JPH06177573A - Ic card - Google Patents

Ic card

Info

Publication number
JPH06177573A
JPH06177573A JP4326320A JP32632092A JPH06177573A JP H06177573 A JPH06177573 A JP H06177573A JP 4326320 A JP4326320 A JP 4326320A JP 32632092 A JP32632092 A JP 32632092A JP H06177573 A JPH06177573 A JP H06177573A
Authority
JP
Japan
Prior art keywords
connector
contact
metal panel
electronic circuit
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4326320A
Other languages
Japanese (ja)
Inventor
Takuya Nishimura
拓也 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP4326320A priority Critical patent/JPH06177573A/en
Publication of JPH06177573A publication Critical patent/JPH06177573A/en
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE:To provide an IC card giving high packaging efficiency and avoiding electromagnetic damage by a method wherein contact springs abutting against electromagnetic shielding panels are integrally provided with a contact terminal. CONSTITUTION:Electronic circuit components 2 such as memory IC etc., connectors 3, etc., are fixed on a wiring substrate 1 to form the electronic circuit on a wiring substrate 1 to be held by an upper metallic panel 5 and a lower metallic panel 6 after inserting the electronic circuit into a resin-made frame 4. At this time, the connectors 3 are provided with a contact spring 7 abutting against the upper metallic panel 5 as well as another contact spring 8 also abutting against the lower metallic panel 6. In such a constitution, the electronic shielding panels 5, 6 such as the metallic panels, etc., and the contact springs 7, 8 are connected to a grounding terminal to be integrally provided with the grounding terminal so that the conducting means between the grounding wire and the electromagnetic shielding panels 5, 6 on the wiring substrate 1 may be eliminated to increase the packaging efficiency of the wiring substrate 1 further enabling the damage to electromagnetic circuit components such as memory IC, etc., to be avoided without fail.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は記憶媒体等に用いられる
ICカードに関し、特に電磁遮蔽板と電気的接続用のコ
ネクタを有するICカードに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card used as a storage medium or the like, and more particularly to an IC card having an electromagnetic shield plate and a connector for electrical connection.

【0002】[0002]

【従来の技術】近年パーソナルコンピュータの増設記憶
装置等の用途に、ICカードが広く使用されるようにな
ってきた。記憶媒体用のICカードは、特にメモリカー
ドと呼ばれている。
2. Description of the Related Art In recent years, IC cards have come to be widely used for applications such as expansion storage devices of personal computers. IC cards for storage media are called memory cards.

【0003】図10はメモリカードの一般的構造を、模
式的に示した断面図である。配線基板61上にメモリI
C等の電子回路部品62、コネクタ63等を取り付け電
子回路を形成し、樹脂製の枠体64に嵌め込んだ後、上
部金属パネル65と下部金属パネル66とで挟み込むよ
うになっている。
FIG. 10 is a sectional view schematically showing the general structure of a memory card. Memory I on wiring board 61
An electronic circuit component 62 such as C, a connector 63, and the like are attached to form an electronic circuit, which is fitted into a resin frame 64 and then sandwiched between an upper metal panel 65 and a lower metal panel 66.

【0004】上部金属パネル65と下部金属パネル66
とは、カードに機械的強度を付与すると共に、電子回路
全体を電磁遮蔽する目的で使用されている。このため配
線基板61の接地線(図示せず)と上部金属パネル65
との間に導電性のスプリング67を装着し、さらに上部
金属パネル65と下部金属パネル66との間にも導電性
のスプリング68を装着し、配線基板61の接地線をコ
ネクタ63の接地端子に繋いで電磁遮蔽効果を持たせて
いる。例えば下部金属パネル66に高電圧が印加された
場合は、その電荷はスプリング68、上部金属パネル6
5、スプリング67、配線基板61の接地線、コネクタ
63の接地端子を経由して外部の接地線に流れて、IC
カード内部の電子回路部品62の損傷または記憶データ
の破壊を防いでいる。
Upper metal panel 65 and lower metal panel 66
Is used for the purpose of imparting mechanical strength to the card and electromagnetically shielding the entire electronic circuit. Therefore, the ground wire (not shown) of the wiring board 61 and the upper metal panel 65 are provided.
And a conductive spring 68 between the upper metal panel 65 and the lower metal panel 66, and the ground wire of the wiring board 61 to the ground terminal of the connector 63. It is connected to give an electromagnetic shielding effect. For example, when a high voltage is applied to the lower metal panel 66, the electric charge is generated by the spring 68 and the upper metal panel 6.
5, the spring 67, the ground wire of the wiring board 61, and the ground terminal of the connector 63 to flow to the external ground wire,
This prevents damage to the electronic circuit parts 62 inside the card or destruction of stored data.

