JP5018616B2 - Electronic component mounting equipment - Google Patents

Electronic component mounting equipment Download PDF

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JP5018616B2
JP5018616B2 JP2008108589A JP2008108589A JP5018616B2 JP 5018616 B2 JP5018616 B2 JP 5018616B2 JP 2008108589 A JP2008108589 A JP 2008108589A JP 2008108589 A JP2008108589 A JP 2008108589A JP 5018616 B2 JP5018616 B2 JP 5018616B2
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solder
electronic component
volume
component mounting
amount
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JP2009260104A (en
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大介 永井
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、半田を用いて電子部品を基板に実装する電子部品実装装置に関するものである。 The present invention relates to electronic component mounting apparatus electrodeposition that implements the substrate electronic components using solder.

基板に電子部品を実装する場合、基板表面の電極が形成されたランド部に半田を供給し、これに電子部品を搭載した後に加熱して半田付けを行っている。同一の基板に同一パターンで半田を印刷する場合にはスクリーン印刷が広く用いられている。スクリーン印刷は電極と対応する位置が開口された所定の厚さを有するマスクを用いた印刷方法であり、基板に被せたマスク上でクリーム半田をスキージングすることで電極に一定量のクリーム半田を印刷する。電子部品はクリーム半田に一定量押し込まれた状態で搭載されるので、この押し込み量に相当する量のクリーム半田が電子部品の側方に押し出されることになる。近年、電子部品の小型化に伴って電極の狭ピッチ化が進展し、これに印刷された半田同士が極めて近接した状態になっているため、リフロー時に半田ブリッジが発生し易くなっている。半田ブリッジの発生を抑えるためには、電子部品の搭載時に厳密な高さ管理を行ってクリーム半田の押し込み量を必要最小限に止め、押し出し量をできるだけ抑える必要がある。電子部品の高さ管理は電子部品を吸着するノズルの下端の高さ、すなわち電子部品の上端の高さを基準としているため、電子部品の厚みが均一でなければ上端の高さをいくら厳密に管理しても押し込み量にばらつきが生じることになる。このようなばらつきを解消するため、従来、クリーム半田に搭載する前段階で電子部品の厚みを計測し、計測結果を高さ管理に反映することで押し込み量を補正することが行われている（特許文献１参照）。
特開２００６−１９６８１９号公報 When an electronic component is mounted on a substrate, solder is supplied to a land portion on which an electrode on the surface of the substrate is formed, and the electronic component is mounted on the land portion and then heated and soldered. Screen printing is widely used when printing solder with the same pattern on the same substrate. Screen printing is a printing method using a mask having a predetermined thickness that is opened at a position corresponding to an electrode, and a certain amount of cream solder is applied to the electrode by squeezing the cream solder on the mask placed on the substrate. Print. Since the electronic component is mounted in a state where it is pushed into the cream solder by a certain amount, an amount of cream solder corresponding to the pushed amount is pushed out to the side of the electronic component. In recent years, with the miniaturization of electronic components, the pitch of electrodes has been reduced, and the solder printed on the electrodes has become extremely close to each other, so that solder bridges are likely to occur during reflow. In order to suppress the occurrence of solder bridges, it is necessary to perform strict height control when mounting electronic components to minimize the push-in amount of cream solder and to suppress the push-out amount as much as possible. The height management of electronic components is based on the height of the lower end of the nozzle that adsorbs the electronic component, that is, the height of the upper end of the electronic component. Even if managed, the amount of push will vary. In order to eliminate such variations, conventionally, the thickness of an electronic component is measured before mounting on the cream solder, and the push amount is corrected by reflecting the measurement result in height management ( Patent Document 1).
JP 2006-196819 A

電子部品の厚みに基づいて電子部品の押し込み量の補正を行うことで、電子部品の側方への半田の押し出し量が適正化され、結果として半田ブリッジの発生を抑制することが可能になるが、この方法では、何らかの理由によって半田の押し出し量が過大になった場合にそれを確認する手立てがなく、この場合は依然として半田ブリッジの発生を招く可能性が残る。   By correcting the push-in amount of the electronic component based on the thickness of the electronic component, the push-out amount of the solder to the side of the electronic component is optimized, and as a result, it is possible to suppress the occurrence of solder bridges. In this method, there is no way to confirm when the amount of solder extrusion becomes excessive for some reason, and in this case, there is still a possibility of causing the occurrence of a solder bridge.

