JP5062469B2 - MOTOR STATOR, MOTOR, MOTOR STATOR MANUFACTURING METHOD, INSULATION MATERIAL ASSEMBLY METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - Google Patents

Description

  The present invention relates to a motor stator, a method for manufacturing a motor stator, a method for assembling an insulating material to a semiconductor device, and a semiconductor device.

  The stator core of the motor stator of the motor described above is formed by laminating a plurality of electromagnetic steel plates formed by pressing, and conventionally, a sheet-like insulating material is interposed between a coil inserted into a slot provided in the stator core and the stator core. There is a motor stator in which the flash generated at the end of the electromagnetic steel sheet during press working is prevented from coming into contact with the coil (for example, see Non-Patent Document 1).

As a semiconductor device including a semiconductor module including a semiconductor chip such as a transistor or a thyristor, there are an inverter that converts a direct current into an alternating current and a converter that converts an alternating current into a direct current (for example, Non-Patent Document 2). In such a semiconductor device, it is necessary to attach a cooler to the semiconductor module that increases in heat dissipation as the power increases and becomes high temperature, and is cooled. In the case of a low-cost non-insulated semiconductor module, it has been necessary to ensure insulation by disposing a sheet-like insulating material between a bus bar joined to the semiconductor chip electrode and the cooler.
“Mechanical Engineering Handbook” published by the Japan Society of Mechanical Engineers May 15, 1988 A8-43 to A8-56 “Mechanical Engineering Handbook”, published by the Japan Society of Mechanical Engineers, May 15, 1988 A8-62 to A8-65

  However, in the conventional motor stator, the flash generated at the end of the electromagnetic steel sheet during the press work, or the unevenness of the inner wall surface of the slot in the stator core generated by the mutual displacement when laminating a plurality of electromagnetic steel sheets, A gap that cannot be filled even if impregnated with a filler for fixing the coil is formed between the stator core and the sheet-like insulating material. Since this gap acts as a heat insulation layer when the coil generates heat during motor operation, the coil temperature rises as much as the heat of the coil is hardly released to the outside, resulting in a decrease in motor drive efficiency. There was a problem of being invited.

  Moreover, as the sheet-like insulating material described above, it is common to use an organic insulating material having poor heat transferability with respect to a metal inorganic material, and such an organic insulating material is generated in a coil during motor operation. Since this hinders heat from being released to the outside, as described above, the coil temperature rises, causing a problem in that the driving efficiency of the motor is reduced.

  On the other hand, in a conventional semiconductor device, if an insulating material highly filled with a filler such as ceramic or alumina is used in order to increase the thermal conductivity, the amount of filler filled with the filler is less flexible, and the bus bar of the semiconductor module side Since it cannot be said that the followability to the surface unevenness or the surface unevenness of the cooler is good, there is a problem that the contact thermal resistance becomes high.

  And if a heat dissipation sheet that is rich in flexibility is used as the insulating material, the followability to the surface irregularities of the bus bar or the surface irregularities of the cooler can be improved and the contact thermal resistance can be reduced. The amount of filler added is limited to ensure the heat conductivity, making it difficult to improve the thermal conductivity, resulting in a decrease in heat transfer performance. This has been a conventional problem.

  The present invention has been made paying attention to the above-mentioned conventional problems, and after reducing the contact thermal resistance, the temperature rise of a heating element such as a motor coil or a semiconductor chip of a semiconductor device is reduced. As a result, when used in a motor, the driving efficiency can be improved. On the other hand, when used in a semiconductor device, the motor stator can improve the cooling performance of the semiconductor module. An object of the present invention is to provide a method for manufacturing a motor, a motor stator, a method for assembling an insulating material to a semiconductor device, and a semiconductor device.

  The motor stator according to the present invention is an insulating material containing a polymer and a monomer, and the liquid crystal monomer containing a mesogenic group and a polymerizable group in a molecule is 50 to 500 weights with respect to 100 parts by weight of a liquid crystal polymer containing a mesogenic group. An insulating material including a portion is used, and the insulating material and the coil are arranged in a slot provided in the stator core of the motor stator, and the insulating material is fused to both the stator core and the coil.

  When a motor stator is manufactured using the insulating material of the present invention, the insulating material is placed in a slot provided in the stator core of the motor stator together with the coil, and heat treatment is performed in this state. Since the gap in the slot is fused to fill both the unevenness of the inner wall surface of the slot and the coil in the slot, the thermal conductivity from the coil to the stator core is improved, and the coil is heated during coil operation during motor operation. The temperature rise can be kept low, and as a result, a decrease in the driving efficiency of the motor can be avoided.

