JP5143083B2 - Substrate processing apparatus, semiconductor device manufacturing method, and substrate mounting table - Google Patents

Description

  The present invention relates to a substrate processing apparatus such as a substrate processing furnace that processes a substrate such as a wafer using a plasma source capable of generating high-density plasma, for example.

  As a substrate processing apparatus, a technique including a substrate processing apparatus that forms a substrate processing chamber for processing a substrate and a heating unit that heats the substrate disposed in the substrate processing chamber is known. Further, such a technique is known that has a cooling means for cooling a portion other than the heating means of the substrate processing apparatus when the substrate is heated (see Patent Document 1).

JP-A-2005-72028

  However, the conventional technique has a problem that the substrate cooling device may not be sufficiently cooled. In this case, for example, in a substrate processing apparatus that uses a magnetic field formed by a magnet for substrate processing, the magnet is heated so that the magnetic force is reduced and good substrate processing cannot be performed, or the substrate is difficult to be operated by an operator. The temperature of the processing apparatus may increase. For example, when members made of rubber, resin, or the like are used, the temperature of the substrate processing apparatus may rise to a temperature higher than the heat resistance temperature of these members. For this reason, the substrate can be heated only to a temperature at which these problems do not occur, and there is a problem that the heating temperature of the substrate is limited.

  An object of the present invention is to solve the above-mentioned problems, and to provide a substrate processing apparatus capable of suppressing a portion other than the substrate heating means from becoming high temperature and raising a temperature limit for heating the substrate. .

  The first feature of the present invention is that a substrate processing container for forming a substrate processing chamber for processing a substrate, a heating means for heating the substrate disposed in the substrate processing chamber, and a substrate processing container are formed. Cooling medium supply means for supplying a cooling medium to the cooling medium path, wherein the cooling medium supply means suppresses heat transfer from the heating means and cools at least the lower portion of the substrate processing container. A substrate processing apparatus is characterized in that a cooling medium is supplied to the substrate.

  Preferably, the apparatus further includes a heat shielding material provided between a heater included in the heating unit and a support unit that supports the heating unit, and the cooling medium supply unit cools the heat shielding material. Supply cooling medium to

  The second feature of the present invention includes a substrate processing container that forms a substrate processing chamber for processing a substrate, and a heating unit that heats the substrate disposed in the substrate processing chamber. A cooling means for cooling at least the substrate processing container with an air flow generated in a space formed between the outer peripheral container covering at least a part of the outer periphery of the container and the substrate processing container, or the heating means from the heating means. The substrate processing apparatus has at least one of heat transfer suppressing means for suppressing heat transfer to the supporting means to be supported.

Preferably, the cooling means includes cooling gas supply means for supplying a cooling gas to a space formed between the outer peripheral container and the substrate processing container, and cooling for discharging the cooling gas from the space. Gas discharge means. Preferably, the substrate processing container includes a magnet for generating a magnetic field, and the cooling gas supply unit is disposed in the vicinity of the magnet and cools the magnet with the cooling gas. Preferably, the heating means has a heater, and control means for controlling the cooling gas supply speed of the cooling gas supply means in accordance with the amount of heat generated by the heater.
Preferably, the apparatus further comprises control means for controlling a cooling gas supply speed of the cooling gas supply means depending on whether or not a substrate is placed on the heating means. Preferably, the cooling gas supply means includes a plurality of cooling gas supply fans arranged around the substrate processing container. Preferably, the cooling means includes at least one cooling medium flow path formed in the substrate processing container, and a cooling medium supply means for supplying the cooling medium to the cooling medium flow path. Preferably, the substrate processing container includes a first container provided with an opening, a second container connected to the first container in a state of closing the opening, and the first container A cooling member is provided at a connection portion between the container and the second container and seals the processing chamber in a substantially airtight state, and the cooling medium flow path is formed in the vicinity of the sealing member.

  Preferably, the heat transfer suppression means is made of a heat shielding material disposed between the heating means and the support means. Preferably, the apparatus further includes a heat shielding material cooling means for cooling at least the heat shielding material. Preferably, the heat blocking material cooling means includes a cooling medium flow path formed in the support means, and a cooling medium supply means for supplying the cooling medium to the cooling medium flow path.

  The third feature of the present invention is that a substrate processing container for forming a substrate processing chamber for processing a substrate, a heating means for heating the substrate disposed in the substrate processing chamber, A substrate processing apparatus comprising: an outer peripheral container that covers at least a part of the outer periphery; and a cooling unit that cools at least the substrate processing container with an airflow generated in a space surrounded by an outer side of the substrate processing container and an inner side of the outer peripheral container. It is in.

  The fourth feature of the present invention is that a substrate processing container for forming a substrate processing chamber for processing a substrate, a heating means for heating the substrate disposed in the substrate processing chamber, and a support for the heating means are supported. The substrate processing apparatus includes support means and heat transfer suppression means for suppressing heat transfer from the heating means to the support means.

  According to a fifth feature of the present invention, a substrate processing container for forming a substrate processing chamber for processing a substrate, a cylindrical electrode arranged outside the substrate processing container, and the substrate processing container The substrate processing apparatus includes an outer peripheral container covering at least a part and an electrode cooling means for cooling the electrode with a cooling gas.

  Preferably, the electrode cooling means includes at least one cooling gas supply means that is provided in the outer peripheral container and supplies a cooling gas into the outer peripheral container. Preferably, the processing container includes a first container provided with an opening, a second container connected to the first container in a state of closing the opening, and the first container. An airtight seal member cooling means for cooling the cylindrical electrode and the seal member. Have.

  According to a sixth aspect of the present invention, there is provided a substrate processing apparatus for processing a substrate in a substrate processing container having a reaction gas supply port and a discharge port and maintained in a substantially vacuum. The substrate processing apparatus is provided with a heating means for heating the substrate disposed in the substrate, and at least one heat blocking material is provided at a connection portion between the heating means and the substrate processing container.

  Preferably, at least one cooling fan for cooling the outer surface of the processing container is provided. Preferably, a cooling medium flow path is formed in the processing container, and cooling medium supply means for supplying the cooling medium to the cooling medium flow path is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the substrate processing apparatus which suppresses that parts other than the heating means which heats a board | substrate can become high temperature can be provided.

It is sectional drawing which shows schematic structure of the substrate processing apparatus which concerns on embodiment of this invention. 1 is a perspective view showing a substrate processing apparatus according to an embodiment of the present invention. FIG. 3 is an enlarged cross-sectional view showing a connecting portion between a susceptor included in a substrate processing apparatus according to an embodiment of the present invention and a support member that supports the susceptor, and FIG. 3A is a cross-sectional view of the same cross section as FIG. FIG. 3B is a cross-sectional view taken along the line AA shown in FIG. It is a perspective view which shows the state in which a flow path is formed in the lower container which the substrate processing apparatus which concerns on embodiment of this invention has. The lower container which the substrate processing apparatus which concerns on embodiment of this invention has is shown, Fig.5 (a) is a plane sectional view, FIG.5 (b) is sectional drawing by BB cross section shown to Fig.5 (a). FIG.5 (c) is sectional drawing by CC cross section shown to Fig.5 (a). It is a graph explaining the control for every substrate processing process of the output of the heater which the susceptor of the substrate processing apparatus which concerns on embodiment of this invention has, and the rotational speed of a fan.

Next, embodiments of the present invention will be described with reference to the drawings.
1 to 5 show a substrate processing apparatus 10 according to an embodiment of the present invention. The substrate processing apparatus 10 includes a plasma processing furnace. Specifically, the substrate processing apparatus 10 performs plasma processing on a substrate such as a wafer using a modified magnetron type plasma source capable of generating high-density plasma by an electric field and a magnetic field. It consists of a processing furnace (hereinafter referred to as MMT apparatus).

  The substrate processing apparatus 10 supplies a reaction gas to the substrate processing chamber 12 that forms a substrate processing chamber 14 that processes a wafer 200 used as a substrate, and the substrate processing chamber 14, and discharges the reaction gas from the substrate processing chamber. A reaction gas supply / discharge system, a plasma generation system for generating plasma in the substrate processing chamber 14, a substrate heating system for heating the wafer 200 as a substrate in the substrate processing chamber 14, and at least the substrate processing container 12 are cooled. It consists of a cooling system, a heat transfer suppression system that suppresses heat from being transferred from the substrate heating system to parts other than the substrate heating system of the substrate processing apparatus 10, and a control system that controls the substrate processing apparatus.

The substrate processing container 12 is used as a first container, a reaction tube 16 used as an upper substrate processing container, a lower substrate processing container 20 used as a second container, a reaction tube 16 and a second container. An O-ring 32 used as a seal member provided at a connection part with
The interference member 30 is located between the reaction tube and the second container. An outer peripheral container 36 that covers at least a part of the outer periphery of the substrate processing container 12 is provided outside the reaction tube 16, and a fan container 38 is provided at the upper part of the outer peripheral container 36 in the gravity direction.

