FR2879023B1 - Matrice de transducteurs pour grande surface - Google Patents
Matrice de transducteurs pour grande surfaceInfo
- Publication number
- FR2879023B1 FR2879023B1 FR0511801A FR0511801A FR2879023B1 FR 2879023 B1 FR2879023 B1 FR 2879023B1 FR 0511801 A FR0511801 A FR 0511801A FR 0511801 A FR0511801 A FR 0511801A FR 2879023 B1 FR2879023 B1 FR 2879023B1
- Authority
- FR
- France
- Prior art keywords
- transducers
- matrix
- large surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/003,054 US7375420B2 (en) | 2004-12-03 | 2004-12-03 | Large area transducer array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2879023A1 FR2879023A1 (fr) | 2006-06-09 |
| FR2879023B1 true FR2879023B1 (fr) | 2016-12-30 |
Family
ID=36481206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0511801A Expired - Lifetime FR2879023B1 (fr) | 2004-12-03 | 2005-11-22 | Matrice de transducteurs pour grande surface |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7375420B2 (enExample) |
| JP (1) | JP5090641B2 (enExample) |
| FR (1) | FR2879023B1 (enExample) |
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| US8477983B2 (en) * | 2005-08-23 | 2013-07-02 | Analog Devices, Inc. | Multi-microphone system |
| US7804970B2 (en) * | 2005-10-24 | 2010-09-28 | Sonosite, Inc. | Array interconnect for improved directivity |
| US7592594B2 (en) * | 2006-11-13 | 2009-09-22 | Raytheon Company | Method of construction of CTE matching structure with wafer processing and resulting structure |
| US20080242979A1 (en) * | 2007-03-30 | 2008-10-02 | Rayette Ann Fisher | Combined X-ray detector and ultrasound imager |
| US7892176B2 (en) * | 2007-05-02 | 2011-02-22 | General Electric Company | Monitoring or imaging system with interconnect structure for large area sensor array |
| US20080315331A1 (en) * | 2007-06-25 | 2008-12-25 | Robert Gideon Wodnicki | Ultrasound system with through via interconnect structure |
| EP2214560A1 (en) | 2007-12-03 | 2010-08-11 | Kolo Technologies, Inc. | Cmut packaging for ultrasound system |
| EP2215854A1 (en) * | 2007-12-03 | 2010-08-11 | Kolo Technologies, Inc. | Stacked transducing devices |
| JP5020792B2 (ja) * | 2007-12-04 | 2012-09-05 | アルパイン株式会社 | 合成画像生成装置および合成画像生成方法 |
| JP5349141B2 (ja) * | 2009-06-02 | 2013-11-20 | 株式会社東芝 | 超音波プローブ |
| CN101959110B (zh) * | 2009-07-16 | 2014-07-09 | 鸿富锦精密工业(深圳)有限公司 | 微机电系统扬声器及电子装置 |
| US8345508B2 (en) * | 2009-09-20 | 2013-01-01 | General Electric Company | Large area modular sensor array assembly and method for making the same |
| GB2473663B (en) * | 2009-09-21 | 2016-11-23 | Aveillant Ltd | Radar Receiver |
| US8391018B2 (en) * | 2009-09-28 | 2013-03-05 | Qualcomm Incorporated | Semiconductor die-based packaging interconnect |
| US8320214B1 (en) * | 2010-07-27 | 2012-11-27 | The United States Of America As Represented By The Secretary Of The Navy | Device for reducing target strength of an underwater object |
| US8264074B2 (en) * | 2010-09-10 | 2012-09-11 | General Electric Company | Device for use as dual-sided sensor package |
| KR101792590B1 (ko) * | 2011-04-26 | 2017-11-01 | 삼성전자주식회사 | 빔포밍 방법, 이를 수행하는 장치 및 의료영상시스템 |
| TW201312763A (zh) * | 2011-09-09 | 2013-03-16 | 鴻海精密工業股份有限公司 | 晶片封裝件 |
| JP5864246B2 (ja) * | 2011-12-20 | 2016-02-17 | 上田日本無線株式会社 | 複合多チャンネル圧電振動子 |
