JP5089561B2 - Sensor package and manufacturing method thereof - Google Patents

Description

  The present invention relates to a sensor package for housing a sensor and a manufacturing method thereof.

  With the progress of semiconductor microfabrication technology, ultra-fine sensors such as MEMS (Micro Electro Mechanical System) sensors have been developed, and at the same time, development of a sensor package in which these sensors are packaged is also proceeding (Patent Document 1).

  FIG. 8 is a schematic cross-sectional view showing a configuration of a conventional sensor package 1. A conventional sensor package 1 includes a package body 3 having a sensor chip housing recess 2, a sensor chip 4 housed in the sensor chip housing recess 2, and a protective material filled in a gap between the sensor chip 4 and the sensor chip housing recess 2. 5 The sensor chip housing recess 2 of the package body 3 has an intermediate step 2b, and bonding pads (not shown) arranged on the intermediate step 2b and terminals of the sensor chip 4 are connected by bonding wires (not shown). ing.

The protective material 5 is a resin material for protecting a part of the sensor chip 4, for example, a bonding pad from oxidation and corrosion, and as shown in FIG. 2 of Patent Document 1, the sensor chip housed in the sensor chip housing recess 2. It is common to drop from above 4 and cover and fill the sensor chip 4 and bonding pads (not shown).
Japanese Patent Application Laid-Open No. 2001-116639

  However, in recent years, with the progress of miniaturization and higher density of sensor chips and sensor packages, the spatial distance between the inner wall of the sensor chip housing recess 2 and the outer peripheral side surface of the sensor chip 4 becomes smaller, and the sensor chip is housed in the sensor chip housing recess 2. Even if the protective material 5 is dropped from above the sensor chip 4, the surface tension acts between the inner wall of the sensor chip housing recess 2 and the outer peripheral side surface of the sensor chip 4. 2 and the outer peripheral side surface of the sensor chip 4 may not be distributed between the inner wall and the sensor chip 4, resulting in voids and coating unevenness. Further, since the spatial distance d between the outer peripheral side surface of the sensor chip 4 and the wall surface of the intermediate step portion 2b is particularly small, voids or the like tend to be easily generated in the corner portion 2a of the sensor chip housing recess 2.

  Such voids in the protective material 5 and uneven application of the protective material 5 are distorted in the shape of the package body 3 due to the influence of heat in the resin curing heating process and the heat cycle test which is a product reliability test. There is a fear. Alternatively, the sensor chip 4 receives a stress of voids or coating unevenness in accordance with a temperature change to which the package body 3 is exposed from the outside, and there is a concern about the influence on the sensing characteristics itself.

  The present invention has been made on the basis of the above problem awareness, and a sensor package that can reduce the influence of stress caused by the protective material, and a sensor that can uniformly fill the protective material inside the downsized package. An object is to provide a method for manufacturing a package.

  The inventor forms the present invention based on the viewpoint that the minimum protective material reservoir is formed in the sensor chip housing recess of the package body, and the influence of the stress caused by the protective material can be reduced by the protective material reservoir. It came to do. Moreover, the space between the outer peripheral side surface of the sensor chip and the sensor chip housing recess is secured, and protection is performed by injecting the protective material from the protective material reservoir as the starting point for injecting the protective material at a position lower than the height of the sensor chip. The present invention has been made based on the viewpoint that the material can be uniformly filled.

  That is, the sensor package of the present invention has a sensor chip, a package body having a sensor chip housing recess for housing the sensor chip, and a protective material covering at least a part of the sensor chip, and is provided on the inner wall of the sensor chip housing recess. Is formed with a plurality of protective material reservoirs that partially enlarge the distance from the outer peripheral side surface of the sensor chip, and the planar width of the portion of the protective material reservoir facing the sensor chip is It is characterized by being smaller than the plane width and being filled with a protective material connected to the outer peripheral side surface of the sensor chip and the protective material reservoir.

  It is preferable that two protective material storage portions are formed at symmetrical positions with respect to the center of the sensor chip housing recess.

  In one aspect, the sensor chip housing recess of the package body has an outer frame portion, an intermediate step portion positioned one step lower inside the outer frame portion, and a sensor chip placement positioned one step lower inside the intermediate step portion. The protective material storage part bites into the intermediate step part from the sensor chip mounting part and reaches the inner wall of the outer frame part.