本発明は、実際に電子部品の側方へ押し出された半田の体積に基づいてリフロー時に半田ブリッジが発生するか否かを評価する電子部品実装装置を提供することを目的とする。 The present invention is intended to actually provide an electronic component Assess whether solder bridges will occur during reflow electronic component mounting apparatus based on the solder volume extruded to the side of the.

請求項１に記載の電子部品実装装置は、ノズルに吸着した電子部品を基板の電極に印刷された半田に搭載する電子部品搭載装置と、電子部品の押し込みによって側方に押し出された半田の表面の高さを計測する三次元計測器と、この三次元計測器から送られてきた半田表面の三次元データに基づいて押し出された半田の体積を算出する情報処理装置と、リフロー時に半田ブリッジが発生しない限界を定めた体積データを記憶する記憶部と、前記情報処理装置によって算出された体積と前記記憶部に記憶された体積データとを比較し、リフロー時に半田ブリッジが発生するかどうかを評価する制御装置とを備え、前記記憶部には基板上で隣接する電子部品間の距離に応じて異なる複数の前記体積データが記憶されている。 The electronic component mounting apparatus according to claim 1 , wherein the electronic component mounting apparatus mounts the electronic component adsorbed on the nozzle on the solder printed on the electrode of the substrate, and the surface of the solder extruded sideward by the pressing of the electronic component. A three-dimensional measuring instrument that measures the height of the solder, an information processing device that calculates the volume of the extruded solder based on the three-dimensional data of the solder surface sent from the three-dimensional measuring instrument, and a solder bridge during reflow A storage unit that stores volume data that defines a limit that does not occur is compared with the volume calculated by the information processing device and the volume data stored in the storage unit to evaluate whether or not a solder bridge occurs during reflow. The storage unit stores a plurality of volume data that differ depending on the distance between adjacent electronic components on the substrate .

請求項２に記載の電子部品実装装置は請求項１に記載の電子部品実装装置であって、前記制御装置は、前記算出された半田の体積に基づいて電子部品の半田への押し込み量を補正する機能を備えた。 The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1 , wherein the control device corrects the pushing amount of the electronic component into the solder based on the calculated volume of the solder. With the function to do .

半田ブリッジが発生するか否かの評価において、電子部品の搭載時に電子部品の側方へ押し出された半田の体積を実際に測定するので、個別の実情に応じた精度の高い評価が可能になる。   In the evaluation of whether or not a solder bridge occurs, the volume of the solder pushed out to the side of the electronic component is actually measured when the electronic component is mounted, so that a highly accurate evaluation according to the individual situation becomes possible. .

添付した図面を参照しながら本発明の実施の形態について説明する。図１は本発明の実施の形態の電子部品実装装置の構成を示したブロック図、図２は電子部品が一定量押し込まれた状態の半田の形状を示す側面図である。   Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a block diagram showing a configuration of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a side view showing a shape of solder in a state where a certain amount of electronic components are pushed.

図１において、電子部品搭載装置１はノズル２に吸着した電子部品３をＸＹＺ座標管理によって任意の位置に位置決め制御する機能を備える。電子部品３が搭載される基板４には電極５に半田６が印刷されており、電子部品搭載装置１はＸＹ座標管理に基づいた制御によって電子部品３を半田６の印刷箇所の鉛直上方（図中点線で示す）に位置決めし、Ｚ座標管理に基づいた制御によって電子部品３を半田６に一定量押し込んだ状態で基板４に搭載する。   In FIG. 1, an electronic component mounting apparatus 1 has a function of positioning and controlling an electronic component 3 sucked by a nozzle 2 at an arbitrary position by XYZ coordinate management. Solder 6 is printed on the electrode 5 on the substrate 4 on which the electronic component 3 is mounted, and the electronic component mounting apparatus 1 moves the electronic component 3 vertically above the printed position of the solder 6 by control based on XY coordinate management (see FIG. The electronic component 3 is mounted on the substrate 4 in a state where the electronic component 3 is pressed into the solder 6 by a control based on the Z coordinate management.