  The reaction tube 16 has an open portion 18 that is opened downward in the direction of gravity, and a flange 16 a is formed around the open portion 18. As a material of the reaction tube 16, quartz that is a non-metallic material and a material that reduces metal contamination is used. Aluminum oxide may be used as a material for the reaction tube 16 instead of quartz.

The lower substrate processing container 20 is a member connected to the reaction tube 16 in a state in which the open portion 18 of the reaction tube 16 is closed, and the substrate described above is connected by connecting the lower substrate processing container 20 and the reaction tube 16. A processing chamber 14 is formed. The lower substrate processing container 20 includes a chamber 22 made of aluminum, and a connecting member 24 made of Teflon (registered trademark) provided at a position above the chamber 22 in the gravity direction and connected to the reaction tube 16. . The connection member 24 is fixed to the chamber 22 by a method such as screwing, for example, and a seal member (not shown) such as an O-ring is provided between the connection member 24 and the chamber 22. Further, an openable / closable gate valve 34 used as a gate valve is provided on the side wall of the chamber 22. The gate valve 34 is used to load the wafer 200 into the substrate processing chamber 14 by a transfer means that is opened and not shown, and is used to discharge the wafer 200 from the substrate processing chamber 14. Further, the gate valve 34 closes the substrate processing chamber 14 in a substantially airtight state.

  The O-ring 32 seals the connection portion between the reaction tube 16 and the lower substrate processing container 20, and prevents the gas from leaking from the substrate processing chamber 14, thereby making the substrate processing chamber 14 substantially airtight. The O-ring 32 is made of perfluorinated fluororubber and has a heat resistant temperature of about 280 ° C. However, when the temperature reaches 200 ° C. or higher, thermal expansion or crushing may occur, and gas leakage from the substrate processing chamber 14 may occur.

The interference member 30 is made of Teflon (registered trademark), and the heat resistant temperature is 280 ° C. However, if the temperature is 200 ° C. or higher, there is a risk of thermal expansion or crushing. Like the O-ring 32, the interference member 30 is located between the reaction tube 16 and the lower substrate processing container 20, and prevents the reaction tube 16 and the connecting member 24 from coming into direct contact with each other. A constant interval is formed between 16 and the connecting member 24. By forming a constant interval in this way, it is possible to prevent the entire load of the reaction tube 16 from being applied to the O-ring 32 and to apply an appropriate load to the O-ring 32. This prevents the O-ring 32 from being damaged by applying an excessive load.

The outer peripheral container 36 is a quadrangular prism-shaped member having a downward open portion. A flange 36a is formed inwardly at a portion forming the open portion, and the flange 36a is fixed to the connecting member 24 described above. . The outer peripheral container 36 is disposed so as to cover the reaction tube 16, forms a space 44 between the reaction tube 16 and the outer peripheral container 36, and uses an electric field or magnetic field used for substrate processing in the substrate processing container 12. It also has a function as a shielding means for shielding.

  As shown in FIG. 2, two supply fans 122 are provided on each of the four side surfaces of the outer peripheral container 36. In addition, one discharge fan 124 is provided on the upper surface of the outer peripheral container 36. Details of the supply fan 122 and the exhaust fan 124 will be described later.

  The fan container 38 is a container disposed on the upper side of the outer peripheral container 36 so as to cover the discharge fan 124. The fan container main body 40 attached to the outer peripheral container 36 and formed with an upward open portion, and the fan container main body 40. The lid portion 42 is detachably attached to the open portion. A duct 48 is attached to the side surface of the fan container body 40.

  The reactive gas supply / discharge system includes a reactive gas supply system that supplies a reactive gas to the substrate processing chamber 14 and a reactive gas discharge system that discharges the reactive gas from the substrate processing chamber 14.

  In the reaction gas supply system, a reaction gas supply pipe 64 connected to a reaction gas supply port 62 formed in the upper part of the reaction tube 16 and a gas supplied from the reaction gas supply pipe 64 are placed in the substrate processing chamber 14. And a shower head 70 spraying on the wafer 200. A gas cylinder used as a reaction gas supply means (not shown) is connected to the reaction gas supply pipe 64 via a supply side valve 66 used as an opening / closing means and a mass flow controller 68 used as a flow rate control means. The shower head 70 is formed with a large number of supply gas passage holes (illustrated) from the upper surface to the lower surface. By passing through these supply gas passage holes, the reaction gas supply pipe 64 is connected to the shower head 70. The reaction gas supplied through the wafer is supplied in a state of being dispersed on the wafer 200.