  Moreover, it is preferable that the bonding pad connectable with the terminal of the sensor chip by the bonding wire is arranged on the upper surface of the intermediate step part at a different plane position from the protective material storage part.

  In a preferred embodiment, the sensor chip, the sensor chip housing recess, and the package body have a substantially square planar shape.

  It is preferable that the sensor chip is arranged so that its center coincides with the sensor chip housing recess, and the outer peripheral side surface of the sensor chip and the inner wall of the sensor chip housing recess are substantially equidistant.

  The package body has an outer frame portion, and it is preferable to cover the outer frame portion with a lid portion for sealing the sensor chip housing recess.

  The sensor package manufacturing method of the present invention includes a sensor chip mounting step of mounting a sensor chip in a sensor chip storage recess for storing the sensor chip in the package body, and the terminals of the sensor chip and the package body after the previous mounting. A conductive connection step for connecting the bonding pads to the inner bonding pads, and a protective material reservoir as a starting point for injecting the protective material to the outer peripheral side surface of the connected sensor chip at a position lower than the height of the sensor chip. It is characterized by having a protective material filling step of injecting a protective material and filling the protective material continuously with the outer peripheral side surface of the sensor chip and the protective material reservoir.

  In one aspect of the protective material reservoir, a plurality of parts that partially enlarge the distance from the outer peripheral side surface of the sensor chip are formed on the inner wall of the sensor chip housing recess, and the protective material reservoir is opposed to the sensor chip of the protective material reservoir. The planar width of the portion to be formed is smaller than the planar width of the sensor chip, and in the protective material filling step, it is preferable that the protective material is separately filled from each protective material reservoir.

  According to the sensor package of the present invention, a plurality of protective material reservoirs that partially increase the distance from the outer peripheral side surface of the sensor chip are formed on the inner wall of the sensor chip housing recess, and the sensor chip of the protective material reservoir The plane width of the part opposite to the sensor chip is configured to be smaller than the plane width of the sensor chip, and the protective material is filled with the sensor chip outer peripheral side surface and the protective material reservoir, so the effect of stress caused by the protective material Can be reduced.

  According to the manufacturing method of the sensor package of the present invention, the protective material is injected into the outer peripheral side surface of the sensor chip from the protective material reservoir as a starting point for injecting the protective material at a position lower than the height of the sensor chip. Since the protective material is filled with the outer peripheral side surface and the protective material reservoir, the protective material can be uniformly filled into the downsized package.

(Embodiment 1)
FIG. 1 is a plan view showing a configuration of a sensor package 10 according to Embodiment 1 of the present invention. In FIG. 1, a state without the lid portion 26 is shown, and only the intermediate step portion 23 of the package body 30 is hatched. 2 is a cross-sectional view taken along the line II-II in FIG. 3 is a cross-sectional view taken along the line III-III in FIG.

  As shown in FIG. 1, the sensor package 10 is a cavity package having a package body 30 having a sensor chip housing recess 20 and a sensor chip 40 housed in the sensor chip housing recess 20. Although not shown in FIG. 1, as shown in FIG. 2 or 3, the gap between the sensor chip 40 and the sensor chip housing recess 20 is filled with a protective material 50 that covers at least the sensor chip 40. 2 and 3, the inside of the sensor chip 40 is omitted.

  The package main body 30 is a box-shaped container having a substantially square (for example, 2.5 mm square) planar shape made of a material such as epoxy resin or ceramic. In this embodiment, the package main body 30 rises from the sensor chip mounting portion (inner bottom portion) 21, the intermediate step portion 23 rising from the peripheral edge of the sensor chip mounting portion 21, and the peripheral edge of the intermediate step portion 23. The outer frame portion 25 surrounds the package housing recess 20 of the package body 30. That is, the package body 30 is mounted in order from the outer side, the outer frame portion 25, the lower stepped intermediate step portion 23 along the inner wall 24 of the outer frame portion 25, and the lower stepped sensor chip along the inner wall 22 of the intermediate step portion 23. The sensor chip housing recess 20 is defined by the outer frame part 25, the intermediate step part 23, and the sensor chip mounting part 21.

