JP5007499B2 - Noise filter array - Google Patents

Description

  The present invention is a noise having an integrated structure in which noise filters for effectively removing noise flowing through signal wirings formed on a circuit board are arranged in an array so as to individually correspond to each signal wiring. It relates to a filter array.

  For example, some mobile phones use a plurality of communication bands in one mobile phone depending on the communication method. In order to prevent reception sensitivity deterioration in each communication band, it is necessary to effectively remove noise in each frequency band.

  As noise filters used for such noise removal, choke coils, ferrite beads, ladder type LC filters, and the like are conventionally known.

  Here, when the above choke coil is used as a noise filter, noise can be easily removed by simply mounting the choke coil on each signal wiring. Is relatively narrow, only noise of a specific frequency can be effectively removed, and it is difficult to simultaneously remove noise of a plurality of frequency bands.

  In addition, when using ferrite beads, as with the choke coil, noise can be easily removed because the noise can be removed simply by mounting the ferrite beads on each signal wiring. Since it has attenuation from the low frequency range, it has a large influence on the signal waveform, such as attenuating a necessary signal, and there is a case where sufficient attenuation of noise cannot be obtained because high attenuation cannot be obtained.

  The ladder-type LC filter described above includes various types such as T-type, π-type, and L-type. In any of these, wide-band noise removal characteristics can be obtained by appropriately setting inductance and capacitance. Although obtained, it is necessary to ground the external electrode connected to the capacitor. Therefore, it is indispensable to form a grounding electrode pattern on the circuit board on which the ladder type LC filter is mounted. For this reason, there exists a problem that the freedom degree of wiring of a circuit board is restrict | limited.

  Furthermore, a plurality of signal wirings are formed on a circuit board that performs high-density mounting, but depending on the component layout, it may be difficult to form a grounding electrode pattern having a sufficient line width together with these signal wirings. As a result, there is a problem that the frequency characteristics of the ladder-type LC filter change due to the influence of the inductance parasitic on the ground electrode pattern, and noise cannot be sufficiently removed.

  On the other hand, in the prior art, a filter element is formed by forming a coil by spirally laminating a plurality of coil conductors in a dielectric, and forming a trap circuit by the inductance of this coil and the floating capacitance between the coil conductors. In addition, a coil is formed by spirally laminating a plurality of coil conductors in a magnetic body on both sides of the element, and a single trap circuit is formed by the inductance of this coil and the floating capacitance between the coil conductors. There has been proposed a filter in which a noise filter is configured by arranging filter elements and integrally forming these filter elements (see, for example, Patent Document 1).

  According to this noise filter, it is possible to remove noise in each communication band by setting the resonance frequency of the trap circuit constituting each filter element corresponding to a plurality of communication bands.

  However, in the noise filter described in Patent Document 1, the resonance frequency not only on the high frequency side but also on the low frequency side depends on the stray capacitance generated between the coil conductors, so that the desired resonance frequency is set. It is difficult. Moreover, since it is difficult for the trap circuit using a magnetic material to obtain high attenuation at the resonance frequency, there is a possibility that appropriate and sufficient noise removal cannot be performed for each frequency band. Furthermore, since it is necessary to sinter and integrate the dielectric and magnetic materials at the same time, cracking and peeling are likely to occur during the manufacturing process, not only the reliability of the strength is low, but also the optimal manufacturing conditions. Since it is necessary to perform setting management with high accuracy, there is a problem in that the cost increases.

  As another conventional technique, there is also proposed a structure in which a plurality of coils formed by spirally laminating a plurality of coil conductors in a single dielectric are formed simultaneously to form a plurality of trap circuits.

However, in the case of the noise filter having this configuration, it is difficult to set each trap circuit to a desired resonance frequency corresponding to a plurality of communication bands, as in the case of the above-mentioned Patent Document 1. May be unable to form a plurality of trap circuits, or may not be able to obtain high attenuation at the resonance frequency of each trap circuit, and appropriate and sufficient noise removal cannot be performed for each frequency band. There is a problem.
JP-A-5-267059

  The present invention has been made to solve the above-described problems, and can easily and reliably set the resonance frequency in a plurality of frequency bands, and can efficiently remove noise for each of the plurality of frequency bands. To provide a high-performance noise filter array capable of reliably removing noise for each noise filter by suppressing the occurrence of characteristic variations between adjacent noise filters. With the goal.

