JP5026825B2 - Transport device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an alignment apparatus capable of continuously maintaining an effect of positioning a plate-like member, a conveying apparatus capable of conveying the plate-like member while maintaining its position, and a sheet pasting apparatus comprising their apparatuses. <P>SOLUTION: The alignment apparatus 11 comprises a base member 20; a supporter 21 to be attachably/detachably supported by the base member 20; a first positioning means 22 for positioning the supporter 21 on the base member 20; a second positioning means 24 for positioning a semiconductor wafer W on a placing surface 21A of the supporter 21. The semiconductor wafer W can be conveyed by the conveying means 13 together with the supporter 21, and the supporter 21 is supported on a table member 12 via a third positioning means 45. An adhesive sheet S is pasted on the semiconductor wafer W supported by the table member 12 via a pasting means 15. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

The present invention relates to a conveying equipment, more particularly, to transport equipment to transport while maintaining the position of the position-decided fit a plate-like member.

  A protective adhesive sheet is affixed to the surface forming the circuit surface of a semiconductor wafer (hereinafter simply referred to as “wafer”). The sheet sticking device for sticking the adhesive sheet includes an alignment device for positioning a wafer, a table member for sticking the adhesive sheet, a transport means for transporting the wafer between the alignment device and the table member, and the table. And a pasting unit for pasting an adhesive sheet on the surface of the wafer supported by the member (see, for example, Patent Document 1).

JP 2003-257898 A

  However, the sheet sticking device described in Patent Document 1 has a disadvantage that even if the wafer is positioned by the alignment device, it is likely to be displaced when transferred to the sheet sticking table member. . In particular, as in recent times, when the wafer thickness is an extremely thin wafer whose back surface is ground to the order of several tens of μm, the moment when the wafer is placed on the upper surface of the table member, that is, the force with which the transfer means holds the wafer. At the moment of releasing, there is a tendency that the wafer is displaced in the lateral direction due to the flow escaping to the outside of the air existing between the two. Therefore, it becomes difficult to maintain the effect of positioning the wafer on the table member for attaching the sheet, which causes a disadvantage that the subsequent sheet attaching accuracy and, in turn, the yield of the semiconductor device is lowered.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and a first object thereof is to provide an alignment apparatus capable of continuously maintaining the effect of positioning the plate-like member. There is.
A second object of the present invention is to provide a transport device capable of eliminating a factor causing positional deviation of a plate-like member by carrying it integrally with a support that supports the plate-like member when the plate-like member is transported. There is to do.
A third object of the present invention is to provide a sheet sticking apparatus capable of sticking an adhesive sheet while accurately maintaining the position of a plate-like member.

To achieve the above object, a base member, a support member that is detachably supported by the base member and has a mounting surface for a plate-like member on the upper surface side, and a first support member that positions the support member with respect to the base member . An alignment apparatus including a first positioning means, and a second positioning means for positioning the plate-like member with respect to the support, a table member for supporting the support together with the plate-like member, and the alignment apparatus Transportation means provided to be movable between the table members,
Said support is provided with the plate-like member adsorption holdable vacuum holes (25), the passageway that passes with the vacuum holes (25) (28) and through passage and (31),
Said conveying means, before Symbol communication path (31) to have a can communicate with passages (60A), when conveying said plate-shaped member to the support integrally between the alignment device and the table member, the passageway ( 60A) communicates with said passage (31), said plate-like member provided to be sucked and held through the passageway (31) of said support,
The base member has a passage (29) that can communicate with the passage (28), and the passage (29) becomes the passage (28) when the support is placed on the base member. Communicating, provided through the passage (28) of the support so that the plate-like member can be sucked and held,
The table member has a passage (46) capable of communicating with the passage (28), and when the support is placed on the table member, the passage (46) becomes the passage (28). communicating, adopts a configuration in which, Ru provided to be sucked and held to the plate member through said passage (28) of said support.

  The said conveyance means can take the structure that the holding | maintenance unit holding the outer peripheral side of the said support body is included, and the said holding | maintenance unit is provided with two or more.

Prior Symbol conveying equipment, before Symbol passage (28)及beauty communication path (31), it is preferable that the possible off valve maintains the suction holding of the plate-shaped member by the support member is provided.

