KR101508593B1 - Solder rework method, solder rework apparatus using the same and board inspection method employing the same - Google Patents

Abstract

A solder rework method for compensating for insufficient solder formed on a circuit board comprises a step for forming an ideal solder structure by distributing ideal solder to predetermined calibration cells; a step for measuring a three-dimensional profile of solder formed on the circuit board and then dividing the measured three-dimensional profile into calibration cells to form an actual solder structure; a step for calculating a rework solder structure by subtracting the actual solder structure from the ideal solder structure; and a step for compensating for insufficient solder formed on the circuit board by discharging a proper amount of solder corresponding to the rework solder structure using a solder discharge device. Accordingly, insufficient solder can be easily and accurately compensated.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a solder rework method, a solder rework method using the solder rework method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder rework method, a solder rework method using the solder rework method, and a substrate inspecting method using the solder rework method, and more particularly to a solder rework method for compensating for a deficient amount of solder formed on a substrate, Device and a substrate inspection method employing the same.

In general, at least one printed circuit board (PCB) is provided in an electronic device, and various circuit elements such as a circuit pattern, a connection pad portion, a driving chip electrically connected to the connection pad portion, Respectively.

Such a printed circuit board is manufactured by applying solder to a pad region of a bare board and then joining the terminals of the electronic component to a region to which the solder is applied.

Conventionally, a process of inspecting whether or not the above-described solder is properly applied has been performed before mounting an electronic component on a printed circuit board, and if the amount of solder is insufficient in the inspection process, the printed circuit board Therefore, inspection of the amount of such solder is very important.

On the other hand, if the amount of solder is insufficient as a result of the inspection, it may be possible to discard the substrate determined to be defective, but it may be possible to recycle the solder by compensating the solder through rework. In this way, it is important to understand how to compensate for the solder in accordance with certain criteria. Considering that it is rather advantageous to discard when the effort and cost for the solder work are large, A compensating solder work method is required.

Therefore, a problem to be solved by the present invention is to provide a solder rework method capable of easily and accurately compensating for deficient solder, and a solder rework apparatus using the same.

Another object of the present invention is to provide a method for inspecting a substrate employing the solder work method.

A solder rework method in accordance with an exemplary embodiment of the present invention is provided for compensating for a deficient amount of solder formed on a substrate. The solder rework method includes dividing an ideal solder into predetermined calibration cells to form an ideal solder structure including the calibration cells, measuring the three-dimensional shape of the solder formed on the substrate Dividing the measured three-dimensional shape into the calibration cells to form an actual solder structure including the calibration cells; subtracting the actual solder structure from the ideal solder structure to form a rework solder structure comprising the calibration cells And a step of discharging solder corresponding to the reworked solder structure to the solder dispenser to compensate the solder formed on the substrate.

In one embodiment, the step of dispensing solder corresponding to the reworked solder structure to the solder dispensing apparatus to compensate for the solder formed on the substrate may include calculating the number of calibration cells for each position of the reworked solder structure And discharging the solder to the solder dispenser by an amount corresponding to the number of calibration cells for each position of the rework solder structure. For example, the solder rework method may further include, before the step of discharging the solder corresponding to the rework solder structure to the solder discharging device and compensating the solder formed on the substrate, And a step of calibrating and storing the discharge amount. The step of discharging the solder to the solder discharging device by an amount corresponding to the number of the calibration cells for each position of the rework solder structure may further include the step of measuring the amount of discharged solder according to the position of the rework solder structure Calculating the number of times of ejection, and ejecting the solder to the solder ejection apparatus according to the calculated number of ejection by position. For example, the solder rework method may include a step of setting a measurement area of a predetermined size on the substrate on which the solder is formed, prior to the step of discharging the solder to the solder dispenser in accordance with the calculated number of discharges by the calculated position And storing a height offset for each position of the measurement region. The step of ejecting the solder to the solder ejection apparatus according to the calculated number of times of ejection by position may include the steps of transferring the solder ejection apparatus to the ejection position in which the height offset is compensated, And discharging the solder by the number of times of discharging for each position corresponding to the discharging position.

In one embodiment, the calibration cell may correspond to a single discharge amount of the solder discharge device.

