JP5151908B2 - Vernier and exposure position measuring method - Google Patents

Description

  The present invention relates to a vernier for measuring the position of a colored pixel with respect to a black matrix on a glass substrate and calculating the positional deviation, and in particular, to the depth of focus of a microscope and the variation in the fringe portion of a measurement mark. The present invention relates to a vernier capable of calculating a positional deviation stably and accurately by automatic measurement without being influenced, and confirming an exposure position accuracy. The present invention also relates to a method for measuring an exposure position using the vernier.

  As a method of manufacturing a color filter used in a liquid crystal display device, first, a black matrix is formed on a glass substrate, and then a colored pixel is aligned with the black matrix pattern on the glass substrate on which the black matrix is formed. And a method of forming a transparent conductive film is widely used.

  The black matrix has a light-shielding property, determines the position of the colored pixels of the color filter, makes the size uniform, and shields unwanted light when used in a display device. It has a function of making a uniform image with no unevenness and improved contrast. The black matrix is formed by, for example, a photolithographic method in which a black photoresist coating film is provided on a glass substrate, and the black matrix is formed by exposing and developing the coating film through a photomask. Yes.

The colored pixels have, for example, red, green, and blue filter functions, and are coated with a negative-type colored photoresist in which a pigment such as a pigment is dispersed on a glass substrate on which a black matrix is formed. A photolithographic method is employed in which colored pixels are formed by exposing and developing the coating film through a photomask.
In addition, the transparent conductive film is formed by forming a transparent conductive film on a glass substrate on which colored pixels are formed by sputtering using ITO (Indium Tin Oxide), for example.

In order to confirm the accuracy of the position of the colored pixel with respect to the black matrix on the glass substrate, that is, the exposure position of the colored pixel, a measurement mark called vernier is used. The measurement mark is provided on the glass substrate outside the image display area where the colored pixels are formed.
A measurement mark called vernier is composed of a first measurement mark formed simultaneously with the formation of the black matrix and a second measurement mark formed simultaneously with the formation of the colored pixels.

A second measurement mark is provided so as to overlap the first measurement mark formed on the glass substrate, the position of the second measurement mark with respect to the first measurement mark is measured, and the positional deviation is calculated. This positional deviation is used as the accuracy of the exposure position of the colored pixel with respect to the black matrix.
In the present invention, a measurement mark composed of a first measurement mark and a second measurement mark for measuring the position of the colored pixel with respect to the black matrix and calculating the positional deviation is referred to as vernier.

FIG. 1 is an explanatory diagram of an example of a vernier (V1) composed of a first measurement mark and a second measurement mark. FIGS. 1A and 1B are plan views of the first measurement mark (M1) and the second measurement mark (M2).
FIG. 1 (a) shows a first measurement mark (M1) formed on the glass substrate (1), and the same material as the black photoresist used for forming the black matrix is used. And formed simultaneously with the formation of the black matrix.

  The first measurement mark (M1) is a square having a side (a) dimension of about 200 μm, and includes a frame (Wa) and an opening (Ka). The dimension of one side (b) of the opening (Ka) is about 100 μm.

FIG. 1B shows the second measurement mark (M2) formed on the first measurement mark (M1), and the same material as the colored photoresist used for forming the colored pixels is used. Formed simultaneously with the formation of the colored pixels.
The second measurement mark (M2) is a square having a dimension of one side (c) of about 150 μm, and a rounded corner is illustrated for explanation.

FIG.1 (c) is the top view showing the state by which the 2nd measurement mark (M2) was provided in the 1st measurement mark (M1) formed on the glass substrate (1), FIG. It is sectional drawing in the XX line of FIG.1 (c).
As shown in FIGS. 1C and 2, in the present invention, a measurement mark in which a second measurement mark (M2) is overlapped on a first measurement mark (M1) is a vernier (V1). ). FIG. 1C shows a state in which the second measurement mark (M2) is provided with no positional deviation with respect to the first measurement mark (M1). The thicknesses (t1, t2) of the first measurement mark (M1) and the second measurement mark (M2) are each about 1 to 2 μm.

FIG. 3 is a plan view for explaining three types of verniers provided on a glass substrate outside the image display area. FIG. 3A is a red vernier (V1-R) for measuring the position of the red colored pixel with respect to the black matrix and calculating the positional deviation.
As shown in FIG. 3A, the red vernier (V1-R) formed on the glass substrate (1) is composed of a red first measurement mark (M1-R) and a red second measurement mark (M2- R).

  FIG. 3B shows a green vernier (V1-G), which includes a green first measurement mark (M1-G) and a green second measurement mark (M2-G). Moreover, FIG.3 (c) is a blue vernier (V1-B), and is comprised by the blue first measurement mark (M1-B) and the blue second measurement mark (M2-B).

The above three types of verniers (V1-R, V1-G, V1-B) form a set, and this set is provided on a glass substrate outside the image display area. For example, when performing multi-sided exposure on a large glass substrate by step exposure, one set is provided at each of the four corners of the exposure region for each exposure.
In addition, the confirmation of the exposure position using three types of vernier is performed for each color for each color after the colored pixels are formed.

