JP5044342B2 - Drawing apparatus and drawing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide drawing equipment for improving the drawing position accuracy, while realizing shortening of drawing time, and to provide a drawing method. <P>SOLUTION: The drawing equipment 1 is provided with a correction processing part 500 comprising an exposure position storage part 501, an exposure position computing part 502, a clock signal generating part 503, a frequency dividing part 504, a laser length measuring interface (I/F) 505, a position sampling part 506, a moving amount acquisition part 507, a position comparison part 508, a position-holding register 509, a position difference computing part 510, an arrival time computing part 511, a delay pulse number computing part 512, an immediately-prior-to-exposure signal generating part 513, a counter 514 and an exposure signal generating part 515. The correction processing part 500 computes the time required for a substrate to reach a desired exposure position from the measurement position of the substrate 90 length-measured by a laser length measuring device 70 and controls a light irradiation part 30 so as to irradiate a light with a delay delayed by the corresponding time portion. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a technique for drawing a pattern by irradiating light to a photosensitive material on a substrate.

  Conventionally, in the manufacturing process of a semiconductor substrate, a printed circuit board, a plasma display device, a liquid crystal display device, a glass substrate for a photomask or the like (hereinafter simply referred to as “substrate”), it has been formed on the surface of the substrate. 2. Description of the Related Art A drawing apparatus that draws a predetermined pattern on the surface of a substrate by irradiating the photosensitive material with light is used. A conventional drawing apparatus includes a stage that moves while holding a substrate as a drawing material in a horizontal posture, and an optical head that irradiates a predetermined pattern of light onto the upper surface of the substrate. Then, the precise position of the substrate is measured by a laser length measuring instrument while moving the substrate, and light is irradiated from the optical head at a desired exposure position, so that a predetermined amount is directly applied to the upper surface of the substrate without using a mask. Draw a pattern. A configuration of a conventional drawing apparatus is disclosed in Patent Document 1, for example. Such a drawing apparatus can flexibly cope with changes in the pitch and width of the pattern.

JP 2005-221596 A

  However, in the current laser length measuring device, the period at which the position update data can be read is only about several MHz to 10 MHz, so that the desired exposure position is measured or detected when the stage moving speed is increased during drawing. There is a problem that the accuracy of the drawing position is lowered.

  In the current semiconductor industry, there is an increasing demand for shortening the substrate processing time, and there is a demand for performing drawing with the stage moving speed (that is, the substrate moving speed) being increased. However, the conventional laser length measuring device has a problem that it cannot meet such demand.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a drawing apparatus and a drawing method that increase drawing position accuracy while realizing a reduction in drawing time.

In order to solve the above problems, the invention of claim 1 is a drawing apparatus for drawing a pattern on a substrate, the light irradiation means for irradiating the substrate with light, and the substrate relative to the light irradiation means Moving means for moving the light, storage means for storing one or more exposure positions to be irradiated with light by the light irradiation means, and position measurement means for measuring the relative position of the substrate as a measurement position for each sampling period T1 And a movement amount acquisition means for acquiring a relative movement amount of the substrate moved by the movement means during the sampling period T1, a comparison value obtained by subtracting the relative movement amount from the exposure position, and the measurement A comparison means for comparing the position and a difference between the exposure position and the measurement position and the substrate when the comparison means detects that the measurement position is greater than or equal to the comparison value. Based on the relative movement amount, time calculating means for calculating an arrival time until the substrate reaches the next exposure position closest to the measurement position, and irradiating the substrate with light according to the arrival time Control means for controlling the light irradiating means, clock signal generating means for generating a clock signal synchronized with the sampling period T1 and having a period T2 shorter than the sampling period T1, and the arrival time. A delay number calculating section for calculating the number of pulses of the clock signal generated by the clock signal generating means during the arrival time by dividing by the period T2, and a counting means for counting the number of pulses of the clock signal; wherein the control means, after the number of pulses obtained by the delay speed computing unit counted by the counting means, to irradiate the light It characterized that you control the urchin the light irradiation unit.

  The invention of claim 2 is the drawing apparatus according to the invention of claim 1, wherein the movement amount acquisition means is configured to detect relative positions of the substrates based on a measurement position of the substrate measured by the position measurement means. The movement amount is calculated and acquired.

