JP2019117839A - Electrical device and electronic device - Google Patents

Abstract

To provide a high-quality electric device with a relatively simple configuration while considering the assemblability of a flexible substrate.SOLUTION: An electrical device in which a flexible substrate is electrically connected to a substrate, and the flexible substrate includes a resin layer provided with an opening and an electrode portion extended across the opening, and the electrode portion has a first surface and a second surface opposite to the first surface, and the first surface faces an electrode pad of the substrate, and the second surface is covered with a conductive member, and both the first surface and the second surface are electrically connected to the electrode pad.SELECTED DRAWING: Figure 1

Description

  The present invention mainly relates to an electrical device and an electronic device.

  Patent Document 1 describes the structure of an image sensor module in which a light source device is mounted on a sensor substrate on which a light receiving sensor is disposed. As an example (FIGS. 10 to 11 of Patent Document 1, etc.), the light source unit includes a light source unit including an LED chip fixed on a flexible substrate together with a reinforcing plate, and one end of the flexible substrate is assembled to a sensor substrate The above implementation is performed.

JP, 2009-94935, A

  By the way, in many electric devices including the above-mentioned image sensor module, it is conceivable that the number of terminals of the flexible substrate is increased or the electrodes thereof are miniaturized along with multifunctionalization, increase of signal amount and data amount and the like. Therefore, while a technology capable of manufacturing such an electric device with high quality is generally required, at the time of manufacturing, for example, improvement of the assemblability of a flexible substrate is also required to reduce manufacturing cost.

  An object of the present invention is to realize high quality electrical devices with a relatively simple configuration while considering the assemblability of a flexible substrate.

  One aspect of the present invention relates to an electric device, wherein the electric device is an electric device in which a flexible substrate is electrically connected to a substrate, and the flexible substrate is a resin layer provided with an opening, and the opening And an electrode portion extending across the electrode, the electrode portion having a first surface and a second surface opposite to the first surface, the first surface facing the electrode pad of the substrate The second surface is covered with a conductive member, and both the first surface and the second surface are electrically connected to the electrode pad.

  According to the present invention, it is possible to improve the quality of the electrical device with a relatively simple configuration.

It is a schematic diagram for demonstrating the example of the system configuration of an electric apparatus. It is a schematic diagram for demonstrating the example of the assembly | attachment aspect of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate. It is a schematic diagram for demonstrating the example of the assembly | attachment aspect of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate. It is a schematic diagram for demonstrating the example of the assembly | attachment aspect of a flexible substrate. It is a schematic diagram for demonstrating the example of the assembly | attachment aspect of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate. It is a schematic diagram for demonstrating the structural example of a flexible substrate.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Each drawing is only a schematic drawing described for the purpose of explaining the structure or configuration, and the dimensions of the illustrated members do not necessarily reflect the actual ones. Further, in the drawings, the same members or the same elements are denoted by the same reference numerals, and the description thereof will be omitted.

  FIG. 1A is a block diagram showing a system configuration of an electric device 1 forming a part / whole of the electronic device according to the embodiment. Examples of the electric device 1 include a lighting device, an image reading device (a scanner such as a contact image sensor) including the lighting device, and the like. Further, as an example of the electronic apparatus to which the electric device 1 can be applied, an image forming apparatus having a scanner function as a main function / auxiliary function such as an automatic document feeder (ADF) or a multi-function printer (MFP) can be mentioned. . FIG. 1B is a schematic view showing the structure of the electric device 1. The electric device 1 includes a substrate 2, an electronic component 3, a flexible substrate 4 and a light guide member 5.

  The substrate 2 includes a plate member 20 as a printed circuit board on which one or more electronic components can be mounted in the present embodiment. The substrate 2 may be referred to as a mounting substrate, and in the present embodiment, any of the upper surface and the lower surface of the plate 20 can be used as a mounting surface of the electronic component. The substrate 2 further includes a sensor unit 21, a voltage generation unit 22, a control unit 23, and an interface unit 24 as electronic components mounted on the plate material 20. In the present embodiment, a line sensor capable of detecting light is used as the sensor unit 21. The voltage generation unit 22 generates a voltage (power) for driving the sensor unit 21. The control unit 23 can control the sensor unit 21 and the voltage generation unit 22. Although details will be described later, the interface unit 24 is configured to enable electrical connection of the substrate 2 to other elements of the electrical device 1.

