JP5109249B2 - Resin composition, laminate, wiring board and method for manufacturing wiring board - Google Patents

Description

  The present invention relates to a resin composition, a laminate, a wiring board, a method for manufacturing a wiring board, and a multilayer wiring board.

  In recent use of electronic devices, high-speed transmission is performed for information transmission, and deterioration of electrical signals is a problem in high-speed transmission. The deterioration of the electric signal indicates the sum of the conductor loss and the dielectric loss, and in particular, the dielectric loss due to the dielectric characteristics of the interlayer insulating material of the multilayer wiring board increases significantly when the electric signal frequency is increased. For this reason, the frequency in the GHz band is a main cause of electrical signal degradation. In order to solve this problem, it is required to use a material having a dielectric constant and a low dielectric loss tangent as the insulating material.

Against this background, epoxy resins and polyimide resins that have been used as insulating materials for electronic parts such as wiring boards may have insufficient electrical characteristics such as dielectric constant and dielectric loss tangent, and are compatible with high-speed transmission. Is difficult.
On the other hand, the norbornene-based resin is a highly heat-resistant resin having a high glass transition temperature, and has a relative dielectric constant of 2.2 to 2.8 and a dielectric loss tangent of 0.001 to 0.006 in the GHz frequency range. Because of its excellent electrical characteristics, it is expected as an insulating resin for wiring boards compatible with high frequencies.

BCB resin is also a high heat-resistant resin having a high glass transition temperature, and has a relative dielectric constant of 2.5 to 2.6 and a dielectric loss tangent of 0.001 to 0.003 in the frequency band of the GHz band. In addition, since it exhibits excellent electrical characteristics, it is expected as an insulating resin for wiring boards compatible with high frequencies.
In addition to having a high glass transition temperature and high heat resistance, polyimide resin also contains a fluorine atom and has a relative dielectric constant of 2.6 to 2.7 and a dielectric loss tangent of 0 in the frequency band of the GHz band. It is expected to be an insulating resin for wiring boards compatible with high frequencies since it has excellent electrical characteristics of .004 to 0.007.
As a technique for lowering the linear expansion coefficient, a technique in which silica is blended in a resin composition has been conventionally employed, but in a low dielectric constant resin system, the interface wettability between the silica surface and the low dielectric constant resin is low, Interfacial peeling or interfacial voids are likely to occur, particularly when the silica having an average particle size of 3 μm or less is highly filled, and it is very difficult to exhibit low thermal expansion, high strength, and toughness.

So far, norbornene-based resins have been disclosed as insulating materials for wiring boards (see, for example, Patent Document 1), but only mentions the characteristics of the resin as an insulating material, and actual workability in laser processing and the like. In general, norbornene-based resins have a large coefficient of linear expansion, so that a large stress is generated when heated or cooled inside the wiring board, and it is difficult to obtain high reliability.
Japanese Patent Laid-Open No. 2001-301088

An object of the present invention is to provide a resin composition having both high reliability due to low dielectric constant and low thermal expansion necessary for an insulating layer, and high strength, toughness and laser processability. Moreover, the objective of this invention is providing the laminated body excellent in a low dielectric constant, low thermal expansibility, an electrical property, and laser workability.
Moreover, the objective of this invention is providing the wiring board excellent in the electrical property, and its manufacturing method.

Such an object is achieved by the present invention described in the following [1] to [19].
[1] A resin composition constituting a resin layer of a wiring board, including fused silica having an average particle size of 3 μm or less, a polybutadiene resin, a low dielectric constant resin, and a laser processability imparting agent. The agent is a resin composition characterized in that the agent is 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole,
The content of fused silica having an average particle size of 3 μm or less is 30 to 85% by weight of the entire resin composition,
The content of the polybutadiene resin is 1 to 10% by weight of the entire resin composition,
The content of the low dielectric constant resin is 15 to 55% by weight of the entire resin composition,
The laser processability imparting agent is a resin composition of 0.1 to 15% by weight based on the content of the low dielectric constant resin.
[2] The resin composition according to item [1], wherein the polybutadiene resin is a polybutadiene resin containing an acrylic group.
[3] The resin composition according to item [1], wherein the polybutadiene resin is a polybutadiene resin containing an epoxy group.
[4] The resin composition according to any one of [1] to [3], wherein the low dielectric constant resin is a cyclic olefin resin.

［式（１）中のＸは、-ＣＨ_２-、-ＣＨ_２ＣＨ_２-、または-Ｏ-を示し、Ｒ１、Ｒ２、Ｒ３、Ｒ４はそれぞれ独立して水素原子、炭化水素基、炭素数１〜１２の極性基を示し、該極性基は直鎖もしくは分岐したアルキル基、アルケニル基、アルキニル基、ビニル基、アリル基、アラルキル基、環状脂肪族基、アリール基、エーテル基により結合されていても良い。
ｎは０から２の整数を示し、その繰り返しは異なっていても良い。］ [ 5 ] The resin composition according to item [ 4 ], wherein the cyclic olefin-based resin is a norbornene-based resin including a repeating structure represented by the following general formula (1).

[X in the formula (1) _{may, -CH 2 -, - CH 2} CH 2 -, or -O- are shown, R1, R2, R3, R4 each independently represent a hydrogen atom, a hydrocarbon group, the number of carbon atoms 1 to 12 polar groups, which are bonded by a linear or branched alkyl group, alkenyl group, alkynyl group, vinyl group, allyl group, aralkyl group, cycloaliphatic group, aryl group, ether group. May be.
n represents an integer of 0 to 2, and the repetition may be different. ]

［式（２）中のＸは、-ＣＨ_２-、-ＣＨ_２ＣＨ_２-、または-Ｏ-を示し、Ｒ１、Ｒ２、Ｒ３、Ｒ４はそれぞれ独立して水素原子、炭化水素基、炭素数１〜１２の極性基を示し、該極性基は直鎖もしくは分岐したアルキル基、アルケニル基、アルキニル基、ビニル基、アリル基、アラルキル基、環状脂肪族基、アリール基、エーテル基により結合されていても良い。
ｎは０から２の整数を示し、その繰り返しは異なっていても良い。］ [ 6 ] The resin composition according to item [ 4 ], wherein the cyclic olefin resin is an addition polymer of a norbornene monomer including a monomer represented by the following general formula (2).

[X in the formula (2) _{is, -CH 2 -, - CH 2} CH 2 -, or -O- are shown, R1, R2, R3, R4 each independently represent a hydrogen atom, a hydrocarbon group, the number of carbon atoms 1 to 12 polar groups, which are bonded by a linear or branched alkyl group, alkenyl group, alkynyl group, vinyl group, allyl group, aralkyl group, cycloaliphatic group, aryl group, ether group. May be.
n represents an integer of 0 to 2, and the repetition may be different. ]

［R¹は脂肪族、芳香族、ヘテロ原子等、又はこれらの組み合わせ、
R²、R³は水素原子、脂肪族、芳香族、ヘテロ原子等、又はこれらの組み合わせ］ [7] The low dielectric constant resin, either a benzocyclobutene-based resin containing a structure represented by or The prepolymerized structures, by the following general formula (3) [1] to [3], wherein A resin composition according to claim 1.

[R ¹ is aliphatic, aromatic, heteroatom, or a combination thereof,
R ² and R ³ are a hydrogen atom, aliphatic, aromatic, heteroatom, or a combination thereof.

[ 8 ] The resin composition according to any one of [1] to [ 3 ], wherein the low dielectric constant resin is a fluorinated polyimide resin.
[ 9 ] A resin layer comprising the resin composition according to any one of items [1] to [ 8 ].
[10] The resin layer has a 3.0 dielectric constant less than [9] the resin layer according to claim.
[ 11 ] The resin layer according to [ 9] or [10 ], wherein the resin layer has a linear expansion coefficient of 50 ppm / ° C. or less.
[ 12 ] A laminate used for a wiring board, wherein the resin layer according to any one of [ 9] to [11 ] and a carrier film are laminated.
[ 13 ] A wiring board comprising the resin layer according to any one of [ 9] to [11 ].
[ 14 ] A step of forming an insulating layer using the resin composition according to any one of [1] to [ 8 ], a step of forming a circuit layer, and a step of opening the insulating layer by laser irradiation And a method for manufacturing a wiring board.
[ 15 ] The method for manufacturing a wiring board according to [ 14 ], wherein the step of forming the insulating layer is performed by applying the resin composition.
The method for manufacturing a the obtained film by using the resin composition is to form by laminating the 14 wiring board according to claim to form a [16] The insulating layer.
[ 17 ] The method for manufacturing a wiring board according to the item [ 16 ], wherein the film in the step of forming the insulating layer is a film with a metal layer.
[ 18 ] The method for manufacturing a wiring board according to any one of [ 14] to [17 ], including a step of heat-curing the insulating layer.
[ 19 ] A wiring board obtained by the manufacturing method according to any one of [ 14] to [18 ].

