JP5101119B2 - Piezoelectric oscillator - Google Patents

Description

  The present invention relates to a pattern structure of a piezoelectric oscillator that is used in an electronic device such as a portable communication device and mainly includes a crystal resonator element.

  Conventionally, crystal oscillators have been used in electronic devices such as portable communication devices. In such a conventional crystal oscillator, as shown in FIG. 6, an integrated circuit element 103 is provided on the lower surface side of a container body 101 in which a crystal vibration element 102 is housed and the crystal vibration element 102 is hermetically sealed by a lid. There is known a structure in which a spherical conductor 104 that is mounted and used as an external connection electrode terminal used when a crystal oscillator is mounted on an external substrate is connected. Each spherical conductor 104 and the integrated circuit element 103 are connected by a conductive pattern drawn on the lower surface of the container body 101 on which the integrated circuit element 103 is mounted. (For example, see Patent Document 1 below.)

The following prior art is disclosed about the crystal oscillator of the above forms.
JP 2003-046251 A JP 2004-228894 A JP 2004-088533 A JP 2000-349555 A

  In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

  In the conventional crystal oscillator, when the spherical conductor is used as an electrode terminal for external connection, in order to mount the crystal oscillator on the external substrate reliably and safely, it takes a connection area to the external substrate. However, there is a limit to reducing the diameter of the spherical conductor. That is, in the structure in which the integrated circuit element and the spherical conductor are connected to the lower surface side of the crystal oscillator container, when the size of the entire crystal oscillator becomes very small, the crystal oscillator is surely connected to the outside as described above. A memory circuit incorporated in an integrated circuit element in a state in which the size of the spherical conductor cannot be changed for mounting on the substrate, and ensuring a space for mounting / arranging the integrated circuit element on the lower surface of the container body A write control terminal for writing data to the crystal oscillator, and a crystal resonator element connection terminal necessary for measuring the characteristics of the crystal resonator element mounted inside the crystal oscillator is provided on the lower surface of the container body. Although it is necessary to draw a pattern for electrically connecting circuit elements on the lower surface of the container body, the pattern is drawn on the lower surface of the container body as the overall size of the crystal oscillator becomes very small. Turn space is reduced, there is a problem that is difficult routing. This problem is not limited to the case of the crystal oscillator using the spherical conductor for the external connection electrode terminal, and the same problem can be obtained even if the crystal oscillator has columnar external connection electrode terminals at the four corners of the lower surface of the container body. Had.

  The present invention has been conceived in view of the above problems, and an object of the present invention is to provide a piezoelectric oscillator in which an integrated circuit element is arranged on the bottom surface of an insulating substrate on which a crystal resonator is mounted. To provide an efficiently drawn pattern structure.

In the piezoelectric oscillator according to the present invention, a crystal resonator element is mounted on the bottom surface in the concave space portion that forms the space portion on one main surface of the insulating base, and the other four main surfaces of the insulating base are provided. A columnar external connection terminal having an equal height is formed at one corner, and is electrically connected to the other main surface of the insulating base through the crystal base and the insulating base. An oscillation circuit is built in, one opposite center terminal on the two sides is a crystal resonator element connection terminal, the other center terminal on the other two sides is a write control terminal, and the other four terminals are control voltage terminals, respectively. An integrated circuit element serving as a power supply terminal, a ground terminal, and an output terminal, and a crystal vibration element connection terminal electrically connected to the crystal vibration element, and a memory incorporated in the integrated circuit element Writing to write data to the circuit And control terminals are formed, a piezoelectric oscillator having a structure lid is hermetically sealed is placed in a manner to close the space opening of the concave container opening on the edge of the concave vessel,
Of the plurality of integrated circuit element terminals provided along one parallel side, the patterns extending on the integrated circuit element mounting surface from the two first central integrated circuit element terminals are respectively the first A plurality of the integrated circuit element terminals provided along the other two parallel sides, drawn to the substantially central part of the two opposite sides of the integrated circuit element mounting surface closest to the central integrated circuit element terminal A pattern extending from the two second central integrated circuit element terminals on the integrated circuit element mounting surface is between each of the first central integrated circuit element terminal and the other integrated circuit element terminals. It is characterized by a pattern structure routed to substantially the central part of the two opposite sides of the integrated circuit element mounting surface via.