  The electronic component 3 includes an electric element 31, a control unit 32 and an interface unit 33. In the present embodiment, a light emitting diode (LED) element is used as the electric element 31, and the electronic component 3 functions as a light source unit. The control unit 32 can control the electric element 31. The interface unit 33 receives a voltage from the voltage generation unit 22 of the substrate 2 through the flexible substrate 4 described later, or receives a control signal from the control unit 23.

  The light guide member 5 is extended in a rod shape as shown in FIG. 1B, and guides the light from the electric element 31 which is an LED element in the extending direction. Then, this light is emitted from the light guide member 5 toward an object (a reading object such as a document or a magazine) (not shown), and the reflected light from the object is detected by the sensor unit 21. The detection result by the sensor unit 21 is processed by, for example, the control unit 23, and image data is generated in this manner.

  FIG. 2A is a schematic view showing a structure for connecting the substrate 2 and the flexible substrate 4. FIG. 2B is a schematic cross-sectional view of the line XX. FIG. 2C is a schematic cross-sectional view of the line Y-Y. The interface unit 24 of the substrate 2 includes an electrode pad 241. Although three electrode pads 241 are illustrated here, the number is not limited thereto.

  The flexible substrate 4 includes a resin layer 40, an electrode portion 41, and a wiring pattern 42, and is formed in a long shape. The resin layer 40 is a flexible insulating member which is a base material of the flexible substrate 4 and is made of polyimide resin or the like. The electrode portion 41 is a conductive member (for example, copper) extended from an end portion of the resin layer 40, and three electrode portions 41 are arranged side by side here so as to correspond to the electrode pad 241. The wiring pattern 42 is a conductive member (for example, copper) fixed to the resin layer 40, and is included in the resin layer 40 in the present embodiment. Here, the electrode portion 41 and the wiring pattern 42 are integrally formed in the same layer, and in relation to the resin layer 40, the portion exposed from the resin layer 40 is the electrode portion 41 and the portion enclosed in the resin layer 40 is The wiring pattern 42 may be used.

  As can be seen from FIGS. 2A to 2C, the electrode portion 41 is covered with the conductive member 91 and fixed to the electrode pad 241, whereby the substrate 2 and the flexible substrate 4 are electrically connected to each other. Specifically, as shown in FIGS. 2B and 2C, the electrode portion 41 has a surface S1 (lower surface in the drawing) and a surface S2 (upper surface in the drawing) opposite to the surface S1. In the state where the surface S1 faces the electrode pad 241, the surface S2 is covered by the conductive member 91 together with the electrode pad 241. With such a configuration, the electrode portion 41 is electrically connected to the electrode pad 241 on both of the surfaces S1 and S2. As a result, the electrical contact area between the electrode portion 41 and the electrode pad 241 can be increased, and connection resistance that may occur between them can be suppressed.

  The melting point of the conductive member 91 is lower than the melting point of the electrode portion 41 and the electrode pad 241. For example, a solder ball can be used as the conductive member 91, whereby the above electrical connection can be realized relatively easily. It becomes. The electrode portion 41 and the electrode pad 241 may be in direct contact and electrically connected, but the conductive member 91 may be present and electrically connected therebetween. An alloy layer may be formed on the conductive member 91 at the boundary with the electrode pad 241 and / or the electrode portion 41. Here, the alloy layer is included in the conductive member 91.

  As shown in FIG. 2A, the fixing between the electrode portion 41 and the electrode pad 241 may be reinforced by an adhesive 92 in addition to the conductive member 91. The adhesive 92 may be disposed in at least a part of a region where the resin layer 40 and the plate member 20 overlap in a plan view (in a viewpoint in a direction perpendicular to the main surface).

  The aspect of the electrical connection between the substrate 2 and the flexible substrate 4 described above is merely an example, and various modifications can be made according to the purpose and the like.