  On the other hand, when the cooler is assembled to the semiconductor module of the semiconductor device using the insulating material of the present invention, the insulating material is disposed between the semiconductor module of the semiconductor device and the cooler, and the heat treatment is performed in this state. In this case, the insulating material is fused to both the semiconductor module and the cooler and follows the surface irregularities of the bus bar on the semiconductor module side or the surface irregularities of the cooler, so that the thermal conductivity from the semiconductor module side to the cooler is improved. This increases the temperature of the semiconductor chip when the semiconductor chip generates heat during operation.

  According to the present invention, since it is configured as described above, it is possible to reduce the contact thermal resistance, and to suppress a rise in the temperature of a heating element such as a motor coil or a semiconductor chip of a semiconductor device. As a result, when used in a motor, the driving efficiency is improved. On the other hand, when used in a semiconductor device, the cooling performance of the semiconductor module can be improved. The effect is brought about.

  In the insulating material of the present invention, the mesogenic group represents a functional group that exhibits liquid crystallinity, and specifically includes biphenyl, terphenyl, phenylbenzoate, azobenzene, stilbene, and derivatives thereof.

  Here, with respect to 100 parts by weight of a liquid crystal polymer containing a mesogenic group, if the liquid crystal monomer containing a mesogenic group and a polymerizable group in the molecule is less than 50 parts by weight, the mesogenic group and the polymerizable group having a low melting point are contained in the molecule. Since the ratio of the liquid crystal monomer contained in the insulating material is small, the insulating material is difficult to soften.For example, when the insulating material formed in a sheet shape is inserted into the slot provided in the stator core of the motor stator together with the coil, the inner wall of the stator core The gap between the coils cannot be filled, resulting in poor thermal conductivity.

  On the other hand, when the liquid crystal monomer containing a mesogenic group and a polymerizable group in the molecule exceeds 500 parts by weight with respect to 100 parts by weight of the liquid crystal polymer containing a mesogenic group, the film forming property is good because the ratio of the polymer component is small. However, as a result, the handling property at the time of film formation is inferior. Therefore, in the present invention, the liquid crystal monomer containing a mesogenic group and a polymerizable group in the molecule with respect to 100 parts by weight of the liquid crystal polymer containing the mesogenic group. 50 to 500 parts by weight.

  As described above, since the insulating material of the present invention has a mesogenic group that exhibits liquid crystallinity, molecules form a higher order structure in the liquid crystal state, and as a result, the insulating material is used as a heat conduction medium of a polymer material. The heat conduction due to the phonons is promoted.

  Further, in the insulating material of the present invention, since it contains at least one polymerizable group of epoxy group, acrylic acid group, and methacrylic acid group as the polymerizable group of the liquid crystal monomer, it has thermosetting properties. It is possible to adhere well to various adherends.

  Furthermore, in the insulating material of the present invention, the polymerizable group of the liquid crystal monomer and the main chain skeleton of the liquid crystal polymer contain at least one polymerizable group of an epoxy group, an acrylic acid group, and a methacrylic acid group; In this case, the compatibility between the liquid crystal polymer and the liquid crystal monomer is good, and when it contains an epoxy group, various curing agents such as amine compounds and acid anhydrides are also used. From the viewpoint of heat transfer, it is desirable to have a mesogenic group in the curing agent molecule.

  In addition, including at least one kind of polymerizable group among epoxy group, acrylic acid group, and methacrylic acid group is an arbitrary combination of epoxy group, acrylic acid group, and methacrylic acid group as the polymerizable group of the monomer. Also included.

  Furthermore, in the insulating material of the present invention, the liquid crystal monomer can be configured to contain a bifunctional or higher functional polymerizable group. When this configuration is employed, the heat dissipation of the cured product obtained by heat treatment is adopted. In addition, the mechanical properties are stable in both a short time and a long time.

Furthermore, the insulating material of the present invention can have a structure having a filler such as an oxide, nitride, boride, carbide or diamond having higher thermal conductivity than the liquid crystal monomer and liquid crystal polymer. If this configuration is adopted, the heat transfer property will be further improved. At this time, if the volume resistivity of the filler is less than 10 ¹⁰ Ω · cm, the reliability as the insulating material is ensured. Therefore, the volume resistivity of the filler is preferably 10 ¹⁰ Ωcm or more.

  Here, since the thermal conductivity of the mesogen group contained in the insulating material is highest in the molecular long axis direction, a motor stator is manufactured using the insulating material of the present invention, or the insulating material of the present invention is used in the semiconductor device. In the case of assembling between the semiconductor module and the cooler, the molecular long axis direction of the mesogen group is controlled by the magnetic field or electric field in the heat treatment stage, that is, the magnetic field or electric field is generated in the heat treatment stage, It is desirable to align the molecular long axis direction of the mesogen group contained in the insulating material with the desired heat transfer direction. In this case, heat treatment is performed while applying magnetic force and voltage, so the molecular chain of the mesogen group is oriented. This orientation state is maintained even during use after being fixed in step 1. Therefore, the heat transfer property of the insulating material is further improved.