In one embodiment, the single discharge amount of the solder dispensing device may be less than or equal to the volume of the calibration cell.

In one embodiment, the calibration cell may have a cube shape, and the ideal solder structure may be defined as a matrix of L x M x N based on the cubic shape (L, M, N = Natural number).

In one embodiment, the step of measuring the three-dimensional shape of the solder formed on the substrate and then dividing the measured three-dimensional shape into the calibration cells to form an actual solder structure including the calibration cells, The method comprising the steps of: irradiating a grid pattern light toward a solder formed on the substrate, receiving the reflected light of the grid pattern light reflected by the solder to obtain a pattern image, and measuring the three- And dividing the measured three-dimensional shape into the calibration cells to form the actual solder structure.

A solder workpiece apparatus according to another exemplary embodiment of the present invention is provided to compensate for the insufficient amount of solder formed on a substrate. Wherein the solder rework apparatus comprises a solder dispenser for dispensing solder to compensate for solder formed on the substrate and an ideal solder structure by dividing the ideal solder into predetermined calibration cells, Dividing the three-dimensional shape of the solder formed on the first solder structure into the calibration cells to form an actual solder structure, subtracting the actual solder structure from the ideal solder structure to yield a rework solder structure, And a discharge control unit for controlling discharge of the discharge device.

In one embodiment, the discharge control unit calculates the number of calibration cells for each position of the reworked solder structure, and calculates the amount of solder by the amount corresponding to the number of calibration cells for each position of the reworked solder structure The solder discharge device can be controlled to discharge the solder.

In one embodiment, the solder reworking apparatus may further include a database for calibrating and storing the discharge amount corresponding to the number of discharging operations of the solder discharging apparatus. For example, the discharge control section may calculate the number of discharges per position of the rework solder structure on the basis of the discharge amount corresponding to the number of discharges stored in the database, It is possible to control the solder ejection apparatus to eject the solder.

In one embodiment, the database may store the amount of discharge according to the number of discharging of the solder discharging device according to the material of the solder.

A substrate inspection method according to another exemplary embodiment of the present invention includes a solder rework for compensating for a deficient amount of solder formed on a substrate. The method of inspecting a substrate includes the steps of: measuring a three-dimensional shape of the solder formed on the substrate; determining from the measurement result whether the solder rework is necessary; determining if the solder rework is required, Dividing the three-dimensional shape of the measured solder into the calibration cells and subtracting the set actual solder structure in the ideal solder structure set divided by predetermined calibration cells to calculate a rework solder structure corresponding to the insufficient amount , Dispensing solder corresponding to the reworked solder structure with the solder dispenser to compensate for the solder formed on the substrate, and measuring the three-dimensional shape of the compensated solder.

In one embodiment, the step of dispensing solder corresponding to the reworked solder structure to the solder dispensing apparatus to compensate for the solder formed on the substrate may include calculating the number of calibration cells for each position of the reworked solder structure And discharging the solder to the solder dispenser by an amount corresponding to the number of calibration cells for each position of the rework solder structure.

In an embodiment of the present invention, the method for inspecting a substrate may further include, before the step of discharging the solder corresponding to the reworked solder structure to the solder dispenser and compensating for the solder formed on the substrate, And a step of calibrating and storing the discharge amount. For example, the step of discharging the solder to the solder ejecting apparatus by an amount corresponding to the number of the calibration cells for each position of the reworked solder structure may include the steps of: Calculating the number of times of discharging for each position, and discharging the solder to the solder discharging device according to the calculated number of times of discharging for each position.

In one embodiment, the step of determining whether the solder rework is required from the measurement result may include a step of checking whether the number of portions where the amount of the solder is insufficient is less than or equal to the reference number of missed portions.

According to the present invention, by dividing the ideal solder and the actually formed solder into predetermined calibration cells for the solder work, the ideal solder structure composed of the calibration cells and the actual solder structure are subtracted from each other, and the solder to be reworked is represented by the calibration cells , The solder can be compensated more easily and accurately.

In addition, it is possible to control the amount of solder to be compensated more accurately by calibrating and storing the amount of solder discharged from the solder discharging device in advance according to the number of discharging and using information on the amount of discharging according to the measured number of discharging have.

