JP2008147535A - Carrier for substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrier for a substrate improved in operator handling property and draining property. <P>SOLUTION: The carrier comprises a bottom plate 1 and a top plate 20 opposing each other so as to house a plurality of semiconductor wafers W, a plurality of side plates 30 connecting both side parts of the bottom plate 1 and the top plate 20, and a pair of connection columns 40 connecting back surface parts of the bottom plate 1 and the top plate 20. A part between the front surface parts of the bottom plate 1 and the top plate 20 is turned to a take-in/take-out port 50 for the semiconductor wafers W, a plurality of support pieces 31 supporting the side part peripheral edge of the semiconductor wafer W are arranged side by side at a prescribed pitch on the respective side plates 30, and a plurality of control pieces 41 for interfering with the rear part peripheral edge of the semiconductor wafer W are arranged side by side at a prescribed pitch on the respective connection columns 40. Then, the inner surfaces 5/21 of the bottom plate 1 and the top plate 20 are inclined at the angle of 0.5°-3.0° respectively so as to be gradually widened as approaching the take-in/take-out port 50 for the semiconductor wafer W from the back surface direction, and holding areas 6/22 for manual operations are respectively formed at the outer surface peripheral edge of the bottom plate 1 and the top plate 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate carrier for storing a substrate made of a semiconductor wafer, a glass wafer or the like.

  A conventional substrate carrier for storing a semiconductor wafer is not shown, but a pair of opposing plates that can accommodate a plurality of semiconductor wafers, a pair of side plates that connect between both side portions of the pair of opposing plates, A pair of connecting columns for connecting the back portions of the pair of opposing plates, and the front portion of the pair of opposing plates is used as a semiconductor wafer inlet / outlet. Or immersed in a cleaning tank in a state where a semiconductor wafer is accommodated (see Patent Documents 1, 2, and 3).

On the inner surface of each side plate, a plurality of support pieces for supporting the side edge of the semiconductor wafer are arranged in parallel at a predetermined pitch. A plurality of control pieces capable of interfering with the rear periphery of the semiconductor wafer are arranged in parallel at a predetermined pitch on the inner surface of each connecting column, and a groove is formed between the control piece and the control piece.
JP-A-10-163304 Japanese Patent Laid-Open No. 11-26567 JP 11-31739 A

  The conventional carrier for substrates is configured as described above, and since there are no manual gripping portions on the pair of opposing plates, side plates, and connecting pillars, and it is slippery, it is very difficult for the operator to handle. There is a problem that. Moreover, there is also a problem that drainability is poor when immersed in the cleaning tank.

  The present invention has been made in view of the above, and an object of the present invention is to provide a carrier for a substrate that can improve the handling property and drainage property of an operator.

In the present invention, in order to solve the above-mentioned problem, a pair of opposing plates that can accommodate a plurality of substrates, a plurality of side plates that connect both side portions of the pair of opposing plates, and one end of the pair of opposing plates A connecting plate that covers at least a part between the portions, and the other end of the pair of opposing plates is used as a substrate insertion / removal port, and each side plate is provided with a support piece for supporting the peripheral edge of the substrate at a predetermined pitch. A plurality of control pieces capable of interfering with the peripheral edge of one end of the substrate are arranged on the connecting plate at a predetermined pitch, and a groove is formed between the control pieces and the control pieces. Used,
The inner surface of at least one counter plate of the pair of counter plates is inclined at an angle of 0.5 ° to 3.0 ° so as to gradually spread from one end portion side of the pair of counter plates toward the loading / unloading port for the substrate. And a gripping region is formed at the periphery of the other end of at least one counter plate.

In addition, a stepped portion for pickup is formed in the peripheral portion of one counter plate, a space is formed between the plurality of side plates and the connecting plate, and the connecting plate is divided into a plurality of connecting columns between them. Can form a space.
Moreover, it is preferable to interpose an inclination angle restricting body for the substrate between the inner surface of at least one counter plate and the support piece located at the end of the plurality of support pieces.
In addition, a straight line passing through the contact point between the support piece and the substrate standing upright when placed vertically can be positioned below the center of the substrate.