  In a motor including a motor stator manufactured by such a manufacturing method, heat transfer from the coil to the stator core is improved, and a temperature rise of the coil when the coil generates heat during operation can be suppressed to a low level. On the other hand, in a semiconductor device in which an insulating material is assembled between the semiconductor module and the cooler by the above-described assembly method, heat conduction from the semiconductor module side to the cooler is achieved. Thus, the temperature rise of the semiconductor chip when the semiconductor chip generates heat during operation is suppressed to a low level.

  The present invention will be described below with reference to the drawings.

[Example 1]
1 to 3 show an embodiment of the present invention. In this embodiment, the insulating material of the present invention is applied to a motor stator.

  As shown partially in FIG. 3, the stator core 3 constituting the stator 2 of the motor 1 is formed by laminating a plurality of electromagnetic iron plates that are formed by punching in an annular shape by pressing, and on the inner peripheral side (the upper side in the figure). A plurality of slots 4 that are open and penetrate along the axial direction are provided radially.

  In the slot 4 of the stator core 3, as shown in FIG. 1, an enamel-coated coil 5 and a filler 6 are arranged via an insulating sheet (insulating material) 10, and a wedge 7 is provided at the opening of the slot 4. The coil 5 and the filler 6 are fixed by fitting.

The insulating sheet 10 is an insulating material containing a polymer and a monomer, and includes a liquid crystal polymer 11 containing a mesogenic group, a liquid crystal monomer 12 containing an epoxy group as a mesogenic group and a polymerizable group in the molecule, and thermal conductivity. It is mainly comprised from the insulating filler 13 which has. In this case, it is formed so as to include 50 to 500 parts by weight of the liquid crystal monomer 12 containing mesogenic groups and polymerizable groups in the molecule with respect to 100 parts by weight of the liquid crystal polymer 11 containing mesogenic groups. The volume resistivity is set to 10 ¹⁰ Ωcm or more.

  In manufacturing the motor stator 2 using the insulating sheet 10 described above, first, after the insulating sheet 10 is inserted into the slot 4 of the stator core 3 and arranged in a predetermined state, the coil 5 is placed in the slot 4. The coil 5 is wound around the stator core 3 so as to be positioned, and the filler 6 is filled in the slot 4.

  At this time, since the insulating sheet 10 is not in a softened state, as shown in FIG. 2, the gap between each end 8 a of the plurality of electromagnetic iron plates 8 forming the inner wall surface 4 a of the slot 4 in the stator core 3 and the insulating sheet 10. There is an air gap S in.

  Thereafter, the insulating sheet 10 set on the stator core 3 is subjected to heat treatment, and the insulating sheet 10 is fused to both the inner wall surface 4a of the slot 4 and the coil 5 in the stator core 3 as shown in FIG. The motor stator 2 in which the gaps S between the end portions 8a of the plurality of electromagnetic iron plates 8 and the insulating sheet 10 are filled with the sheet 10, that is, the gaps S are eliminated, is obtained.

  Here, since the thermal conductivity of the mesogen group contained in the insulating sheet 10 is highest in the molecular long axis direction, in this embodiment, the molecular long axis direction of the mesogen group is controlled by a magnetic field in the heat treatment stage. That is, a magnetic field is generated at the stage of the heat treatment so that the molecular long axis direction of the mesogen group contained in the insulating sheet 10 is along the desired heat transfer direction.

  As described above, since the insulating sheet 10 in this embodiment has a mesogenic group that exhibits liquid crystallinity, molecules form a higher order structure in the liquid crystal state, and as a result, a heat conducting medium of a polymer material. Therefore, heat conduction by phonons is promoted.

  In this embodiment, the insulating sheet 10 disposed together with the coil 5 in the slot 4 of the stator core 3 of the motor stator 2 is subjected to heat treatment, and the insulating sheet 10 is applied to both the inner wall surface 4 a of the slot 4 and the coil 5. Since the gap S in the slot 4 is filled to be fused, the thermal conductivity from the coil 5 to the stator core 3 is improved, and the temperature rise when the coil 5 generates heat during motor operation is increased. It can be kept low.

  Therefore, in the motor 1 including the motor stator 2 manufactured as described above using the insulating sheet 10 in this embodiment, the temperature rise during the heat generation of the coil 5 during operation can be kept low, so that the output is improved. Will be achieved.

Further, in the insulating sheet 10 in this embodiment, since the liquid crystal monomer 12 has an epoxy group as a polymerizable group, a thermally and mechanically stable strength and adhesive force can be obtained. When it has two epoxy groups, the heat dissipation and mechanical properties of the cured product obtained by the heat treatment become stable both in a short time and in a long time. In addition, in the insulating sheet 10 in this embodiment, since the volume resistivity of the filler 13 is 10 ¹⁰ Ωcm or more, the heat transferability is further improved and the reliability as the insulating material is ensured. Will get.

