JP5008964B2 - ACF tape bonding apparatus, ACF tape bonding apparatus, and ACF tape bonding method - Google Patents

ACF tape bonding apparatus, ACF tape bonding apparatus, and ACF tape bonding method Download PDF

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JP5008964B2
JP5008964B2 JP2006344889A JP2006344889A JP5008964B2 JP 5008964 B2 JP5008964 B2 JP 5008964B2 JP 2006344889 A JP2006344889 A JP 2006344889A JP 2006344889 A JP2006344889 A JP 2006344889A JP 5008964 B2 JP5008964 B2 JP 5008964B2
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acf tape
current
tape
acf
release paper
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JP2008156424A (en
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橋 利 男 高
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Shibaura Mechatronics Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/745Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using a single unit having both a severing tool and a welding tool
    • B29C65/7451Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using a single unit having both a severing tool and a welding tool the severing tool and the welding tool being movable with respect to one-another
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/20Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43Joining a relatively small portion of the surface of said articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B29C66/7232General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
    • B29C66/72327General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of natural products or their composites, not provided for in B29C66/72321 - B29C66/72324
    • B29C66/72328Paper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/81General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8141General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
    • B29C66/81433General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined being toothed, i.e. comprising several teeth or pins, or being patterned
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/82Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/824Actuating mechanisms
    • B29C66/8242Pneumatic or hydraulic drives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Replacement Of Web Rolls (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To enable a present ACF tape to be precisely stuck to a next ACF tape even if the tape widths of the present tape and the next tape are thin. <P>SOLUTION: The ACF tape-sticking device 10 sticks the present ACF tape 1a comprising an adhesive film 2a, 2b and release paper 3a, 3b, with the next ACF tape 1b. The ACF tape-sticking device 10 is equipped with an ACF tape-supporting part 15 for supporting the overlapped present ACF tape 1a and next ACF tape 1b, and a welding device 5 for sticking the overlapped part of the present ACF tape 1a and the next ACF tape 1b arranged so as to face to the ACF tape-supporting part 15 by pressing the overlapped part by a pressing part 14 and sticking them by ultrasonic vibration. The tip face 14a of the pressing part 14 of the welding device 5 is subjected to knurling processing to form a plurality of protruded parts 19. Each of the protruded parts 19 has a flat face 19f and an edge 19r surrounding the flat face 19f. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

本発明は、現在ACFテープと次回ACFテープを確実に接合することができるACFテープ接合装置、ACFテープ貼着装置、およびACFテープ接合方法に関する。   The present invention relates to an ACF tape joining apparatus, an ACF tape adhering apparatus, and an ACF tape joining method capable of reliably joining a current ACF tape and a next ACF tape.

図7に示すように、従来、粘着膜2aと剥離紙3aとからなる現在ACFテープ1aと粘着膜2bと剥離紙3bとからなる次回ACFテープ1bとを接合するACFテープ接合装置10は、重なった現在ACFテープ1aと次回ACFテープ1bとを支持するアンビル(ACFテープ支持部)15と、アンビル15に対向して配置され、現在ACFテープ1aと次回ACFテープ1bの重なった部分を、ホーン(押圧部)14によって押圧し、かつ超音波振動させることによって接合する溶着装置5とを備えている。ここで、ホーン14の先端面14aは平坦面からなっている。   As shown in FIG. 7, conventionally, the ACF tape joining apparatus 10 for joining the current ACF tape 1a composed of the adhesive film 2a and the release paper 3a and the next ACF tape 1b composed of the adhesive film 2b and the release paper 3b is overlapped. An anvil (ACF tape support portion) 15 that supports the current ACF tape 1a and the next ACF tape 1b, and an anvil 15 that is disposed opposite to the anvil 15, the overlapping portion of the current ACF tape 1a and the next ACF tape 1b is replaced with a horn ( And a welding device 5 that is pressed by a pressing portion 14 and bonded by ultrasonic vibration. Here, the front end surface 14a of the horn 14 is a flat surface.

このようなACFテープ接合装置10を用いて、現在ACFテープ1aと次回ACFテープ1bとを接合する際には、次回ACFテープ1bの剥離紙3bを現在ACFテープ1aの粘着膜2aに押しつけた後、次回ACFテープ1bの剥離紙3bと現在ACFテープ1aの粘着膜2aを超音波振動させる(図8参照)。このことによって、現在ACFテープ1aの粘着膜2aと次回ACFテープ1bの剥離紙3bとの間に摩擦熱を発生させ、現在ACFテープ1aの粘着膜2aを溶かして次回ACFテープ1bの剥離紙3bに接着させる。   When the present ACF tape 1a and the next ACF tape 1b are joined using such an ACF tape joining apparatus 10, the release paper 3b of the next ACF tape 1b is pressed against the adhesive film 2a of the current ACF tape 1a. Next, the release paper 3b of the ACF tape 1b and the adhesive film 2a of the current ACF tape 1a are vibrated ultrasonically (see FIG. 8). As a result, frictional heat is generated between the adhesive film 2a of the current ACF tape 1a and the release paper 3b of the next ACF tape 1b, and the adhesive film 2a of the current ACF tape 1a is melted to release the release paper 3b of the next ACF tape 1b. Adhere to.

しかしながら、このような従来のACFテープ接合装置10においては、ホーン14の先端部の端縁14rで超音波振動の振動エネルギーが最も効率よく加わるため、現在ACFテープ1aと次回ACFテープ1bは、実質上、当該端縁14rに対応する箇所でのみ接合されている。このため、現在ACFテープ1aと次回ACFテープ1bの接合は十分なものではなく、とりわけ、テープ幅の細い現在ACFテープ1aと次回ACFテープ1bを接合する場合には、現在ACFテープ1aと次回ACFテープ1bを確実に接合できないことがある。   However, in such a conventional ACF tape joining apparatus 10, the vibration energy of ultrasonic vibration is most efficiently applied at the edge 14r of the tip of the horn 14, so that the current ACF tape 1a and the next ACF tape 1b are substantially Above, it is joined only at a location corresponding to the edge 14r. For this reason, the current ACF tape 1a and the next ACF tape 1b are not sufficiently joined. In particular, when the current ACF tape 1a having a narrow tape width and the next ACF tape 1b are joined, the current ACF tape 1a and the next ACF tape 1b. The tape 1b may not be reliably joined.

本発明は、このような点を考慮してなされたものであり、現在ACFテープおよび次回ACFテープのテープ幅が細い場合であっても、現在ACFテープと次回ACFテープを確実に接合できるACFテープ接合装置、ACFテープ貼着装置、およびACFテープ接合方法を提供することができる。   The present invention has been made in consideration of such points, and even when the width of the current ACF tape and the next ACF tape is narrow, the present ACF tape can reliably join the next ACF tape to the next ACF tape. A joining device, an ACF tape sticking device, and an ACF tape joining method can be provided.

本発明は、粘着膜と剥離紙とからなる現在ACFテープと次回ACFテープとを接合するACFテープ接合装置において、
重なった現在ACFテープと次回ACFテープとを支持するACFテープ支持部と、
ACFテープ支持部に対向して配置され、現在ACFテープと次回ACFテープの重なった部分を、押圧部によって押圧し、かつ超音波振動させることによって接合する溶着装置とを備え、
前記押圧部の先端面には、ローレット加工が施されて、複数の突部が形成され、
各突部が、平坦面と、当該平坦面を囲む端縁とを有することを特徴とするACFテープ接合装置である。
The present invention relates to an ACF tape joining apparatus for joining a current ACF tape composed of an adhesive film and a release paper to the next ACF tape,
An ACF tape support that supports the overlapped current ACF tape and next ACF tape;
A welding device that is disposed to face the ACF tape support portion, and that joins the current ACF tape and the next overlapped portion of the ACF tape by pressing the pressing portion and ultrasonically oscillating;
A knurling process is performed on the tip surface of the pressing portion to form a plurality of protrusions,
Each protrusion has a flat surface and an edge surrounding the flat surface.