  Moreover, the conveyance means in the said sheet sticking apparatus can take the structure that the holding | maintenance unit holding the outer peripheral side of the said support body is included, and the said holding | maintenance unit is provided with two or more.

  Further, the sheet sticking device may be configured such that an energy ray curable protective sheet is stuck on the plate-like member, and an energy irradiation device is disposed on the transport path of the transport means.

  Moreover, the said support body can be comprised with the material which can permeate | transmit an energy ray.

According to the present invention, by providing the base member and the support, and the first and second positioning means for positioning the support and the plate-like member, mutual displacement between the plate-like member and the support is prevented. Thus, it can be transported integrally.
In addition, with the configuration in which the table member is provided with the third positioning means, after the plate-like member is transferred from the alignment device to the table member for sheet pasting and transferred, the adhesive sheet is not required to be positioned again. Can be affixed.
Further, since the conveying means is configured to hold the support without holding the plate-like member, even if the plate-like member is a brittle member such as a wafer ground to be extremely thin, the plate-like member The risk of damaging the member can be eliminated.
Further, in the configuration in which a plurality of holding units for holding the support are provided, a plurality of supports can be used, and the next support is attached to the table member using the time during which the adhesive sheet is applied by the attaching means. Since it can be conveyed upward and a part of a series of operations can be overlapped, the processing capacity per unit time can be improved.
Further, in the configuration in which the energy irradiation device is arranged in the conveyance path of the plate-shaped member, when an energy ray curable protective sheet is attached to the plate-shaped member, the energy beam can be irradiated in the conveyance process. it can.
Furthermore, if the support is an energy beam transmission type, energy beam irradiation through the support can be performed, and the degree of freedom of device layout can be expanded.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet sticking apparatus according to an embodiment of the present invention. In this figure, a sheet sticking apparatus 10 is provided side by side with an alignment apparatus 11 that supports a wafer W transferred from a wafer stocker (not shown) with a circuit surface (front surface) facing down, and the alignment apparatus 11. A table member 12 on which RF can be placed, a transfer means 13 for transferring and transferring the wafer W between the alignment device 11 and the table member 12, and an upper surface (back surface) of the wafer W supported on the table member 12 ) And an ultraviolet irradiation device 16 as an energy irradiation device arranged along the transfer path of the transfer means 13. It is configured. Note that the wafer W in the present embodiment is intended for a wafer having a UV curable protective sheet PS attached in advance to its circuit surface (surface).

As shown in FIG. 2, the alignment device 11 is detachably supported by a base member 20 and an upper surface of the base member 20, and a support body 21 whose upper surface is a mounting surface 21 </ b> A of the wafer W. The first positioning means 22 for positioning the support 21 on the base member 20 and the second positioning means 24 for positioning the wafer W on the support 21 are configured. As shown in FIG. 3, the base member 20 is provided in a plate shape having a substantially square planar shape. The support 21 is made of a material that can transmit ultraviolet rays, and a vacuum hole 25 for adsorbing and holding the wafer W is formed on the upper surface thereof. The vacuum hole 25 communicates with a chamber 26 formed inside the support 21, and the chamber 26 is connected to a decompression device 30 through passages 28 and 29. It can be held by suction. In this embodiment, the outer shape of the support 21 is substantially the same as the outer shape of the wafer W, but is not limited to this. Here, the passage 28 in the support body 21 allows communication with the passage 29 when the support body 21 is installed on the base member 20, while the passage to the atmosphere when the support body 21 leaves the base member 20. An appropriate opening / closing valve (not shown) for blocking the opening is provided. The support 21 is provided with a passage 31 of a different route communicating with the chamber 26, the passage 31 is and communicates with a holding unit 54 to be described later of the transport apparatus 13, the wafer support 21 in the conveyance means 13 When transported together with W, the inside of the chamber 26 is depressurized to hold the wafer W by suction. Here, similarly to the passage 28, the passage 31 is provided with an opening / closing valve (not shown), and the opening / closing valve is normally closed and is provided with the passage 31 on the condition that the holding unit 54 holds the support 21. The holding unit 54 can communicate with the holding unit 54.