According to the present invention, it is possible to obtain a resin composition having a low dielectric constant, high strength, toughness, and high reliability due to low thermal expansion necessary for an insulating layer.
Further, according to the present invention, by using the resin composition, it is possible to obtain a laminate excellent in low dielectric constant, low thermal expansion, electrical characteristics, high strength, toughness, and laser workability.
Furthermore, according to this invention, the wiring board excellent in the electrical property can be obtained.

  The present invention is a resin composition used for forming an insulating layer of a wiring board, and contains fused silica having an average particle size of 3 μm or less, a polybutadiene resin, and a low dielectric constant resin as constituent components. As a result, electrical characteristics, low thermal expansion, and high performance that enable high-speed transmission of electronic equipment that could not be handled by resins such as epoxy resin, polyimide resin, and polyester resin that were used for insulating layers of conventional printed wiring boards Strength and toughness can be expressed.

  In addition, the present invention is a laminate used for a wiring board having an insulating layer, which is a laminate obtained by laminating a resin layer composed of the resin composition and a carrier film, and is a high-speed electronic device. It has a resin layer having electrical characteristics that enables transmission, and also has excellent flatness.

  Moreover, this invention is a manufacturing method of a wiring board including the process of forming an insulating layer using the said resin composition, the process of forming a circuit layer, and the process of opening the said insulating layer by laser irradiation. The wiring board obtained in this way has excellent electrical characteristics that enable high-speed transmission of electronic equipment, excellent connection reliability between layers due to microfabrication by laser irradiation, and even high adhesion of insulating layers It is.

The resin composition, the laminate, the method for producing a wiring board, and the wiring board of the present invention will be described in detail.
The resin composition of the present invention is a resin composition used for forming an insulating layer of a wiring board, and the resin composition comprises silica, polybutadiene resin, and low dielectric constant resin having an average particle size of 3 μm or less. It is characterized by containing as.

As the silica having an average particle diameter of 3 μm or less used in the present invention, spherical fused silica having an average particle diameter of 0.2 to 1 μm is preferably used in view of fluidity, circuit embedding property, and resin solution viscosity.
As content of the silica with an average particle diameter of 3 micrometers or less used by this invention, 30 to 85 weight% of the whole said resin composition is especially preferable, and 40 to 75 weight% is especially preferable. When the content is within this range, the dielectric constant, the linear expansion coefficient, the electrical characteristics, and the laser processability are particularly excellent.

  The type of polybutadiene resin used in the present invention is not limited, but those having an acrylic group or an epoxy group are particularly preferable. The content of the polybutadiene resin is preferably 1 to 10% by weight, particularly preferably 3 to 6% by weight, based on the entire resin composition. When the content is within this range, the wettability of the silica surface is particularly high, and high strength, toughness, low dielectric constant, low linear expansion coefficient, electrical characteristics, and laser workability are excellent.

Examples of the low dielectric constant resin used in the present invention include cyclic olefin resins, benzocyclobutene resins, and fluorine-containing polyimide resins.
Examples of the cyclic olefin-based resin preferably include a norbornene-based resin. More specifically, for example, a (co) polymer of a norbornene-type monomer, a copolymer of a norbornene-type monomer and an α-olefin, and the like. Copolymers with other monomers that can be used, and hydrogenated products of these copolymers. These norbornene resins can be produced by a known polymerization method, and there are an addition polymerization method and a ring-opening polymerization method. Of these, polymers obtained by addition (co) polymerization of norbornene monomers are preferred, but the present invention is not limited to these. As the polymerization method, known methods such as random polymerization and block polymerization are used.

  The norbornene resin addition polymer used in the present invention includes (1) addition (co) polymer of norbornene monomer obtained by addition (co) polymerization of norbornene monomer, and (2) norbornene monomer. And addition copolymers of ethylene and α-olefins, (3) addition copolymers of norbornene-type monomers and non-conjugated dienes, and other monomers as required. These resins can be obtained by all known polymerization methods.

Examples of the ring-opening polymer of norbornene-based resin used in the present invention include (4) a ring-opening (co) polymer of a norbornene-type monomer, and a resin obtained by hydrogenating the (co) polymer if necessary (5 A ring-opening copolymer of a norbornene-type monomer and ethylene or α-olefin, and a resin obtained by hydrogenating the (co) polymer if necessary, (6) a norbornene-type monomer and a non-conjugated diene, or Examples thereof include ring-opening copolymers with other monomers, and resins obtained by hydrogenating the (co) polymers as necessary. These resins can be obtained by all known polymerization methods.
Among these, (1) addition (co) polymers obtained by addition (co) polymerization of norbornene type monomers are preferred, but the present invention is not limited to these.

The norbornene resin addition polymer can be obtained by coordination polymerization using a metal catalyst or radical polymerization. Among them, in coordination polymerization, a polymer is obtained by polymerizing monomers in a solution in the presence of a transition metal catalyst (NiCOLE R. GROVE et al. Journal of Polymer Science: part B, Polymer Physics, Vol. 1). 37, 3003-3010 (1999)).
Representative nickel and platinum catalysts as metal catalysts for coordination polymerization are described in PCT WO 9733198 and PCT WO 00/20472. Examples of metal catalysts for coordination polymerization include (toluene) bis (perfluorophenyl) nickel, (mesylene) bis (perfluorophenyl) nickel, (benzene) bis (perfluorophenyl) nickel, bis (tetrahydro) bis ( Known metal catalysts such as perfluorophenyl) nickel, bis (ethyl acetate) bis (perfluorophenyl) nickel, and bis (dioxane) bis (perfluorophenyl) nickel may be mentioned.

The radical polymerization technique is described in Encyclopedia of Polymer Science, John Wiley & Sons, 13, 708 (1988).
Generally, in radical polymerization, the temperature is raised to 50 ° C. to 150 ° C. in the presence of a radical initiator, and the monomer is reacted in a solution. Examples of the radical initiator include azobisisobutyronitrile (AIBN), benzoyl peroxide, lauryl peroxide, azobisisocapronitrile, azobisisoleronitrile, and t-butyl hydrogen peroxide.

  A ring-opening polymer of a norbornene-based resin is a ring-opening (co) polymer obtained by ring-opening (co) polymerizing at least one norbornene-type monomer using a known ring-opening polymerization method with titanium or a tungsten compound as a catalyst. And then, if necessary, a hydrogenated carbon-carbon double bond in the ring-opened (co) polymer is hydrogenated by a conventional hydrogenation method to produce a thermoplastic saturated norbornene resin.

  Suitable polymerization solvents for the above-described polymerization system include hydrocarbons and aromatic solvents. Examples of the hydrocarbon solvent include pentane, hexane, heptane, and cyclohexane, but are not limited thereto. Examples of the aromatic solvent include, but are not limited to, benzene, toluene, xylene and mesitylene. Diethyl ether, tetrahydrofuran, ethyl acetate, ester, lactone, ketone, amide can also be used. These solvents can be used alone or as a polymerization solvent.

  The molecular weight of the norbornene resin can be controlled by changing the ratio of the initiator and the monomer or changing the polymerization time. When the above-mentioned coordination polymerization is used, US Pat. As disclosed in US Pat. No. 6,136,499, the molecular weight can be controlled by using a chain transfer catalyst. In the present invention, α-olefin such as ethylene, propylene, 1-hexane, 1-decene, 4-methyl-1-pentene and the like is suitable for controlling the molecular weight.

In the present invention, the norbornene-based resin has a weight average molecular weight of 10,000 to 500,000, preferably 30,000 to 100,000, and more preferably 50,000 to 80,000. The weight average molecular weight can be measured by gel permeation chromatography (GPC) using standard polystyrene. (Conforms to ASTM DFS 3536-91)
The molecular weight distribution [ratio of weight average molecular weight: Mw and number average molecular weight: Mn (Mw / Mn)] of the norbornene-based resin is not particularly limited, but is preferably 5 or less, particularly preferably 4 or less, particularly 1 to 3 is preferred. When the molecular weight distribution is within the above range, the electrical characteristics are particularly excellent.

As a method of measuring the molecular weight distribution, for example, it can be measured by GPC using cyclohexane or tetrahydrofuran as an organic solvent.
In the case of a norbornene-based resin in which the weight average molecular weight and molecular weight distribution cannot be measured by the above method, those having a melt viscosity and a degree of polymerization that can form a resin layer by an ordinary melt processing method can be used. . The glass transition temperature of the norbornene-based resin can be appropriately selected according to the purpose of use, but is usually 50 ° C. or higher, preferably 70 ° C. or higher, more preferably 100 ° C. or higher, and further preferably 125 ° C. or higher.
Examples of the norbornene-based resin used in the present invention include those containing a repeating structure represented by the following general formula (1).