このような構成により、現在ACFテープおよび次回ACFテープのテープ幅が細い場合であっても、現在ACFテープと次回ACFテープを確実に接合することができる。   With such a configuration, even if the tape width of the current ACF tape and the next ACF tape is narrow, the current ACF tape and the next ACF tape can be reliably joined.

本発明は、突部が、押圧部の先端面にあやめ状に配置されていることを特徴とするACFテープ接合装置である。   The present invention is the ACF tape bonding apparatus characterized in that the protrusions are arranged in a wavy shape on the front end surface of the pressing part.

このような構成により、次回ACFテープを現在ACFテープに対してより均一に接合することができる。   With such a configuration, the next ACF tape can be bonded more uniformly to the current ACF tape.

本発明は、突部の配置ピッチが0.5〜1.0mmであることを特徴とするACFテープ接合装置である。   The present invention is the ACF tape bonding apparatus characterized in that the arrangement pitch of the protrusions is 0.5 to 1.0 mm.

このような構成により、超音波振動によって発生する、現在ACFテープと次回ACFテープとの間の摩擦熱を大きくすることができ、かつ溶着時に発生する溶けカスが突部の間に詰まることを防止することができる。   With such a configuration, the frictional heat generated by ultrasonic vibration between the current ACF tape and the next ACF tape can be increased, and the molten residue generated during welding is prevented from clogging between the protrusions. can do.

本発明は、溶着装置が、押圧部をACFテープ支持部に向かって駆動するシリンダを有し、
シリンダには、シリンダの内圧を高くすることによって、押圧部をACFテープ支持部に向かって駆動させる空圧回路が接続され、
空圧回路には、空圧回路の内圧を減圧する減圧弁が設けられていることを特徴とするACFテープ接合装置である。
The present invention has a cylinder in which the welding apparatus drives the pressing portion toward the ACF tape support portion,
The cylinder is connected to a pneumatic circuit that drives the pressing portion toward the ACF tape support portion by increasing the internal pressure of the cylinder.
The air pressure circuit is provided with a pressure reducing valve for reducing the internal pressure of the air pressure circuit.

このような構成により、テープ幅が1.2mm以下の現在ACFテープおよび次回ACFテープを用いる場合に、空圧回路に設けられた減圧弁によって、空圧回路の内圧を減圧して適宜調整することができる。このため、現在ACFテープおよび次回ACFテープに加わる圧力を小さくし、現在ACFテープの粘着膜が溶けすぎてしまうことを防止することができる。   With such a configuration, when the current ACF tape and the next ACF tape having a tape width of 1.2 mm or less are used, the internal pressure of the pneumatic circuit is reduced and appropriately adjusted by the pressure reducing valve provided in the pneumatic circuit. Can do. For this reason, the pressure applied to the current ACF tape and the next ACF tape can be reduced, and the adhesive film of the current ACF tape can be prevented from being excessively melted.

本発明は、ACFテープ支持部が、現在ACFテープと次回ACFテープとを吸着して保持することを特徴とするACFテープ接合装置である。   The present invention is an ACF tape joining apparatus characterized in that the ACF tape support part sucks and holds the current ACF tape and the next ACF tape.

本発明は、ACFテープ支持部の上流側に、現在ACFテープを所望位置で切断する切断部が設けられたことを特徴とするACFテープ接合装置である。   The present invention is an ACF tape bonding apparatus characterized in that a cutting portion for cutting a current ACF tape at a desired position is provided upstream of the ACF tape support portion.

本発明は、基板を支持する基板ステージと、
基板ステージの上流側に配置され、粘着膜と剥離紙とからなる現在ACFテープおよび次回ACFテープを順次供給するACFテープ供給部と、
基板ステージとACFテープ供給部との間に配置された上記のACFテープ接合装置と、
基板ステージに対向して配置され、基板上に供給された現在ACFテープの剥離紙を押圧し、基板に粘着膜を圧着させる加圧部と、
基板ステージの下流側に配置され、現在ACFテープの剥離紙を巻き取るACFテープ巻取部と、
を備えたことを特徴とするACFテープ貼着装置である。
The present invention includes a substrate stage for supporting a substrate,
An ACF tape supply unit that is arranged on the upstream side of the substrate stage and sequentially supplies a current ACF tape and a next ACF tape made of an adhesive film and a release paper;
The ACF tape bonding apparatus disposed between the substrate stage and the ACF tape supply unit;
A pressure unit that is disposed facing the substrate stage and presses the release paper of the current ACF tape supplied on the substrate, and presses the adhesive film to the substrate;
An ACF tape take-up unit that is arranged on the downstream side of the substrate stage and winds the release paper of the current ACF tape;
It is an ACF tape sticking apparatus characterized by comprising.

このような構成により、現在ACFテープおよび次回ACFテープのテープ幅が細い場合であっても、現在ACFテープと次回ACFテープを確実に接合することができる。   With such a configuration, even if the tape width of the current ACF tape and the next ACF tape is narrow, the current ACF tape and the next ACF tape can be reliably joined.

本発明は、ACFテープ供給部により、現在ACFテープを供給する現在ACFテープ供給工程と、
ACFテープ支持部の上流側に設けられた切断部により、現在ACFテープを所望位置で切断する切断工程と、
ACFテープ供給部により、次回ACFテープを供給する次回ACFテープ供給工程と、
基板ステージとACFテープ供給部との間に配置された上記のACFテープ接合装置により、現在ACFテープと次回ACFテープとを接合する接合工程と、
を備えたことを特徴とするACFテープ接合方法である。
The present invention provides a current ACF tape supply step of supplying the current ACF tape by the ACF tape supply unit;
A cutting step of cutting the current ACF tape at a desired position by a cutting portion provided on the upstream side of the ACF tape support portion;
The next ACF tape supply process for supplying the next ACF tape by the ACF tape supply unit;
A joining step of joining the current ACF tape and the next ACF tape by the ACF tape joining apparatus disposed between the substrate stage and the ACF tape supply unit;
An ACF tape joining method characterized by comprising:

このような構成により、現在ACFテープおよび次回ACFテープのテープ幅が細い場合であっても、現在ACFテープと次回ACFテープを確実に接合することができる。   With such a configuration, even if the tape width of the current ACF tape and the next ACF tape is narrow, the current ACF tape and the next ACF tape can be reliably joined.

本発明によれば、溶着装置の押圧部の先端面に、ローレット加工が施されて複数の突部が形成され、かつ各突部が平坦面と当該平坦面を囲む端縁とを有しているため、現在ACFテープおよび次回ACFテープのテープ幅が細い場合であっても、現在ACFテープと次回ACFテープを確実に接合することができる。   According to the present invention, the tip surface of the pressing portion of the welding apparatus is knurled to form a plurality of protrusions, and each protrusion has a flat surface and an edge surrounding the flat surface. Therefore, even if the tape width of the current ACF tape and the next ACF tape is narrow, the current ACF tape and the next ACF tape can be reliably joined.