  The reaction gas discharge system has a reaction gas discharge pipe 74 connected to a reaction gas discharge port 72 provided on the side surface of the reaction tube 16 and below the susceptor 92 described below in the gravity direction. A vacuum pump 80 is connected to the pipe 74 via an APC 76 used as a pressure adjusting means for adjusting the pressure in the reaction chamber and a discharge side valve 78.

The plasma generation system generates high-density plasma in the substrate processing chamber 14 by an electric field and a magnetic field, and is an electrode 82 used as a reactive gas excitation unit that excites a reactive gas supplied to the substrate processing chamber 14 by discharge. And a magnet 84 used as a magnetic field generating means for generating a magnetic field in the substrate processing chamber 14. The electrode 82 has a cylindrical shape and is attached to the outer peripheral surface of the substrate processing container 12. The electrode 82 is connected to a high-frequency power source 88 that supplies high-frequency power via a matching unit 86 that performs impedance matching.

  The magnet 84 is made of a cylindrical permanent magnet, and is attached to each of the upper end portion and the lower end portion of the outer surface of the electrode 82. As the material of the magnet 84, neodymium-based rare earth cobalt is used. Magnets have a temperature at which the magnetic force drops abruptly when the temperature exceeds a certain temperature called the Curie temperature. For this reason, the magnet must be used in a temperature body that does not cause demagnetization at a temperature lower than the Curie temperature. In the magnet 84, if the surface temperature is less than 100 degreeC, the fall of magnetic force can be prevented. The two magnets 84 have magnetic poles at both ends (inner peripheral end and outer peripheral end) along the radial direction of the substrate processing chamber 14, and the magnetic poles of the two magnets 84 are formed in opposite directions. For this reason, the magnetic poles of the inner peripheral portions of the two magnets are different from each other, magnetic field lines are formed along the inner peripheral surface of the magnet 84, and a magnetic field is generated in the substrate processing chamber 14.

  According to this plasma generation system, when a high frequency voltage is applied to the electrode 82 from the high frequency power supply 88, a magnetron discharge is generated under the influence of a magnetic field formed by two magnets 84 arranged above and below. Plasma is generated in the substrate processing chamber 14.

  As shown in FIGS. 1 and 3, the substrate heating system includes a susceptor 92 that heats the wafer 200 disposed in the substrate processing chamber 14, a heater 94 that supplies heat to the susceptor 92, and a susceptor 92. The heater shaft 98 that supports the heater 94 so as to contact the susceptor 92 and the heater base 100 that further supports the heater shaft 98 from below is supported. Further, the substrate heating system is disposed in the vicinity of a heat shielding material 128, which will be described later, and is a heater TC93 used as a control means for controlling the temperature of the susceptor 92, and an earth wire that draws plasma into the wafer 200 placed on the susceptor 92. The heater TC93 is connected to the heater TC wiring 95, and the FR terminal 96 is connected to the FR terminal wiring 97 for grounding the FR terminal. Of these members, the susceptor 92 and the heater 94 are used as heating means for heating the wafer 200 disposed in the substrate processing chamber 14. The heater shaft 98 and the heater base 100 are used as support means for supporting the heating means.

  The heater 94 is composed of a SiC heater, and is supplied with electric power from the wiring 91 and has a heat generation amount capable of raising the inner surface temperature of the wafer 200 to 600 to 700 ° C.

  The susceptor 92 is made of quartz, which is a non-metallic material. As a material for forming the susceptor 92, aluminum nitride or ceramics may be used instead of quartz.

  The heater shaft 98 is a hollow tubular member made of quartz, and has a flange 98a at the upper end and a flange 98b at the lower end. The flange 98a is fixed to the downward surface of the susceptor 92. Two heaters 94 described above are arranged in the hollow portion of the heater shaft 98.

