JP5142573B2 - Electronics - Google Patents

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JP5142573B2
JP5142573B2 JP2007098398A JP2007098398A JP5142573B2 JP 5142573 B2 JP5142573 B2 JP 5142573B2 JP 2007098398 A JP2007098398 A JP 2007098398A JP 2007098398 A JP2007098398 A JP 2007098398A JP 5142573 B2 JP5142573 B2 JP 5142573B2
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circuit board
opening
sheet metal
metal plate
cpu
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JP2008258371A (en
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隆 山田
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Canon Inc
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Canon Inc
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本発明は電子機器に関するものである。特に、IC、CPU、ASIC等の集積回路素子を実装したプリント基板と、そのプリント基板に面する金属板を有する電子機器に関するものであり、特に金属板に静電気、あるいは高電圧のノイズが印加される状況にある構造に関するものである。   The present invention relates to an electronic device. In particular, the present invention relates to a printed circuit board on which an integrated circuit element such as an IC, CPU, ASIC or the like is mounted and a metal plate facing the printed circuit board. In particular, static electricity or high voltage noise is applied to the metal plate. It is related to the structure in the situation.

従来のプリント基板に面する金属板としては、プリント基板から発する電磁波ノイズおよび外来の電磁波ノイズを遮蔽する目的として、プリント基板を金属板で覆い囲うように配置しているものがある(例えば、特許文献1参照)。また金属板を回路素子の放熱板に利用したり(例えば、特許文献2参照)、プリント基板の固定に使われている(例えば、特許文献3参照)。
特開2001−291986号公報 特開平11−145656号公報 特開2006−133650号公報
As a conventional metal plate facing the printed circuit board, there is one in which the printed circuit board is covered with a metal plate for the purpose of shielding electromagnetic noise generated from the printed circuit board and external electromagnetic noise (for example, patents). Reference 1). In addition, a metal plate is used as a heat radiating plate of a circuit element (for example, see Patent Document 2), and is used for fixing a printed circuit board (for example, see Patent Document 3).
JP 2001-291986 A JP-A-11-145656 JP 2006-133650 A

しかしながら、上記従来例では電磁波シールド(遮蔽)には効果があるものの、以下のような問題があった。   However, although the above-described conventional example is effective for electromagnetic wave shielding (shielding), there are the following problems.

(1)機器外部接続用コネクタのシールド用金属枠(シェル)等をシャーシにアースするため、プリント基板に相対して面する金属板にコネクタの金属枠を電気的に接続する。このときに、静電気ノイズがコネクタの金属シェルに印加した場合、基板に面する金属板の電位が急激に変動し、その影響として金属板と静電結合した集積回路素子内部が誤動作を引き起こすことがある。   (1) In order to ground the shielding metal frame (shell) of the device external connection connector to the chassis, the metal frame of the connector is electrically connected to a metal plate facing the printed circuit board. At this time, if electrostatic noise is applied to the metal shell of the connector, the potential of the metal plate facing the substrate may fluctuate abruptly, and as a result, the integrated circuit element electrostatically coupled to the metal plate may cause malfunction. is there.

(2)機器外部に面した金属板に静電気が印加した場合、(1)と同様に金属板と静電結合した集積回路素子内部が誤動作を引き起こすことがある。   (2) When static electricity is applied to a metal plate facing the outside of the device, the inside of the integrated circuit element that is electrostatically coupled to the metal plate may cause a malfunction as in (1).

本発明は、以上の点に着目して成されたものであり、金属板に印加された静電気などのノイズによる集積回路素子の誤動作の発生を防ぐことができる電子機器を提供することを課題とする。   The present invention has been made paying attention to the above points, and it is an object of the present invention to provide an electronic device capable of preventing the malfunction of an integrated circuit element due to noise such as static electricity applied to a metal plate. To do.

前記課題を解決するために、本発明の電子機器は、以下の構成を備える。   In order to solve the above problems, an electronic apparatus of the present invention has the following configuration.