図２は電子部品が一定量押し込まれた状態の半田６の形状を示す側面図である。基板４上には電極５が隣接して形成されており、この電極５上にスクリーン印刷によって半田６、６１が印刷されている。電子部品３、３１はそれぞれ半田６、６１に上方から押し込まれた状態で基板４上に隣接して搭載されている。   FIG. 2 is a side view showing the shape of the solder 6 in a state where a certain amount of electronic components are pushed. An electrode 5 is formed adjacent to the substrate 4, and solders 6 and 61 are printed on the electrode 5 by screen printing. The electronic components 3 and 31 are mounted adjacently on the substrate 4 while being pushed into the solders 6 and 61 from above.

（ａ）は、電子部品３、３１と半田６、６１がそれぞれ適正な高さ（厚み）にある場合を示している。半田６、６１は上方から電子部品３、３１が押し込まれた量の分だけ電子部品３、３１の側方に押し出される。押し出される半田量は、電子部品３、３１の押し込み量もしくは半田６、６１の高さ（厚み）が大きいほど大きくなる。   (A) has shown the case where the electronic components 3 and 31 and the solder 6 and 61 are each in appropriate height (thickness). The solders 6 and 61 are pushed out to the side of the electronic components 3 and 31 by the amount by which the electronic components 3 and 31 are pushed from above. The amount of solder to be pushed out increases as the pushing amount of the electronic components 3 and 31 or the height (thickness) of the solders 6 and 61 increases.

（ａ）では電子部品３、３１、半田６、６１とも適正な高さにあるので、押し出し量も適正な範囲に収まり、隣り合う半田６、６１のクリアランスが広く保たれた状態となっている。これに対し（ｂ）は半田６、６１が適正値より高く（厚く）印刷されている場合を示しており、（ａ）に比べて押し出し量が大きく、隣り合う半田６、６１のクリアランスが十分に保たれていない状態となっている。また、一般に電子部品３、３１はその上端位置、すなわちノズル２の下端位置においてＺ座標管理されているため、一定のＺ座標管理がなされている場合であっても高さ（厚み）方向にばらつきがあると半田への押し込み量にも同様のばらつきが生じる。（ｃ）は電子部品３、３１が適正値より高い（厚い）場合を示しており、（ａ）の場合と同様のＺ座標管理を行って搭載した場合であっても押し込み量は増大し、これに伴い押し出し量も大きくなり、隣り合う半田６、６１のクリアラン
スが十分に保たれていない状態となっている。隣り合う半田６、６１のクリアランスが十分に保たれていない場合、リフロー時に溶融した半田６、６１がブリッジを形成し、電子部品３、３１間で電気的な短絡が生じてしまう。 In (a), since the electronic components 3 and 31 and the solders 6 and 61 are at appropriate heights, the amount of extrusion is within an appropriate range, and the clearance between the adjacent solders 6 and 61 is widely maintained. . On the other hand, (b) shows a case where the solders 6 and 61 are printed higher (thicker) than the appropriate value, and the amount of extrusion is larger than that in (a), and the clearance between the adjacent solders 6 and 61 is sufficient. It is in a state that is not kept. Further, since the electronic components 3 and 31 are generally managed in the Z coordinate at the upper end position thereof, that is, the lower end position of the nozzle 2, the electronic components 3 and 31 vary in the height (thickness) direction even when the constant Z coordinate management is performed. If there is, the same variation occurs in the amount of pressing into the solder. (C) shows the case where the electronic components 3 and 31 are higher (thick) than the appropriate value, and the amount of push-in increases even when the Z-coordinate management is performed in the same manner as in (a). As a result, the amount of extrusion increases, and the clearance between the adjacent solders 6 and 61 is not sufficiently maintained. When the clearance between the adjacent solders 6 and 61 is not sufficiently maintained, the solders 6 and 61 melted at the time of reflow form a bridge, and an electrical short circuit occurs between the electronic components 3 and 31.