The invention of claim 3 is a drawing method for drawing a pattern on the substrate by irradiating light from the light irradiating means while moving the substrate relative to the light irradiating means. Storing one or more exposure positions to be irradiated with light by the light irradiation means, (b) measuring a relative position of the substrate as a measurement position for each sampling period T1, and (c) the sampling period Obtaining a relative movement amount of the substrate moved by the moving means during T1, (d) obtaining a comparison value by subtracting the relative movement amount from the exposure position, and (e) the measurement A step of comparing the position with the comparison value, and (f) a difference between the exposure position and the measurement position when the measurement position is detected to be equal to or greater than the comparison value in the step (e) and Based on the relative movement amount of the substrate, A step of calculating an arrival time until the substrate reaches the next exposure position closest to the measurement position; and (g) the light irradiation so that the substrate is irradiated with light according to the arrival time. Controlling the means ; (h) generating a clock signal synchronized with the sampling period T1 and having a period T2 faster than the sampling period T1, and (i) changing the arrival time to the period T2. (J) calculating the number of pulses of the clock signal generated in the step (g) during the arrival time, and (j) counting the number of pulses obtained in the step (i). characterized in that the, have a, wherein step (g), after counting the number of pulses in said step (j) is a step of controlling the light irradiation unit to irradiate light to the substrate And

The invention of claim 4 is the drawing method according to the invention of claim 3 , wherein the step (c) is based on the measurement position of the substrate measured in the step (b). It is a step of calculating and acquiring the relative movement amount.

According to the first or second aspect of the invention, there is provided time calculating means for calculating the arrival time based on the relative movement amount of the substrate, and control means for controlling the light irradiation means so as to irradiate the light delayed by the arrival time. Thus, even when the substrate is moved at a relatively high speed with respect to the light irradiation means, pattern drawing with excellent position accuracy can be executed irrespective of the position measurement sampling rate of the position measurement means.
Further, the number of pulses of the clock signal generated by the clock signal generation unit during the arrival time is calculated, and the number of pulses is counted by the counting unit. Therefore, the arrival time can be measured accurately, and the accuracy of the pattern drawing position can be improved.

  According to the invention of claim 2, since the movement amount acquisition means calculates the relative movement amount of the substrate based on the measurement position information, the relative movement amount is updated every period T1. Therefore, the arrival time error can be made relatively small, and the accuracy of the pattern drawing position can be increased.

According to the third or fourth aspect of the invention, the method includes the step of calculating the arrival time based on the relative movement amount of the substrate and the step of controlling the light irradiation means so as to irradiate the light delayed by the arrival time. Thus, even when the substrate is moved at a relatively high speed with respect to the light irradiation means, pattern drawing with excellent positional accuracy can be executed regardless of the sampling rate for measuring the position of the substrate.
Further, the method includes a step of calculating the number of pulses of the clock signal generated during the arrival time and a step of counting the number of pulses. Therefore, since the arrival time can be accurately measured, the accuracy of the pattern drawing position can be improved.

According to the fourth aspect of the invention, since the method includes the step of calculating the relative movement speed of the substrate based on the measurement position information, the relative movement amount of the substrate is updated every period T1. Therefore, the arrival time error can be made relatively small, and the accuracy of the pattern drawing position can be increased.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

<1. First Embodiment>
<1.1. About the configuration of the drawing device>
FIG. 1 is a side view showing a configuration of a drawing apparatus 1 according to the present invention. FIG. 2 is a top view showing the configuration of the drawing apparatus 1 according to the present invention.

  In FIG. 1 and FIG. 2, for the sake of illustration and explanation, the Z-axis direction is defined as the vertical direction and the XY plane is defined as the horizontal plane, but these are defined for convenience in order to grasp the positional relationship. However, each direction described below is not limited. Further, the counterclockwise rotation direction about the Z axis is defined as “+ θ direction”.

  The drawing device 1 is configured as a device for drawing a predetermined pattern on the upper surface of a glass substrate for a color filter in a process of manufacturing a color filter of a liquid crystal display device. As shown in FIGS. 1 and 2, the drawing apparatus 1 mainly includes a stage 10 that holds a substrate 90, a moving mechanism 20 that is coupled to the stage 10, and a light irradiation unit 30 that irradiates light toward the substrate 90. And a control unit 50 that controls the operation of the moving mechanism 20 and the light irradiation unit 30, and a laser length measuring device 70 that measures the position of the base plate 24.

  The stage 10 has a flat outer shape, and a plurality of suction holes (not shown) are formed on the upper surface of the stage 10. When placing the substrate 90 on the upper surface of the stage 10, the substrate 90 can be fixed and held on the upper surface of the stage 10 while keeping the substrate 90 horizontal by the suction pressure of the suction holes.

  The moving mechanism 20 is a mechanism for moving the stage 10 in the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (rotation direction around the Z-axis (θ direction)). The moving mechanism 20 includes a rotation mechanism 21 that rotates the stage 10, a support plate 22 that rotatably supports the stage 10, a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction, and a support plate via the sub-scanning mechanism 23. And a main scanning mechanism 25 that moves the base plate 24 in the main scanning direction. Further, a mirror 26 that reflects light emitted from a laser length measuring device 70 to be described later is fixed on the side surface of the base plate 24 in the (+ X) direction.

  The rotation mechanism 21 includes a linear motor 21 a having a mover attached to an end of the stage 10 on the (−Y) direction side and a stator laid on the upper surface of the support plate 22. A rotation shaft 21 b is provided between the lower surface side of the center portion of the stage 10 and the support plate 22. For this reason, when the linear motor 21a is operated, the moving element moves in the X-axis direction along the stator, and the stage 10 rotates within a predetermined angle range around the rotating shaft 21b on the support plate 22.