(1)集積回路素子を搭載した電子回路基板と、前記電子回路基板に搭載され、外部装置と前記集積回路素子を接続するために前記集積回路素子と電気的に接続された接続部と、前記電子回路基板の前記集積回路素子を搭載した面とは反対側の面に相対し、前記電子回路基板及び前記接続部と電気的に接続された金属板と、を備え、前記金属板は、前記電子回路基板上に搭載された前記集積回路素子の搭載位置に対応する位置に前記集積回路素子の外形形状以上の大きさの開口部を有することを特徴とする電子機器。 (1) an electronic circuit board on which an integrated circuit element is mounted; a connection part mounted on the electronic circuit board and electrically connected to the integrated circuit element to connect an external device and the integrated circuit element; A metal plate that is opposite to the surface of the electronic circuit board opposite to the surface on which the integrated circuit element is mounted, and that is electrically connected to the electronic circuit board and the connection portion; electronic apparatus comprising a Turkey which have a said integrated circuit opening of the outer shape or size of the elements in a position corresponding to the mounting position of the integrated circuit element mounted on an electronic circuit board.

本発明によれば、集積回路素子の形状に応じた開口部を設けることにより金属板と集積回路素子が静電結合することがなく、金属板に印加された静電気などのノイズによる集積回路素子の誤動作の発生を防ぐことができる。また、金属板と集積回路素子の内部半導体との静電結合力が弱まることで金属板に印加された静電気などのノイズによる集積回路素子の誤動作の発生を防ぐことができる。   According to the present invention, the opening corresponding to the shape of the integrated circuit element is provided, so that the metal plate and the integrated circuit element are not electrostatically coupled, and the integrated circuit element is not affected by noise such as static electricity applied to the metal plate. The occurrence of malfunction can be prevented. Further, since the electrostatic coupling force between the metal plate and the internal semiconductor of the integrated circuit element is weakened, the malfunction of the integrated circuit element due to noise such as static electricity applied to the metal plate can be prevented.

以下本発明を実施するための最良の形態を、実施例により詳しく説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to examples.

図1ないし図3は本実施例を説明するための図である。図1は本実施例に係るプリント基板取り付け部分の分解斜視図である。図2は本実施例に係るプリント基板の要部説明図である。図3は本実施例に係るプリント基板と基板保持板金との位置関係を説明する斜視図である。図1において、101は電子写真プリンタ(電子機器)、102は駆動ギア、103は外装カバー(外装部材)、104はUSBコネクタ穴、105はプリント基板(電子回路基板)、106はCPU(集積回路素子)である。また、107はUSBコネクタ(接続手段)、108は基板保持板金(金属板)、109は板金開口部(開口部)、110はビスである。図2において、201は基板ビス穴、202はUSBコネクタ107の金属シェルの半田付け部、203はUSBコネクタ107の金属シェルをフレームグランド(FG)である基板保持板金108に接続するためのFGパターン、204は信号パターンである。   1 to 3 are diagrams for explaining the present embodiment. FIG. 1 is an exploded perspective view of a printed board mounting portion according to the present embodiment. FIG. 2 is an explanatory diagram of a main part of the printed circuit board according to the present embodiment. FIG. 3 is a perspective view for explaining the positional relationship between the printed circuit board and the substrate holding sheet metal according to this embodiment. In FIG. 1, 101 is an electrophotographic printer (electronic device), 102 is a drive gear, 103 is an exterior cover (exterior member), 104 is a USB connector hole, 105 is a printed circuit board (electronic circuit board), and 106 is a CPU (integrated circuit). Element). Also, 107 is a USB connector (connection means), 108 is a substrate holding sheet metal (metal plate), 109 is a sheet metal opening (opening), and 110 is a screw. In FIG. 2, 201 is a board screw hole, 202 is a soldering portion of the metal shell of the USB connector 107, 203 is an FG pattern for connecting the metal shell of the USB connector 107 to the board holding metal plate 108 which is a frame ground (FG). 204 are signal patterns.