  Further, in this embodiment, when the motor stator 2 is manufactured using the insulating sheet 10, the molecular long axis direction of the mesogen group is controlled by the magnetic field at the stage of the heat treatment so as to follow the desired heat transfer direction. Therefore, the molecular chain of the mesogen group is fixed in an oriented state, and this oriented state is maintained even during use. Therefore, the heat transfer property of the insulating sheet 10 is further improved, that is, The heat generated in the coil 5 of the motor 1 can be transmitted more efficiently by the stator core 3.

  In this embodiment, as shown in FIGS. 1 and 2, the fillers 13 have almost uniform shapes, but the fillers 13 may have irregular shapes.

[Example 2]
FIG. 4 shows another embodiment of the present invention, and also in this embodiment, the case where the insulating material of the present invention is applied to a motor stator is shown. In this embodiment, when the motor stator 2 is manufactured using the insulating sheet 10, the heat treatment is performed without generating a magnetic field, and other configurations are the same as those of the previous embodiment.

  Also in this embodiment, since the insulating sheet 10 is made of a liquid crystal structural material, it has excellent thermal conductivity. In addition, the insulating sheet 10 disposed in the slot 4 in the stator core 3 of the motor stator 2 together with the coil 5 is used. The insulating sheet 10 is fused to both the inner wall surface 4 a of the slot 4 and the coil 5 to fill the gap S in the slot 4, so that the coil 5 is connected to the stator core 3. As the thermal conductivity is increased, the temperature rise during the heat generation of the coil 5 during motor operation can be kept low, and as a result, the output can be improved.

[Example 3]
FIG. 5 shows still another embodiment of the present invention. In this embodiment as well, the insulating material of the present invention is applied to a motor stator. The insulating sheet 10 in this embodiment includes a liquid crystal monomer 12A having only one polymerizable group, and heat treatment is performed without generating a magnetic field when the motor stator 2 is manufactured using the insulating sheet 10. Other configurations are the same as those of the first embodiment.

  Also in this embodiment, since the insulating sheet 10 is made of a liquid crystal structure material, the insulating sheet 10 is excellent in thermal conductivity. In addition, the insulating sheet 10 is subjected to heat treatment, whereby the insulating sheet 10 is slotted. 4 is fused to both the inner wall surface 4a of the coil 4 and the coil 5 so as to fill the gap S in the slot 4, so that the thermal conductivity from the coil 5 to the stator core 3 is improved, so that the motor operation is performed. The temperature rise during the heat generation of the coil 5 in the inside can be kept low, and as a result, the output is improved.

[Example 4]
FIG. 6 shows still another embodiment of the present invention. In this embodiment as well, the insulating material of the present invention is applied to a motor stator. The insulating sheet 10 in this embodiment is mainly composed of a liquid crystal polymer 11 having a mesogenic group and a liquid crystal monomer 12A having only one polymerizable group, that is, a structure not including an insulating filler 13. In manufacturing the motor stator 2 using the insulating sheet 10, heat treatment is performed without generating a magnetic field.

  Also in this embodiment, since the insulating sheet 10 is made of a liquid crystal structure material, the insulating sheet 10 is excellent in thermal conductivity. In addition, the insulating sheet 10 is subjected to heat treatment, whereby the insulating sheet 10 is slotted. 4 is fused to both the inner wall surface 4a of the coil 4 and the coil 5 so as to fill the gap S in the slot 4, so that the thermal conductivity from the coil 5 to the stator core 3 is improved, so that the motor operation is performed. The temperature rise during the heat generation of the coil 5 in the inside can be kept low, and as a result, the output is improved.

[Example 5]
FIG. 7 shows still another embodiment of the present invention. In this embodiment as well, the insulating material of the present invention is applied to a motor stator. The insulating sheet 10 in this embodiment is mainly composed of a liquid crystal polymer 11 containing a mesogenic group, a liquid crystal monomer 12A having only one polymerizable group, and a conductive filler 13A. In manufacturing the motor stator 2 used, heat treatment is performed without generating a magnetic field.

  Also in this embodiment, since the insulating sheet 10 is made of a liquid crystal structure material, the insulating sheet 10 is excellent in thermal conductivity. In addition, the insulating sheet 10 is subjected to heat treatment, whereby the insulating sheet 10 is slotted. 4 is fused to both the inner wall surface 4a of the coil 4 and the coil 5 so as to fill the gap S in the slot 4, so that the thermal conductivity from the coil 5 to the stator core 3 is improved, so that the motor operation is performed. The temperature rise during the heat generation of the coil 5 in the inside can be kept low, and as a result, the output is improved.

[Example 6]
8 to 10 show other embodiments of the present invention. In this embodiment, the insulating material of the present invention is applied to a semiconductor device.

  As shown in FIG. 8, the semiconductor device 21 includes a non-insulated semiconductor module 22 incorporating a semiconductor chip, a cooler 23 that cools the semiconductor chip, and a solder 24 connected to the non-insulated semiconductor module 22. An insulating sheet (insulating material) 30 is provided between the joined bus bar 25 and the cooler 23.