第1の実施の形態
以下、本発明の第1の実施の形態に係るACFテープ接合装置、ACFテープ貼着装置、ACFテープ接合方法およびACFテープ貼着方法について、図面を参照して説明する。ここで、図1乃至図5は本発明の第1の実施の形態を示す図である。
First Embodiment Hereinafter, an ACF tape bonding apparatus, an ACF tape bonding apparatus, an ACF tape bonding method, and an ACF tape bonding method according to a first embodiment of the present invention will be described with reference to the drawings. Here, FIG. 1 to FIG. 5 are diagrams showing a first embodiment of the present invention.

図1に示すように、ACFテープ貼着装置50は、基板60を支持する基板ステージ51と、基板ステージ51の上流側に配置され、粘着膜2aと剥離紙3aとからなる現在ACFテープ1a、および粘着膜2bと剥離紙3bとからなる次回ACFテープ1bを順次供給するACFテープ供給部20と、基板ステージ51とACFテープ供給部20との間に配置されたACFテープ接合装置10とを備えている。なお、本願において「上流」とは、現在ACFテープ1aおよび次回ACFテープ1aの搬送される流れに対して、上流であることを意味する。   As shown in FIG. 1, an ACF tape adhering apparatus 50 is disposed on the upstream side of a substrate stage 51 that supports a substrate 60 and the substrate stage 51, and is currently an ACF tape 1a that includes an adhesive film 2a and a release paper 3a. And an ACF tape supply unit 20 for sequentially supplying the next ACF tape 1b composed of the adhesive film 2b and the release paper 3b, and an ACF tape bonding apparatus 10 disposed between the substrate stage 51 and the ACF tape supply unit 20. ing. In the present application, “upstream” means upstream of the flow of the current ACF tape 1a and the next ACF tape 1a.

また、図1に示すように、基板ステージ51に対向して、基板60上に供給された現在ACFテープ1aの剥離紙3aを押圧し、基板60に粘着膜2aを圧着させる加圧部53が配置されている。また、基板ステージ51の下流側に、現在ACFテープ1aの剥離紙3aを巻き取るACFテープ巻取部30が配置されている。   Further, as shown in FIG. 1, a pressing unit 53 that presses the release paper 3 a of the current ACF tape 1 a supplied onto the substrate 60 and presses the adhesive film 2 a against the substrate 60, facing the substrate stage 51. Has been placed. Further, an ACF tape winding unit 30 that winds the release paper 3a of the ACF tape 1a is disposed downstream of the substrate stage 51.

ところで、現在ACFテープ1aとは、その粘着膜2aが加圧部53によって基板60に圧着されている(または、既に圧着された)ACFテープのことを意味し、次回ACFテープ1bとは、現在ACFテープ1aに次いでその粘着膜2bが加圧部53によって基板60に圧着されるACFテープのことを意味する。   By the way, the current ACF tape 1a means an ACF tape whose pressure-sensitive adhesive film 2a is pressure-bonded (or already pressure-bonded) to the substrate 60 by the pressurizing unit 53, and the next ACF tape 1b is the current ACF tape 1b. This means an ACF tape in which the adhesive film 2b is pressure-bonded to the substrate 60 by the pressurizing unit 53 after the ACF tape 1a.

このうち、ACFテープ接合装置10は、図1および図2に示すように、重なった現在ACFテープ1aと次回ACFテープ1bとを支持するアンビル(ACFテープ支持部)15と、アンビル15に対向して配置され、現在ACFテープ1aと次回ACFテープ1bの重なった部分(現在ACFテープ1aの終端部と次回ACFテープ1bの始端部)を、ホーン(押圧部)14によってアンビル15に対して押圧して接合する溶着装置5と、溶着装置5の上流側に配置された現在ACFテープ1aを所望位置で切断する切断カッター(切断部)12とを有している。   Among them, the ACF tape joining apparatus 10 is opposed to the anvil 15 and the anvil (ACF tape support portion) 15 for supporting the overlapped current ACF tape 1a and the next ACF tape 1b as shown in FIGS. The portion where the current ACF tape 1a and the next ACF tape 1b overlap (the end of the current ACF tape 1a and the start of the next ACF tape 1b) is pressed against the anvil 15 by the horn (pressing portion) 14. And a cutting cutter (cutting part) 12 that cuts the current ACF tape 1a disposed on the upstream side of the welding device 5 at a desired position.

図2に示すように、溶着装置5は、ホーン14に連結され、ホーン14をアンビル15に向かう方向(図4(d)の矢印方向)に超音波振動させる超音波溶着器13と、超音波溶着器13に連結され、ホーン14および超音波溶着器13をアンビル15に向かって(図4(c)の矢印方向に)駆動するシリンダ16とを有している。   As shown in FIG. 2, the welding apparatus 5 is connected to a horn 14, and an ultrasonic welder 13 that ultrasonically vibrates the horn 14 in a direction toward the anvil 15 (arrow direction in FIG. 4D), and an ultrasonic wave. The cylinder 16 is connected to the welder 13 and drives the horn 14 and the ultrasonic welder 13 toward the anvil 15 (in the direction of the arrow in FIG. 4C).

また、図1および図2に示すように、このアンビル15には開口溝11が設けられ、当該開口溝11内に切断カッター12が挿入可能になっている(図4(b)参照)。   Further, as shown in FIGS. 1 and 2, the anvil 15 is provided with an opening groove 11, and a cutting cutter 12 can be inserted into the opening groove 11 (see FIG. 4B).

また、図2および図3(a)(b)に示すように、溶着装置5のホーン14の先端面14aには、ローレット加工が施されて、複数の突部19が形成されている。そして、図3(a)(b)に示すように、この突部19の各々は、平坦面19fと、当該平坦面19fを囲む端縁19rとを有している。また、図3(a)に示すように、突部19の平坦面19fは、その横断面が正方形からなっている。なお、図3(b)に示すように、本実施の形態において、当該正方形の一辺は0.25mmとなっている。   Further, as shown in FIGS. 2 and 3A and 3B, the tip surface 14a of the horn 14 of the welding apparatus 5 is knurled to form a plurality of protrusions 19. As shown in FIGS. 3A and 3B, each of the protrusions 19 has a flat surface 19f and an edge 19r surrounding the flat surface 19f. Further, as shown in FIG. 3A, the flat surface 19f of the protrusion 19 has a square cross section. In addition, as shown in FIG.3 (b), in this Embodiment, the one side of the said square is 0.25 mm.

また、図3(a)(b)に示すように、突部19は、ホーン14の先端面14aにあやめ状に配置されている。また、図3(b)に示すように、本実施の形態において、突部19の配置ピッチは0.75mmとなっている。なお、参考のため、図3(a)には、テープ幅が2.0mm、1.5mmおよび1.2mmからなるACFテープ1を示している。   Further, as shown in FIGS. 3A and 3B, the projecting portion 19 is arranged on the front end surface 14 a of the horn 14 in an irregular shape. Moreover, as shown in FIG.3 (b), in this Embodiment, the arrangement | positioning pitch of the protrusion 19 is 0.75 mm. For reference, FIG. 3A shows an ACF tape 1 having a tape width of 2.0 mm, 1.5 mm, and 1.2 mm.

また、アンビル15は、現在ACFテープ1aと次回ACFテープ1bとを吸引して保持する吸着穴(図示せず)を有しており、この吸着穴によって、現在ACFテープ1aと次回ACFテープ1bとを吸着して保持している(図2参照)。   Further, the anvil 15 has a suction hole (not shown) for sucking and holding the current ACF tape 1a and the next ACF tape 1b. The suction hole allows the current ACF tape 1a and the next ACF tape 1b to be connected to each other. Is adsorbed and held (see FIG. 2).