  The first positioning means 22 includes a protrusion 33 rising from the upper surface of the base member 20 and a recess 34 formed on the lower surface side of the support 21, and the protrusion 33 is fitted into the recess 34. By doing so, the support 21 can be positioned. In the present embodiment, the protrusions 33 and the recesses 34 are arranged at positions spaced approximately 120 degrees along the circumferential direction of the support 21, but are not limited thereto.

  The second positioning means 24 is provided on the upper surface side of the base member 20, and the pins 35 provided at positions spaced apart by approximately 120 degrees in the circumferential direction of the support 21, and these pins 35 are movable. A linear motion motor 36. The upper end position of the pin 35 is provided at a height that contacts the outer peripheral edge of the wafer W. The direction of movement of the linear motor 36 is directed to the center of the support 21, so that the center of the wafer W placed on the support 21 can coincide with the center of the support 21. Yes.

  The table member 12 includes an upper table 40 and a lower table 41, and the upper table 40 is provided so as to be able to move up and down with respect to the lower table 41 through lifting means (not shown). A protrusion 43 is provided on the upper surface of the upper table 40, and the protrusion 43 fits into the recess 34 of the support 21 when the wafer W is transferred together with the support 21. 21 is positioned, and the relative positioning state of the support 21 and the wafer W by the alignment device 11 is maintained. Here, the projection 43 and the recess 34 constitute a third positioning means 45 having substantially the same configuration as the first positioning means 22. Further, the upper table 40 is formed with a passage 46 connected to the pressure reducing device 30, similarly to the passage 29 provided in the base member 20, whereby the support 21 is placed on the upper table 40. Even in the state where the wafer W is supported, the wafer W on the support 21 is sucked and held. Further, the upper table 40 is configured such that the ring frame RF can be positioned and fixed on the outer periphery of the wafer W to be placed. The lower table 41 is provided with a slider 47. The slider 47 moves on a guide rail 49 laid in the left-right direction in FIG. 1 so that the table member 12 can reciprocate left and right. Yes.

  The conveying means 13 is located above the alignment device 11 and the table member 12, and a single-axis robot 50 extending therebetween, and a slider 52 that is supported by the single-axis robot 50 and is movable in the left-right direction. And a Z-axis cylinder 53 supported on the front side of the slider 52 (front side in FIG. 1), and a holding unit 54 fixed to the lower end of the piston rod 53A in the Z-axis cylinder 53. As shown in FIG. 4, the holding unit 54 includes a frame plate 56 that is substantially circular in plan view, and a chuck 57 that is disposed at positions spaced apart by approximately 120 degrees in the circumferential direction of the frame plate 56. The chuck 57 includes a cylinder 58 and a holding member 60 which is attached to the tip of the piston rod 59 of the cylinder 58 and is provided so as to advance and retreat along the radial direction of the frame plate 56. As shown in FIG. 1, the holding member 60 located on the left side is formed with a passage 60 </ b> A that can communicate with the passage 31 of the support 21. The passage 60A is connected to the decompression device 30 via a hose (not shown), and when the support member 21 is supported by the holding member 60, the inside of the chamber 26 is decompressed through the passage 31 and the wafer W is loaded. Adsorbed and held on the mounting surface 21A. Further, an ultraviolet irradiation device 16 is disposed on the transfer path of the transfer means 13 between the alignment device 11 and the table member 12, and when the wafer W is transferred above the ultraviolet irradiation device 16. The protective sheet PS affixed to the circuit surface is irradiated with ultraviolet rays.

  The affixing means 15 includes a support shaft 70 that supports the unrolled sheet R temporarily attached to the release sheet RL in a roll shape so that it can be fed out, and a peel plate 71 that peels the adhesive sheet S from the release sheet RL. A pressing roller 72 that presses the adhesive sheet S against the upper surface of the wafer W, a driving roller 73 and a pinch roller 74 that apply a repetitive output to the original fabric R, a winding shaft 76 that winds the release sheet RL, and these And a frame F that integrally supports each member. Note that the adhesive sheet S is formed by laminating a die bonding sheet (not shown) substantially corresponding to the shape of the wafer W on a mounting sheet attached to the ring frame RF, and a heating means (not shown) built in the upper table 40. The wafer W is mounted on the ring frame RF via the die bonding sheet.