【0005】[0005]

【発明が解決しようとする課題】上述したようにメモリ
カードに電磁遮蔽効果を持たせるためには、上部金属パ
ネル65と下部金属パネル66とを、スプリング67、
スプリング68を介して配線基板61の接地線に接続す
る必要があった。このため配線基板61上には、スプリ
ング67の接触電極スペースおよびスプリング67の保
持具69を設置するスペースが必要になる。なお保持具
69は通常枠体64と一体に形成される。またスプリン
グ68およびスプリング68の保持具70を貫通させる
スペースも必要になる。保持具70も通常枠体64と一
体に形成され、本例では枠体64の一部とで保持具を形
成している。これらの設置スペースを確保するため、電
子回路部品62を搭載する配線基板61の有効実装面積
が狭められていた。またスプリング67、68の部品
代、装着工費も必要だった。
As described above, in order to provide the memory card with the electromagnetic shielding effect, the upper metal panel 65 and the lower metal panel 66 are connected to the spring 67,
It was necessary to connect to the ground wire of the wiring board 61 via the spring 68. Therefore, a space for the contact electrode of the spring 67 and a space for installing the holder 69 of the spring 67 are required on the wiring board 61. The holder 69 is usually formed integrally with the frame 64. In addition, a space for passing the spring 68 and the holder 70 for the spring 68 is also required. The holder 70 is also usually formed integrally with the frame body 64, and in this example, a part of the frame body 64 forms the holder. In order to secure these installation spaces, the effective mounting area of the wiring board 61 on which the electronic circuit component 62 is mounted has been narrowed. In addition, parts charges for springs 67 and 68 and installation costs were also required.

【0006】さらに上部金属パネル65または下部金属
パネル66に印加された高電圧は、配線基板61の接地
線を通じて、コネクタ63の接地端子に流れるので、前
記接地線近傍の電子回路部品62に影響を与え、記憶デ
ータを破壊(いわゆるデータ化け)させることがあっ
た。そこで本発明は上記欠点を除去し、実装効率が高く
電磁障害に強いICカードを提供することを目的とす
る。
Further, since the high voltage applied to the upper metal panel 65 or the lower metal panel 66 flows to the ground terminal of the connector 63 through the ground wire of the wiring board 61, it affects the electronic circuit parts 62 near the ground wire. There was a case where the stored data was destroyed (so-called garbled data). Therefore, an object of the present invention is to eliminate the above-mentioned drawbacks and provide an IC card having high mounting efficiency and strong against electromagnetic interference.

【0007】[0007]

【課題を解決するための手段】本発明では金属パネル等
の電磁遮蔽板と、外部との電気的接続用のコネクタを有
するICカードにおいて、前記コネクタの接地端子に連
結して、前記電磁遮蔽板と当接する接触ばねを、前記接
地端子に一体として設けたことを特徴とする。
According to the present invention, in an IC card having an electromagnetic shielding plate such as a metal panel and a connector for electrical connection with the outside, the electromagnetic shielding plate is connected to a ground terminal of the connector. A contact spring that comes into contact with is provided integrally with the ground terminal.

【0008】[0008]

【作用】金属パネル等の電磁遮蔽板との接触ばねを、コ
ネクタの接地端子に連結しこの接地端子に一体として設
けたので、配線基板上の接地線を使用せずに電磁遮蔽す
ることができる。このため配線基板上の接地線と電磁遮
蔽板との導通手段が不要となり、配線基板の実装効率が
上がると共に、外部ノイズが配線基板上の接地線を流れ
る事によるメモリIC等の電子回路部品の損傷をより確
実に防ぐ事ができる。
Since the contact spring with the electromagnetic shielding plate such as the metal panel is connected to the ground terminal of the connector and provided integrally with this ground terminal, electromagnetic shielding can be achieved without using the ground wire on the wiring board. . For this reason, a means for connecting the ground wire on the wiring board and the electromagnetic shield plate is not required, the mounting efficiency of the wiring board is improved, and external noise flows through the ground wire on the wiring board to prevent the electronic circuit parts such as the memory IC from being used. Damage can be prevented more reliably.