  The sub-scanning mechanism 23 includes a linear motor 23 a having a mover attached to the lower surface of the support plate 22 and a stator laid on the upper surface of the base plate 24. A pair of guide portions 23 b extending in the sub-scanning direction is provided between the support plate 22 and the base plate 24. Therefore, when the linear motor 23a is operated, the support plate 22 moves in the sub scanning direction along the guide portion 23b on the base plate 24.

  The main scanning mechanism 25 includes a linear motor 25 a having a mover attached to the lower surface of the base plate 24 and a stator laid on the base 60 of the drawing apparatus 1. In addition, a pair of guide portions 25 b extending in the main scanning direction is provided between the base plate 24 and the base 60. For this reason, when the linear motor 25a is operated, the base plate 24 moves in the main scanning direction along the guide portion 25b on the base 60.

  The light irradiation unit 30 is a mechanism for irradiating the upper surface of the substrate 90 held on the stage 10 with a predetermined pattern of pulsed light. The light irradiation unit 30 is above the stage 10 and the moving mechanism 20, and has a frame 31 spanned from both sides of the stage 10 in a substantially horizontal direction, and is equidistant on the frame 31 along the X-axis direction (for example, And a plurality of optical heads 32 attached at intervals of 200 mm.

  One laser oscillator 34 is connected to the optical head 32 via an illumination optical system 33, and a laser driving unit 35 is connected to the laser oscillator 34. Therefore, when the laser drive unit 35 is operated, pulse light is emitted from the laser oscillator 34, and the emitted pulse light is introduced into each optical head 32 via the illumination optical system 33.

  Inside the optical head 32, there is an emission part 36 for emitting the pulsed light introduced from the illumination optical system 33 downward, and a part for blocking the pulsed light to form a light beam having a predetermined shape. An aperture unit 37 and a projection optical system 38 for forming an image of the pulsed light on the upper surface of the substrate 90 are provided. The aperture unit 37 includes an aperture AP that is a glass plate on which a predetermined light shielding pattern is formed by a plurality of slits. The pulsed light emitted from the emission unit 36 is partially shielded when passing through the aperture AP set in the aperture unit 37, and enters the projection optical system 38 as a light beam having a predetermined pattern. The incident light beam is scaled by a lens included in the projection optical system 38 and imaged on the upper surface of the substrate 90. Thereby, a plurality of regular patterns are drawn on the photosensitive material formed on the upper surface of the substrate 90.

  Further, the optical head 32 is provided with an aperture drive unit 39 for adjusting the position of the aperture AP set in the aperture unit 37. The aperture drive unit 39 can adjust the projection position of the pattern on the substrate 90 by adjusting the horizontal position (including the inclination in the horizontal plane) of the aperture AP. The aperture drive unit 39 can be configured by combining a plurality of linear motors, for example.

  The laser length measuring device 70 includes a laser light source (semiconductor laser), a linear interference system, and a receiver (not shown). In the laser length measuring device 70, the light beam emitted from the laser light source is incident on the mirror 26 fixed to the base plate 24 via the linear interference system. Then, the reflected light interferes with the original light beam by the linear interference system and is received by the receiver. Based on the output from the receiver, the position of the base plate 24 is accurately obtained. Therefore, position information of the substrate 90 held on the stage 10 can be obtained.

  FIG. 3 is a block diagram showing a connection configuration between each unit of the drawing apparatus 1 and the control unit 50 according to the present invention. The control unit 50 is electrically connected to the rotation mechanism 21, the sub-scanning mechanism 23, the main scanning mechanism 25, the laser driving unit 35, the illumination optical system 33, the projection optical system 38, and the aperture unit 37 described above. The operation can be controlled. The control unit 50 is configured by, for example, a computer having a CPU, a memory, and the like, and performs the above-described control when the computer operates according to a program installed in the computer.

  As shown in FIG. 1, an input unit 80 is connected to the control unit 50. The operator can set the moving speed of the stage 10 and the intervals between the plurality of light irradiation areas on the substrate 90 via the input unit 80.

  When performing drawing processing in such a drawing apparatus 1, pulse light is emitted from each optical head 32 while moving the stage 10 in the main scanning direction and the sub-scanning direction according to the drawing data input from the input unit 80. Then, a pattern is drawn on the substrate 90. Specifically, pulse light is irradiated from each optical head 32 while moving the stage 10 in the main scanning direction.

  As a result, a plurality of patterns are drawn on the upper surface of the substrate 90 in the main scanning direction with a predetermined exposure width (for example, 50 mm). When one drawing in the main scanning direction is completed, the drawing apparatus 1 moves the stage 10 by the exposure width in the sub-scanning direction, and moves the stage 10 in the main scanning direction again, and pulse light from each optical head 32. Irradiate.

  As described above, the drawing apparatus 1 repeats drawing in the main scanning direction a plurality of times (for example, four times) while shifting the substrate 90 in the sub-scanning direction by the exposure width of the optical head 32, thereby providing a color filter for the substrate 90. Draw a pattern.