［式（１）中のＸは、-ＣＨ₂-、-ＣＨ₂ＣＨ₂-、または-Ｏ-を示し、Ｒ１、Ｒ２、Ｒ３、Ｒ４はそれぞれ独立して水素原子、炭化水素基、炭素数１〜１２の極性基を示し、該極性基は直鎖もしくは分岐したアルキル基、アルケニル基、アルキニル基、ビニル基、アリル基、アラルキル基、環状脂肪族基、アリール基、エーテル基により結合されていても良い。
ｎは０から２の整数を示し、その繰り返しは異なっていても良い。］

[X in the formula (1) _{may, -CH 2 -, - CH 2} CH 2 -, or -O- are shown, R1, R2, R3, R4 each independently represent a hydrogen atom, a hydrocarbon group, the number of carbon atoms 1 to 12 polar groups, which are bonded by a linear or branched alkyl group, alkenyl group, alkynyl group, vinyl group, allyl group, aralkyl group, cycloaliphatic group, aryl group, ether group. May be.
n represents an integer of 0 to 2, and the repetition may be different. ]

Examples of the polar group include a hydroxyl group, a carboxyl group, an ester group, an acryloyl group, a methacryloyl group, an aryl group, an aralkyl group, a silyl group, an epoxy group, and an organic group containing these functional groups.
Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, and a dodecyl group. Examples include vinyl, allyl, butynyl, cyclohexenyl, etc. Specific examples of alkynyl include ethynyl, 1-propynyl, 2-propynyl, 1-butynyl, 2-butynyl, etc. However, as specific examples of cycloaliphatic groups, cyclopentyl group, cyclohexyl group, cyclooctyl group, specific examples of aryl group include phenyl group, naphthyl group, anthracenyl group, etc., and specific examples of aralkyl group include benzyl group, Phenethyl group and the like are specific examples of silyl groups such as trimethoxysilyl group, triethoxysilyl group, triethoxysilyl group. Examples of the epoxy group include an alkoxysilyl group such as a til group, a trimethoxypropyl group, a trimethylsilylmethyl ether group, a diphenylmethylsilyl group, and the like, and specific examples of the epoxy group include a methyl glycidyl ether group and an allyl glycidyl-ether group. However, the present invention is not limited to these.
Regarding the functional group containing an ester group, the functional group containing a ketone group, and the functional group containing an ether group, the structure is not particularly limited as long as it is a functional group having these groups. Preferable specific examples of the functional group containing an epoxy group include a functional group having a glycidyl ether group, but the structure is not particularly limited as long as it is a functional group having an epoxy group.

  Although the substitution amount of the polar group is not particularly limited, it is preferably 3 to 70 mol%, particularly preferably 5 to 40 mol% of the whole norbornene-based resin. When the substitution amount is within the above range, the dielectric constant is particularly excellent. Further, the norbornene-based resin having a polar group in such a side chain is obtained by, for example, 1) introducing a compound having the polar group into the norbornene-based resin by a modification reaction, and 2) a monomer having the polar group. 3) by copolymerizing the monomer having the polar group as a copolymer component with other components, or 4) copolymerizing the monomer having the polar group such as an ester group. After copolymerization as a component, it can be obtained by hydrolyzing the ester group.

［式（２）中のＸは、-ＣＨ₂-、-ＣＨ₂ＣＨ₂-、または-Ｏ-を示し、Ｒ１、Ｒ２、Ｒ３、Ｒ４はそれぞれ独立して水素原子、炭化水素基、炭素数１〜１２の極性基を示し、該極性基は直鎖もしくは分岐したアルキル基、アルケニル基、アルキニル基、ビニル基、アリル基、アラルキル基、環状脂肪族基、アリール基、エーテル基により結合されていても良い。
ｎは０から２の整数を示し、その繰り返しは異なっていても良い。］ As a norbornene-type monomer used in order to manufacture the norbornene-type resin used by this invention, the norbornene-type monomer represented by General formula (2) is preferable.

[X in the formula (2) _{is, -CH 2 -, - CH 2} CH 2 -, or -O- are shown, R1, R2, R3, R4 each independently represent a hydrogen atom, a hydrocarbon group, the number of carbon atoms 1 to 12 polar groups, which are bonded by a linear or branched alkyl group, alkenyl group, alkynyl group, vinyl group, allyl group, aralkyl group, cycloaliphatic group, aryl group, ether group. May be.
n represents an integer of 0 to 2, and the repetition may be different. ]

Examples of the cyclic olefin monomer used for producing the norbornene resin used in the present invention include those having an alkyl group, such as 5-methyl-2-norbornene, 5-ethyl-2-norbornene, and 5-propyl-. 2-norbornene, 5-butyl-2-norbornene, 5-pentyl-2-norbornene, 5-hexyl-2-norbornene, 5-heptyl-2-norbornene, 5-octyl-2-norbornene, 5-nonyl-2- Examples of those having an alkenyl group such as norbornene and 5-decyl-2-norbornene include 5-allyl-2-norbornene, 5-methylidene-2-norbornene, 5-ethylidene-2-norbornene and 5-isopropylidene-2- Norbornene, 5- (2-propenyl) -2-norbornene, 5- (3-butenyl) -2-norbornene, 5- (1-methyl-2-propenyl) -2-no Bornene, 5- (4-pentenyl) -2-norbornene, 5- (1-methyl-3-butenyl) -2-norbornene, 5- (5-hexenyl) -2-norbornene, 5- (1-methyl-4 -Pentenyl) -2-norbornene, 5- (2,3-dimethyl-3-butenyl) -2-norbornene, 5- (2-ethyl-3-butenyl) -2-norbornene, 5- (3,4-dimethyl) -4-pentenyl) -2-norbornene, 5- (7-octenyl) -2-norbornene, 5- (2-methyl-6-heptenyl) -2-norbornene, 5- (1,2-dimethyl-5-hexenyl) ) -2-norbornene, 5- (5-ethyl-5-hexenyl) -2-norbornene, 5- (1,2,3-trimethyl-4-pentenyl) -2-norbornene and the like having an alkynyl group 5-ethynyl-2-norbornene and the like having an alkoxysilyl group For example, dimethylbis ((5-norbornen-2-yl) methoxy)) silane and the like having silyl groups include 1,1,3,3,5,5-hexamethyl-1,5-dimethylbis. Examples of those having an aryl group such as ((2- (5-norbornene-2-yl) ethyl) trisiloxane) include 5-phenyl-2-norbornene, 5-naphthyl-2-norbornene, and 5-pentafluorophenyl-2- Examples of those having an aralkyl group such as norbornene include 5-benzyl-2-norbornene, 5-phenethyl-2-norbornene, 5-pentafluorophenylmethane-2-norbornene, 5- (2-pentafluorophenylethyl) -2 Examples of those having an alkoxysilyl group such as 5-norbornene and 5- (3-pentafluorophenylpropyl) -2-norbornene include 5-trimethoxysilyl 2-norbornene, 5-triethoxysilyl-2-norbornene, 5- (2-trimethoxysilylethyl) -2-norbornene, 5- (2-triethoxysilylethyl) -2-norbornene, 5- (3- Trimethoxypropyl) -2-norbornene, 5- (4-trimethoxybutyl) -2-norbornene, 5-trimethylsilylmethyl ether-2-norbornene, etc., hydroxyl group, ether group, carboxyl group, ester group, acryloyl group or methacryloyl As the group having a group, 5-norbornene-2-methanol and its alkyl ether, acetic acid 5-norbornene-2-methyl ester, propionic acid 5-norbornene-2-methyl ester, butyric acid 5-norbornene-2-methyl ester , Valeric acid 5-norbornene-2-methyl ester, caproic acid 5-norbornene-2-me Chill esters, caprylic acid 5-norbornene-2-methyl ester, capric acid 5-norbornene-2-methyl ester, lauric acid 5-norbornene-2-methyl ester, stearic acid 5-norbornene-2-methyl ester, oleic acid 5- Norbornene-2-methyl ester, linolenic acid 5-norbornene-2-methyl ester, 5-norbornene-2-carboxylic acid, 5-norbornene-2-carboxylic acid methyl ester, 5-norbornene-2-carboxylic acid ethyl ester, 5 -Norbornene-2-carboxylic acid t-butyl ester, 5-norbornene-2-carboxylic acid i-butyl ester, 5-norbornene-2-carboxylic acid trimethylsilyl ester, 5-norbornene-2-carboxylic acid triethylsilyl ester, 5- Norbornene-2-carboxylic acid isobornyl ester, 5-norbornene-2- Rubonic acid 2-hydroxyethyl ester, 5-norbornene-2-methyl-2-carboxylic acid methyl ester, cinnamic acid 5-norbornene-2-methyl ester, 5-norbornene-2-methylethyl carbonate, 5-norbornene- 2-methyl n-butyl carbonate, 5-norbornene-2-methyl t-butyl carbonate, 5-methoxy-2-norbornene, (meth) acrylic acid 5-norbornene-2-methyl ester, (meth) acrylic acid 5 -Norbornene-2-ethyl ester, (meth) acrylic acid 5-norbornene-2-n-butyl ester, (meth) acrylic acid 5-norbornene-2-n-propyl ester, (meth) acrylic acid 5-norbornene-2 -i-butyl ester, (meth) acrylic acid 5-norbornene-2-i-propyl ester, (meth) acrylic acid 5-norbornene-2-hexyl 5-[(2,3-epoxypropoxy) is a compound having an epoxy group, such as ester, (meth) acrylic acid 5-norbornene-2-octyl ester, (meth) acrylic acid 5-norbornene-2-decyl ester, etc. Methyl] -2-norbornene and the like, and those composed of a tetracyclo ring, include 8-methoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-ethoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-n-propylcarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-i-propylcarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-n-butoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8- (2-methylpropoxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8- (1-methylpropoxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-t-butoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-cyclohexyloxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8- (4′-t-butylcyclohexyloxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-phenoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-tetrahydrofuranyloxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] -3-dodecene, 8-tetrahydropyranyloxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-methoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-ethoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-n-propoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-i-propoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-n-butoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8- (2-methylpropoxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8- (1-methylpropoxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-t-butoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-cyclohexyloxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8- (4′-t-butylcyclohexyloxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-phenoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-tetrahydrofuranyloxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyl-8-tetrahydropyranyloxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] -3-dodecene, 8-methyl-8-acetoxytetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (methoxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (ethoxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (n-propoxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (i-propoxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (n-butoxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (t-butoxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (cyclohexyloxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (phenoxyloxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8,9-di (tetrahydrofuranyloxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] -3-dodecene, 8,9-di (tetrahydropyranyloxycarbonyl) tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] -3-dodecene, 8,9-tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene-8-carboxylic acid, 8-methyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene-8-carboxylic acid, 8-methyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-ethyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyltetracyclo [4.4.0.1 ^2,5 . 0 ^1,6 ] dodec-3-ene, 8-ethylidenetetracyclo [4.4.0.1 ^2,5 . 1 ^7,12] Dodekku-3-ene, 8-ethylidene tetracyclo [4.4.0.1 ^{2, 5.} 1 ^7,10 0 ^1,6 ] dodec-3-ene and the like.

