JP5025143B2 - 発光装置および照明装置 - Google Patents
発光装置および照明装置 Download PDFInfo
- Publication number
- JP5025143B2 JP5025143B2 JP2006050723A JP2006050723A JP5025143B2 JP 5025143 B2 JP5025143 B2 JP 5025143B2 JP 2006050723 A JP2006050723 A JP 2006050723A JP 2006050723 A JP2006050723 A JP 2006050723A JP 5025143 B2 JP5025143 B2 JP 5025143B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting device
- emitting element
- reflecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
1a:搭載部
1b:配線導体
2:発光素子
3:波長変換部材
4:反射部材
5:導電性部材
6:透光性部材
Claims (2)
- 青色の光を発する発光素子が搭載された配線基板と、該配線基板上に、前記発光素子を取り囲むように設けられた反射部材と、前記発光素子を覆うとともに、前記反射部材の内側に配された、前記発光素子からの光を黄色の光に波長変換する波長変換部材とを具備して成る発光装置において、前記配線基板および反射部材の少なくとも一方は、前記発光素子からの光を赤色の光に波長変換する蛍光性のアルミナセラミックスから成るとともに、前記アルミナセラミックスに賦活材としてのマンガンが含まれており、前記発光素子は、360nm〜410nmの波長範囲に含まれる光を発生させることを特徴とする発光装置。
- 請求項1に記載の発光装置と、前記発光装置が搭載され、前記発光装置を駆動する電気配線を有する駆動部と、前記発光装置から出射される光を反射する光反射手段とを含む照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006050723A JP5025143B2 (ja) | 2006-02-27 | 2006-02-27 | 発光装置および照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006050723A JP5025143B2 (ja) | 2006-02-27 | 2006-02-27 | 発光装置および照明装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011278390A Division JP5528423B2 (ja) | 2011-12-20 | 2011-12-20 | 発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007234639A JP2007234639A (ja) | 2007-09-13 |
JP5025143B2 true JP5025143B2 (ja) | 2012-09-12 |
Family
ID=38554963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006050723A Expired - Fee Related JP5025143B2 (ja) | 2006-02-27 | 2006-02-27 | 発光装置および照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5025143B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BRPI1008218A2 (pt) * | 2009-05-28 | 2016-07-05 | Koninkl Philips Electronics Nv | dispositivo de iluminação e lâmpada |
CA2763244A1 (en) * | 2009-05-28 | 2010-12-02 | Koninklijke Philips Electronics N.V. | Illumination device and method for assembly of an illumination device |
CN102449374B (zh) * | 2009-05-28 | 2016-05-11 | 皇家飞利浦电子股份有限公司 | 陶瓷照明设备 |
CN102667311B (zh) * | 2009-12-15 | 2014-10-01 | 夏普株式会社 | 照明装置、显示装置以及电视接收装置 |
JP6228944B2 (ja) * | 2010-03-29 | 2017-11-08 | 東芝ライテック株式会社 | 照明装置 |
JP4977770B2 (ja) * | 2010-04-07 | 2012-07-18 | 共立エレックス株式会社 | 反射板の製造方法 |
JP2020533778A (ja) * | 2017-09-12 | 2020-11-19 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
JP6741244B2 (ja) * | 2019-07-11 | 2020-08-19 | 株式会社光波 | 発光装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3900848B2 (ja) * | 2001-03-23 | 2007-04-04 | シチズン電子株式会社 | 発光ダイオード |
JP2003124521A (ja) * | 2001-10-09 | 2003-04-25 | Rohm Co Ltd | ケース付半導体発光装置 |
JP4122791B2 (ja) * | 2002-02-14 | 2008-07-23 | 松下電工株式会社 | 発光装置 |
EP1588991B1 (en) * | 2003-01-20 | 2019-04-17 | Ube Industries, Ltd. | Ceramic composite material for optical conversion |
JP2004335579A (ja) * | 2003-05-01 | 2004-11-25 | Fine Rubber Kenkyusho:Kk | 発光装置 |
-
2006
- 2006-02-27 JP JP2006050723A patent/JP5025143B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2007234639A (ja) | 2007-09-13 |
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