三次元計測器７は電子部品３、３１の押し込みによって側方に押し出された半田の表面に光を走査させ、反射光を受光した位置に応じて測点の高さ（Ｚ座標値）を計測する機能を備える。計測された各測点の高さ（Ｚ座標値）データは予め設定された各測点の水平位置（ＸＹ座標値）とともに半田表面の三次元データを構成し、情報処理装置８に送られる。情報処理装置８は送られてきた半田表面の三次元データに基づいて体積を算出する機能を備える。   The three-dimensional measuring instrument 7 scans the surface of the solder pushed sideways by pushing the electronic parts 3 and 31, and measures the height (Z coordinate value) of the measuring point according to the position where the reflected light is received. It has a function to do. The measured height (Z coordinate value) data of each measurement point constitutes three-dimensional data of the solder surface together with the preset horizontal position (XY coordinate value) of each measurement point, and is sent to the information processing device 8. The information processing apparatus 8 has a function of calculating a volume based on the sent three-dimensional data of the solder surface.

電子部品３、３１の側方に押し出された半田は、リフロー時に液状化することで水平方向に流れ出すとともに表面張力によって電子部品３、３１の側面に沿って鉛直方向にせりあがる。そのため、リフロー時に半田ブリッジが発生するかどうかは単純にリフロー前の両者の距離によって決まるのではなく、電子部品３、３１の側方に押し出された半田の体積による部分が大きいと考えられる。   The solder pushed to the side of the electronic components 3 and 31 liquefies at the time of reflow, flows out in the horizontal direction, and rises in the vertical direction along the side surfaces of the electronic components 3 and 31 by surface tension. For this reason, whether or not a solder bridge is generated during reflow is not simply determined by the distance between the two before reflow, but is considered to be large due to the volume of the solder extruded to the side of the electronic components 3 and 31.

制御装置９はリフロー時に半田ブリッジが発生するかどうかを評価する機能を備える。この評価は情報処理装置８によって算出された半田の体積に基づいて行い、予め評価の基準となる体積データが記憶部１０に記憶されている。この体積データはリフロー時に半田ブリッジが発生しない限界を定めたものである。制御装置９は情報処理装置８によって算出された体積と記憶部１０に記憶された体積データとを比較し、比較の結果を表示装置１１に表示する。記憶部１０には基板４上で隣接する電子部品３、３１間の距離に応じて異なる複数の体積データが記憶されており、制御装置９は電子部品３、３１間の距離に対応する体積データを用いて評価を行う。   The control device 9 has a function of evaluating whether or not a solder bridge occurs during reflow. This evaluation is performed based on the solder volume calculated by the information processing apparatus 8, and volume data serving as a reference for evaluation is stored in the storage unit 10 in advance. This volume data defines the limit at which no solder bridge occurs during reflow. The control device 9 compares the volume calculated by the information processing device 8 with the volume data stored in the storage unit 10 and displays the comparison result on the display device 11. The storage unit 10 stores a plurality of volume data different depending on the distance between the electronic components 3 and 31 adjacent to each other on the substrate 4, and the control device 9 stores the volume data corresponding to the distance between the electronic components 3 and 31. Use to evaluate.

