JP5078411B2 - Integrated circuit module - Google Patents

Description

  The present invention relates to an integrated circuit module that transmits and receives information with optical signals between a plurality of electronic devices and / or optical devices housed in a hollow three-dimensional wiring substrate.

  Conventionally, this type of integrated circuit module has a semiconductor integrated circuit integrated with a substrate, and there is a system-in-package (i.e., SiP) in which an electronic device (and an optical device) is mounted on the substrate. There is a printed circuit board (hereinafter referred to as a PCB) on which devices (and optical devices) are mounted, and each optical element is disposed between the mounted electronic devices via wiring on the substrate or by opposing the optical devices. Each of them transmits / receives an electric signal or an optical signal.

  As this conventional integrated circuit module, there is one disclosed in Patent Document 1, which is shown in FIG. 5 as a cross-sectional view of the integrated circuit module.

In the figure, the conventional integrated circuit module is configured by arranging an IC chip 210 and a printed board 220 so as to face each other, and three optical elements are provided on a first surface 210F of the IC chip 210 facing the printed board 220. 212 are arranged side by side, and the first rectangular region R1 is assumed so as to surround the three optical elements 212, and the first protrusions 216 are arranged at each of the four corners of the first rectangular region R1. It is. The printed circuit board 220 is formed with three light guide paths 222 for optical communication with each of the three optical elements 212, and the second light guide path 222 is surrounded by an end arrangement area of the three light guide paths 222. Assuming the rectangular region R2, the second protrusions 224 are arranged at the four corners of the second rectangular region R2. The first protrusion 216 and the second protrusion 224 are disposed adjacent to each other, and the end of the light guide path 222 can be accurately aligned with the position corresponding to the optical element 212.
JP 2006-133467 A

  Since the integrated circuit module according to the background art is configured as described above, the mounted electronic devices must be connected to each other by wiring on the board, limiting the degree of freedom of board design, It had the problem of increasing design time and design effort. Also, in the case of an electronic device to be mounted, a light guide path must be arranged corresponding to each optical device, limiting the degree of freedom of board design as in the case of an electronic device, and design time. And the problem of increasing design effort.

  Further, in the case of the integrated circuit module described in Patent Document 1, the IC chip 210 and the printed circuit board 220 are disposed to face each other, and each of the optical elements 212 is configured to transmit and receive optical signals. In addition to restricting the placement position of the electronic device or the optical device and the degree of freedom in designing the substrate in advance, there is a problem of increasing design time and labor.

  Further, since the integrated circuit module according to the background art is configured to transmit and receive signals between a pair of electronic devices or optical devices, it is possible to connect between a plurality of electronic devices or optical devices. When transmitting and receiving signals, the arrangement of wiring and light guides is complicated, which limits the degree of freedom for further board design, and increases the design time and design effort. .

  In particular, when the planar substrate on which the electronic device or the optical device is mounted is constituted by a three-dimensional solid substrate having a three-dimensional structure such as a three-dimensional structure, the three-dimensionally mounted electronic devices or optical devices are associated with each other. It has the subject that it becomes very difficult to connect with wiring, a light guide path, etc.

  The present invention has been made in order to solve the above-described problems. The present invention expands the degree of freedom in layout design of a plurality of electronic devices or optical devices mounted on a three-dimensionally shaped three-dimensional wiring board, and minimizes design time and labor. The purpose is to propose an integrated circuit module which can be designed in a small number.

An integrated circuit module according to the present invention includes a three-dimensional wiring substrate formed in a hollow three-dimensional shape, and a plurality of components that are disposed on a hollow inner surface of the three-dimensional wiring substrate and transmit and / or receive information using optical signals. An integrated circuit module comprising an electronic device and / or an optical device, wherein the electronic device and / or the optical device pass through the solid wiring substrate and a terminal disposed at a lower outer periphery of the solid wiring substrate. A via connected to the back side and a wiring disposed between the via and the terminal on the outer peripheral surface of the three-dimensional wiring substrate, wherein the one electronic device and / or the optical device is a plurality of other electronic devices. And / or transmission and / or reception of information by optical signals with the optical device.