  For example, the flexible substrate 4 is not limited to the above-described configuration. As an example, the electrode part 41 may be arrange | positioned or embed | buried on one surface (upper surface in the figure) of the resin layer 40, as FIG. 3 (A) shows. As another example, the electrode part 41 may be arrange | positioned or embed | buried on the other surface (lower surface in the figure in the figure) of the resin layer 40, as FIG. 3 (B) shows. In these cases, the wiring portion 42 can be coated with a solder resist.

  As still another example, as shown in FIG. 3C, in the resin layer 40, the end on the surface S1 side of the electrode portion 41 is positioned inside the end on the surface S2 side of the electrode portion 41. It may be provided. According to this configuration, it is possible to prevent interference between the plate member 20 and the resin layer 40 when the substrate 2 and the flexible substrate 4 are electrically connected.

  As still another example, the flexible substrate 4 may be configured such that the resin layer 40 includes two wiring layers M1 and M2, as shown in FIG. 3 (D). The electrode portion 41 may be disposed to correspond to the wiring layer (here, M1) closer to the electrode pad 241 of the substrate 2, and thereby, as in FIG. Interference with the resin layer 40 can be prevented. The number of wiring layers may be three or more.

  The installation position of the conductive member 91 at the time of electrically connecting the substrate 2 and the flexible substrate 4 is not limited to the above-described embodiment. As an example, as shown in FIG. 4A, the plurality of conductive members 91 may be disposed in a staggered arrangement in plan view. By positioning the conductive members 91 adjacent to each other in a direction crossing the arranging direction of the plurality of electrode portions 41, the distance between the electrode portions 41 can be reduced, which is advantageous for increasing the number of terminals. It becomes. Alternatively, this is also advantageous for narrowing the width of the flexible substrate 4.

  The plurality of conductive members 91 arranged in a staggered manner include one relatively close to the end of the resin layer 40 and one relatively far from the end. In this configuration, as shown in FIG. 4B, the base 41 'of the electrode portion 41 corresponding to the conductive member 91 farther from the end of the resin layer 40 may be provided wider. Thus, the strength of the electrode portion 41 can be improved.

  Although the electrode part 41 is extended and provided from the edge part of the resin layer 40, the aspect is not restricted to the above-mentioned example. As an example, as shown in FIG. 4C, an opening OP1 is provided in the resin layer 40, and the electrode portion 41 is an end (edge, inner wall, opening) of the opening OP1. And so on) may be extended. According to such a configuration, the arrangement position of the electrode portion 41 does not necessarily have to be the end in the longitudinal direction of the resin layer 40, but a position away from the end in the longitudinal direction of the resin layer 40 , And the electrode portion 41 can be arranged. In the example of FIG. 4C, the opening OP1 has a rectangular shape, and the electrode portion 41 is provided corresponding to all the sides of the opening OP1, but may be provided only on a part of the sides Good.

  Moreover, the shape of the electrode part 41 is not restricted to the above-mentioned example. For example, as illustrated in FIG. 5, the electrode portion 41 may be provided with a hole H <b> 1 corresponding to the installation position of the conductive member 91. According to such a configuration, the conductive member 91 electrically connects the electrode portion 41 to the electrode pad 241 while filling the hole H1, thereby further suppressing the connection resistance between the electrode portion 41 and the electrode pad 241 and Can be fixed firmly. The hole H1 may be partially filled with the conductive member 91.

The flexible substrate 4 can be fixed in the electric device 1 in a bent state because of its flexibility, but the same applies to the electrode portion 41. Corresponding to this, it is possible to provide the electrode pad 241 of the substrate 2 also on the side surface of the plate 20. For example, as shown in FIG. 6, the electrode pads 241 and a portion 241 ₁ extending in the plane direction of the plate material 20, a portion 241 ₂ extending from portion 241 ₁ so as to cover the side surface of the plate 20, the Including. Then, the flexible substrate 4, the surface S1 of the electrode portion 41 so as to face the both parts 241 ₁ and 241 _2, are fixed by bending. According to such a configuration, the electrical contact area between the electrode portion 41 and the electrode pad 241 can be increased, and connection resistance that can occur between them can be further suppressed.

