JP5078478B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5078478B2
JP5078478B2 JP2007189189A JP2007189189A JP5078478B2 JP 5078478 B2 JP5078478 B2 JP 5078478B2 JP 2007189189 A JP2007189189 A JP 2007189189A JP 2007189189 A JP2007189189 A JP 2007189189A JP 5078478 B2 JP5078478 B2 JP 5078478B2
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Japan
Prior art keywords
antenna
semiconductor chip
electrode
recess
semiconductor device
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Expired - Fee Related
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JP2007189189A
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English (en)
Japanese (ja)
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JP2008052721A5 (enrdf_load_stackoverflow
JP2008052721A (ja
Inventor
舜平 山崎
康行 荒井
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2007189189A priority Critical patent/JP5078478B2/ja
Publication of JP2008052721A publication Critical patent/JP2008052721A/ja
Publication of JP2008052721A5 publication Critical patent/JP2008052721A5/ja
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JP2007189189A 2006-07-28 2007-07-20 半導体装置 Expired - Fee Related JP5078478B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007189189A JP5078478B2 (ja) 2006-07-28 2007-07-20 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006206798 2006-07-28
JP2006206798 2006-07-28
JP2007189189A JP5078478B2 (ja) 2006-07-28 2007-07-20 半導体装置

Publications (3)

Publication Number Publication Date
JP2008052721A JP2008052721A (ja) 2008-03-06
JP2008052721A5 JP2008052721A5 (enrdf_load_stackoverflow) 2010-08-26
JP5078478B2 true JP5078478B2 (ja) 2012-11-21

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JP2007189189A Expired - Fee Related JP5078478B2 (ja) 2006-07-28 2007-07-20 半導体装置

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JP (1) JP5078478B2 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5029252B2 (ja) * 2007-09-26 2012-09-19 株式会社村田製作所 無線ｉｃデバイス
JP5029253B2 (ja) * 2007-09-26 2012-09-19 株式会社村田製作所 無線ｉｃデバイス
JP5637004B2 (ja) * 2011-02-23 2014-12-10 株式会社村田製作所 半導体集積回路モジュール、無線通信モジュール及び無線通信デバイス
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
EP3679523B1 (en) * 2017-09-07 2023-02-01 Composecure LLC Transaction card with embedded electronic components and process for manufacture
JP6306258B1 (ja) * 2017-09-20 2018-04-04 誠敏 中野 Ｉｃタグシステム
KR102741051B1 (ko) 2017-10-18 2024-12-09 컴포시큐어 엘엘씨 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
JP6362759B1 (ja) * 2017-12-19 2018-07-25 誠敏 中野 Ｉｃタグ
EP3609066B1 (en) * 2018-08-07 2021-02-24 Mahle International GmbH Electric power inverter
CN111952733B (zh) * 2020-07-03 2023-02-03 深圳捷豹电波科技有限公司 天线板及应用其的无线充电与通讯模块

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1185938A (ja) * 1997-07-17 1999-03-30 Denso Corp Ｉｃカード

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JP2008052721A (ja) 2008-03-06

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