JP5126632B2 - Light emitting module - Google Patents

Description

  The present invention relates to a light-emitting module that has a plurality of chip-like LEDs (light-emitting diodes) that emit light when energized and emits them all at once, and is used, for example, as a light source for a projector or a lighting fixture.

  A reflector made of a square frame is provided on one surface of a device substrate made of a metal base substrate whose surface is made of a resin plate, and a plurality of chip rows forming a series circuit are arranged inside the reflector in a direction perpendicular to the extending direction of the row. COB (chip on board) type lighting device in which a translucent sealing resin such as a silicone resin mixed with a phosphor is filled inside the reflector and each chip row is embedded with the sealing resin Is known as a prior art (see, for example, Patent Document 1).

  In each of the chip rows in this lighting device, a plurality of LED chips each having a pair of element electrodes are arranged in a row, and both ends of bonding wires are connected to the element electrodes of the LED chips adjacent in the direction in which the row extends. Are joined by wire bonding, and each LED chip is connected in series. Therefore, this illuminating device has a simple structure because it is not necessary to provide on the device substrate a wiring conductor that is positioned around the chip row and formed in a predetermined pattern. Each LED chip of the illumination device emits blue light, and a phosphor that is excited by the blue light and emits yellow light is mixed with the sealing resin. For this reason, the illuminating device can illuminate with white light formed by mixing yellow light and blue light.

JP 2008-277561 A

  When the lighting device described in Patent Document 1 is turned on, each LED chip in the chip row generates heat. Most of this heat is released through the device substrate to the back side of the substrate, but the heat conduction area between the device substrate and the LED chip is limited to the size of the LED chip. For this reason, the heat conductivity from the LED chip to the device substrate is not good. Further, since the sealing resin is heated by the LED chip and also by the heat generated by the excited phosphor, the temperature of the sealing resin also rises. For these reasons, in the illumination device described in Patent Document 1, the temperature of each LED chip is likely to rise, and there is room for improvement in maintaining the light emission efficiency.

  Therefore, the present applicant has provided a heat diffusion layer of a size corresponding to the mounting area of each chip row on the surface of the device substrate, and adopted a device for mounting the chip row on this heat diffusion layer. We have developed a light-emitting module with improved thermal conductivity from each LED chip in the chip array to the device substrate.

  In this light emitting module, since the heat diffusion layer is made of metal, at least the surface of the heat diffusion layer is made of silver, gold, or nickel that can reflect light on the surface in order to improve the light extraction efficiency in the light utilization direction. It is preferable to do. However, the present inventors have found that there are the following problems with the adoption of such a thermal diffusion layer.

  That is, as a result of various trial manufactures by the present inventor, adhesion between a heat diffusion layer whose surface is formed of silver, gold, or nickel and a transparent silicone resin, urethane resin, or acrylic resin that can be used as a sealing resin It turns out that the sex is not strong. On the other hand, a heat cycle in which the light emitting module expands and contracts with the start and stop of light emission of the light emitting module is known.

  Therefore, it is inevitable that stress acts on the interface between the sealing resin and the member in contact with the member due to the dimensional change of each member caused by the difference in thermal expansion coefficient between the members constituting the light emitting module. And since the reliability of adhesion | attachment with sealing resin and the thermal diffusion layer adhering to this is low as mentioned above, there exists a possibility that sealing resin may peel by the said stress. It is not appropriate to reach such a situation, and there is room for improvement in ensuring the durability of the light emitting module.

  As described above, in the conventional technology, there is a room for improving the heat dissipation from the LED mounted on the substrate, and there is a problem that the sealing resin may be peeled off in the improvement.