さらに制御装置９は情報処理装置８によって算出された体積に基づいて電子部品の搭載の際の半田への押し込み量を補正する機能を備える。図２（ｂ）、（ｃ）に示したように、電子部品の半田への押し込み量が大きいと電子部品の側方への押し出し量も大きくなってブリッジを形成しやすくなる。この対策としては、半田の印刷精度を高めて印刷高さ（厚さ）が適正値となるようにしたり、電子部品の検査精度を高めて適正値の高さ（厚さ）の電子部品を選別して用いたりするなどの方法がある。これらの方法とは別に、もしくは同時に、電子部品搭載装置１が行う電子部品の押し込みの際の押し込み量を減ずる補正を行う対策を採ることもできる。この場合、制御装置９は体積に基づいて電子部品搭載装置１のＺ座標管理に基づいた押し込み量を隣り合う半田６、６１がブリッジを形成しない程度にまで減ずる補正を行う。   Further, the control device 9 has a function of correcting the amount of pushing into the solder when the electronic component is mounted based on the volume calculated by the information processing device 8. As shown in FIGS. 2B and 2C, when the amount of pushing the electronic component into the solder is large, the amount of pushing the electronic component to the side is also large, and a bridge is easily formed. As countermeasures, the printing accuracy (thickness) of solder is increased so that the printing height (thickness) is an appropriate value, or the inspection accuracy of electronic components is increased to select electronic components with the appropriate height (thickness). There are methods such as using them. In addition to or simultaneously with these methods, it is also possible to take a measure for performing correction to reduce the amount of pushing when the electronic component mounting apparatus 1 pushes the electronic component. In this case, the control device 9 performs correction to reduce the push-in amount based on the Z coordinate management of the electronic component mounting device 1 to the extent that the adjacent solders 6 and 61 do not form a bridge based on the volume.

本発明は電子部品を基板に半田付けする電子部品の実装分野において有用である。   The present invention is useful in the field of electronic component mounting where an electronic component is soldered to a substrate.

本発明の実施の形態の電子部品実装装置の構成を示したブロック図The block diagram which showed the structure of the electronic component mounting apparatus of embodiment of this invention 電子部品が一定量押し込まれた状態の半田の形状を示す側面図Side view showing the shape of the solder with a certain amount of electronic components pushed in

符号の説明Explanation of symbols

１ 電子部品搭載装置
３、３１ 電子部品
４ 基板
５ 電極
６、６１ 半田
７ 三次元計測器
８ 情報処理装置
９ 制御装置 DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3, 31 Electronic component 4 Board | substrate 5 Electrode 6, 61 Solder 7 Three-dimensional measuring device 8 Information processing apparatus 9 Control apparatus

Claims (2)

ノズルに吸着した電子部品を基板の電極に印刷された半田に搭載する電子部品搭載装置と、電子部品の押し込みによって側方に押し出された半田の表面の高さを計測する三次元計測器と、この三次元計測器から送られてきた半田表面の三次元データに基づいて押し出された半田の体積を算出する情報処理装置と、リフロー時に半田ブリッジが発生しない限界を定めた体積データを記憶する記憶部と、前記情報処理装置によって算出された体積と前記記憶部に記憶された体積データとを比較し、リフロー時に半田ブリッジが発生するかどうかを評価する制御装置とを備え、前記記憶部には基板上で隣接する電子部品間の距離に応じて異なる複数の前記体積データが記憶されていることを特徴とする電子部品実装装置。 An electronic component mounting apparatus that mounts the electronic component adsorbed on the nozzle on the solder printed on the electrode of the substrate, a three-dimensional measuring instrument that measures the height of the surface of the solder pushed sideways by the pushing of the electronic component, An information processing device that calculates the volume of the extruded solder based on the three-dimensional data of the solder surface sent from the three-dimensional measuring instrument, and a memory that stores volume data that defines a limit at which no solder bridge occurs during reflow A control unit that compares the volume calculated by the information processing device with the volume data stored in the storage unit and evaluates whether or not a solder bridge occurs during reflow, and the storage unit An electronic component mounting apparatus , wherein a plurality of volume data different according to a distance between adjacent electronic components on a substrate are stored . 前記制御装置は、前記算出された半田の体積に基づいて電子部品の半田への押し込み量を補正する機能を備えたことを特徴とする請求項１に記載の電子部品実装装置。 The electronic component mounting apparatus according to claim 1 , wherein the control device has a function of correcting an amount of pushing of the electronic component into the solder based on the calculated volume of the solder.
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