  When the norbornene-based resin used in the present invention has a side chain substituent, it can generally be obtained by directly polymerizing the norbornene-type monomer having the above-mentioned substituent. A similar polymer can be obtained by a method of introducing a substituent. As the modification reaction, for example, in the case of an epoxy group, an epoxy group-containing unsaturated monomer is grafted to the polymer, and a compound having an epoxy group is reacted in the reactive functional group portion of the polymer. There are known methods such as direct epoxidation of the polymer having a carbon-carbon double bond using an epoxidizing agent such as peracid or hydroperoxide.

［R¹は脂肪族、芳香族、ヘテロ原子等、又はこれらの組み合わせ、
R²、R³は水素原子、脂肪族、芳香族、ヘテロ原子等、又はこれらの組み合わせ］ The benzocyclobutene resin used in the present invention is a benzocyclobutene resin containing a structure represented by the following general formula (3) or a prepolymerized structure thereof.

[R ¹ is aliphatic, aromatic, heteroatom, or a combination thereof,
R ² and R ³ are a hydrogen atom, aliphatic, aromatic, heteroatom, or a combination thereof.

A benzocyclobutene resin that has been prepolymerized is preferably used for adjusting moldability, and is included in the benzocyclobutene resin of the present invention. The number average molecular weight of the prepolymerized benzocyclobutene resin is usually 500 or more, preferably 3,000 to 1,000,000. The number average molecular weight can be measured using, for example, gel permeation chromatography (GPC).
Since the benzocyclobutene resin does not generate a functional group having a large polarizability such as a hydroxyl group by a curing reaction, the dielectric property is very excellent and the water absorption is low. Moreover, since it has a rigid chemical structure, it has excellent heat resistance.
The fluorinated polyimide resin used in the present invention is not limited as long as it has fluorine-containing substituents such as fluorine atoms and fluorinated organic groups in the side chain and fluorinated organic groups in the main chain. It preferably has a repeating unit represented by the following formula (4).

［式（４）中のＹは、下記構造式（５）で表される基よりなる群から選択される有機基を示す。］

[Y in Formula (4) represents an organic group selected from the group consisting of groups represented by the following Structural Formula (5). ]

［式（５）中のＡは、水素原子又はアルキル基、Ｒｆ₃は−Ｃ_mＦ_2m+1（但し、mは１〜１０の整数を示す）、Ｚは酸素原子、イオウ原子又は単結合、Ｒｆ₄は下記式（６）で表される基よりなる群から選択される有機基を示す。］

[A in the formula (5) is a hydrogen atom or an alkyl group, Rf ₃ is -C _m F _{2m + 1} (where, m is an integer of 1 to 10), Z is an oxygen atom, a sulfur atom or a single bond , Rf ₄ represents an organic group selected from the group consisting of groups represented by the following formula (6). ]

［式中のｎは６〜１０の整数を示す。］

[N in the formula represents an integer of 6 to 10. ]

  Among the fluorinated polyimide resins, preferred are 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropanoic acid dianhydride as the acid anhydride constituting the fluorinated polyimide resin, and fluorine. 2,2-bis (trifluoromethyl) -4,4'-diaminobiphenyl, 2,2-bis [4- (4-aminophenoxy) phenyl] -hexafluoropropane , 2-bis (3-amino-4-hydroxyphenyl) -hexafluoropropane, 2,2-bis (3-amino-4-methyl) -hexafluoropropane, 2,2-bis (4-aminophenyl)- Examples include hexafluoropropane. These may be used alone or in combination of two or more. Since the fluorinated polyimide contains fluorine, both the dielectric constant and the dielectric loss tangent are superior to those of other polyimides, and also excellent in heat resistance and flame retardancy.

The weight average molecular weight of the fluorinated polyimide resin is not particularly limited, but is preferably 1,000 to 1,000,000, particularly preferably 5,000 to 500,000, and most preferably 10,000 to 250,000. When the weight average molecular weight (Mw) is within the above range, the heat resistance, the smoothness of the surface of the molded article and the like are excellent in balance.
The weight average molecular weight can be evaluated in terms of polystyrene measured by, for example, gel permeation chromatography (GPC) using cyclohexane or toluene as an organic solvent.

  The resin composition of the present invention can be obtained by blending at least silica having an average particle size of 3 μm or less, a polybutadiene resin, and a low dielectric constant resin. In this case, a part of each functional group may react and the components may be covalently bonded.

  Examples of the laser processability-imparting agent used in the resin composition of the present invention include triazole compounds, triazine compounds, benzophenone compounds, and azide compounds. Examples of triazole compounds include 2- (3-t- Butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-5-octylphenyl) -benzotriazole and 2- [2-hydroxy-3,5-bis (α, α -Dimethylbenzyl) phenyl] -2H-benzotriazole and the like, and examples of the triazine compound include 2- [4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine-2yl. ] -5- (octyloxy) phenol and 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5 [(hexyl) oxy] -phenol Examples of the benzophenone compound include 2-hydroxy-4-n-octoxybenzophenone and 4,4- (dimethylamino) benzophenone. Examples of the azide compound include 2,6 -Bis (4'-azidobenzal) -4-methyl-cyclohexanone, 2,6-bis (4'-azidobenzal) -4-ethyl-cyclohexanone, 4,4'-diazidodiphenylsulfone and 4,4'-diazide A benzophenone etc. are mentioned, It is not limited to these, It can use even if it combines 1 type or 2 types or more. Among these, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5 [(hexyl) oxy] -phenol or 2,6-bis for improving laser processability (4′-azidobenzal) -4-methyl-cyclohexanone is more preferred. As the content of the laser imparting agent used in the present invention, in the case of the cyclic olefin resin and the benzocyclobutene resin, which are the main components, 0.1 to 15% by weight of each resin component is particularly preferable, 10% by weight is preferred. When the content is within this range, both electrical characteristics and laser processability are particularly excellent.

The resin composition of the present invention may further contain an inorganic filler other than spherical fused silica for the purpose of improving heat resistance, physical properties and the like.
Examples of inorganic fillers other than spherical fused silica include silicates such as talc, calcined clay, unfired clay, mica and glass, oxides such as titanium oxide, alumina and crystalline silica, calcium carbonate, magnesium carbonate and hydro Carbonates such as talcite, hydroxides such as aluminum hydroxide, magnesium hydroxide and calcium hydroxide, sulfates or sulfites such as barium sulfate, calcium sulfate and calcium sulfite, zinc borate, barium metaborate, boric acid Examples thereof include borates such as aluminum, calcium borate and sodium borate, and nitrides such as aluminum nitride, boron nitride and silicon nitride.

