JP5090641B2 - 大面積トランスデューサ・アレイ - Google Patents
大面積トランスデューサ・アレイ Download PDFInfo
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- JP5090641B2 JP5090641B2 JP2005347492A JP2005347492A JP5090641B2 JP 5090641 B2 JP5090641 B2 JP 5090641B2 JP 2005347492 A JP2005347492 A JP 2005347492A JP 2005347492 A JP2005347492 A JP 2005347492A JP 5090641 B2 JP5090641 B2 JP 5090641B2
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
12 基材
14 前面
16 背面
18 トランスデューサ
20 X方向
22 Y方向
24、64 Z方向
26 タイル型トランスデューサ・アレイ
28 もう一つの実施形態
30 介在層
32 はんだバンプ
34 第一の面
36 第二の面
38 長さ
40 幅
42、44 コネクタ
46 積層アセンブリ
48 電子装置
50 積層型三次元アセンブリ
52 積層型電子装置
54、56、58、60 電子装置の層
62 貫通孔バイア
66 積層型電子装置を関連するトランスデューサ素子と位置揃えするステップ
Claims (5)
- 前面(14)及び背面(16)を含む基材(12)と、
該基材(12)の前記前面(14)に配設されて、トランスデューサ・アレイ(26)を形成するように水平(20)方向及び垂直(22)方向に位置揃えされた複数のトランスデューサ(18)であって、その各々が、対応する入力信号を検知するように構成されている複数のトランスデューサ(18)と、
前記基材(12)の前記背面(16)に配設されている複数のコネクタと、
を備えたトランスデューサ・アレイ(10)であって、
前記複数のトランスデューサ(18)は物理的トランスデューサを含んでおり、前記コネクタは前記複数のトランスデューサ(18)に接続されており、
前記複数のトランスデューサ(18)の各々が前記複数のコネクタの1つ以上のそれぞれを介して前記基材(12)の前記背面(16)に配置された複数の電子装置のうちの対応する1個と電気的に結合するように前記複数のコネクタは配置されており、
相互接続を介して、前記複数の電子装置の各々が前記トランスデューサ・アレイ(26)の前記複数のトランスデューサ(18)に結合される
積層型トランスデューサ・アレイ。 - 第一の層に配設されて、複数のトランスデューサ(18)に結合されており、複数の入力信号を処理するように構成されている複数の電子装置と、
第二の層に配設されて、前面(14)及び背面(16)を含んでいる基材(12)と、
該基材(12)の前記背面(16)に配設されている電気的相互接続層と、
前記基材(12)の前記前面(14)上で第三の層に配設されて、複数の入力信号を検知するように構成されている複数のトランスデューサ(18)と、
を備え、
前記複数のトランスデューサ(18)が前記基材(12)及び前記相互接続層を通って前記複数の電子装置のうちの対応する1個と電気的に結合され、
相互接続を介して、前記複数の電子装置の各々が前記複数のトランスデューサ(18)に結合される
積層型トランスデューサ・アレイ。 - 前記複数のトランスデューサ(18)は、トランスデューサの大面積アレイを組み立てるようにタイル状に配置されている、請求項2に記載の積層型トランスデューサ・アレイ。
- 前記電子装置は、前記トランスデューサに電気的に結合されている少なくとも1個の信号プロセッサを含んでいる、請求項2に記載の積層型トランスデューサ・アレイ。
- 前記複数のトランスデューサ(18)と前記複数の電子装置のうちの対応する1個との間に配置されて、前記複数のトランスデューサ(18)と前記複数の電子装置のうちの対応する1個との間の電気的接続を容易にするように構成されている介在層(30)をさらに含んでいる請求項2に記載の積層型トランスデューサ・アレイ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/003,054 | 2004-12-03 | ||
US11/003,054 US7375420B2 (en) | 2004-12-03 | 2004-12-03 | Large area transducer array |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006166443A JP2006166443A (ja) | 2006-06-22 |
JP2006166443A5 JP2006166443A5 (ja) | 2011-08-11 |
JP5090641B2 true JP5090641B2 (ja) | 2012-12-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005347492A Active JP5090641B2 (ja) | 2004-12-03 | 2005-12-01 | 大面積トランスデューサ・アレイ |
Country Status (3)
Country | Link |
---|---|
US (2) | US7375420B2 (ja) |
JP (1) | JP5090641B2 (ja) |
FR (1) | FR2879023B1 (ja) |
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-
2004
- 2004-12-03 US US11/003,054 patent/US7375420B2/en active Active
-
2005
- 2005-11-22 FR FR0511801A patent/FR2879023B1/fr active Active
- 2005-12-01 JP JP2005347492A patent/JP5090641B2/ja active Active
-
2008
- 2008-05-08 US US12/117,608 patent/US7867824B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7375420B2 (en) | 2008-05-20 |
US7867824B2 (en) | 2011-01-11 |
JP2006166443A (ja) | 2006-06-22 |
US20080213933A1 (en) | 2008-09-04 |
FR2879023A1 (fr) | 2006-06-09 |
US20060133198A1 (en) | 2006-06-22 |
FR2879023B1 (fr) | 2016-12-30 |
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