Thus, in the present invention, a plurality of electronic devices that transmit and / or receive information with optical signals are disposed on the hollow inner surface of a three-dimensional wiring substrate formed in a hollow three-dimensional shape, and the three- dimensional wiring A terminal is disposed at the lower end of the outer periphery of the substrate, a via is connected to the back side of the electronic device and / or the optical device through the three-dimensional wiring substrate, and between the via and the terminal on the outer peripheral surface of the three-dimensional wiring substrate Wiring is arranged in this one electronic device and / or optical device so that information can be transmitted and / or received by optical signals with other electronic devices and / or optical devices. It is possible to transmit and receive information at the same time without being restricted by the position where each electronic device and optical device are arranged, and is mounted on a three-dimensional wiring substrate. While a larger degree of freedom in layout design of the number of electronic devices or optical devices, an effect that the design time and effort can be designed as small as possible.

  In addition, the integrated circuit module according to the present invention may change an optical signal transmitted and / or received by one electronic device and / or an optical device to a frequency different for each of a plurality of other electronic devices and / or optical devices as necessary. To do.

  As described above, in the present invention, an optical signal transmitted and / or received by one electronic device and / or optical device is set to a different frequency for each of a plurality of other electronic devices and / or optical devices. Based on this, it is possible to reliably transmit information between the corresponding electronic device and / or optical device, and freedom of layout design of a plurality of electronic devices or optical devices mounted on a three-dimensional solid wiring substrate. In addition to expanding the degree, the design time and labor can be reduced as much as possible.

  In addition, the integrated circuit module according to the present invention is different for each of a plurality of other electronic devices and / or optical devices in an optical signal in which one electronic device and / or an optical device transmits and / or receives information as necessary. An identifier is assigned, and transmission and / or reception is performed with an optical signal of information to which the different identifier is added.

  As described above, in the present invention, different identifiers are assigned to optical signals transmitted and / or received by one electronic device and / or optical device for each of a plurality of other electronic devices and / or optical devices. By transmitting and / or receiving an optical signal of information to which an identifier is added, information can be reliably transmitted between the corresponding electronic device and / or optical device based on the identifier. In addition to increasing the degree of freedom in designing the arrangement of a plurality of electronic devices or optical devices mounted on the original three-dimensional wiring substrate, the design time and labor can be reduced as much as possible.

  Further, in the integrated circuit module according to the present invention, if necessary, the hollow inner surface of the three-dimensional wiring substrate absorbs an optical signal transmitted from the electronic device and / or the optical device disposed on the inner surface. It is formed by the body.

  Thus, in the present invention, the hollow inner side surface of the three-dimensional wiring substrate is formed of a light absorber that absorbs an optical device and / or an optical signal transmitted from the optical device disposed on the inner side surface. In addition, it is possible to prevent erroneous reception due to the optical signal reflected from the inner surface, and to increase the degree of freedom in the layout design of a plurality of electronic devices or optical devices mounted on the three-dimensional shape three-dimensional wiring substrate, as well as design time and labor Can be designed as little as possible.

(First embodiment of the present invention)
An integrated circuit module according to a first embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view for explaining the basic operation of the integrated circuit module according to the present embodiment, FIG. 2 is a circuit board mounting mode diagram of the integrated circuit module according to the present embodiment, and FIG. FIG. 4 shows a signal format of an optical signal used in the integrated circuit module shown in FIG.

  In each of the drawings, the integrated circuit module according to the present embodiment is disposed on the three-dimensional wiring substrate 1 formed in a three-dimensional shape having the hollow portion 11 and the inner surface 12 of the hollow portion 11 of the three-dimensional wiring substrate 1. A plurality of electronic devices 21 to 27 that transmit and / or receive information by optical signals, and the one electronic device 21 communicates with the other six electronic devices 22 to 27. It is the structure which performs transmission and / or reception of information by.