【0009】[0009]

【実施例】以下本発明をメモリカードに適用した場合の
実施例を、図1乃至図9を参照して説明する。図1は第
1の実施例を模式的に示した断面図であり、コネクタの
端子配列が一段式の場合である。配線基板1上に、メモ
リIC等の電子回路部品2、コネクタ3等を取り付け電
子回路を形成し、樹脂製の枠体4に嵌め込んだ後、上部
金属パネル5と下部金属パネル6とで挟み込むようにな
っている。前記コネクタ3は接地端子部での断面図を示
しており、前記上部金属パネル5と当接する接触ばね7
と、前記下部金属パネル6と当接する接触ばね8を有し
ている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a memory card will be described below with reference to FIGS. FIG. 1 is a cross-sectional view schematically showing the first embodiment, in which the connector terminal arrangement is of a single-stage type. An electronic circuit component 2 such as a memory IC, a connector 3 and the like are mounted on the wiring board 1 to form an electronic circuit, which is fitted in a resin frame 4 and then sandwiched between an upper metal panel 5 and a lower metal panel 6. It is like this. The connector 3 shows a cross-sectional view at the ground terminal portion, and a contact spring 7 for contacting the upper metal panel 5 is shown.
And a contact spring 8 that comes into contact with the lower metal panel 6.

【0010】図2は前記コネクタ3のみを拡大した断面
図であり、図3はさらに前記コネクタ3の接地端子部周
辺を拡大した上面図である。図3のA−A線での断面図
が図2になっている。図3の点線は接触端子12のコネ
クタ筐体11に隠れた部分を表したものである。
FIG. 2 is an enlarged sectional view of only the connector 3, and FIG. 3 is an enlarged top view of the periphery of the ground terminal portion of the connector 3. FIG. 2 is a sectional view taken along the line AA of FIG. The dotted line in FIG. 3 represents the portion of the contact terminal 12 hidden in the connector housing 11.

【0011】樹脂等の絶縁材料で形成されたコネクタ筐
体11には、スリ−ブ状の接触端子12が嵌め込まれて
いる。前記接触端子12は燐青銅等の弾性材料で形成さ
れており、前記接触端子12に一体として形成され連結
されたた接触ばね12a,12bが外部より挿入される
コンタクトピン(図示せず)に当接し導通する。前記コ
ネクタ筐体11の接地端子部の上面下面には透孔13、
14が形成されており、前記接触端子12に一体として
形成され連結する他の接触ばね12c,12dが、前記
透孔13、14を貫通して前記コネクタ筐体11の外側
面に飛び出す如く装填されている。この外側面に飛び出
した前記接触ばね12c,12dが、図1における上部
金属パネル5と下部金属パネル6にそれぞれ当接して導
電路を形成する。前記接触端子12に一体として形成さ
れ、コネクタ外部へ導出された接続端子12eは、図1
における配線基板1に半田付け等で接続される。
A sleeve-shaped contact terminal 12 is fitted in a connector housing 11 formed of an insulating material such as resin. The contact terminals 12 are formed of an elastic material such as phosphor bronze, and contact springs 12a and 12b integrally formed and connected to the contact terminals 12 contact a contact pin (not shown) inserted from the outside. Contact and conduct. Through holes 13 are formed in the upper and lower surfaces of the ground terminal portion of the connector housing 11,
14 are formed, and other contact springs 12c and 12d integrally formed with and connected to the contact terminal 12 are loaded so as to penetrate the through holes 13 and 14 and jump out to the outer surface of the connector housing 11. ing. The contact springs 12c and 12d protruding to the outer side surfaces contact the upper metal panel 5 and the lower metal panel 6 in FIG. 1 to form conductive paths. The connection terminal 12e formed integrally with the contact terminal 12 and led out of the connector is shown in FIG.
Is connected to the wiring board 1 by soldering or the like.

【0012】なお前記接触ばね12c,12dは、接地
端子にのみ設けられるものであり、他の接触端子には図
3に示す如く、接触ばね12a,12bのみが形成され
ている。
The contact springs 12c and 12d are provided only on the ground terminal, and the other contact terminals are provided with only the contact springs 12a and 12b as shown in FIG.