In order to solve the above-mentioned problem, the invention of claim 1 is a module substrate; and a plurality of wiring conductors provided on a surface of the module substrate to form irregularities on the surface of the module substrate and reflect light; Between the plurality of wiring conductors , adjacent to these wiring conductors, provided on a part of the surface of the module substrate , and forming unevenness on the surface of the module substrate together with the wiring conductor , and adjacent to the wiring conductor A heat diffusion layer made of a metal that forms the concave and convex portions between the wiring conductors and reflecting light; and a light emitting group that is fed through the wiring conductor and shorter than the total length of the heat diffusion layer is formed. a plurality of LED and each device electrode on the thermal diffusion layer as the heat diffusion layer protrudes is mounted side by side are connected directly by wire from; the thermal diffusion layer, Line conductors, and the filled recesses and partially adhered to the region between the plurality of LED mounted side by side to the heat diffusion layer of the portion protruding from the light-emitting group and the thermal diffusion layer with fill LED characterized by comprising a; and translucent sealing resin of the motor joules substrate deposited been phosphor-containing Te.

  In the invention of claim 1, the chip-like LED (light emitting diode) refers to an LED made of a bare chip. In the first aspect of the invention, the module substrate can use an insulating layer of synthetic resin or glass or ceramics. In this case, the insulating layer may be a single insulating layer or a plurality of insulating layers. A module substrate formed by laminating a metal plate for promoting heat dissipation on the back surface of the substrate can be used. In the first aspect of the invention, the surface of the module substrate refers to the side from which the light emitted from the light emitting module is extracted.

  In the invention of claim 1, the heat diffusion layer is sized to mount a plurality of LEDs, and the metal layer forming the heat diffusion layer may be formed by laminating two or more single layers or different metals, In order to obtain good light reflection performance on the surface, at least the surface is preferably formed of silver, gold, or nickel. In the invention of claim 1, the wiring conductor is provided to be electrically connected to the LED and to carry electricity to the LED, and the wiring conductor is made of the same kind of metal as the heat diffusion layer. And the thermal diffusion layer can be produced simultaneously. Furthermore, providing the wiring conductor around the heat diffusion layer along the heat diffusion layer shortens the distance of electrical connection between the wiring conductor and the LED, thereby suppressing the increase in size of the module substrate. This is preferable.

  In the first aspect of the invention, the sealing resin may be a translucent resin such as a transparent silicone resin, a transparent urethane resin, or a transparent acrylic resin. In order to emit white light from the light emitting module, when the LED emits blue light, a yellow phosphor that emits yellow light when excited by the emitted blue light may be mixed with the sealing resin. Similarly, in order to emit white light from the light emitting module, when the LED emits ultraviolet light, a red phosphor that is excited by the emitted ultraviolet light and emits red light, and is excited by the ultraviolet light and emitted green light. A green phosphor that emits blue light and a blue phosphor that emits blue light when excited by the same ultraviolet light may be mixed in the sealing resin. Furthermore, when three types of LEDs emitting red, green, and blue light are used as a set and a plurality of sets are mounted on the heat diffusion layer, a sealing resin that does not mix phosphors may be used.

  In the light emitting module according to the first aspect of the present invention, a plurality of heat diffusion layers are provided on a module substrate, and a plurality of LEDs are mounted on each of them, and these LEDs are fed through wiring conductors provided on the module substrate. It has the composition which is done. As a result, most of the heat generated by each LED during light emission is diffused by thermal conduction to the entire heat diffusion layer having a much larger area than that of the individual LED, and from the entire heat diffusion layer to the module substrate. Since it is transmitted by heat conduction, the heat dissipation from the LED is improved, and the temperature rise of the LED can be suppressed. Furthermore, a part of the heat generated by each LED is transmitted to the sealing resin, and the phosphor excited in the sealing resin generates heat. Since it can be received and quickly conducted to the module substrate at a portion between the plurality of LEDs mounted side by side on the diffusion layer, it is possible to suppress heat from being applied to the sealing resin and to further suppress the temperature rise of the LEDs.

  Furthermore, in the light emitting module of the invention according to claim 1, a portion of the sealing resin deposited on the module substrate in which the heat diffusion layer and the wiring conductor are buried is formed by the heat diffusion layer and the wiring conductor. It is bonded to the heat diffusion layer and the wiring conductor in a shape corresponding to the unevenness. Therefore, the adhesion portion of the sealing resin to the heat diffusion layer and the wiring conductor can function as an anchor for the sealing resin. Therefore, in spite of the poor adhesion between this layer and the sealing resin due to the use of the thermal diffusion layer, the adhesion of the sealing resin to the module substrate is supplemented by the anchor function, and the light emission of the LED It can suppress that sealing resin peels from a module board | substrate resulting from the heat cycle accompanying the stop.

