JP5138394B2 - ポリマー部材 - Google Patents
ポリマー部材 Download PDFInfo
- Publication number
- JP5138394B2 JP5138394B2 JP2008010808A JP2008010808A JP5138394B2 JP 5138394 B2 JP5138394 B2 JP 5138394B2 JP 2008010808 A JP2008010808 A JP 2008010808A JP 2008010808 A JP2008010808 A JP 2008010808A JP 5138394 B2 JP5138394 B2 JP 5138394B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- electroless plating
- carbon dioxide
- plating solution
- polymer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 description 91
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Description
実施例1で用いたメッキ装置の概略構成図を図1に示した。メッキ装置100は、図1に示すように、主に、二酸化炭素ボンベ21、フィルター26、高圧シリンジポンプ20及び高圧容器1から構成されており、これらの構成要素は配管27により接続されている。また、図1に示すように、各構成要素間を繋ぐ配管27には、高圧二酸化炭素の流動を制御するための手動バルブ22〜24が所定の位置に設けられている。
まず、次のようにして、金属微粒子が表面内部に浸透したポリマー基材102(マウント)を作製(用意)した。射出成形により、図2に示した所定形状のポリマー基材102を成形した。次いで、成形後のポリマー基材102と金属錯体とを表面改質装置(不図示)の高圧容器(不図示)内に装着した。なお、この際、ポリマー基材102の全表面が、後に高圧容器に導入される超臨界状態の二酸化炭素(以下、超臨界二酸化炭素という)と接するようにポリマー基材102を高圧容器内で保持した。また、この例では、金属錯体としてヘキサフルオロアセチルアセトナトパラジウム(II)を用いた。
上述のようにして作製されたポリマー部材に対して、高温多湿試験(条件:温度80℃、湿度90%Rh、放置時間500時間)やヒートサイクル試験(80℃と150℃との温度間を15サイクル)を行った後、ピール試験したところ、膜剥れは発生しなかった。また、本実施例の上記プロセスを繰り返し行ったところ、高圧容器1内部にはメッキ膜の成長や容器内壁の腐食は認められなかった。
実施例2で用いたメッキ装置の概略構成図を図6に示した。メッキ装置200は、図6に示すように、主に、二酸化炭素ボンベ21、フィルター26、高圧シリンジポンプ20、及び、高圧容器1’から構成されており、これらの構成要素は配管27により接続されている。また、図6に示すように、各構成要素間を繋ぐ配管27には、超臨界二酸化炭素の流動を制御するための手動バルブ22〜24が所定の位置に設けられている。
まず、この例では、実施例1と同様にして、金属微粒子が表面内部に浸透したポリマー基材102(図2に示した形状のマウント102)を作製(用意)した。なお、この例では、金属錯体としてヘキサフルオロアセチルアセトナトパラジウム(II)を用いた。
上述のようにして作製されたポリマー部材に対して、実施例1と同様にして環境試験(高温多湿試験、ヒートサイクル試験)及び密着性評価(ピール試験)を行ったところ、実施例1と同様に、密着性の高いメッキ膜がポリマー基材102上に形成されていることが分かった。
比較例1では、メッキ装置の内部容器で攪拌を行わなかったこと以外は、実施例4(無電解メッキ液にアルコールを混合しない場合)と同様にして、ポリマー基材に無電解メッキ処理を施し、ポリマー部材を作製した。
比較例2では、無電解メッキ液と金属微粒子が表面内部に浸透したポリマー基材を、メッキ装置の内部容器に挿入した後、80℃に加温した。次いで、実施例3と同様にして内部容器を高圧容器内に挿入し、超臨界二酸化炭素を導入して無電解メッキ処理を行った。すなわち、比較例2では、ポリマー基材に接触させる無電解メッキ液の温度を、超臨界二酸化炭素を導入する前後でほぼ一定にした。
メッキ膜の密着性:
◎ 環境試験(高温多湿、ヒートサイクル試験)後のピール試験で問題がない場合(メッキ膜の剥離、膜膨れ等がない場合)
○ 環境試験前のピール試験で問題がない場合
× 環境試験前のピール試験で剥離した場合
容器内壁の腐食性及びメッキ膜の成長:
○ 容器内壁に錆やメッキ膜の成長がない場合
× 容器内壁に錆やメッキ膜の成長が発生した場合
本実施例で用いたポリマー部材の製造装置の概略構成を図7に示した。本実施例の製造装置500は、図7に示すように、主に、金型を含む縦型の射出成形装置部503と、高圧二酸化炭素を含む無電解メッキ液の金型への供給及び排出を制御する無電解メッキ装置部501と、射出成形装置部503の可塑化シリンダー内の溶融樹脂に金属錯体を溶解した高圧二酸化炭素を浸透させるための表面改質装置部502とからなる。
次に、表面内部に金属微粒子を浸透させたポリマー基材の成形方法について説明する。なお、本発明において金属微粒子の樹脂への浸透方法は任意であるが、本実施例では、可塑化シリンダー52内で可塑化計量した溶融樹脂の先端部(フローフロント部)に金属微粒子を溶解した高圧二酸化炭素を導入した。
上述のようにして作製された表面内部に金属微粒子が分散したポリマー基材507に対して、次のようにして、金型内で無電解メッキ処理を行った。なお、無電解メッキ処理を行っている間、金型内部は80℃に温調した。
8 無電解メッキ液
9 内部容器
21 液体二酸化炭素ボンベ
20,33,34 シリンジポンプ
100,200 メッキ装置
102 ポリマー部材(マウント)
109,600 金属微粒子
300,602,709 無電解メッキ膜
500 製造装置
501 無電解メッキ装置部
502 表面改質装置部
503 射出成形装置部
504 キャビティ
505 スキン層(表皮)
506 コア層
507 ポリマー成形品
509 無電解ニッケル−リン膜
510 金メッキ膜
601 水溶性物質
708 発泡セル
Claims (3)
- ポリマー部材であって、
表面から所定深さまでの第1領域に金属微粒子が含浸したポリマー基材と、
上記ポリマー基材の上記表面上に形成された無電解メッキ膜とを備え、
上記ポリマー基材の上記表面から100nm以上の深さであり、且つ、上記所定深さより浅い深さを有する第2領域に、上記無電解メッキ膜の一部が浸透していることを特徴とするポリマー部材。 - 上記ポリマー基材の内部にポリアルキレングリコールの粒子が存在することを
特徴とする請求項1に記載のポリマー部材。 - 上記ポリマー基材の内部に空隙が存在することを特徴とする請求項1に記載のポリマー部材。
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