This insulating sheet 30 is an insulating material containing a polymer and a monomer, and includes a liquid crystal polymer 31 containing a mesogenic group, a liquid crystal monomer 32 containing an epoxy group as a mesogenic group and a polymerizable group in the molecule, and thermal conductivity. It is mainly comprised from the insulating filler 33 which has. In this case, it is formed so as to contain 50 to 500 parts by weight of the liquid crystal monomer 12 containing mesogenic groups and polymerizable groups in the molecule with respect to 100 parts by weight of the liquid crystal polymer 11 containing mesogenic groups. The volume resistivity is set to 10 ¹⁰ Ωcm or more.

  When the cooler 23 is assembled to the semiconductor module 22 of the semiconductor device 21 using the insulating sheet 30 described above, first, the insulating sheet 30 is placed between the bus bar 25 on the semiconductor module 22 side of the semiconductor device 21 and the cooler 23. Deploy.

  At this time, since the insulating sheet 30 is not in a softened state, there is a gap S between the bus bar 25 and the insulating sheet 30 or between the cooler 23 and the insulating sheet 30 as shown in FIG. .

  Thereafter, the insulating sheet 30 set between the bus bar 25 and the cooler 23 is subjected to heat treatment, and the insulating sheet 30 is fused to both the bus bar 25 and the cooler 23 as shown in FIG. The semiconductor device 21 in which the gap S is filled with the insulating sheet 30, that is, the gap S is eliminated is obtained.

  Here, since the thermal conductivity of the mesogen group contained in the insulating sheet 30 is highest in the molecular long axis direction, in this embodiment, the molecular long axis direction of the mesogen group is controlled by a magnetic field in the heat treatment stage. That is, a magnetic field is generated at the stage of the heat treatment so that the molecular major axis direction of the mesogen group contained in the insulating sheet 30 is along the desired heat transfer direction.

  As described above, since the insulating sheet 30 in this embodiment has a mesogenic group that exhibits liquid crystallinity, molecules form a higher order structure in the liquid crystal state, and as a result, a heat conducting medium of a polymer material. Therefore, heat conduction by phonons is promoted.

  In this embodiment, the insulating sheet 30 disposed between the bus bar 25 and the cooler 23 is heated, and the insulating sheet 30 is fused to both the bus bar 25 and the cooler 23 so that the bus bar Since the gap S between the insulating sheet 30 and the gap S and the gap S between the cooler 23 and the insulating sheet 30 are filled, the thermal conductivity from the semiconductor module 22 side to the cooler 23 is increased. Thus, the temperature rise of the semiconductor chip when the semiconductor chip generates heat during operation can be kept low.

Moreover, in the insulating sheet 30 in this embodiment, since the liquid crystal monomer 32 has an epoxy group as a polymerizable group, a thermally and mechanically stable strength and adhesive force can be obtained. When it has two epoxy groups, the heat dissipation and mechanical properties of the cured product obtained by the heat treatment become stable both in a short time and in a long time. In addition, in the insulating sheet 30 in this embodiment, since the volume resistivity of the filler 33 is 10 ¹⁰ Ωcm or more, the heat transferability is further improved and the reliability as the insulating material is ensured. Will get.

  Further, in this embodiment, when the cooler 23 is assembled to the semiconductor module 22 of the semiconductor device 21 using the insulating sheet 30, the molecular long axis direction of the mesogen group is changed to a desired heat transfer direction by a magnetic field at the stage of the heat treatment. Since it is controlled so as to be aligned, the molecular chain of the mesogen group is fixed in an oriented state, and this oriented state is maintained even during use. Therefore, the heat transfer property of the insulating sheet 30 is further improved. In other words, the temperature rise of the semiconductor chip when the semiconductor chip generates heat during operation can be further suppressed.

  In this embodiment, as shown in FIGS. 9 and 10, the filler 33 has a substantially uniform shape, but it does not matter if the fillers 33 have irregular shapes.

[Example 7]
FIG. 11 shows another embodiment of the present invention. In this embodiment, the insulating material of the present invention is applied to a semiconductor device. In this embodiment, when the insulating sheet 30 is assembled between the semiconductor module 22 of the semiconductor device 21 and the cooler 23, the heat treatment is performed without generating a magnetic field. Is the same.

  Also in this embodiment, since the insulating sheet 30 is made of a liquid crystal structural material, it has excellent thermal conductivity, and in addition, the insulating sheet 30 disposed between the bus bar 25 and the cooler 23 is heated. Processing is performed to fuse the insulating sheet 30 to both the bus bar 25 and the cooler 23, and the gap S between the bus bar 25 and the insulating sheet 30 or the gap S between the cooler 23 and the insulating sheet 30. Therefore, the thermal conductivity from the semiconductor module 22 side to the cooler 23 is increased, and the temperature rise of the semiconductor chip when the semiconductor chip generates heat during operation can be kept low. .