  According to the first aspect of the present invention, the heat radiation from the LED mounted on the substrate can be improved, and the sealing resin is peeled off from the module substrate due to the light emission of the LED and the heat cycle accompanying its stop. And the durability of the light emitting module can be improved.

It is a front view which abbreviate | omits and shows the light emitting module which concerns on one embodiment of this invention. It is sectional drawing shown along the arrow F2-F2 line | wire in FIG. It is an enlarged front view of the F3 part in FIG.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.

In FIG. 1, reference numeral 1 denotes COB (chip on
board) type light emitting module. The light emitting module 1 is disposed at the focal point of a projection lens group of a spotlight, for example, and used as a light source of this light.

  The light emitting module 1 includes a module substrate 2, a plurality of heat diffusion layers 6 to 10, a plurality of wiring conductors 11 to 20, light emitting groups 21 to 30, an end bonding wire 41, a protective layer 42, a frame body 44 and a sealing resin 48.

  The module substrate 2 has a predetermined shape, for example, a quadrangle as shown in FIG. 1, and is formed by laminating a metal plate 4 on the back surface of the insulating layer 3 as shown in FIG. The insulating layer 3 is made of synthetic resin. The metal plate 4 is made of aluminum or an alloy thereof. In FIG. 1, reference numeral 2 a indicates attachment holes opened at the four corners of the module substrate 2.

  As shown in FIG. 1, for example, the five heat diffusion layers 6 to 10 have a rectangular shape extending in a direction connecting two parallel sides of the module substrate 2, have the same size, and They are arranged at intervals in the direction connecting the other two parallel sides. These thermal diffusion layers 6 to 10 are laminated on the surface of the module substrate 2 as shown in FIG.

  Each of the thermal diffusion layers 6 to 10 is formed of, for example, copper laminated on the insulating layer 3, nickel laminated on the copper layer by plating or the like, and a surface layer laminated on the nickel by plating or the like. Yes. The surface layer is made of a metal having a higher light reflectivity than the insulating layer 3, and the light reflectivity is 60% or more. As a surface layer that preferably satisfies these conditions, for example, a silver layer employed in this embodiment can be exemplified. The thickness of these heat diffusion layers 6 to 10 is preferably as thick as possible, for example, 35 μm.

  The heat diffusion layers 6 to 10 may be two layers or one layer, for example, a single layer of silver, gold, or nickel, and two layers formed by laminating a surface layer of silver, gold, or nickel on a copper layer. However, at least the surface layer is preferably made of silver.

  Each of the pair of wiring conductors 11 to 20 is laminated on the surface of the module substrate 2, and these also have a three-layer structure of copper, nickel and silver. Even one layer can be used. The wiring conductors 11 to 20 and the thermal diffusion layers 6 to 10 are formed simultaneously by etching, plating treatment, or the like. Therefore, the thickness of the wiring conductors 11 to 20 is also 35 μm, for example, and their surface layer is made of, for example, silver and has a light reflectance of 60% or more. Each of the wiring conductors 11 to 20 having such a surface layer can effectively reflect the light incident on the surface layer in the light utilization direction, which is preferable in improving the light extraction performance of the light emitting module 1.

  The wiring conductors 11 to 20 are provided around the heat diffusion layers 6 to 10 in a non-contact manner along the heat diffusion layers 6 to 10.