ここで101は電子写真プリンタであり、不図示の電子写真エンジン部を持ち、機構の一部が駆動ギア102である。駆動ギア102およびプリント基板105は基板保持板金108を介しビス110により固定される。これら部材を固定し外装カバー103にて覆うことで製品となる。プリント基板105にはUSBコネクタ107とCPU106が搭載されており、パーソナルコンピュータ(以下、パソコン)との通信のインタフェースを構成している。プリント基板105は不図示の配線により不図示のエンジン制御回路に接続される。USBコネクタ107はシールドカバーである金属シェル(遮蔽のための金属枠)で覆われており、この金属シェルは金属シェル半田付け部202にてプリント基板105のFGパターン203に半田付けされている。このFGパターン203は基板ビス穴201まで延びており、ビス110を用いることで基板保持板金108と電気的接続がなされている。基板保持板金108は板金でできた電子写真プリンタ101にビス110にて固定されることで、電子写真プリンタ101と電気的接続がなされる。よってUSBコネクタ107の金属シェルは電子写真プリンタ101のFGに電気的に接続されている。USBコネクタ107の信号線は信号線パターン204によりCPU106に接続されている。図2ではこれら以外の配線および部品は省略している。   An electrophotographic printer 101 has an electrophotographic engine unit (not shown), and a part of the mechanism is a drive gear 102. The drive gear 102 and the printed circuit board 105 are fixed by screws 110 through a substrate holding sheet metal 108. These members are fixed and covered with an exterior cover 103 to obtain a product. The printed circuit board 105 is equipped with a USB connector 107 and a CPU 106, and constitutes an interface for communication with a personal computer (hereinafter referred to as a personal computer). The printed circuit board 105 is connected to an engine control circuit (not shown) by wiring (not shown). The USB connector 107 is covered with a metal shell (a metal frame for shielding) that is a shield cover, and this metal shell is soldered to the FG pattern 203 of the printed circuit board 105 by a metal shell soldering portion 202. The FG pattern 203 extends to the board screw hole 201 and is electrically connected to the board holding metal plate 108 by using a screw 110. The substrate holding sheet metal 108 is electrically connected to the electrophotographic printer 101 by being fixed to the electrophotographic printer 101 made of sheet metal with screws 110. Therefore, the metal shell of the USB connector 107 is electrically connected to the FG of the electrophotographic printer 101. A signal line of the USB connector 107 is connected to the CPU 106 by a signal line pattern 204. In FIG. 2, wirings and parts other than these are omitted.

基板保持板金108には板金開口部109がある。これは図3に破線で示すとおり、CPU106の外形と略同寸法、略同形状の大きさ(外形形状)、プリント基板105上面視にて略同一位置である。なお、板金開口部109は、CPU106より大きい略相似の形状であってもよい。つまり、以下に説明するCPU106と基板保持板金との静電結合をなくすには、板金開口部109の形状がCPU106の外形形状以上の大きさであれば良い。   The substrate holding sheet metal 108 has a sheet metal opening 109. As indicated by a broken line in FIG. 3, this is substantially the same size as the outer shape of the CPU 106, the size of the same shape (outer shape), and substantially the same position in the top view of the printed board 105. The sheet metal opening 109 may have a substantially similar shape larger than the CPU 106. That is, in order to eliminate the electrostatic coupling between the CPU 106 and the substrate holding sheet metal described below, the shape of the sheet metal opening 109 may be larger than the outer shape of the CPU 106.

基板保持板金108はプリント基板105を保持すると共に、駆動ギア102を避けて電子写真プリンタ101に固定する機能を持っており、同時に前述のUSBコネクタ107の金属シェルのFG配線の機能も有している。ここで、USBコネクタ107に利用者の人体に帯電した静電気が印加された場合、FGパターン203、基板保持板金108を通って電子写真プリンタ101へ放電経路が形成される。このとき、基板保持板金108は静電気のエネルギーにより一気に電流が流れることで全体の電位が急激に変化する。このとき板金開口部109が無い場合、CPU106は基板保持板金108と静電結合しCPU106の誤動作を引き起こすことがある。しかし本発明の板金開口部109によりCPU106と基板保持板金108の静電結合が無くなり、静電気による誤動作は起こらない。   The substrate holding metal plate 108 has a function of holding the printed circuit board 105 and fixing it to the electrophotographic printer 101 while avoiding the drive gear 102, and also has a function of FG wiring of the metal shell of the USB connector 107 described above. Yes. Here, when static electricity charged on the human body of the user is applied to the USB connector 107, a discharge path is formed to the electrophotographic printer 101 through the FG pattern 203 and the substrate holding sheet metal 108. At this time, the entire electric potential of the substrate holding metal plate 108 changes suddenly due to the current flowing at a stroke by the energy of static electricity. At this time, if the sheet metal opening 109 is not present, the CPU 106 may be electrostatically coupled with the substrate holding sheet metal 108 to cause the CPU 106 to malfunction. However, the sheet metal opening 109 of the present invention eliminates the electrostatic coupling between the CPU 106 and the substrate holding sheet metal 108, thereby preventing malfunction due to static electricity.

