JP2909489B2 - Circuit device and mounting method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an optical integrated circuit (hereinafter referred to as OEIC) and / or an optical element mounting apparatus and a mounting method used for a computer, an equipment control circuit and the like.

[Conventional technology]

 An example of the prior art will be described with reference to FIG.

In FIG. 8, semiconductor elements 4 such as ICs, LSIs, resistors, capacitors and the like are arranged on a printed circuit board 2 called PI (PLUG-IN), and the elements are electrically connected by a printed circuit 6. . When an optical element is mounted, the light output from the light emitting element 8 is coupled to the light receiving element 14 via the optical connector 10 and the fiber cable 12, via the other PI, 2A optical connector 10A.

[Problems to be solved by the invention]

However, in the prior art, a fiber cable, a connector, a light-emitting or light-receiving element, and the like, which are components for connection with a printed wiring or another substrate, are required. Problems tend to occur, workability is poor, and costs are high.

In addition, electric signals are easily affected by disturbance, and there is a limit in noise resistance.

An object of the present invention is to solve the above-described problems, and is excellent in heat resistance, noise resistance, gas resistance, environmental resistance such as pressure resistance, highly reliable in performance, and small in size capable of ultra-high-speed processing. A circuit mounting device and method are provided.

[Means for solving the problem]

In order to achieve the above object, the device of the present invention comprises an OEIC and / or an optical element, which are coupled to each other by light beams, on the inner wall surface of a sealed case in which external light is blocked. The case in which the OEIC or the optical element is attached to the plate may be stored in the case, or the case in which the OEIC or the optical element is attached can be stacked in multiple layers like a ball case box.
In addition, common parts such as a memory and an energy source can be arranged at the center of the case. Further, a light transmission means such as a prism or a mirror is provided in the case, or an energy conversion element for converting electricity to light or light to electricity is provided. A shape memory alloy or a shape memory resin can be used for the case.

Further, the method according to the present invention includes the steps of disposing an OEIC and / or an optical element which are coupled to each other by light beams on the inner surface of the case, and disposing a common part such as a memory or an energy source at the center of the case. This is a method of sealing off and blocking external light, and is a method of multiplexing such cases. A shape memory alloy or a shape memory resin is used for the case, and a three-dimensional shape is memorized by heat treatment.

[Action]

According to the above configuration, since the OEIC and the optical element can be arranged three-dimensionally, connecting parts can be omitted, and a small and highly reliable device can be obtained. Further, the gas resistance is improved by sealing, the pressure resistance is improved by, for example, a spherical case, and the noise resistance is improved by omitting the wiring. Further, by arranging the common components in the center of the case, the transmission from the memory or the energy source to the OEIC or the optical element can be performed efficiently, so that the operation can be speeded up.

Further, by making the case made of a shape memory alloy or a shape memory resin, it is possible to easily manufacture a sealed case in which external light is blocked.

〔Example〕

Hereinafter, some embodiments of the present invention will be described with reference to the drawings. The same components as those of the conventional example are denoted by the same reference numerals, and description thereof is omitted.

(First Embodiment) FIG. 1 shows an example of a cubic case. FIG. 1 (a) is a perspective view showing an entire image of a dark box 30 which is sealed and shielded from external light, and FIG. 1 (b) is a view of FIG. A-A 'cross-sectional view, and FIG.
3 is a perspective view showing an element 32 of the optical element. FIG.

In FIG. 1, an element 32 is mounted on the inner wall surface of a dark box 30. Mirrors 36 are provided at the corners to guide light rays 34 between the three-dimensionally arranged elements 32. By assembling in this manner, electrical wiring and fiber cables can be omitted.

The outer surface of the dark box 30 is provided with a shield 38, which is connected to the ground to increase noise resistance.

The element 32 includes a light emitting diode for coupling between the elements,
A light emitting unit 40 such as a laser and a light receiving unit 42 such as an optical switch are provided. The result of the arithmetic processing in the internal circuit of the element 32 is converted from the light emitting section 40 into a light beam 34, and the light receiving section of another element is
The processing is performed through 42.

An element that transmits the light beam 34 by assembling three-dimensionally
The light-emitting unit 40 and the light-receiving unit 42 are directly connected to each other by, for example, reducing the interval between the light-receiving portions 32 and preventing light from diverging using a condenser lens (not shown). When the elements 32 are not facing each other, the light is
Lead 34 is combined.

