JP5090641B2 - 大面積トランスデューサ・アレイ - Google Patents

大面積トランスデューサ・アレイ Download PDF

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Publication number
JP5090641B2
JP5090641B2 JP2005347492A JP2005347492A JP5090641B2 JP 5090641 B2 JP5090641 B2 JP 5090641B2 JP 2005347492 A JP2005347492 A JP 2005347492A JP 2005347492 A JP2005347492 A JP 2005347492A JP 5090641 B2 JP5090641 B2 JP 5090641B2
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Japan
Prior art keywords
transducers
transducer
transducer array
substrate
disposed
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JP2005347492A
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English (en)
Japanese (ja)
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JP2006166443A (ja
JP2006166443A5 (enExample
Inventor
レイエット・アン・フィッシャー
ウィリアム・エドワード・バーディック，ジュニア
ジェイムズ・ウィルソン・ローズ
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General Electric Co
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General Electric Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type

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  • Ultra Sonic Daignosis Equipment (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2005347492A 2004-12-03 2005-12-01 大面積トランスデューサ・アレイ Expired - Lifetime JP5090641B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/003,054 US7375420B2 (en) 2004-12-03 2004-12-03 Large area transducer array
US11/003,054 2004-12-03

Publications (3)

Publication Number Publication Date
JP2006166443A JP2006166443A (ja) 2006-06-22
JP2006166443A5 JP2006166443A5 (enExample) 2011-08-11
JP5090641B2 true JP5090641B2 (ja) 2012-12-05

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Family Applications (1)

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JP2005347492A Expired - Lifetime JP5090641B2 (ja) 2004-12-03 2005-12-01 大面積トランスデューサ・アレイ

Country Status (3)

Country Link
US (2) US7375420B2 (enExample)
JP (1) JP5090641B2 (enExample)
FR (1) FR2879023B1 (enExample)

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CN101959110B (zh) * 2009-07-16 2014-07-09 鸿富锦精密工业（深圳）有限公司 微机电系统扬声器及电子装置
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TW201312763A (zh) * 2011-09-09 2013-03-16 鴻海精密工業股份有限公司 晶片封裝件
JP5864246B2 (ja) * 2011-12-20 2016-02-17 上田日本無線株式会社 複合多チャンネル圧電振動子
KR101919013B1 (ko) 2012-09-13 2019-02-08 삼성전자주식회사 미세가공 초음파 변환기 어레이
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
TWI623081B (zh) 2013-03-15 2018-05-01 蝴蝶網路公司 互補式金屬氧化物半導體（ｃｍｏｓ）超音波換能器以及用於形成其之方法
CA2903479C (en) 2013-03-15 2023-10-10 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
EP3024594A2 (en) 2013-07-23 2016-06-01 Butterfly Network Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
EP3038762B1 (en) 2013-08-26 2019-12-18 Koninklijke Philips N.V. Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly
CN106659464B (zh) 2014-04-18 2020-03-20 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法
TWI671059B (zh) 2014-04-18 2019-09-11 美商蝴蝶網路公司 超音波成像壓縮方法和設備
CN106461767B (zh) 2014-04-18 2019-05-28 蝴蝶网络有限公司 单衬底超声成像装置的架构、相关设备和方法
WO2016007920A1 (en) * 2014-07-11 2016-01-14 New York University Three dimensional tactile feedback system
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US10828012B2 (en) * 2015-09-07 2020-11-10 Sony Corporation Ultrasonic array oscillator, method of producing ultrasonic array oscillator, ultrasonic probe, and ultrasonic diagnostic apparatus
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US10512936B2 (en) 2017-06-21 2019-12-24 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US11498096B2 (en) * 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
US12109591B2 (en) 2019-09-09 2024-10-08 GE Precision Healthcare LLC Ultrasound transducer array architecture and method of manufacture

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Also Published As

Publication number Publication date
FR2879023B1 (fr) 2016-12-30
US7867824B2 (en) 2011-01-11
US20080213933A1 (en) 2008-09-04
US20060133198A1 (en) 2006-06-22
US7375420B2 (en) 2008-05-20
FR2879023A1 (fr) 2006-06-09
JP2006166443A (ja) 2006-06-22

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