  The three-dimensional wiring substrate 1 is disposed at the lower end of the outer periphery, sends and receives signals from the outside, and is attached to the terminal 13 for inputting power and the inner surface 12 over almost the entire surface to transmit optical signals. It is the structure provided with the light absorber 14 which absorbs. A wiring 3 is disposed on the outer peripheral surface of the three-dimensional wiring substrate 1, and the wiring 3 passes through the three-dimensional wiring substrate 1 and is connected between the vias 31 and the terminals 13 connected to the back side of the electronic devices 21 to 27. It is the structure arrange | positioned by this predetermined path | route.

  The electronic device 21 includes a calculation control unit and a photoelectric conversion unit (not shown), and includes an optical signal transmission unit 21a that transmits an optical signal converted by the photoelectric conversion unit. Similarly to the electronic device 21, the electronic devices 22 to 27 have an arithmetic control unit, and include an optical signal receiving unit and a photoelectric conversion unit (not shown) that receive the optical signal and perform photoelectric conversion. It is a configuration. Note that each of the electronic devices 21 to 27 can be configured to include an optical signal transmission and reception unit that transmits and receives an optical signal, and can also be configured to transmit and receive an optical signal between each other.

  Next, the manufacturing process of the integrated circuit module according to the present embodiment based on the above configuration and the operation mode of the manufactured integrated circuit module will be described.

  First, regarding the manufacturing process of the integrated circuit module according to the present embodiment, the via 31 is formed at a predetermined position of the two-dimensional flat plate-like insulating base material with the three-dimensional wiring substrate 1 in an unfolded state, and at the lower end of the outer periphery of the surface. A plurality of terminals 13 are formed, and the wiring 3 is formed between the plurality of terminals 13 and the vias 31.

  In addition, the electronic devices 21 to 27 are mounted at positions corresponding to the vias 31 on the back surface side of the three-dimensional wiring substrate 1. In addition, the light absorber 14 which absorbs an optical signal beforehand is stuck on the whole back surface of the said plate-shaped insulating base material. The developed three-dimensional wiring substrate 1 is formed by bending each side into a three-dimensional cube.

  As shown in FIG. 2, the integrated circuit module having the three-dimensional shape of the three-dimensional wiring substrate 1 is press-fitted into the connector 4 of the wiring board 5 in the direction indicated by the arrow P. 1 is attached in contact with the terminal 13. Since the three-dimensional wiring substrate 1 is press-fitted into the connector 4 due to the elasticity of the plate-like insulating substrate itself constituting the three-dimensional wiring substrate 1 or the elasticity of the connector 4, the wiring board 5 and the three-dimensional wiring substrate 1 The electrical connection to can be more reliably performed.

  Next, an operation mode of the integrated circuit module according to the present embodiment will be described. First, an activation signal from the outside is input through the terminal 41 of the wiring board 5, and the electronic device 21 is activated based on the activation signal. When different information is output from the electronic device 21 to the other electronic devices 22,..., 27, synchronization / control signals of identification codes respectively corresponding to the electronic devices 21,. It is executed in a signal format added to the information signal to be output.

  An optical signal of this signal format is emitted radially from the optical signal transmitters 21a of the electronic devices 21,..., 27 sequentially for each of the other electronic devices 21,. Thus, since the optical signals of the channels ch1,..., Ch6 can be emitted radially without being limitedly emitted to the electronic devices 21,..., 27 from the optical signal transmission unit 21a, each arrangement of the electronic devices 21,. Without being limited to the configuration, an integrated circuit module capable of reliably transmitting and receiving the method can be manufactured easily and accurately.

  The optical signal emitted radially is also emitted to the inner surface 12 of the three-dimensional wiring substrate 1 on which the electronic devices 22 to 27 are not disposed. As a result of absorption by 14, irregular reflection at the light absorber 14 of the three-dimensional wiring substrate 1 can be prevented, and erroneous reception of the electronic devices 22 to 27 can be prevented.

(Other embodiments of the present invention)
In the integrated circuit module according to the embodiment, the optical signal is assigned with an identifier for each of the electronic devices 22 to 27, and the signal format is configured. However, the electronic device 21 is provided for each of the electronic devices 22 to 27. It is also possible to configure with optical signals having different frequencies.