Further, a substrate anti-contamination body can be interposed between the inner surface of at least one counter plate and the control piece located at the end of the plurality of control pieces.
Moreover, it is preferable to form a holding | grip area | region by making a rib protrude outward from the other end part peripheral edge of at least one opposing board.

  Further, each support piece is formed in a substantially plate shape, and one end portion located on one end side of the opposite plate is formed as a bent portion bent inward of the opposite plate, and at least between the bent portions of the plurality of support pieces. The substrate is provided with a damage prevention piece for the substrate, and the opposed surface facing the peripheral edge of the substrate is formed in a substantially V shape, and the inclination angle of the opposed surface of the damage prevention piece is in the range of 60 ° to 85 °. Is preferred.

Further, a posture control piece for the substrate is provided between the plurality of control pieces, and a facing surface facing the peripheral edge of the one end of the substrate is formed to be concave, and the facing surface of the posture control piece is defined as the first inclined surface, The first and second inclined surfaces are asymmetrically formed by a second inclined surface located on the opposite side of the first inclined surface and a deepest groove positioned between the first and second inclined surfaces. Then, the deepest groove may be shifted from the center line of the groove between the control piece and the control piece.
Furthermore, it is preferable to separate (separate) the peripheral edge of the one end portion of the substrate that is supported substantially horizontally by the support piece and the deepest groove of the posture control piece during horizontal use.

  Here, the substrate in the claims includes at least a semiconductor wafer having a diameter of 200 mm, 300 mm, and 450 mm, a dummy wafer, a glass wafer, and the like. The counter plate, the plurality of side plates, and the connection plate may be integrally formed, or may be assembled using a fastener or the like. These counter plate, the plurality of side plates, and the connecting plate are not particularly required to be transparent, opaque, or translucent. Moreover, although a connection board is connected between the one end parts of a pair of opposing board, the board by which one or more erection was carried out between a pair of side boards, and the board which covers at least one part between the one end parts of a pair of opposing board may be sufficient.

  The side plate and the support piece may be integrally molded with the same molding material, or may be multicolor molded with different molding materials. This also applies to the connecting plate and the control piece. Further, the side plate and the damage prevention piece for the substrate may be integrally formed of the same molding material, may be formed of different molding materials, or the damage prevention piece may be retrofitted. The same applies to the connecting plate and the posture control piece.

According to the present invention, there is an effect that the handling property and drainage property of an operator can be improved.
Further, if an inclination angle restricting body for a substrate is interposed between the inner surface of at least one counter plate and the support piece located at the end of the plurality of support pieces, the substrate at which the inclination angle restricting body is located at the end most Is inclined at substantially the same inclination angle as that of the other substrates, so that it is possible to prevent the substrate located at the end from being inclined more than the other substrates and destabilizing the posture.

  Further, if a contamination prevention body for a substrate is interposed between the inner surface of at least one counter plate and the control piece positioned at the end of the plurality of control pieces, the substrate positioned at the end is at least one counter plate. It is possible to prevent contamination by the influence of

In addition, if a rib is projected outward from the peripheral edge of the other end of at least one opposing plate to form a gripping region, a finger or a gripping tool can be appropriately hooked and gripped on the protruding rib, It becomes possible to easily change the posture of the substrate carrier from the vertical position to the horizontal position, or from the horizontal position to the vertical position.
Further, when the peripheral edge of the substrate supported substantially horizontally by the support piece and the deepest groove of the attitude control piece are separated from each other when used horizontally, the other end of the substrate is prevented from being excessively inclined due to contact. It becomes possible.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 10, a substrate carrier in the present embodiment is a bottom plate facing a plurality of semiconductor wafers W so as to be accommodated. 1 and the top plate 20, a pair of left and right side plates 30 connecting the bottom plate 1 and both side portions of the top plate 20, and a pair of left and right connecting columns 40 connecting the bottom plate 1 and the back surface of the top plate 20. The opening between the front surface of the bottom plate 1 and the top plate 20 serves as a loading / unloading port 50 for the semiconductor wafer W. Each side plate 30 includes a plurality of support pieces 31 supporting the semiconductor wafer W arranged in parallel. A groove 32 is formed between the support piece 31, and a plurality of control pieces 41 that can be controlled in attitude by interfering with the semiconductor wafer W are arranged in parallel on each connecting column 40. A groove 42 is formed between Ri, optionally, vertical or or in the horizontally used in the process of semiconductor manufacturing, is immersed in the cleaning liquid in the cleaning tank while accommodating the transported or or a plurality of semiconductor wafers W,.