FIG. 4 is an explanatory diagram of a method of measuring the position of the colored pixel with respect to the black matrix using vernier and calculating the positional deviation. FIG. 4 shows an example in which the second measurement mark (M2) is displaced in the positive direction of the X axis and simultaneously in the positive direction of the Y axis with respect to the first measurement mark (M1).
As shown in FIG. 4, first, the distance (x1) between the right edge of the opening (Ka) and the right edge of the second measurement mark (M2) is measured. Next, the distance (x2) between the left edge of the opening (Ka) and the left edge of the second measurement mark (M2) is measured. The positional deviation (Δx) in the X direction is calculated by Δx = (x1−x2) / 2. Similarly, a positional deviation (Δy) in the Y direction is calculated.

FIG. 5 is a cross-sectional view of a vernier when measuring between the edge of the opening and the edge of the second measurement mark. As shown in FIG. 5, the edge portion (fringe portion) indicated by the symbol (F) of the second measurement mark (M2) is in an inclined state.
The distance (x1) between the right edge (Ke) of the opening (Ka) and the right edge (Je) of the second measurement mark (M2) is measured using a microscope from above the vernier. The thickness (t3) of the overlapping portion of the trapezoidal second measurement mark (M2) formed by overlapping the peripheral edge of the frame portion (Wa) of the first measurement mark (M1) Since the depth of focus is narrow, the fringe portion (F) becomes a blurred image.

In addition, the inclination angle and the inclination width of the fringe portion (F) of the second measurement mark (M2) to be formed are not constant and vary. Therefore, it is difficult to find the right edge (Je) (the upper right end of the trapezoid) of the second measurement mark (M2) by automatic measurement, and an error often occurs in automatic measurement. Also, in manual measurement, misperception is likely to occur due to the level of proficiency of the operator.
JP-A-11-24079 JP 2006-267305 A

The present invention has been made to solve the above-described problem, and is a vernier for measuring the position of a colored pixel with respect to the black matrix of a color filter and calculating the positional deviation thereof, and is based on the focal depth of a microscope. Provides a vernier that can be used to accurately and stably calculate the positional deviation and confirm the accuracy of the exposure position with automatic measurement without being affected by it and without being affected by variations in the fringe part of the measurement mark. It is an object to do.
It is another object of the present invention to provide a method for measuring an exposure position using the vernier.

The present invention is a vernier that calculates a positional shift of a colored pixel with respect to a black matrix on a glass substrate.
1) The vernier includes a first measurement mark and a second measurement mark,
2) The first measurement mark includes a light shielding portion, a first opening, and a second opening formed at the same time as the formation of the black matrix. The second measurement mark is formed of colored pixels on the light shielding portion. Formed at the same time as the formation,
3) The centroid of the second measurement mark is a vernier characterized by being located at the apex of an isosceles triangle having a base that is a straight line connecting the centroid of the first opening and the centroid of the second opening.

  Further, the present invention is the vernier according to the above invention, wherein the isosceles triangle is a right-angled isosceles triangle.

  Further, the present invention provides the vernier according to claim 1 or 2, wherein the vernier moves the microscope used for measurement to the vicinity of the vernier to a position away from the vernier, and further to just above the vernier. This vernier is characterized by having a target mark.

According to the present invention, in the vernier according to claim 1, claim 2, or claim 3, the vernier calculates the positional deviation of the red vernier and the green colored pixel for calculating the positional deviation of the red colored pixel. The vernier is characterized in that it is composed of a green vernier and a blue vernier for calculating the positional deviation of the blue colored pixels, and each color vernier is provided in parallel and at equal intervals on the glass substrate. is there.

Further, the present invention relates to a method for measuring an exposure position using a vernier that calculates a positional shift of a colored pixel with respect to a black matrix on a glass substrate.
1) Using the vernier according to claim 1 or 2 as the vernier, the same visual field (display) of the microscope using the first opening, the second opening, and the second measurement mark of the vernier for measurement from above the vernier Screen)
2) The first opening by pattern matching in each preset measurement area corresponding to each of the first opening, the second opening, and the second measurement mark in the same field of view (display screen) Recognizing each of the second opening and the second measurement mark,
3) Each of the recognized first opening, second opening, and second measurement mark is binarized, or the coordinates of the center of gravity (A ′) of the first opening by binarization and ellipse fitting, Calculating the coordinates of the center of gravity (B ′) of the second opening and the coordinates of the center of gravity (D ′) of the second measurement mark;
4) From the coordinates of the center of gravity (A ′) of the first opening and the coordinates of the center of gravity (B ′) of the second opening, the coordinates of the center of gravity (C ′) of the second measurement mark having no positional deviation are set. Process,
5) calculating the positional deviation of the second measurement mark from the difference between the calculated coordinates of the center of gravity (D ′) of the second measurement mark and the coordinates of the center of gravity (C ′) of the set second measurement mark. A method for measuring an exposure position, comprising:

Further, the present invention relates to a method for measuring an exposure position using a vernier that calculates a positional shift of a colored pixel with respect to a black matrix on a glass substrate.
1) The vernier according to claim 3 is used as the vernier, the microscope used for measurement is set to a low magnification, the microscope is moved to the vicinity of the XY coordinates of the vernier set in advance, and the target mark is placed above the vernier from the microscope. The process of fitting in the field of view (display screen),
2) A step of setting the microscope used for measurement at a medium magnification, recognizing the target mark by pattern matching, moving the microscope, and positioning the target mark at the center of the field of view (display screen) of the microscope;
3) A step of setting the XY coordinates of the center of the visual field (display screen) of the microscope as an origin for the microscope to move to the vernier position;
4) The microscope used for the measurement is set to a high magnification, the microscope is moved a predetermined distance from the origin, and the vernier first opening, the second opening, and the second measurement mark are placed in the same field of view of the microscope ( Process within the display screen),
5) The first opening by pattern matching in each preset measurement area corresponding to each of the first opening, the second opening, and the second measurement mark in the same field of view (display screen). Recognizing each of the second opening and the second measurement mark,
6) Each of the recognized first opening, second opening, and second measurement mark is binarized, or the coordinates of the center of gravity (A ') of the first opening by binarization and elliptic fitting processing, Calculating the coordinates of the center of gravity (B ′) of the second opening and the coordinates of the center of gravity (D ′) of the second measurement mark;
7) From the coordinates of the center of gravity (A ′) of the first opening and the coordinates of the center of gravity (B ′) of the second opening, the coordinates of the center of gravity (C ′) of the second measurement mark having no positional deviation are set. Process,
8) calculating the positional deviation of the second measurement mark from the difference between the calculated coordinates of the center of gravity (D ′) of the second measurement mark and the coordinates of the center of gravity (C ′) of the set second measurement mark A method for measuring an exposure position, comprising:

Moreover, this invention uses the vernier of Claim 4 in the measuring method of the exposure position of Claim 6, as said vernier,
1) When calculating the positional deviation of the red colored pixel with respect to the black matrix, for the red vernier, the positional deviation of the red colored pixel is calculated by the steps 1) to 8).
2) When calculating the positional deviation of the green colored pixel with respect to the black matrix, after calculating the positional deviation of the red colored pixel, the microscope used for the measurement is changed to the first opening, the second opening, and the red second of the red vernier. From the position where the measurement mark is stored in the same field of view (display screen) of the microscope, a predetermined interval is moved, and the first and second openings of the green vernier and the green second measurement mark are moved to the microscope. Within the same field of view (display screen)
3) For the green vernier, the displacement of the green colored pixel is calculated by the steps 5) to 8).
4) When calculating the positional deviation of the blue colored pixel with respect to the black matrix, after calculating the positional deviation of the green colored pixel, the microscope used for the measurement is the green vernier first opening, second opening, green second From the position where the measurement mark is stored in the same field of view (display screen) of the microscope, a predetermined interval is moved, and the blue vernier first opening, the second opening, and the blue second measurement mark are moved to the microscope. Within the same field of view (display screen)
3) A method for measuring an exposure position, characterized in that, for a blue vernier, a displacement of a blue colored pixel is calculated by the steps 5) to 8).

  The present invention is composed of a first measurement mark and a second measurement mark, and the first measurement mark includes a light shielding portion, a first opening portion, and a second opening portion formed simultaneously with the formation of the black matrix, The second measurement mark is formed simultaneously with the formation of the colored pixels on the light shielding portion, and the center of gravity of the second measurement mark is a straight line connecting the center of gravity of the first opening and the center of gravity of the second opening. Because it is a vernier located at the apex of an isosceles triangle or right isosceles triangle, it is not affected by the depth of focus of the microscope, and it is accurate and stable without being affected by variations in the fringe part of the measurement mark. Thus, a positional deviation is calculated, and a vernier that can confirm the accuracy of the exposure position is obtained.

  In addition, the present invention is a vernier equipped with a target mark for moving the microscope used for measurement to the vicinity of the vernier at a position away from the vernier and further to the position directly above the vernier. It is possible to calculate the positional deviation well and efficiently and to confirm the accuracy of the exposure position.

  Further, the present invention is composed of a red vernier, a green vernier, and a blue vernier for calculating the positional deviation of each color coloring pixel, and each color vernier is provided on the glass substrate in parallel and at equal intervals. Therefore, the microscope used for the measurement can be moved from the red vernier to the green vernier and from the green vernier to the blue vernier, and the positional deviation of each color-colored pixel can be calculated efficiently.

  The present invention also includes: 1) a step of placing the first opening, the second opening, and the second measurement mark of the vernier from above the vernier within the same field of view (display screen) of the microscope used for measurement, and 2) pattern matching. Step of recognizing each of the first opening, the second opening, and the second measurement mark by 3) Coordinates of the center of gravity (A ′) of the first opening and coordinates of the center of gravity (B ′) of the second opening The step of calculating the coordinates of the center of gravity (D ′) of the second measurement mark, 4) the position from the coordinates of the center of gravity (A ′) of the first opening and the center of gravity (B ′) of the second opening Step of setting the coordinates of the center of gravity (C ′) of the second measurement mark without deviation, 5) The coordinates of the calculated center of gravity (D ′) of the second measurement mark and the center of gravity of the set second measurement mark (D ′) C ′) The exposure position measurement comprising the step of calculating the positional deviation of the second measurement mark from the difference in coordinates. Therefore, it is possible to calculate the positional deviation accurately and stably without being affected by the depth of focus of the microscope and without being affected by the variation of the fringe part of the measurement mark, and confirm the accuracy of the exposure position. This is a method of measuring the exposure position using a vernier that can be used.

