JP5015947B2 - ゲッター材を含むマイクロメカニカルデバイスの製造方法及び製造されたデバイス - Google Patents

ゲッター材を含むマイクロメカニカルデバイスの製造方法及び製造されたデバイス Download PDF

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JP5015947B2
JP5015947B2 JP2008544013A JP2008544013A JP5015947B2 JP 5015947 B2 JP5015947 B2 JP 5015947B2 JP 2008544013 A JP2008544013 A JP 2008544013A JP 2008544013 A JP2008544013 A JP 2008544013A JP 5015947 B2 JP5015947 B2 JP 5015947B2
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getter material
silicon
support
deposition
intermediate layer
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JP2009518191A5 (zh
JP2009518191A (ja
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リッツィ，エネア
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サエス ゲッターズ ソチエタ ペル アツィオニ
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Glass Compositions (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2008544013A 2005-12-06 2006-11-28 ゲッター材を含むマイクロメカニカルデバイスの製造方法及び製造されたデバイス Active JP5015947B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT002343A ITMI20052343A1 (it) 2005-12-06 2005-12-06 Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti
ITMI2005A002343 2005-12-06
PCT/IT2006/000824 WO2007066370A1 (en) 2005-12-06 2006-11-28 Process for manufacturing micromechanical devices containing a getter material and devices so manufactured

Publications (3)

Publication Number Publication Date
JP2009518191A JP2009518191A (ja) 2009-05-07
JP2009518191A5 JP2009518191A5 (zh) 2012-03-01
JP5015947B2 true JP5015947B2 (ja) 2012-09-05

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ID=37951839

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JP2008544013A Active JP5015947B2 (ja) 2005-12-06 2006-11-28 ゲッター材を含むマイクロメカニカルデバイスの製造方法及び製造されたデバイス

Country Status (17)

Country Link
US (1) US7833880B2 (zh)
EP (1) EP1957395B1 (zh)
JP (1) JP5015947B2 (zh)
KR (1) KR101364623B1 (zh)
CN (1) CN101291873B (zh)
AT (1) ATE480495T1 (zh)
AU (1) AU2006322862C1 (zh)
CA (1) CA2623020C (zh)
DE (1) DE602006016850D1 (zh)
DK (1) DK1957395T3 (zh)
ES (1) ES2348613T3 (zh)
IL (1) IL191756A (zh)
IT (1) ITMI20052343A1 (zh)
NO (1) NO20081994L (zh)
RU (1) RU2401245C2 (zh)
TW (1) TWI325409B (zh)
WO (1) WO2007066370A1 (zh)

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FR2922202B1 (fr) * 2007-10-15 2009-11-20 Commissariat Energie Atomique Structure comportant une couche getter et une sous-couche d'ajustement et procede de fabrication.
EP2484629B1 (fr) * 2011-02-03 2013-06-26 Nivarox-FAR S.A. Pièce de micromécanique complexe ajourée
RU2474912C1 (ru) * 2011-08-23 2013-02-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) Способ получения газопоглощающей структуры
US9935028B2 (en) * 2013-03-05 2018-04-03 Global Circuit Innovations Incorporated Method and apparatus for printing integrated circuit bond connections
US9870968B2 (en) 2011-10-27 2018-01-16 Global Circuit Innovations Incorporated Repackaged integrated circuit and assembly method
US9966319B1 (en) 2011-10-27 2018-05-08 Global Circuit Innovations Incorporated Environmental hardening integrated circuit method and apparatus
RU2523718C2 (ru) * 2012-11-20 2014-07-20 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) Нанокомпозитная газопоглощающая структура и способ ее получения
RU2522323C1 (ru) * 2012-12-29 2014-07-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Микроэлектромеханический взрыватель
RU2522362C1 (ru) * 2012-12-29 2014-07-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана (МГТУ им. Н.Э. Баумана) Микроэлектромеханический взрыватель изохорический
US10160638B2 (en) 2013-01-04 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a semiconductor structure
US8847373B1 (en) * 2013-05-07 2014-09-30 Innovative Micro Technology Exothermic activation for high vacuum packaging
DE102015224499A1 (de) * 2015-12-08 2017-06-08 Robert Bosch Gmbh Spannungsreduzierung beim Laserwiederverschluss durch Temperaturerhöhung
DE102015226772A1 (de) * 2015-12-29 2017-06-29 Robert Bosch Gmbh Gettervorrichtung für ein mikromechanisches Bauelement
JP6932491B2 (ja) * 2016-10-31 2021-09-08 株式会社豊田中央研究所 Ｍｅｍｓ装置を製造する方法
CN106517082B (zh) * 2016-11-14 2017-11-03 北方电子研究院安徽有限公司 一种mems吸气剂图形化制备方法
CN109879240B (zh) * 2017-12-06 2021-11-09 有研工程技术研究院有限公司 一种厚膜吸气材料的制备方法
FR3083537B1 (fr) * 2018-07-06 2021-07-30 Ulis Boitier hermetique comportant un getter, composant integrant un tel boitier hermetique et procede de fabrication associe
US11508680B2 (en) 2020-11-13 2022-11-22 Global Circuit Innovations Inc. Solder ball application for singular die
CN112614779A (zh) * 2020-12-17 2021-04-06 苏州晶鼎鑫光电科技有限公司 一种吸气剂图形化的掩膜方式