  The semiconductor wafer W is made of, for example, a silicon wafer having a diameter of 300 mm (12 inches) that is sliced thinly and rounded, and an orientation flat or notch for facilitating alignment and the like is notched in a peripheral portion, and constitutes a substrate carrier. A plurality of sheets (for example, 25 sheets or 26 sheets) are arranged and stored in a line at a predetermined pitch between the bottom plate 1 and the top plate 20.

  Such a semiconductor wafer W is subjected to various processing and processing in the semiconductor manufacturing process, whereby an electronic circuit pattern is formed on the surface Wf, and the substrate carrier is placed vertically (see FIG. 2). Is supported upright while standing upright or slightly inclined. On the other hand, when the substrate carrier is placed horizontally (see FIG. 1), it is supported substantially horizontally in an exposed state.

  The bottom plate 1, the top plate 20, the pair of side plates 30, and the pair of connecting columns 40 are integrally formed by injection molding in which a predetermined molding material is injected and filled into a mold, so that the semiconductor wafer W is horizontal. The dimension in the height direction of the substrate carrier is set based on the determined horizontal reference plane. The predetermined molding material is not particularly limited, but various thermoplastics such as polycarbonate, polyether ether ketone, polyether imide, fluorine resin having good self-lubricity, various nylons, polybutylene terephthalate, etc. Examples thereof include a resin or a mixture of these components.

  As shown in FIG. 1 and FIG. 2, the bottom plate 1 and the top plate 20 are basically formed as thick discs that are slightly larger than the semiconductor wafer W, and both sides bulge outward in the radial direction. A plurality of semiconductor wafers W arranged in a row are opposed to each other with a space between them.

  As shown in FIG. 3, the bottom plate 1 includes a flat diameter-enlarged portion 2 that is connected to the end portions of the pair of side plates 30 and the connecting columns 40, and a reduced-diameter portion that is integrally laminated on the bottom surface of the enlarged-diameter portion 2 3, and a ring-shaped stepped portion 4 is cut out between the enlarged diameter portion 2 and the reduced diameter portion 3, and a pair of parallel rails of a forklift or a robot (not shown) are provided in the stepped portion 4. By interfering and locking, the substrate carrier is reliably picked up when the conveyor is transported.

  The inner surface 5 of the bottom plate 1 facing the semiconductor wafer W and the top plate 20 is 0.5 ° to 3.0 ° so as to gradually expand from the back side of the substrate carrier toward the substrate loading / unloading port 50. It is inclined at an angle and functions to suppress and prevent drainage during cleaning liquid immersion and cleaning and adhesion of liquid. The inclination angle of the inner surface of the bottom plate is in the range of 0.5 ° to 3.0 °. If it is less than 0.5 °, the releasability from the mold during molding deteriorates, and conversely, 3.0 ° This is because if it exceeds the range, the dimensional accuracy will be hindered.

  As shown in FIGS. 1, 2, and 7, a gripping area 6 that improves rigidity and prevents deformation is formed endlessly on the outer peripheral edge of the bottom plate 1, and this gripping area 6 is handled by an operator or an automatic machine. It works to contribute. The gripping region 6 is formed by a gripping rib 7 protruding from the outer peripheral edge of the bottom plate 1 by 10 mm or more in the downward direction, which is the outward direction.

  As shown in FIG. 6, positioning tools 8 called kinematic couplings are integrally arranged on the both sides of the bottom surface of the bottom plate 1 so as to draw a substantially plane Y, as shown in FIG. The tool 8 is inserted into a positioning pin provided upright on a processing apparatus for semiconductor manufacturing. Each positioning tool 8 is formed into a substantially rectangular block having a pair of long sides and a pair of short sides, and a positioning groove 9 is formed in the surface so as to be recessed in a substantially inverted V-shaped section or a substantially inverted Y-shaped section. The positioning groove 9 is inserted into the positioning pin of the processing apparatus from above. The peripheral surface 10 of the positioning tool 8 is formed in an inclined surface that gradually narrows from the bottom surface of the bottom plate 1 in consideration of molding safety and the like.