  According to the piezoelectric oscillator of the present invention, in the crystal oscillator having the structure in which the integrated circuit element is mounted on the bottom surface of the insulating substrate of the crystal resonator on which the crystal resonator element is mounted, the pattern is efficiently drawn on the bottom surface of the insulating substrate. I can do it.

  Further, according to the crystal oscillator of the present invention, in the crystal oscillator having the structure in which the integrated circuit element is mounted on the bottom surface of the insulating substrate of the crystal resonator on which the crystal resonator element is mounted, the crystal oscillator element connection terminal and the write control are provided. Since the terminal is arranged at the approximate center of the four sides around the integrated circuit element mounting surface, when mounting the piezoelectric oscillator of the present invention on an external electric circuit board such as a mother board, external electric When electrical connection is made between the circuit wiring and the terminal portion of the circuit, short-circuiting between the crystal vibration element connection terminal and the write control terminal and other terminals due to the spread of solder etc. at the previous terminal portion Can be prevented.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object. Moreover, in each figure, in order to make it easier to understand the present invention, a part is exaggerated.

  FIG. 1 is a schematic sectional view of a crystal oscillator 38 according to an embodiment of the present invention as seen from the horizontal direction. A crystal oscillator 38 shown in FIG. 1 includes a concave container 4, an external connection terminal 5, a lid 6, a crystal vibration element 12, a writing control terminal 32, a crystal vibration element connection terminal 31, and an integrated circuit element 37. Has been. The crystal oscillator 38 shown in FIG. 1 is provided with external terminal electrodes 9 at the four corners of the bottom surface of the insulating base 2 of the crystal resonator 1 in which the crystal resonator element 12 is accommodated in the space opening 10. The external connection terminal 5 is electrically connected to and fixed to the external terminal electrode 9, and an integrated circuit element 37 is mounted on the bottom surface of the insulating base 2 of the crystal unit 1, and the periphery of the integrated circuit element mounting surface 33. At the center of the four sides, a write control terminal 32 and a crystal resonator element connection terminal 31 are formed on opposite sides. Here, the inside of the external connection terminal 5 is filled with a conductor in the through hole, and the external terminal electrode 9 and the circuit wiring of the external electric circuit are electrically connected. In FIG. 1, the write control terminal 32 and the crystal resonator element connection terminal 31 are not shown.

  2 is a schematic bottom view of the insulating substrate 2 of the crystal oscillator 38 according to the first embodiment of the present invention, and FIG. 3 shows the crystal oscillator 38 according to the second embodiment of the present invention. 1 is a schematic bottom view of an insulating substrate 2. FIG.

  The quartz resonator 1 includes, for example, an insulative substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, and a concave container 4 made of a side wall 3 made of the same ceramic material as the insulative substrate 2, 42 alloy, The crystal unit 1 is constituted by a cover body 6 made of Kovar, phosphor bronze, or the like. The side wall 3 is attached to the upper surface of the insulating base 2 and the cover body 6 is placed and fixed on the upper surface of the side wall 3. The crystal resonator element 12 is mounted on the upper surface of the insulating substrate 2 located inside the side wall 3 via the conductive adhesive 13. The crystal resonator 1 accommodates the crystal resonator element 12 in the inside thereof, specifically, in a space opening 10 surrounded by the upper surface of the insulating base 2, the inner surface of the side wall 3, and the lower surface of the lid 6. The lid 6 is hermetically sealed.

  On the other hand, the crystal resonator element 12 accommodated in the space opening 10 of the crystal resonator 1 is formed by attaching and forming a pair of vibration electrodes on both main surfaces of a crystal piece cut along a predetermined crystal axis. When a fluctuation voltage from the outside is applied to the crystal piece via a pair of vibrating electrodes, thickness shear vibration is generated at a predetermined frequency.

