JP5027728B2 - 固体撮像装置およびx線検査システム - Google Patents
固体撮像装置およびx線検査システム Download PDFInfo
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- JP5027728B2 JP5027728B2 JP2008114210A JP2008114210A JP5027728B2 JP 5027728 B2 JP5027728 B2 JP 5027728B2 JP 2008114210 A JP2008114210 A JP 2008114210A JP 2008114210 A JP2008114210 A JP 2008114210A JP 5027728 B2 JP5027728 B2 JP 5027728B2
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- 238000003384 imaging method Methods 0.000 title claims description 172
- 238000007689 inspection Methods 0.000 title claims description 23
- 238000007599 discharging Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 2
- 238000002955 isolation Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 22
- 230000010354 integration Effects 0.000 description 18
- 239000003990 capacitor Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000000926 separation method Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 230000004044 response Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000013170 computed tomography imaging Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003325 tomography Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computed tomography [CT]
- A61B6/032—Transmission computed tomography [CT]
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/667—Camera operation mode switching, e.g. between still and video, sport and normal or high- and low-resolution modes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/30—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming X-rays into image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/42—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by switching between different modes of operation using different resolutions or aspect ratios, e.g. switching between interlaced and non-interlaced mode
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
- H04N25/443—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by reading pixels from selected 2D regions of the array, e.g. for windowing or digital zooming
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/32—Transforming X-rays
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medical Informatics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Biomedical Technology (AREA)
- General Physics & Mathematics (AREA)
- Pulmonology (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Biophysics (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Optics & Photonics (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Heart & Thoracic Surgery (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Measurement Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008114210A JP5027728B2 (ja) | 2008-04-24 | 2008-04-24 | 固体撮像装置およびx線検査システム |
KR1020107015107A KR101632757B1 (ko) | 2008-04-24 | 2009-04-22 | 고체 촬상 장치 및 x선 검사 시스템 |
US12/989,132 US8477907B2 (en) | 2008-04-24 | 2009-04-22 | Solid-state image pickup apparatus and X-ray inspection system |
EP09735012.8A EP2276236B1 (en) | 2008-04-24 | 2009-04-22 | Solid-state image pickup apparatus and x-ray inspection system |
PCT/JP2009/058003 WO2009131150A1 (ja) | 2008-04-24 | 2009-04-22 | 固体撮像装置およびx線検査システム |
CN200980114758.5A CN102017609B (zh) | 2008-04-24 | 2009-04-22 | 固体摄像装置及x射线检查系统 |
TW098113772A TWI484942B (zh) | 2008-04-24 | 2009-04-24 | Solid-state imaging device and X-ray inspection system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008114210A JP5027728B2 (ja) | 2008-04-24 | 2008-04-24 | 固体撮像装置およびx線検査システム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012120634A Division JP5337281B2 (ja) | 2012-05-28 | 2012-05-28 | X線検査システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009267712A JP2009267712A (ja) | 2009-11-12 |