The present invention also includes 1) a step of placing the microscope used for measurement at a low magnification and placing the target mark in the field of view (display screen) of the microscope from above the vernier, and 2) setting the microscope used for measurement at a medium magnification, Step of recognizing and positioning the target mark at the center of the field of view (display screen) of the microscope, 3) step of setting the XY coordinates of the center of the field of view (display screen) of the microscope as the origin for moving the microscope to the position of the vernier 4) Set the microscope used for measurement to a high magnification, move a predetermined distance, and place the first and second apertures of the vernier in the same field of view (display screen) of the microscope. 5) the step of recognizing each of the first opening, the second opening, and the second measurement mark by pattern matching, 6) the coordinates of the center of gravity (A ′) of the first opening, the second opening Center of gravity (B ′) coordinates, the step of calculating the coordinates of the center of gravity (D ′) of the second measurement mark, 7) the coordinates of the center of gravity (A ′) of the first opening, and the center of gravity (B ′ of the second opening) ), The step of setting the coordinates of the center of gravity (C ′) of the second measurement mark without positional deviation, 8) the coordinates of the center of gravity (D ′) of the calculated second measurement mark, and the set second Since the exposure position measurement method includes a step of calculating the positional deviation of the second measurement mark from the difference in the coordinates of the center of gravity (C ′) of the measurement mark, without being affected by the depth of focus of the microscope, In addition, the exposure position measurement method using vernier that can calculate the positional deviation accurately and stably by automatic measurement without being affected by the variation of the fringe part of the measurement mark, and confirm the accuracy of the exposure position. It becomes.

Below, based on the embodiment of the present invention, it explains in detail.
FIG. 6 is an explanatory diagram of an example of a vernier (V2) according to the present invention, which is composed of a first measurement mark and a second measurement mark. 6A and 6B are plan views of the first measurement mark (M11) and the second measurement mark (M12).
FIG. 6A shows the first measurement mark (M11) formed on the glass substrate (1), and the same material as the black photoresist used for forming the black matrix is used. It was formed simultaneously with the formation of the black matrix.

  The first measurement mark (M11) includes a light shielding part (S), a first opening (Ka-A) and a second opening (Ka-A) provided in the light shielding part (S). . Squares are illustrated as the shapes of the first opening (Ka-A) and the second opening (Ka-B). The dimension of one side (d) of this square is about 10 μm.

FIG. 6B shows the second measurement mark (M12) formed on the light-shielding portion (S) of the first measurement mark (M11), and the colored photo used for forming the colored pixels. The same material as the resist is used, and is formed simultaneously with the formation of the colored pixels.
A circular shape is exemplified as the shape of the second measurement mark (M12). The dimension of the diameter (e) of the second measurement mark (M12) is about 20 μm.

FIG. 6C shows a state in which the second measurement mark (M12) is provided on the light-shielding portion (S) of the first measurement mark (M11) formed on the glass substrate (1). It is a top view. As shown in FIG. 6C, in the present invention, the measurement mark in which the second measurement mark (M12) is provided on the first measurement mark (M11) is referred to as vernier (V2). ing. FIG. 6C shows a state in which the second measurement mark (M12) is provided with no positional deviation with respect to the first measurement mark (M11).
Further, the distance (f) between the first opening (Ka-A) and the second measurement mark (M12), and the distance between the second opening (Ka-B) and the second measurement mark (M12) ( g) is about 35 μm at the same distance.

FIG. 7 is a plan view for explaining the arrangement of the first opening (Ka-A), the second opening (Ka-B), and the second measurement mark (M12). Reference numerals (A), (B), and (D) represent the positions of the centers of gravity of the first opening (Ka-A), the second opening (Ka-B), and the second measurement mark (M12), respectively. Yes.
The center of gravity (D) of the second measurement mark (M12) is at the apex (C) of an isosceles triangle whose base is the straight line connecting the center of gravity (A) of the first opening and the center of gravity (B) of the second opening. positioned.

FIG. 7 illustrates a right isosceles triangle as an isosceles triangle.
The centroid (C) is obtained by connecting the center of gravity (A) and the center of gravity (B) with a straight line to form a base and drawing a perpendicular from the center of the base. The vertex (C) shown in FIG. 7 is the design position of the center of gravity (D) of the second measurement mark (M12), and when the second measurement mark (M12) is formed without misalignment, The center of gravity (D) of the measurement mark (M12) is the position of the vertex (C). That is, it is a vernier that uses the deviation of the center of gravity (D) of the formed second measurement mark (M12) from the apex (C) as the positional deviation of the second measurement mark (M12).

  In addition, although the right isosceles triangle whose position deviation is easy to calculate is illustrated, an isosceles triangle whose vertex is not a right angle may be used. Further, the first opening (Ka-A) and the second opening (Ka-B) may be provided with an inclination (rotation of the angle θ) on the XY plane. Further, the shapes of the first opening (Ka-A), the second opening (Ka-B), and the second measurement mark (M12) are not limited to a square and a circle.

FIG. 8 shows a state in which the microscope to be measured is moved directly above the vernier, and the first opening, the second opening, and the second measurement mark of the vernier of the present invention are contained in the same field of view of the microscope. Yes, the image in the field of view of the microscope is displayed on the display screen.
For example, by selecting an objective lens of a microscope, a first aperture that is in a region of about 60 μm square is set to a magnification that allows a resolution of about 0.1 to 0.2 μm and a region of about 100 μm square of the subject to be accommodated in the field of view. And the second opening and the second measurement mark are accommodated in the same field of view of the microscope.

  FIG. 8 illustrates the second measurement mark (M12) formed as a second measurement mark formed at a position shifted from the apex (C), which is the design position. The second measurement mark (M12) is shifted in the positive direction of the X axis with respect to the first opening (Ka-A) and the second opening (Ka-B) of the first measurement mark (M11). This is an example in which the Y axis is shifted in the positive direction at the same time.