  Next, the positioning of the wafer W and the sheet sticking operation will be described. In this example, it is assumed that the pasting operation of the original fabric R is completed in the pasting unit 15 and that the posture for pasting the adhesive sheet S on the wafer W is ready.

  When the support 21 is supported on the upper surface of the alignment device 11, the support 21 is automatically positioned by fitting the protrusion 33 of the base member 20 into the recess 34 of the support 21. The wafer W is placed on the placement surface 21A of the support 21. Subsequently, the pin 35 which comprises the 2nd positioning means 24 moves toward the support body 21 side via the linear motion motor 36. FIG. As a result, the center of the wafer W coincides with the center of the support 21 and the positioning of the wafer W is completed.

In a state where the positioning of the wafer W is completed in this way, the pressure in the chamber 26 is reduced from the base member 20 side by the pressure reducing device 30 to hold the wafer W on the support 21 by suction. Then, the holding unit 54 is lowered via the Z-axis cylinder 53 of the conveying means 13, and the holding member 60 is lowered to a position facing the outer peripheral surface of the support 21.

  Next, the piston rod 59 is moved to a position where the holding member 60 contacts the outer peripheral surface of the support 21. At this time, the passage 60 </ b> A of the holding member 60 is set in advance so as to contact the passage 31 of the support 21, and an unillustrated opening / closing valve provided in the passage 31 is opened, and the pressure in the chamber 26 is reduced through the passage 31. Is also started. In this state, the support unit 21 is separated from the base member 20 by raising the holding unit 54 by operating the Z-axis cylinder 53. During this separation, the passage 28 of the support 21 is closed by an unillustrated opening / closing valve, so that the pressure reduction in the chamber 26 by the passage 31 is not hindered.

The support 21 that supports the wafer W is transferred via the transfer means 13 and transferred to the upper table 40 of the table member 12. In this conveyance path, when the support 21 passes through the upper part of the ultraviolet irradiation device 16, ultraviolet rays are transmitted through the support 21 and applied to the protective sheet PS to cure the ultraviolet curable adhesive of the protective sheet PS. . When the holding unit 54 is positioned above the table member 12, the Z-axis cylinder 53 is operated to lower the support 21, and the protrusion 43 of the table 40 is fitted into the recess 34 of the support 21. it is done to position the support 21, and at the same time, opened on-off valve in the passage 28 in the support 21 performs the decompression of the chamber 26 through passage 4 6 and the communication in the upper table 40. And while holding | maintenance of the support body 21 by the holding member 60 is cancelled | released, the on-off valve in the channel | path 31 is obstruct | occluded and the holding | maintenance unit 54 raises.

  The wafer W is supported by the table member 12 while maintaining the state of being positioned by the alignment apparatus 11. On the table member 12, the ring frame RF is positioned and fixed in advance by a conveying device (not shown). In this state, the table member 12 moves to the right side in FIG. Then, the table member 12 moves to a point where the left end in FIG. 1 is located on the right side of the tip of the peel plate 71, raises the upper table 40, and then moves back so as to return to the left side. The adhesive sheet S is affixed to the upper surface of the wafer W under the pressing force of the press roller 72 while S is peeled from the release sheet RL. That is, the wafer W is mounted on the ring frame RF while heating a die bonding sheet (not shown) stacked on the adhesive sheet S by a heating means (not shown) built in the upper table 40.

  The wafer W mounted on the ring frame RF by the adhesive sheet S in this manner is released from the support 21 by the decompression device 30 and is accommodated in a wafer stocker or the like via a suction arm such as a robot (not shown). The support 21 is returned to the alignment apparatus 11 via the transfer means 13 and waits for the transfer of a new wafer W to be the next object.