また、電子写真プリンタ101の外装の一部は板金により形成されている。この状態で電子写真プリンタ101の外装板金に静電気が印加された時、場合によっては基板保持板金108の電位が急激に変化する可能性がある。この場合にも本発明により板金開口部109を設けることでCPU106は静電気の影響を受けることはない。   A part of the exterior of the electrophotographic printer 101 is formed of sheet metal. In this state, when static electricity is applied to the exterior sheet metal of the electrophotographic printer 101, the potential of the substrate holding sheet metal 108 may change abruptly in some cases. Also in this case, the CPU 106 is not affected by static electricity by providing the sheet metal opening 109 according to the present invention.

本実施例ではCPU106のパッケージをQFP(Quad Flat Package)として示した。この他にもSOP(Small Outline Package)、DIP(Dual Inline Package)等いかなるパッケージにも適応できるものである。   In the present embodiment, the package of the CPU 106 is shown as QFP (Quad Flat Package). In addition, it can be applied to any package such as SOP (Small Outline Package), DIP (Dual Inline Package).

図4ないし図6は本実施例を説明するための図であり、実施例1と異なる部分について説明する。図4は本実施例に係るプリント基板と基板保持板金との位置関係を説明する図である。図5は本実施例に係るCPUを説明する図である。図6は本実施例に係る板金開口部の形状を説明する図で、(a)は丸形開口部の場合を示す図、(b)は楕円形開口部の場合を示す図、(c)は多角形開口部の場合を示す図である。また、図6(d)は切り込み開口部の場合を示す図、(e)はスリット開口部の場合を示す図、(f)はメッシュ開口部の場合を示す図である。図4において401は小さい板金開口部である。図5において501はCPU106内部の半導体チップ(内部半導体)、502はCPU106のリードフレームである。CPU106はリードフレーム502から不図示の金あるいはアルミのワイヤにより半導体チップ501に電気的接続がなされている。   FIG. 4 to FIG. 6 are diagrams for explaining the present embodiment, and parts different from the first embodiment will be described. FIG. 4 is a diagram for explaining the positional relationship between the printed circuit board and the substrate holding sheet metal according to this embodiment. FIG. 5 is a diagram illustrating the CPU according to the present embodiment. 6A and 6B are diagrams for explaining the shape of the sheet metal opening according to the present embodiment, in which FIG. 6A is a view showing a case of a round opening, FIG. 6B is a view showing a case of an oval opening, and FIG. These are figures which show the case of a polygonal opening. FIG. 6D is a view showing the case of the slit opening, FIG. 6E is a view showing the case of the slit opening, and FIG. 6F is a view showing the case of the mesh opening. In FIG. 4, 401 is a small sheet metal opening. In FIG. 5, reference numeral 501 denotes a semiconductor chip (internal semiconductor) inside the CPU 106, and 502 denotes a lead frame of the CPU 106. The CPU 106 is electrically connected from the lead frame 502 to the semiconductor chip 501 by a gold or aluminum wire (not shown).

図4に示すように、基板保持板金108の板金開口部401を半導体チップ501の大きさにすることで、静電気による誤動作を起こさせず、かつ板金開口部401を最小にすることができる。   As shown in FIG. 4, by setting the size of the metal plate opening 401 of the substrate holding metal plate 108 to the size of the semiconductor chip 501, it is possible to minimize the metal plate opening 401 without causing malfunction due to static electricity.

また、図6に板金開口部401の部分を模式化して示すように、板金開口部については半導体チップ501(図中、破線で示す)の大きさと同じか大きければ次のようなものでもよい。すなわち、丸形開口部601(図6(a))、楕円形開口部602(図6(b))、多角形開口部603(図6(c))、切り込み開口部604(図6(d))でも良い。また、スリット開口部605(図6(e))、メッシュ開口部606(図6(f))等のように小さな開口部を複数有するものでも良い。   Further, as schematically shown in FIG. 6, the sheet metal opening 401 may be as follows as long as the size of the sheet metal opening is equal to or larger than the size of the semiconductor chip 501 (indicated by a broken line in the drawing). That is, a round opening 601 (FIG. 6A), an elliptic opening 602 (FIG. 6B), a polygon opening 603 (FIG. 6C), and a cut opening 604 (FIG. 6D). )). Further, a plurality of small openings such as a slit opening 605 (FIG. 6E), a mesh opening 606 (FIG. 6F), and the like may be used.