  In FIG. 8, a region indicated by a symbol (Sa) is a measurement area corresponding to each of the first opening, the second opening, and the second measurement mark set in advance, and in each measurement area Each of the first opening, the second opening, and the second measurement mark is recognized. This recognition recognizes that the first opening, the second opening, and the second measurement mark captured by pattern matching are the searched marks, based on each registered image data. To do.

  FIG. 9 shows the calculated center of gravity of the first opening, the second opening, and the second measurement mark on the display screen. The first opening and the second opening are obtained by binarizing the imaged first opening and second opening with a preset threshold value after recognition by pattern matching, and calculating the center of gravity. The second measurement mark is obtained by calculating the center of gravity of the circle by performing binarization processing and elliptic fitting processing after recognition by pattern matching.

  Symbols (A ′) and (B ′) shown in FIG. 9 represent the calculated center of gravity of the first opening (Ka-A) and the center of gravity of the second opening (Ka-B), respectively. Reference sign (C ′) represents the center of gravity of the second measurement mark (M12) set from the center of gravity (A ′) of the second opening and the center of gravity (B ′) of the second opening. Reference sign (D ′) represents the center of gravity of the actually formed second measurement mark (M12).

Reference numerals (A), (B), and (C (D)) shown in FIG. 7 are design centroids. In FIG. 9, reference numerals (A ′), (B ′), ( The center of gravity indicated by C ′) and (D ′) is the center of gravity of the first opening (Ka-A) and the center of gravity of the second opening (Ka-B) that are actually formed. The center of gravity set from the first opening (Ka-A) and the second opening (Ka-B), and the center of gravity of the actually formed second measurement mark.

FIG. 10 is an explanatory diagram of a method for calculating the positional deviation of the second measurement mark, showing the coordinates of the respective center of gravity shown in FIG.
The coordinates of the center of gravity (A ′) of the first opening (Ka-A) are (Xa, Ya), and the coordinates of the center of gravity (B ′) of the second opening (Ka-B) are (Xb, Yb). The coordinates of the center of gravity (C ′) set from the center of gravity (A ′) and the center of gravity (B ′) are (Xc, Yc). The center of gravity (C ′) is the center of gravity of the second measurement mark when the second measurement mark (M12) is not misaligned. The coordinates of the center of gravity (D ′) of the actually formed second measurement mark (M12) are (Xd, Yd).

  Therefore, the positional deviation (Δx) in the X direction of the actually formed second measurement mark (M12) is calculated by Δx = Xd−Xc. Further, the positional deviation (Δy) in the Y direction is calculated by Δy = Yd−Yc.

  As shown in FIGS. 4 and 5, the exposure position measurement method in the prior art is first between the right edge of the opening (Ka) and the right edge of the second measurement mark (M2). The distance of (x1) is measured. Next, the distance (x2) between the left edge of the opening (Ka) and the left edge of the second measurement mark (M2) is measured. The positional deviation (Δx) in the X direction is calculated by Δx = (x1−x2) / 2. Similarly, the positional deviation (Δy) in the Y direction is calculated.

  On the other hand, the method for measuring the exposure position in the present invention does not measure the edge of the measurement mark, but the first opening (Ka-A), the second opening (Ka-B), and the second measurement. Since the positional deviation is calculated based on the center of gravity of the mark (M12), it is accurate and stable without being affected by the depth of focus of the microscope and without being affected by variations in the fringe portion of the measurement mark. Thus, the positional deviation of the colored pixels with respect to the black matrix can be calculated, and the accuracy of the exposure position can be confirmed.

Further, since the first measurement mark (M1) in the conventional technique is a square having a side (a) of about 200 μm, it is not possible to measure all the measurement points at once with a high magnification of the microscope. For example, the measurement is divided into four times.
On the other hand, in the vernier (V2) according to the present invention, all of the measurement marks can be accommodated within a size of about 50 μm square, so that even a high-magnification microscope can display an image in the same field of view. Deviation can be calculated, and the exposure position can be measured efficiently.

  FIG. 11 is a plan view of an example of a vernier according to claim 3. As shown in FIG. 11, the vernier includes a vernier (V2), a target mark (TM), and a color identification mark (IM). The vernier (V2) is a vernier shown in FIG. 6 (c), and this vernier is subjected to the second measurement on the light shielding portion (S) of the first measurement mark (M11) formed on the glass substrate (1). This is a state in which the mark (M12) is provided without misalignment.

The target mark (TM) is a target mark for moving the microscope used for measurement to the vicinity of the vernier (V2) and further to the position directly above the vernier (V2). The target mark (TM) is provided at a position away from the vernier (V2) by a certain distance.
The target mark (TM) has a first opening (Ka-A) and a second opening (in the portion where the light-shielding portion (S) of the first measurement mark (M11) extends rightward in FIG. It is an opening formed simultaneously with the formation of Ka-B).

FIG. 11 illustrates a cross-shaped target mark (TM). The fixed distance (L1) at which the target mark (TM) is separated from the vernier (V2) (vernier second measurement mark) is about 100 μm. Further, the dimensions of the target mark (TM) are about 60 μm in the vertical and horizontal directions represented by the symbols (j) and (k), and the width of the opening represented by the symbols (h) and (i) is about 20 μm.

FIG. 11 shows an example in which a color identification mark (IM) is further provided in addition to the target mark (TM). The color identification mark (IM) is a mark for identifying the color of the colored pixel, which color pixel the vernier (V2) is for.
The color identification mark (IM) is provided at a position further away from the target mark (TM) by a certain distance (L2), for example, 100 to 200 μm. The color identification mark (IM) is an opening formed simultaneously with the formation of the target mark (TM).

  FIG. 12 is a plan view showing an outline of an example of a measuring apparatus used in the present invention. FIG. 13 is a side view showing a portion of the microscope from the direction indicated by the white arrow in FIG. As shown in FIGS. 12 and 13, this measuring apparatus includes a surface plate (10), an X-axis rail (11), an X-axis trolley (12), a gantry (gantry) (13), a Y-axis trolley (14), It consists of a microscope (15).

The gantry (gantry) (13) is provided on the X-axis trolley (12) so that it can freely move in the X-axis direction on the X-axis rail (11) provided on the surface plate (10). It has become. Further, the Y-axis trolley (14) can move freely in the Y-axis direction on the gantry (gantry) (13).
By freely moving in the X-axis direction and the Y-axis direction, the microscope (15) provided on the side surface of the Y-axis trolley (14) can be moved to any XY coordinate position on the surface plate (10). It can be done.

  The microscope (15) used for the measurement is provided with a revolver to which several types of objective lenses are attached so that the magnification can be changed quickly. The glass substrate (color filter) (1) placed on the surface plate (10) is a glass substrate on which a black matrix and colored pixels are already formed, and glass outside the image display area on which the colored pixels are formed. Verniers are provided on the substrate.

In the measuring method using the vernier (V2) provided with the target mark (TM) shown in FIG. 11, first, the microscope used for the measurement may have a low magnification, for example, a region of about 200 μm square of the subject within the field of view. The microscope is moved to the vicinity of the preset XY coordinates of the vernier (V2), and the vicinity of the target mark (TM) is stored in the field of view (display screen) of the microscope from above the vernier.
FIG. 14 shows an image in the field of view of the microscope near the XY coordinates of vernier (V2) displayed on the display screen. At this time, the setting of the microscope to a low magnification and the movement of the XY coordinates are automatically performed.

Next, the microscope used for the measurement is set to a medium magnification, for example, a medium magnification capable of accommodating a region of about 150 μm square of the subject in the field of view, and the target mark is recognized by pattern matching. This recognition recognizes that the captured target mark is the searched mark based on the target mark image which is the image data of the target mark registered in advance.
Thereafter, the microscope is finely moved, and the target mark (TM) is positioned at the center of the field of view (display screen) of the microscope. FIG. 15 shows an image on the display screen in which the microscope is finely moved and the target mark (TM) is positioned at the center of the field of view (display screen) of the microscope.

Next, the XY coordinates of the center of the display screen where the target mark is displayed at the center of the display screen are set as the origin (X ₀ , Y ₀ ) for moving the microscope to the position of the vernier (V2). Subsequently, the microscope used for the measurement is set to a high magnification, for example, a high magnification capable of accommodating an area of about 100 μm square of the subject in the field of view, and the microscope is set at a predetermined distance from the origin (X ₀ , Y ₀ ). (L1) is moved, and the first opening, the second opening, and the second measurement mark of the vernier (V2) are placed in the same field of view (display screen) of the microscope.

FIG. 16 shows the microscope image of the target mark (TM) displayed on the display screen when the magnification of the microscope is increased. From the position of the origin (X ₀ , Y ₀ ), the microscope moves a fixed distance (L1) in the direction indicated by the thick arrow in FIG. The first opening (Ka-A), the second opening (Ka-B), and the second measurement mark (M12) of V2) are placed in the same field of view (display screen) of the microscope. The second measurement mark (M12) of the vernier (V2) is shown at the design position.

  In FIG. 16, the video (display screen) within the dotted line frame corresponds to the display screen shown in FIG. Therefore, the subsequent steps are based on the steps described above based on FIGS. In addition, a series of operations such as microscope magnification setting, microscope movement, recognition by pattern matching, origin setting, binarization processing, ellipse fitting, and barycentric coordinate calculation in the above steps are all performed automatically.

  As described above, according to the measurement method using the vernier (V2) provided with the target mark (TM), it is not affected by the depth of focus of the microscope and is also affected by the variation in the fringe portion of the measurement mark. It is possible to calculate the positional deviation with accuracy, stability, and efficiency by automatic measurement, and to confirm the accuracy of the exposure position.

FIG. 17 is a plan view of an example of a vernier according to claim 4. As shown in FIG. 17, the vernier includes a red vernier (V2-R) for calculating the positional deviation of the red colored pixel, a green vernier (V2-G) for calculating the positional deviation of the green colored pixel, and blue. It is composed of blue vernier (V2-B) for calculating the positional deviation of the colored pixels. Each color vernier is a vernier shown in FIG. 11, and each color vernier is provided with a target mark (TM) and a color identification mark (IM).
Each color vernier is provided in parallel and at equal intervals on a glass substrate outside the image display area. This interval is a predetermined interval (L3) set in advance and is 200 μm.

The calculation of the positional deviation of the colored pixel with respect to the black matrix using this vernier is performed for the colored pixel of that color every time one colored pixel is formed, for example. In this case, for example, the steps 1) to 8) described in claim 6 are performed three times each time one color pixel is formed.
Alternatively, for example, after three colored pixels are formed, the positional deviation is calculated for the three colored pixels at once.