As another example, the electrode portion 41, the surface S1 may be fixed so as to face the portion 241 ₂ of the portion 241 ₁ and part 241 _2. As yet another example, the electrode pad 241, a structure without the and portion 241 ₁ includes a portion 241 ₂ to cover the side surfaces of the plate material 20, in this configuration, the electrode portion 41, the surface S1 is opposite to the portion 241 ₂ May be fixed.

  In addition, the flexible substrate 4 can be electrically connected to the substrate 2 in various manners using its flexibility. For example, the width of the flexible substrate 4 (the width in the direction crossing the long direction) is W1, and the width of the substrate 2 in the short side direction is W2. Here, in the case of W1 <W2, as shown in FIG. 1B, the flexible substrate 4 is fixed to the short side portion of the substrate 2 at one end where the electrode portion 41 is disposed, and the substrate 2 is obtained. Can be connected electrically. Then, the flexible substrate 4 can be disposed with the other end portion where the electronic component 3 is disposed close to the short side portion of the substrate 2. That is, both the one end and the other end of the flexible substrate 4 come close to the short side of the substrate 2.

  On the other hand, in the case of W1> W2, the area necessary for the electrical connection between the electrode portion 41 and the electrode pad 241 may not be sufficient. For example, in the case of W1> W2, it may be difficult to electrically connect some of the plurality of electrode portions 41 of the flexible substrate 4 to the electrode pads 241 of the substrate 2. In such a case, as shown in FIG. 7, the flexible substrate 4 is fixed to the long side portion of the substrate 2 at one end where the electrode portion 41 is disposed, and the electronic component 3 is disposed. The other end portion can be disposed in a bent / twisted state, with the short side portion of the substrate 2 being brought close to it. That is, the one end of the flexible substrate 4 is close to the long side of the substrate 2 and the other end is close to the short side of the substrate 2.

  As shown in FIG. 8A, it is possible to provide an opening OP2 in the resin layer 40 and to bridge the electrode portion 41 in the opening OP2. That is, the electrode portion 41 is extended across the opening OP2 so as to extend from one edge of the opening OP2 and to extend to the other edge opposite to the one edge. In other words, the concept of the end of the resin layer 40 includes the edge of the opening OP2 provided in the resin layer 40, and one end of the electrode portion 41 is fixed by the one edge of the opening OP2 and the electrode The other end of 41 is fixed at the other edge of the opening OP2. Thereby, the strength of the electrode portion 41 can be improved, and the flexible substrate 4 can be easily mounted on the substrate 2.

  FIG. 8B is a schematic view showing a structure when the flexible substrate 4 is electrically connected to the substrate 2. FIG. 8C is a schematic cross-sectional view of the line Y-Y. The cross-sectional structure of the line XX is the same as FIG. FIG. 8D is a perspective view showing a connection between the substrate 2 and the flexible substrate 4.

  In this example, the conductive member 91 is installed in the opening OP2, and as described above (see FIG. 2A etc.), the electrode portion 41 is in a state where the surface S1 faces the electrode pad 241, The surface S 2 is covered by the conductive member 91 together with the electrode pad 241. According to such a configuration, the connection resistance between the electrode portion 41 and the electrode pad 241 is suppressed as described above (see FIG. 2A etc.), and the strength of the electrode portion 41 can be improved. It is further advantageous in the implementation.

  As described with reference to FIG. 3A and the like, various changes can be made to the electrode portion 41 provided in the opening OP2 according to the purpose and the like. For example, as illustrated in FIG. 3A to FIG. 3B, the electrode portion 41 is disposed or embedded in one surface of the resin layer 40 as illustrated in FIG. As shown in B), it may be disposed or embedded on the other surface of the resin layer 40. Also, for example, as shown in FIG. 3D, the flexible substrate 4 may be configured such that the resin layer 40 includes two wiring layers M1 and M2 as shown in FIG. 9C.

  As shown in FIG. 10A, the electrode portions 41 installed in the opening OP2 can also be arranged in a zigzag as in FIG. 4A. Thereby, the width W1 'of the resin layer 40 of the flexible substrate 4 can be narrowed, and, for example, W1' <W1 can be achieved.

  Further, as shown in FIG. 10B, the installation direction of each of the plurality of electrode portions 41 is made to cross the lengthwise direction of the flexible substrate 4, and the arrangement direction of the plurality of electrode portions 41 is set as the flexible substrate 4. It may be parallel to the longitudinal direction. Along with this, the plurality of conductive members 91 are installed along the longitudinal direction of the flexible substrate 4. The width W 1 ′ ′ of the resin layer 40 of the flexible substrate 4 can be narrowed also in this manner.

  The various modifications described above (for example, FIG. 5 to FIG. 7 and the like) are also applicable to the electrode portion 41 installed in the opening OP2.

  The flexible substrate 4 can be bent and disposed as described above (refer to FIG. 1 (B), FIG. 7, FIG. 8 (D), etc.). As a bending position of the flexible substrate 4, for example, a position close to a corner of the substrate 2 can be mentioned. Here, in order to improve the assemblability of the flexible substrate 4 at the time of manufacturing the electric device 1, it is conceivable to configure the flexible substrate 4 so that the bending position thereof can be specified. For example, the wiring pattern 42 may be patterned so as to form a portion in which the flexibility locally increases in the longitudinal direction (a portion which can be bent with a smaller force than other portions). . As a result, the user of the flexible substrate 4 such as the manufacturer of the electric device 1 can properly bend the flexible substrate 4 at a specific position, and the manufacturing burden on the user can be reduced.

  As an example, as shown in FIG. 11A, the wiring pattern 42 includes a line pattern 421 and an extension pattern 422. The line pattern 421 extends in the longitudinal direction of the flexible substrate 4. The extending pattern 422 is extended from the line pattern 421 in a direction intersecting the longitudinal direction. Since the flexibility changes at the boundary between the line pattern 421 and the extension pattern 422, it is possible to form a bent portion for facilitating the bending of the flexible substrate 4 locally. The user can properly bend the flexible substrate 4 at the bending portion.

  In the present embodiment, by providing two extension patterns 422 close to one line pattern 421, the flexibility locally increases between the two extension patterns 422, and the fold A curved portion is formed. The term "locally" refers to an aspect in which a portion having a characteristic different from other portions in the periphery is present in a relatively small / narrow region, and in the present embodiment, a portion between them as compared with the two extension patterns 422. The aspect which the bending part becomes easy to bend is shown. In the flexible substrate of the conventional structure, the flexibility is almost uniform (it bends substantially uniformly), and when assembling the flexible substrate, the user is asked at which position the flexible substrate should be bent. There were cases where it was not easy to identify. On the other hand, according to the present embodiment, since the two extension patterns 422 facilitate local bending, bending at that position is induced, and the user is indicated by a two-dot chain line in FIG. The flexible substrate 4 can be appropriately bent at the bending curve K. When the flexible substrate 4 is bent, the curved portion thereby includes the bent portion, and the top portion of the curved portion is formed in the bent portion.

  In many cases, since the user bends and assembles the flexible substrate 4 with a finger, two extension patterns 422 forming the bent portion may be provided in an area that can be appropriately bent with a finger. The length of this region may be set to, for example, 1 cm or more, 1.2 cm or more, or 1.5 cm or more, and may be set to 3 cm or less, 2.5 cm or less, or 2 cm or less. Further, the distance between the two extension patterns 422 may be set in consideration of an assembly error, and may be set to, for example, about 0.5 cm to 2 cm.

  According to such a configuration, when, for example, the two extension patterns 422 are pressed against the corner of the substrate 2 with a finger and the flexible substrate 4 is bent, the position where the curvature of the wiring pattern 42 is largest is It will be formed in the said bending part. In the example of the present embodiment, the bent portion is formed between one end portion of the flexible substrate 4 on which the electrode portion 41 is disposed and the other end portion on which the electronic component 3 is disposed. For example, it may be located in the central portion, for example, in the range of 15 to 85% of the total length of the resin layer 40.

  As another example, as shown in FIG. 11B, the wiring pattern 42 may include a meandering pattern 423 instead of the extending pattern 422. The meandering pattern 423 extends in the longitudinal direction of the flexible substrate 4 while meandering. The direction of the meandering of the meandering pattern 423 may be a direction that intersects with the long direction, and in this example, the meandering pattern 423 is a "-" shaped pattern. Even with such a shape, the flexible substrate 4 can be appropriately bent at the bending line K, and the same effect as the example of FIG. 11A in which the extension pattern 422 is provided can be obtained.