<1.2. Configuration and Function of Correction Processing Unit>
Next, the configuration and function of the correction processing unit 500 included in the control unit 50 of the drawing apparatus 1 will be described.

  FIG. 4 is a block diagram of the correction processing unit 500 provided in the drawing apparatus 1 according to the present invention. As shown in FIG. 4, the correction processing unit 500 is connected to the light irradiation unit 30, the laser length measuring device 70, and the input unit 80, and will be described later based on inputs from the laser length measuring device 70 and the input unit 80. A process is performed and the light irradiation part 30 is controlled.

  The correction processing unit 500 includes an exposure position storage unit 501, an exposure position calculation unit 502, a clock signal generation unit 503, a frequency division unit 504, a laser length measurement interface (I / F) 505, and a position sampling unit 506. Further, the correction processing unit 500 includes a movement amount acquisition unit 507, a position comparison unit 508, a position holding register 509, a position difference calculation unit 510, an arrival time calculation unit 511, a delay pulse number calculation unit 512, a signal immediately before exposure generation unit 513, and a counter. 514 and an exposure signal generator 515 are also provided.

  The exposure position storage unit 501 can store exposure position data input by the operator via the input unit 80. The exposure position storage unit 501 is connected to the exposure position calculation unit 502 and outputs exposure position data to the exposure position calculation unit 502.

  The exposure position calculation unit 502 is connected to the position comparison unit 508 and the position difference calculation unit 510, and sequentially outputs exposure position signals based on the exposure position data stored in the exposure position storage unit 501.

  The clock signal generation unit 503 is connected to the frequency division unit 504 and the counter 514, generates a clock signal having a relatively high-speed cycle (T2), and outputs the generated clock signal to the frequency division unit 504 and the counter 514. To do.

  The frequency divider 504 is connected to the laser measurement I / F 505, the position sampling unit 506, and the signal generation unit 513 immediately before exposure. The frequency divider 504 receives an input from the clock signal generator 503, divides the clock signal generated by the clock signal generator 503, and divides the frequency signal into the laser measurement I / F 505 and the position sampling unit 506. To the signal generator 513 immediately before exposure. The frequency division ratio at this time is set according to the sampling period (T1) of the laser length measuring device 70.

  A laser length measurement I / F 505, which is an interface connecting the laser length measuring device 70 and the correction processing unit 500, outputs a frequency division frequency signal input from the frequency division portion 504 to the laser length measuring device 70. Thereby, the control unit 50 (or the correction processing unit 500) and the laser length measuring device 70 operate in synchronization. The laser length measurement I / F 505 is connected to the position sampling unit 506, and the result of length measurement by the laser length measuring device 70 (that is, the measurement position of the substrate 90) is sent to the position sampling unit 506 as a measurement position signal. Output.

  The position sampling unit 506 is connected to the movement amount acquisition unit 507, the position comparison unit 508, and the position holding register 509, and outputs a measurement position signal input from the laser length measurement I / F 505, respectively. The position sampling unit 506 outputs a measurement position signal in synchronization with the frequency division frequency signal (period T1) input from the frequency division unit 504. That is, the measurement position signal is input from the position sampling unit 506 to the movement amount acquisition unit 507, the position comparison unit 508, and the position holding register 509 every cycle T1.

  The movement amount acquisition unit 507 is connected to the position comparison unit 508 and the arrival time calculation unit 511, calculates the movement amount of the substrate 90 based on the measurement position signal sent from the position sampling unit 506, and the result Is output to the position comparison unit 508 and the arrival time calculation unit 511 as a movement amount signal. Specifically, the movement amount acquisition unit 507 obtains the movement distance of the substrate 90 during the period T1 based on the latest measurement position signal and the previous measurement position signal, and calculates the value as the movement amount of the substrate 90. Get as.

  The position comparison unit 508 is connected to the position holding register 509 and the immediately preceding exposure signal generation unit 513. First, the position comparison unit 508 subtracts the movement amount input from the movement amount acquisition unit 507 from the closest next exposure position value input from the exposure position calculation unit 502, so that the position immediately before the next exposure position is obtained. The position is calculated as a comparison value. Then, the position comparison unit 508 compares the comparison value with the measurement position input from the position sampling unit 506. Further, the position comparison unit 508 outputs a comparison detection signal to the position holding register 509 and the just-exposure signal generation unit 513 when the measurement position exceeds the comparison value.

  The position holding register 509 is connected to the position difference calculation unit 510, and outputs a held measurement position signal to the position difference calculation unit 510 when a comparison detection signal is input from the position comparison unit 508.

  The position difference calculation unit 510 obtains a difference distance between the closest next exposure position input from the exposure position calculation unit 502 and the measurement position (signal) input from the position holding register 509. The position difference calculation unit 510 is connected to the arrival time calculation unit 511 and outputs the calculation result (difference distance) to the arrival time calculation unit 511 as a difference signal.