  The outer frame portion 25 is covered with a lid portion 26 made of, for example, a glass plate or a ceramic plate, and the sensor chip housing recess 20 is sealed by the lid portion 26. In the intermediate step portion 23, four bonding pads 23A to 23D for establishing conduction with the terminals 42A to 42D of the sensor chip 40 are arranged, and these bonding pads 23A to 23D are further extended to the outside of the package. It is electrically connected to a line (not shown). By connecting this lead wire to an external device (for example, a mobile terminal device, an inkjet, etc.), the sensor package 10 functions as an interface with the external device.

  As shown in FIGS. 1 and 2, the sensor chip housing recess 20 has a distance d between the wall surface (inner wall) 22 of the intermediate step portion 23 and the outer peripheral side surface of the sensor chip 40 at substantially equal distances on each side of the sensor chip 40. The shape is set so that At this time, the center of the sensor chip 40 and the center of the sensor chip housing recess 20 (sensor chip mounting portion 21) coincide.

  Next, as shown in FIGS. 1 and 3, the sensor chip housing recess 20 has a pair of protections that extend continuously from the inner wall 22 of the intermediate step part 23 and partially enlarge the distance from the outer peripheral side surface of the sensor chip 40. Material storage portions 60 and 70 are formed. The protective material storage portions 60 and 70 are bitten into the intermediate step portion 23 from the sensor chip mounting portion 21 (the intermediate step portion 23 is removed) and reach the inner wall 24 of the package body 30. In other words, the protective material reservoirs 60 and 70 are formed in a region surrounded by the wall surfaces 60a and 70a of the intermediate step portion 23, and the shape of the wall surfaces 60a and 70a is a substantially rectangular shape in plan view that is line symmetric at the midpoint between them. It has become.

  The plane width w of the portion of the protective material reservoir 60, 70 facing the sensor chip 40 is set smaller than the plane width W of the sensor chip 40. That is, the width w of the inlet portion of the protective material reservoirs 60 and 70 when the package body 10 is viewed in plan is set smaller than the plan width W of the sensor chip 40. When the width w of the protective material reservoirs 60 and 70 is made equal to the width W of the sensor chip 40, the protective material in which the volume (amount) of the protective material filled in the protective material reservoirs 60 and 70 is filled in other locations. This is because it becomes larger than the volume (quantity) of the package and causes distortion of the package itself. Moreover, since the non-formation area | region of the protective material storage parts 60 and 70 in the intermediate | middle step part 23 is thick, it is stable with respect to the internal pressure concerning wall surface 60a, 70a, and the width | variety of the protective material storage parts 60 and 70 Since the width of w is reduced, the thin portion can be minimized.

  The protective material reservoirs 60 and 70 are formed at two positions symmetrical with respect to the center of the sensor chip housing recess 20. Further, the protective material reservoirs 60 and 70 have the same accommodation volume, and are 180 degrees rotationally symmetric with respect to the center of the sensor chip housing recess 20. Since the protective material reservoirs 60 and 70 are formed in symmetrical positions in this way, the balance is improved, and the sensor package 10 cancels out distortion caused by the protective material 50 filled in the protective material reservoirs 60 and 70. A matching action is obtained.

  As shown in FIGS. 1 to 3, the space between the wall surface 22 of the intermediate step portion 23 and the outer peripheral side surface of the sensor chip 40 is connected to the protective material storage portions 60 and 70. That is, the protective material 50 is connected to the space between the wall surface 22 of the intermediate step portion 23 and the outer peripheral side surface of the sensor chip 40 (the non-formation region of the protective material storage portions 60 and 70) and the protective material storage portions 60 and 70. Filled. Further, the protective material reservoirs 60 and 70 are arranged at different planar positions from the bonding pads 23 </ b> A to 23 </ b> D on the upper surface of the intermediate step part 23.

  The sensor chip 40 is a fine sensor element having a substantially square (for example, 1 mm square) planar shape, and is, for example, a MEMS sensor such as an acceleration sensor, a pressure sensor, or a gyro sensor. The sensor chip 40 is bonded to the sensor chip mounting portion 21 of the sensor chip housing recess 20 with a die bond resin 41. The sensor chip 40 is similar (substantially square) in planar shape to the inner periphery of the sensor chip housing recess 20 (sensor chip mounting portion 21).