  The heater base 100 is a hollow tubular member made of aluminum and has a larger diameter than the heater shaft 98. Instead of using aluminum as the material of the heater base 100, stainless steel such as SUS may be used. A heater shaft 98 is mounted on the heater base 100 on an upward surface, and the shaft fixing member 102 is screwed to the heater base 100 with screws 104 in a state where the flange 98b of the heater shaft 98 is covered from above. A heater shaft 98 is fixed to 100. A heat shielding material 128 is provided at a position between the heater base 100 and the heater 94. Further, in the vicinity of the heat blocking material 128 of the heater base 100, a cooling water passage C <b> 1 through which cooling water flows is formed in the circumferential direction of the heater base 100. Details of the heat blocking material 128 and the cooling water channel C1 will be described later.

  The susceptor 92, the heater 94, the heater shaft 98, and the heater base 100 are connected to an elevator 106 provided below the heater base 100, and ascend and descend as a unit by the elevator 106.

  The cooling system includes a supply fan 122 that is used as a cooling gas supply unit that supplies air that is a cooling medium and a cooling gas to the space 44, and a discharge fan that is used as a cooling gas discharge unit and discharges air from the space 44. 124. Further, the supply fan 122 and the discharge fan 124 are used as cooling means for cooling at least the substrate processing container 12 with an air flow generated in the space 44 formed between the outer peripheral container 36 and the substrate processing container 12. Further, the cooling system is used as a cooling medium flow path formed in the substrate processing container 12, and the cooling water flow paths C 1, C 2, C 3, C 4, and C 5 formed in the chamber 22 that forms a part of the substrate processing container 12. , C6, C7, a cooling water flow path C8 formed in the connecting member 24, and a cooling medium supply means for supplying cooling water to the cooling water flow paths C1, C2, C3, C4, C5, C6, C7, C8. And a pump P.

  The supply fan 122 is used as a cooling means for supplying air to the space 44 and is disposed in the vicinity of the above-described magnet 84 and used as a magnet cooling means for cooling the magnet 84 with air. The supply fan 122 is used as an electrode cooling means for cooling the electrode 82 with air. The supply fan 122 is used as an airtight seal member for cooling the above-described O-ring 32 used as an airtight seal member. A plurality of supply fans 122 are arranged around the substrate processing container 12, and as described above, a total of eight supply fans 122 are provided on each of the four side surfaces of the outer peripheral container 36. These supply fans 122 are rotationally driven so as to be installed in a direction in which an airflow from the outside of the substrate processing apparatus 10 toward the space 44 is generated.

  The exhaust fan 124 is attached to the surface forming the ceiling of the outer peripheral container 36 in a direction in which an airflow from the space 44 into the fan container 38 is generated by being driven to rotate. The duct 48 is attached to a side surface of the fan container main body 40 that forms a part of the fan container 38, and discharges the gas in the fan container 38 to the outside of the substrate processing apparatus 10.

  Therefore, when the eight supply fans 122 and the discharge fans 124 are driven to rotate, air is supplied from the outside of the substrate processing apparatus 10 to the space 44 by the supply fans 122, and this air is discharged from the space 44 by the discharge fans 124. An air flow is generated when the air is discharged into the outer peripheral container 36 and the air discharged into the outer peripheral container 36 is discharged to the outside of the substrate processing apparatus 10 through the duct 48. The airflow hits the magnets 84 and the electrodes 82 located in the vicinity of the eight supply fans 122, and cools the magnets 84 and the electrodes 82. At this time, the supply fans 122 are evenly provided, that is, two of the same number are provided on each of the four side surfaces of the outer peripheral container 36, so that the air hits the magnet 84 and the electrode 82 equally, The electrode 82 is cooled evenly. In addition, since an air flow from the supply fan 122 toward the exhaust fan 124 is generated in the space 44, the reaction tube 16 is cooled by the air flow. Instead of exhausting air from the outer peripheral container 36 using the duct 48 or in combination with exhausting air from the duct 48, the lid 42 is opened from the fan container main body 40, and this open portion Air may be discharged from the air. By opening the lid portion 42, heat can be hardly accumulated in the fan container 38.

  As shown in FIGS. 4 and 5, the cooling water flow path C1 is a flow path from the cooling water inlet I1 to the cooling water inlet O2, passes through the chamber 22 from the cooling water inlet I1, and is formed in the heater base 100 described above. It communicates with the flow path formed, communicates with the flow path formed in the chamber 22 again, and reaches the cooling water outlet O1. As shown in FIG. 3, the cooling water passage C <b> 1 is located in the vicinity of the above-described heat shielding material 128 in the heater base 100. As shown in FIG. 1, the cooling water channel C <b> 8 is formed in the connection member 24 so as to be disposed in the vicinity of the O-ring 32.