  Therefore, according to such an embodiment, the wafer W is positioned together with the support 21 and is transferred and transferred to the table member 12 for sheet sticking. It is possible to continuously maintain, and it is possible to eliminate the inconvenience that the wafer W is displaced when the sheet is stuck. In addition, since the transfer means 13 is not configured to directly hold the wafer W, a factor that damages the wafer W can be avoided.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

For example, in the above-described embodiment, the case where one frame plate 56 is attached to the Z-axis cylinder 53 of the transport unit 13 and the holding unit 54 is provided on the frame plate is illustrated and described, but the present invention is not limited thereto. Instead, as shown in FIG. 5, a long plate-like holding plate 75 can be connected to the Z-axis cylinder 53, and holding units 54 can be provided on both sides of the holding plate 75. At this time, the holding plate 75 may be provided so as to be rotatable in a horizontal plane so that the holding unit 54 can selectively access above the alignment device 11 and the table member 12.
With such a configuration, it is possible to cope with the case where two support bodies 21 are provided. As a result, it is possible to transport the next support 21 to above the table member 12 by using the time during which the adhesive sheet S is pasted by the pasting means 15, and a part of the series of operations described above. Since they can overlap, the processing capacity per unit time can be improved.

  Moreover, although the ultraviolet irradiation device 16 was used as an energy irradiation device, other energy irradiation devices, such as an ultrasonic wave, are also employable.

  Further, the first to third positioning means are not limited to the illustrated configuration example. The present invention employs various positioning means as long as the initial positioning state can be maintained when the wafer W supported on the support 21 by the alignment apparatus 11 is transferred to the table member 12. can do.

  The plate-like member in the present invention is not limited to the semiconductor wafer W, and other plate-like members such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer can be a silicon wafer or a compound. It may be a wafer.

  In addition, the base member, the table member, the conveying unit, the holding unit, the pasting unit, and the material that can transmit the energy beam are not limited to those exemplified in the above embodiment, but have the same function, operation, and properties. If it is, it can substitute and be used without any limitation.

  Further, the surface on which the ring frame RF of the table member 12 is placed can be controlled to rotate, and the position of the wafer W in the circumferential direction is detected by a sensor (not shown) before the wafer W is placed on the table member 12. If the ring frame RF is rotated in accordance with the above, the relative positional relationship in the circumferential direction between the ring frame RF and the wafer W can always be fixed and mounted.

The schematic front view which shows the whole structure of the sheet sticking apparatus which concerns on this embodiment. The expanded sectional view which shows the detailed structure of an alignment apparatus. FIG. 2 is a schematic plan view of the alignment apparatus. The principal part schematic plan view of a conveying apparatus. The principal part schematic plan view which shows the modification of a conveying apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Alignment apparatus 12 Table member 13 Conveying means 15 Sticking means 1 6 Ultraviolet irradiation apparatus 20 Base member 21 Support body 22 First positioning means 24 Second positioning means 45 Third positioning means W Semiconductor wafer (plate) Shaped member)

Claims (2)

A base member, a support body that is detachably supported by the base member and has a mounting surface for a plate-like member on the upper surface side, a first positioning means for positioning the support body with respect to the base member , An alignment device including a second positioning means for positioning the plate-like member with respect to the support, a table member for supporting the support together with the plate-like member, and moving between the alignment device and the table member Transportation means provided in a possible manner,
Said support is provided with the plate-like member adsorption holdable vacuum holes (25), the passageway that passes with the vacuum holes (25) (28) and through passage and (31),
Said conveying means, before Symbol communication path (31) to have a can communicate with passages (60A), when conveying said plate-shaped member to the support integrally between the alignment device and the table member, the passageway ( 60A) communicates with said passage (31), said plate-like member provided to be sucked and held through the passageway (31) of said support,
The base member has a passage (29) that can communicate with the passage (28), and the passage (29) becomes the passage (28) when the support is placed on the base member. Communicating, provided through the passage (28) of the support so that the plate-like member can be sucked and held,
The table member has a passage (46) capable of communicating with the passage (28), and when the support is placed on the table member, the passage (46) becomes the passage (28). A conveying device characterized in that the plate-like member is provided so as to be capable of being sucked and held through the passage (28) of the support . Wherein the passage (28)及beauty communication path (31), conveying apparatus according to claim 1, wherein the possible-off valve maintains the suction holding of the plate-shaped member by the support body is provided.

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