【0013】図4は第2の実施例を模式的に示した断面
図であり、コネクタの端子配列が2段式の場合である。
配線基板21上に、メモリIC等の電子回路部品22、
コネクタ23等を取り付け電子回路を形成し、樹脂製の
枠体24に嵌め込んだ後、上部金属パネル25と下部金
属パネル26とで挟み込むようになっている。前記コネ
クタ23は接地端子部での断面図を示しており、前記上
部金属パネル25と当接する接触ばね27を有してい
る。
FIG. 4 is a cross-sectional view schematically showing the second embodiment, in which the connector terminal arrangement is a two-stage type.
On the wiring board 21, an electronic circuit component 22 such as a memory IC,
After the connector 23 and the like are attached to form an electronic circuit, the electronic circuit is fitted into the resin frame 24, and then sandwiched between the upper metal panel 25 and the lower metal panel 26. The connector 23 is shown in a sectional view at the ground terminal portion, and has a contact spring 27 that comes into contact with the upper metal panel 25.

【0014】コネクタの端子配列が2段式の場合には、
接地端子が上段のみ或いは下段のみにある場合と、上段
下段にそれぞれある場合があり、本実施例では上段のみ
に接地端子がある場合である。前記上部金属パネル25
には前記接触ばね27を介して接触し得るが、前記下部
金属パネル26には前記コネクタ23を通じては接触で
きない。本実施例ではスプリング28を用いて、前記上
部金属パネル25と前記下部金属パネル26とを導通さ
せている。
When the terminal arrangement of the connector is a two-stage type,
There are cases where the ground terminals are provided only in the upper stage or only in the lower stage, and there are cases in which they are provided in the upper stage and the lower stage, respectively. The upper metal panel 25
However, the lower metal panel 26 cannot be contacted through the connector 23. In this embodiment, a spring 28 is used to electrically connect the upper metal panel 25 and the lower metal panel 26.

【0015】図5は前記コネクタ23の接地端子部での
断面図であり、樹脂等の絶縁材料で形成されたコネクタ
筐体31には、スリ−ブ状の接触端子32、34が嵌め
込まれている。前記接触端子32は燐青銅等の弾性材料
で形成されており、前記接触端子32に一体として形成
され連結された接触ばね32a,32b、34a,34
bが外部より挿入されるコンタクトピン(図示せず)に
当接し導通する。前記コネクタ筐体31の接地端子部の
上面には透孔33が形成されており、前記接触端子32
に連結する他の接触ばね32cが、前記透孔33を貫通
して前記コネクタ筐体31の外側面に飛び出す如く装填
されている。この外側面に飛び出した前記接触ばね32
cが、図4における上部金属パネル25に当接して導電
路を形成する。前記接触端子32、34に一体として形
成され、コネクタ外部へ導出された接続端子32d,3
4dは、図4における配線基板21に半田付け等で接続
される。
FIG. 5 is a cross-sectional view of the ground terminal portion of the connector 23. The connector housing 31 made of an insulating material such as resin has sleeve-like contact terminals 32 and 34 fitted therein. There is. The contact terminal 32 is formed of an elastic material such as phosphor bronze, and the contact springs 32a, 32b, 34a, 34 are integrally formed and connected to the contact terminal 32.
b is brought into contact with a contact pin (not shown) inserted from the outside so as to be electrically connected. A through hole 33 is formed in the upper surface of the ground terminal portion of the connector housing 31, and the contact terminal 32 is formed.
Another contact spring 32c connected to is inserted into the outer surface of the connector housing 31 so as to penetrate the through hole 33. The contact spring 32 protruding to the outside surface
c contacts the upper metal panel 25 in FIG. 4 to form a conductive path. Connection terminals 32d, 3 formed integrally with the contact terminals 32, 34 and led out of the connector
4d is connected to the wiring board 21 in FIG. 4 by soldering or the like.

【0016】本実施例では、上部金属パネル25と下部
金属パネル26とを導通させるスプリング28を、枠体
24の一部と保持具29とで保持しているが、コネクタ
筐体にスペースがある場合には、図6、図7に示すよう
にコネクタ筐体にスプリング保持用の透孔を設けてもよ
い。
In this embodiment, the spring 28 for conducting the upper metal panel 25 and the lower metal panel 26 is held by a part of the frame 24 and the holder 29, but there is a space in the connector housing. In this case, as shown in FIGS. 6 and 7, a through hole for holding a spring may be provided in the connector housing.