In order to solve the above problem, the noise filter array of claim 1 of the present application is:
On a circuit board on which a plurality of signal filters are formed, comprising at least three noise filters for noise removal, wherein each noise filter is integrated in an adjacent state by an insulator and arranged in an array. A noise filter array implemented and used,
On the outside of the insulator, a pair of left and right external electrodes connected to each signal wiring formed on the circuit board is formed,
A plurality of coils are arranged in series inside the insulator, and both ends of the series-connected coils are electrically connected individually to the pair of left and right external electrodes, respectively. In addition, a capacitor is connected in parallel to at least one of the plurality of coils, and the remaining coil has a resonance point due to the influence of a floating capacitor that is inevitably generated by forming the coil. A plurality of different stages of LC parallel resonant circuits are connected in cascade to form each noise filter.
Each of the coils is configured by connecting a plurality of laminated coil conductors via the insulator through via holes,
The capacitor has a shield electrode between the front and rear coils connected in series and electrically connected to both the coils, and one end of each of the external electrodes of the pair of left and right external electrodes. The other end side of the electrically connected capacitance forming electrode is configured to be opposed to each other via the insulator, and
To suppress the variation in characteristics of the noise filter adjacent to each other, among the noise filter, in the noise filter other noise filter on both sides is adjacent, the electric magnetic field distribution of each other adjacent noise filter to each other In order to eliminate the shift of the resonance frequency to the high frequency side due to mutual interference, the capacitance is adjusted so that the capacitance of the capacitor is larger than that of the noise filter in which another noise filter is adjacent to only one side. It is characterized by

The noise filter array according to claim 2 of the present application is
On a circuit board on which a plurality of signal filters are formed, comprising at least three noise filters for noise removal, wherein each noise filter is integrated in an adjacent state by an insulator and arranged in an array. A noise filter array implemented and used,
A pair of left and right external electrodes individually connected to each signal wiring formed on the circuit board is formed outside the insulator, and a position outside the insulator where the external electrode is not formed While a direction identification mark is formed on the
A plurality of coils are arranged in series inside the insulator, and both ends of the series-connected coils are electrically connected individually to the pair of left and right external electrodes, respectively. In addition, a capacitor is connected in parallel to at least one of the plurality of coils, and the remaining coil has a resonance point due to the influence of a floating capacitor that is inevitably generated by forming the coil. A plurality of different stages of LC parallel resonant circuits are connected in cascade to form each noise filter.
Each of the coils is configured by connecting a plurality of laminated coil conductors via the insulator through via holes,
The capacitor has a shield electrode between the front and rear coils connected in series and electrically connected to both the coils, and one end of each of the external electrodes of the pair of left and right external electrodes. The other end side of the electrically connected capacitance forming electrode is configured to be opposed to each other via the insulator, and
In order to suppress variation in characteristics of the noise filters adjacent to each other, among the noise filters, the magnetic flux generated by the direction identification mark is used for the noise filter located at a position facing the direction identification mark via the insulator. It is characterized in that the capacitance of the capacitor is adjusted so as to compensate for a decrease in inductance caused by shielding.

  According to a third aspect of the present invention, there is provided the noise filter array according to the first or second aspect, wherein the shield electrode and the capacitance forming electrode are arranged to face each other via the insulator. In place of the capacitor, a capacitor is formed by disposing the coil conductor and a capacitance forming electrode electrically connected at one end to the pair of left and right external electrodes through the insulator. It is characterized by being.

In the noise filter arrays of claim 1 and claim 2, since the noise filter comprising the LC parallel resonance circuit is integrally formed in an array in a single insulator, the LC parallels constituting each noise filter are formed. By adjusting the capacitance of the capacitor of the resonance circuit, changing the number of turns of the coil conductor, or changing the distance between the coil conductors, it is possible to easily and reliably set the desired resonance frequency. The noise of each signal wiring can be removed individually and efficiently.
In addition, since shield electrodes are arranged between the front and rear coils, it is possible to prevent magnetic coupling between the front and rear coils, and the setting of the resonance frequency of each LC parallel resonance circuit can be performed reliably. .
Therefore, by using the noise filter of the present invention, for example, it is possible to effectively take measures against noise in mobile phones.