  The arrival time calculation unit 511 receives the difference signal input from the position difference calculation unit 510, divides the difference distance by the movement amount of the substrate 90 input from the movement amount acquisition unit 507, and further divides the value into the period. By multiplying by T1, the time (arrival time Td) required for the substrate 90 to reach the nearest next exposure position is calculated. The arrival time calculation unit 511 is connected to the delay pulse number calculation unit 512 and outputs the arrival time Td obtained by the calculation to the delay pulse number calculation unit 512 as an arrival time signal.

  The delay pulse number calculation unit 512 calculates the number of pulses of the clock signal generated by the clock signal generation unit 503 during the arrival time Td based on the arrival time signal input from the arrival time calculation unit 511. The delay pulse number calculation unit 512 is connected to the counter 514 and outputs the calculation result to the counter 514 as a pulse number signal.

  The immediately-exposure signal generation unit 513 is connected to the counter 514, and when a comparison detection signal is input from the position comparison unit 508, a pulse signal is generated in synchronization with the frequency division frequency signal input from the frequency division unit 504. Output to the counter 514. Although details will be described later, the immediately-exposure signal generation unit 513 has a function of transmitting to the counter 514 the timing to start counting the number of pulses.

  The counter 514 determines the number of pulses of the clock signal generated by the clock signal generation unit 503 immediately after receiving the pulse signal from the immediately preceding exposure signal generation unit 513 according to the pulse number signal input from the delay pulse number calculation unit 512. Count. The counter 514 is connected to the exposure signal generation unit 515, and outputs a command signal to the exposure signal generation unit 515 when the count is completed.

  The exposure signal generation unit 515 is connected to the light irradiation unit 30, receives an instruction signal from the counter 514, and outputs an exposure signal (pulse signal) to the light irradiation unit 30. In response to the exposure signal, the light irradiation unit 30 irradiates the substrate 90 with light. As a result, a predetermined position of the moving substrate 90 is exposed.

<1.3. Operation procedure of drawing apparatus>
Next, the operation of the drawing apparatus 1 including the correction processing unit 500 will be specifically described.

  FIG. 5 is a flowchart showing the operation procedure of the drawing apparatus 1 according to the present invention. FIG. 6 is a timing chart regarding the correction processing unit 500 when the drawing apparatus 1 according to the present invention is operated.

  Here, the substrate 90 is placed on the stage 10 by a transport mechanism (such as a transport robot) (not shown), an operator, and the like, and exposure position information and stage movement speed information (500 mm / in FIG. 6) by the operator. It is assumed that the input has already been completed. For the sake of explanation, FIG. 6 shows the position of the substrate 90 at each timing (for example, 75 nm) as a distance from a predetermined position (reference position). In the present embodiment, desired exposure positions are 150 nm and 300 nm.

  First, the control unit 50 operates the moving mechanism 20 based on the exposure position information. Then, the substrate 90 starts moving at a predetermined speed in the main scanning direction (step S1). That is, the substrate 90 starts to move along the Y axis shown in FIGS.

  Subsequently, the position of the base plate 24 is measured by the laser length measuring device 70 and the position sampling unit 506 (step S2). In this embodiment, the laser length measuring device 70 measures the length every sampling period 100 nsec (T1) (that is, the length measurement clock is 10 MHz). In step S2, measurement position information of the substrate 90 is acquired (see FIG. 6). In FIG. 6, the length is set to be measured at the rise of the length measurement clock (timing a, b, c, d, e, f).

  Subsequently, the movement amount acquisition unit 507 acquires the movement amount of the substrate 90 (step S3). Here, a method by which the movement amount acquisition unit 507 acquires the movement amount will be described with a specific example.

  For example, as shown in FIG. 6, at timing a, it can be seen that the position of the substrate 90 is 76 nm from the laser side length value. Next, at timing b, the position of the substrate is at a position of 126 nm. That is, the 50 nm substrate 90 has advanced during 100 nsec (period T1), and the movement amount acquisition unit 507 acquires the movement amount of the substrate 90 at timing b as 50 nm. On the other hand, at timing c, the measurement position at timing b is 126 nm, and the measurement position at timing c is 177 nm. Therefore, the movement amount acquisition unit 507 acquires the movement amount of the substrate 90 at this timing c as 51 nm. In this way, the movement amount acquisition unit 507 acquires the movement amount of the substrate 90.

  Subsequently, the position comparison unit 508 compares the comparison value with the measurement position. That is, it is determined whether or not the measurement position exceeds the comparison value (step S4). Here, the processing by the position comparison unit 508 will be specifically described with reference to FIG. For example, at timing b, the nearest next exposure position is 150 nm, and the relative movement amount of the substrate 90 obtained from the movement amount acquisition unit 507 is 50 nm. Therefore, the comparison value that is the position immediately before the next exposure position is 100 nm (= 150 nm−50 nm). Here, the measurement position at timing b is 126 nm, and this measurement position is a value equal to or greater than the comparison value (100 nm). In this case (in the case of YES at step S4), a comparison detection signal is output from the position comparison unit 508.