  The long side and the short side of the positioning tool 8 may be formed linearly, but at least the short side is bent or curved in a substantially square shape to facilitate release from the mold. You may do it.

  The top plate 20 is 0.5 ° to 3.0 ° so that the inner surface 21 facing the semiconductor wafer W and the bottom plate 1 gradually expands from the back side of the substrate carrier toward the substrate loading / unloading port 50. It is inclined at an angle and functions to suppress and prevent drainage during cleaning liquid immersion and cleaning and adhesion of liquid. The inclination angle of the inner surface 21 of the top plate 20 is in the range of 0.5 ° to 3.0 ° as in the case of the bottom plate 1.

  As shown in FIGS. 1, 2, and 7, a grip region 22 that improves rigidity and prevents deformation is formed endlessly on the outer peripheral edge of the top plate 20. Contributes to the handling of The gripping region 22 is formed by protruding the gripping rib 23 from the outer peripheral edge of the top plate 20 by 10 mm or more upward, which is the outward direction.

  As shown in FIGS. 1, 3, 8, and 9, the pair of side plates 30 face each other with a storage space for the semiconductor wafer W, and project the semiconductor wafer W between the connection columns 40. A space to contribute and a space for liquid distribution are formed. In the longitudinal direction of the inner surface of each side plate 30 (vertical direction in FIG. 1), a plurality of support pieces 31 supporting the side edge of the semiconductor wafer W are arranged in parallel at a predetermined pitch, and between the support pieces 31 and 31. In this case, a groove 32 having a substantially U-shaped or U-shaped cross section is defined.

  In the plurality of support pieces 31, the support piece 31 </ b> A located at the lowermost stage is located at a predetermined interval from the horizontal reference plane, and the other support piece 31 is spaced (pitch) from the support piece 31 </ b> A located at the lowermost stage. Are arranged in the vertical upward direction (pitch direction). Among the plurality of support pieces 31, an inclination angle restricting body 33 for the semiconductor wafer W is interposed between the support piece 31 </ b> B positioned at the uppermost stage and the inner surface 21 of the top plate 20. The facing surface facing the semiconductor wafer W is formed substantially the same as the surface of the support piece 31, and the tilt angle restricting body 33 selectively mounts a dummy wafer or a contamination preventing wafer.

  The inclination angle restricting body 33 has, for example, a thick inner peripheral edge portion of the top plate 20, a thick inner surface end portion of the side plate 30, or a tapered protrusion on the inner surface of the side plate 30 inward. The semiconductor wafer W formed by projecting to the substrate carrier and supported by the uppermost support piece 31B when the substrate carrier is placed vertically is not at an inclination angle different from that of the semiconductor wafer W supported by the other support piece 31. The semiconductor wafer W is inclined at substantially the same inclination angle, and functions to smoothly take out the uppermost semiconductor wafer W and to prevent or prevent contamination due to particles of the semiconductor wafer W.

  As shown in FIGS. 1 to 3 and 5, each support piece 31 is formed in a substantially plate shape having a substantially tapered triangle and extending in the front-rear direction of the substrate carrier, and is positioned on the back side of the substrate carrier. The distal end of the substrate is curved inwardly of the substrate carrier to form a substantially semicircular arc bent portion along the peripheral edge of the semiconductor wafer W, and the other supporting piece 31 adjacent to the bent portion is bent. A damage preventing piece 34 for the semiconductor wafer W located at the bottom of the groove 32 is integrally formed with the portion.

  As shown in FIG. 8, each support piece 31 is formed such that the front surface (upper surface) is inclined at an angle of 0 ° to 2 °, and the back surface is inclined at an angle of 1 ° to 5 °. Is rounded (chamfered), and functions to suppress and prevent damage and marking of the semiconductor wafer W regardless of whether the substrate carrier is placed vertically or horizontally.

