FR2879023B1 - Matrice de transducteurs pour grande surface - Google Patents

Matrice de transducteurs pour grande surface

Info

Publication number
FR2879023B1
FR2879023B1 FR0511801A FR0511801A FR2879023B1 FR 2879023 B1 FR2879023 B1 FR 2879023B1 FR 0511801 A FR0511801 A FR 0511801A FR 0511801 A FR0511801 A FR 0511801A FR 2879023 B1 FR2879023 B1 FR 2879023B1
Authority
FR
France
Prior art keywords
transducers
matrix
large surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0511801A
Other languages
English (en)
French (fr)
Other versions
FR2879023A1 (fr
Inventor
Rayette Ann Fisher
William Edward Burdick Jr
James Wilson Rose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GE Precision Healthcare LLC
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2879023A1 publication Critical patent/FR2879023A1/fr
Application granted granted Critical
Publication of FR2879023B1 publication Critical patent/FR2879023B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292Electrostatic transducers, e.g. electret-type

Landscapes

  • Ultra Sonic Daignosis Equipment (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
FR0511801A 2004-12-03 2005-11-22 Matrice de transducteurs pour grande surface Expired - Lifetime FR2879023B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/003,054 US7375420B2 (en) 2004-12-03 2004-12-03 Large area transducer array

Publications (2)

Publication Number Publication Date
FR2879023A1 FR2879023A1 (fr) 2006-06-09
FR2879023B1 true FR2879023B1 (fr) 2016-12-30

Family

ID=36481206

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0511801A Expired - Lifetime FR2879023B1 (fr) 2004-12-03 2005-11-22 Matrice de transducteurs pour grande surface

Country Status (3)

Country Link
US (2) US7375420B2 (enExample)
JP (1) JP5090641B2 (enExample)
FR (1) FR2879023B1 (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8477983B2 (en) * 2005-08-23 2013-07-02 Analog Devices, Inc. Multi-microphone system
US7804970B2 (en) * 2005-10-24 2010-09-28 Sonosite, Inc. Array interconnect for improved directivity
US7592594B2 (en) * 2006-11-13 2009-09-22 Raytheon Company Method of construction of CTE matching structure with wafer processing and resulting structure
US20080242979A1 (en) * 2007-03-30 2008-10-02 Rayette Ann Fisher Combined X-ray detector and ultrasound imager
US7892176B2 (en) * 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) * 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
EP2214560A1 (en) 2007-12-03 2010-08-11 Kolo Technologies, Inc. Cmut packaging for ultrasound system
EP2215854A1 (en) * 2007-12-03 2010-08-11 Kolo Technologies, Inc. Stacked transducing devices
JP5020792B2 (ja) * 2007-12-04 2012-09-05 アルパイン株式会社 合成画像生成装置および合成画像生成方法
JP5349141B2 (ja) * 2009-06-02 2013-11-20 株式会社東芝 超音波プローブ
CN101959110B (zh) * 2009-07-16 2014-07-09 鸿富锦精密工业(深圳)有限公司 微机电系统扬声器及电子装置
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
GB2473663B (en) * 2009-09-21 2016-11-23 Aveillant Ltd Radar Receiver
US8391018B2 (en) * 2009-09-28 2013-03-05 Qualcomm Incorporated Semiconductor die-based packaging interconnect
US8320214B1 (en) * 2010-07-27 2012-11-27 The United States Of America As Represented By The Secretary Of The Navy Device for reducing target strength of an underwater object
US8264074B2 (en) * 2010-09-10 2012-09-11 General Electric Company Device for use as dual-sided sensor package
KR101792590B1 (ko) * 2011-04-26 2017-11-01 삼성전자주식회사 빔포밍 방법, 이를 수행하는 장치 및 의료영상시스템
TW201312763A (zh) * 2011-09-09 2013-03-16 鴻海精密工業股份有限公司 晶片封裝件
JP5864246B2 (ja) * 2011-12-20 2016-02-17 上田日本無線株式会社 複合多チャンネル圧電振動子
KR101919013B1 (ko) 2012-09-13 2019-02-08 삼성전자주식회사 미세가공 초음파 변환기 어레이
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
TWI623081B (zh) 2013-03-15 2018-05-01 蝴蝶網路公司 互補式金屬氧化物半導體(cmos)超音波換能器以及用於形成其之方法
CA2903479C (en) 2013-03-15 2023-10-10 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
EP3024594A2 (en) 2013-07-23 2016-06-01 Butterfly Network Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
EP3038762B1 (en) 2013-08-26 2019-12-18 Koninklijke Philips N.V. Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly
CN106659464B (zh) 2014-04-18 2020-03-20 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法
TWI671059B (zh) 2014-04-18 2019-09-11 美商蝴蝶網路公司 超音波成像壓縮方法和設備
CN106461767B (zh) 2014-04-18 2019-05-28 蝴蝶网络有限公司 单衬底超声成像装置的架构、相关设备和方法
WO2016007920A1 (en) * 2014-07-11 2016-01-14 New York University Three dimensional tactile feedback system
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US10828012B2 (en) * 2015-09-07 2020-11-10 Sony Corporation Ultrasonic array oscillator, method of producing ultrasonic array oscillator, ultrasonic probe, and ultrasonic diagnostic apparatus
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US10512936B2 (en) 2017-06-21 2019-12-24 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US11498096B2 (en) * 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
US12109591B2 (en) 2019-09-09 2024-10-08 GE Precision Healthcare LLC Ultrasound transducer array architecture and method of manufacture