  Moreover, the signal used for transmission / reception between the electronic devices 21 to 27 accommodated in FIG. 1 may be configured by a signal (including radio waves) having a specific wavelength in addition to the optical signal.

  In the integrated circuit module according to the embodiment, the wiring 3 is arranged on the outer peripheral surface of the three-dimensional wiring substrate 1. However, the wiring 3 may be arranged on the inner peripheral surface of the three-dimensional wiring substrate 1. .

  In the integrated circuit module according to the above embodiment, the two-dimensional planar insulating base material is bent to form the hollow three-dimensional wiring substrate 1, but the integrated circuit module according to another embodiment of the present invention is used. In the circuit module, each surface of the three-dimensional wiring substrate 1 to be formed is a plane plate of a small plate piece, and electronic devices 21 to 27 (or optical devices) are disposed on the inner surface of the plane plate, and The wiring 3 and the terminal 13 are disposed on the outer side surface, and these flat plates can be assembled into a three-dimensional shape such as a cube.

  The flat plate has a concave portion (or convex portion) formed at an end portion thereof, and the solid wiring substrate 1 is configured by fitting the concave portion and the convex portion. In addition, a terminal to be electrically connected is provided at each corresponding position of the concave portion and the convex portion, and the terminals can be brought into contact with each other by fitting the concave portion and the convex portion, so that the flat plates can be electrically connected integrally. Become.

  The fine plate piece forming the flat plate can be formed of a microchip made of a low temperature co-fired ceramic substrate (LTCC) or the like. In addition, the flat plate can be assembled by bonding or the like in addition to the fitting assembly.

It is a perspective view for demonstrating the basic operation | movement of the integrated circuit module which concerns on the 1st Embodiment of this invention. FIG. 2 is a circuit board mounting diagram of the integrated circuit module according to the present embodiment. It is the sectional view on the AA line in FIG. 2 is a signal format of an optical signal used in the integrated circuit module shown in FIG. 1. It is sectional drawing of the conventional integrated circuit module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Three-dimensional wiring base | substrate 3 Wiring 4 Connector 5 Wiring board R1 1st rectangular area R2 2nd rectangular area ch1 Channel 11 Hollow part 12 Inner side surface 13, 41 Terminal 14 Optical absorber 21 ... 27 Electronic device 21a Optical signal transmission Part 31 Via 210 IC chip 210F First surface 212 Optical element 216 First protrusion 220 Printed circuit board 222 Light guide 224 Second protrusion ch1 to ch6 Channel P Arrow

Claims (4)

A three-dimensional wiring substrate formed in a hollow three-dimensional shape;
An integrated circuit module comprising a plurality of electronic devices and / or optical devices arranged on the hollow inner surface of the three-dimensional wiring substrate and transmitting and / or receiving information with optical signals,
A terminal disposed at an outer peripheral lower end of the three-dimensional wiring substrate;
A via that penetrates through the three-dimensional wiring substrate and is connected to the back side of the electronic device and / or the optical device;
Wiring disposed between the via and the terminal on the outer peripheral surface of the three-dimensional wiring substrate;
With
An integrated circuit module, wherein the one electronic device and / or optical device transmits and / or receives information by optical signals to and from another plurality of electronic devices and / or optical devices. The integrated circuit module according to claim 1,
An integrated circuit module characterized in that an optical signal transmitted and / or received by said one electronic device and / or optical device has a different frequency for each of a plurality of other electronic devices and / or optical devices. The integrated circuit module according to claim 1,
A different identifier is assigned to each of a plurality of other electronic devices and / or optical devices to the optical signal transmitted and / or received by the one electronic device and / or optical device, and the information to which the different identifier is added. An integrated circuit module characterized by performing transmission and / or reception with an optical signal. The integrated circuit module according to any one of claims 1 to 3,
An integrated circuit module, wherein a hollow inner side surface of the three-dimensional wiring substrate is formed of a light absorber that absorbs an optical signal transmitted from an electronic device and / or an optical device disposed on the inner side surface.