  In addition, the character pattern of “く” referred to here may be rounded or not rounded, and for example, even if it has a shape closer to “C” or “” ”than“ ku ”. It may be any shape that guides bending at a specific position.

  As still another example, as shown in FIG. 11C, the meandering pattern 423 may be formed in a pattern of two or more “<” shapes. In this case, the serpentine pattern 423 may be referred to as a wave pattern, a zigzag pattern or the like. In such a shape, a plurality of bending lines K are formed as the above-mentioned bending portion, so that the user can select one or some of them to bend the flexible substrate 4.

  The line pattern 421 is substantially straight in the present embodiment, but may include, for example, a curve having a curvature smaller than that of the meandering pattern 423.

  The bent portion or bending line K can be formed by an element other than the wiring pattern 42. As one example, as shown in FIG. 12A, a conductive pattern 43 may be further fixed to the resin layer 40. FIG. 12B is a schematic cross-sectional view of the line d1-d1. In this example, the conductive pattern 43 is assumed to be electrically independent of the line pattern 421 of the wiring pattern 42, but may be formed in the same layer as the wiring pattern 42 or in a different layer It is also good. In this example, the conductive pattern 43 is in the shape of a letter “く”, as can be seen from FIG. 12 (A). The conductive pattern 43 may be formed narrower in the vicinity of the fold line K than the other portions.

  The conductive pattern 43 may have any shape as long as it induces bending at a specific position, and as another example, it may be similar to the shape of "C" or "U" like the serpentine pattern 422 described above. Alternatively, they may be separated by a fold line K. In this example, a pair of conductive patterns 43 is provided for one line pattern 421, but may be one.

  Further, although the aspect in which the conductive pattern 43 is formed in the same layer as the wiring pattern 42 is illustrated in the present embodiment, the conductive pattern 43 does not necessarily have to have conductivity, and as another embodiment, the conductive pattern 43 is used. Alternatively, an insulating member may be used.

  In many cases, in order for the user to assemble the flexible substrate 4 by bending it with a finger, the conductive pattern 43 may be provided in an area that can be appropriately bent with a finger, like the extension pattern 422 described above.

  As another example of forming the above-mentioned bent portion or bending line K, the resin layer 40 may be formed so as to form a portion where the flexibility locally increases in the longitudinal direction, ie, The resin layer 40 may be provided with a shape that guides bending at a specific position.

  For example, as shown in FIG. 13A, the resin layer 40 may be provided with a slit-like recessed portion 401. The slit-like recess 401 may be provided to extend in a direction intersecting the longitudinal direction. This configuration also allows the user to bend the flexible substrate 4 along the recess 401. FIG. 13B is a schematic cross-sectional view of the line d2-d2. In this example, the recessed portion 401 is provided on the upper surface of the resin layer 40, but may be provided on the surface on the side that becomes valley-shaped when folded, and is provided on the lower surface of the resin layer 40 as needed. It may be provided on both the upper surface and the lower surface. Also, instead of the recessed portion 401, a through hole may be provided that penetrates from the upper surface to the lower surface of the resin layer 40. A plurality of these recessed portions 401 to the through holes may be formed side by side to form so-called perforations in a plan view.

  Also, for example, as shown in FIG. 14, a notch 402 may be provided at the edge of the resin layer 40. By locally narrowing the resin layer 40 by the notch 402, the rigidity of this portion is locally reduced, whereby the user can bend the flexible substrate 4 at a position corresponding to the notch 402.

  Further, the above-mentioned recessed portion 401 (or through hole) and the notch 402 may be used in combination so as to guide the bending of the flexible substrate 4 more appropriately.

  Although some preferred embodiments have been illustrated above, the present invention is not limited to these examples, and a part of them may be modified without departing from the spirit of the present invention. For example, some of the above examples may be combined with other examples.