【0017】図6、図7において、41は配線基板、4
2はメモリIC等の電子回路部品、43はコネクタ、4
5は上部金属パネル、46は下部金属パネル、47はス
プリングである。図7は図6のB−B線での断面図であ
り、コンタクトピン挿入口48の数が少ない場合には、
この様にスプリング47を保持する透孔49を設けるこ
とができる。この場合には、配線基板41の実装面積を
最大限に活用できる上、上部金属パネル25と下部金属
パネル26との導通をコネクタ部でとるので、高電圧等
の外部ノイズを、コネクタ43の接地端子に最短距離で
結ぶことができる。 上記実施例は上部金属パネル25
と下部金属パネル26との導通手段にいずれもスプリン
グを用いているが、導通手段はスプリングに限られるも
のではなくねじ止め、はとめ等でもよい。或いは電磁遮
蔽板の上部と下部を一体として形成し折り曲げて使用し
てもよい。またコネクタが2段式で接地端子が上段と下
段の両方にある場合は、図2の如く金属パネルとの接触
ばねをコネクタの上面下面に設け得ることは言うまでも
ない。
In FIGS. 6 and 7, 41 is a wiring board, 4
2 is an electronic circuit component such as a memory IC, 43 is a connector, 4
5 is an upper metal panel, 46 is a lower metal panel, and 47 is a spring. FIG. 7 is a sectional view taken along the line BB of FIG. 6, and when the number of contact pin insertion ports 48 is small,
In this way, the through hole 49 for holding the spring 47 can be provided. In this case, since the mounting area of the wiring board 41 can be utilized to the maximum and the upper metal panel 25 and the lower metal panel 26 are electrically connected by the connector portion, external noise such as high voltage is grounded by the connector 43. Can be connected to the terminal at the shortest distance. In the above embodiment, the upper metal panel 25 is used.
A spring is used as a means for connecting between the lower metal panel 26 and the lower metal panel 26. However, the means for connecting is not limited to the spring, and may be a screw, a snap, or the like. Alternatively, the upper and lower portions of the electromagnetic shield plate may be integrally formed and bent before use. Further, in the case where the connector is a two-stage type and the ground terminals are in both the upper and lower stages, it goes without saying that a contact spring with the metal panel can be provided on the upper and lower surfaces of the connector as shown in FIG.

【0018】図8は第3の実施例で、コネクタ接触ばね
の変形例である。コネクタ部分の断面図のみを示してい
るが、コネクタの端子配列は1段式である。図9は本実
施例の接地端子部周辺のみを拡大した底面図であり、図
9のC−C線での断面図が図8になっている。樹脂等の
絶縁材料で形成されたコネクタ筐体51には、スリーブ
状の接触端子52が嵌め込まれている。前記接触端子5
2は燐青銅等の弾性材料で形成されており、接触ばね5
2a,52bが外部より挿入されるコンタクトピン(図
示せず)と当接し導通する。前記コネクタ筐体51の背
面より、前記接触端子52に連結する他の接触ばね52
c,52dが導出されており、互いに離間する方向に折
り曲げられている。前記接触ばね52c,52dの先端
部は、それぞれ前記コネクタハウジング51の上面、下
面より突出しており、図1と同様な上部金属パネル(図
示せず)と下部金属パネル(図示せず)に当接して導電
路を形成する。この場合前記接触ばね52dが配線基板
の方向に飛び出すので、前記配線基板に切り込み等の逃
げを作っておくとよい。前記接触端子52に一体として
形成され、コネクタ外部へ導出された接続端子52e
は、図1と同様に配線基板1に半田付け等で接続され
る。
FIG. 8 is a third embodiment, which is a modification of the connector contact spring. Only the sectional view of the connector portion is shown, but the terminal arrangement of the connector is a one-stage type. FIG. 9 is a bottom view in which only the periphery of the ground terminal portion of this embodiment is enlarged, and FIG. 8 is a sectional view taken along the line CC of FIG. A sleeve-shaped contact terminal 52 is fitted in a connector housing 51 formed of an insulating material such as resin. The contact terminal 5
2 is made of an elastic material such as phosphor bronze, and has a contact spring 5
2a and 52b come into contact with a contact pin (not shown) inserted from the outside to establish electrical conduction. Another contact spring 52 connected to the contact terminal 52 from the rear surface of the connector housing 51.
c and 52d are drawn out, and are bent in the directions away from each other. The tip ends of the contact springs 52c and 52d project from the upper surface and the lower surface of the connector housing 51, respectively, and contact the upper metal panel (not shown) and the lower metal panel (not shown) similar to those in FIG. To form a conductive path. In this case, since the contact spring 52d jumps out toward the wiring board, it is advisable to make a relief such as a cut in the wiring board. A connection terminal 52e formed integrally with the contact terminal 52 and led out of the connector
Are connected to the wiring board 1 by soldering or the like as in FIG.