  That is, as shown in FIG. 1, the pair of wiring conductors 11 serving as the anode side and the cathode side are provided so as to extend along both sides of the heat diffusion layer 6 with a necessary insulation distance from the heat diffusion layer 6. It has been. One end portions of these wiring conductors 11 form terminal portions 11a or 11b. Similarly, a pair of wiring conductors 12 are provided for the thermal diffusion layer 7 and have terminal portions 12a or 12b. The conductor 13 is provided for the thermal diffusion layer 8 and has a terminal portion 13a or 13b. The pair of wiring conductors 14 is provided for the thermal diffusion layer 9 and has a terminal portion 14a or 14b. The wiring conductor 15 is provided for the thermal diffusion layer 10 and has a terminal portion 15a or 15b. The terminal portions 11a to 15a and 11b to 15b are arranged in the same direction as the arrangement direction of the heat diffusion layers 6 to 10 apart from one end in the longitudinal direction of the heat diffusion layers 6 to 10 (the lower end of the module substrate 2 in FIG. 1). It has been.

  Similarly, the pair of wiring conductors 16 serving as the anode side and the cathode side are provided so as to extend along both sides of the thermal diffusion layer 6 with a necessary insulating distance from the thermal diffusion layer 6. One end portions of these wiring conductors 16 form terminal portions 16a or 16b. Similarly, a pair of wiring conductors 17 are provided for the thermal diffusion layer 7 and have terminal portions 17a or 17b. The conductor 18 is provided for the thermal diffusion layer 8 and has terminal portions 18a or 18b. The pair of wiring conductors 19 is provided for the thermal diffusion layer 9 and has terminal portions 19a or 19b. The wiring conductor 20 is provided for the thermal diffusion layer 10 and has a terminal portion 20a or 20b. Each of the terminal portions 16a to 20a and 16b to 20b is away from the other longitudinal end of the thermal diffusion layers 6 to 10 (the upper end of the module substrate 2 in FIG. 1) and is in the same direction as the arrangement direction of the thermal diffusion layers 6 to 10. Are lined up.

  The wiring conductors 11 and 16 are axisymmetrical with respect to the center line A indicated by the one-dot chain line in FIG. 1 of the module substrate 2. Similarly, the wiring conductors 12 and 17, the wiring conductors 13 and 18, the wiring conductors 14 and 19, Each of the wiring conductors 15 and 20 is line symmetric with respect to the center line A.

  By providing the wiring conductors 11 to 20 in this way, a pair of wiring conductors 11 and 16 positioned so as to continuously extend in a straight line are disposed on the left side of the heat diffusion layer 6 at the left end in FIG. A pair of wiring conductors 15 and 20 positioned so as to continuously extend in a straight line are disposed on the right side of the thermal diffusion layer 10 at the right end in FIG. At the same time, two sets of wiring conductors are arranged on each of the left and right sides of the thermal diffusion layers 7 to 9 between the thermal diffusion layers 6 and 10 so as to continuously extend in a straight line. That is, the other set of wiring conductors 11 and 16 and the set of wiring conductors 12 and 17 are disposed between the heat diffusion layers 6 and 7, and the other set of wiring conductors 12 and 17 and the set of wiring conductors are arranged. 13 and 18 are disposed between the thermal diffusion layers 7 and 8. Similarly, another set of wiring conductors 13 and 18 and a set of wiring conductors 14 and 19 are disposed between the heat diffusion layers 8 and 9, and the other set of wiring conductors 14 and 19 and the other set of wiring conductors are disposed. Wiring conductors 15 and 20 are disposed between the thermal diffusion layers 9 and 10.

  As described above, the heat diffusion layers 6 to 10 and the wiring conductors 11 to 20 adjacent to each other form irregularities on the surface of the module substrate 2 as shown in FIG. That is, each of the heat diffusion layers 6 to 10 and each of the wiring conductors 11 to 20 bears a convex portion, and the gap between the adjacent heat diffusion layer and the wiring conductor, and the gap between the adjacent wiring conductors bears the concave portion C, and is uneven. Is formed.

  The light emitting groups 21 to 30 are divided into three types having different overall lengths. That is, as shown in FIG. 1, the light emitting groups 23 and 28 having the longest overall length, the light emitting groups 21, 25, 26, and 30 having the shortest overall length, and the light emitting groups 22, 24, 27, and 29 having the intermediate total length. It is divided into. In addition, the full length of each light emission group 21-30 points out the length of the row direction (up-down direction in FIG. 1) of the LED row mentioned later.