  On the other hand, if the measurement position does not exceed this comparison value (NO in step S4), the comparison detection signal is not output. For example, as shown in FIG. 6, at timing c, the nearest next exposure position is 300 nm, and the movement amount of the substrate 90 is 51 nm. Therefore, the comparison value is 249 nm (= 300 nm-51 nm). Here, the measurement position at timing c is 177 nm, but the comparison value does not exceed the measurement position as compared with the comparison value 249 nm. In such a case, the process returns to step S2 as shown in FIG.

  As described above, the position comparison unit 508 detects whether the calculated comparison value exceeds the nearest next exposure position based on the measurement position of the substrate 90 at a certain timing and the movement amount of the substrate 90. Is done.

  Subsequently, when the comparison value exceeds the nearest next exposure position (Yes in step S4), the difference distance between the exposure position and the measurement position is obtained by the position difference calculation unit 510 (step S5). As shown in FIG. 6, at timing b, for example, the nearest next exposure position is 150 nm and the measurement position is 126 nm, so the difference distance is calculated as 24 nm. At timing e, since the nearest next exposure position is 300 nm and the measurement position is 275 nm, the difference distance 25 nm is calculated.

  Subsequently, the arrival time calculation unit 511 calculates the time (arrival time Td) required for the substrate 90 to move from the measurement position to the next exposure position (step S6). Specifically, the arrival time Td is obtained by dividing the aforementioned difference distance by the movement amount of the substrate 90 and multiplying the value by the period T1. For example, as shown in FIG. 6, by dividing the difference distance of 24 nm by the movement amount of 50 nm and multiplying the value (0.48) by the period T1 (100 nsec) at timing b, 48 nsec is obtained as the arrival time Td. .

  Here, in order to prevent the calculation time from being excessively long due to the arrival time Td not being divisible by the moving speed or the number of digits after the decimal point being increased, the calculation is performed using, for example, memory table conversion. You may design the arrival time calculating part 511 so that it may complete | finish without calculating below a predetermined digit.

  Subsequently, the delay pulse number calculation unit 512 calculates the number of pulses of the clock signal generated by the clock signal generation unit 503 during the arrival time Td (step S7). The number of pulses can be obtained by dividing the arrival time Td described above by the period T2. As shown in FIG. 6, at the timing b, for example, the arrival time Td is 48 nsec and the period T2 is 2.5 nsec, so the number of pulses is 19.2 (= 48 nsec ÷ 2.5 nsec).

  Here, when the number of pulses does not become an integer as described above, for example, the number of delayed pulses is calculated so as to select an integer that is greater than (or less than) a value that can be calculated and closest to that value. The part 512 may be designed. In the present embodiment, the delay pulse number calculation unit 512 calculates a value that is equal to or less than the calculated value and is the closest value as the pulse number. That is, in the above case, the number of pulses is 19.

  Subsequently, the counter 514 counts the clock signal generated by the clock signal generation unit 503 by the number of pulses calculated in step S7 (step S8). In this embodiment, when the length measurement clock signal falls, the immediately-exposure signal generation unit 513 is designed to output the immediately-exposure signal, and the counter 514 starts counting upon receiving the output. ing. For example, as shown in FIG. 6, a signal immediately before exposure is generated between timing b and timing c at an intermediate time between timing b and timing c (timing b1). Thereby, the counter 514 can be operated in synchronization with the clock signal, and the counter 514 starts counting for 19 pulses.

  When the counter 514 finishes counting 19 pulses, a command signal is sent from the counter 514 to the exposure signal generator 515. Upon receiving this command signal, the exposure signal generation unit 515 outputs the exposure signal to the light irradiation unit 30. Thereby, the light irradiation part 30 irradiates light (pulse light) with respect to the board | substrate 90 (step S9).

  Subsequently, the exposure apparatus 1 determines whether or not there is a next exposure position (step S10). Specifically, the exposure position calculation unit 502 determines whether to output the next exposure position information. If yes (YES), the process returns to step S2, and the control unit 50 repeats the above-described operation. On the other hand, when the next exposure position does not exist (in the case of NO), the movement of the stage 10 is stopped (S11). When the pattern drawing process by the drawing apparatus 1 is finished, all the operations are finished.

<1.4. Advantages of this embodiment>
As described above, the drawing apparatus 1 according to the present embodiment includes the correction processing unit 500 so that the exposure signal generation unit 515 outputs the exposure signal to the light irradiation unit 30 according to the arrival time Td. Therefore, even if the moving speed of the substrate 90 is increased, it is possible to suppress a decrease in position accuracy for drawing a pattern (timing accuracy for generating an exposure signal). As a result, a high throughput of substrate manufacturing can be realized.

  Moreover, since it is not necessary to improve the sampling period T1 of the laser length measuring device 70, the manufacturing cost of the drawing apparatus 1 can be suppressed. Further, by shortening the period T2 of the clock signal generated by the clock signal generation unit 503, the pattern drawing error can be further reduced.

