JP5148750B2 - 水冷式クーラー固定構造を備えたメインボードテスト用ソケット - Google Patents
水冷式クーラー固定構造を備えたメインボードテスト用ソケット Download PDFInfo
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- JP5148750B2 JP5148750B2 JP2011514483A JP2011514483A JP5148750B2 JP 5148750 B2 JP5148750 B2 JP 5148750B2 JP 2011514483 A JP2011514483 A JP 2011514483A JP 2011514483 A JP2011514483 A JP 2011514483A JP 5148750 B2 JP5148750 B2 JP 5148750B2
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- Prior art keywords
- cooler
- main board
- fixing
- water
- socket
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- 238000012360 testing method Methods 0.000 title claims description 76
- 238000001816 cooling Methods 0.000 title claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 10
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 10
- 238000011161 development Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
110 ソケット胴体
112 クーラー保持溝
120 クーラー固定部材
122 フック部材
122a 係止フック
124 係止鍔
126 弾性バネ
128 ヒンジ
130 保持溝
132 クーラー加圧片
134 ヒンジ
136 加圧バネ
140 固定ボルト
150 水冷式クーラー
154 位置固定溝
160 ヒンジ固定ねじ
110a 上部ソケット胴体
110b 下部ソケット胴体
Claims (5)
- メインボード上に実装されたCPUに比べて大きいサイズに形成され、かつ水冷式クーラーが挿入されて保持される一定のサイズのクーラー保持溝が設けられ、前記メインボード上のCPU上部に設置されるソケット胴体と、
前記ソケット胴体のクーラー保持溝の上部を横切って設置され、かつ一端が前記ソケット胴体の一側の上端に一定範囲で回転自在にヒンジ結合され、前記クーラー保持溝上に挿入されて保持された水冷式クーラーを固定させるクーラー固定手段と、
前記クーラー固定手段の固定結合によって前記ソケット胴体のクーラー保持溝上に保持された水冷式クーラーの上部面を弾力的に加圧し、その下部面が前記メインボード上のCPU上部面に密着するようにするクーラー加圧手段と、
前記ソケット胴体を前記メインボード上に固定させるソケット固定手段と、を備えて構成され、
前記クーラー固定手段は、
前記ソケット胴体の一側の上端に一定範囲で回転自在にヒンジ結合され、前記クーラー保持溝の上部を横切る構造で形成されるクーラー固定部材と、
前記クーラー固定部材の他端に一定範囲で回転自在に設置され、かつその下端に係止フックが形成されたフック部材と、
前記フック部材の係止フックに対応して前記ソケット胴体の他側の外側面上に形成される係止鍔と、
前記クーラー固定部材の他端に設置され、前記フック部材が前記係止鍔に常時係止することができる方向にその力が作用する弾性バネとで構成され、
前記クーラー加圧手段は、前記クーラー固定部材の下部面上に一定深さに形成され、かつその両側の同一線上にヒンジ孔が貫通形成された保持溝と、
前記保持溝に対応するサイズに形成され、前記保持溝上に突出設置され、かつ上下に一定範囲で移動自在になるように長孔形態のヒンジ貫通孔が前記ヒンジ孔に対応して形成されたクーラー加圧片と、
前記ヒンジ孔とヒンジ貫通孔を通じて結合され、前記クーラー加圧片を前記保持溝上に設置するヒンジと、
前記保持溝上に設置され、前記クーラー加圧片を外側方向に常時加圧する加圧バネとで構成される水冷式クーラー固定構造を備えたメインボードテスト用ソケット。 - 前記ヒンジは、前記ソケット胴体の一側の下部面上に一定深さの長さ方向に形成されたヒンジ挿入溝を通じて挿入され、前記クーラー固定部材の一端をヒンジ結合し、かつ、前記ヒンジ挿入溝を通じて上向きに螺合されるヒンジ固定ねじのねじ頭によって前記ヒンジ挿入溝上に固定されることを特徴とする請求項1に記載の水冷式クーラー固定構造を備えたメインボードテスト用ソケット。
- 前記水冷式クーラーの上部面の中心部には、前記クーラー加圧手段のクーラー加圧片に対応する位置固定溝が形成され、前記クーラー固定手段を用いて前記クーラー保持溝上に前記水冷式クーラーを固定させる場合、前記クーラー加圧片によって前記水冷式クーラーの位置が固定するようにすることを特徴とする請求項1または2に記載の水冷式クーラー固定構造を備えたメインボードテスト用ソケット。
- 前記ソケット固定手段は、
前記ソケット胴体の下部面に多数形成される螺合孔と、
前記メインボードの下部面を貫通し、前記螺合孔との締結により前記メインボード上に前記ソケット胴体を固定させる固定ボルトとで構成されることを特徴とする請求項1乃至3のいずれかにに記載の水冷式クーラー固定構造を備えたメインボードテスト用ソケット。 - 前記クーラー保持溝の先端部を成す前記ソケット胴体の先端面の一部分は、前記水冷式クーラーの先端面に設けられたカップリングが挿入されて保持されるように開放されることを特徴とする請求項1乃至4のいずれかに記載の水冷式クーラー固定構造を備えたメインボードテスト用ソケット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080056968A KR100965926B1 (ko) | 2008-06-17 | 2008-06-17 | 수냉식 쿨러 고정구조가 구비된 메인보드 테스트용 소켓 |
KR10-2008-0056968 | 2008-06-17 | ||
PCT/KR2009/002959 WO2009154370A2 (ko) | 2008-06-17 | 2009-06-03 | 수냉식 쿨러 고정구조가 구비된 메인보드 테스트용 소켓 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011526708A JP2011526708A (ja) | 2011-10-13 |