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US4050914A (en) * 1976-07-26 1977-09-27 S.A.E.S. Getters S.P.A. Accelerator for charged particles
US5503285A (en) * 1993-07-26 1996-04-02 Litton Systems, Inc. Method for forming an electrostatically force balanced silicon accelerometer
CA2179052C (en) 1993-12-13 2001-02-13 Robert E. Higashi Integrated silicon vacuum micropackage for infrared devices
US5594170A (en) 1994-06-15 1997-01-14 Alliedsignal Inc. Kip cancellation in a pendulous silicon accelerometer
US5656778A (en) 1995-04-24 1997-08-12 Kearfott Guidance And Navigation Corporation Micromachined acceleration and coriolis sensor
JPH09196682A (ja) 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 角速度センサと加速度センサ
US5821836A (en) 1997-05-23 1998-10-13 The Regents Of The University Of Michigan Miniaturized filter assembly
US6499354B1 (en) 1998-05-04 2002-12-31 Integrated Sensing Systems (Issys), Inc. Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices
US6110808A (en) * 1998-12-04 2000-08-29 Trw Inc. Hydrogen getter for integrated microelectronic assembly
JP2000182511A (ja) * 1998-12-14 2000-06-30 Yamaha Corp 電界放射型素子の製造方法
US6058027A (en) 1999-02-16 2000-05-02 Maxim Integrated Products, Inc. Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate
US6590850B2 (en) 2001-03-07 2003-07-08 Hewlett-Packard Development Company, L.P. Packaging for storage devices using electron emissions
US6534850B2 (en) * 2001-04-16 2003-03-18 Hewlett-Packard Company Electronic device sealed under vacuum containing a getter and method of operation
TW533188B (en) 2001-07-20 2003-05-21 Getters Spa Support for microelectronic, microoptoelectronic or micromechanical devices
US6923625B2 (en) 2002-01-07 2005-08-02 Integrated Sensing Systems, Inc. Method of forming a reactive material and article formed thereby
US6621134B1 (en) 2002-02-07 2003-09-16 Shayne Zurn Vacuum sealed RF/microwave microresonator
US6635509B1 (en) 2002-04-12 2003-10-21 Dalsa Semiconductor Inc. Wafer-level MEMS packaging
ITMI20030069A1 (it) * 2003-01-17 2004-07-18 Getters Spa Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato.
US7235461B2 (en) * 2003-04-29 2007-06-26 S.O.I.Tec Silicon On Insulator Technologies Method for bonding semiconductor structures together
CN1594067A (zh) * 2003-09-08 2005-03-16 华中科技大学机械科学与工程学院 一种低温集成的圆片级微机电系统气密性封装工艺
ITMI20032209A1 (it) * 2003-11-14 2005-05-15 Getters Spa Processo per la produzione di dispositivi che richiedono per il loro funzionamento un materiale getter non evaporabile.
ITMI20050616A1 (it) 2005-04-12 2006-10-13 Getters Spa Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti

Also Published As

Publication number Publication date
US7833880B2 (en) 2010-11-16
RU2008127306A (ru) 2010-01-20
TWI325409B (en) 2010-06-01
US20080293178A1 (en) 2008-11-27
IL191756A0 (en) 2008-12-29
AU2006322862C1 (en) 2011-12-01
CA2623020A1 (en) 2007-06-14
CN101291873A (zh) 2008-10-22
CN101291873B (zh) 2011-06-15
DK1957395T3 (da) 2011-01-03
TW200732245A (en) 2007-09-01
KR101364623B1 (ko) 2014-02-19
ATE480495T1 (de) 2010-09-15
IL191756A (en) 2012-08-30
JP2009518191A (ja) 2009-05-07
EP1957395B1 (en) 2010-09-08
ITMI20052343A1 (it) 2007-06-07
CA2623020C (en) 2015-10-20
AU2006322862B2 (en) 2011-04-28
WO2007066370A1 (en) 2007-06-14
NO20081994L (no) 2008-06-05
ES2348613T3 (es) 2010-12-09
EP1957395A1 (en) 2008-08-20
RU2401245C2 (ru) 2010-10-10
DE602006016850D1 (de) 2010-10-21
AU2006322862A1 (en) 2007-06-14
KR20080081019A (ko) 2008-09-05

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