Further, in the noise filter array of the present invention, it is not necessary to individually provide a noise filter for each signal wiring, and noise of each signal wiring can be individually removed by one component (noise filter array).
As a result, the number of components can be reduced as compared with the prior art, and the efficiency of component mounting can be improved and the mounting area on the circuit board can be reduced.
In addition, since the noise filter is integrally formed in a single insulator, there is little risk of cracking or peeling in the manufacturing process, and it is possible to efficiently manufacture a highly reliable noise filter array free from structural defects. It becomes possible.

  Further, in the noise filter array according to claim 1 of the present invention, among the noise filters, the noise filter in which the other noise filter is adjacent to both sides is a noise filter in which the other noise filter is adjacent to only one side. In comparison, the capacitance of the capacitor is adjusted so as to increase, so that variations in the characteristics of the resonance frequency between adjacent noise filters are suppressed, and noise can always be efficiently removed by each noise filter. A high performance noise filter array can be obtained.

In the noise filter array according to claim 2 of the present invention, among the noise filters, the noise filter at a position facing the direction identification mark is made up to compensate for a decrease in inductance caused by magnetic flux shielding by the direction identification mark. Since the capacitance of the capacitor is adjusted , variation in characteristics of each noise filter is suppressed. As a result, it is possible to obtain a high-performance noise filter array that can always remove noise efficiently with each noise filter.

  Further, as in claim 3 of the present application, a capacitor is formed by disposing a coil conductor and a capacitance forming electrode electrically connected to one of the two external electrodes via an insulator. Even in such a case, it is possible to obtain a noise filter array having a noise filter composed of a plurality of LC parallel resonant circuits with a relatively simple configuration.

  In the noise filter array of claim 3, the desired resonance frequency can be easily set by adjusting the capacitance of the capacitor, changing the number of turns of the coil conductor, or changing the distance between the coil conductors. Is possible. In particular, when a shield electrode is disposed between the front and rear coils so as to be orthogonal to the coil axis direction, magnetic coupling between the front and rear coils can be reliably prevented. This is preferable because the resonance frequency can be set more reliably.

  Furthermore, in the noise filter array according to claim 3 of the present application, among the noise filters, the noise filter in which the other noise filter is adjacent on both sides is compared with the noise filter in which the other noise filter is adjacent on only one side. Then, adjust the capacitance of the capacitor so that the capacitance of the capacitor is increased, or adjust the capacitance of the noise filter at the position facing the direction identification mark to compensate for the decrease in inductance caused by magnetic flux shielding by the direction identification mark. As a result, it is possible to always remove noise efficiently in each noise filter, and a high-performance noise filter array can be obtained.

  Hereinafter, examples of the present invention will be shown and features thereof will be described in more detail.

  1 is a plan view showing a state in which a noise filter array according to a first embodiment of the present invention is mounted on a circuit board, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 is a first embodiment of the present invention. It is an equivalent circuit schematic of the noise filter array concerning.

  As shown in FIGS. 1 to 3, the noise filter array according to the first embodiment is for removing noise flowing through a plurality of (four in the first embodiment) signal wirings 2 formed on the circuit board 1. Therefore, four noise filters 3 a to 3 d (FIG. 3) are integrally arranged corresponding to each signal wiring 2.

  That is, the noise filter array includes a rectangular parallelepiped insulator 4 formed by laminating insulating sheets such as ceramic green sheets and firing them integrally. Further, external electrodes 6 and 7 for signal input / output are respectively formed on both end sides (right and left outer portions) of the insulator 4 so as to correspond to the signal wires 2 individually. However, it is electrically connected to the left and right electrode patterns 2a, 2b constituting each signal wiring 2 by soldering or the like.

  In addition, in the insulator 4, two stages of LC parallel resonant circuits 8 and 9 are formed in a cascade connection corresponding to each signal wiring 2. The two-stage LC parallel resonance circuits 8 and 9 constitute noise filters 3a to 3d for the signal wirings 2. As will be described later, the LC parallel resonance circuits 8 and 9 are configured such that their resonance frequencies are different from each other so that noise can be effectively removed in a plurality of frequency bands.