JP5148750B2 true JP5148750B2 (ja) | 2013-02-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011514483A Active JP5148750B2 (ja) | 2008-06-17 | 2009-06-03 | 水冷式クーラー固定構造を備えたメインボードテスト用ソケット |
Country Status (5)
Country | Link |
---|---|
US (1) | US7864537B2 (ja) |
JP (1) | JP5148750B2 (ja) |
KR (1) | KR100965926B1 (ja) |
CN (1) | CN102067063B (ja) |
WO (1) | WO2009154370A2 (ja) |
Families Citing this family (16)
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US8937810B2 (en) | 2012-09-14 | 2015-01-20 | International Business Machines Corporation | Electronic assembly with detachable coolant manifold and coolant-cooled electronic module |
US9066460B2 (en) | 2013-01-17 | 2015-06-23 | International Business Machines Corporation | Disassemblable electronic assembly with leak-inhibiting coolant capillaries |
ITTO20140013U1 (it) * | 2014-01-23 | 2015-07-23 | Johnson Electric Asti S R L | Connettore elettrico e relativo dispositivo di ritegno per un gruppo elettroventilatore di raffreddamento di uno scambiatore di calore per autoveicoli |
KR101697325B1 (ko) * | 2016-07-18 | 2017-01-17 | 민형식 | 컴퓨터 처리장치용 냉각장치 |
CN109062350A (zh) * | 2018-08-17 | 2018-12-21 | 广西紫极科技有限公司 | 一种计算机硬件保护装置 |
CN108818358B (zh) * | 2018-08-21 | 2021-06-11 | 天津泽川工贸有限公司 | 新型固定火箭壁板工装 |
KR102188133B1 (ko) * | 2018-11-15 | 2020-12-07 | 주식회사 에이텍 | 컴퓨터의 발열을 이용한 cpu 냉각장치 |
CN210008008U (zh) * | 2018-11-30 | 2020-01-31 | 富顶精密组件(深圳)有限公司 | 一种固定芯片模组的锁固结构及其背板结构 |
TWI751742B (zh) * | 2020-10-16 | 2022-01-01 | 奇鋐科技股份有限公司 | 組合式水冷單元扣具結構 |
TWI756868B (zh) * | 2020-10-16 | 2022-03-01 | 奇鋐科技股份有限公司 | 組合式水冷模組扣具結構 |
US11737236B2 (en) | 2020-11-16 | 2023-08-22 | Asia Vital Components Co., Ltd. | Knockdown water-cooling module latch device structure |
US11683908B2 (en) | 2020-11-16 | 2023-06-20 | Asia Vital Components Co., Ltd. | Knockdown water-cooling unit latch device structure |
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US20220418134A1 (en) * | 2021-06-28 | 2022-12-29 | International Business Machines Corporation | Rotating lid for module cooler |
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CN113918399B (zh) * | 2021-12-06 | 2022-03-08 | 深圳市微特精密科技股份有限公司 | 一种电脑主板固件功能测试装置 |
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CN101573016B (zh) * | 2008-04-28 | 2011-08-31 | 富准精密工业(深圳)有限公司 | 散热装置及其扣具 |
-
2008
- 2008-06-17 KR KR1020080056968A patent/KR100965926B1/ko active IP Right Grant
-
2009
- 2009-06-03 CN CN2009801230224A patent/CN102067063B/zh active Active
- 2009-06-03 WO PCT/KR2009/002959 patent/WO2009154370A2/ko active Application Filing
- 2009-06-03 JP JP2011514483A patent/JP5148750B2/ja active Active
- 2009-06-09 US US12/481,053 patent/US7864537B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2009154370A3 (ko) | 2010-03-11 |
JP2011526708A (ja) | 2011-10-13 |
WO2009154370A2 (ko) | 2009-12-23 |
KR100965926B1 (ko) | 2010-06-24 |
US7864537B2 (en) | 2011-01-04 |
CN102067063A (zh) | 2011-05-18 |
US20090311894A1 (en) | 2009-12-17 |
CN102067063B (zh) | 2013-03-06 |
KR20090131140A (ko) | 2009-12-28 |
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