  The spatial distance d between the side surface of the sensor chip 40 and the wall surface 22 of the intermediate step portion 23 that is a non-formation region of the protective material storage portions 60 and 70 is, for example, about 0.25 mm (FIG. 2). The spatial distance D with respect to the wall surface 22 of the intermediate step portion 23 that is the formation region of the protective material storage portions 60 and 70 is, for example, about 0.5 mm (FIG. 3). Further, terminals 42A to 42D are provided at the four corners of the upper surface of the sensor chip 40. These terminals 42A to 42D and the bonding pads 23A to 23D arranged in the intermediate step portion 23 are electrically connected by bonding wires 43A to 43D. Connected.

  The protective material 50 is made of an electrically insulating resin material (for example, silicone resin, fluorine-based resin, etc.), is filled in the gap between the sensor chip 40 and the sensor chip housing recess 20, and covers at least a part of the sensor chip 40. Yes. Since the sensor chip 40 and its terminals 42A to 42D, the bonding wires 43A to 43D, and the bonding pads 23A to 23D are liable to be deteriorated due to oxidation, corrosion or the like, the protective material 50 filled in the sensor chip housing recess 20 is used for these elements. To ensure an electrical signal path. For example, if the bonding wires 43 </ b> A to 43 </ b> D are formed of a noble metal (such as gold) that hardly deteriorates due to oxidation or corrosion, the terminals 42 </ b> A to 42 </ b> D of the sensor chip 40 and the bonding pads 23 </ b> A to 23 </ b> D may be covered with the protective material 50. That's fine.

  As described above, according to the sensor package 10 of the present embodiment, even when the sensor chip and the sensor package are relatively miniaturized and densified, the influence of stress caused by the protective material can be reduced. That is, according to the sensor package 10 of the present embodiment, the sensor package 10 having a small and low profile and a highly reliable structure can be realized.

  Next, a method for manufacturing the sensor package 10 according to the present embodiment will be described with reference to FIGS. The sensor package 10 of the present embodiment is manufactured by the following manufacturing process.

1. First, the package body 30 configured as shown in FIG. 1 is manufactured (or prepared). As shown in FIG. 2 or 3, if the sensor package 10 is a ceramic package, for example, an unfired ceramic sheet in which a mixed slurry of ceramic raw material powder, organic binder, plasticizer, solvent and the like is formed in a sheet shape is prepared. To do. Then, ceramic sheets 12 and 13 hollowed into a predetermined shape are laminated on the ceramic sheet 11 in the order shown in FIG. 2 or 3, and the integrated sheet is fired and individualized to form the sensor package body 30. Here, the shape of hollowing out the ceramic sheet 12 serving as the intermediate step portion 23 is determined in consideration of the size of the sensor chip 40 to be housed, and the shapes of the protective material storage portions 60 and 70 are also hollowed out. The shape of the ceramic sheet 13 is also formed in consideration of the outer frame portion 25.

2. Next, as shown in FIG. 2 or 3, the die bonding resin 41 is applied to the sensor chip mounting portion 21 of the sensor chip housing recess 20 of the package body 30, and the sensor chip 40 is mounted. The die bond resin 41 is cured, and the sensor chip 40 is fixed in the sensor chip housing recess 20. Since the sensor chip 40 and the sensor chip storage recess 20 (sensor chip mounting portion 21) are similar in plan shape, the positioning of the sensor chip 40 mounted in the sensor chip storage recess 20 can be easily performed.

3. Next, as shown in FIG. 1, the terminals 42A to 42D of the fixed sensor chip and the bonding pads 23A to 23D are connected by bonding wires 43A to 43D.

4). 4. Protective Material Filling Step Then, the protective material 50 is injected from the tip 51a of the protective material injection nozzle 51 in a state where the protective material injection nozzle 51 shown in FIG. Specifically, the protective material injection nozzle 51 is advanced into the protective material reservoirs 60 and 70, and the protective material 50 is injected from the position where the tip 51a is below the upper surface of the sensor chip 40.

  The tip diameter Nd of the tip 51a of the protective material injection nozzle 51 is, for example, about 0.35 mm, and in order to maintain the injection pressure for pushing out the protective material 50 having a certain viscosity, further dramatic reduction in size can be expected. Absent. That is, while there is a limit to downsizing the protective material injection nozzle in order to extrude the protective material having a certain viscosity, the downsizing of the sensor chip and the sensor package is progressing independently of this, so the protective material injection nozzle However, there is a situation where the sensor package becomes relatively small. If the protective material is injected to the sensor package thus miniaturized using the protective material injection nozzle, the nozzle tip and the intermediate step may interfere (contact) and prevent smooth injection of the protective material. is there. Inevitably, even if the protective material is injected at a position higher than the height of the sensor chip, the spatial distance (clearance) between the outer peripheral side surface of the sensor chip and the wall surface of the sensor chip housing recess is small. It does not go down to every corner between the wall surface of the sensor chip housing recess, and voids and coating unevenness occur. Stress tends to concentrate on the voids and uneven coating areas, and the durability and operational stability of the element are reduced.

  Therefore, in the sensor package 10 of the present embodiment, the protective material injection nozzle 51 is caused to enter the protective material reservoirs 60 and 70 so that the position lower than the height of the sensor chip 40 is the starting point for injecting the protective material 50. (FIG. 4).

  That is, the spatial distance D from the outer peripheral side surface of the sensor chip 40 to the inner wall 24 of the package body 30 satisfies the relationship of the tip diameter Nd of the protective material injection nozzle 51, and the planar width W of the sensor chip 40> the protective material storage unit 60, By satisfying the relationship of the plane width w of the portion 70 facing the sensor chip 40> the tip diameter Nd of the protective material injection nozzle 51, the protective material injection nozzle 51 is protected in the state of reaching the bottom surface of the sensor chip housing recess 20 The material 50 can be injected. That is, the protective material reservoirs 60 and 70 serve as a sink for the tool (protective material injection nozzle 51) when the protective material 50 is injected into the ultrafine sensor package 10.

  As a result, the injected protective material 50 first goes around the sensor chip 40 continuously with the protective material reservoirs 60 and 70 while covering the side surface of the sensor chip 40 through the protective material reservoirs 60 and 70. It will be filled. Since the space around the protective material reservoirs 60 and 70 and the sensor chip 40 is connected in the same plane as the sensor chip mounting portion 21, the protective material 50 injected from a position lower than the upper surface of the sensor chip 40 is It spreads in the plane direction and can surround the periphery of the sensor chip 40, and the action such as surface tension hardly acts on the corners.

  When the protective material 50 is injected from the protective material reservoirs 60 and 70 using the protective material reservoir 60 as a starting point and then the protective material 50 is injected starting from the protective material reservoir 70, more uniform filling is possible. The amount of the protective material 50 injected from the protective material reservoir 60 as the starting point is preferably the same as the amount of the protective material 50 injected from the protective material reservoir 70 as the starting point from the viewpoint of uniform filling. Uniformity is increased by alternately injecting the protective material 50 starting from the protective material reservoir 60 and injecting the protective material 50 starting from the protective material reservoir 70 with the same amount of protective material injection. It is possible.

  Alternatively, the protective material reservoirs 60 and 70 may be formed by using a nozzle that injects the protective material 50 starting from the protective material reservoir 60 and a plurality of nozzles that inject the protective material 50 starting from the protective material reservoir 70. It is also possible to inject from both simultaneously. According to the manufacturing method of the sensor package of the present embodiment, the protective material 50 can be spread over the entire periphery of the sensor chip in a state where generation of voids and coating unevenness is suppressed. The protective material 50 is filled on the intermediate step portion 23 while covering the upper surface of the sensor chip 40 so as to overflow from the space area when the space area on the side surface of the sensor chip 40 is filled. In this manner, the protective material 50 is uniformly and uniformly filled in order from the bottom surface of the sensor chip housing recess 20.

  Further, after the protective material 50 fills the space area on the side surface of the sensor chip 40, the protective material 50 may be dropped from above the sensor chip 40 to protect the sensor chip. Further, if the bonding wires 43A to 43D are made of a noble metal (gold or the like) that hardly deteriorates due to oxidation or corrosion, the protection of the range covering the sensor chip 40 and its terminals 42A to 42D and the bonding pads 23A to 23D. It is possible to fill with the amount of resin of the material 50, and it is possible to minimize the stress applied to the sensor chip 40 from the protective material 50.