本実施例においても、板金開口部401、601〜606によりCPU106の半導体チップ501と基板保持板金108の静電結合が無くなり、静電気による誤動作の発生を防ぐことができる。   Also in this embodiment, the sheet metal openings 401 and 601 to 606 eliminate the electrostatic coupling between the semiconductor chip 501 of the CPU 106 and the substrate holding sheet metal 108, and can prevent malfunction due to static electricity.

図7ないし図8は本実施例を説明するための図であり実施例1と異なる部分について説明する。図7は本実施例に係るUSBコネクタとCPUが同一面に搭載されたプリント基板の取り付けを説明する垂直断面図である。図8は本実施例に係るプリント基板と基板保持板金との位置関係を説明する垂直断面図である。図7において701はUSBコネクタ107の面にCPU106を搭載するプリント基板である。また図8において801は基板保持板金108とは逆に、外装カバー103側からプリント基板105を保持する基板保持板金である。基板保持板金801では、さらに電子写真プリンタ101に組み付ける足802の部分が広くなりUSBコネクタ107の先端部分が突出するように穴803が開いている。足802は穴803によりUSBコネクタ穴104とUSBコネクタ107の隙間を埋めることでUSBコネクタ107のカバーとしての機能を持たせている。   7 to 8 are diagrams for explaining the present embodiment, and different portions from the first embodiment will be described. FIG. 7 is a vertical sectional view for explaining attachment of a printed circuit board on which the USB connector and the CPU according to the present embodiment are mounted on the same surface. FIG. 8 is a vertical sectional view for explaining the positional relationship between the printed circuit board and the substrate holding metal plate according to this embodiment. In FIG. 7, reference numeral 701 denotes a printed board on which the CPU 106 is mounted on the surface of the USB connector 107. In FIG. 8, reference numeral 801 denotes a substrate holding sheet metal that holds the printed circuit board 105 from the exterior cover 103 side, contrary to the substrate holding sheet metal 108. In the substrate holding metal plate 801, the portion of the foot 802 to be assembled to the electrophotographic printer 101 is further widened, and a hole 803 is opened so that the tip portion of the USB connector 107 protrudes. The foot 802 has a function as a cover of the USB connector 107 by filling the gap between the USB connector hole 104 and the USB connector 107 with the hole 803.

図7のようにCPU106と板金開口部109の位置関係はプリント基板701の裏、および表のいずれでも良い。また図8のようにプリント基板105と基板保持板金801の位置関係は外装カバー103に対して、どちらが対面していても構わない。さらに基板保持板金108は実施例1のように装置内部の板金であっても、本実施例の基板保持板金801のように外装カバー103の一部となっても構わない。   As shown in FIG. 7, the positional relationship between the CPU 106 and the sheet metal opening 109 may be on the back side of the printed circuit board 701 or on the front side. Further, as shown in FIG. 8, the positional relationship between the printed circuit board 105 and the substrate holding metal plate 801 may face either side of the exterior cover 103. Further, the substrate holding sheet metal 108 may be a sheet metal inside the apparatus as in the first embodiment, or may be a part of the exterior cover 103 like the substrate holding sheet metal 801 in the present embodiment.

本実施例においても、板金開口部109によりCPU106と基板保持板金801の静電結合が無くなり、静電気による誤動作の発生を防ぐことができる。   Also in this embodiment, the sheet metal opening 109 eliminates the electrostatic coupling between the CPU 106 and the substrate holding sheet metal 801, thereby preventing the malfunction due to static electricity.

なお、実施例1ないし実施例3においては、半導体集積回路素子をCPU106としたが、これはASIC、LSIなど半導体の種類、分野を問わず本発明を適応することが可能である。   In the first to third embodiments, the semiconductor integrated circuit element is the CPU 106, but the present invention can be applied regardless of the type or field of semiconductor such as ASIC and LSI.