また、図1(a)(b)に示すように、基板ステージ51の上流側(図1(a)(b)の左側)には、現在ACFテープ1aの粘着膜2aを切断するハーフカッタ41と、当該ハーフカッタ41によって切断された粘着膜2aを剥離する剥離ヘッド42とを有する粘着膜部分剥離部40が配置されている。そして、この粘着膜部分剥離部40によって、現在ACFテープ1aの粘着膜2aが部分的に切断し剥離される。   Further, as shown in FIGS. 1A and 1B, on the upstream side of the substrate stage 51 (the left side of FIGS. 1A and 1B), a half cutter 41 that cuts the adhesive film 2a of the current ACF tape 1a. And an adhesive film partial peeling portion 40 having a peeling head 42 for peeling the adhesive film 2a cut by the half cutter 41. Then, the adhesive film 2a of the ACF tape 1a is partially cut and peeled by the adhesive film partial peeling portion 40.

また、図1(a)(b)に示すように、ハーフカッタ41および剥離ヘッド42の上方には、ハーフカッタ41によって現在ACFテープ1aの粘着膜2aを切断する際、および剥離ヘッド42によってハーフカッタ41によって切断された粘着膜2aを剥離する際に、現在ACFテープ1aを上方から吸着して保持する吸着ブロック45が設けられている。   Further, as shown in FIGS. 1A and 1B, above the half cutter 41 and the peeling head 42, when the adhesive film 2a of the ACF tape 1a is currently cut by the half cutter 41 and when the peeling head 42 An adsorbing block 45 that currently adsorbs and holds the ACF tape 1a from above when peeling the adhesive film 2a cut by the cutter 41 is provided.

また、図1(a)(b)に示すように、基板ステージ51の下流側(図1(a)(b)の右側)には、使用済み現在ACFテープ(剥離紙3a)をクランパ46aによって把持しつつ、下流側(図1(a)(b)の右側)に移動することによって、所定の長さの現在ACFテープ1aを基板60上に引き出す引出ユニット46が設けられている。   Further, as shown in FIGS. 1A and 1B, the used current ACF tape (release paper 3a) is placed by the clamper 46a on the downstream side of the substrate stage 51 (on the right side of FIGS. 1A and 1B). A drawer unit 46 is provided that pulls the current ACF tape 1a having a predetermined length onto the substrate 60 by moving to the downstream side (the right side of FIGS. 1A and 1B) while gripping.

また、図1(a)(b)に示すように、ACFテープ接合装置10とハーフカッタ41との間には、ガイド23に沿って上下方向に移動自在な供給側可動ローラ25と、ACFテープ供給部20からの現在ACFテープ1aを折り返し供給側可動ローラ25に供給する供給側固定ローラ29と、供給側可動ローラ25からの現在ACFテープ1aを受ける供給側固定ローラ26とが配置されている。また、同様に、引出ユニット46とACFテープ巻取部30との間には、巻取側固定ローラ36と、当該巻取側固定ローラ36からの剥離紙3aを受けるとともに、ガイド33に沿って上下方向に移動自在な巻取側可動ローラ35とが配置されている。   Further, as shown in FIGS. 1A and 1B, between the ACF tape joining apparatus 10 and the half cutter 41, a supply-side movable roller 25 that is movable up and down along the guide 23, and an ACF tape. A supply-side fixed roller 29 that supplies the current ACF tape 1a from the supply unit 20 to the return supply-side movable roller 25 and a supply-side fixed roller 26 that receives the current ACF tape 1a from the supply-side movable roller 25 are disposed. . Similarly, between the drawing unit 46 and the ACF tape winding unit 30, the winding side fixing roller 36 and the release paper 3 a from the winding side fixing roller 36 are received and along the guide 33. A winding-side movable roller 35 that is movable in the vertical direction is disposed.

なお、供給側可動ローラ25には、支持ローラ(図示せず)を介して錘(図示せず)が連結されている。このため、供給側可動ローラ25には、当該錘によって上方への引っ張り力が加えられる。また、同様に、巻取側可動ローラ35には、支持ローラ(図示せず)を介して錘(図示せず)が連結されている。このため、巻取側可動ローラ35にも、当該錘によって上方への引っ張り力が加えられる。   Note that a weight (not shown) is connected to the supply side movable roller 25 via a support roller (not shown). For this reason, an upward pulling force is applied to the supply side movable roller 25 by the weight. Similarly, a weight (not shown) is connected to the winding side movable roller 35 via a support roller (not shown). For this reason, an upward pulling force is also applied to the winding side movable roller 35 by the weight.

また、図1(a)(b)に示すように、巻取側固定ローラ36と巻取側可動ローラ35との間には、使用済み現在ACFテープ(剥離紙3a)を把持するクランプ機構39が設けられている。   Further, as shown in FIGS. 1A and 1B, a clamp mechanism 39 that holds the used ACF tape (release paper 3a) between the winding side fixed roller 36 and the winding side movable roller 35. Is provided.

また、図1(a)(b)に示すように、ACFテープ供給部20は、現在ACFテープ1aおよび次回ACFテープ1bを巻きつけて保持する供給リール22と、当該供給リール22を回転駆動する供給モータ21とを有している。また、ACFテープ巻取部30は、使用済み現在ACFテープ(剥離紙3a)を巻き取って保持する巻取リール32と、当該巻取リール32を回転駆動する巻取モータ31とを有している。   Further, as shown in FIGS. 1A and 1B, the ACF tape supply unit 20 rotates and drives the supply reel 22 that winds and holds the current ACF tape 1a and the next ACF tape 1b, and the supply reel 22. And a supply motor 21. The ACF tape take-up unit 30 includes a take-up reel 32 that takes up and holds a used current ACF tape (release paper 3a), and a take-up motor 31 that rotates the take-up reel 32. Yes.

次に、このような構成からなる本実施の形態の作用について述べる。   Next, the operation of the present embodiment having such a configuration will be described.

最初に、現在ACFテープ1aの粘着膜2aを基板60に圧着するACFテープ貼着装置50の作用について説明する。   First, the operation of the ACF tape adhering device 50 that presses the adhesive film 2a of the ACF tape 1a to the substrate 60 will be described.

まず、基板ステージ51によって、基板60が支持される(基板支持工程81)(図1(a)(b)および図5参照)。   First, the substrate 60 is supported by the substrate stage 51 (substrate support step 81) (see FIGS. 1A and 1B and FIG. 5).

次に、クランプ機構39により、使用済みの現在ACFテープ(剥離紙3a)がクランプされる(図1(a)参照)。   Next, the used current ACF tape (release paper 3a) is clamped by the clamp mechanism 39 (see FIG. 1A).

次に、基板ステージ51の上流側に配置されたACFテープ供給部20によって、剥離紙3aと粘着膜2aとからなる現在ACFテープ1aが供給される(ACFテープ供給工程83)(図1(a)および図5参照)。具体的には、ACFテープ供給部20の供給モータ21が、供給リール22を図1(a)の矢印の方向に回転駆動し、現在ACFテープ1aが供給リール22から巻き出される。   Next, the current ACF tape 1a composed of the release paper 3a and the adhesive film 2a is supplied by the ACF tape supply unit 20 arranged on the upstream side of the substrate stage 51 (ACF tape supply step 83) (FIG. 1A ) And FIG. Specifically, the supply motor 21 of the ACF tape supply unit 20 rotates the supply reel 22 in the direction of the arrow in FIG. 1A, and the current ACF tape 1a is unwound from the supply reel 22.