The average particle diameter of the inorganic filler is not particularly limited, but is preferably 3 μm or less, like the fused silica that is an essential component. When the average particle diameter is within the above range, the circuit embedding property in the resin layer of the wiring board is particularly excellent.
Although content of the said inorganic filler is not specifically limited, 10 weight% or less of the whole said resin composition is preferable. When the content is within the above range, both electrical characteristics and low linear expansion are excellent.

  In the resin composition of the present invention, a light and / or thermal polymerization initiator can be further added. This makes it easy to react and crosslink functional groups such as double bond sites and epoxy groups in cyclic olefin resins by light irradiation and / or heating, and improve adhesion to circuit boards by subsequent curing. Can be made.

Examples of the photo and / or thermal polymerization initiator include benzophenones such as benzophenone, benzoylbenzoic acid, 4-phenylbenzophenone and hydroxybenzophenone, and benzoin alkyls such as benzoin ethyl ether, benzoin isopropyl ether, benzoin butyl ether and benzoin isobutyl ether. Ethers, acetophenones such as 4-phenoxydichloroacetophenone and diethoxyacetophenone, thioxanthones such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone and 2,4-dimethylthioxanthone, ethylanthraquinone and butylanthraquinone And alkyl anthraquinones.
Also, azobisisobutyronitrile, isobutyryl peroxide, diisopropyl peroxydicarbonate, t-hexylperoxy-2-ethylhexanoate, 1,1,3,3-tetramethylbutylperoxy-2- Mention may be made of organic peroxides such as ethyl hexanoate, dicumyl peroxide, t-butyl cumyl peroxide and t-butyl hydroperoxide.

  Further, when a photoacid generator is used as the photo and / or thermal polymerization initiator, functional groups such as epoxy groups and alkoxysilyl groups are cross-linked and adhesion with the substrate is improved by subsequent curing. Preferred photoacid generators are onium salts, halogen compounds, sulfates and mixtures thereof. For example, onium salts include diazonium salts, ammonium salts, iodonium salts, sulfonium salts, phosphates, arsonium salts, oxonium salts, and the like. The counter anion of the onium salt is not limited as long as it is a compound that can form an onium salt and a counter anion. Examples of the counter anion include, but are not limited to, boric acid, phosphoric acid, antimonic acid, sulfate, carboxylic acid and its chloride. Examples of onium salt photoacid generators include triphenylsulfonium tetrafluorophosphate, triphenylsulfonium tetrafluorosulfate, 4-thiophenoxydiphenylsulfonium tetrafluoroborate, 4-thiophenoxydiphenylsulfonium tetrafluoroantimony. 4-thiophenoxydiphenylsulfonium tetrafluoroarsenate, 4-thiophenoxydiphenylsulfonium tetrafluorophosphate, 4-thiophenoxydiphenylsulfonium tetrafluorosulfonate, 4-t-butylphenyldiphenylsulfate Phonium tetrafluoroborate, 4-t-butylphenyldiphenylsulfonium tetrafluorosulfonium, 4-t-butylphenyldiphenylsulfone Um tetrafluoroantimonate, 4-t-butylphenyldiphenylsulfonium trifluorophosphonate, 4-t-butylphenyldiphenylsulfonium trifluorosulfonate, tris (4-methylphenyl) sulfonium trifluoroborate, Tris (4-methylphenyl) sulfonium tetrafluoroborate, tris (4-methylphenyl) sulfonium hexafluoroarsenate, tris (4-methylphenyl) sulfonium hexafluorophosphate, tris (4-methylphenyl) ) Sulfonium hexafluorosulfonate, Tris (4-methoxyphenyl) sulfonium tetrafluoroborate, Tris (4-methylphenyl) sulfonium hexafluorantimonate, Tris (4-methylphenol) Nyl) sulfonium hexafluorophosphate, tris (4-methylphenyl) sulfonium trifluorosulfonate, triphenyliodonium tetrafluoroborate, triphenyliodonium hexafluoroantimonate, triphenyliodonium hexafluoroarsenate, triphenyl Iodonium hexafluorophosphate, triphenyliodonium trifluorosulfonate, 3,3-dinitrodiphenyliodonium tetrafluoroborate, 3,3-dinitrodiphenyliodonium hexafluoroantimonate, 3,3-dinitrodiphenyliodonium hexafluoroarsenate, 3 , 3-Dinitrodiphenyliodonium trifluorosulfonate, 4,4-dinitrodiphenyliodonium Tetrafluoroborate, 4,4-dinitrodiphenyliodonium hexafluoroantimonate, 4,4-dinitrodiphenyliodonium hexafluoroarsenate, 4,4-dinitrodiphenyliodonium trifluorosulfonate, 4,4'-di-t-butyl Phenyliodonium triflate, 4,4 ′, 4 ″ -tris (t-butylphenyl) sulfonium triflate, diphenyliodonium tetrakis (pentafluorophenyl) borate, triphenylsulfonium diphenyliodonium tetrakis (pentafluorophenyl) borate 4,4′-di-t-butylphenyliodonium tetrakis (pentafluorophenyl) borate, tris (t-butylphenyl) sulphoniumtetrakis (pentafluoropheny) ) Borate, (4-methylphenyl) (4- (1-methylethyl) phenyl) iodonium tetrakis (pentafluorophenyl) borate and 4- (2-methylpropyl) phenyl (4-methylphenyl) iodonium hexafluorophosphate Is mentioned. These may be used alone or in combination.

  Among these, as the photoacid generator, 4,4′-di-t-butylphenyliodonium triflate, 4,4 ′, 4 ″ -tris (t-butylphenyl) sulfonium triflate, diphenyliodonium Tetrakis (pentafluorophenyl) borate, triphenylsulfonium diphenyliodonium tetrakis (pentafluorophenyl) borate, 4,4′-di-t-butylphenyliodonium tetrakis (pentafluorophenyl) borate, tris (t-butylphenyl) sulfur Phonimtetrakis (pentafluorophenyl) borate, (4-methylphenyl) (4- (1-methylethyl) phenyl) iodonium tetrakis (pentafluorophenyl) borate and 4- (2-methylpropyl) phenyl (4-methylphenyl) Yaw And hexafluorophosphate, mixtures thereof, and more preferable.

  In the resin composition of the present invention, as a component other than the above components, an ultraviolet absorber, a light stabilizer and an antioxidant can be used as a stabilizer. Examples of the ultraviolet absorber include p-methoxycinnamic acid, 2-hydroxy-4-methoxybenzophenone, 4-dihydroxybenzophenone, 2,2′-dihydroxy-4,4′-dihydroxy, 2-hydroxy-4- Examples include methoxybenzophenone, 2-hydroxybenzotriazole, 2- (2′-hydroxy3 ′, 5′-di-t-butylphenyl) benzotriazole and 2-ethylhexyl-2-cyano-3,3′-diphenylacrylate. It is done.

  Examples of the light stabilizer include bis (1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl) sebacate and dimethyl-1- (2-hydroxyethyl) -4-succinate. Hydroxy-2,2,6,6-tetramethylpiperidine polycondensate, poly [[6- (1,1,3,3-tetramethylbutyl) amino-1,3,5-triazine-2,4-] Examples include hindered amines such as [(2,2,6,6-tetramethyl-4-piperidyl) imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imino]].

  Examples of the antioxidant include triethylene glycol-bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate], octylated diphenylamine, octadecyl-3- (3,5 -Di-t-butyl-4-hydroxyphenyl) propionate, 3,5-di-t-butyl-4-hydroxybenzyl phosphonate-diethyl ester, tris (2,4-di-t-butylphenyl) phosphite 2-[[2,4,8,10-tetrakis (1,1-dimethylether) dibenzo [d, f] [1,3,2] dioxaphosphin 6-yl] oxy] -N, N -Bis [2-[[2,4,8,10-tetrakis (1,1dimethylethyl) dibenzo [d, f] [1,3,2,] dioxaphosphin-6-yl] oxy]- Ethyl] Ethanamine and other pheno Le systems include phosphorus-based antioxidants. These can be used alone or in admixture of two or more. The content of these stabilizers is preferably 0.01 to 10 parts by weight with respect to 100 parts by weight of the cyclic olefin resin.

  If necessary, the resin composition of the present invention further includes a curing agent such as an ionic curing agent or a radical curing agent, a curing accelerator, a curing aid, a flame retardant, a leveling agent, a coupling agent, a lubricant, and Additives such as dyes and pigments, reactive diluents, solvents, resins other than the above resins, oligomers, and the like can be included.

  Since the resin composition of the present invention has excellent electrical characteristics and laser processability, it is suitable not only for wiring boards such as printed wiring boards and multilayer wiring boards but also for insulators such as semiconductor devices and liquid crystal display devices. . In particular, when used in an insulating layer of a multilayer wiring board that requires uniformity in thickness and surface smoothness in an interlayer insulating layer, the multilayer wiring board has stable high-speed transmission characteristics because of excellent circuit embedding and surface smoothness. Can be provided.