[Example 8]
FIG. 12 shows still another embodiment of the present invention. In this embodiment, the insulating material of the present invention is applied to a semiconductor device. The insulating sheet 30 in this embodiment includes a liquid crystal monomer 32A having only one polymerizable group, and a magnetic field is applied when the insulating sheet 30 is assembled between the semiconductor module 22 and the cooler 23 of the semiconductor device 21. The heat treatment is performed without generating the other components, and other configurations are the same as those in the sixth embodiment.

  Also in this embodiment, since the insulating sheet 30 is made of a liquid crystal structure material, the insulating sheet 30 is excellent in thermal conductivity. In addition, the insulating sheet 30 is subjected to a heat treatment, whereby the insulating sheet 30 is 25 and the cooler 23 so as to fill the gap S between the bus bar 25 and the insulating sheet 30 and the gap S between the cooler 23 and the insulating sheet 30. The heat conductivity from the module 22 side to the cooler 23 is enhanced, and the temperature rise of the semiconductor chip when the semiconductor chip generates heat during operation can be suppressed low.

[Example 9]
FIG. 13 shows still another embodiment of the present invention. In this embodiment, the insulating material of the present invention is applied to a semiconductor device. The insulating sheet 30 in this embodiment is mainly composed of a liquid crystal polymer 31 containing a mesogenic group and a liquid crystal monomer 32A having only one polymerizable group, that is, a structure not including an insulating filler 33. When the insulating sheet 30 is assembled between the semiconductor module 22 of the semiconductor device 21 and the cooler 23, heat treatment is performed without generating a magnetic field.

  Also in this embodiment, since the insulating sheet 30 is made of a liquid crystal structure material, the insulating sheet 30 is excellent in thermal conductivity. In addition, the insulating sheet 30 is subjected to a heat treatment, whereby the insulating sheet 30 is 25 and the cooler 23 so as to fill the gap S between the bus bar 25 and the insulating sheet 30 and the gap S between the cooler 23 and the insulating sheet 30. The heat conductivity from the module 22 side to the cooler 23 is enhanced, and the temperature rise of the semiconductor chip when the semiconductor chip generates heat during operation can be suppressed low.

[Example 10]
FIG. 14 shows still another embodiment of the present invention. This embodiment also shows a case where the insulating material of the present invention is applied to a semiconductor device. The insulating sheet 30 in this embodiment is mainly composed of a liquid crystal polymer 31 containing a mesogenic group, a liquid crystal monomer 32A having only one polymerizable group, and a conductive filler 33A. When the semiconductor device 21 is assembled between the semiconductor module 22 and the cooler 23, the heat treatment is performed without generating a magnetic field.

  Also in this embodiment, since the insulating sheet 30 is made of a liquid crystal structure material, the insulating sheet 30 is excellent in thermal conductivity. In addition, the insulating sheet 30 is subjected to a heat treatment, whereby the insulating sheet 30 is 25 and the cooler 23 so as to fill the gap S between the bus bar 25 and the insulating sheet 30 and the gap S between the cooler 23 and the insulating sheet 30. The heat conductivity from the module 22 side to the cooler 23 is enhanced, and the temperature rise of the semiconductor chip when the semiconductor chip generates heat during operation can be suppressed low.

[Comparative Example 1]
As a comparative example, as shown in FIG. 15, an insulating sheet 50 composed of a polymer 51 not containing a mesogenic group and a filler 53 is formed, and the insulating sheet 50 is disposed together with the coil 5 in the slot 4 in the stator core 3 of the motor stator 2. Heat treatment was performed on the sheet 50 to manufacture the motor stator 2.

  In this comparative example, since the insulating sheet 50 does not contain a liquid crystal structural material, the thermal conductivity is lower than that of the insulating sheets 10 of Examples 1 to 5, and a plurality of sheets forming the inner wall surface 4a of the slot 4 are used. The space | gap S remains between each edge part 8a of the electromagnetic iron plate 8, and the insulating sheet 50, As a result, the heat conductive performance compared with the said Examples 1-5 will be inferior.

[Comparative Example 2]
As another comparative example, as shown in FIG. 16, an insulating sheet 50 </ b> A composed of a thermosoftening polymer 51 </ b> A not containing a mesogen group and a filler 53 is formed, and a coil is formed in a slot 4 in the stator core 3 of the motor stator 2. The motor stator 2 was manufactured by subjecting the insulating sheet 50 </ b> A disposed together with the heat treatment to the heat treatment.