  In addition, the individual terms described in the present specification are merely used for the purpose of describing the present invention, and it goes without saying that the present invention is not limited to the exact meaning of the terms, It may also include its equivalents. For example, in FIG. 1 (A) etc., when the electric device 1 forms the whole of the electronic device, the electric device 1 may be called an electronic device. Also, for example, the electrode portion 41 and the electrode pad 241 may be referred to as a terminal portion, a connection portion, or the like. Also, for example, the wiring pattern 42 may be referred to as a metal pattern, a conductive pattern or the like, or may be referred to simply as a wiring or the like.

The features of the invention are summarized below:
The first aspect is an electric device (for example 1) in which a flexible substrate (for example 4) is electrically connected to a substrate (for example 2), and the flexible substrate is a resin provided with an opening (for example OP2) Layer (e.g. 40) and an electrode part (e.g. 41) extended across the opening, wherein the electrode part comprises a first surface (e.g. S1) and a second surface (e.g. S2) opposite thereto And the first surface is opposed to the electrode pad (for example, 241) of the substrate, and the second surface is covered with a conductive member (for example, 91), and the first surface is Both the surface and the second surface are electrically connected to the electrode pad.

  According to the first aspect, by increasing the electrical contact area between the electrode portion and the electrode pad, the connection resistance that may occur between them is suppressed, which is advantageous for improving the quality of the electric device. Further, by making the electrode part in a structure of being bridged in the opening of the resin layer to improve the robustness of the electrode part, it is possible to strengthen the above electrical connection, which is further advantageous for improving the quality of the electric device. Moreover, this can be realized with a relatively simple configuration, which is also advantageous for improving the assemblability of the flexible substrate.

  In the second aspect, the substrate includes a plurality of the electrode pads, the flexible substrate includes a plurality of the electrode portions corresponding to the plurality of electrode pads, and the plurality of electrode portions are juxtaposed in the opening. And the plurality of electrode portions are arranged with a plurality of conductive members (for example, 91) together with the plurality of electrode pads in a state where the first surfaces of the plurality of electrode portions face the plurality of electrode pads. By being covered, they are electrically connected to the plurality of electrode pads, and the plurality of conductive members are arranged in a zigzag in a plan view.

  According to the second aspect, by arranging the plurality of conductive members in a staggered manner, electrical connection between the plurality of electrode units and the plurality of electrode pads can be realized at a relatively high density.

  In the third aspect, the conductive member is made of a material having a melting point lower than that of the electrode portion and the electrode pad.

  According to the third aspect, for example, solder balls can be used as the conductive members, and the flexible substrate can be assembled in a relatively simple manner.

  In the fourth aspect, the electrode portion is provided with a hole (for example, H1) penetrating from the first surface to the second surface, and the conductive member covers the second surface and the hole. It is filled and arranged.

  According to the fourth aspect, the connection resistance between the electrode portion and the electrode pad can be further suppressed with a relatively simple configuration, and the electrode portion and the electrode pad can be firmly fixed. Therefore, it is further advantageous to the quality improvement of an electric device.

In the fifth aspect, the substrate includes a plate (for example, 20) to which the electrode pad is fixed, and the electrode pad includes a first portion (for example, 241 ₁ ) extending in a plane direction of the plate, and the plate A second portion (for example, 241 ₂ ) extended from the first portion so as to cover the side surface of the electrode pad, and the flexible substrate is such that the first surface of the electrode portion is the first portion of the electrode pad And being bent and fixed so as to face both of the second portion and the second portion.

  According to the fifth aspect, by bending and fixing the flexible substrate and increasing the electrical contact area between the electrode portion and the electrode pad, it is possible to further suppress the connection resistance that may occur between them, and the electrical device It is further advantageous to improve the quality of

In the sixth aspect, the substrate includes a plate (for example, 20) to which the electrode pad is fixed, the electrode pad includes a portion (for example, 241 ₂ ) covering the side surface of the plate, and the flexible substrate is The first surface of the electrode portion is fixed so as to face the portion covering the side surface of the plate material of the electrode pad.

  According to the sixth aspect, the electrical connection between the electrode portion and the electrode pad can be appropriately realized also on the side surface of the plate.