Next, a resin layer and a laminated body are demonstrated.
FIG. 1 is a cross-sectional view schematically showing an example of the laminate of the present invention.
The laminate 1 is formed by laminating a resin layer 3 composed of the above resin composition and a carrier film 2.
The resin layer composed of the resin composition can be used as an insulating layer having electrical characteristics that enable high-speed transmission of electronic devices and characteristics that are excellent in laser processability.
Although the thickness of the resin layer 3 comprised with a resin composition is not specifically limited, 0.1-60 micrometers is preferable and 1-40 micrometers is especially preferable. The thickness of the resin layer composed of the resin composition is preferably not less than the lower limit for improving insulation reliability, and the upper limit for achieving thinning, which is one of the purposes in a multilayer wiring board. Below the value is preferred.

  The carrier film 2 is preferably a metal foil that can be used as a conductor layer such as copper or aluminum, or a resin film that can be easily peeled off from the resin layer 2 made of a resin composition with an appropriate strength. Examples of the resin film include films made of polyester, aromatic polyimide, polyethylene, and the like. Among these carrier films, a film made of polyester is most preferable. Thereby, it becomes particularly easy to peel from the resin layer 3 composed of the resin composition with an appropriate strength. It also has excellent stability against reactive diluents. Furthermore, migration of the resin composition component dissolved in the reactive diluent and the solvent to the carrier film can be prevented. Moreover, although the thickness of the carrier film 2 is not specifically limited, 10-200 micrometers is preferable and especially 20-100 micrometers is preferable. When the thickness of the carrier film is within the above range, the flatness of the resin layer on the circuit in the wiring board is particularly excellent.

  As a method of laminating the resin layer 3 composed of the resin composition on the carrier film 2, for example, the resin composition is dissolved in a solvent or the like to form a varnish, which is applied to the carrier film 2 to form a resin layer. And the like. Examples of the application method include, for example, a method of applying or casting using a roll coater, bar coater, knife coater, gravure coater, die coater and curtain coater, a spraying method, a dipping method, a printing machine, A drawing method using a vacuum printing machine and a dispenser, and spin coating may be used in some cases. Among these, a method using a die coater is preferable. Thereby, the laminated body 1 which has predetermined | prescribed thickness can be produced stably.

  Specifically, as a method for producing the laminate 1, for example, a resin composition dissolved in a solvent is applied to the carrier film 2 with a thickness of about 1 to 100 μm, and the coating layer is formed by, for example, 80 It is dried at ˜200 ° C. for 20 seconds to 30 minutes, and preferably the residual solvent amount is 1.0% by weight or less. Thereby, the laminated body 1 by which the resin layer 3 comprised with the resin composition was laminated | stacked on the carrier film 2 can be obtained.

  The resin layer obtained in this way is excellent in processability and electrical characteristics, for example, can have a level difference of surface irregularities of 0.5 μm or less, has excellent surface smoothness, and is 3. A dielectric constant of 0 or less and a dielectric loss tangent of 0.006 or less can be achieved, and a coefficient of linear expansion of 50 ppm / ° C. or less is obtained, resulting in low thermal expansion.

Next, the wiring board will be described.
FIG. 2 is a cross-sectional view showing an example of the wiring board of the present invention.
As illustrated in FIG. 2, the wiring board 10 includes a core substrate 5 and a resin layer 3 provided on both surfaces of the core substrate 5.
The core substrate 5 is formed with an opening 51 opened by a drilling machine. Conductor circuits 52 are formed on both surfaces of the core substrate 5.
The inside of the opening 51 is plated, and the conductor circuits 52 on both surfaces of the core substrate 5 are conducted.

The resin layer 3 is provided on both surfaces of the core substrate 5 so as to cover the conductor circuit 52. An opening 31 formed by laser processing is formed in the resin layer 3.
In addition, second conductor circuits 32 are formed on both surfaces of the resin layer 3.
The conductor circuit 52 and the second conductor circuit 32 are electrically connected through the opening 31.

  A method for manufacturing such a wiring board will be described with reference to FIG. 3. For example, after opening the opening 102 by drilling the core substrate (for example, FR-4 double-sided copper foil) 107 with a drilling machine. Then, the opening 102 is plated by electroless plating so that both surfaces of the core substrate 107 are electrically connected. Then, the conductor circuit 101 is formed by etching the copper foil of the core substrate 107 (FIG. 3A).

  The material of the conductor circuit 101 may be any material as long as it is suitable for this manufacturing method, but is preferably removable by a method such as etching or peeling in the formation of the conductor circuit. Those having resistance to the chemicals used in this are preferred. Examples of the material of the conductor circuit 101 include copper, copper alloy, 42 alloy, nickel, and the like. In particular, the copper foil, the copper plate, and the copper alloy plate are most preferable for use as the conductor circuit 101 because not only electrolytic plated products and rolled products can be selected, but also various thicknesses can be easily obtained.

Next, a resin layer 104 is formed so as to cover the conductor circuit 101 (FIG. 3B). The resin layer 104 may be formed by directly applying the resin composition of the present invention to the insulating layer forming surface, pressing the above laminate (resin layer with a carrier film), vacuum pressing, or ordinary Examples thereof include a method of forming a resin layer 104 by laminating using a pressure laminator, a vacuum laminator, a becquerel type laminating apparatus, or the like.
Moreover, when a metal layer is used as the carrier film, the metal layer can be processed as a conductor circuit.

  Next, when a laminate (resin layer with a carrier film) is used for resin layer formation, the formed resin layer 104 is heated and cured after peeling the carrier film. The temperature for heating and curing is preferably in the range of 150 ° C to 300 ° C. In particular, 150-250 degreeC is preferable. The first resin layer 104 is heated and semi-cured, and one or more resin layers 104 are further formed on the resin layer 104, and the semi-cured resin layer 104 is heat-cured again to such an extent that there is no practical problem. Thereby, the adhesive force between the resin layers 104 and between the resin layer 104 and the conductor circuit 101 can be improved. The semi-curing temperature in this case is preferably 100 ° C to 250 ° C, more preferably 150 ° C to 200 ° C.

Next, the resin layer 104 is irradiated with a laser to form an opening 105 (FIG. 3C). As the laser, an excimer laser, a UV laser, a carbon dioxide gas laser, or the like can be used. Formation of the opening 105 by the laser can easily form a fine opening 105 regardless of whether the resin layer 104 is photosensitive or non-photosensitive. Therefore, it is particularly preferable when the resin layer 104 needs to be finely processed.
Next, the conductor circuit 106 is formed (FIG. 3D). The conductive circuit 106 can be formed by a known method such as a semi-additive method.
Next, the conductor post 107 is formed (FIG. 3E). As a method of forming the conductor post 107, it can be formed by a known method such as electrolytic plating. For example, copper electroplating can be performed using the conductive circuit 106 as a lead for electrolytic plating, and the copper post can be formed by filling with copper. By this method, a wiring board can be obtained.
In the step of obtaining the wiring board, a multilayer wiring board can be obtained by repeating the steps shown in FIGS. 3B to 3E.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example and a comparative example, this invention is not limited to this.

Synthesis of norbornene resin A Polymer A was synthesized as a cyclic olefin resin by the following method.
16.4 g (0.07 mol) of 5-decyl-2-norbornene, 5.41 g of 5-methylglycidyl ether-2-norbornene (0) in a reaction vessel sufficiently filled with an inert gas nitrogen. 0.03 mol), and 130 g of ethyl acetate and 115 g of cyclohexane (0.53 M) were charged as polymerization solvents. Next, a catalyst solution in which 0.69 g (1.4 × 10 ⁻³ mol) of a transition metal catalyst (η6-toluenenickel bis (pentafluorophenyl)) was dissolved in 5 g of toluene was charged into the reaction vessel and stirred at room temperature for 4 hours. After the polymerization, the polymerization solution was put into a mixed solution of 47 ml of glacial acetic acid, 87 ml of 30% hydrogen peroxide water, and 300 ml of pure water, and stirred for 2 hours to make the transition metal catalyst of the aqueous layer and the organic layer of the resin solution. The aqueous layer of the separated solution was removed, the organic layer was washed several times with pure water, and the resin solution was poured into methanol to precipitate a norbornene-based resin. A norbornene resin A was obtained.