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491760A (en) * 1981-10-16 1985-01-01 Stanford University Force sensing polymer piezoelectric transducer array
US4804132A (en) * 1987-08-28 1989-02-14 Difrancesco Louis Method for cold bonding
US5471151A (en) * 1990-02-14 1995-11-28 Particle Interconnect, Inc. Electrical interconnect using particle enhanced joining of metal surfaces
US5670251A (en) * 1990-02-14 1997-09-23 Particle Interconnect Corporation Patternable particle filled adhesive matrix for forming patterned structures between joined surfaces
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US5423220A (en) * 1993-01-29 1995-06-13 Parallel Design Ultrasonic transducer array and manufacturing method thereof
US5329498A (en) * 1993-05-17 1994-07-12 Hewlett-Packard Company Signal conditioning and interconnection for an acoustic transducer
US5381385A (en) * 1993-08-04 1995-01-10 Hewlett-Packard Company Electrical interconnect for multilayer transducer elements of a two-dimensional transducer array
US6096982A (en) * 1998-02-18 2000-08-01 Nanopierce Technologies, Inc. Method and apparatus for conductively joining components
JP3478178B2 (ja) * 1999-06-16 2003-12-15 住友金属工業株式会社 超音波探傷方法および装置
US6430109B1 (en) * 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6984571B1 (en) 1999-10-01 2006-01-10 Ziptronix, Inc. Three dimensional device integration method and integrated device
JP2001198122A (ja) * 2000-01-18 2001-07-24 Toshiba Corp 2次元アレイ型超音波プローブ及び超音波診断装置
US6623501B2 (en) * 2000-04-05 2003-09-23 Therasense, Inc. Reusable ceramic skin-piercing device
JP2002027594A (ja) * 2000-07-11 2002-01-25 Hitachi Ltd 超音波探触子およびその製造方法
JP2002028159A (ja) * 2000-07-12 2002-01-29 Hitachi Ltd 平面及び曲面形状のアレイ状素子の実装構造及びその製造方法
US6630203B2 (en) * 2001-06-15 2003-10-07 Nanopierce Technologies, Inc. Electroless process for the preparation of particle enhanced electric contact surfaces
US6683665B1 (en) * 2000-11-20 2004-01-27 Sarnoff Corporation Tiled electronic display structure and method for modular repair thereof
JP2003084066A (ja) * 2001-04-11 2003-03-19 Nippon Kessho Kogaku Kk 放射線検出器用部品、放射線検出器および放射線検出装置
US6510195B1 (en) * 2001-07-18 2003-01-21 Koninklijke Philips Electronics, N.V. Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same
US6669644B2 (en) * 2001-07-31 2003-12-30 Koninklijke Philips Electronics N.V. Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy
JP4874497B2 (ja) * 2001-10-20 2012-02-15 ゾネア メディカル システムズ,インコーポレイテッド 幅広ビーム映像化
GB0212775D0 (en) * 2002-05-31 2002-07-10 Westwind Air Bearings Ltd Machine apparatus and methods
JP2004088056A (ja) * 2002-07-02 2004-03-18 Sumitomo Electric Ind Ltd 圧電振動子とその実装方法、実装デバイス、それを用いた超音波プローブ、およびそれを用いた3次元超音波診断装置
JP4342859B2 (ja) * 2002-09-30 2009-10-14 富士フイルム株式会社 超音波用探触子及びそれを用いた超音波送受信装置
US7202684B2 (en) * 2003-03-13 2007-04-10 Intel Corporation Thermal stratification test apparatus and method providing cyclical and steady-state stratified environments
US6990176B2 (en) * 2003-10-30 2006-01-24 General Electric Company Methods and apparatus for tileable sensor array

Also Published As

Publication number Publication date
US7867824B2 (en) 2011-01-11
US20080213933A1 (en) 2008-09-04
US20060133198A1 (en) 2006-06-22
US7375420B2 (en) 2008-05-20
FR2879023A1 (fr) 2006-06-09
JP2006166443A (ja) 2006-06-22
JP5090641B2 (ja) 2012-12-05

Similar Documents

Publication Publication Date Title
FR2879023B1 (fr) Matrice de transducteurs pour grande surface
EP1931169A4 (en) Post filter for microphone array
DE602006003378D1 (de) Elektroakustischer Wandler
EP2095943A4 (en) SHEET CONTROLLING MOISTURE
FI20065801A0 (fi) Likaantuvan pinnan ravistuslaite
NO20052964D0 (no) Overflatemodifisert silikagel
DE602006002442D1 (de) Akustische oberflächenwellenvorrichtung
NO20042425L (no) Anordning for algeproduksjon
DE602007000754D1 (de) Piezoelektrischer elektroakustischer Wandler
PT1735252E (pt) Aglutinante hidráulico
EP1937403A4 (en) PREPARATION OF CHROMATOGRAPHIC MATRICES
DE602007012612D1 (de) Dünnes Keramikplattenelement
DE112005002529A5 (de) Hydraulisch betätigte Giesseinheit
DE602006021261D1 (de) Oberflächenwellenvorrichtung
EP1949895A4 (en) IONTOPHORESIS-PREPARATION
DK1826164T3 (da) Lagpresse
EP1992192A4 (en) Sound sponge for loudspeakers
EP1887364A4 (en) BIOCHIPSUBSTRATE AND BIOCHIP
DE602005007816D1 (de) Hydraulische Aufhängungsvorrichtung
FR2887144B3 (fr) Audio vibromasseur
DK1900249T3 (da) Elektroakustisk transducer
DE112005002551A5 (de) Hydraulisch betätigte Giesseinheit
EP1938203A4 (en) Naming system layer
FR2890404B3 (fr) Cloison pour isolement acoustique
FR2896971B1 (fr) Assiette de degustation pour cocktails

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18

PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20

TP Transmission of property

Owner name: GE PRECISION HEALTHCARE LLC, US

Effective date: 20250306