このため、現在ACFテープ1aに弛みが生じ、供給側可動ローラ25に連結された錘の作用により供給側可動ローラ25が上昇する(図1(a)参照)。なお、供給側可動ローラ25が上昇して上限位置に到達すると、供給モータ21の回転駆動は停止する。   Therefore, the current ACF tape 1a is slackened, and the supply-side movable roller 25 is lifted by the action of the weight connected to the supply-side movable roller 25 (see FIG. 1A). When the supply-side movable roller 25 rises and reaches the upper limit position, the rotation drive of the supply motor 21 stops.

このとき、基板ステージ51の下流側に配置されたACFテープ巻取部30によって、加圧部53により基板60に現在ACFテープ1aの粘着膜2aが既に圧着された、使用済みの現在ACFテープ(剥離紙3a)が巻き取られる(ACFテープ巻取工程93b)(図1(a)および図5参照)。   At this time, the used current ACF tape (the adhesive film 2a of the current ACF tape 1a is already pressure-bonded to the substrate 60 by the pressurizing unit 53 by the ACF tape winding unit 30 disposed on the downstream side of the substrate stage 51 ( The release paper 3a) is wound up (ACF tape winding step 93b) (see FIGS. 1A and 5).

すなわち、ACFテープ巻取部30の巻取モータ31が、巻取リール32を図1(a)の矢印の方向に回転駆動し、巻取リール32に使用済みの現在ACFテープ(剥離紙3a)が巻き取られる。このため、使用済みの現在ACFテープ(剥離紙3a)とクランプ機構39との距離が短くなり、巻取側可動ローラ35が、巻取側可動ローラ35に連結された錘(図示せず)の作用により上方向に付与されている引っ張り力に抗して下降する(図1(a)参照)。なお、巻取側可動ローラ35が下降して下限位置に到達すると、巻取モータ31の回転駆動は停止する。   That is, the take-up motor 31 of the ACF tape take-up unit 30 rotates the take-up reel 32 in the direction of the arrow in FIG. 1A, and the current ACF tape (release paper 3a) used for the take-up reel 32 Is wound up. For this reason, the distance between the used current ACF tape (release paper 3a) and the clamp mechanism 39 is shortened, and the winding-side movable roller 35 is connected to the winding-side movable roller 35 with a weight (not shown). It descends against the tensile force applied upward by the action (see FIG. 1A). In addition, when the winding side movable roller 35 descends and reaches the lower limit position, the rotational driving of the winding motor 31 is stopped.

次に、クランプ機構39が使用済みの現在ACFテープ(剥離紙3a)のクランプを解除する(図1(b)参照)。   Next, the clamp mechanism 39 releases the clamp of the used ACF tape (release paper 3a) (see FIG. 1B).

次に、使用済みの現在ACFテープ(剥離紙3a)が、ACFテープ供給部20とACFテープ巻取部30との間に配置された引出ユニット46のクランパ46aによって把持されて、上流側から下流側(図1(b)の右側)へと移動させられる(ACFテープ引出工程85)(図1(a)(b)および図5参照)。   Next, the used current ACF tape (release paper 3a) is gripped by the clamper 46a of the drawer unit 46 disposed between the ACF tape supply unit 20 and the ACF tape take-up unit 30, and the downstream side from the upstream side. (ACF tape drawing process 85) (see FIGS. 1A, 1B, and 5).

このように、引出ユニット46によって現在ACFテープ1aを基板60上に引き出す際、現在ACFテープ1aの所定位置がハーフカッタ41の上方に到達したとき、ハーフカッタ41によって現在ACFテープ1aの粘着膜2aが切断される(ハーフカット工程87)(図1(b)および図5参照)。その後、現在ACFテープ1aのハーフカッタ41によって粘着膜2aが切断された箇所が、剥離ヘッド42の上方に到達したときに、剥離ヘッド42によって、当該箇所の粘着膜2aが剥離される(粘着膜剥離工程88)(図1(b)および図5参照)。このように、現在ACFテープ1aの粘着膜2aがハーフカッタ41によって切断されたり、剥離ヘッド42によって剥離されたりするときには、吸着ブロック45がその都度作動し、現在ACFテープ1aは吸着ブロック45に吸着保持される。   As described above, when the current ACF tape 1a is pulled out onto the substrate 60 by the drawing unit 46, when the predetermined position of the current ACF tape 1a reaches above the half cutter 41, the adhesive film 2a of the current ACF tape 1a is reached by the half cutter 41. Is cut (half-cut step 87) (see FIG. 1B and FIG. 5). Thereafter, when the location where the adhesive film 2a is cut by the half cutter 41 of the ACF tape 1a reaches above the peeling head 42, the adhesive film 2a at the location is peeled off by the peeling head 42 (adhesive film). Peeling step 88) (see FIG. 1B and FIG. 5). As described above, when the adhesive film 2a of the current ACF tape 1a is cut by the half cutter 41 or peeled by the peeling head 42, the suction block 45 is operated each time, and the current ACF tape 1a is sucked by the suction block 45. Retained.

なお、上述のように、現在ACFテープ1aが上流側から下流側へと移動するので、ACFテープ供給部20の供給側可動ローラ25は、供給側可動ローラ25に連結された錘により上方向に付与されている引っ張り力に抗して下降する(図1(b)参照)。   As described above, since the ACF tape 1a currently moves from the upstream side to the downstream side, the supply side movable roller 25 of the ACF tape supply unit 20 is moved upward by the weight connected to the supply side movable roller 25. It descends against the applied pulling force (see FIG. 1B).

このとき、使用済みの現在ACFテープ(剥離紙3a)には、弛みが生じるので、巻取側可動ローラ35に連結された錘によって、巻取側可動ローラ35が上昇する(図1(b)参照)。   At this time, since the used current ACF tape (release paper 3a) is slackened, the winding-side movable roller 35 is raised by the weight connected to the winding-side movable roller 35 (FIG. 1B). reference).

次に、加圧部53が降下し、現在ACFテープ1aの剥離紙3aを押圧して、現在ACFテープ1aの粘着膜2aを、基板ステージ51に支持された基板60に圧着する(圧着工程91)(図1(a)(b)および図5参照)。   Next, the pressurizing unit 53 descends, presses the release paper 3a of the current ACF tape 1a, and crimps the adhesive film 2a of the current ACF tape 1a to the substrate 60 supported by the substrate stage 51 (crimping step 91). (See FIGS. 1 (a) and 1 (b) and FIG. 5).

次に、基板ステージ51の下流側に配置されたACFテープ巻取部30によって、使用済み現在ACFテープ(剥離紙3a)が巻き取られる(ACFテープ巻取工程93)(図1(a)および図5参照)。   Next, the used current ACF tape (release paper 3a) is taken up by the ACF tape take-up unit 30 arranged on the downstream side of the substrate stage 51 (ACF tape take-up step 93) (FIG. 1 (a) and (See FIG. 5).