  The light emitting groups 23 and 28 having the longest total length are mounted on the thermal diffusion layer 8 located in the center in the arrangement direction of the thermal diffusion layers 6 to 10, and are lined with the center line A as a boundary. Symmetric. The light emitting groups 21 and 26 having the shortest overall length are mounted on the thermal diffusion layer 6 located at one end in the arrangement direction of the thermal diffusion layers 6 to 10 and are symmetrical with respect to the center line A. Similarly, the light emitting groups 25 and 30 having the shortest overall length are mounted on the thermal diffusion layer 10 located at the other end in the arrangement direction of the thermal diffusion layers 6 to 10, and the center line It is line symmetric with respect to A. The light emitting groups 22 and 27 having an intermediate length are mounted on the thermal diffusion layer 7 between the thermal diffusion layers 6 and 8, and are symmetrical with respect to the center line A. Similarly, the intermediate length The light emitting groups 24 and 29 having the total length are mounted on the thermal diffusion layer 9 between the thermal diffusion layers 8 and 10 and are symmetrical with respect to the center line A.

  Therefore, as shown in FIG. 1, the total length of the light emitting modules disposed on both sides of the light emitting groups 23 and 28 having the longest total length among the three types of light emitting groups is the light emitting module disposed far from the light emitting groups 23 and 28. Short enough.

  As described above, the configuration of each of the light emitting groups 21 to 30 is the same except that the total length is different according to each of the three groups. Therefore, here, the light emission group 26 shown in FIG. 2 will be described as a representative.

  The light emitting group 26 includes a plurality of LED rows 31. Each LED row 31 includes a plurality of chip-like LEDs (light emitting diodes) 32 which are light emitting elements and bonding wires 37.

  As shown in FIG. 2, each LED 32 is composed of a bare chip in which a light emitting layer 32b is provided on a translucent LED substrate 32a having an insulating property such as sapphire glass. Emits light. As shown in FIG. 3, the LED 32 has a rectangular shape in plan view, and has a pair of element electrodes on the light emitting layer 32b. One element electrode is for the anode and the other element electrode is for the cathode.

  These LEDs 32 are formed on the heat diffusion layers 6 to 10 stacked on the module substrate 2 in a direction orthogonal to the longitudinal direction of the heat diffusion layers 6 to 10 and the direction in which the wiring conductors 11 to 20 extend, that is, left and right in FIG. The direction is preferably arranged and fixed in a straight line. These are fixed by adhering the surface of the LED substrate 32 a opposite to the surface on which the light emitting layer 32 b is provided with a light-transmitting die bond material 35. For the die bond material 35, a translucent silicone resin or the like is used.

  The bonding wire 37 is made of a fine metal wire, preferably a gold fine wire. As shown in FIG. 3, the bonding wire 37 is connected to the anode and cathode element electrodes of the LEDs 32 adjacent to each other in the extending direction of the LED row 31 by wire bonding. . Thereby, the some LED32 which made the row | line | column is electrically connected in series.

  As representatively shown in FIG. 3, the number of LEDs 32 included in each of the plurality of LED rows 31 included in each light emitting group is the same. As shown in FIG. 1, the LED rows 31 are arranged in a direction perpendicular to the extending direction, and occupy a square area on the module substrate 2 and are arranged as described above. For this reason, in each of the light emitting groups 21 to 30, the LEDs 32 that they have are arranged in a matrix and aligned vertically and horizontally.

  The end bonding wire 41 is made of a fine metal wire, for example, a gold fine wire. The end bonding wires 41 connect the LEDs 32 positioned at both ends of the LED rows 31 of the light emitting groups 21 to 30 to a pair of wiring conductors positioned on both sides of the light emitting group. doing.