The preceding LC parallel resonance circuit 8 includes an input side coil 11, a floating capacitor 12 a that is inevitably generated when the input side coil 11 is formed, and an input side capacitor formed by a capacitance forming electrode 24 described later. 12 b, and capacitors 12 a and 12 b are connected in parallel to the input side coil 11. Further, the LC parallel resonance circuit 9 in the subsequent stage includes an output side capacitor 13, a floating capacitor 14 a inevitably generated when the output side coil 13 is formed, and an output side capacitor formed by a capacitance forming electrode 25 described later. 14 b, and capacitors 14 a and 14 b are connected in parallel to the output side coil 13.
In the first embodiment, the upper input coil 11 and the lower output coil 13 are also referred to as “front and rear coils 11, 13”. The front and rear coils 11 and 13 correspond to the “front and rear coils” in claims 1 and 2.

  The input side coil 11 is formed into a spiral coil by sequentially connecting a plurality of laminated coil conductors 16 in the insulator 4 through via holes 17. Similarly, the output side coil 13 is formed into a spiral coil by sequentially connecting a plurality of laminated coil conductors 18 in the insulator 4 through via holes 19. And each one end side of the input side coil 11 and the output side coil 13 is mutually connected in series via the via hole 20, and the other end side of the input side coil 11 and the output side coil 13 is respectively the input side and the output side. The external electrodes 6 and 7 are connected.

  Further, a shield electrode 23 is disposed between the front and rear coils, that is, between the input side coil 11 and the output side coil 13 so as to be orthogonal to the coil axis direction, and the insulator 4 is interposed between the shield electrode 23 and the shield electrode 23. The two capacitance forming electrodes 24 and 25 are formed to face each other. As a result, the shield electrode 23 and one capacitance forming electrode 24 constitute an input side capacitor 12b, and the shield electrode 23 and the other capacitance forming electrode 25 constitute an output side capacitor 14b.

  The shield electrode 23 is electrically connected to the via hole 20 that connects the upper input coil 11 and the lower output coil 13 in series, and is embedded in the insulator 4. Therefore, it is configured not to be externally connected. The shield electrode 23 is configured to have an area large enough to cover the diameters of the front and rear coils 11 and 13.

That is, the shield electrode 23 functions as one electrode for forming the capacitance of the capacitors 12b and 14b, and also functions as an electromagnetic shield so that the front and rear coils 11 and 13 are not magnetically coupled. It is configured. The capacitance forming electrodes 24 and 25 are electrically connected to the external electrodes 6 and 7 with one end portions thereof drawn out to the outer side of the insulator 4.
In order to prevent magnetic coupling between the front and rear coils 11 and 13, the area of the shield electrode 23 is set to cover at least half of the area of the diameter of the front and rear coils 11 and 13. Is preferred.

Then, the number of turns of the input side coil 11 and the output side coil 13 is adjusted in advance so that the resonance points of the LC parallel resonant circuits 8 and 9 are different from each other, or the inductance is changed, or the shield electrode 23 is opposed to this. By adjusting the opposing area and distance between the opposing capacitance forming electrodes 24 and 25 in advance to change the capacitance of the input-side capacitor 12b and the output-side capacitor 14b, noise at a frequency to be removed is surely obtained. The resonance points of the LC parallel resonance circuits 8 and 9 are adjusted so as to be removed.
When the number of turns of each coil 11 and 13 itself is adjusted and the resonance point can be sufficiently adjusted by the change in capacitance of the floating capacitors 12a and 14a generated accordingly, the capacitance forming electrode 24 is not necessarily required. , 25 are not required to form the capacitors 12b, 14b.

  Further, in the first embodiment, each of the noise filters 3a to 3d is such that the LC parallel resonance circuit 8 on the front stage side removes the noise on the low frequency side, and the LC parallel resonance circuit 9 on the rear stage side has the noise on the high frequency side. Each is set to remove. In this case, the resonance frequency in the LC parallel resonance circuit depends on the value of the product of inductance and capacitance (LC product), and the larger the LC product, the lower the resonance frequency and the lower frequency side. The LC product of the parallel resonant circuit 8 is larger than the LC product of the LC parallel resonant circuit 9 on the rear stage side.

  By the way, in the first embodiment, four noise filters 3a to 3d are arranged in an array corresponding to each signal wiring 2 individually, but on each side of these noise filters 3a to 3d. There is a difference in electromagnetic field distribution between the noise filters 3b and 3c adjacent to the other noise filters 3a and 3d and the noise filters 3a and 3d adjacent to the other noise filters 3b and 3c on only one side.

  Therefore, when adjusting the resonance points of the LC parallel resonance circuits 8 and 9 for the noise filters 3a to 3d as described above, it is assumed that each of the noise filters 3a to 3d exists independently. , 14b are adjusted, the resonance points in the LC parallel resonance circuits 8 and 9 of the noise filters 3a to 3d are shifted from predetermined values, and desired filter characteristics cannot be obtained.

  FIG. 4 shows the opposing areas and opposing distances of the capacitance forming electrodes 24 and 25 with respect to the shield electrode 23 between the noise filters 3a to 3d for the capacitors 12b and 14b before and after the LC parallel resonant circuits 8 and 9, respectively. Is a diagram showing the results of examining the frequency dependence characteristics (hereinafter referred to as IL characteristics) of the insertion loss (IL) of the noise filter 3a of the first element and the noise filter 3b of the second element when set to the same value in FIG. is there.

  As shown in FIG. 4, when the capacitance forming electrodes 24 and 25 are set to have the same facing area and facing distance for each of the noise filters 3 a to 3 d, 1 1 due to mutual interference of electromagnetic field distributions between adjacent noise filters. It can be seen that the position of the resonance frequency shifts between the IL characteristic of the noise filter 3a of the element (shown by a solid line in the figure) and the IL characteristic of the noise filter 3b of the second element (shown by a broken line in the figure). .

  That is, the noise filter 3b of the second element is adjacent to the noise filters 3a and 3c of the first element and the third element on both sides thereof, and the noise filter 3c of the third element is connected to the second element on both sides thereof. Since the noise filters 3b and 3d of the fourth element are adjacent to each other, the noise filters 3b and 3c of the second element and the third element are magnetically coupled as compared with the noise filters 3a and 3d of the first element and the fourth element. Therefore, the resonance point shifts to the high frequency side. On the other hand, since the noise filters 3a and 3d of the first element and the fourth element are adjacent to other noise filters only on one side, the magnetic coupling is smaller than that of the noise filters 3b and 3c of the second element and the third element. The resonance point shifts to the low frequency side.

  Therefore, in order to eliminate the influence of variations in filter characteristics due to the difference in electromagnetic field distribution between adjacent noise filters in this way, in the first embodiment, other noises on both sides of each of the noise filters 3a to 3d. The noise filters 3b and 3c of the second element and the third element adjacent to each other in the filter are compared with the noise filters 3a and 3d where the other noise filters are adjacent to only one side of the capacitors 12b and 14b. The capacitance is adjusted so as to increase the capacitance.

  That is, as shown in FIG. 5, for the noise filters 3b and 3c of the second element and the third element, the opposing area of the capacitance forming electrodes 24 and 25 constituting the capacitors 12b and 14b with respect to the shield electrode 23 is different. Therefore, the resonance point is shifted to the low frequency side by adjusting the capacitance to be larger. Thereby, it is possible to prevent the characteristic variation from occurring at the resonance point between the adjacent noise filters 3a to 3d.

When the capacitance is adjusted by changing the facing area of each capacitance forming electrode 24, 25 with respect to the shield electrode 23 as in the first embodiment, the capacitance is adjusted only by changing the shape of the print pattern. Therefore, there is no need to change the number of laminated insulating sheets, which is advantageous in that it can be realized at low cost.
The method of adjusting the capacitance is not limited to this, and the capacitance is adjusted by changing the opposing distance of the capacitance forming electrodes 24 and 25 with respect to the shield electrode 23, so that the noise filters 3 a to 3 d are mutually adjusted. It is also possible to configure so as to prevent variation in filter characteristics.

Next, a method for manufacturing the noise filter array of the first embodiment will be described.
FIG. 6 is an exploded perspective view showing an example of a manufacturing method of the noise filter array according to the first embodiment of the present invention.