このとき、ACFテープ供給部20の供給モータ21が、供給リール22を図1(a)の矢印の方向に回転駆動し、次に基板60に圧着される現在ACFテープ1aが、供給リール22から巻き出される(ACFテープ供給工程83a)(図1(a)および図5参照)。このため、当該現在ACFテープ1aに弛みが生じて、供給側可動ローラ25に連結された錘(図示せず)の作用により供給側可動ローラ25が上昇する(図1(a)参照)。   At this time, the supply motor 21 of the ACF tape supply unit 20 drives the supply reel 22 to rotate in the direction of the arrow in FIG. Unwinding (ACF tape supply step 83a) (see FIG. 1A and FIG. 5). Therefore, the current ACF tape 1a is slackened, and the supply-side movable roller 25 is lifted by the action of a weight (not shown) connected to the supply-side movable roller 25 (see FIG. 1 (a)).

以降は、上述した工程が繰り返し行われる。   Thereafter, the above-described steps are repeatedly performed.

上記のように、現在ACFテープ1aを基板60に圧着する工程を繰り返していくと、基板60に圧着するための現在ACFテープ1aが無くなってしまう。このように、現在ACFテープ1aが無くなると、新しいACFテープ(次回ACFテープ1b)を現在ACFテープ1aに接合する必要がある。このように、次回ACFテープ1bを現在ACFテープ1aに接合する際に、以下に示すように、ACFテープ貼着装置50のACFテープ接合装置10が用いられる。   As described above, when the process of pressing the current ACF tape 1a to the substrate 60 is repeated, the current ACF tape 1a for pressing the substrate 60 is lost. Thus, when the current ACF tape 1a is lost, it is necessary to join a new ACF tape (next ACF tape 1b) to the current ACF tape 1a. Thus, the next time the ACF tape 1b is bonded to the current ACF tape 1a, the ACF tape bonding apparatus 10 of the ACF tape adhering apparatus 50 is used as described below.

以下、次回ACFテープ1bを現在ACFテープ1aに接合する方法について述べる。   Hereinafter, a method for joining the ACF tape 1b to the current ACF tape 1a next time will be described.

まず、アンビル15の上流側に設けられた切断カッター12により、現在ACFテープ1aが所望位置で切断される(切断工程)(図4(a)(b)参照)。   First, the cutting cutter 12 provided on the upstream side of the anvil 15 cuts the current ACF tape 1a at a desired position (cutting step) (see FIGS. 4A and 4B).

次に、ACFテープ供給部20により、次回ACFテープ1bが供給される(次回ACFテープ供給工程)(図1(a)(b)および図4(c)参照)。   Next, the ACF tape supply unit 20 supplies the next ACF tape 1b (next ACF tape supply step) (see FIGS. 1A, 1B, and 4C).

次に、基板ステージ51とACFテープ供給部20との間に配置されたACFテープ接合装置10により、現在ACFテープ1aと次回ACFテープ1bとが接合される(接合工程)(図1(a)(b)および図4(d)参照)。   Next, the current ACF tape 1a and the next ACF tape 1b are joined by the ACF tape joining apparatus 10 disposed between the substrate stage 51 and the ACF tape supply unit 20 (joining step) (FIG. 1A). (See (b) and FIG. 4 (d)).

具体的には、まず、シリンダ16によって、超音波溶着器13および超音波溶着器13に連結されたホーン14がアンビル15に向かって移動して、ホーン14の先端面14aが次回ACFテープ1bの剥離紙3bを押圧する。このことによって、次回ACFテープ1bの剥離紙3bが現在ACFテープ1aの粘着膜2aに押しつけられる(図2および図4(d)参照)。   Specifically, first, the cylinder 16 moves the ultrasonic welder 13 and the horn 14 connected to the ultrasonic welder 13 toward the anvil 15, and the tip surface 14a of the horn 14 is moved to the next ACF tape 1b. The release paper 3b is pressed. As a result, the release paper 3b of the next ACF tape 1b is pressed against the adhesive film 2a of the current ACF tape 1a (see FIG. 2 and FIG. 4D).

次に、超音波溶着器13によって、ホーン14が超音波振動する。このことによって、現在ACFテープ1aの粘着膜2aと次回ACFテープ1bの剥離紙3bとが超音波振動し、現在ACFテープ1aの粘着膜2aと次回ACFテープ1bの剥離紙3bとの間に摩擦熱が発生し、現在ACFテープ1aの粘着膜2aが溶融して次回ACFテープ1bの剥離紙3bに接着される。   Next, the horn 14 is ultrasonically vibrated by the ultrasonic welder 13. As a result, the adhesive film 2a of the current ACF tape 1a and the release paper 3b of the next ACF tape 1b are ultrasonically vibrated, and friction is generated between the adhesive film 2a of the current ACF tape 1a and the release paper 3b of the next ACF tape 1b. As heat is generated, the adhesive film 2a of the ACF tape 1a is melted and bonded to the release paper 3b of the ACF tape 1b next time.

このとき、図3(a)(b)に示すように、ホーン14の先端面14aは、ローレット加工が施されて、複数の突部19が形成されている。そして、この突部19の各々は、平坦面19fと、当該平坦面19fを囲む端縁19rとを有している。   At this time, as shown in FIGS. 3A and 3B, the tip surface 14 a of the horn 14 is knurled to form a plurality of protrusions 19. Each of the protrusions 19 has a flat surface 19f and an edge 19r surrounding the flat surface 19f.

このように、ホーン14の先端面14aに複数の突部19を設けることによって、ホーン14の先端面14aの表面積に対して、超音波振動によって大きな摩擦熱が発生する端縁19rの占める表面積の割合を増やすことができる。このため、次回ACFテープ1bと現在ACFテープ1aを確実に接合することができる。   In this way, by providing the plurality of protrusions 19 on the tip surface 14a of the horn 14, the surface area occupied by the edge 19r that generates large frictional heat due to ultrasonic vibration is larger than the surface area of the tip surface 14a of the horn 14. The ratio can be increased. For this reason, the next ACF tape 1b and the present ACF tape 1a can be reliably joined.

また、図3(a)(b)に示すように、突部19がホーン14の先端面14aに複数個設けられている。このため、接合する現在ACFテープ1aおよび次回ACFテープ1bのテープ幅が細くても、複数の突部19の端縁19rによって、現在ACFテープ1aの粘着膜2aを溶融して、次回ACFテープ1bの剥離紙3bに接着することができる。この結果、幅の細い現在ACFテープ1aと次回ACFテープ1bであっても、確実に接合することできる。   Further, as shown in FIGS. 3A and 3B, a plurality of protrusions 19 are provided on the tip surface 14 a of the horn 14. For this reason, even if the tape width of the current ACF tape 1a and the next ACF tape 1b to be joined is narrow, the adhesive film 2a of the current ACF tape 1a is melted by the edges 19r of the plurality of protrusions 19, and the next ACF tape 1b The release paper 3b can be adhered. As a result, even the narrow current ACF tape 1a and the next ACF tape 1b can be reliably joined.

ここで、超音波振動によって発生する、現在ACFテープ1aの粘着膜2aと次回ACFテープ1bの剥離紙3bとの間の摩擦熱を大きくするためには、突部19の配置ピッチは1.0mmより小さくなっていることが好ましい。他方、突部19の配置ピッチが小さくなりすぎて、0.5mmより小さくなると、現在ACFテープ1aの粘着膜2aが次回ACFテープ1bの剥離紙3bに対して溶着する時に発生する溶けカスが、突部19の間に詰まり易くなり、清掃が困難になる。このため、突部19の配置ピッチは0.5〜1.0mmであることが好ましい。   Here, in order to increase the frictional heat generated by the ultrasonic vibration between the adhesive film 2a of the current ACF tape 1a and the release paper 3b of the next ACF tape 1b, the arrangement pitch of the protrusions 19 is 1.0 mm. It is preferable that it is smaller. On the other hand, when the arrangement pitch of the protrusions 19 becomes too small and becomes smaller than 0.5 mm, the melted residue generated when the adhesive film 2a of the current ACF tape 1a is welded to the release paper 3b of the ACF tape 1b next time, It becomes easy to clog between the protrusions 19, and cleaning becomes difficult. For this reason, it is preferable that the arrangement pitch of the protrusions 19 is 0.5 to 1.0 mm.