  In addition, since the protective material reservoirs 60 and 70 are arranged at different planar positions from the arrangement portions of the bonding pads 23A to 23D of the intermediate step portion 23, the protective material injection entering the protective material reservoirs 60 and 70 is performed. The nozzle 51 does not interfere with the bonding wires 43A to 43D, and the protective material 50 can be smoothly injected.

5. Heat-curing process of protective material After the injection of the protective material 50 is completed, the protective material 50 is heat-cured and gelled. In this case, the sensor chip 40 and the sensor chip storage recess 20 (sensor chip mounting portion 21) have a substantially square planar shape, so that the package main body 30 due to heat applied to the protective material 50 or an external load after completion. Can be prevented or warping can be reduced. Further, by disposing the sensor chip 40 at a substantially central portion of the sensor chip housing recess 20 (sensor chip mounting portion 21), bonding wires 43A to 43D for electrically connecting the sensor chip terminals 42A to 42D and the bonding pads 23A to 23D are provided. It can be formed symmetrically inside the package, and the operational stability of the sensor package 10 is improved.

6). Step of Sealing Sensor Chip Housing Concave Finally, the package lid portion 26 that seals the sensor chip housing concave portion 20 is put on the outer frame portion 25 of the package body 30. As a result, airtightness or dustproofness inside the package is ensured, and deterioration of the sensor chip terminals 42A to 42D and bonding wires 43A to 43D and dust mixing into the package can be prevented.

(Embodiment 2)
FIG. 5 is a plan view showing the configuration of the sensor package 100 according to Embodiment 2 of the present invention. In FIG. 5, a state without the lid portion 26 is shown, and only the intermediate step portion 23 of the package body 30 is hatched. The description of the same configuration as the configuration of the sensor package 10 according to Embodiment 1 of the present invention is the same as that of the sensor package 10, and the detailed description is omitted.

  The sensor package 100 is provided with four protective material reservoirs at positions corresponding to the sides of the sensor chip 40, that is, positions corresponding to the four sides. That is, as shown in FIG. 5, the protective material reservoirs 80 and 90 are further provided than the sensor package 10. The configuration of the protective material reservoirs 80 and 90 is the same as that of the protective material reservoirs 60 and 70, and detailed description thereof is omitted. Since the sensor package 100 is provided with four protective material reservoirs and has higher symmetry, the influence of stress caused by the protective material can be further reduced. Note that the number of the protective material reservoirs can be changed as appropriate according to the amount of the protective material to be filled.

  Next, a modified example of the shape of the protective material reservoir will be described with reference to FIGS. 6 and 7 are partial schematic views showing a plan view shape of the protective material reservoir. In each of the embodiments described above, the wall surface 60a of the protective material reservoir 60 has a substantially rectangular shape in plan view. However, as shown in FIG. 6, even if the wall surface 60a of the protective material reservoir 60 has a circular arc shape in plan view. As shown in FIG. 7, the wall surface 60 a of the protective material reservoir 60 may not be in contact with the inner wall 24 of the package body 30. 6 and 7, only the protective material reservoir 60 is shown, but the shape of the protective material reservoirs 70, 80, 90 can be similarly modified.

  In each of the above embodiments, the spatial distance d between the side surface of the sensor chip 40 and the wall surface 22 of the intermediate step portion 23 which is a non-formation region of the protective material storage portions 60 and 70 (80, 90), The spatial distance D between the side surface and the wall surface 22 of the intermediate step 23 which is the formation region of the protective material reservoirs 60 and 70 (80, 90), the planar width w of the protective material reservoirs 60 and 70 (80, 90), and The value of the planar width W of the sensor chip 40 has been specifically exemplified and described, but the present invention is not limited to this, and various modifications can be made. That is, the present invention can be applied to any sensor package that is miniaturized and densified and a method for manufacturing the same.

  In the above embodiment, the case where the sensor chip 40 is a MEMS sensor has been described as an example. However, the sensor chip 40 may be a magnetic sensor, a CCD (Charged Coupled Device) sensor, a CMOS (Complementary Metal Oxide Semiconductor) sensor, or the like. It can be set as an image sensor and other various ultrafine sensors.

