JP5052031B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

Info

Publication number
JP5052031B2
JP5052031B2 JP2006110730A JP2006110730A JP5052031B2 JP 5052031 B2 JP5052031 B2 JP 5052031B2 JP 2006110730 A JP2006110730 A JP 2006110730A JP 2006110730 A JP2006110730 A JP 2006110730A JP 5052031 B2 JP5052031 B2 JP 5052031B2
Authority
JP
Japan
Prior art keywords
layer
printing
substrate
insulating layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006110730A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007038641A (ja
JP2007038641A5 (enrdf_load_stackoverflow
Inventor
栄二 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2006110730A priority Critical patent/JP5052031B2/ja
Publication of JP2007038641A publication Critical patent/JP2007038641A/ja
Publication of JP2007038641A5 publication Critical patent/JP2007038641A5/ja
Application granted granted Critical
Publication of JP5052031B2 publication Critical patent/JP5052031B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Screen Printers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2006110730A 2005-06-28 2006-04-13 半導体装置の作製方法 Expired - Fee Related JP5052031B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006110730A JP5052031B2 (ja) 2005-06-28 2006-04-13 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005187913 2005-06-28
JP2005187913 2005-06-28
JP2006110730A JP5052031B2 (ja) 2005-06-28 2006-04-13 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2007038641A JP2007038641A (ja) 2007-02-15
JP2007038641A5 JP2007038641A5 (enrdf_load_stackoverflow) 2009-03-05
JP5052031B2 true JP5052031B2 (ja) 2012-10-17

Family

ID=37797053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006110730A Expired - Fee Related JP5052031B2 (ja) 2005-06-28 2006-04-13 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP5052031B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5586920B2 (ja) * 2008-11-20 2014-09-10 株式会社半導体エネルギー研究所 フレキシブル半導体装置の作製方法
JP5760363B2 (ja) * 2010-09-30 2015-08-12 凸版印刷株式会社 スクリーン印刷装置およびその印刷方法
KR101410888B1 (ko) * 2012-09-07 2014-06-23 주식회사 진우엔지니어링 스크린 인쇄장치
CN114953716A (zh) * 2022-05-19 2022-08-30 深圳市百柔新材料技术有限公司 一种高宽比超过1.0的高精密厚膜图形的印刷装置和印刷方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54162308U (enrdf_load_stackoverflow) * 1978-05-02 1979-11-13
JPS60154071A (ja) * 1984-01-24 1985-08-13 ホルスト・レブハン スクイジ−ヘツド
JPH04199895A (ja) * 1990-11-29 1992-07-21 Ibiden Co Ltd ハンダ印刷装置におけるプリント基板支持装置
JPH106475A (ja) * 1996-06-20 1998-01-13 Murata Mfg Co Ltd スクリーン印刷用スキージ
JPH11289148A (ja) * 1998-04-02 1999-10-19 Ibiden Co Ltd 基板の表面処理方法
JP2001307054A (ja) * 2000-04-27 2001-11-02 Toppan Forms Co Ltd 非接触型データ送受信体用ｉｃチップの封止方法
US7028391B2 (en) * 2002-06-19 2006-04-18 Speedline Technologies, Inc. Method and apparatus for supporting a substrate
CN100391004C (zh) * 2002-10-30 2008-05-28 株式会社半导体能源研究所 半导体装置以及半导体装置的制作方法
JP4588341B2 (ja) * 2003-03-24 2010-12-01 株式会社半導体エネルギー研究所 Ｉｃカード

Also Published As

Publication number Publication date
JP2007038641A (ja) 2007-02-15

Similar Documents

Publication Publication Date Title
US7791153B2 (en) Method for manufacturing semiconductor device
US7449372B2 (en) Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device
US8492246B2 (en) Method of manufacturing integrated circuit device
US20060270175A1 (en) Method for manufacturing antenna and method for manufacturing semiconductor device
KR101443176B1 (ko) 반도체 장치 및 그것의 제작 방법
US8928131B2 (en) Semiconductor device and manufacturing method thereof
US7776656B2 (en) Method for manufacturing semiconductor device
KR20120102819A (ko) 반도체 디바이스 및 이의 제작 방법
US8232181B2 (en) Manufacturing method of semiconductor device
US7465596B2 (en) Manufacturing method of semiconductor device
JP5052031B2 (ja) 半導体装置の作製方法
US20140027852A1 (en) Semiconductor Device and Method for Manufacturing the Same
JP5089033B2 (ja) 半導体装置の作製方法
JP5030470B2 (ja) 半導体装置の作製方法
JP4908936B2 (ja) 半導体装置の作製方法
JP4693619B2 (ja) 導電層を有する基板の作製方法及び半導体装置の作製方法
JP2007043101A (ja) 半導体装置の作製方法
JP5004503B2 (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090120

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090120

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110721

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111004

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111128

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120717

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120724

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150803

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150803

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees