JP5147191B2 - 回路基板 - Google Patents
回路基板 Download PDFInfo
- Publication number
- JP5147191B2 JP5147191B2 JP2006105935A JP2006105935A JP5147191B2 JP 5147191 B2 JP5147191 B2 JP 5147191B2 JP 2006105935 A JP2006105935 A JP 2006105935A JP 2006105935 A JP2006105935 A JP 2006105935A JP 5147191 B2 JP5147191 B2 JP 5147191B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- seat
- circuit board
- contact
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006105935A JP5147191B2 (ja) | 2006-04-07 | 2006-04-07 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006105935A JP5147191B2 (ja) | 2006-04-07 | 2006-04-07 | 回路基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007278862A JP2007278862A (ja) | 2007-10-25 |
| JP2007278862A5 JP2007278862A5 (enExample) | 2009-05-07 |
| JP5147191B2 true JP5147191B2 (ja) | 2013-02-20 |
Family
ID=38680450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006105935A Expired - Fee Related JP5147191B2 (ja) | 2006-04-07 | 2006-04-07 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5147191B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5588851B2 (ja) * | 2010-12-14 | 2014-09-10 | 株式会社日本マイクロニクス | 電気的接続装置及びその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150594A (ja) * | 1998-11-05 | 2000-05-30 | Hitachi Ltd | 接続装置および押さえ部材付配線フィルムの製造方法並びに検査システムおよび半導体素子の製造方法 |
| JP4004241B2 (ja) * | 2001-04-16 | 2007-11-07 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP3651451B2 (ja) * | 2001-09-20 | 2005-05-25 | ヤマハ株式会社 | プローブユニットおよびその製造方法 |
-
2006
- 2006-04-07 JP JP2006105935A patent/JP5147191B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007278862A (ja) | 2007-10-25 |
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