  As shown in FIG. 8, the damage prevention piece 34 has a facing surface 35 that is opposed to the peripheral edge of the semiconductor wafer W and has a substantially V-shaped cross section, and the inclination angle of the facing surface 35 is 60 ° to 85 °. From the viewpoint of smooth movement of the semiconductor wafer W, preferably in the range of 75 ° to 82 °, the semiconductor wafer W functions to suppress and prevent damage due to sliding and impact of the semiconductor wafer W. The inclination angle of the facing surface 35 is in the range of 60 ° to 85 °. If the angle is less than 60 °, the semiconductor wafer W may not be smoothly slid and may be caught on the way. This is because the impact acting on the semiconductor wafer W when the substrate carrier is placed vertically increases, and the semiconductor wafer W may be damaged or chipped due to the impact.

  As shown in FIGS. 1 to 3, the pair of connecting columns 40 form a space that contributes to the protrusion of the semiconductor wafer W of the robot and a space for liquid circulation between the adjacent side plate 30 and other connecting columns 40. To do. Each connecting column 40 is formed in an elongated column, and in the longitudinal direction of the inner surface, a plurality of control pieces 41 that can interfere with the rear periphery of the semiconductor wafer W are arranged in parallel at a predetermined pitch. In between, a groove 42 having a substantially U-shaped cross section directed in the front direction of the substrate carrier is defined, and each control piece 41 takes into account the amount of deflection of the semiconductor wafer W when the substrate carrier is placed horizontally. The support pieces 31 are positioned below the support surface (mounting surface) for supporting the semiconductor wafer W.

  As shown in FIG. 9 and FIG. 10, a contamination prevention body 43 for the semiconductor wafer W is interposed between the control piece 41 </ b> A located at the top of the plurality of control pieces 41 and the inner surface 21 of the top plate 20. The contamination prevention body 43 is formed substantially the same as the control piece 41 and selectively mounts a dummy wafer or a contamination prevention wafer.

  For example, the contamination preventing body 43 is formed such that the inner peripheral edge of the top plate 20 is thick, the inner end of the connecting column 40 is formed thick, or the protrusion on the inner surface of the connecting column 40 is inward. The uppermost semiconductor wafer W is formed by projecting and contributes to the inclination of the uppermost semiconductor wafer W at substantially the same inclination angle as the other semiconductor wafers W when the substrate carrier is placed vertically. Is taken out, and contamination associated with particles of the semiconductor wafer W is suppressed and prevented.

  9 and 10, a posture control piece 44 for the semiconductor wafer W positioned at the bottom of the groove 42 is integrally formed between the plurality of control pieces 41, and the semiconductor wafer W of the posture control piece 44 is formed. A facing surface 45 facing the rear periphery is formed as a recess. The posture control piece 44 is formed in a substantially plate shape with a rounded chamfered tip, and the height is adjusted in consideration of the diameter and thickness of the semiconductor wafer W, the position where it is integrally formed, and the like.

  As shown in FIG. 10, the facing surface 45 of the attitude control piece 44 is in contact with the rear peripheral edge of the semiconductor wafer W to be inclined at a predetermined angle, and opposite to the first inclined surface 46. A second inclined surface 47 that is located on the side and inclines the semiconductor wafer W at a predetermined angle, and is located between the first and second inclined surfaces 46 and 47 and is in contact with the semiconductor wafer W at the most The semiconductor wafer W is formed from the deep groove 48 to control the posture of the semiconductor wafer W horizontally when the substrate carrier is horizontally placed, or to tilt the semiconductor wafer W upright at an inclination angle of 1 ° to 3 ° when the substrate carrier is vertically placed. Or preventing contact between adjacent semiconductor wafers W.

  The first and second inclined surfaces 46 and 47 of the posture control piece 44 are formed asymmetrically as shown in the figure, and the deepest groove 48 is formed at the center of the groove 42 between the posture control piece 44 and the posture control piece 44. It functions to be slightly shifted from the line in the arrangement direction of the plurality of control pieces 41. The first inclined surface 46 is formed, for example, by forming a triangular rib to facilitate the inclination of the semiconductor wafer W in one direction, and the second inclined surface 47 is formed by forming a protruding piece that is taller than the triangular rib. The

  The deepest groove 48 is formed in a steep shape in which the first inclined surface 46 side is gentle and the second inclined surface 47 side is erected, and the control piece 41 is positioned below the support piece 31. Similarly to the above, the substrate carrier is separated from the rear edge of the semiconductor wafer W supported substantially horizontally by the support piece 31 when the substrate carrier is used horizontally.