本実施の形態においては、図3(b)に示すように、突部19の配置ピッチが0.75mmとなっている。このため、超音波振動によって発生する、現在ACFテープ1aの粘着膜2aと次回ACFテープ1bの剥離紙3bとの間の摩擦熱を大きくすることができ、かつ溶着時に発生する溶けカスが突部19の間に詰まることを防止することができる。   In the present embodiment, as shown in FIG. 3B, the arrangement pitch of the protrusions 19 is 0.75 mm. For this reason, the frictional heat generated by the ultrasonic vibration between the adhesive film 2a of the current ACF tape 1a and the release paper 3b of the next ACF tape 1b can be increased, and the melted residue generated during welding is projected. 19 can be prevented from clogging.

また、図3(a)(b)に示すように、突部19は、ホーン14の先端面14aにあやめ状に配置されているので、次回ACFテープ1bを現在ACFテープ1aに対してより均一に溶着することができる。   Further, as shown in FIGS. 3 (a) and 3 (b), since the protrusion 19 is arranged in a wavy shape on the front end surface 14a of the horn 14, the next ACF tape 1b is more uniform than the current ACF tape 1a. Can be welded to.

また、横断面が正方形からなる平坦面19fを有する突部19は、平坦なホーン14の先端面14aに、直線状の溝を碁盤の目のように入れるだけで、生成することができる。このため、横断面が正方形からなる平坦面19fを有する突部19は、容易に生成することができる。   Further, the protrusion 19 having a flat surface 19f having a square cross section can be generated by simply inserting a straight groove into the tip surface 14a of the flat horn 14 like a grid. For this reason, the protrusion 19 having the flat surface 19f having a square cross section can be easily generated.

また、図示していないが、横断面がひし形からなる平坦面を有する突部も、平坦なホーン14の先端面14aに、溝を直線状に入れるだけで生成することができる。このため、横断面がひし形からなる平坦面を有する突部も、容易に生成することができる。   Although not shown, a protrusion having a flat surface having a rhombic cross section can also be generated by simply inserting a groove in the front end surface 14a of the flat horn 14 in a straight line. For this reason, the protrusion which has a flat surface which a cross section becomes a rhombus can also be produced | generated easily.

第2の実施の形態
次に図6により本発明の第2の実施の形態について説明する。図6に示す第2の実施の形態は、シリンダ16に、シリンダ16の内圧を高くすることによって、ホーン14をアンビル15に向かって駆動させる空圧回路6が接続されている。また、空圧回路6に、空圧回路6の内圧を減圧する減圧弁17が設けられている。また、当該空圧回路6は、電磁弁9を介してコンプレッサ8およびサイレンサー7に連結されている。その他の構成は、図1乃至図5に示す第1の実施の形態と略同一である。
Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment shown in FIG. 6, the pneumatic circuit 6 that drives the horn 14 toward the anvil 15 by increasing the internal pressure of the cylinder 16 is connected to the cylinder 16. The pneumatic circuit 6 is provided with a pressure reducing valve 17 that reduces the internal pressure of the pneumatic circuit 6. The pneumatic circuit 6 is connected to a compressor 8 and a silencer 7 via an electromagnetic valve 9. Other configurations are substantially the same as those of the first embodiment shown in FIGS.

図6に示す第2の実施の形態において、図1乃至図5に示す第1の実施の形態と同一部分には同一符号を付して詳細な説明は省略する。   In the second embodiment shown in FIG. 6, the same parts as those in the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

接合される現在ACFテープ1aおよび次回ACFテープ1bのテープ幅が1.2mm以下となる場合には、ホーン14から現在ACFテープ1aおよび次回ACFテープ1bに加わる圧力が大きくなり過ぎて、現在ACFテープ1aの粘着膜2aが溶けすぎてしまうことがある(図2参照)。   When the tape width of the current ACF tape 1a and the next ACF tape 1b to be joined is 1.2 mm or less, the pressure applied from the horn 14 to the current ACF tape 1a and the next ACF tape 1b becomes too large, and the current ACF tape The adhesive film 2a of 1a may melt too much (see FIG. 2).

本実施の形態においては、テープ幅が1.2mm以下の現在ACFテープ1aおよび次回ACFテープ1bを接合する場合に、空圧回路6に設けられた減圧弁17によって、空圧回路6の内圧を減圧して適宜調整することができる。このため、現在ACFテープ1aおよび次回ACFテープ1bに加わる圧力を小さくし、現在ACFテープ1aの粘着膜2aが溶けすぎてしまうことを防止することができる。   In the present embodiment, when the current ACF tape 1a and the next ACF tape 1b having a tape width of 1.2 mm or less are joined, the internal pressure of the pneumatic circuit 6 is reduced by the pressure reducing valve 17 provided in the pneumatic circuit 6. The pressure can be reduced and adjusted appropriately. For this reason, the pressure applied to the current ACF tape 1a and the next ACF tape 1b can be reduced, and the adhesive film 2a of the current ACF tape 1a can be prevented from being excessively melted.

なお、減圧弁17は、減圧弁17を制御する制御部(図示せず)と接続され、当該制御部からの信号に基づいて空圧回路6の内圧を減圧してもよい。このように、減圧弁17が制御部によって制御されることによって、減圧弁17はACFテープ(現在ACFテープ1aおよび次回ACFテープ1b)のテープ幅や種類に応じて、迅速かつ確実に空圧回路6の内圧を調整することができる。   The pressure reducing valve 17 may be connected to a control unit (not shown) that controls the pressure reducing valve 17 and reduce the internal pressure of the pneumatic circuit 6 based on a signal from the control unit. In this way, the pressure reducing valve 17 is controlled by the control unit, so that the pressure reducing valve 17 can quickly and surely operate the pneumatic circuit according to the tape width and type of the ACF tape (current ACF tape 1a and next ACF tape 1b). The internal pressure of 6 can be adjusted.

本発明の第1の実施の形態によるACFテープ貼着装置を示す側方図。The side view which shows the ACF tape sticking apparatus by the 1st Embodiment of this invention. 本発明の第1の実施の形態によるACFテープ接合装置を示す側方図。The side view which shows the ACF tape joining apparatus by the 1st Embodiment of this invention. 本発明の第1の実施の形態によるACFテープ接合装置の先端を示す拡大図。The enlarged view which shows the front-end | tip of the ACF tape joining apparatus by the 1st Embodiment of this invention. 本発明の第1の実施の形態によるACFテープ接合方法を説明する側方図。The side view explaining the ACF tape joining method by the 1st Embodiment of this invention. 本発明の第1の実施の形態によるACFテープ貼着方法を示すフロー図。The flowchart which shows the ACF tape sticking method by the 1st Embodiment of this invention. 本発明の第1の実施の形態によるACFテープ接合装置を示す概略図。BRIEF DESCRIPTION OF THE DRAWINGS Schematic which shows the ACF tape joining apparatus by the 1st Embodiment of this invention. 従来のACFテープ接合装置を示す側方図。The side view which shows the conventional ACF tape joining apparatus. 従来のACFテープ接合装置によって、現在ACFテープと次回ACFテープとが接合されている様子を示す側方断面図。Side sectional drawing which shows a mode that the present ACF tape and the next ACF tape are joined by the conventional ACF tape joining apparatus.