  The cooling water flow paths C2, C3, C4, C5, C6, and C7 pass through the chamber 22 from the cooling water inlets I2, I3, I4, I5, I6, and I7, respectively, and the cooling water outlets O2, O3, O4, respectively. This is a flow path leading to O5, O7, and O7. Then, the pipe D1 is connected to the cooling water inlet I1, the cooling water outlet O1 and the cooling water inlet I2 are connected by the pipe D2, the cooling water outlet O2 and the cooling water inlet I3 are connected by the pipe D3, and the cooling water outlet O3 and the cooling water inlet I4 are connected by a pipe D4, the cooling water outlet O4 and the cooling water inlet I5 are connected by a pipe D5, and the cooling water outlet O5 and the cooling water inlet I6 are connected by a pipe D6. The outlet O6 and the cooling water inlet I7 are connected by a pipe D7, and the pipe D8 is connected to the cooling water outlet O7. And the edge part on the opposite side to the side connected to the cooling water outlet O7 of the piping D8 is connected to the inlet_port | entrance (not shown) of the cooling water flow path C8 shown by FIG. By connecting the pipes D1, D2, D3, D4, D5, D6, D7, and D8 in this way, the cooling water flow paths C1, C2, C3, C4, C5, C6, C7, and the pipe D8 are connected from the pipe D1. Through this, a series of flow paths to the cooling water flow path C8 is further formed.

  The pump P is connected to the end of the pipe D1 opposite to the end connected to the cooling water inlet I1, and feeds the cooling water into the cooling water passage C1. The cooling water fed by the pump P reaches the flow path C8 through the cooling water flow paths C1, C2, C3, C4, C5, C6, C7 and the pipe D8 provided in the chamber 22, and is shown in FIG. It is discharged out of the substrate processing apparatus 10 from a discharge port (not shown) of the cooling water channel C8. Instead of discharging the cooling water from the outlet of the cooling water flow path C8 to the outside of the substrate processing apparatus 10, the cooling water circulates in the series of cooling water flow paths by connecting the outlet of the cooling water flow path C8 and the pump P. You may make it do. Thus, by supplying cooling water to the cooling water flow path, the temperature of the substrate processing apparatus 10 can be reduced by 20 to 60 percent.

  The heat transfer suppression system is used as a heat transfer suppression unit disposed between at least one of the susceptor 92 or the heater 94 used as the heating unit and at least one of the heater shaft 98 or the heater base 100 used as the support unit. The above-described cooling water channel C1 used as a heat shielding material cooling means for cooling the heat shielding material 128, and the above-described pump used as a cooling medium supply means for supplying cooling water to the cooling water channel C1 P.

  The heat blocking material 128 is made of Teflon (registered trademark) resin, which is a material having a relatively lower thermal conductivity than aluminum, which is the material of the heater base 100, and has a substantially cylindrical shape. Instead of using Teflon (registered trademark) resin as the material of the heat shielding material 128, ceramics may be used. As shown in FIG. 3, the heater 94 described above is inserted into the hollow portion of the heat shield material 128, and the heat shield material 128 is fitted into the hollow portion of the heater base 100 with the heater 94 inserted. As a result, the heater 94 is not in direct contact with the heater base 100 made of aluminum, but between the heater 94 and the heater base 100, a heat blocking member made of ceramics that is a material having a lower thermal conductivity than aluminum. The heat transfer from the heater 94 to the heater base 100 is suppressed.

The cooling water channel C1 and the pump P are used not only as cooling means for cooling the substrate processing container 12 as described above, but also as heat shielding material cooling means for cooling the heat shielding material 128. That is, when the cooling water supplied from the pump P is supplied to the cooling water channel C1, the heat blocking material 128 is cooled together with the heater base 100 by this cooling water. And the thermal expansion of the heat blocking material 128 is suppressed by cooling the heat blocking material 128. For this reason, even if a material having a higher thermal expansion coefficient than that of the heater base 100 into which the heat shielding material 128 is inserted is used as the material of the heat shielding material 128, the risk of the apparatus being destroyed by the expansion of the heat shielding material 128 is low. Become. The thermal expansion coefficient of Teflon (registered trademark) resin, which is the material of the heat shielding material 128, is 10 × 10 ⁻⁵ / ° C., whereas the thermal expansion coefficient of aluminum, which is the heater base material, is 2.5 × 10. ^Although it is ⁻⁵ / ° C., the heat blocking material 128 is cooled by the cooling water, and the thermal expansion of the heat blocking material 128 is suppressed. Therefore, the risk of the heat blocking material 128 being destroyed is low. Also, when SUS316, which is stainless steel, is used as the material of the heater base 100, its thermal expansion coefficient is 1.6 × 10 ⁻⁵ / ° C., which is higher than that of Teflon (registered trademark) resin used as the heat shielding material 128. Although the coefficient of thermal expansion is low, since the heat shielding material 128 is cooled, the risk of the heat shielding material 128 being destroyed is low. Further, if ceramic is used as the heat shielding material 128, the thermal expansion coefficient is 0.8 × 10 ⁻⁵ / ° C., which is lower than the thermal expansion coefficients of aluminum, which is the material of the heater base 100, and SUS316. For this reason, the danger that an apparatus will be destroyed by thermal expansion can be made smaller.