  The opposing surface 45 of the attitude control piece 44 inclines the semiconductor wafer W at an angle of 1 ° to 3 °. If the semiconductor wafer W is inclined at an angle of 1 ° or more, the semiconductor wafer W is vertically oriented when the substrate carrier is placed vertically. This is because it is possible to eliminate the possibility of inclining. Moreover, if it inclines at an angle of less than 3 degrees, it is not necessary to enlarge the space | interval of the some control piece 41, and the length of the control piece 41 can be made into suitable length.

  If the first inclined surface 46 is formed on one of the center lines of the groove 42 and the second inclined surface 47 is inclined upward from the vicinity of the boundary between the second inclined surface 47 and the deepest groove 48. The semiconductor wafer W can be easily controlled to be tilted to one side.

In the above configuration, when the semiconductor wafer W is stored in the horizontally placed substrate carrier, the semiconductor wafer W is inserted into the loading / unloading port 50 of the substrate carrier shown in FIG. If it is supported horizontally, the rear periphery of the semiconductor wafer W is fitted between the plurality of control pieces 41 in a non-contact manner through the groove 42, the attitude of the semiconductor wafer W is controlled, and the horizontal accuracy is maintained. The semiconductor wafer W can be accommodated in a horizontal substrate carrier.
By repeating such operations, a plurality of semiconductor wafers W can be aligned and stored in a row on the substrate carrier.

  At this time, the semiconductor wafer W is preferably stored so that the surface Wf on which the electronic circuit pattern is formed is positioned on the upper side. Further, since the rear peripheral edge of the semiconductor wafer W supported substantially horizontally by the support piece 31 and the deepest groove 48 of the control piece 41 or the attitude control piece 44 are not basically in contact with each other, the rear part of the semiconductor wafer W is lifted. Thus, it is possible to prevent the front portion of the semiconductor wafer W from being excessively inclined downward.

  On the other hand, when immersing a plurality of semiconductor wafers W in the cleaning solution in the cleaning tank in an aligned and housed state, the substrate carrier shown in FIG. Each of the semiconductor wafers W is supported by the pair of left and right support pieces 31 and avoids contact between the semiconductor wafers W adjacent to the control piece 41 and changes the posture of the semiconductor wafers W arranged in a vertical row to a horizontal row. When the substrate carrier is submerged in the cleaning tank by standing up or tilting at a slight angle, the cleaning liquid is discharged from the inlet / outlet port 50, the space between the side plate 30 and the connecting column 40, and the space between the pair of connecting columns 40. Each flows in and the semiconductor wafer W can be immersed in the cleaning liquid.

  At this time, if the base plate 1 and the top plate 20 constituting the substrate carrier and the gripping regions 6 and 22, that is, the protruding rigid ribs 7 and 23 are appropriately hooked and firmly held, the substrate carrier is not dropped. The posture can be changed very easily. Further, since the tilt angle restricting body 33 tilts the semiconductor wafer W supported by the uppermost support piece 31B in the same direction at the same tilt angle as the semiconductor wafer W supported by the other support pieces 31, the uppermost stage support piece 31B. The semiconductor wafer W does not tilt more than the other semiconductor wafers W, and the posture does not become unstable.

  Further, the contamination prevention body 43 exhibits the same function and effect as the inclination angle regulation body 33, and also regulates the contact between the top plate 20 and the uppermost semiconductor wafer W, thereby changing the state of the uppermost semiconductor wafer W. Since the semiconductor wafer W can be made in the same manner as a normal state where it is sandwiched between another pair of adjacent semiconductor wafers W, dirt on the inner surface of the top plate does not move to the uppermost semiconductor wafer W.