-Synthesis of fluorinated polyimide resin B 791 g of dehydrated and purified N-methyl-2-pyrrolidone (NMP) was placed in a four-necked flask equipped with a dry nitrogen gas inlet tube, a cooler, a thermometer, and a stirrer, and nitrogen gas was added. Stir vigorously for 10 minutes. Next, 2,2-bis (4- (4-aminophenoxy) phenyl) propane (BAPP) 73.8926 g (0.180 mol), 1,3-bis (3-aminophenoxy) benzene 17.5402 g (0 .060 mol), α, ω-bis (3-aminopropyl) polydimethylsiloxane 50.2200 g (average molecular weight 837, 0.060 mol) is added and the system is heated to 60 ° C. and stirred until uniform. . After homogeneous dissolution, the system was cooled to 5 ° C. with an ice-water bath, and 43.1330 g (0.150 mol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride (BPDA), 3,3 ′ , 4,4′-benzophenonetetracarboxylic dianhydride (BTDA) 44.110 g (0.150 mol) was added as a powder over 15 minutes, and stirring was continued for 3 hours. During this time, the flask was kept at 5 ° C.
Thereafter, the nitrogen gas inlet tube and the cooler were removed, a Dean-Stark tube filled with xylene was attached to the flask, and 198 g of xylene was added to the system. Instead of the oil bath, the system was heated to 175 ° C., and generated water was removed from the system. When heated for 4 hours, no water was observed from the system. After cooling, this reaction solution was put into a large amount of methanol to precipitate polyimidesiloxane. The solid content was filtered and then dried under reduced pressure at 80 ° C. for 12 hours to remove the solvent, and 227.79 g (yield 92.1%) of fluorinated polyimide resin B was obtained. When the infrared absorption spectrum was measured by the KBr tablet method, an absorption of 5.6 μm derived from a cyclic imide bond was observed, but an absorption of 6.06 μm derived from an amide bond could not be recognized. It was confirmed that it was almost 100% imidized.

・ Production of Laminate A resin solution obtained according to the formulation table of each example and comparative example was formed on a polyester film (Diafoil, MRX-50, thickness 50 μm) as a carrier film with a roll coater. Was applied to form a resin layer. Thereafter, drying was performed at 80 ° C. for 10 minutes and at 140 ° C. for 10 minutes to obtain a laminate including a resin layer with a carrier film.

-Preparation of a wiring board The wiring board was created in the following way using the laminated body (resin layer with a carrier film) obtained above.
1) Formation of inner layer circuit and insulating layer Using a double-sided copper-clad laminate (ELC-4781 manufactured by Sumitomo Bakelite Co., Ltd.) with a total thickness of 0.3 mm and a copper foil thickness of 12 μm, a hole is opened with a drilling machine. Thereafter, the opening portions were plated by electroless plating to achieve conduction between the upper and lower copper foils, and the inner layer conductor circuits were formed on both surfaces by etching the copper foils on both sides of the laminate.
Next, the inner layer conductor circuit is sprayed with a chemical solution mainly composed of hydrogen peroxide and sulfuric acid (Tech SO-G manufactured by Asahi Denka Kogyo Co., Ltd.) to form irregularities by roughening treatment. The resin layer surface of the laminate obtained in Example I-1 was aligned with the conductor circuit surface, the conductor circuit was embedded using a vacuum laminator, and a baking process was performed at 200 ° C. for 60 minutes to form an insulating layer.

2) Formation of laser processing and outer layer circuit Next, a UV-YAG laser device (ML605LDX manufactured by Mitsubishi Electric Corporation) is used to form an opening (blind via hole) of φ40 μm, and desmear treatment of the bottom of the opening (Nippon McDermid Co., Ltd. Macudizer series), electroless copper plating (Uemura Kogyo Sul Cup PRX) was performed for 15 minutes to form a 0.5 μm thick feed layer on the laminate surface . Next, a 25 μm thick UV-sensitive dry film (AQ-2558 manufactured by Asahi Kasei Co., Ltd.) is pasted on the surface of the power supply layer with a hot roll laminator, and a pattern with a minimum line width / line spacing of 20/20 μm is drawn. Using the chrome vapor deposition mask (made by Towa Process Co., Ltd.), alignment was performed, and exposure was performed using an exposure apparatus (UX-1100SM-AJN01 made by USHIO INC.). Development was performed with a sodium carbonate aqueous solution to form a plating resist.

Next, electrolytic copper plating (Okuno Pharmaceutical Co., Ltd. 81-HL) was performed at 3 A / dm ² for 30 minutes using the power feeding layer as an electrode to form a copper wiring having a thickness of about 20 μm. Here, the plating resist was peeled off using a two-stage peeling machine. Each chemical solution has a monoethanolamine solution (R-100 manufactured by Mitsubishi Gas Chemical Co., Ltd.) for the first-stage alkaline aqueous solution layer, and potassium permanganate and sodium hydroxide for the second-stage oxidizing resin etchant. An aqueous solution (Mc. Dither 9275, 9276 manufactured by Nippon McDermid Co., Ltd.) as the main component and an acidic amine aqueous solution (Mc. Dicer 9279 manufactured by Nippon McDermid Co., Ltd.) were used for neutralization.

  Next, the power feeding layer was dipped in an ammonium persulfate aqueous solution (AD-485 manufactured by Meltex Co., Ltd.) to remove it by etching and ensure insulation between the wirings. Finally, a dry film type solder resist (CFP-1121 manufactured by Sumitomo Bakelite Co., Ltd.) was formed on the circuit surface while embedding the circuit with a vacuum laminator, and finally a wiring board was obtained.

・ Evaluation items and evaluation methods (1) Electrical characteristics (dielectric constant, dielectric loss tangent)
Dielectric characteristics at a frequency of 10 GHz were measured. As a measuring instrument, a cylindrical cavity resonator (manufactured by Agilent Technologies, microwave network analyzer HP8510B) was used. In addition, the sample for a measurement used the resin layer film obtained by removing a carrier film from a laminated body, and heat-processing at 200 degreeC for 1 hour with the drying machine in nitrogen atmosphere subsequently.

(2) Coefficient of linear expansion Remove the carrier film from the laminate, and then heat-treat at 180 ° C for 2 hours with a drier in a nitrogen atmosphere, and use the resin layer film obtained as a measurement sample for TMA measurement in tensile mode. Machine (manufactured by Seiko Instruments Inc.), and the average linear expansion coefficient between 30 ° C. and 150 ° C. was determined.

(3) Bending resistance The carrier film is removed from the laminate, and then a resin layer film obtained by heat treatment at 180 ° C. for 2 hours with a dryer in a nitrogen atmosphere is used as a measurement sample, and cylindrical shapes of various sizes are used. Abnormalities such as cracks were confirmed by bending 180 degrees with a mandrel.
◎: No abnormality with 3 mm diameter cylindrical mandrel ○: No abnormality with 5 mm diameter cylindrical mandrel △: No cracking with 4 mm diameter cylindrical mandrel △: No abnormality with 10 mm diameter cylindrical mandrel, No cracking with 8 mm diameter cylindrical mandrel ×: Cracks occur in a 10mm cylindrical mandrel

(4) Workability On a circuit board having a circuit layer with line width / interline / thickness = 20 μm / 20 μm / 10 μm, the laminate obtained above is applied at a maximum temperature of 170 ° C. and a pressure of 1.96 × 10 ⁻ After laminating by vacuum press under the condition of ² MPa (20 kgf / cm ² ), the carrier film is peeled off and heat-treated at 200 ° C. for 1 hour with a dryer in a nitrogen atmosphere to cure the resin layer and form an insulating layer did. The obtained insulating layer was further evaluated for workability when a 100 μm 50 μm diameter via was opened with a UVYAG laser (manufactured by Mitsubishi Electric Corporation).
Each code is as follows.
◎: All target via diameters can be opened and there is no appearance problem. ○: 80% or more good via diameter and practically usable appearance. △: Less than 80% good via diameter and practically unusable. Poor appearance.

(5) Heat resistance The heat resistance was evaluated using a differential calorimetry (TG-DTA) at a temperature at which the weight decreased by 5%.
In addition, the sample heat-processed the laminated body at 200 degreeC for 1 hour, and peeled and used the resin layer.
Each code is as follows.
A: 350 ° C. or higher ○: 300-350 ° C.
Δ: 260-300 ° C
×: Less than 260 ° C

(6) Adhesiveness A 10 × 10 grid pattern is cut with a cutter knife into the insulating layer of the circuit board having the hardened insulating layer obtained in the above evaluation (3), and an adhesive tape is once applied thereon. I attached and peeled it off, and counted the number of squares that were peeled off.