<2. Second Embodiment>
In the first embodiment, the movement amount acquisition unit 507 is configured to calculate and acquire the movement amount of the substrate 90 based on the measurement position information, but the movement amount acquisition method is limited to this. It is not a thing.

  FIG. 7 is a block diagram of a correction processing unit 500a included in the drawing apparatus 1 according to the second embodiment configured based on such a principle. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected suitably and description is abbreviate | omitted.

  As shown in FIG. 7, the input unit 80a is connected to an exposure position storage unit 501 and a movement amount acquisition unit 507a. That is, the setting value of the moving speed of the stage 10 in the main scanning direction input by the operator can be output to the moving amount acquisition unit 507a as it is. Further, unlike the position sampling unit 506 in the first embodiment, the position sampling unit 506a is connected only to the position comparison unit 508 and the position holding register 509, and is not connected to the movement amount acquisition unit 507a.

  Here, the movement amount acquisition unit 507a calculates the distance traveled by the stage 10 during the sampling period T1 of the length measuring laser 70 from the input setting value of the movement speed of the stage 10, and acquires the value as the movement amount. To do. That is, for example, if the moving speed of the stage 10 is 500 nm / sec and the period T1 is 100 nsec, the moving amount is 50 nm.

  Even in such a case, as long as the substrate 90 moves at substantially the same speed as the set value, the position accuracy of pattern drawing can be increased as in the first embodiment. Furthermore, since the circuit configuration of the correction processing unit 500a can be simplified, the manufacturing cost of the drawing apparatus 1 can be reduced.

<3. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

  In the drawing apparatus 1 in the above embodiment, the stage 10 is moved with respect to the stationary optical head 32. However, the present invention is not limited to this. For example, the optical head 32 is placed on the stationary stage 10. The structure which moves this may be sufficient.

  In the first embodiment, the position comparison unit 508 first subtracts the latest movement amount of the substrate 90 acquired by the movement area acquisition unit 507 from the value of the next next exposure position, thereby obtaining a comparison value. However, the method for calculating the comparison value is not limited to this. For example, instead of the latest movement amount information, any one of the movement amount information acquired so far by the movement amount acquisition unit 507 may be used for calculation of the comparison value. Further, an average of a plurality of movement amounts of the substrate 90 may be used as a movement amount for calculating the comparison value.

  Further, in the above embodiment, the immediately preceding exposure signal generation unit 513 outputs the immediately preceding exposure signal after the position comparison unit 508 outputs the comparison detection signal and when the length measurement clock signal falls. Explained. In this case, the output of the exposure signal is always delayed by half the length T1 of the length measurement clock. Therefore, when a pattern is drawn with the substrate 90 moved at a constant speed, a certain deviation occurs between the desired exposure position and the actual exposure position. Even in such a case, for example, by setting the exposure position set in advance from the input unit 80 to a value calculated in consideration of the shift from the desired exposure position, the shift can be eliminated. It is. Alternatively, the exposure position calculation unit 502 may be configured to perform a shift calculation process.

  Further, the correction processing units 500 and 500a in the above embodiment calculate the number of delay pulses after calculating the arrival time Td (see FIGS. 4, 5, and 7). This is because the movement amount acquisition units 507 and 507a calculate the distance traveled during the period T1 (100 nsec in the embodiment), and it is necessary to calculate the arrival time once. However, the configuration of the correction processing units 500 and 500a is not limited to this. For example, the movement amount acquisition unit outputs the distance D traveled by the substrate 90 during the period T2 of the clock signal to the delay pulse number calculation unit. The delay pulse number calculation unit 512 may be configured to divide the difference distance between the measurement position and the exposure position by the distance D from the output value.

  A specific example will be described. For example, at the timing b shown in FIG. 6, the movement amount of the substrate 90 is 50 nm. Therefore, the movement distance D that moves during the period T2 (2.5 nsec, frequency 400 MHz) is 1.25 nm (= 50 nm ÷ 100 nsec × 2.5 nsec). Then, the movement amount acquisition unit outputs this value to the delay pulse number calculation unit. Next, the delay pulse number calculation unit calculates the pulse number (19) by dividing the difference distance (24 nm) between the exposure position and the measurement position by the input movement distance D (1.25 nm).

  Thereby, the exposure apparatus 1 can calculate the number of pulses to be counted by the counter 514 without passing through the arrival time calculation unit 511. Therefore, since the circuit configuration of the correction processing units 500 and 500a can be further simplified, the manufacturing cost of the exposure apparatus 1 can be suppressed. Further, by shortening the period T2 of the clock signal generated by the clock signal generation unit 503, the pattern drawing error can be further reduced.

  In the above embodiment, the correction processing units 500 and 500a are realized in hardware (circuit), but the invention is not limited to this. For example, the CPU executes a program and the like. It may be realized.