| KR101919013B1 (ko) | 2012-09-13 | 2019-02-08 | 삼성전자주식회사 | 미세가공 초음파 변환기 어레이 |
| US9499392B2 (en) | 2013-02-05 | 2016-11-22 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
| TWI623081B (zh) | 2013-03-15 | 2018-05-01 | 蝴蝶網路公司 | 互補式金屬氧化物半導體(cmos)超音波換能器以及用於形成其之方法 |
| CA2903479C (en) | 2013-03-15 | 2023-10-10 | Butterfly Network, Inc. | Monolithic ultrasonic imaging devices, systems and methods |
| US9667889B2 (en) | 2013-04-03 | 2017-05-30 | Butterfly Network, Inc. | Portable electronic devices with integrated imaging capabilities |
| EP3024594A2 (en) | 2013-07-23 | 2016-06-01 | Butterfly Network Inc. | Interconnectable ultrasound transducer probes and related methods and apparatus |
| EP3038762B1 (en) | 2013-08-26 | 2019-12-18 | Koninklijke Philips N.V. | Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly |
| CN106659464B (zh) | 2014-04-18 | 2020-03-20 | 蝴蝶网络有限公司 | 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法 |
| TWI671059B (zh) | 2014-04-18 | 2019-09-11 | 美商蝴蝶網路公司 | 超音波成像壓縮方法和設備 |
| CN106461767B (zh) | 2014-04-18 | 2019-05-28 | 蝴蝶网络有限公司 | 单衬底超声成像装置的架构、相关设备和方法 |
| WO2016007920A1 (en) * | 2014-07-11 | 2016-01-14 | New York University | Three dimensional tactile feedback system |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US10828012B2 (en) * | 2015-09-07 | 2020-11-10 | Sony Corporation | Ultrasonic array oscillator, method of producing ultrasonic array oscillator, ultrasonic probe, and ultrasonic diagnostic apparatus |
| US9987661B2 (en) | 2015-12-02 | 2018-06-05 | Butterfly Network, Inc. | Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods |
| US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US10512936B2 (en) | 2017-06-21 | 2019-12-24 | Butterfly Network, Inc. | Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections |
| US11498096B2 (en) * | 2018-11-06 | 2022-11-15 | Siemens Medical Solutions Usa, Inc. | Chip-on-array with interposer for a multidimensional transducer array |
| US12109591B2 (en) | 2019-09-09 | 2024-10-08 | GE Precision Healthcare LLC | Ultrasound transducer array architecture and method of manufacture |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4491760A (en) * | 1981-10-16 | 1985-01-01 | Stanford University | Force sensing polymer piezoelectric transducer array |
| US4804132A (en) * | 1987-08-28 | 1989-02-14 | Difrancesco Louis | Method for cold bonding |
| US5471151A (en) * | 1990-02-14 | 1995-11-28 | Particle Interconnect, Inc. | Electrical interconnect using particle enhanced joining of metal surfaces |
| US5670251A (en) * | 1990-02-14 | 1997-09-23 | Particle Interconnect Corporation | Patternable particle filled adhesive matrix for forming patterned structures between joined surfaces |
| US5083697A (en) * | 1990-02-14 | 1992-01-28 | Difrancesco Louis | Particle-enhanced joining of metal surfaces |
| US5423220A (en) * | 1993-01-29 | 1995-06-13 | Parallel Design | Ultrasonic transducer array and manufacturing method thereof |
| US5329498A (en) * | 1993-05-17 | 1994-07-12 | Hewlett-Packard Company | Signal conditioning and interconnection for an acoustic transducer |
| US5381385A (en) * | 1993-08-04 | 1995-01-10 | Hewlett-Packard Company | Electrical interconnect for multilayer transducer elements of a two-dimensional transducer array |