  The control system includes a controller 150 used as a control unit. The controller 150 passes through the signal line A, the APC 76, the discharge side valve 78, and the vacuum pump 80, the signal line B through the elevator 106, and the signal line C through the gate valve. 34, a matcher 86 and a high frequency power supply 88 through a signal line D, a mass flow controller 68 and a supply side valve 66 through a signal line E, a heater 94 through a signal line F, and a signal as shown in FIG. Each of the pumps P is controlled via a line G.

  Next, as a semiconductor device manufacturing process using the substrate processing apparatus 10, a predetermined plasma process is performed on the surface of the wafer 200 or the surface of the base film formed on the wafer 200. explain. In the following description, the operation of each unit constituting the substrate processing apparatus is controlled by the controller 150.

  First, in step 1, the output of the heater 94 indicated by the line b in FIG. 6 is increased. At this time, the controller 150 increases the fan speed of the supply fan 122 indicated by the line a so that the output of the heater 94 increases. Further, the controller 150 starts driving the pump P, and a continuous cooling water flow from the pipe D1 to the cooling water flow path C8 through the cooling water flow paths C1, C2, C3, C4, C5, C6, C7, and the pipe D8. Start supplying cooling water to the road.

  In the next step 2, the heater output is made constant after confirming that the temperature of the susceptor 92 has risen to a constant temperature. At this time, the controller 150 keeps the fan speed of the supply fan 122 constant so as to follow that the output of the heater 94 becomes constant.

In the next step 3, a transfer mechanism (not shown) carries the wafer 200 into the substrate processing chamber 14 through the gate valve 34. The loaded wafer 200 is placed on the susceptor 92, and the wafer 200 comes into contact with the susceptor 92. Then, the susceptor 92 is raised by the elevator 106, and the wafer 200 is raised to a position where processing is performed. At this time, the controller 150 controls the vacuum pump 80 and the APC 76 to maintain the pressure in the substrate processing chamber 14 at a predetermined pressure within the range of 0.1 to 100 Pa. Then, oxygen (O ₂ ) and nitrogen (N ₂ ) as reaction gases are supplied from the reaction gas supply port 62 through the opening of the shower head 70 to the upper surface of the wafer 200 disposed in the substrate processing chamber 14. . The gas flow rate at this time is a predetermined flow rate in the range of 10 to 500 sccm, and the processing time is 2 to 5 minutes. At the time when the thin film is formed, the wafer 200 is heated to 700 ° C. or higher.

  In step 3, simultaneously with supplying the processing gas, the controller 150 applies a high-frequency voltage to the electrode 82 using the matching unit 86 and the high-frequency power source 88 to form an electric field, and the substrate under the influence of the magnetic field by the magnet 84. Magnetron discharge is generated in the processing chamber 14. Electrons discharged by this magnetron discharge continue to circulate while continuing a cycloid motion while drifting, thereby extending the lifetime and increasing the ionization generation rate and generating high-density plasma. Then, the reactive gas is excited and decomposed by this high-density plasma to cause a chemical reaction, and a nitride and oxide film are formed on the surface of the wafer 200 placed on the susceptor 92. Then, the wafer 200 on which the film is formed is transferred from the substrate processing chamber 14 by a transfer mechanism (not shown), and the wafer 200 and the susceptor 92 are separated.

  In the next step 4, the wafer 200 is transferred to the outside of the substrate processing chamber 14, and a standby is performed for a certain time in a state where the wafer 200 is not placed on the susceptor 92.