  After immersing the semiconductor wafer W in the cleaning liquid, if the substrate carrier is pulled up from the cleaning tank, the cleaning liquid is discharged from the inlet / outlet port 50, the space between the side plate 30 and the connecting column 40, and the space between the pair of connecting columns 40. Each of them flows out, the semiconductor wafer W is taken out from the cleaning tank, and the cleaning operation can be completed.

  At this time, since the bottom plate 1 and the inner surfaces 5 and 21 of the top plate 20 constituting the substrate carrier are not flat but inclined, the cleaning liquid does not accumulate in the substrate carrier and smoothly flows downward. The space between the side plate 30 and the connecting column 40 and the space between the pair of connecting columns 40 are discharged.

  According to the above configuration, since the grip areas 6 and 22 for manual operation that are difficult to slip are provided on the bottom plate 1 and the top plate 20, respectively, handling of the operator is extremely facilitated, rigidity is remarkably improved, and deformation during molding is performed. Can be effectively suppressed and prevented. Further, the formation of the gripping regions 6 and 22 can increase the strength of the carrier for the substrate and improve the dimensional accuracy, thereby preventing variations during manufacture and hindering the insertion and removal of the semiconductor wafer W. In addition, it is possible to effectively eliminate the difficulty of teaching the robot that handles the semiconductor wafer W.

  In addition, since the inner surfaces 5 and 21 of the bottom plate 1 and the top plate 20 are inclined, respectively, even when the substrate carrier is immersed in the cleaning tank, it is possible to suppress the adhesion of the cleaning liquid and greatly improve drainage. This makes it possible to facilitate, speed up and facilitate subsequent work. Further, since the facing surface 45 of the posture control piece 44 is formed by the first and second inclined surfaces 46 and 47 and the deepest groove 48, the contact area with the semiconductor wafer W is reduced to prevent contamination, It is possible to eliminate irregularities such as aligning and tilting a plurality of semiconductor wafers W in the same direction and tilting in the opposite direction.

  Further, since the rear peripheral edge of the semiconductor wafer W does not directly collide with the deepest groove 48 of the attitude control piece 44, it is highly possible to prevent damage to the semiconductor wafer W due to the strong vertical collision.

  In the above embodiment, the grip regions 6 and 22 are provided on the bottom plate 1 and the top plate 20, respectively, but the present invention is not limited to this, and the grip region may be provided on only one side. Further, the inner surface of only one of the bottom plate 1 and the top plate 20 may be inclined. Further, although the plurality of positioning tools 8 are integrally formed on the bottom plate 1, a separate positioning tool 8 may be attached to the bottom plate 1 later. Further, a separate side plate 30 provided with support pieces 31 may be connected between the bottom plate 1 and the top plate 20 by using a frictional engagement means, a fastener such as a bolt, or the like. You may integrate the board 20 and the side plate 30 of another member by insert molding.

  Moreover, although the damage prevention piece 34 was integrally formed between the bending parts of the some support piece 31, it is not limited to this at all, For example, the damage prevention piece 34 may be formed between the some support pieces 31. it can. Further, a protrusion preventing protrusion for the semiconductor wafer W can be formed on the tip or the surface of the support piece 31, or a protrusion preventing shape can be formed. Further, the facing surface 35 of the damage preventing piece 34 can be formed in a substantially V-shaped symmetric cross section, or can be formed in a substantially V-shaped asymmetric cross section.

  The bottom plate 1 and the back surface of the top plate 20 may be connected by a pair of connecting columns 40, but may be connected by a single connecting column 40, or connected by a connecting plate of a predetermined size. It is also possible. Further, another connecting column 40 may be connected between the bottom plate 1 and the back surface of the top plate 20 using a fastener such as a friction engagement means or a bolt, or the bottom plate 1 and the top plate 20 may be connected to another member. It is also possible to integrate the connecting column 40 by insert molding.