  In manufacturing the noise filter array of Example 1, the insulating sheet 31 for forming the input side coil, the insulating sheet 32 for forming the output side coil, the insulating sheets 33 and 34 for forming the capacitor, and these For example, a predetermined number of interconnecting insulating sheets (not shown) provided with via holes, for example, are provided between the insulating sheets 31 to 34 as necessary. In addition, as each of these insulating sheets, a ceramic green sheet that is a dielectric is used.

  The coil forming insulating sheets 31 and 32 are respectively provided with four coil conductors 16 and 18 for forming the coils 11 and 13 corresponding to the four signal wirings 2. In addition, the coil conductors 16 and 18 are formed by changing the shape of each of the insulating sheets 31 and 32 so as to be spiral when the insulating sheets 31 and 32 are laminated. The coil conductors 16 and 18 have the same winding direction with respect to the direction of signal flow.

On the other hand, of the insulating sheets 33 and 34 for forming capacitors, the upper insulating sheet 33 is formed with the capacitance forming electrodes 24 and 25, and the lower insulating sheet 34 is formed with the shield electrode 23. ing.
The shield electrode 23 and the capacitance forming electrodes 24 and 25 are formed in parallel in order to correspond to the four signal wires 2 respectively. Further, among these insulating sheets 31 to 34, via holes 20 and the like are formed in predetermined insulating sheets so that the upper and lower sheets can be electrically connected. In this case, materials such as Ag—Pd and Ag are used for the coil conductors 16 and 18, the shield electrode 23, and the capacitance forming electrodes 24 and 25.

  Then, the insulating sheet 32 for forming the output side coil, the insulating sheets 33 and 34 for forming the capacitor, and the insulating sheet 31 for forming the input side coil are laminated in a predetermined number, and further, each insulating property is provided as necessary. After interposing an insulating sheet (not shown) for connection between the sheets 31 to 34, a laminate of these insulating sheets is integrally fired. Thereafter, external electrodes 6 and 7 are formed at both end portions (left and right outer portions) of the obtained insulator 4 so as to correspond to each signal wiring 2.

  Thereby, the noise filter array of Example 1 having the configuration as shown in FIG. 2 and the equivalent circuit as shown in FIG. 3 is obtained. That is, in this noise filter array, the coil conductors 16 and 18 are sequentially connected via the via holes 17, 19, and 20 to form the spiral input side coil 11 and output side coil 13, Each coil 11, 13 has one end connected to the external electrodes 6, 7 and the other end connected in series to each other via the via hole 20 and also connected to the shield electrode 23 in common. Further, the capacitance forming electrodes 24 and 25 are opposed to the shield electrode 23 through the insulator 4, and one end of each capacitance forming electrode 24 and 25 is connected to the external electrodes 6 and 7. A side capacitor 12b and an output side capacitor 14b are formed. As a result, the floating capacitor 12a and the input-side capacitor 12b are connected in parallel to the input-side coil 11, and the floating capacitor 14a and the output-side capacitor 14b are connected in parallel to the output-side coil 13. Configuration is realized.

  In the noise filter array of the first embodiment, the resonance points of the front and rear LC parallel resonance circuits 8 and 9 are included in each frequency band so that noise can be effectively removed in a plurality of frequency bands. By setting the resonance frequency in advance so as to eliminate the generated noise, it is possible to effectively remove the noise in two communication bands near 800 MHz and 2 GHz, which is necessary as a noise countermeasure for mobile phones, for example.

  In addition, since the shield electrode 23 is interposed between the input side coil 11 and the output side coil 13 and the magnetic coupling between the front and rear coils 11 and 13 is surely cut off, each LC parallel resonance circuit 8 and 9 is separated. It is possible to suppress and prevent fluctuations in the resonance frequency of the trap and increase the trap attenuation in each of a plurality of frequency bands. For example, it is possible to ensure a high attenuation of 20 dB or more for the resonance frequency on the high frequency side.

Further, in the noise filter array of the first embodiment, a plurality of noise filters 3a to 3d are integrally formed in one component, and the noise of each signal wiring 2 can be removed together. There is no need to provide a noise filter individually for each wiring 2, and the number of parts can be reduced.
Furthermore, since a plurality of LC parallel resonant circuits 8 and 9 are formed in a single insulator 4, there is little risk of cracking or peeling in the manufacturing process, and there is no structural defect and a highly reliable noise filter. An array can be provided.