  In this comparative example, since the insulating sheet 50A includes the thermosoftening polymer 51A, the space between each end 8a of the plurality of electromagnetic iron plates 8 and the insulating sheet 50A forming the inner wall surface 4a of the slot 4 by heat treatment. However, since the insulating sheet 50A does not contain a liquid crystal structural material, the thermal conductivity is lower than that of the insulating sheet 10 of Examples 1 to 5, and as a result, the above Examples 1 to 5 are eliminated. Compared with the heat conduction performance will be inferior.

[Comparative Example 3]
As another comparative example, as shown in FIG. 17, an insulating sheet 50 </ b> B composed of a liquid crystal polymer 51 </ b> B containing a mesogenic group and a filler 53 is formed, and together with the coil 5 in the slot 4 in the stator core 3 of the motor stator 2. The motor stator 2 was manufactured by subjecting the arranged insulating sheet 50B to heat treatment.

  In this comparative example, since the insulating sheet 50B does not contain a liquid crystal monomer, it is difficult to be softened when heat-treated, and the end portions 8a of the plurality of electromagnetic iron plates 8 forming the inner wall surface 4a of the slot 4 and the insulating sheet 50B. As a result, the gap S remains, and as a result, the heat conduction performance is inferior to those of Examples 1 to 5.

[Comparative Example 4]
As yet another comparative example, as shown in FIG. 18, an insulating sheet 50 </ b> C composed of a liquid crystal monomer 52 </ b> C containing a mesogenic group and a polymerizable group in the molecule and a filler 53 was formed.

  In this comparative example, since the insulating sheet 50C does not contain a polymer component, the film forming property is poor as compared with the insulating sheets 10 of Examples 1 to 5, and handling during film formation is inferior.

[Comparative Example 5]
As another comparative example, as shown in FIG. 19, an insulating sheet 60 composed of a polymer 61 not containing a mesogen group and a filler 63 is formed, and the bus bar 25 on the semiconductor module 22 side of the semiconductor device 21 is cooled. Heat treatment was applied to the insulating sheet 60 disposed between the cooler 23 and the cooler 23 was assembled to the bus bar 25.

  In this comparative example, since the insulating sheet 60 does not contain a liquid crystal structural material, the thermal conductivity is lower than that of the insulating sheets 30 of the above Examples 6 to 10, and the cooling between the bus bar 25 and the insulating sheet 60 and cooling. The space | gap S remains between the container 23 and the insulating sheet 60, As a result, the heat conductive performance compared with the said Examples 6-10 will be inferior.

[Comparative Example 6]
As another comparative example, as shown in FIG. 20, an insulating sheet 60 </ b> A composed of a thermosoftening polymer 61 </ b> A not containing a mesogenic group and a filler 63 is formed, and a bus bar 25 on the semiconductor module 22 side of the semiconductor device 21. The insulating sheet 60 disposed between the heat sink and the cooler 23 was subjected to heat treatment, and the cooler 23 was assembled to the bus bar 25.

  In this comparative example, since the insulating sheet 60A contains the thermosoftening polymer 61A, the gap S between the bus bar 25 and the insulating sheet 60 or between the cooler 23 and the insulating sheet 60 is eliminated by heat treatment. However, since the insulating sheet 60A does not contain a liquid crystal structural material, the thermal conductivity is lower than that of the insulating sheets 30 of Examples 6 to 10, and as a result, the heat compared to Examples 6 to 10 of the above. Conductivity performance is inferior.

[Comparative Example 7]
As another comparative example, as shown in FIG. 21, an insulating sheet 60B composed of a liquid crystal polymer 61B containing a mesogenic group and a filler 63 is formed, and the bus bar 25 on the semiconductor module 22 side of the semiconductor device 21 is cooled. Heat treatment was applied to the insulating sheet 60 disposed between the cooler 23 and the cooler 23 was assembled to the bus bar 25.

  In this comparative example, since the insulating sheet 60B does not contain a liquid crystal monomer, it is difficult to be softened when the heat treatment is performed, and the gap S between the bus bar 25 and the insulating sheet 60, or between the cooler 23 and the insulating sheet 60. As a result, the thermal conductivity performance compared to Examples 6 to 10 is inferior.

  In the above-described embodiments, the insulating material of the present invention is applied to a motor stator, particularly a distributed winding motor stator or a semiconductor device. However, the present invention is not limited to this, and a concentrated winding motor stator. In addition to motors and semiconductor devices, it can also be applied around heating elements in electrical equipment and electronic equipment. For example, it is placed around a coil of electrical equipment, and between the coil and the terminal. It is possible to ensure insulation and thermal conductivity while filling the gap.

It is the partial cross section explanatory drawing (a) of the direction orthogonal to the axial direction of the motor by one Example of this invention, and the partial cross sectional explanatory drawing (b) of the direction in alignment with the axial direction of a motor. Example 1 FIG. 2 is a partial cross-sectional explanatory view in a direction along the axial direction of the motor before heat-treating the insulating sheet when manufacturing the motor stator of the motor shown in FIG. 1. Example 1 It is a fragmentary sectional view of the stator core of the motor shown in FIG. Example 1 It is a fragmentary sectional view of the direction along the axial direction of the motor by the other Example of this invention. (Example 2) It is a fragmentary sectional view of the direction in alignment with the axial direction of the motor by the further another Example of this invention. (Example 3) It is a fragmentary sectional view of the direction in alignment with the axial direction of the motor by the further another Example of this invention. Example 4 It is a fragmentary sectional view of the direction in alignment with the axial direction of the motor by the further another Example of this invention. (Example 5) It is a section explanatory view showing a semiconductor device by one example of the present invention. (Example 6) FIG. 9 is a partially enlarged cross-sectional explanatory view after heat-treating an insulating sheet when manufacturing the semiconductor device shown in FIG. 8. (Example 6) FIG. 9 is a partially enlarged cross-sectional explanatory view before heat-treating an insulating sheet when manufacturing the semiconductor device shown in FIG. 8. (Example 6) It is a partial expanded sectional explanatory view of the semiconductor device by other examples of the present invention. (Example 7) It is a partial expanded sectional explanatory view of the semiconductor device by further another Example of this invention. (Example 8) It is a partial expanded sectional explanatory view of the semiconductor device by further another Example of this invention. Example 9 It is a partial expanded sectional explanatory view of the semiconductor device by further another Example of this invention. (Example 10) It is a fragmentary sectional view of the direction along the axial direction of the motor by a comparative example. (Comparative Example 1) It is a fragmentary sectional view of the direction along the axial direction of the motor by other comparative examples. (Comparative Example 2) It is a fragmentary sectional view of the direction in alignment with the axial direction of the motor by other comparative examples. (Comparative Example 3) It is a partial expanded section explanatory view of the insulating material by other comparative examples. (Comparative Example 4) It is explanatory drawing of the partial cross section of the semiconductor device by a comparative example. (Comparative Example 5) It is a fragmentary sectional view of the semiconductor device by other comparative examples. (Comparative Example 6) It is a fragmentary sectional view of a semiconductor device by other comparative examples. (Comparative Example 7)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Motor 2 Stator 3 Stator core 4 Slot 5 Coil 10, 30 Insulation sheet (insulation material)
11, 31 Liquid crystal polymer 12, 32 Liquid crystal monomer 13, 33 Filler 20 Semiconductor device 22 Semiconductor module 23 Cooler

Claims (11)

A motor using an insulating material containing a polymer and a monomer, the insulating material containing 50 to 500 parts by weight of a liquid crystal monomer containing a mesogenic group and a polymerizable group in the molecule with respect to 100 parts by weight of a liquid crystal polymer containing a mesogenic group A stator,
The insulating material and the coil are arranged in a slot provided in the stator core of the motor stator,
A motor stator, wherein an insulating material is fused to both the stator core and the coil . The polymerizable group of the liquid crystal monomer contained in the insulating material and the main chain skeleton of the liquid crystal polymer contain at least one polymerizable group of an epoxy group, an acrylic acid group, and a methacrylic acid group. Item 2. The motor stator according to Item 1. The motor stator according to claim 1, wherein the liquid crystal monomer contained in the insulating material includes a bifunctional or higher functional polymerizable group. The motor stator according to any one of claims 1 to 3, wherein the insulating material includes a filler having higher thermal conductivity than the liquid crystal monomer and the liquid crystal polymer . The motor stator according to claim 4, wherein the filler has a volume resistivity of 10 ¹⁰ Ωcm or more . A motor comprising the motor stator according to claim 1 . In manufacturing the motor stator according to any one of claims 1 to 5, after the insulating material and the coil are arranged in a slot provided in the stator core of the motor stator, the insulating material is applied to both the stator core and the coil by heat treatment. A method of manufacturing a motor stator, characterized by being fused . The method of manufacturing a motor stator according to claim 7, wherein a magnetic field or an electric field is generated during the heat treatment so that a molecular major axis direction of a mesogen group contained in the insulating material is aligned with a desired heat transfer direction . An insulating material containing a polymer and a monomer, wherein an insulating material containing 50 to 500 parts by weight of a liquid crystal monomer containing a mesogenic group and a polymerizable group in the molecule is used for 100 parts by weight of a liquid crystal polymer containing a mesogenic group . When assembling between the semiconductor module and the cooler,
Assembling the insulating material to the semiconductor device, wherein the insulating material is disposed between the semiconductor module and the cooler of the semiconductor device, and then the heat treatment is performed to fuse the insulating material to both the semiconductor module and the cooler. Method.   10. The method of assembling an insulating material in a semiconductor device according to claim 9, wherein a magnetic field or an electric field is generated during the heat treatment so that the molecular major axis direction of the mesogen group contained in the insulating material is aligned with a desired heat transfer direction.   11. A semiconductor device comprising an insulating material assembled between a semiconductor module and a cooler by the assembling method according to claim 9.

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