【0019】上記実施例はいずれもメモリカードを例に
とったが、本発明はメモリカードに限られるものではな
く、電磁遮蔽板とコネクタを使用するICカードであれ
ば、いずれにも適用できることは言うまでもない。また
電磁遮蔽板は金属パネルに限られるものではなく、導電
性樹脂板等の導電性物質であればよい。
Although all of the above embodiments have been described with respect to the memory card as an example, the present invention is not limited to the memory card and can be applied to any IC card using an electromagnetic shield and a connector. Needless to say. Further, the electromagnetic shield plate is not limited to the metal panel, and may be any conductive substance such as a conductive resin plate.

【0020】[0020]

【発明の効果】以上説明したように、本発明によれば、
電磁遮蔽板とコネクタの接地端子とをコネクタ部に設け
た接触ばねを介して接続するので、配線基板の実装面積
を有効に活用することができ、かつ高電圧等の外部ノイ
ズは配線基板を通さずにコネクタの接地端子に逃がすこ
とができるので、電磁障害に強いICカードを提供する
ことができる。
As described above, according to the present invention,
Since the electromagnetic shield plate and the ground terminal of the connector are connected via the contact spring provided in the connector section, the mounting area of the wiring board can be effectively utilized and external noise such as high voltage can be passed through the wiring board. Since it can be released to the ground terminal of the connector without having to do so, it is possible to provide an IC card that is resistant to electromagnetic interference.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1実施例に係わるICカードの断面
図。
FIG. 1 is a sectional view of an IC card according to a first embodiment of the present invention.

【図2】本発明の第1実施例に係わるコネクタの断面
図。
FIG. 2 is a sectional view of the connector according to the first embodiment of the present invention.

【図3】本発明の第1実施例に係わるコネクタの要部上
面図。
FIG. 3 is a top view of a main part of the connector according to the first embodiment of the present invention.

【図4】本発明の第2実施例に係わるICカードの断面
図。
FIG. 4 is a sectional view of an IC card according to a second embodiment of the present invention.

【図5】本発明の第2実施例に係わるコネクタの断面
図。
FIG. 5 is a sectional view of a connector according to a second embodiment of the present invention.

【図6】本発明の第2実施例の変形例に係わるICカー
ドの断面図。
FIG. 6 is a sectional view of an IC card according to a modification of the second embodiment of the present invention.

【図7】本発明の第2実施例の変形例に係わるコネクタ
の断面図。
FIG. 7 is a sectional view of a connector according to a modification of the second embodiment of the present invention.

【図8】本発明の第3実施例に係わるコネクタの断面
図。
FIG. 8 is a sectional view of a connector according to a third embodiment of the present invention.

【図9】本発明の第3実施例に係わるコネクタの要部底
面図。
FIG. 9 is a bottom view of the essential parts of the connector according to the third embodiment of the present invention.

【図10】従来技術によるICカードの断面図。FIG. 10 is a sectional view of an IC card according to a conventional technique.

【符号の説明】[Explanation of symbols]

1 … 配線基板 2 … 電子回路部品 3 … コネクタ 4 … 枠体 5 … 上部金属パネル(電磁遮蔽板) 6 … 下部金属パネル(電磁遮蔽板) 7 … 上部接触ばね 8 … 下部接触ばね 1 ... Wiring board 2 ... Electronic circuit component 3 ... Connector 4 ... Frame 5 ... Upper metal panel (electromagnetic shield plate) 6 ... Lower metal panel (electromagnetic shield plate) 7 ... Upper contact spring 8 ... Lower contact spring

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H01R 4/64 A 7354−5E 9/09 Z 6901−5E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01R 4/64 A 7354-5E 9/09 Z 6901-5E