  On the other hand, as shown in FIGS. 1 to 4, columnar external connection terminals 5 are connected and fixed to the external terminal electrodes 9 formed at the four corners on the lower surface of the insulating base 2 described above. ing. In FIG. 3, a flip chip type integrated circuit element 37 formed in a rectangular shape is mounted on the lower surface of the insulating substrate 2 surrounded by the external connection terminals 5 at the four corners. The element 37 is connected to the insulating substrate 2 via the conductive adhesive 36. In addition, a write control terminal 32 and a crystal resonator element connection terminal 31 are formed at opposite sides at the center of the four sides around the integrated circuit element mounting surface 33.

  The integrated circuit element 37 has, on the circuit forming surface inside the integrated circuit element 37, a temperature-sensitive element that detects the ambient temperature state, and a temperature compensation circuit that compensates for the temperature characteristics of the crystal resonator element 12, and is stored in the memory. A temperature compensation circuit that corrects the vibration characteristics of the crystal resonator element 12 according to temperature changes based on the temperature compensation data, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. After being output to the outside, the oscillation output generated in is used as a reference signal such as a clock signal. Here, the crystal resonator element 12 and the integrated circuit element 37 are connected by a metallized wiring 15 provided in the inner layer of the insulating substrate 2 shown in FIG. Further, as shown in FIG. 1, the integrated circuit element 37, the external connection terminal 5, the write control terminal 32, and the crystal vibration element connection terminal 31 are formed by a metallized wiring 15 provided in the inner layer of the insulating base 2. It is connected.

  FIG. 2 shows a first embodiment of the present invention and is a schematic view showing the bottom surface of the crystal unit of FIG. 1, that is, the integrated circuit element mounting surface. FIG. 3 shows a second embodiment of the present invention, and is a schematic view showing the bottom surface of the crystal unit of FIG. 1, that is, the integrated circuit element mounting surface. FIG. 2 shows a pattern 39 extending on the integrated circuit element mounting surface 33 from two first central integrated circuit element terminals among a plurality of integrated circuit element terminals 8 provided along one parallel two sides. Are drawn to the substantially central part of the two opposite sides of the integrated circuit element mounting surface 33 closest to the first central integrated circuit element terminal 8 and provided along the other two parallel sides. Among the plurality of integrated circuit element terminals 8, the patterns 39 extending on the integrated circuit element mounting surface 33 from the two second central integrated circuit element terminals 8 are respectively the first central integrated circuit. The pattern structure 40 is routed to the substantially central portion of two opposing sides of the integrated circuit element mounting surface 33 via the element terminal 8 and the other integrated circuit element terminal 8.

  Further, FIG. 3 shows that the crystal resonator element connection terminal 31 and the write control terminal 32 are drawn to substantially central portions of two opposing sides of the integrated circuit element mounting surface 33 closest to each integrated circuit element terminal 8. It is the schematic which showed the pattern structure 40 turned. Here, the write control terminal 32 may have a structure arranged on the short side of the crystal oscillator, and this case is also included in the technical scope of the present invention.

  The crystal oscillator described above is first arranged in a matrix of m columns × n rows (m and n are natural numbers of 2 or more: in the example of FIG. 5, 3 rows × 4 columns) as shown in FIG. A sheet-like substrate 35 having a plurality of arranged external connection terminals 5 is formed. The sheet-like substrate 35 is formed of an insulator such as silicon, glass, or glass epoxy resin, for example. For example, when the sheet-like substrate 35 is a glass epoxy resin, a base is formed by impregnating a glass cloth substrate formed by weaving glass yarn with a liquid precursor of an epoxy resin and polymerizing the precursor at a high temperature. The conductor film 7 is formed by processing a metal foil such as a copper foil attached to the surface into a predetermined pattern using a conventionally known photoetching or the like, and a conventionally known punching process or the like is also performed. By doing so, a space for mounting the integrated circuit element 37 is formed.