本発明の実施例1に係るプリント基板取り付け部分の分解斜視図である。It is a disassembled perspective view of the printed circuit board attachment part which concerns on Example 1 of this invention. 本発明の実施例1に係るプリント基板の要部説明図である。It is principal part explanatory drawing of the printed circuit board which concerns on Example 1 of this invention. 本発明の実施例1に係るプリント基板と基板保持板金との位置関係を説明する斜視図である。It is a perspective view explaining the positional relationship of the printed circuit board which concerns on Example 1 of this invention, and a board | substrate holding metal plate. 本発明の実施例2に係るプリント基板と基板保持板金との位置関係を説明する図である。It is a figure explaining the positional relationship of the printed circuit board which concerns on Example 2 of this invention, and a board | substrate holding metal plate. 本発明の実施例2に係るCPUを説明する図である。It is a figure explaining CPU which concerns on Example 2 of this invention. 本発明の実施例2に係る板金開口部の形状を説明する図で、(a)は丸形開口部の場合を示す図、(b)は楕円形開口部の場合を示す図、(c)は多角形開口部の場合を示す図、(d)は切り込み開口部の場合を示す図、(e)はスリット開口部の場合を示す図、(f)はメッシュ開口部の場合を示す図である。It is a figure explaining the shape of the sheet-metal opening part concerning Example 2 of this invention, (a) is a figure which shows the case of a round opening, (b) is a figure which shows the case of an elliptical opening, (c) Is a diagram showing a case of a polygonal opening, (d) is a diagram showing a case of a slit opening, (e) is a diagram showing a case of a slit opening, and (f) is a diagram showing a case of a mesh opening. is there. 本発明の実施例3に係るUSBコネクタとCPUが同一面に搭載されたプリント基板の取り付けを説明する垂直断面図である。It is a vertical sectional view explaining attachment of a printed circuit board on which a USB connector and a CPU according to Example 3 of the present invention are mounted on the same surface. 本発明の実施例3に係るプリント基板と基板保持板金との位置関係を説明する垂直断面図である。It is a vertical sectional view explaining the positional relationship between the printed circuit board and the substrate holding metal plate according to the third embodiment of the present invention.

符号の説明Explanation of symbols

101 電子写真プリンタ(電子機器)
105 プリント基板(電子回路基板)
106 CPU(集積回路素子)
107 USBコネクタ(接続手段)
108 基板保持板金(金属板)
109 板金開口部(開口部)
203 FGパターン
401 小さい板金開口部
501 半導体チップ(内部半導体)
101 Electrophotographic printer (electronic equipment)
105 Printed circuit board (electronic circuit board)
106 CPU (Integrated Circuit Element)
107 USB connector (connection means)
108 Substrate holding sheet metal (metal plate)
109 Sheet metal opening (opening)
203 FG pattern 401 Small sheet metal opening 501 Semiconductor chip (internal semiconductor)

Claims (1)

集積回路素子を搭載した電子回路基板と、
前記電子回路基板に搭載され、外部装置と前記集積回路素子を接続するために前記集積回路素子と電気的に接続された接続部と、
前記電子回路基板の前記集積回路素子を搭載した面とは反対側の面に相対し、前記電子回路基板及び前記接続部と電気的に接続された金属板と、を備え、
前記金属板は、前記電子回路基板上に搭載された前記集積回路素子の搭載位置に対応する位置に前記集積回路素子の外形形状以上の大きさの開口部を有することを特徴とする電子機器。
An electronic circuit board having integrated circuit elements mounted thereon;
A connection part mounted on the electronic circuit board and electrically connected to the integrated circuit element to connect the external circuit and the integrated circuit element;
A surface of the electronic circuit board opposite to the surface on which the integrated circuit element is mounted, and a metal plate electrically connected to the electronic circuit board and the connection part,
The metal plate is characterized by a Turkey which have a said electronic circuit and the integrated circuit opening of the outer shape or size of the elements in a position corresponding to the mounting position of the IC element mounted on a substrate Electronics.
JP2007098398A 2007-04-04 2007-04-04 Electronics Expired - Fee Related JP5142573B2 (en)

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JP6779630B2 (en) * 2016-02-08 2020-11-04 キヤノン株式会社 Electronics
US10433417B2 (en) 2016-02-08 2019-10-01 Canon Kabushiki Kaisha Electronic apparatus

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JPH03281296A (en) * 1990-03-29 1991-12-11 Toppan Printing Co Ltd Ic card
JPH06177573A (en) * 1992-12-07 1994-06-24 Toshiba Corp Ic card
JPH08202843A (en) * 1995-01-23 1996-08-09 Fujitsu Ltd Fixing structure for grounding spring
JP4608777B2 (en) * 2000-12-22 2011-01-12 株式会社村田製作所 Electronic component module
US6496386B2 (en) * 2000-12-22 2002-12-17 Hewlett-Packard Company Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external environment

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