  In this case, for example, when calculating the positional deviation of the red color pixel which is the first color, the red color pixel (V2-R) is obtained by performing steps 1) to 8) of the red color pixel. Calculate the displacement.

Subsequently, when calculating the positional deviation of the green color pixel which is the second color, after calculating the positional deviation of the red colored pixel, the microscope used for the measurement is connected to the first opening of the red vernier (V2-R), The green vernier (V2-G) is moved from the position where the two openings and the red second measurement mark (M12-R) are stored in the same field of view (display screen) of the microscope by a predetermined interval (L3). The first opening, the second opening, and the green second measurement mark (M12-G) are housed in the same field of view (display screen) of the microscope, and the green vernier (V2-G) is described in claim 6. 5) Step to 8)
The positional deviation of the green colored pixel is calculated by the process.

  Subsequently, when calculating the position shift of the blue color pixel which is the third color, after calculating the position shift of the green color pixel, the microscope used for the measurement is the first opening of the green vernier (V2-G), From the position where the second opening, the green vernier (V2-G) is stored in the same field of view (display screen) of the microscope, a predetermined constant interval (L3) is moved, and the blue vernier (V2-B) The one opening, the second opening, and the blue second measurement mark (M12-B) are housed in the same field of view (display screen) of the microscope, and the blue vernier (V2-B) is 5) step according to claim 6. ˜8) The displacement of the blue colored pixel is calculated by the process.

As described above, the measuring method of the exposure position according to claim 7 uses the red vernier (V2) as the microscope used for the measurement without the steps 1) to 4) described in claim 6 after the second color. -R) to green vernier (V2-G), and from green vernier (V2-G) to blue vernier (V2-B), and the position shift of each colored pixel is automatically calculated continuously. How to do it.
Accordingly, it is possible to efficiently calculate the positional deviation of the three colored pixels.

(A)-(c) is explanatory drawing of an example of the vernier comprised by the mark for 1st measurement, and the mark for 2nd measurement. It is sectional drawing in the XX line of FIG.1 (c). (A)-(c) is a top view explaining 3 types of vernier provided on the glass substrate outside an image display area. It is explanatory drawing of the method of measuring the position of the coloring pixel with respect to a black matrix using a vernier, and calculating the position shift. It is sectional drawing of the vernier at the time of measuring between the edge of an opening part, and the edge of the 2nd measurement mark. (A) is a top view of the 1st mark for a measurement of an example of the vernier by this invention. (B) is a top view of the 2nd measurement mark of an example of the vernier by this invention. (C) is a plan view showing a state in which the second measurement mark is provided on the light shielding portion of the first measurement mark. It is a top view explaining arrangement | positioning of a 1st opening part, a 2nd opening part, and the 2nd measurement mark. It is the display screen which displayed the image | video in the same visual field of a microscope by moving a microscope right above a vernier and displaying a 1st opening part, a 2nd opening part, and the 2nd mark for a measurement. The calculated center of gravity of each of the first opening, the second opening, and the second measurement mark is displayed on the display screen. It is explanatory drawing of the method which shows the coordinate of each gravity center shown in FIG. 9, and calculates the position shift of the 2nd measurement mark. It is a top view of an example of the vernier concerning Claim 3. It is a top view which shows the outline of an example of the measuring apparatus used in this invention. It is a side view which shows the part of the microscope from the direction shown by the white thick arrow in FIG. The image in the field of view of the microscope near the XY coordinates of Vernier is displayed on the display screen. The image is displayed on the display screen by moving the microscope finely and positioning the target mark at the center of the field of view (display screen) of the microscope. The image of the microscope of the target mark when the microscope is set to a high magnification is displayed on the display screen. It is a top view of an example of the vernier concerning Claim 4.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Glass substrate 10 ... Surface plate 11 ... X-axis rail 12, 14 ... X-axis truck, Y-axis truck 15 ... Microscope A, B, D ... 1st opening part, Position of the center of gravity of the second opening and the second measurement mark A ′, B ′... Calculated center of gravity of the first opening, center of gravity C of the second opening C ... design of the center of gravity of the second measurement mark Upper position C′—centroid D ′ of second measurement mark set from the center of gravity of the second opening and the center of gravity of the second opening D′—centroid F of the actually formed second measurement mark ... Fringe part IM ... Color identification mark Ka ... Opening part Ka-A ... First opening part Ka-B ... Second opening part Ke ... Edge Je .. Edges L1 and L2 on the right side of the second measurement mark ... a certain distance M1 ... first measurement mark M1-R, M2-R ... red first measurement mark , Red second measurement mark M1-G, M2-G ... green first measurement mark, green second measurement mark M1-B, M2-B ... blue first measurement mark, blue second Measurement mark M2 ... Second measurement mark M11 ... First measurement mark M12 in the present invention ... Second measurement mark M12-R, M12-G, M12-B in the present invention Red second measurement mark, green second measurement mark, blue second measurement mark S ... light-shielding portion Sa ... measurement area TM ... target mark V1 ... vernier V1-R in the present invention V1-G, V1-B ... red vernier, green vernier, blue vernier V2 ... vernier V2-R, V2-G, V2-B according to the present invention red vernier, green vernier, blue according to the present invention Vernier Wa ・ ・ ・ Frame

Claims (7)

In the vernier that calculates the displacement of the colored pixels relative to the black matrix on the glass substrate,
1) The vernier includes a first measurement mark and a second measurement mark,
2) The first measurement mark includes a light shielding portion, a first opening, and a second opening formed at the same time as the formation of the black matrix. The second measurement mark is formed of colored pixels on the light shielding portion. Formed at the same time as the formation,
3) The vernier characterized in that the center of gravity of the second measurement mark is located at the apex of an isosceles triangle whose base is a straight line connecting the center of gravity of the first opening and the center of gravity of the second opening.   The vernier according to claim 1, wherein the isosceles triangle is a right-angled isosceles triangle.   The vernier according to claim 1 or 2, wherein the vernier is provided with a target mark for moving a microscope used for measurement to a position near the vernier at a position away from the vernier, and further to move directly above the vernier. Vernier characterized by being.   4. The vernier according to claim 1, wherein the vernier is a red vernier for calculating a positional deviation of a red colored pixel, a green vernier for calculating a positional deviation of a green colored pixel, and a blue color. A vernier comprising blue verniers for calculating a positional deviation of colored pixels, and each color vernier is provided on a glass substrate in parallel and at equal intervals. In the measurement method of the exposure position using a vernier that calculates the positional deviation of the colored pixels with respect to the black matrix on the glass substrate,
1) Using the vernier according to claim 1 or 2 as the vernier, the same visual field (display) of the microscope using the first opening, the second opening, and the second measurement mark of the vernier for measurement from above the vernier Screen)
2) The first opening by pattern matching in each preset measurement area corresponding to each of the first opening, the second opening, and the second measurement mark in the same field of view (display screen) Recognizing each of the second opening and the second measurement mark,
3) Each of the recognized first opening, second opening, and second measurement mark is binarized, or the coordinates of the center of gravity (A ′) of the first opening by binarization and ellipse fitting, Calculating the coordinates of the center of gravity (B ′) of the second opening and the coordinates of the center of gravity (D ′) of the second measurement mark;
4) From the coordinates of the center of gravity (A ′) of the first opening and the coordinates of the center of gravity (B ′) of the second opening, the coordinates of the center of gravity (C ′) of the second measurement mark having no positional deviation are set. Process,
5) calculating the positional deviation of the second measurement mark from the difference between the calculated coordinates of the center of gravity (D ′) of the second measurement mark and the coordinates of the center of gravity (C ′) of the set second measurement mark. And a method of measuring an exposure position. In the measurement method of the exposure position using a vernier that calculates the positional deviation of the colored pixels with respect to the black matrix on the glass substrate,
1) The vernier according to claim 3 is used as the vernier, the microscope used for measurement is set to a low magnification, the microscope is moved to the vicinity of the XY coordinates of the vernier set in advance, and the target mark is placed above the vernier from the microscope. The process of fitting in the field of view (display screen),
2) A step of setting the microscope used for measurement at a medium magnification, recognizing the target mark by pattern matching, moving the microscope, and positioning the target mark at the center of the field of view (display screen) of the microscope;
3) A step of setting the XY coordinates of the center of the visual field (display screen) of the microscope as an origin for the microscope to move to the vernier position;
4) The microscope used for the measurement is set to a high magnification, the microscope is moved a predetermined distance from the origin, and the vernier first opening, the second opening, and the second measurement mark are placed in the same field of view of the microscope ( Process within the display screen),
5) The first opening by pattern matching in each preset measurement area corresponding to each of the first opening, the second opening, and the second measurement mark in the same field of view (display screen). Recognizing each of the second opening and the second measurement mark,
6) Each of the recognized first opening, second opening, and second measurement mark is binarized, or the coordinates of the center of gravity (A ') of the first opening by binarization and elliptic fitting processing, Calculating the coordinates of the center of gravity (B ′) of the second opening and the coordinates of the center of gravity (D ′) of the second measurement mark;
7) From the coordinates of the center of gravity (A ′) of the first opening and the coordinates of the center of gravity (B ′) of the second opening, the coordinates of the center of gravity (C ′) of the second measurement mark having no positional deviation are set. Process,
8) calculating the positional deviation of the second measurement mark from the difference between the calculated coordinates of the center of gravity (D ′) of the second measurement mark and the coordinates of the center of gravity (C ′) of the set second measurement mark And a method of measuring an exposure position. The exposure position measurement method according to claim 6, wherein the vernier according to claim 4 is used as the vernier.
1) When calculating the positional deviation of the red colored pixel with respect to the black matrix, for the red vernier, the positional deviation of the red colored pixel is calculated by the steps 1) to 8).
2) When calculating the positional deviation of the green colored pixel with respect to the black matrix, after calculating the positional deviation of the red colored pixel, the microscope used for the measurement is changed to the first opening, the second opening, and the red second of the red vernier. From the position where the measurement mark is stored in the same field of view (display screen) of the microscope, a predetermined interval is moved, and the first and second openings of the green vernier and the green second measurement mark are moved to the microscope. Within the same field of view (display screen)
3) For the green vernier, the displacement of the green colored pixel is calculated by the steps 5) to 8).
4) When calculating the positional deviation of the blue colored pixel with respect to the black matrix, after calculating the positional deviation of the green colored pixel, the microscope used for the measurement is the green vernier first opening, second opening, green second From the position where the measurement mark is stored in the same field of view (display screen) of the microscope, a predetermined interval is moved, and the blue vernier first opening, the second opening, and the blue second measurement mark are moved to the microscope. Within the same field of view (display screen)
3) A method for measuring an exposure position, wherein the displacement of a blue colored pixel is calculated in steps 5) to 8) for the blue vernier.

Images