  In the drawing apparatus 1 in the above embodiment, the exposure pattern is generated by the aperture AP. However, the exposure pattern generation mechanism is not limited to this. For example, a drawing apparatus having a configuration for generating an exposure pattern by an optical modulation element such as a grading light valve (GLV) may be used. Note that the GLV (diffraction grating type modulation element) is configured by a diffraction grating that can be switched between a state in which the intensity of the 0th-order diffracted light is increased and a state in which the intensity of the odd-order diffracted light is increased. For example, by designing so that only the 0th-order diffracted light is guided to the projection optical system, the GLV can function as a switching element for the drawing signal light.

  Moreover, in the drawing apparatus 1 in the above embodiment, the glass substrate for the color filter of the liquid crystal display device is a processing target, but the present invention is not limited to this, and the semiconductor substrate, the printed board, the glass substrate for the plasma display device. Other substrates such as these may be processed.

It is the side view which showed the structure of the drawing apparatus which concerns on this invention. It is the top view which showed the structure of the drawing apparatus which concerns on this invention. It is the block diagram which showed the connection structure between each part of the drawing apparatus which concerns on this invention, and a control part. It is a block diagram of the correction | amendment process part with which the drawing apparatus which concerns on this invention is provided. It is a flowchart which shows the procedure of operation | movement of the correction process part with which the drawing apparatus which concerns on this invention is provided. It is a timing chart figure when operating the drawing apparatus which concerns on this invention. It is a block diagram of the correction | amendment process part with which the drawing apparatus in 2nd Embodiment is provided.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Drawing apparatus 10 Stage 20 Moving mechanism 21 Rotating mechanism 23 Subscanning mechanism 25 Main scanning mechanism 30 Light irradiation part 50 Control part 500,500a Correction processing part 501 Exposure position memory | storage part 503 Clock signal generation part 506,506a Position sampling part 507, 507a Movement amount acquisition unit 508 Position comparison unit 511 Arrival time calculation unit 512 Delay pulse number calculation unit 513 Just before exposure signal generation unit 514 Counter 515 Exposure signal generation unit 70 Laser length measuring device 90 Substrate a, b, b1, c, d, e, f timing

Claims (4)

A drawing device for drawing a pattern on a substrate,
A light irradiation means for irradiating the substrate with light;
Moving means for moving the substrate relative to the light irradiation means;
Storage means for storing one or more exposure positions to be irradiated with light by the light irradiation means;
Position measuring means for measuring the relative position of the substrate as a measurement position for each sampling period T1,
A movement amount acquisition means for acquiring a relative movement amount of the substrate moved by the movement means during the sampling period T1;
Comparison means for comparing the measurement position with a comparison value obtained by subtracting the relative movement amount from the exposure position;
When the comparison unit detects that the measurement position is equal to or greater than the comparison value, the substrate is moved to the measurement position based on the difference between the exposure position and the measurement position and the relative movement amount of the substrate. Time calculating means for calculating the arrival time until the next exposure position closest to
Control means for controlling the light irradiation means to irradiate the substrate with light according to the arrival time;
A clock signal generating means for generating a clock signal synchronized with the sampling period T1 and having a period T2 shorter than the sampling period T1,
A delay number calculation unit for calculating the number of pulses of the clock signal generated by the clock signal generation unit during the arrival time by dividing the arrival time by the period T2.
Counting means for counting the number of pulses of the clock signal;
Equipped with a,
It said control means, after the number of pulses obtained by the delay speed computing unit counted by the counting means, drawing device, characterized that you control the light irradiating means so as to irradiate light. The drawing apparatus according to claim 1,
The drawing apparatus characterized in that the movement amount acquisition means calculates and acquires the relative movement amount of the substrate based on the measurement position of the substrate measured by the position measurement means. A drawing method for drawing a pattern on the substrate by irradiating light from the light irradiation means while moving the substrate relative to the light irradiation means,
(a) storing one or more exposure positions to be irradiated with light by the light irradiation means;
(b) measuring the relative position of the substrate as a measurement position for each sampling period T1,
(c) obtaining a relative movement amount of the substrate moved by the moving means during the sampling period T1;
(d) obtaining a comparison value by subtracting the relative movement amount from the exposure position;
(e) comparing the measurement position with the comparison value;
(f) when it is detected in the step (e) that the measurement position is equal to or greater than the comparison value, based on the difference between the exposure position and the measurement position and the relative movement amount of the substrate. Calculating the arrival time until it reaches the next exposure position closest to the measurement position;
(g) controlling the light irradiation means to irradiate the substrate with light according to the arrival time;
(h) generating a clock signal synchronized with the sampling period T1 and having a period T2 faster than the sampling period T1;
(i) calculating the number of pulses of the clock signal generated in the step (g) during the arrival time by dividing the arrival time by the period T2.
(j) counting the number of pulses obtained in the step (i);
I have a,
The step (g) is a step of controlling the light irradiating means to irradiate the substrate with light after counting the number of pulses in the step (j) . The drawing method according to claim 3 ,
The step (c)
A drawing method, which is a step of calculating and obtaining a relative movement amount of the substrate based on the measurement position of the substrate measured in the step (b).

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