It is a perspective explanatory view showing typically the substrate carrier at the time of horizontal placement in the embodiment of the substrate carrier according to the present invention. It is a perspective explanatory view showing typically the substrate carrier at the time of vertical placement in the embodiment of the substrate carrier according to the present invention. It is front explanatory drawing which shows typically the board | substrate carrier at the time of horizontal placement in embodiment of the board | substrate carrier concerning this invention. It is a partial section side view showing typically the substrate carrier at the time of horizontal placement in the embodiment of the substrate carrier concerning the present invention. It is a plane explanatory view showing typically an embodiment of a substrate carrier concerning the present invention. It is bottom explanatory drawing which shows typically embodiment of the carrier for substrates which concerns on this invention. It is a partial section side view showing typically the substrate carrier at the time of vertical placement in the embodiment of the substrate carrier concerning the present invention. It is principal part sectional explanatory drawing which shows typically the support piece and damage prevention piece in embodiment of the carrier for substrates which concerns on this invention. It is sectional explanatory drawing which shows typically the support piece and control piece of the board | substrate carrier at the time of vertical installation in embodiment of the board | substrate carrier concerning this invention. FIG. 10 is an explanatory cross-sectional view of a main part of FIG. 9.

Explanation of symbols

1 Bottom plate (opposite plate)
4 Stepped portion 5 Inner surface 6 Holding region 7 Rib 20 Top plate (opposite plate)
21 inner surface 22 grip region 23 rib 30 side plate 31 support piece 31A bottom support piece 31B top support piece (support piece located at the end)
32 Groove 33 Inclination angle regulating body 34 Damage prevention piece 35 Opposing surface 40 Connecting column (connecting plate)
41 Control piece 41A Control piece (control piece located at the end)
42 Groove 43 Contamination prevention body 44 Posture control piece 45 Opposing surface 46 First inclined surface 47 Second inclined surface 48 Deepest groove 50 Outlet / inlet W Semiconductor wafer (substrate)

Claims (7)

A pair of opposing plates facing each other so that a plurality of substrates can be stored; a plurality of side plates connecting both side portions of the pair of opposing plates; and a connecting plate covering at least a part between one end portions of the pair of opposing plates; Between the other ends of the pair of opposing plates, and a plurality of support pieces that support the peripheral edges of the side of the substrate are arranged on each side plate at a predetermined pitch. A plurality of control pieces capable of interfering with the peripheral edge of one end portion are arranged at a predetermined pitch, a groove is formed between the control piece and the control piece, and is a substrate carrier used in a vertical or horizontal orientation,
The inner surface of at least one counter plate of the pair of counter plates is inclined at an angle of 0.5 ° to 3.0 ° so as to gradually spread from one end portion side of the pair of counter plates toward the loading / unloading port for the substrate. And a gripping region is formed on the periphery of the other end of at least one counter plate.   2. The substrate carrier according to claim 1, wherein an inclination angle regulating body for the substrate is interposed between the inner surface of at least one counter plate and the support piece located at the end of the plurality of support pieces.   The substrate carrier according to claim 1 or 2, wherein a substrate anti-contamination body is interposed between the inner surface of at least one counter plate and the control piece located at the end of the plurality of control pieces.   The substrate carrier according to claim 1, 2, or 3, wherein a grip region is formed by projecting a rib outward from the periphery of the other end of at least one counter plate.   Each support piece is formed in a substantially plate shape, and one end portion located on one end side of the opposite plate is formed as a bent portion bent inward of the opposite plate, and the substrate is provided between at least the bent portions of the plurality of support pieces. An opposing surface that is provided with a damage preventing piece for use and is opposed to the side edge of the substrate is formed in a substantially V shape, and the inclination angle of the facing surface of the damage preventing piece is in the range of 60 ° to 85 °. 5. The substrate carrier according to any one of 4 to 4.   A posture control piece for the substrate is provided between the plurality of control pieces, and a facing surface facing the peripheral edge of the one end of the substrate is recessed, and the facing surface of the posture control piece is formed with the first inclined surface and the first inclined surface. A second inclined surface located on the opposite side of the one inclined surface and a deepest groove positioned between the first and second inclined surfaces, and the first and second inclined surfaces are made asymmetric. 6. The substrate carrier according to claim 1, wherein the deepest groove is shifted from a center line of the groove between the control piece and the control piece.   7. The substrate carrier according to claim 6, wherein a peripheral edge of one end of the substrate supported substantially horizontally by the support piece during horizontal use is separated from a deepest groove of the attitude control piece.

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