(7) Circuit embedding property On the circuit board having a circuit layer with line width / line spacing / thickness = 5 μm / 5 μm / 10 μm, the laminate obtained above is subjected to a maximum attained temperature of 170 ° C. and a pressure of 1.96 × 10. ^-2 MPa (20 Kgf / cm ² ) After lamination by vacuum press, the carrier film is peeled off, heat treated at 200 ° C. for 1 hour with a drier in a nitrogen atmosphere, and the resin layer is cured to form an insulating layer. Formed. The obtained insulating layer was cut and the cross section was observed to observe the resin embedding condition and the filler dispersion condition. Each code is as follows.
○: No abnormalities in both resin filling property and filler dispersibility △: No abnormality in resin filling property, more than filler dispersibility between lines ×: There are unfilled portions of resin

(8) Connection reliability Connection reliability was determined by leaving it in an atmosphere of 30 ° C and 70% humidity for 1965 hours, then performing 260 ° C reflow three times, and a temperature cycle test (-40 ° C and 125 ° C for 30 minutes each, no exposure) ), And a continuity test was conducted every 100 cycles, and evaluation was made on the failure occurrence cycle.
Each code is as follows.
◎: 800 cycles or more ○: 500 to 800 cycles Δ: 100 to 500 cycles ×: less than 100 cycles

(9) Insulation reliability The insulation reliability was measured by measuring the insulation resistance value between conductors after being left for 100 hours in an atmosphere of 85 ° C. and 85% humidity. Each code is as follows.
◎: Insulation resistance value 10 ¹⁰ Ω or more ○: Insulation resistance value 10 ⁸ to 10 ⁹ Ω
Δ: Insulation resistance value 10 ⁷ to 10 ⁸ Ω
×: Insulation resistance value less than 10 ⁷

Example 1
60 g of silica B with an average particle size of 0.5 μm, 32 g of norbornene resin A, 5 g of polybutadiene A, and 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) as a laser processability imparting agent The resin solution was prepared by dissolving 3 g of -5-chlorobenzotriazole in 200 g of mesitylene, and a laminated board and a wiring board were prepared and evaluated according to the above procedure. The results are shown in Table 1.

(Example 2)
The same procedure as in Example 1 was carried out except that the amount of silica B was changed to 40 g and the blending amount of norbornene resin A was changed to 52 g.
(Example 3)
The same operation as in Example 1 was carried out except that the amount of silica B was changed to 75 g and the amount of norbornene resin A was changed to 17 g.

Example 4
The same operation as in Example 1 was carried out except that the amount of polybutadiene A was changed to 3 g and the amount of norbornene resin A was changed to 34 g.
(Example 5)
The same procedure as in Example 1 was performed except that the amount of polybutadiene A was changed to 7 g and the blending amount of norbornene resin A was changed to 30 g.

(Example 6)
The same procedure as in Example 1 was performed except that polybutadiene A was changed to polybutadiene B.
(Example 7)
The silica component was the same as Example 1 except that silica B was changed to 40 g and silica C was changed to 20 g.

(Example 8)
The silica component was the same as Example 1 except that silica B was changed to 50 g and silica C was changed to 10 g.
Example 9
The silica component was the same as Example 1 except that the silica A was changed to 60 g.

(Example 10)
The low dielectric constant resin was carried out in the same manner as in Example 1 except that the benzocyclobutene resin B was changed to 60 g.
(Example 11)
The same procedure as in Example 1 was performed except that the low dielectric constant resin was changed to 60 g of fluorinated polyimide resin C and N-methyl-2-pyrrolidone (NMP) as the solvent mesitylene.

(Comparative Example 1)
The same procedure as in Example 1 was performed except that polybutadiene A was not blended and the blending amount of norbornene resin A was changed to 37 g.
(Comparative Example 2)
The silica component was the same as Example 1 except that silica D was changed to 60 g.
(Comparative Example 3)
Implemented except that the low dielectric constant resin was changed to 60 g of epoxy resin D, which is a high dielectric constant resin, the solvent mesitylene was changed to N-methyl-2-pyrrolidone (NMP), and 1 g of the curing accelerator 2-methylimidazole was added. Performed the same as Example 1.

As is apparent from Table 1, Examples 1 to 11 were excellent in adhesion, electrical characteristics, heat resistance and workability.
On the other hand, Comparative Example 1 was inferior in strength, toughness (flexibility), circuit embedding property, connection reliability, and insulation reliability. This was because the film was brittle and had defects. Comparative Example 2 was inferior in low linear expansion, and Comparative Example 3 was inferior in low dielectric constant.

  According to the present invention, since it is possible to obtain a resin composition having high adhesion, low thermal expansion and high reliability necessary for an insulating layer, and further laser processing, electrical characteristics and fine processing by laser can be performed. It can be used as an insulating material such as a required semiconductor mounting substrate. In addition, this makes it possible to obtain a wiring board having excellent electrical characteristics, particularly dielectric characteristics, and thus can be applied to multilayer wiring boards for electronic devices that require miniaturization of parts and high-speed signal transmission.

It is sectional drawing which shows an example of the laminated body of this invention. It is sectional drawing which shows an example of the wiring board of this invention. It is sectional drawing which shows an example of the manufacturing method of the wiring board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laminated body 2 Carrier film 3 Resin layer 5 Core board 10 Wiring board 31 Opening part of resin layer 32 Conductor circuit 51 Opening part of core board 52 Conductor circuit 101 Conductor circuit 102 Opening part 103 Core substrate 104 Resin layer 105 Opening part 106 Conductor Circuit 107 Conductor post

Claims (19)

A resin composition constituting a resin layer of a wiring board, comprising fused silica having an average particle size of 3 μm or less, a polybutadiene resin, a low dielectric constant resin, and a laser processability imparting agent, A resin composition characterized by being 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole,
The content of fused silica having an average particle size of 3 μm or less is 30 to 75% by weight of the entire resin composition,
The content of the polybutadiene resin is 1 to 10% by weight of the entire resin composition,
The content of the low dielectric constant resin is 15 to 55% by weight of the entire resin composition,
The laser processability imparting agent is a resin composition of 0.1 to 15% by weight based on the content of the low dielectric constant resin. The resin composition according to claim 1, wherein the polybutadiene resin is a polybutadiene resin containing an acrylic group. The resin composition according to claim 1, wherein the polybutadiene resin is a polybutadiene resin containing an epoxy group. The resin composition according to any one of claims 1 to 3, wherein the low dielectric constant resin is a cyclic olefin resin. The resin composition according to claim 4, wherein the cyclic olefin-based resin is a norbornene-based resin including a repeating structure represented by the following general formula (1).

[X in Formula (1) represents —CH 2 —, —CH 2 CH 2 —, or —O—, and R 1, R 2, R 3, and R 4 each independently represent a hydrogen atom, a hydrocarbon group, or a C 1-12 carbon atom. Represents a polar group, and the polar group may be bonded by a linear or branched alkyl group, alkenyl group, alkynyl group, vinyl group, allyl group, aralkyl group, cycloaliphatic group, aryl group, or ether group.
n represents an integer of 0 to 2, and the repetition may be different. ] The resin composition according to claim 4, wherein the cyclic olefin resin is an addition polymer of a norbornene monomer including a monomer represented by the following general formula (2).

[X in Formula (2) represents —CH 2 —, —CH 2 CH 2 —, or —O—, and R 1, R 2, R 3, and R 4 each independently represents a hydrogen atom, a hydrocarbon group, or a C 1-12 carbon atom. Represents a polar group, and the polar group may be bonded by a linear or branched alkyl group, alkenyl group, alkynyl group, vinyl group, allyl group, aralkyl group, cycloaliphatic group, aryl group, or ether group.
n represents an integer of 0 to 2, and the repetition may be different. ] The resin composition according to any one of claims 1 to 3, wherein the low dielectric constant resin is a benzocyclobutene resin including a structure represented by the following general formula (3) or a prepolymerized structure thereof. object.

[R1 is aliphatic, aromatic, heteroatom, etc., or a combination thereof,
R2 and R3 are a hydrogen atom, aliphatic, aromatic, heteroatom, or a combination thereof. The resin composition according to claim 1, wherein the low dielectric constant resin is a fluorinated polyimide resin. A resin layer comprising the resin composition according to claim 1. The resin layer according to claim 9, wherein the resin layer has a relative dielectric constant of 3.0 or less. The resin layer according to claim 9 or 10, wherein the resin layer has a linear expansion coefficient of 50 ppm / ° C or less. It is a laminated body used for a wiring board, Comprising: The laminated body formed by laminating | stacking the resin layer and carrier film in any one of Claim 9 thru | or 11. A wiring board comprising the resin layer according to claim 9. A wiring board comprising: a step of forming an insulating layer using the resin composition according to claim 1; a step of forming a circuit layer; and a step of opening the insulating layer by laser irradiation. Manufacturing method. The method for manufacturing a wiring board according to claim 14, wherein the step of forming the insulating layer is performed by applying the resin composition. The method for producing a wiring board according to claim 14, wherein the step of forming the insulating layer is formed by laminating a film obtained using the resin composition. The method for manufacturing a wiring board according to claim 16, wherein the film in the step of forming the insulating layer is a film with a metal layer. The method for manufacturing a wiring board according to claim 14, further comprising a step of heat-curing the insulating layer. The wiring board obtained by the manufacturing method in any one of Claims 14 thru | or 18.

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