  In the next step 5, the output of the heater 94 is lowered in a state where the wafer 200 is not placed. At this time, the controller 150 reduces the fan speed of the supply fan 122 so as to follow the decrease in the output of the heater 94. Further, at the end of this step 5, the controller 150 stops driving the pump P, and from the pipe D1 to the cooling water flow path C8 via the cooling water flow paths C1, C2, C3, C4, C5, C6, C7, and the pipe D8. The supply of cooling water to the continuous cooling water flow path is stopped.

  In step 2, step 3, and step 4, the output of the heater 94 is constant. However, in the step 3 in which the wafer 200 is placed on the susceptor 92, the heat from the susceptor 92 is absorbed by the wafer, so that the substrate is compared with the steps 2 and 4 in which the wafer is not placed on the susceptor 92. The temperature of the processing container 12 or the like is unlikely to rise. For this reason, the controller 150 lowers the speed of the supply fan 122 in step 3 compared to steps 2 and 4, although the output of the heater 94 is constant. In this embodiment, the controller 150 controls the speed of the supply fan 122. However, the controller 150 may control the fan speed of the exhaust fan 124 in addition to controlling the speed of the supply fan 122.

  As described above, the substrate processing apparatus 10 is used as a control unit that controls the air supply speed of the supply fan 122 according to the output of the heater 94, and whether the wafer 200 is placed on the susceptor 92 or not. Accordingly, the controller 150 is used as control means for controlling the air supply speed of the supply fan 122. For this reason, compared with the case where the air supply speed which the supply fan 122 supplies through each process process is made constant, the burden of the supply fan 122 can be lightened and the lifetime of the supply fan 122 can be extended.

  In the substrate processing apparatus 10 described above, the heat of the susceptor 92 and the heater 94 can satisfactorily prevent the portions other than the susceptor 92 and the heater 94 of the substrate processing apparatus 10 from becoming high temperature. The limit of the heating temperature can be raised and the wafer 200 can be used for a process of heating to a high temperature of 700 ° C. or higher.

  As described above, the present invention can be used in a substrate processing apparatus such as a substrate processing furnace that performs plasma processing on a substrate such as a wafer using a modified magnetron plasma source that can generate high-density plasma by an electric field and a magnetic field. .

DESCRIPTION OF SYMBOLS 10 ... Substrate processing apparatus 12 ... Substrate processing container 14 ... Substrate processing chamber 16 ... Reaction tube 20 ... Lower substrate processing container 22 ... Chamber 24 ... Connection member 30 ... Interference member 32 ... O-ring 36 ... outer peripheral container 44 ... space 82 ... electrode 84 ... magnet 92 ... susceptor 94 ... heater 98 ... heater shaft 100 ... Heater base 122 ... Supply fan 124 ... Exhaust fan 128 ... Heat shield 150 ... Controller C1, C2, C3, C4, C5, C6, C7, C8 ... Cooling water flow path D1, D2 , D3, D4, D5, D6, D7, D8 ... Piping P ... Pump

Claims (3)

A substrate processing container for forming a substrate processing chamber for processing the substrate;
A susceptor for heating a substrate disposed in the substrate processing chamber;
A heater for supplying heat to the susceptor;
A heater shaft that supports the susceptor and in which the heater is disposed;
A heater base for supporting the heater shaft;
A heat shielding material that is provided between the heater and the heater base and is made of a material having a lower thermal conductivity than the heater base;
Cooling means for cooling the heater base and the heat shielding material;
A substrate processing apparatus. A step of cooling the heater base with a heat shielding material provided between the heater and the heater base and having a lower thermal conductivity than the heater base;
  Raising the susceptor supported by the heater base to a certain temperature;
  Carrying a substrate into a processing chamber containing the susceptor;
  Supplying a reaction gas to the processing chamber and processing the substrate;
  After the step of processing the substrate, the step of carrying the substrate out of the processing chamber;
  After the unloading step, in a state where there is no substrate in the processing chamber, the step of reducing the output of the heater,
  Stopping the cooling of the heater base and the heat blocking material;
  A method of manufacturing a semiconductor device having A susceptor for heating the substrate;
  A heater for supplying heat to the susceptor;
  A heater shaft that supports the susceptor and in which the heater is disposed;
  A heater base for supporting the heater shaft;
  A heat shielding material that is provided between the heater and the heater base and is made of a material having a lower thermal conductivity than the heater base;
  A cooling flow path to which cooling means for cooling the heater base and the heat blocking material is supplied;
  A substrate mounting table.

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