JP5027728B2 true JP5027728B2 (ja) | 2012-09-19 |
Family
ID=41216879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008114210A Active JP5027728B2 (ja) | 2008-04-24 | 2008-04-24 | 固体撮像装置およびx線検査システム |
Country Status (7)
Country | Link |
---|---|
US (1) | US8477907B2 (ko) |
EP (1) | EP2276236B1 (ko) |
JP (1) | JP5027728B2 (ko) |
KR (1) | KR101632757B1 (ko) |
CN (1) | CN102017609B (ko) |
TW (1) | TWI484942B (ko) |
WO (1) | WO2009131150A1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5094530B2 (ja) | 2008-04-24 | 2012-12-12 | 浜松ホトニクス株式会社 | X線検査システム |
JP5628103B2 (ja) * | 2011-06-30 | 2014-11-19 | 富士フイルム株式会社 | 放射線検出器、放射線画像撮影システム、断線検出プログラム、及び断線検出方法 |
US8872120B2 (en) * | 2012-08-23 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and method for driving the same |
JP6274501B2 (ja) * | 2013-11-26 | 2018-02-07 | キヤノンメディカルシステムズ株式会社 | X線診断装置 |
JP2016019708A (ja) * | 2014-07-16 | 2016-02-04 | 浜松ホトニクス株式会社 | 固体撮像装置、x線撮像システムおよび固体撮像装置駆動方法 |
JP6700673B2 (ja) * | 2015-05-15 | 2020-05-27 | キヤノン株式会社 | 撮像装置、撮像システム |
KR102018189B1 (ko) * | 2017-12-20 | 2019-09-04 | 주식회사 에이치앤아비즈 | 엑스레이 디텍터의 비닝 모드 제어장치 및 방법 |
JP7200520B2 (ja) * | 2018-07-09 | 2023-01-10 | コニカミノルタ株式会社 | 制御システム及び放射線撮影システム |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2557865B2 (ja) * | 1987-01-28 | 1996-11-27 | キヤノン株式会社 | 固体撮像装置 |
US7123687B2 (en) | 2003-04-10 | 2006-10-17 | Varian Medical Systems Technologies, Inc. | Method for displaying digital X-ray image data at high resolution |
JP2005184358A (ja) * | 2003-12-18 | 2005-07-07 | Sony Corp | 固体撮像装置、及び画素信号読み出し方法 |
JP2006068512A (ja) * | 2004-08-06 | 2006-03-16 | Canon Inc | 撮像装置、撮像システム、撮像方法、およびコンピュータプログラム |
DE112006000869B4 (de) | 2005-04-11 | 2017-10-19 | J. Morita Mfg. Corp. | Radiographievorrichtung mit Übersichtsbildfunktion |
JP4773768B2 (ja) * | 2005-08-16 | 2011-09-14 | キヤノン株式会社 | 放射線撮像装置、その制御方法及び放射線撮像システム |
US8005187B2 (en) | 2005-10-17 | 2011-08-23 | J. Morita Manufacturing Corporation | Medical digital X-ray imaging apparatus and medical digital X-ray sensor |
JP2007144064A (ja) | 2005-11-30 | 2007-06-14 | Shimadzu Corp | 撮像センサおよびそれを用いた撮像装置 |
JP2007244443A (ja) * | 2006-03-14 | 2007-09-27 | Shizuo Nakayama | 人間の動作のレッスンシステム及びレッスン方法 |
JP4868926B2 (ja) * | 2006-04-21 | 2012-02-01 | キヤノン株式会社 | 放射線撮像装置 |
JP5094530B2 (ja) * | 2008-04-24 | 2012-12-12 | 浜松ホトニクス株式会社 | X線検査システム |
-
2008
- 2008-04-24 JP JP2008114210A patent/JP5027728B2/ja active Active
-
2009
- 2009-04-22 EP EP09735012.8A patent/EP2276236B1/en active Active
- 2009-04-22 WO PCT/JP2009/058003 patent/WO2009131150A1/ja active Application Filing
- 2009-04-22 KR KR1020107015107A patent/KR101632757B1/ko active IP Right Grant
- 2009-04-22 CN CN200980114758.5A patent/CN102017609B/zh active Active
- 2009-04-22 US US12/989,132 patent/US8477907B2/en active Active
- 2009-04-24 TW TW098113772A patent/TWI484942B/zh active
Also Published As
Publication number | Publication date |
---|---|
US8477907B2 (en) | 2013-07-02 |
WO2009131150A1 (ja) | 2009-10-29 |
JP2009267712A (ja) | 2009-11-12 |
KR101632757B1 (ko) | 2016-06-22 |
TWI484942B (zh) | 2015-05-21 |
EP2276236B1 (en) | 2015-06-03 |
CN102017609A (zh) | 2011-04-13 |
EP2276236A4 (en) | 2011-08-17 |
CN102017609B (zh) | 2013-05-15 |
KR20110005770A (ko) | 2011-01-19 |
EP2276236A1 (en) | 2011-01-19 |
TW201008261A (en) | 2010-02-16 |
US20110064195A1 (en) | 2011-03-17 |
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