Second Embodiment FIG. 2 shows a cross section of a second embodiment in which the case is a polyhedral dark box.

The operation and operation are the same as those of the first embodiment, but the mounting density of the elements 32 is improved by making the dark box 30 a polyhedron.

Although not shown in the drawing, by disposing common parts such as a memory and an energy source in the center of the dark box 30,
Light transmission between the common component and each element 32 is efficiently performed.

Although FIG. 2 shows a hexagonal cross section, as shown in FIG. 3, by adopting a shape close to a sphere, the pressure resistance is further improved.

Third Embodiment FIG. 4 shows an example in which polyhedral dark boxes are multiplexed (three in the figure).

The element 32 is mounted on the outer wall surface of the inner polyhedron 30B, and the light beam is coupled to the element 32 mounted on the inner wall of the outermost polyhedron 30A in the same manner as in the above-described embodiment. The elements mounted on the inner and outer wall surfaces of the internal polyhedron 30B or 30C are connected by electricity or light. In the figure, energy is supplied from the power supply 46 to the innermost polyhedron 30C.

According to this embodiment, the light is radially coupled from the innermost polyhedron and the distance between the light beams becomes uniform, so that it is effective for a multiprocessor type circuit mounting such as an ultra-high-speed computer.

In this example, the polyhedrons having a hexagonal cross section are stacked, but the cubes of the first embodiment may be stacked.

(Fourth Embodiment) FIG. 5 shows a fourth embodiment, in which the dark box 30 according to the first embodiment is used, and the elements mounted on the same surface are connected by electric wiring 44, and are connected to the other surface. This is an electric / optical mixed circuit in which circuit connections are coupled by light.

Also in this embodiment, the apparatus can be made compact and small.

(Fifth Embodiment) FIG. 6 shows a fifth embodiment, in which power is also supplied by light.

As shown in FIG. 6, the electricity from the main power supply 46 is converted from electricity into light energy by an energy conversion element 48 such as a semiconductor laser, and received by an energy conversion element 50 such as a solar battery that receives the light beam 34. To convert the light into electric energy to make the energy of a logical operation circuit inside each element.

(Sixth Embodiment) FIG. 7 shows a sixth embodiment.

This example relates to the manufacture of a dark box, and uses a shape memory alloy or a resin, and manufactures a cubic dark box by the following procedure.

(1) The shape memory alloy or resin 52 is formed into a flat plate shape as shown in FIG.

(2) The shape of the cube is memorized by applying heat (or cooling) in a cubic shape as shown in FIG.

(3) After cooling (or applying heat) again from this state, the sheet is developed into a flat plate as shown in FIG.

(4) Next, as shown in FIG.
C, an element 32 such as an optical element is mounted.

(5) Heat is again applied (or cooled) to make a memorized cube as shown in FIG.

(6) Refrigerant, N ₂ gas, etc. are sealed inside, and the edges are sealed with welding 56 or the like.

 According to these embodiments, the following effects can be obtained.

(1) For miniaturized mounting, compact mounting can be achieved by performing three-dimensional mounting, as compared to mounting on a conventional flat surface such as a printed circuit board in FIG. 8, and miniaturization can be realized. The three-dimensional shape to be mounted is a cube, a polyhedron, a sphere, a cylinder, or the like.

(2) For high reliability, to eliminate the conventional printed circuit wiring 6, the inter-PI connecting optical connectors 10, 10A, and the fiber cable wiring 12 shown in FIG. (Photoelectric I
C), mounting the optical elements on the inner wall of the dark box and coupling them with light, resulting in the printed circuit wiring 6 and the connector shown in FIG.
10,10A and fiber cable 12 are not required.

(B) In (a), the optical coupling between the elements is performed directly between the elements, or when an angle is required, a prism, a mirror, or the like is used to guide light rays to couple the elements.

(3) For environmental resistance, use a dark box and seal the mounted container. (A) Since the inside of the container is cut off from the outside air for sealing, the bad gas of the outside air (corrosion) Gas). Further corrosion tactile resistance is further improved by encapsulating the internal inert gas such as N _2.

