CN110665747B - Calibration method for dispensing and curing chip electronic component - Google Patents
Calibration method for dispensing and curing chip electronic component Download PDFInfo
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- CN110665747B CN110665747B CN201911064078.9A CN201911064078A CN110665747B CN 110665747 B CN110665747 B CN 110665747B CN 201911064078 A CN201911064078 A CN 201911064078A CN 110665747 B CN110665747 B CN 110665747B
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- calibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to a calibration method for dispensing and curing a chip electronic component, which comprises the following steps: the glue dispensing equipment receives a glue dispensing instruction, starts calibration, and moves to a fourth position along the first position, the second position and the third position in sequence at a constant flying speed; when the dispensing equipment moves to a first trigger point, a valve of the dispensing equipment is triggered to perform a first dispensing action to obtain a first calibration point; when the dispensing equipment moves to a second trigger point, a valve of the dispensing equipment is triggered to perform a second dispensing action to obtain a second calibration point; when the second dispensing action is finished, calculating the horizontal distance between the first calibration point and the second calibration point to generate a calibration distance; obtaining calibration delay time according to the calibration distance, and finishing calibration; the method is applied to the dispensing and curing operation of the chip electronic component, the dispensing position is accurately controlled, the dispenser is calibrated aiming at different workpieces, the actual drop point of the dispensing point is adjusted, the technical adjustment process is simplified, and the position accuracy of adjustment is ensured.
Description
Technical Field
The invention relates to the technical field of devices for spraying, pouring or allowing liquid or other fluid substances to flow to the surface of a workpiece, in particular to a calibration method for dispensing and curing a chip electronic component.
Background
The dispensing technology is widely applied to the electronic packaging industry, and along with the rapid development of the electronic industry technology, the volume of an electronic circuit is smaller and smaller, so that the requirement on the dispensing technology is higher and higher. The glue dispenser is mainly used for dispensing and curing chip electronic components in a PCB, and aims to reduce the failure probability of the components caused by cold and hot changes, falling, vibration and other factors in the use process of products, so that the service life of the products is prolonged. Therefore, when dispensing operation is performed, the accuracy of the dispensing position is directly related to the quality of the packaging technology, and further dispensing needs to be accurately controlled, so that the dispensing machine can dispense the dispensing point at a set position.
At present, a dispenser needs to be calibrated for different workpieces during dispensing operations. During the flying dispensing process of the chip electronic component, the glue often has an initial velocity in a certain direction at the moment when the glue leaves the glue valve, so that the final dropping point of the glue is not at the set position. In the prior art, the offset distance needs to be set by virtue of the proficiency and the operation experience of technicians, and the actual drop point of the glue point is adjusted by setting different offset distances. The prior art is complex in adjustment process, inaccurate in adjustment position precision and greatly influenced by speed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a calibration method for dispensing and curing a chip electronic component, which can accurately reflect the relation between the actual drop point of a glue point and a dispenser, is suitable for various flying dispensing processes, can quickly and accurately calibrate the actual drop point of the glue point and is not influenced by the speed.
The invention realizes the purpose through the following technical scheme:
a calibration method for performing dispensing curing on a chip electronic component comprises the following steps:
the glue dispensing equipment receives a glue dispensing instruction and starts calibration;
the dispensing equipment moves to a fourth position along the first position, the second position and the third position in sequence at the flying speed;
a first trigger point is arranged between the first position and the second position, and a second trigger point is arranged between the third position and the fourth position;
when the dispensing equipment moves to the first trigger point, triggering a valve of the dispensing equipment to perform a first dispensing action to obtain a first calibration point;
when the dispensing equipment moves to the second trigger point, triggering a valve of the dispensing equipment to perform a second dispensing action to obtain a second calibration point;
when the second dispensing action is finished, calculating the horizontal distance between the first calibration point and the second calibration point to generate a calibration distance;
and obtaining the calibration delay time according to the calibration distance, and finishing the calibration.
Preferably, the first trigger point and the second trigger point are located in the same vertical direction.
Preferably, the first position and the second position are located on the same first horizontal line, the third position and the fourth position are located on the same second horizontal line, and the first horizontal line and the second horizontal line are parallel.
Preferably, the first position, the second position, the third position and the fourth position are located on the same horizontal line.
Preferably, at least one first trigger point is arranged between the first position and the second position, and at least one second trigger point is arranged between the third position and the fourth position.
Preferably, in the first dispensing action, at least one first calibration point is obtained, and in the second dispensing action, at least one second calibration point is obtained.
Preferably, the second calibration point is any point other than the first calibration point.
Preferably, the flying speed is uniform.
The invention has the beneficial effects that:
1. because the time calibration model is established, the calibration delay time can be measured through the model, the relation between the actual drop point of the glue point and the driver can be accurately reflected, and the method is suitable for various flying glue dispensing processes;
2. the invention measures the calibration delay time, and the parameters are the same under different speeds, so the invention is not influenced by the speed;
3. the method has the advantages of simple measurement process, rapidness, accuracy and easiness in implementation, and the dispenser does not need to be adjusted by repeatedly setting the offset distance.
Drawings
Fig. 1 is a schematic flow chart of a calibration method for dispensing and curing a chip electronic component according to the present invention.
Fig. 2 is a calibration diagram illustrating a calibration method for dispensing and curing a chip electronic component according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, a flowchart of a calibration method for dispensing and curing a chip electronic component may specifically include:
step 1, when the dispensing equipment starts to move at a flying speed, acquiring preset point-falling position information of the dispensing equipment;
when the dispensing equipment moves from the first position to the fourth position at the flying speed, the moving path of the dispensing equipment sequentially moves from the first position to the fourth position through the second position and the third position, and the dispensing equipment simultaneously obtains the information of the preset point-falling position. And the uniform motion is carried out from the first position to the second position and from the third position to the fourth position. In a preferred embodiment, the dispensing device is movable to a plurality of different positions to obtain a plurality of different preset placement position information.
Step 2, the dispensing equipment starts to move at the flying speed, and the position information of the calibration point of the dispensing equipment is collected;
when the dispensing equipment moves from the first position to the fourth position at the flying speed, when the dispensing equipment moves to a first trigger point, a valve of the dispensing equipment is triggered, the colloid is sprayed out from the valve of the dispensing equipment, and the point is dropped to a certain position, so that a first calibration point is obtained; when the dispensing equipment moves to a second trigger point, a valve of the dispensing equipment is triggered, the colloid is sprayed out from the valve of the dispensing equipment, and the point is dropped to a certain position, so that a second calibration point is obtained; in a preferred embodiment, the dispensing device is movable to a plurality of trigger points at different positions for dispensing to obtain a plurality of calibration points, and each trigger point has another trigger point corresponding to the trigger point in the same vertical direction.
Step 3, calculating the distance between the first calibration point and the second calibration point to obtain a calibration distance; calculating calibration delay time according to the calibration distance, and performing structured training by acquiring speed information and position information of different calibration points to obtain a time calibration model;
the dispensing equipment collects data information moving to different preset drop point positions, including flight speed, the preset drop point positions, calibration points and calibration distances, and structurizes the collected data information, such as structurizes the flight speed, the preset drop point positions and the vectors of the calibration points, then merges the structuralized information according to the collected flight speed, then counts the merged structuralized information according to the flight speed, counts the calibration distances of all sections, and finally performs weighted calculation according to the calibration distances in the flight speed sections, so as to obtain the result as the calibration time of the section.
Step 4, regulating and controlling the dispensing equipment through a time calibration model, and performing accurate dispensing of the colloid on a preset dispensing position;
and counting the calibration distances generated in different flight speed sections by taking the flight speed information as a unit to obtain the calibration time of the section. When the dispensing equipment moves from the first position to the second position at the flying speed, the triggering time of the valve of the dispensing equipment can be regulated and controlled according to the calibration time generated in the speed section, so that after the valve of the dispensing equipment is triggered, the colloid can accurately fall on the preset falling point position after moving for a period of time, namely, after calibration, the colloid falls on a target point of a workpiece needing dispensing.
As shown in fig. 2, specifically, when the dispensing apparatus starts moving at the speed V, the dispensing apparatus passes A, B, D, E dots in sequence while taking the trigger point C of the dot a and the dot B, and taking the trigger point F of the dot D and the dot E, where the dot C is in the same vertical direction as the dot F. When the dispensing equipment reaches the point C, the valve of the dispensing equipment is triggered, the colloid is sprayed out through the valve and falls to the calibration point Y, when the dispensing equipment reaches the point F, the valve of the dispensing equipment is triggered, the colloid is sprayed out through the valve and falls to the calibration point Z. Wherein, the point A, the point B, the point C and the point Y are on the same first horizontal line, the point D, the point E, the point F and the point Z are on another same second horizontal line, and the first horizontal line and the second horizontal line are parallel. In a preferred embodiment, the dispensing apparatus sequentially passes through a plurality of trigger points at different positions to perform a plurality of dispensing actions to obtain a plurality of calibration points.
The dispensing equipment acquires the flying speed V, the position information of the point C, the position information of the point F, the position information of the point Y, the position information of the point Z, and the calibration distance S between the point Y and the point Z, and in a preferred embodiment, acquires a plurality of calibration distances S through a plurality of acquired calibration points. And then structuring and merging the information, counting according to the flight speed, and performing weighting calculation according to the calibration distance S of the flight speed to obtain a time calibration model:
wherein T is the calibration delay time, S is the calibration distance, and V is the flying speed. Through this time calibration model, can regulate and control the equipment valve trigger time that glues of point. For example, if the dispensing apparatus moves at the speed V1 from point a1 to point B1, the preset drop point is point C1, and if the calibration point Y is located on the right side of point C1, the valve triggering time of the dispensing apparatus is advanced by calculation of the time calibration model, so that the actual drop point is precisely located on the preset drop point position C1. In the present embodiment, the dispensing speed can be varied, that is, the dispensing speed can be changed and adjusted at any time, but the calibration delay time measured by the method is the same at different dispensing speeds, and therefore, is not affected by the speed. The calibration method can be preset in the dispensing control system and used as a calibration module of one of the systems, or the calibration method can be arranged in an external calibration device, and then the calibration device is inserted into the dispensing machine to calibrate the dispensing machineA flying glue dispensing process or a glue dispensing device.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (7)
1. A calibration method for dispensing and curing chip electronic components is characterized by comprising the following steps:
step 1: the method comprises the steps that a dispensing device receives a dispensing instruction, the dispensing device moves from a first position to a fourth position at a flying speed, the flying speed is constant, the moving path of the dispensing device sequentially moves from the first position to the fourth position through the second position and the third position, the dispensing device simultaneously obtains preset drop point position information, the dispensing device moves to a plurality of different positions, obtains a plurality of different preset drop point position information, and starts calibration;
step 2: the dispensing equipment moves to a fourth position along the first position, the second position and the third position in sequence at the flying speed; a first trigger point is arranged between the first position and the second position, and a second trigger point is arranged between the third position and the fourth position; when the dispensing equipment moves to the first trigger point, a valve of the dispensing equipment is triggered to perform a first dispensing action, the glue body is sprayed out from the valve of the dispensing equipment, and the glue body is dropped to a certain position to obtain a first calibration point; when the dispensing equipment moves to the second trigger point, a valve of the dispensing equipment is triggered to perform a second dispensing action, the colloid is sprayed out from the valve of the dispensing equipment, and the point is dropped to a certain position to obtain a second calibration point;
and step 3: when the second dispensing action is finished, calculating the horizontal distance between the first calibration point and the second calibration point to generate a calibration distance; obtaining a plurality of calibration distances through the obtained plurality of calibration points, obtaining calibration delay time according to the calibration distances, and performing structured training by acquiring speed information and position information of different calibration points to obtain a time calibration model; the dispensing equipment collects data information moving to different preset drop point positions, including flight speed, the preset drop point positions, calibration points and calibration distances, and structurizes the collected data information into vectors of the flight speed, the preset drop point positions and the calibration points, then merges the structuralized information according to the collected flight speed, then counts the merged structuralized information according to the flight speed, counts the calibration distances of all sections, and finally performs weighted calculation according to the calibration distances in the flight speed sections to obtain the result as the calibration time of the sections, and finishes the calibration;
and 4, step 4: regulating and controlling the dispensing equipment through a time calibration model, regulating and controlling the valve triggering time of the dispensing equipment, and executing accurate dispensing of the colloid on a preset dispensing position; counting calibration distances generated in different flight speed sections by taking flight speed information as a unit to obtain calibration time of the sections; when the dispensing equipment moves from the first position to the second position at the flying speed, the triggering time of the valve of the dispensing equipment is regulated and controlled according to the calibration time generated in the speed section, so that after the valve of the dispensing equipment is triggered, the colloid can accurately fall on the preset falling point position after moving for a period of time, and after calibration, the colloid falls on a target point of a workpiece needing dispensing.
2. A calibration method for performing dispensing curing on a chip electronic component according to claim 1, wherein the first trigger point and the second trigger point are located in a same vertical direction; the dispensing equipment moves to a plurality of trigger points at different positions, a plurality of dispensing actions are carried out, a plurality of calibration points are obtained, and each trigger point is provided with another trigger point corresponding to the trigger point in the same vertical direction.
3. A calibration method for curing in-place of chip electronic components according to claim 2, wherein said first position and said second position are located on a same first horizontal line, said third position and said fourth position are located on a same second horizontal line, and said first horizontal line is parallel to said second horizontal line.
4. A calibration method for curing in-place of chip electronic components according to claim 2, wherein said first position, said second position, said third position and said fourth position are located on the same horizontal line.
5. A calibration method for curing in-place of chip electronic components according to claim 3 or 4, wherein at least one first trigger point is arranged between said first position and said second position, and at least one second trigger point is arranged between said third position and said fourth position.
6. A calibration method for dispensing curing of chip electronic components as claimed in claim 5, characterized in that in said first dispensing action at least one first calibration point is obtained and in said second dispensing action at least one second calibration point is obtained.
7. The method as claimed in claim 6, wherein the second calibration point is any point other than the first calibration point.
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| CN201911064078.9A CN110665747B (en) | 2019-11-04 | 2019-11-04 | Calibration method for dispensing and curing chip electronic component |
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| CN201911064078.9A CN110665747B (en) | 2019-11-04 | 2019-11-04 | Calibration method for dispensing and curing chip electronic component |
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| CN117123433B (en) * | 2023-10-26 | 2024-02-20 | 常州铭赛机器人科技股份有限公司 | Control logic analysis method for variable-speed glue quantity of dispensing valve |
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