In addition, the height offset can be previously stored for each position of the measurement area and compensated to set the discharge position, so that the solder rework work can be performed more accurately even when the substrate is distorted.

1 is a flowchart illustrating a solder rework method according to an embodiment of the present invention.
2 is a conceptual diagram for explaining a process of forming an ideal solder structure in the solder rework method of FIG.
3 is a conceptual view for explaining a process of forming an actual solder structure in the solder rework method of FIG.
4 is a conceptual diagram for explaining a process of calculating a reworked solder structure in the solder rework method of FIG.
5 is a flowchart showing an embodiment of a process of compensating solder in the solder rework method of FIG.
FIG. 6 is a conceptual diagram for explaining a process of calibrating and storing the discharge amount according to the discharge count in the process of compensating the solder of FIG.
7 is a conceptual view showing a solder workpiece apparatus according to an embodiment of the present invention.
8 is a flowchart illustrating a method of inspecting a substrate according to an embodiment of the present invention.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a flowchart illustrating a solder rework method according to an embodiment of the present invention.

A solder rework method in accordance with one embodiment of the present invention is provided to compensate for the insufficient amount of solder formed on the substrate.

Referring to FIG. 1, in order to rework the solder according to an embodiment of the present invention, an ideal solder structure is first formed (S110).

2 is a conceptual diagram for explaining a process of forming an ideal solder structure in the solder rework method of FIG.

Referring to FIG. 2, an ideal solder structure (ISS) is formed by dividing the ideal solder (IS) into predetermined calibration cells (CC).

The ideal solder (IS) means that a desired amount of solder to be formed on a substrate is conceptualized in a three-dimensional shape. The calibration cell CC refers to a reference unit for dividing the solder in a three-dimensional shape and measuring its volume and the like, and may be a predetermined three-dimensional unit. In one embodiment, the calibration cell CC may have a cubic shape, as shown in FIG. 2, and the ideal solder structure ISS may be a matrix of L x M x N based on the cube shape matrix (L, M, N are natural numbers).

Also, in one embodiment, the calibration cell CC may correspond to a single discharge amount of the solder discharge apparatus described later. At this time, the calibration cell CC may correspond to a conceptual cube formed by a single discharge of the solder dispensing apparatus.

The ideal solder structure ISS is formed to include a plurality of calibration cells CC and the number of the calibration cells CC for each position of the ideal solder IS, Volume and the like can be easily obtained.

Referring again to FIG. 1, an actual solder structure is formed (S120).

3 is a conceptual view for explaining a process of forming an actual solder structure in the solder rework method of FIG.

Referring to FIG. 3, the actual solder RS is divided into the calibration cells CC to form an actual solder structure RSS.

The actual solder (RS) refers to conceptualization of a solder actually formed on the substrate in a three-dimensional shape. Specifically, the solder is formed by measuring the three-dimensional shape of the solder formed on the substrate, To form the actual solder structure (RSS). In addition, the actual solder structure RSS is formed by dividing the actual solder in a three-dimensional shape based on the calibration cell CC described above.

Accordingly, the actual solder structure RSS is formed to include a plurality of calibration cells CC, and the number of the calibration cells CC, that is, the number of the actual solder RSs, Volume and the like can be easily obtained.

On the other hand, in order to form the actual solder structure RSS, when measuring the three-dimensional shape of the solder formed on the substrate, a three-dimensional shape measurement method using lattice pattern light may be employed. Specifically, a grating pattern light is irradiated toward the solder formed on the substrate, and then, the grating pattern light receives the reflected light reflected by the solder to obtain a pattern image, and then, The three-dimensional shape of the solder can be measured. As described above, the three-dimensional shape of the solder may be divided into the calibration cells CC to form the actual solder structure RSS.

Referring again to FIG. 1, a rework solder structure is next calculated (S130).

4 is a conceptual diagram for explaining a process of calculating a rework solder structure (RWS) in the solder rework method of FIG.

Referring to FIG. 4, the ideal solder structure (ISS) subtracts the actual solder structure (RSS) to yield a rework solder structure (RWS).

The rework solder structure RWS is obtained by dividing the rework solder on the basis of the above-described calibration cell CC. The rework solder means that the solder to be compensated in addition to the solder actually required on the substrate, that is, the solder actually required on the substrate, is conceptualized into a three-dimensional shape.

Accordingly, the reworked solder structure RWS is formed to include a plurality of calibration cells CC, and the number of the calibration cells CC, that is, the volume of the reworked solder, etc., It can be easily obtained.

Subsequently, the solder corresponding to the reworked solder structure RWS is discharged to the solder discharging device to compensate the solder formed on the substrate (S140).

5 is a flowchart showing an embodiment of a process of compensating solder in the solder rework method of FIG.

Referring to FIG. 5, in order to compensate for the solder formed on the substrate, the number of the calibration cells CC for each position of the reworked solder structure RWS is calculated (S142).

For example, the number of the calibration cells (CC) corresponding to the amount of the reworked solder can be calculated along the plane coordinates of the substrate.

Subsequently, the solder is discharged to the solder discharge device by an amount corresponding to the number of the calibration cells CC for each position of the rework solder structure RWS (S144).

For example, the solder may be continuously discharged along the plane coordinates by an amount corresponding to the number of the calibration cells (CC) corresponding to the amount of the reworked solder calculated along the plane coordinates of the substrate.

At this time, before discharging the solder corresponding to the rewound solder structure (RWS) to the solder discharging device and compensating the solder formed on the substrate (S140), the amount of discharging according to the discharging number of the solder discharging device is calibrated . That is, when the solder is discharged using the solder discharge device, it is possible to previously calibrate the amount of discharge in accordance with the number of discharge and to make it into a database.

In one embodiment, the single discharge amount of the solder dispensing device may be less than or equal to the volume of the calibration cell CC. If the amount of one discharge of the solder discharge device is larger than the volume of the calibration cell CC, the amount of one discharge of the solder discharge device exceeds the size of the calibration cell CC, It is not possible to calculate the number of times of discharge corresponding to the amount of reworked solder. Meanwhile, when the amount of discharge once of the solder dispensing apparatus is equal to the volume, the calibration cell CC defined as the cube may be formed by one discharge of the solder dispensing apparatus.

FIG. 6 is a conceptual diagram for explaining a process of calibrating and storing the discharge amount according to the discharge count in the process of compensating the solder of FIG.

Referring to FIG. 6, when the solder is discharged using the solder dispensing apparatus, the discharge amount according to the number of times of discharge such as once, twice, three times, and four times can be stored in advance. Here, the discharge amount does not mean the discharge amount of the physical solder but means the discharged three-dimensional shape of the solder formed on the substrate after being discharged. The solder is a viscous material, and the amount of discharge does not increase proportionally with the number of discharging. For example, as shown in FIG. 6, the height of the square column increases with an increase in the number of discharging, The rate of increase of the height of the quadrangular column can be reduced.

 Referring again to FIG. 5, when the solder is discharged to the solder discharge device by an amount corresponding to the number of the calibration cells CC for each position of the rework solder structure RWS (S144) (S144a), and then the solder may be discharged to the solder discharging apparatus according to the calculated discharging number per position (S144b).

Meanwhile, it is possible to set a measurement area of a predetermined size on the substrate on which the solder is formed, before discharging the solder to the solder dispenser in accordance with the calculated number of discharges per position calculated (S144b) The height offset can be stored.

In this case, in the step S144b of discharging the solder to the solder discharging device according to the calculated number of discharging by position, the solder discharging device is transferred to the discharging position compensated for the height offset, The solder can be discharged by the solder discharging device by the number of discharging times for each position corresponding to the discharging position.

Therefore, even when the substrate is slightly distorted due to bending or the like, accurate positioning of the solder along the plane coordinates of the substrate can be grasped, so that the solder can be discharged at a relatively accurate position.

Hereinafter, an embodiment of a solder work device for implementing the solder rework method will be described in detail with reference to the drawings.

7 is a conceptual view showing a solder workpiece apparatus according to an embodiment of the present invention.

7, a solder rework apparatus 100 provided to compensate for a deficient amount of solder formed on a substrate 10 according to an embodiment of the present invention includes a solder dispensing apparatus 110 and a discharge control unit 120).

The solder dispensing apparatus 110 discharges the solder 20 to compensate for the solder formed on the substrate 10.

The solder discharge device 110 discharges the solder 20 under the control of a discharge control part 120 to be described later.

The discharge control unit 120 divides the ideal solder IS into predetermined calibration cells CC to form an ideal solder structure ISS, Dimensional shape is divided into the calibration cells CC to form an actual solder structure RSS and the actual solder structure RSS is subtracted from the ideal solder structure ISS to yield a rework solder structure RWS , And controls the ejection of the ejection apparatus based on the reworked solder structure (RWS).

That is, the discharge control unit 120 may include a process of forming the ideal solder structure (S110) shown in FIGS. 1 to 6, a process of forming the actual solder structure (S120), and a process of calculating the rework solder structure (S130), and the like.

In addition, the discharge control unit 120 may control the solder dispensing apparatus 110 in the step of compensating the solder described in FIGS. 1 to 6 (S140).

In one embodiment, the discharge control unit 120 calculates the number of calibration cells CC for each position of the rework solder structure RWS and calculates the number of the calibration cells CC for each position of the rework solder structure RWS The solder dispensing apparatus 110 can be controlled to discharge the solder 20 to the solder dispensing apparatus 110 by an amount corresponding to the number of the solder dispensers 110.

In one embodiment, the solder workpiece 100 may further include a database 130. The database 130 calibrates and stores the amount of discharge according to the number of discharging operations of the solder discharging device 110.

For example, the discharge control unit 120 calculates the number of times of discharge of the rework solder structure RWS based on the discharge amount according to the number of discharges stored in the database 130, The solder dispenser 110 can be controlled to discharge the solder 20 to the solder dispenser 110 according to the number of times of discharge.

In one embodiment, the database 130 may store the amount of discharge according to the number of discharging of the solder discharging device 110 according to the material of the solder 20. Accordingly, the database 130 can calculate the amount of discharge according to the number of times of discharge of the solder discharging device 110 based on physical properties of the solder 20, for example, the viscosity of the solder 20 And it is possible to accurately set the number of discharging times of the solder discharging device 110 according to the positions.

The solder rework apparatus 100 may set a predetermined measurement area (FOV) on the substrate on which the solder is formed, before discharging the solder to the solder dispensing apparatus 110, The height offset can be stored for each position of the FOV. The offset means an offset in the Z-axis direction corresponding to a plane coordinate according to the XY-coordinate system of the measurement area (FOV).

In this case, when the solder is discharged to the solder dispensing apparatus 110 according to the calculated number of discharges per position, the solder dispensing apparatus 110 is transferred to the dispensing position compensated for the height offset, The solder can be discharged to the solder dispenser 110 by the number of discharges per position corresponding to the discharge position.

Therefore, even when the substrate is slightly distorted due to bending or the like, accurate positioning of the solder along the plane coordinates of the substrate can be grasped, so that the solder can be discharged at a relatively accurate position.

In addition, the solder rework apparatus 100 may implement all of the solder rework methods according to FIGS. 1 to 6, and a detailed description thereof will be omitted.

Hereinafter, one embodiment of a substrate inspecting method employing the above-described solder work method will be described in detail with reference to the drawings.

8 is a flowchart illustrating a method of inspecting a substrate according to an embodiment of the present invention.

Referring to FIG. 8, a method for inspecting a substrate according to an embodiment of the present invention includes a solder rework process for compensating for a deficient amount of solder formed on a substrate.

In the substrate inspection method, the three-dimensional shape of the solder formed on the substrate is measured (S210).

As the three-dimensional shape measurement of the solder, the method of measuring a three-dimensional shape using the grid pattern light described in FIGS. 1 to 6 may be employed.

Then, it is determined from the measurement result whether the solder rework is necessary (S220).

At this time, if the solder has too many parts to be compensated, it may be preferable to discard the solder rather than compensate it. Accordingly, in one embodiment, the process may include checking whether the number of deficient parts of the solder is less than or equal to the reference defective number from the measurement result. For example, after 50 solder rewrites are set to the reference solder count for one board, solder rewinding can be performed at a later time when the solder rework number is less.

Next, in the ideal solder structure (ISS) set by dividing the ideal solder (IS) into predetermined calibration cells (CC), the three-dimensional shape of the measured solder is determined by the calibration The actual solder structure RSS divided by the cells CC is subtracted to calculate the rework solder structure RWS corresponding to the insufficient amount (S230).

The process includes the steps of forming the ideal solder structure S110 described in FIGS. 1 to 6, forming the actual solder structure S120, calculating the rework solder structure S130, The same processes may be included, and redundant detailed descriptions of these processes are omitted.

Subsequently, the solder corresponding to the rewound solder structure (RWS) is discharged by the solder discharging device to compensate the solder formed on the substrate (S240).

The above process is substantially the same as the process (S140) of compensating the solder described in FIGS. 1 to 6, so that a detailed description will be omitted.

Next, the three-dimensional shape of the compensated solder is measured (S250).

In this process (S250), the process of measuring the three-dimensional shape of the solder formed on the substrate described above (S210) is repeated. In one embodiment, the three-dimensional shape measurement using the grid pattern light described in FIGS. 1 to 6 Dimensional shape measurement method can be employed. This process is substantially the same as the above-mentioned process (S210), except that the compensated solder is measured for a three-dimensional shape, and therefore detailed description thereof will be omitted.

According to the solder rework method, solder work apparatus and substrate inspecting method as described above, the ideal solder and the actually formed solder are divided into predetermined calibration cells for the solder work, and then the ideal solder structure composed of the calibration cells, By representing the solder to be reworked by subtracting the structure from the calibration cells, it is possible to more easily and accurately compensate the solder, and the substrate can be inspected using the same.

In addition, it is possible to control the amount of solder to be compensated more accurately by calibrating and storing the amount of solder discharged from the solder discharging device in advance according to the number of discharging and using information on the amount of discharging according to the measured number of discharging have.

In addition, the height offset can be previously stored for each position of the measurement area and compensated to set the discharge position, so that the solder rework work can be performed more accurately even when the substrate is distorted.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, the foregoing description and drawings are to be regarded as illustrative rather than limiting of the present invention.

10: substrate 20: solder
100: Solder rework device 110: Solder dispensing device
120: Discharge control unit 130:
IS: Ideal Solder ISS: Ideal Solder structure
RS: Actual Solder RSS: Actual Solder Structure
RWS: Reworked solder structure

Claims (16)

A solder rework method for compensating for a deficient amount of solder formed on a substrate,
Dividing the ideal solder into predetermined calibration cells to form an ideal solder structure comprising the calibration cells;
Measuring a three-dimensional shape of the solder formed on the substrate and dividing the measured three-dimensional shape into the calibration cells to form an actual solder structure including the calibration cells;
Subtracting the actual solder structure from the ideal solder structure to yield a rework solder structure comprising the calibration cells; And
And discharging solder corresponding to the reworked solder structure to the solder ejection device to compensate for the solder formed on the substrate. The method according to claim 1,
The step of compensating the solder formed on the substrate by discharging the solder corresponding to the reworked solder structure to the solder discharging device,
Calculating the number of calibration cells per position of the reworked solder structure; And
And discharging the solder to the solder dispenser by an amount corresponding to the number of calibration cells for each position of the rework solder structure. 3. The method of claim 2,
Before the step of discharging the solder corresponding to the rework solder structure to the solder dispenser to compensate the solder formed on the substrate,
Further comprising the step of calibrating and storing the amount of discharge according to the number of discharging of the solder discharging device,
The step of discharging the solder to the solder discharge device by an amount corresponding to the number of calibration cells for each position of the rework solder structure,
Calculating an ejection count for each position of the reworked solder structure based on an ejection amount according to the stored ejection number; And
And discharging the solder to the solder dispenser in accordance with the calculated number of discharges per position calculated. The method of claim 3,
Before the step of discharging the solder to the solder discharging device according to the calculated number of discharging by position,
Setting a measurement area of a predetermined size on the substrate on which the solder is formed; And
Further comprising storing a height offset for each location of the measurement area,
Wherein the step of discharging the solder to the solder discharging device according to the calculated number of discharging by position,
Transferring the solder dispensing apparatus to a dispense position compensating for the height offset; And
And discharging the solder from the discharge position to the solder discharge device by the number of times of discharge for each position corresponding to the discharge position. The method according to claim 1,
Wherein the calibration cell corresponds to a single discharge amount of the solder dispensing apparatus. The method according to claim 1,
Wherein the amount of one discharge of the solder discharge device is smaller than or equal to the volume of the calibration cell. The method according to claim 1,
Wherein the calibration cell has a cuboidal shape,
Wherein the ideal solder structure is defined as a matrix of L x M x N based on the shape of the cube. (L, M, and N are natural numbers). The method according to claim 1,
The step of measuring the three-dimensional shape of the solder formed on the substrate and dividing the measured three-dimensional shape into the calibration cells to form the actual solder structure including the calibration cells,
Irradiating grid pattern light toward the solder formed on the substrate;
Receiving the reflected light of the grid pattern light reflected by the solder to obtain a pattern image;
Measuring a three-dimensional shape of the solder using the pattern image; And
Dividing the measured three-dimensional shape into the calibration cells to form the actual solder structure. A solder rework device for compensating for a deficient amount of solder formed on a substrate,
A solder dispenser for dispensing solder to compensate for solder formed on the substrate; And
Dividing the ideal solder into predetermined calibration cells to form an ideal solder structure and dividing the three dimensional shape of the solder formed on the substrate measured by the shape measuring device into the calibration cells to form an actual solder structure, And a discharge control section for calculating the rework solder structure by subtracting the actual solder structure from the solder structure and controlling the discharge of the discharge device based on the rework solder structure. 10. The method of claim 9,
The discharge control unit
Calculating the number of calibration cells for each position of the reworked solder structure and controlling the solder dispenser to discharge the solder to the solder dispenser by an amount corresponding to the number of calibration cells for each position of the rework solder structure Features a solder workpiece. 10. The method of claim 9,
Further comprising: a database for calibrating and storing an ejection amount corresponding to the ejection number of the solder ejection apparatus,
The discharge control unit
The number of times of ejection of the reworked solder structure is calculated on the basis of the amount of ejection according to the number of times of ejection stored in the database and the number of times of ejection of the solder ejection device Wherein the control unit controls the operation of the soldering workpiece. 12. The method of claim 11,
Wherein the database stores an amount of discharge according to the number of times of discharge of the solder dispenser in accordance with a material of the solder. A substrate inspection method comprising a solder rework for compensating for a deficient amount of solder formed on a substrate,
Measuring a three-dimensional shape of the solder formed on the substrate;
Determining from the measurement result whether the solder rework is required;
If the solder rework is determined to be necessary, dividing the ideal solder into predetermined calibration cells, and subtracting the actual solder structure set by dividing the measured three-dimensional shape of the solder into the calibration cells, Calculating a reworked solder structure corresponding to a deficient amount;
Discharging a solder corresponding to the reworked solder structure with a solder dispenser to compensate for solder formed on the substrate; And
And measuring the three-dimensional shape of the compensated solder. 14. The method of claim 13,
The step of compensating the solder formed on the substrate by discharging the solder corresponding to the reworked solder structure to the solder discharging device,
Calculating the number of calibration cells per position of the reworked solder structure; And
And discharging the solder to the solder dispenser by an amount corresponding to the number of calibration cells for each position of the rework solder structure. 14. The method of claim 13,
Before the step of discharging the solder corresponding to the rework solder structure to the solder dispenser to compensate the solder formed on the substrate,
Further comprising the step of calibrating and storing the amount of discharge according to the number of discharging of the solder discharging device,
The step of discharging the solder to the solder discharge device by an amount corresponding to the number of calibration cells for each position of the rework solder structure,
Calculating an ejection count for each position of the reworked solder structure based on an ejection amount according to the stored ejection number; And
And discharging the solder to the solder dispenser in accordance with the calculated number of discharges per position calculated. 14. The method of claim 13,
Determining from the measurement result whether the solder rework is necessary,
And checking whether or not the number of portions where the amount of the solder is insufficient is less than or equal to a reference number of times from the measurement result.

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