  In the above embodiment, the planar shape of the sensor chip 40, the sensor chip housing recess 20, and the package body 30 is a substantially square similar shape, but the present invention is not limited to this. For example, the planar shape of the sensor chip and the sensor chip housing recess may be a similar shape such as a circle or an ellipse.

It is a top view which shows the structure of the sensor package which concerns on Embodiment 1 of this invention. It is sectional drawing which follows the II-II line of FIG. It is sectional drawing which follows the III-III line of FIG. It is a figure which shows injection | emission of the protective material to a protective material storage part. It is a top view which shows the structure of the sensor package which concerns on Embodiment 2 of this invention. It is a partial schematic diagram which shows the planar view shape of the 1st modification of a protective material storage part. It is a partial schematic diagram which shows the planar view shape of the 2nd modification of a protective material storage part. It is a schematic sectional drawing which shows the structure of the conventional sensor package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,100 Sensor package 11, 12, 13 Ceramic sheet 20 Sensor chip accommodation recessed part 21 Sensor chip mounting part 22 Wall surface 23 of intermediate | middle step part Intermediate | middle step part 23A-23D Bonding pad 24 Inner wall 25 of outer frame part Outer frame part 26 Lid Part 30 package body 40 sensor chip 41 die bond resin 42A-42D sensor chip terminal 43A-43D bonding wire 50 protective material 51 protective material injection nozzle 51a nozzle tip 60, 70, 80, 90 protective material storage 60a, 70a, 80a, 90a Wall surface of protective material reservoir

Claims (9)

A sensor chip;
A package body having a sensor chip housing recess for housing the sensor chip;
A protective material covering at least a part of the sensor chip;
A plurality of protective material reservoirs that partially enlarge the distance from the outer peripheral side surface of the sensor chip are formed on the inner wall of the sensor chip housing recess,
The plane width of the portion of the protective material reservoir that faces the sensor chip is smaller than the plane width of the sensor chip, and the protective material is filled with the sensor chip outer peripheral side surface and the protective material reservoir. ,
Sensor package characterized by   The sensor package according to claim 1, wherein the protective material reservoir is formed at two positions symmetrical with respect to the center of the sensor chip housing recess.   The sensor chip housing recess of the package body has an outer frame portion, an intermediate step portion positioned one step lower inside the outer frame portion, and a sensor chip mounting portion positioned one step lower inside the intermediate step portion. The sensor package according to claim 1, wherein the protective material storage portion bites into the intermediate step portion from the sensor chip mounting portion and reaches an inner wall of the outer frame portion.   The sensor package according to claim 3, wherein bonding pads that can be connected to the terminals of the sensor chip by bonding wires are arranged on the upper surface of the intermediate step portion so as to be different in a planar position from the protective material storage portion.   The sensor package according to any one of claims 1 to 4, wherein the sensor chip, the sensor chip storage recess, and the package body have a substantially square planar shape.   The sensor package according to claim 5, wherein the sensor chip is arranged so that a center thereof coincides with the sensor chip housing recess, and an outer peripheral side surface of the sensor chip and an inner wall of the sensor chip housing recess are substantially equidistant.   The sensor package according to any one of claims 1 to 6, wherein the package body has an outer frame portion, and a lid portion for sealing the sensor chip housing recess is covered on the outer frame portion. A sensor chip mounting step of mounting the sensor chip in a sensor chip storage recess for storing the sensor chip in the package body;
A conductive connection step of connecting the terminals of the sensor chip and the bonding pads in the package body after bonding by a bonding wire;
A protective material is injected into the outer peripheral side surface of the connected sensor chip from a protective material reservoir as a starting point for injecting the protective material at a position lower than the height of the sensor chip, and the outer peripheral side surface of the sensor chip and the protective material reservoir A protective material filling process in which the protective material is filled in a row, and
A method for manufacturing a sensor package, comprising:   A plurality of the protective material storage portions are formed on the inner wall of the sensor chip storage recess to partially enlarge the distance from the outer peripheral side surface of the sensor chip. 9. The method of manufacturing a sensor package according to claim 8, wherein a planar width is configured to be smaller than a planar width of the sensor chip, and in the protective material filling step, the protective material is separately filled from each protective material reservoir.

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