  That is, as representatively shown in FIG. 2, the pair of wiring conductors 16 positioned on both sides of the light emitting group 26 and the LEDs 32 at both ends of each LED row 31 included in the light emitting group 26 are connected by the end bonding wires 41. It is connected. Therefore, the LED rows 31 included in the light emitting group 26 are electrically connected in parallel. This connection relationship is the same for other light emitting groups and a pair of wiring conductors arranged on both sides thereof.

  The protective layer 42 is made of an insulating resist, has a rectangular frame shape, and is laminated on the peripheral portion of the module substrate 2. The protective layer 42 has the same size as the module substrate 2 and surrounds the heat diffusion layers 6 to 10. The protective layer 42 has a mounting hole 2a and an escape hole 42a that exposes the terminal portions 11a to 20a and 11b to 20b.

  The frame 44 is made of an insulating material such as synthetic resin, and is fixed on the protective layer 42 laminated on the module substrate 2. Therefore, as shown in FIG. 1, inside the frame body 44, the thermal diffusion layers 6 to 10, the portions along the thermal diffusion layers 6 to 10 of the wiring conductors 11 to 20, the light emitting groups 21 to 30, and the end bonding wires 41. Is arranged.

  The sealing resin 48 (see FIGS. 1 and 2) is filled in the frame body 44 and attached onto the module substrate 2, and the members arranged inside the frame body 44 are filled to seal these members. doing. The sealing resin 48 is made of a synthetic resin having translucency, and is made of, for example, a transparent silicone resin. A part of the back surface of the sealing resin 48 which is injected into the frame body 44 in an uncured state and then cured by heating is formed by the heat diffusion layers 6 to 10 and the wiring conductors 11 to 20 as illustrated in FIG. A shape commensurate with the formed irregularities is adhered to each of the thermal diffusion layers 6 to 10 and the wiring conductors 11 to 20, and the thermal diffusion layer is filled with the recess C formed between these members. It is also adhered to 6-10. In addition, the code | symbol 48a in FIG. 2 has shown the penetration part of the thermal-diffusion layer 6-10 with respect to the recessed part C. FIG. Further, the sealing resin 48 is also bonded to the protective layer 42 and the insulating layer 3 of the module substrate 2 in the regions separated from the heat diffusion layers 6 to 10 and the wiring conductors 11 to 20.

  Although not shown, the phosphor is dispersed and mixed in the sealing resin 48. For example, a yellow phosphor that is excited by blue light emitted from each LED 32 and emits yellow light is used as the phosphor, but a red phosphor or a green phosphor is used to improve color rendering. May be added.

  As described above, the COB type light emitting module 1 has three types of light emitting groups 21 to 30 arranged so as to occupy a square area and emits light having the longest length (full length) in the direction in which the LED rows 31 are arranged. On the basis of the groups 23 and 28, the light emitting groups 22, 27 and 28, 29 having a short length (full length) in the arrangement direction are arranged on the both sides in order of length. Therefore, the combined shape of these three types of light emitting groups 21 to 30 can be made substantially round. Accordingly, the light distribution pattern projected on the irradiated portion from the spotlight using the light emitting module 1 as a light source can be substantially rounded.

  Further, in the COB type light emitting module 1, the plurality of LED rows 31 included in each of the light emitting groups 21 to 30 are not folded back and extend straight as illustrated in FIG. The direction of the bonding wire 37 that connects the plurality of LEDs 32 forming the individual LED rows 31 in series does not change. In addition, the LEDs 32 arranged at both ends of the LED row 31 are connected to the wiring conductors 11 to 20 on the module substrate 2 on which the light emitting groups 21 to 30 are arranged by the end bonding wires 41, and these bondings are performed. The wires 37 and the end bonding wires 41 are wired along the direction in which the LED rows 31 extend. Therefore, the routing of the bonding wire 37 and the end bonding wire 41 can be simplified, which is advantageous in manufacturing.

  The light emitting module 1 having the above-described configuration is configured such that the LEDs 32 included in the light emitting groups 21 to 30 are simultaneously transmitted by supplying power to the light emitting groups 21 to 30 through the terminal portions 11a to 20a and 11b to 20b. Can emit light. The blue light emitted by this light emission and the yellow light emitted from the phosphor in the sealing resin 48 excited by a part of this light are mixed to form white light, It is emitted from the light emitting module 1 in the light utilization direction.