  Furthermore, in the noise filter array of the first embodiment, among the noise filters 3a to 3d, the second and third element noise filters 3b and 3c adjacent to other noise filters on both sides are only on one side. Since the capacitances of the front and rear capacitors 12b and 14b are larger than those of the noise filters 3a and 3d in which other noise filters are adjacent to each other, the electromagnetic field distribution between the adjacent noise filters is mutually increased. By eliminating the influence of interference, it is possible to suppress variation in the resonance frequency characteristics between the noise filters 3a to 3d. As a result, it is possible to always remove noise efficiently in each of the noise filters 3a to 3d, and a high-performance noise filter array can be obtained.

  In the first embodiment, the capacitance forming electrodes 24 and 25 are provided with respect to the shield electrode 23 in both the LC parallel resonance circuits 8 and 9 before and after the noise filters 3a to 3d. However, depending on the required filter characteristics, it is not always necessary to form the output side capacitor 14b by providing the capacitance forming electrode 25 for the LC parallel resonance circuit 9 on the rear stage side for removing the noise on the high frequency side. Noise can be sufficiently removed by the side coil 13 and the floating capacitor 14a generated accordingly.

  That is, in the LC parallel resonance circuit, the resonance frequency depends on the value of the LC product, and the larger the LC product, the lower the resonance frequency and the lower the frequency side. In the case of the same LC product value, the larger the inductance L, the larger the attenuation amount, and the larger the ratio of the capacitance C, the narrower the attenuation band. Here, the setting of the resonance frequency on the high frequency side can be easily realized by adjusting the stray capacitance because the LC product may be small. In addition, since the stray capacitance may be small, the attenuation band can be widened. On the other hand, setting the resonance frequency on the low frequency side requires that the LC product be increased to some extent. In this case, if the value of the inductance L is set too large, a problem such as distortion of the signal waveform occurs. Therefore, there is a limit to increase the value of the inductance L. Therefore, in order to adjust the resonance frequency, It is necessary to increase the capacitance value to some extent. Further, in order to cover the limit of the inductance L, if the interlayer distance of the coil conductor is reduced or the insulating material is changed in order to increase the capacitance of the floating capacitor 12a, the characteristics are deteriorated and the reliability is reduced. There is a problem that the manufacturing cost increases due to an increase in man-hours. Therefore, the LC parallel resonance circuit 8 on the front stage side needs to positively secure the capacitance by the input side capacitor 12b without depending on the capacitance of the floating capacitor 12a.

  Therefore, depending on the required filter characteristics, for the LC parallel resonance circuit 8 on the front stage side, the capacitance forming electrode 24 is provided to form the input side capacitor 12b, and the input side coil 11 and the floating capacitor 12a connected in parallel to the input side coil 11 are formed. , In combination with the input-side capacitor 12b, a somewhat large LC product can be obtained and noise on the low-frequency side is removed. On the other hand, for the LC parallel resonance circuit 9 on the rear stage side, the capacitance forming electrode is omitted and the output side A combination of the coil 13 and the floating capacitor 14a connected in parallel to the coil 13 can be configured to remove high-frequency noise.

  Even in the case of adopting such a configuration, in order to remove the influence of variation in filter characteristics due to the difference in electromagnetic field distribution between adjacent noise filters, as shown in FIG. 7, among the noise filters 3a to 3d, Regarding the second and third noise filters 3b and 3c having other noise filters adjacent to both sides, the first and fourth noise filters 3a having other noise filters adjacent to only one side. , 3d, the capacitance adjustment is performed so that the opposing area of the capacitance forming electrode 24 with respect to the shield electrode 23 is formed larger and the capacitance of the input side capacitor 12b is increased.

FIG. 8 is a diagram showing a configuration of a main part of a noise filter array according to another embodiment (second embodiment) of the present invention, in which a direction identification mark is formed at a position facing the noise filter 3a of the first element. It is a figure which shows typically the magnitude | size of the capacitance formation electrode with respect to the shield electrode of each noise filter.
In FIG. 8, the portions denoted by the same reference numerals as those in FIGS. 1 to 6 indicate the same or corresponding portions as those in the noise filter array of the first embodiment.