符号の説明Explanation of symbols

1a 現在ACFテープ
1b 次回ACFテープ
2a,2b 粘着膜
3a,3b 剥離紙
5 溶着装置
6 空圧回路
10 ACFテープ接合装置
11 開口溝
12 切断カッター(切断部)
13 超音波溶着器
14 ホーン(押圧部)
14a ホーンの先端面
15 アンビル(ACFテープ支持部)
16 シリンダ
17 減圧弁
19 突部
19f 平坦面
19r 端縁
20 ACFテープ供給部
30 ACFテープ巻取部
39 クランプ機構
40 粘着膜部分剥離部
41 ハーフカッタ
42 剥離ヘッド
46 引出ユニット
46a クランパ
50 ACFテープ貼着装置
51 基板ステージ
53 加圧部
60 基板
81 基板支持工程
83,83a ACFテープ供給工程
85 ACFテープ引出工程
87 ハーフカット工程
88 粘着膜剥離工程
91 圧着工程
93,93b ACFテープ巻取工程
1a Present ACF tape 1b Next ACF tape 2a, 2b Adhesive film 3a, 3b Release paper 5 Welding device 6 Pneumatic circuit 10 ACF tape joining device 11 Opening groove 12 Cutting cutter (cutting part)
13 Ultrasonic welder 14 Horn (pressing part)
14a End face 15 of horn 15 Anvil (ACF tape support part)
16 Cylinder 17 Pressure reducing valve 19 Protruding part 19f Flat surface 19r Edge 20 ACF tape supply part 30 ACF tape winding part 39 Clamp mechanism 40 Adhesive film partial peeling part 41 Half cutter 42 Peeling head 46 Drawer unit 46a Clamper 50 ACF tape sticking Apparatus 51 Substrate stage 53 Pressurizing unit 60 Substrate 81 Substrate support step 83, 83a ACF tape supply step 85 ACF tape drawing step 87 Half cut step 88 Adhesive film peeling step 91 Pressure bonding step 93, 93b ACF tape winding step

Claims (8)

粘着膜と剥離紙とからなる現在ACFテープと次回ACFテープとを接合するACFテープ接合装置において、
重なった現在ACFテープと次回ACFテープとを支持するACFテープ支持部と、
ACFテープ支持部に対向して配置され、現在ACFテープと次回ACFテープの重なった部分を、押圧部によって押圧し、かつ超音波振動させることによって接合する溶着装置とを備え、
前記押圧部の先端面には、ローレット加工が施されて、複数の突部が形成され、
各突部は、平坦面と、当該平坦面を囲む端縁とを有することを特徴とするACFテープ接合装置。
In the ACF tape joining device that joins the current ACF tape consisting of an adhesive film and release paper to the next ACF tape,
An ACF tape support that supports the overlapped current ACF tape and next ACF tape;
A welding device that is disposed to face the ACF tape support portion, and that joins the current ACF tape and the next overlapped portion of the ACF tape by pressing the pressing portion and ultrasonically oscillating;
A knurling process is performed on the tip surface of the pressing portion to form a plurality of protrusions,
Each protrusion has a flat surface and an edge surrounding the flat surface.
突部は、押圧部の先端面にあやめ状に配置されていることを特徴とする請求項1記載のACFテープ接合装置。   2. The ACF tape bonding apparatus according to claim 1, wherein the protrusion is arranged in a wavy shape on the front end surface of the pressing portion. 突部の配置ピッチは0.5〜1.0mmであることを特徴とする請求項1記載のACFテープ接合装置。   2. The ACF tape bonding apparatus according to claim 1, wherein the arrangement pitch of the protrusions is 0.5 to 1.0 mm. 溶着装置は、押圧部をACFテープ支持部に向かって駆動するシリンダを有し、
シリンダには、シリンダの内圧を高くすることによって、押圧部をACFテープ支持部に向かって駆動させる空圧回路が接続され、
空圧回路には、空圧回路の内圧を減圧する減圧弁が設けられていることを特徴とする請求項1記載のACFテープ接合装置。
The welding apparatus has a cylinder that drives the pressing portion toward the ACF tape support portion,
The cylinder is connected to a pneumatic circuit that drives the pressing portion toward the ACF tape support portion by increasing the internal pressure of the cylinder.
2. The ACF tape joining apparatus according to claim 1, wherein the air pressure circuit is provided with a pressure reducing valve for reducing the internal pressure of the air pressure circuit.
ACFテープ支持部は、現在ACFテープと次回ACFテープとを吸着して保持することを特徴とする請求項1記載のACFテープ接合装置。   2. The ACF tape bonding apparatus according to claim 1, wherein the ACF tape support part sucks and holds the current ACF tape and the next ACF tape. ACFテープ支持部の上流側に、現在ACFテープを所望位置で切断する切断部が設けられたことを特徴とする請求項1記載のACFテープ接合装置。   2. The ACF tape joining apparatus according to claim 1, wherein a cutting section for cutting the current ACF tape at a desired position is provided upstream of the ACF tape support section. 基板を支持する基板ステージと、
基板ステージの上流側に配置され、粘着膜と剥離紙とからなる現在ACFテープおよび次回ACFテープを順次供給するACFテープ供給部と、
基板ステージとACFテープ供給部との間に配置された請求項1記載のACFテープ接合装置と、
基板ステージに対向して配置され、基板上に供給された現在ACFテープの剥離紙を押圧し、基板に粘着膜を圧着させる加圧部と、
基板ステージの下流側に配置され、現在ACFテープの剥離紙を巻き取るACFテープ巻取部と、
を備えたことを特徴とするACFテープ貼着装置。
A substrate stage for supporting the substrate;
An ACF tape supply unit that is arranged on the upstream side of the substrate stage and sequentially supplies a current ACF tape and a next ACF tape made of an adhesive film and a release paper;
The ACF tape bonding apparatus according to claim 1 disposed between the substrate stage and the ACF tape supply unit;
A pressure unit that is disposed facing the substrate stage and presses the release paper of the current ACF tape supplied on the substrate, and presses the adhesive film to the substrate;
An ACF tape take-up unit that is arranged on the downstream side of the substrate stage and winds the release paper of the current ACF tape;
An ACF tape sticking device comprising:
ACFテープ供給部により、現在ACFテープを供給する現在ACFテープ供給工程と、
ACFテープ支持部の上流側に設けられた切断部により、現在ACFテープを所望位置で切断する切断工程と、
ACFテープ供給部により、次回ACFテープを供給する次回ACFテープ供給工程と、
基板ステージとACFテープ供給部との間に配置された請求項1記載のACFテープ接合装置により、現在ACFテープと次回ACFテープとを接合する接合工程と、
を備えたことを特徴とするACFテープ接合方法。
The current ACF tape supply process for supplying the current ACF tape by the ACF tape supply unit
A cutting step of cutting the current ACF tape at a desired position by a cutting portion provided on the upstream side of the ACF tape support portion;
The next ACF tape supply process for supplying the next ACF tape by the ACF tape supply unit;
A joining step of joining the current ACF tape and the next ACF tape by the ACF tape joining apparatus according to claim 1 disposed between the substrate stage and the ACF tape supply unit;
An ACF tape joining method comprising:
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