  In a seventh aspect, the electronic component (for example, 3) is provided, the electrode unit is disposed at one end of the flexible substrate, the electronic component is disposed at the other end of the flexible substrate, and the substrate is The flexible substrate has a long side and a short side in plan view, and the flexible substrate is arranged such that both the electrode portion and the electronic component are close to the short side portion of the substrate.

  According to the seventh aspect, for example, an electronic component can be appropriately disposed on the short side of a printed circuit board provided with a line sensor, and for example, a scanner or the like can be easily realized.

  In an eighth aspect, the electronic component (for example, 3) is provided, the electrode unit is disposed on one end side of the flexible substrate, and the electronic component is disposed on the other end side of the flexible substrate. In the planar view, the flexible substrate has a long side and a short side, and in the flexible substrate, the electrode portion is close to the long side portion and the electronic component is disposed close to the short side portion.

  According to the eighth aspect, even if the area required for the electrical connection of the flexible substrate is not sufficient in the short side of the printed circuit board, the electronic component can be appropriately disposed on the short side, and the sixth aspect Similarly, for example, a scanner or the like can be easily realized.

  A ninth aspect is an electronic device, wherein the electronic device comprises the above-mentioned electric device (for example, 1).

  According to the ninth aspect, the electric device described above is applicable to various electronic devices such as an ADF (Auto Document Feeder) and an MFP (Multifunction Printer) having a scanner function.

  1: Electric device, 2: Substrate, 241: Electrode pad, 3: Electronic component, 4: Flexible substrate, 40: Resin layer, 41: Electrode part, 42: Wiring pattern.

Claims (9)

An electrical device in which a flexible substrate is electrically connected to a substrate, wherein
The flexible substrate includes a resin layer provided with an opening, and an electrode portion extended across the opening,
The electrode portion has a first surface and a second surface opposite to the first surface,
The first surface faces the electrode pad of the substrate,
The second surface is covered with a conductive member,
An electric device, wherein both the first surface and the second surface are electrically connected to the electrode pad. The substrate includes a plurality of the electrode pads, and the flexible substrate includes a plurality of the electrode portions corresponding to the plurality of electrode pads,
The plurality of electrode portions are juxtaposed to the opening,
The plurality of electrode portions are covered with the plurality of conductive members together with the plurality of electrode pads in a state in which the first surfaces thereof respectively face the plurality of electrode pads. Each is electrically connected to multiple electrode pads,
The electric device according to claim 1, wherein the plurality of conductive members are staggered in a plan view. The electric device according to claim 1, wherein the conductive member is made of a material having a melting point lower than that of the electrode portion and the electrode pad. The electrode portion is provided with a hole penetrating from the first surface to the second surface,
The electric device according to any one of claims 1 to 3, wherein the conductive member covers the second surface and fills the hole. The substrate includes a plate on which the electrode pad is fixed,
The electrode pad is
A first portion extending in a surface direction of the plate material;
A second portion extended from the first portion so as to cover the side surface of the plate material;
Including
The flexible substrate is bent and fixed such that the first surface of the electrode portion faces both the first portion and the second portion of the electrode pad. An electrical device according to any one of the preceding claims. The substrate includes a plate on which the electrode pad is fixed,
The electrode pad includes a portion covering the side surface of the plate material,
The flexible substrate is fixed such that the first surface of the electrode portion faces the portion covering the side surface of the plate material of the electrode pad. An electrical device according to any one of the preceding claims. Equipped with electronic components,
The electrode unit is disposed at one end of the flexible substrate,
The electronic component is disposed at the other end of the flexible substrate,
The substrate has a long side and a short side in plan view,
The electricity according to any one of claims 1 to 6, wherein in the flexible substrate, both the electrode portion and the electronic component are disposed in proximity to a short side portion of the substrate. apparatus. Equipped with electronic components,
The electrode unit is disposed at one end of the flexible substrate,
The electronic component is disposed on the other end side of the flexible substrate,
The substrate has a long side and a short side in plan view,
7. The flexible substrate according to claim 1, wherein the electrode portion is in proximity to a long side portion, and the electronic component is disposed in proximity to a short side portion. Electrical device as described in. An electronic device comprising the electric device according to any one of claims 1 to 8.

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