(B) By making the mounting device a sphere or a polyhedron close to a sphere, it becomes easy to withstand high external pressure.

(C) Pass a refrigerant such as a gas or a liquid into a closed vessel. Similarly, by cooling the outside of the container with a refrigerant, heat generation can be easily suppressed with a small amount of refrigerant, and mounting in a stable temperature environment can be realized.

(D) By covering the outer surface of the sealed dark box to be mounted with a shield plate or the like and connecting it to ground, it is possible to easily realize circuit mounting that is resistant to noise such as electromagnetic induction electrostatic noise.

(4) For high-speed operation, three-dimensional mounting enables connection at the shortest distance. In the case of a sphere or a polyhedron, a common part such as a power supply and a memory is placed at the center, and an element is mounted on the inner wall surface, so that the connection can be made at the shortest distance and an equal distance. These are effective for ultra-high-speed circuits in which the wiring length affects the performance.

〔The invention's effect〕

 As described above, the present invention has the following effects.

(1) Since a logical operation and control circuit having excellent environmental resistance can be made, it can be applied to circuit implementation under adverse environmental conditions such as space, deep sea, extreme cold, around a reactor, and the like.

(2) High-density mounting is possible, and a compact arithmetic and control unit can be produced.

(3) An ultra-high-speed arithmetic device can be created.

(4) The dark box cannot be opened because the light is coupled in the dark box (the circuit does not operate if the box is opened). Therefore, it is highly confidential and is suitable for defense, related circuits, and maintaining important confidential matters.

[Brief description of the drawings]

1A and 1B show a first embodiment of the present invention, wherein FIG. 1A is a perspective view of a dark box, FIG. 1B is a sectional view taken along line AA 'of FIG. 1A, and FIG. FIG. 2 is a perspective view of the element, FIG. 2 is a sectional view showing a second embodiment, FIG. 3 is a front view of a modification of the second embodiment,
FIG. 4 is a sectional view showing the third embodiment, FIG. 5 is a sectional view showing the fourth embodiment, FIG. 6 is an explanatory view showing the fifth embodiment, and FIG.
FIG. 8 is an explanatory view showing a sixth embodiment, and FIG. 8 is an explanatory view of a conventional example. 30 ... dark box, 32 ... OEIC, optical element, etc. 34 ... light beam, 36 ... mirror, 38 ... shield, 40 ... light emitting part, 42 ... light receiving part, 48,50 ... energy conversion Element 52: Shape memory alloy or resin.

──────────────────────────────────────────────────の Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01S 31/12 JICST file (JOIS)

Claims (6)

(57) [Claims] An opto-electric integrated circuit and / or an optical element which are coupled to each other by a light beam are arranged in a case which is sealed and shielded from external light, and a common part such as a memory or an energy source is disposed at the center of the case. A circuit device that is provided. 2. A case in which a plurality of sealed and shielded external light-shielded cases are superposed one on another, and light beams which are mutually coupled to an inner wall surface of an outermost case and a wall surface of a case superposed inside the case by light rays. A circuit device in which an electric integrated circuit and / or an optical element are arranged, and a common part such as a memory or an energy source is arranged in a central portion of an innermost case among these cases. 3. An opto-electronic integrated circuit and / or an optical element, which are coupled to each other by a light beam, are disposed in a sealed case in which external light is blocked, and energy for operating the opto-electric integrated circuit and / or the optical element is disposed. A circuit device, wherein a supply is provided with an energy conversion element for converting electricity to light and an energy conversion element for converting light to electricity. 4. An opto-electric integrated circuit and / or an optical element, which are coupled to each other by light rays, are disposed in a case that is sealed and shielded from external light, and the case is made of a shape memory alloy or a shape memory resin. Circuit device. 5. An optoelectronic integrated circuit and / or an optical element which are coupled to each other by a light beam on an inner surface of a case, and a common part such as a memory or an energy source is disposed at a center of the case. A circuit mounting method that seals off air and blocks external light. 6. An opto-electric integrated circuit and / or light, wherein a case made of a shape memory alloy or a shape memory resin in which a three-dimensional shape is memorized by heat treatment is developed in a plane, and an inner surface of the case is coupled to each other by light beams. A circuit mounting method in which the elements are arranged, heat-treated again to form a three-dimensional shape, the case is sealed, and external light is blocked.