| US6096982A (en) * | 1998-02-18 | 2000-08-01 | Nanopierce Technologies, Inc. | Method and apparatus for conductively joining components |
| JP3478178B2 (ja) * | 1999-06-16 | 2003-12-15 | 住友金属工業株式会社 | 超音波探傷方法および装置 |
| US6430109B1 (en) * | 1999-09-30 | 2002-08-06 | The Board Of Trustees Of The Leland Stanford Junior University | Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections |
| US6984571B1 (en) | 1999-10-01 | 2006-01-10 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
| JP2001198122A (ja) * | 2000-01-18 | 2001-07-24 | Toshiba Corp | 2次元アレイ型超音波プローブ及び超音波診断装置 |
| US6623501B2 (en) * | 2000-04-05 | 2003-09-23 | Therasense, Inc. | Reusable ceramic skin-piercing device |
| JP2002027594A (ja) * | 2000-07-11 | 2002-01-25 | Hitachi Ltd | 超音波探触子およびその製造方法 |
| JP2002028159A (ja) * | 2000-07-12 | 2002-01-29 | Hitachi Ltd | 平面及び曲面形状のアレイ状素子の実装構造及びその製造方法 |
| US6630203B2 (en) * | 2001-06-15 | 2003-10-07 | Nanopierce Technologies, Inc. | Electroless process for the preparation of particle enhanced electric contact surfaces |
| US6683665B1 (en) * | 2000-11-20 | 2004-01-27 | Sarnoff Corporation | Tiled electronic display structure and method for modular repair thereof |
| JP2003084066A (ja) * | 2001-04-11 | 2003-03-19 | Nippon Kessho Kogaku Kk | 放射線検出器用部品、放射線検出器および放射線検出装置 |
| US6510195B1 (en) * | 2001-07-18 | 2003-01-21 | Koninklijke Philips Electronics, N.V. | Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same |
| US6669644B2 (en) * | 2001-07-31 | 2003-12-30 | Koninklijke Philips Electronics N.V. | Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy |
| JP4874497B2 (ja) * | 2001-10-20 | 2012-02-15 | ゾネア メディカル システムズ,インコーポレイテッド | 幅広ビーム映像化 |
| GB0212775D0 (en) * | 2002-05-31 | 2002-07-10 | Westwind Air Bearings Ltd | Machine apparatus and methods |
| JP2004088056A (ja) * | 2002-07-02 | 2004-03-18 | Sumitomo Electric Ind Ltd | 圧電振動子とその実装方法、実装デバイス、それを用いた超音波プローブ、およびそれを用いた3次元超音波診断装置 |
| JP4342859B2 (ja) * | 2002-09-30 | 2009-10-14 | 富士フイルム株式会社 | 超音波用探触子及びそれを用いた超音波送受信装置 |
| US7202684B2 (en) * | 2003-03-13 | 2007-04-10 | Intel Corporation | Thermal stratification test apparatus and method providing cyclical and steady-state stratified environments |
| US6990176B2 (en) * | 2003-10-30 | 2006-01-24 | General Electric Company | Methods and apparatus for tileable sensor array |
-
2004
- 2004-12-03 US US11/003,054 patent/US7375420B2/en active Active
-
2005
- 2005-11-22 FR FR0511801A patent/FR2879023B1/fr not_active Expired - Lifetime
- 2005-12-01 JP JP2005347492A patent/JP5090641B2/ja not_active Expired - Lifetime
-
2008
- 2008-05-08 US US12/117,608 patent/US7867824B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US7867824B2 (en) | 2011-01-11 |
| US20080213933A1 (en) | 2008-09-04 |
| US20060133198A1 (en) | 2006-06-22 |
| US7375420B2 (en) | 2008-05-20 |
| FR2879023A1 (fr) | 2006-06-09 |
| JP2006166443A (ja) | 2006-06-22 |
| JP5090641B2 (ja) | 2012-12-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 11 |
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| PLFP | Fee payment |
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| PLFP | Fee payment |
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| PLFP | Fee payment |
Year of fee payment: 20 |
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| TP | Transmission of property |
Owner name: GE PRECISION HEALTHCARE LLC, US Effective date: 20250306 |