  Next, each integrated circuit element mounting pad 11 on the bottom surface of the insulating substrate 2 of the crystal resonator 1 formed by mounting the hermetically sealed crystal resonator element 12 on the inside corresponds to a predetermined function. The integrated circuit element 37 is mounted in such a form that the integrated circuit element terminals 8 face each other, and are electrically and mechanically connected.

  As the integrated circuit element 37, a rectangular flip-chip type integrated circuit element 37 having a plurality of integrated circuit element terminals 8 on the joint surface is used. In the integrated circuit element 37, a plurality of integrated circuit element terminals 8 provided on the joint surface thereof are connected to each integrated circuit element mounting pad 11 on the bottom surface of the insulating base 2 of the crystal resonator 1 with a conductive adhesive. After that, the conductive adhesive 36 is melted by application of heat and then cooled and solidified to connect the integrated circuit element terminal 8 and the integrated circuit element mounting pad 11 to the conductive adhesive 36. The integrated circuit element 37 is mounted on the bottom surface of the insulating substrate 2 of the crystal unit 1 by bonding via the.

  Next, the external terminal electrode 9 on the bottom surface of the insulating base 2 of the crystal resonator 1 in which the crystal resonator element 12 is accommodated is the conductor film on the top surface formed on each external connection terminal 5 of the sheet-like substrate 35. 7 so that a part of the integrated circuit element 37 enters a position opposite to the conductive film 7, and the conductive film 7 on the upper surface of the external connection terminal 5 of the sheet-like substrate 35 is electrically conductive. It is bonded and mounted with an adhesive 36.

  Thereafter, by cutting off the connecting portion between the surplus portion of the sheet-like substrate 35 and the external connection terminal 5, each external connection terminal 5 is separated from the surplus portion, and a plurality of crystal oscillators 38 are obtained simultaneously.

  Finally, temperature compensation data is input to the integrated circuit element 37 via the write control terminal 32, and the temperature compensation data is stored in the memory in the integrated circuit element 37. Such temperature compensation data writing operation is performed by applying the probe needle of the temperature compensation data writing device to the writing control terminal 32 and using the temperature compensation data created according to the temperature characteristics of the crystal resonator element 12 as an integrated circuit. This is performed by inputting to a memory provided in the temperature compensation circuit of the element 37 and storing it. Here, the temperature compensation data written in the integrated circuit element 37 is for correcting the variation in the temperature characteristic inherent to each crystal oscillation element 12, and the crystal oscillation used in the temperature compensation type crystal oscillator. It is obtained by measuring the temperature characteristics of the element 12 in advance.

  Here, as shown in FIG. 2, the characteristic part of the present invention is that two first central integrated circuit elements among a plurality of integrated circuit element terminals 8 provided along two parallel sides. A pattern 39 extending from the terminal on the integrated circuit element mounting surface 33 is drawn to the substantially central portion of the two opposite sides of the integrated circuit element mounting surface 33 closest to the first central integrated circuit element terminal 8. Of the plurality of integrated circuit element terminals 8 provided along the other two parallel sides, the integrated circuit element mounting surface 33 is extended from the two second central integrated circuit element terminals 8. Pattern 39 to be formed on the substantially central portions of the two opposite sides of the integrated circuit element mounting surface 33 through the first central integrated circuit element terminal 8 and the other integrated circuit element terminal 8, respectively. Routed pattern structure It is 0. With this pattern structure 40, in the crystal oscillator having a structure in which the integrated circuit element is mounted on the bottom surface of the insulating substrate of the crystal resonator on which the crystal resonator element is mounted, the pattern can be efficiently drawn on the bottom surface of the insulating substrate. .