  In this case, the light emitted from the light emitting layer 32 b of the LED 32 to the back side thereof is incident on one of the thermal diffusion layers 6 to 10 without passing through the die bonding material 35, or passes through the die bonding material 35 and enters the thermal diffusion layers 6 to 6. 10 is incident. In any case, the blue light incident on the heat diffusion layers 6 to 10 is reflected in the light utilization direction by any one of the heat diffusion layers 6 to 10, so that the light extraction efficiency is improved in this respect. good.

  In addition, the total length of the heat diffusion layers 6 to 10 is longer than the total length of each of the light emitting groups 21 to 30, and the heat diffusion layers 6 to 10 have portions protruding from the light emitting groups 21 to 30 as shown in FIG. doing. This part is covered with a sealing resin 48 containing a phosphor. Therefore, a part of the radiated light of the phosphor excited by the light incident on the sealing resin 48 on the part can be reflected in the light utilization direction at the part, so that the light extraction efficiency is further improved in this respect. Can be improved.

  Each LED 32 generates heat as it emits light. Most of this heat is conducted to the module substrate 2 and released from the metal plate 4 to an external heat radiating member such as a heat sink (not shown). In this case, each of the metal heat diffusion layers 6 to 10 on the module substrate 2 functions as a heat spreader and diffuses heat over the entire heat diffusion layers 6 to 10. Therefore, it is possible to quickly conduct the heat of the LED 32 to the module substrate 2 and suppress the temperature rise of the LED 32.

  Further, part of the heat generated by each LED 32 is transmitted to the sealing resin 48. At the same time, the phosphor excited in the sealing resin 48 that covers the portions of the thermal diffusion layers 6 to 10 protruding from the light emitting groups 21 to 30 generates heat. Since a part of the sealing resin 48 is bonded to the protruding part, a part of the heat of the sealing resin 48 is received at the protruding part of the thermal diffusion layers 6 to 10 to quickly Can be conducted to the module substrate 2. Therefore, it is possible to suppress the heat from flowing into the sealing resin 48, and accordingly, it is possible to further suppress the temperature increase of the LED 32.

  In addition, since the sealing resin 48 has the intrusion 48a into the concave and convex recess C formed on the surface of the module substrate 2 by the heat diffusion layers 6 to 10 and the wiring conductors 11 to 20, the wiring conductors 11 to 20 is larger than the surface layer of the wiring conductors 11 to 20. Thereby, the heat of the sealing resin 48 is easily transmitted to the wiring conductors 11 to 20, and the terminal portions 11 a to 20 a and 11 b to 20 b of the wiring conductors 11 to 20 arranged outside the sealing resin 48 are sealed. The heat of the stop resin 48 can be released. Therefore, also in this respect, it is possible to suppress the heat from flowing into the sealing resin 48, and accordingly, the temperature increase of the LED 32 can be further suppressed.

  Further, as described above, in the sealing resin 48 deposited on the module substrate 2, the portions where the thermal diffusion layers 6 to 10 and the wiring conductors 11 to 20 are buried are the thermal diffusion layers 6 to 10 and The heat diffusion layers 6 to 10 and the wiring conductors 11 to 20 are bonded to each other in a shape corresponding to the unevenness formed by the wiring conductors 11 to 20. Therefore, the adhesion part of the sealing resin 48 to the heat diffusion layers 6 to 10 and the wiring conductors 11 to 20 can function as an anchor for the sealing resin 48.

  Therefore, the thermal diffusion layers 6 to 10 used for improving the heat radiation performance and the light extraction efficiency and the sealing with respect to the module substrate 2 are not good even though the adhesion between the sealing resin 48 filling the thermal diffusion layers 6 to 10 is not good. The adhesiveness of the resin 48 can be supplemented by the anchor function. Thereby, it can suppress that sealing resin 48 peels from the module board | substrate 2 resulting from the light cycle of each LED32, and the heat cycle of the light emitting module 1 accompanying the stop.

