JP5087869B2 - 基板の両面に実装可能な集積回路装置及び電子機器 - Google Patents
基板の両面に実装可能な集積回路装置及び電子機器 Download PDFInfo
- Publication number
- JP5087869B2 JP5087869B2 JP2006187949A JP2006187949A JP5087869B2 JP 5087869 B2 JP5087869 B2 JP 5087869B2 JP 2006187949 A JP2006187949 A JP 2006187949A JP 2006187949 A JP2006187949 A JP 2006187949A JP 5087869 B2 JP5087869 B2 JP 5087869B2
- Authority
- JP
- Japan
- Prior art keywords
- signal
- terminal
- terminals
- output
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/409—Mechanical coupling
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0404—Matrix technologies
- G09G2300/0408—Integration of the drivers onto the display substrate
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Semiconductor Integrated Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006187949A JP5087869B2 (ja) | 2005-08-05 | 2006-07-07 | 基板の両面に実装可能な集積回路装置及び電子機器 |
| US11/462,066 US7646381B2 (en) | 2005-08-05 | 2006-08-03 | Integrated circuit device mountable on both sides of a substrate and electronic apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005228082 | 2005-08-05 | ||
| JP2005228082 | 2005-08-05 | ||
| JP2006187949A JP5087869B2 (ja) | 2005-08-05 | 2006-07-07 | 基板の両面に実装可能な集積回路装置及び電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007070780A Division JP5087961B2 (ja) | 2005-08-05 | 2007-03-19 | 基板の両面に実装可能な集積回路装置及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007067377A JP2007067377A (ja) | 2007-03-15 |
| JP2007067377A5 JP2007067377A5 (enExample) | 2007-05-10 |
| JP5087869B2 true JP5087869B2 (ja) | 2012-12-05 |
Family
ID=37831256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006187949A Expired - Fee Related JP5087869B2 (ja) | 2005-08-05 | 2006-07-07 | 基板の両面に実装可能な集積回路装置及び電子機器 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7646381B2 (enExample) |
| JP (1) | JP5087869B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012937A (ja) * | 2005-06-30 | 2007-01-18 | Seiko Epson Corp | 表示ドライバ |
| JP4956143B2 (ja) * | 2006-11-02 | 2012-06-20 | 株式会社東芝 | 半導体メモリカード、ホスト装置、及びデータ転送方法 |
| KR101034718B1 (ko) * | 2009-10-13 | 2011-05-17 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시장치 |
| JP5866904B2 (ja) | 2011-09-14 | 2016-02-24 | 株式会社リコー | 回路装置および液滴吐出装置 |
| TWI724059B (zh) * | 2016-07-08 | 2021-04-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置、顯示模組及電子機器 |
| US11482155B2 (en) | 2018-07-20 | 2022-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Receiving circuit |
| TWI696921B (zh) * | 2019-03-28 | 2020-06-21 | 威鋒電子股份有限公司 | Usb積體電路 |
| KR20250024684A (ko) * | 2023-08-11 | 2025-02-19 | 삼성디스플레이 주식회사 | 표시 장치 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303366A (ja) * | 1997-04-30 | 1998-11-13 | Mitsubishi Electric Corp | 半導体装置 |
| JP3484365B2 (ja) * | 1999-01-19 | 2004-01-06 | シャープ株式会社 | 半導体装置用パッケージ、この半導体装置用パッケージのテスト時に使用するプローブカード、および、このプローブカードを用いたパッケージのテスト方法 |
| JP3362843B2 (ja) * | 1999-12-22 | 2003-01-07 | 日本電気株式会社 | 液晶表示装置及びその信号送受方法並びに液晶パネル |
| JP2001236303A (ja) | 2000-02-25 | 2001-08-31 | Nec Microsystems Ltd | ユニバーサル・シリアル・バス制御回路 |
| TW538364B (en) | 2001-12-10 | 2003-06-21 | Via Tech Inc | USB control circuit capable of automatically switching paths |
| GB2383137B (en) * | 2001-12-17 | 2005-06-29 | Micron Technology Inc | DVI link with circuit and method for test |
| JP2004341101A (ja) * | 2003-05-14 | 2004-12-02 | Nec Corp | 表示パネル駆動装置 |
| JP4370913B2 (ja) * | 2004-01-07 | 2009-11-25 | セイコーエプソン株式会社 | マクロセル、集積回路装置、及び電子機器 |
| JP4809590B2 (ja) * | 2004-03-31 | 2011-11-09 | エーユー オプトロニクス コーポレイション | 電子装置 |
| TWI266477B (en) * | 2005-03-29 | 2006-11-11 | Realtek Semiconductor Corp | Chip with adjustable pinout function and method thereof |
-
2006
- 2006-07-07 JP JP2006187949A patent/JP5087869B2/ja not_active Expired - Fee Related
- 2006-08-03 US US11/462,066 patent/US7646381B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007067377A (ja) | 2007-03-15 |
| US7646381B2 (en) | 2010-01-12 |
| US20070055812A1 (en) | 2007-03-08 |
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