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 電磁遮蔽板と、外部との電気的接続用の
コネクタを有するICカードにおいて、前記コネクタの
接地端子に連結して、前記電磁遮蔽板と当接する接触ば
ねを、前記接地端子に一体として設けたことを特徴とす
るICカード。
1. In an IC card having an electromagnetic shield plate and a connector for electrical connection to the outside, a contact spring, which is connected to the ground terminal of the connector and abuts on the electromagnetic shield plate, is connected to the ground terminal. An IC card characterized by being provided integrally.
【請求項2】 前記接触ばねの先端が、前記コネクタの
筐体の上面と下面に突出し前記電磁遮蔽板に当接するご
とく設けられたことを特徴とする請求項1記載のICカ
ード。
2. The IC card according to claim 1, wherein the tip of the contact spring is provided so as to protrude from the upper surface and the lower surface of the housing of the connector and contact the electromagnetic shield plate.
【請求項3】 前記接触ばねの先端が、前記コネクタの
筐体の上面または下面に突出し前記電磁遮蔽板に当接す
るごとく設けられ、前記コネクタの筐体の上面と下面と
を狭持する前記電磁遮蔽板を、導通手段にて導通したこ
とを特徴とする請求項1記載のICカード。
3. The electromagnetic device which is provided so that a tip of the contact spring projects on an upper surface or a lower surface of a housing of the connector and abuts on the electromagnetic shield plate, and holds the upper surface and the lower surface of the housing of the connector. 2. The IC card according to claim 1, wherein the shield plate is electrically connected by a conductive means.
【請求項4】 前記導通手段が、前記コネクタの筐体の
上面と下面とを貫通する透孔内に設けられたことを特徴
とする請求項3記載のICカード。
4. The IC card according to claim 3, wherein the conducting means is provided in a through hole that penetrates an upper surface and a lower surface of the housing of the connector.
JP4326320A 1992-12-07 1992-12-07 Ic card Pending JPH06177573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4326320A JPH06177573A (en) 1992-12-07 1992-12-07 Ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4326320A JPH06177573A (en) 1992-12-07 1992-12-07 Ic card

Publications (1)

Publication Number Publication Date
JPH06177573A true JPH06177573A (en) 1994-06-24

Family

ID=18186454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4326320A Pending JPH06177573A (en) 1992-12-07 1992-12-07 Ic card

Country Status (1)

Country Link
JP (1) JPH06177573A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6481633B1 (en) 1999-07-06 2002-11-19 J. S. T. Mfg. Co., Ltd. IC incorporating card with a grounding structure
JP2008258371A (en) * 2007-04-04 2008-10-23 Canon Inc Electronic equipment
JP2016057974A (en) * 2014-09-11 2016-04-21 東芝情報システム株式会社 USB memory device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6481633B1 (en) 1999-07-06 2002-11-19 J. S. T. Mfg. Co., Ltd. IC incorporating card with a grounding structure
JP2008258371A (en) * 2007-04-04 2008-10-23 Canon Inc Electronic equipment
JP2016057974A (en) * 2014-09-11 2016-04-21 東芝情報システム株式会社 USB memory device

Similar Documents

Publication Publication Date Title
JP3646894B2 (en) Electric connector shroud and electric connector assembly using the same
US5456616A (en) Electrical device employing a flat flexible circuit
US5398154A (en) Card grounding apparatus
JP3712742B2 (en) Electrical connector with grounding clip
JP3168512B2 (en) Shielded receptacle electrical connector assembly
US20050032426A1 (en) Connector having a simple structure assuring a stable mounting operation
JPH0676894A (en) Connector
JPH08236215A (en) Universal ground clip for card acceptance connector
US7014506B2 (en) Board mounted memory card connector
US5281155A (en) Electrical connector with electrostatic discharge protection
US20040023537A1 (en) ESD type connector
US6755691B2 (en) Connector with movable contact alignment member
US6790052B2 (en) Circuit board straddle mounted connector
US20040023533A1 (en) Electrical connector
US20090023337A1 (en) Electrical connector
US20060040558A1 (en) Board mounted memory card connector with EMI shield
US6626689B1 (en) Electrical card connector
JPH11214092A (en) Card connection device
US20030119354A1 (en) Electrical connector having improved shielding
JP3079467B2 (en) Grounded electrical connector
US6837747B1 (en) Filtered connector
JPH06177573A (en) Ic card
US6736656B1 (en) Electrical card connector
JP3278052B2 (en) Shield connector
US6079620A (en) Board adapter