  In addition, when the sealing resin 48 is to expand and contract with the heat cycle in the direction intersecting with the direction in which the heat diffusion layers 6 to 10 and the wiring conductors 11 to 20 extend, the anchor function described above is performed. The concave / convex concave portion C to be carried and the engaging portion with the enclosing portion 48a of the sealing resin 48 filling the concave / convex portion provide resistance to the expansion / contraction. As a result, the influence of expansion / contraction of the sealing resin 48 on the frame portion of the frame body 44 positioned in the intersecting direction is reduced, and the stress acting between the frame portion and the module substrate 2 is reduced accordingly. . Therefore, it is possible to suppress the sealing resin 48 from peeling from the module substrate 2 in this respect.

  In addition, despite the fact that the combined shape of the light emitting groups 21 to 30 is pseudo-round, the frame 44 is square, so that the areas where the light emitting groups 21 to 30 deviate from the regions arranged as described above, In other words, the sealing resin 48 filled in the frame body 44 is also provided at portions such as the four corners of the frame body 44 where the LEDs 32 are not disposed. And the heat | fever of the sealing resin 48 is given to the module board | substrate 2 as stated above in this part. Thus, as heat is radiated from the entire inner side of the frame body 44 to the module substrate 2, it is easy to make the temperature distribution of the module substrate 2 uniform. Thereby, it is possible to make it difficult to generate the thermal stress of the module substrate 2 due to the different heat distribution of the module substrate 2. Therefore, the sealing resin 48 can be prevented from peeling from the module substrate 2 due to the generation of the thermal stress.

  Moreover, in the light emitting module 1 of the said structure, the width | variety of each light emission group 21-30 is the same, and the number of LED32 which the LED row 31 has is the same. For this reason, the current value applied to each LED row 31 and, therefore, the forward applied voltage to the plurality of LEDs 32 included in each LED row 31 can be made the same, so that variations in the emission intensity of each LED 32 can be suppressed.

  The present invention is not limited to the one embodiment. For example, a white material can be used for the insulating material forming at least the surface portion of the module substrate 2. In this case, the light reflection performance at the surface portion is improved, and accordingly, the light extraction efficiency in the light utilization direction can be improved. In addition, when the surface layers of the thermal diffusion layers 6 to 10 and the wiring conductors 11 to 20 are made of silver, the thermal diffusion layers 6 to 10 and the wiring conductors 11 to 20 are seen through the translucent sealing resin 48. It is preferable in that it can be made difficult. In the embodiment, the frame body 44 is used. However, the frame body 44 may be omitted.

  DESCRIPTION OF SYMBOLS 1 ... Light emitting module, 2 ... Module board | substrate, 6-10 ... Thermal diffusion layer, 11-20 ... Wiring conductor, 32 ... LED, 37 ... Bonding wire, 41 ... End part bonding wire, 44 ... Frame, 48 ... Sealing Resin, 48a ... entering portion, C ... recessed portion

Claims (1)

A module substrate;
A plurality of wiring conductors provided on the surface of the module substrate to form irregularities on the surface of the module substrate and reflect light;
Between the plurality of wiring conductors , adjacent to these wiring conductors, provided on a part of the surface of the module substrate , and forming unevenness on the surface of the module substrate together with the wiring conductor , and adjacent to the wiring conductor A heat diffusion layer made of a metal that forms the concave and convex portions between the wiring conductor and reflecting light;
A light emitting group that is fed through the wiring conductor and shorter than the entire length of the heat diffusion layer is formed, and each element electrode is directly connected to the heat diffusion layer by a wire so that the heat diffusion layer protrudes from the light emission group. A plurality of LEDs mounted side by side;
Between the plurality of LEDs that fill the heat diffusion layer, the wiring conductor, and the LED, fill the recess, and part of the heat diffusion layer protrudes from the light emitting group and are mounted side by side on the heat diffusion layer and adhered to the site of translucent sealing resin of the motor joules substrate deposited been phosphor;
A light emitting module comprising:

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