  3, the crystal oscillator 38 having the structure in which the integrated circuit element 37 is mounted on the bottom surface of the insulating substrate 2 of the crystal resonator 1 on which the crystal resonator element 12 is mounted. Since the positions where the connection terminal 31 and the write control terminal 32 are arranged are substantially the center of the four sides around the integrated circuit element mounting surface 33 and separated from the external connection terminal 5, the connection terminal 31 and the write control terminal 32 are mounted on an external electric circuit such as a mother board. At this time, when the circuit wiring of the external electric circuit is electrically connected by soldering or the like, an electrical short circuit between the crystal resonator element connection terminal 31 and the write control terminal 32 due to the spread of solder or the like at the terminal portion is caused. There is an effect that can be prevented.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

For example, in the above-described embodiment, the resin for the purpose of protecting the circuit forming surface of the integrated circuit element 37 is not injected into the integrated circuit element mounting surface 33, but the integrated circuit element mounting surface 33 and the integrated circuit element Even if resin is injected into the gap between 37, it does not matter.

1 is a schematic cross-sectional view of a crystal oscillator according to an embodiment of the present invention when viewed from a horizontal direction. FIG. 2 is a schematic diagram illustrating a bottom surface of the crystal unit of FIG. 1, that is, an integrated circuit element mounting surface according to the first embodiment of the present invention. FIG. 4 is a schematic diagram showing a bottom surface of the crystal unit of FIG. 1, that is, an integrated circuit element mounting surface according to the second embodiment of the present invention. FIG. 4 is a schematic diagram showing a bottom surface of the crystal unit of FIG. 1, that is, an integrated circuit element mounting surface according to the third embodiment of the present invention. It is a schematic top view of the sheet-like board | substrate with which the terminal for external connection used for the crystal oscillator of this invention was formed. It is the schematic sectional drawing which looked at the conventional crystal oscillator from the horizontal direction.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator 2 ... Insulating base | substrate 3 ... Side wall 4 ... Concave container 5 ... External connection terminal 6 ... Cover body 7 ... Conductive film 8 ... Integrated circuit element terminal 9... External terminal electrode 10. Space opening 11. Integrated circuit element mounting pad 12. Crystal oscillator 13. Conductive adhesive 15. ... Crystal oscillator connection terminal 32 ... Write control terminal 33 ... Integrated circuit element mounting surface 35 ... Sheet-like substrate 36 ... Conductive adhesive 37 ... Integrated circuit element 38 ..Crystal oscillator 39 ... Pattern 40 ... Pattern structure

Claims (1)

  A crystal resonator element is mounted on the bottom surface in the concave space that forms the space on one main surface of the insulating base, and the four corners on the other main surface of the insulating base are equally high. A columnar external connection terminal is formed, and an oscillation circuit that is electrically connected to the quartz resonator element through the insulating base is incorporated on the other main surface of the insulating base. The two opposite center terminals are the crystal resonator element connection terminals, the other two opposite center terminals are write control terminals, and the other four terminals are the control voltage terminal, power supply terminal, and ground terminal, respectively. , And an integrated circuit element serving as an output terminal, and a crystal oscillator element connection terminal electrically connected to the crystal oscillator element, and writing to write data to a memory circuit incorporated in the integrated circuit element A control terminal is formed, and the concave container A piezoelectric oscillator having a structure in which a lid is placed on an upper edge of the mouth so as to block the space opening of the concave container and hermetically sealed, and a plurality of piezoelectric oscillators provided along two parallel sides Among the integrated circuit element terminals, the patterns extending on the integrated circuit element mounting surface from the two first central integrated circuit element terminals are closest to the first central integrated circuit element terminal, respectively. Of the plurality of integrated circuit element terminals drawn along the substantially two central sides of the two opposite sides of the element mounting surface and provided along the other two parallel sides, the second central integrated circuit The pattern extending from the element terminal on the integrated circuit element mounting surface passes between the integrated circuit element terminal in the first center and the other integrated circuit element terminal, and then the integrated circuit element mounting surface. The path routed around the approximate center of the two opposite sides of Piezoelectric oscillator, wherein over down structure.

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