  In the second embodiment, a direction identification mark 37 is formed at a position outside the insulator 4 where the external electrodes 6 and 7 are not formed. That is, the direction identification mark 37 is for indicating the directionality when the noise filter array is mounted on the circuit board 1. In the example shown in FIG. 8, the side to which the direction identification mark 37 is attached is the upper surface of the chip. In addition, it is indicated that the formation position of the direction identification mark 37 corresponds to the noise filter 3a of the first element.

  By the way, the direction identification mark 37 is often formed of an electrode material, and when such a direction identification mark 37 is formed, the magnetic flux of the noise filter 3a at a position facing the direction identification mark 37 is shielded. As a result, the inductance is reduced, and a difference occurs in the filter characteristics between the noise filter 3a and the other noise filters 3b to 3d, and the desired filter characteristics cannot be obtained.

  FIG. 9 shows the noise filter of the first element when the direction identification mark 37 is formed above the noise filter 3a of the first element among the four noise filters 3a to 3d arranged in an array. It is a figure which shows the result of having investigated the IL characteristic of 3a and noise filter 3d of the 4th element. In this case, the capacitance forming electrodes 24 and 25 of the noise filter 3a of the first element and the noise filter 3d of the fourth element are set to have the same opposing area and opposing distance with respect to the shield electrode 23.

  As shown in FIG. 9, the IL characteristic (indicated by a solid line) of the noise filter 3a of the first element located at the position facing the direction identification mark 37 and the fourth element not facing the direction identification mark 37 In the IL characteristic of the noise filter 3d (indicated by a broken line in the figure), it can be seen that the position of the resonance frequency is slightly shifted.

  Therefore, in the second embodiment, among the noise filters 3a to 3d, the noise filter 3a located at the position facing the direction identification mark 37 compensates for a decrease in inductance due to magnetic flux shielding by the direction identification mark 37. The capacitances of the capacitors 12b and 14b are adjusted.

  Specifically, as shown in FIG. 8, for the first noise filter 3 a located at the position facing the direction identification mark 37, the opposing area of each capacitance forming electrode 24, 25 with respect to the shield electrode 23 is set to 4 elements. Adjustment is made so that the capacitance becomes larger by making it larger than in the case of the noise filter 3d of the eye, and thereby the resonance point is shifted to the low frequency side. Accordingly, it is possible to prevent variation in characteristics at the resonance point between the noise filters 3a and 3d depending on the presence or absence of the direction identification mark 37.

  In the second embodiment, the capacitance is adjusted by changing the facing area of each capacitance forming electrode 24, 25 with respect to the shield electrode 23. However, the method for adjusting the capacitance is not limited to this, and each capacitance with respect to the shield electrode 23 is adjusted. It is also possible to adjust the capacitance by changing the facing distance between the capacitance forming electrodes 24 and 25.

  Thus, in the second embodiment, the capacitance of the capacitors 12b and 14b in the noise filter 3a at the position facing the direction identification mark 37 is larger than that of the noise filter 3d at the position not facing the direction identification mark 37. By adjusting the capacitance so as to increase, the inductance drop caused by the magnetic flux shielding by the direction identification mark 37 is compensated. Therefore, variation in filter characteristics between the noise filters 3a and 3d is suppressed, and each noise is reduced. It is possible to obtain a high performance noise filter array capable of always efficiently removing noise by the filters 3a to 3d.

In the second embodiment as well, since the four noise filters 3a to 3d are arranged in an array, the influence on the filter characteristics due to the magnetic coupling between adjacent noise filters is taken into consideration. In the noise filters 3b and 3c in which the other noise filters are adjacent to both sides, the capacitance of the capacitor is larger than the noise filters 3a and 3d in which the other noise filters are adjacent to only one side. It is necessary to adjust the capacitance, for example, to adjust the facing area of the capacitance forming electrodes 24 and 25 of the noise filters 3b and 3c of the second element and the third element as in the first embodiment. This is the same as in the first embodiment.
Since other configurations and operational effects are the same as in the case of the first embodiment, detailed description is omitted here to avoid duplication.

  In the second embodiment, the noise filter array in which the four noise filters 3a to 3d are arranged in the array shape has been described. For example, two noise filters are provided, and direction identification is performed at a position opposite to one noise filter. The present invention can also be applied to a noise filter array having a configuration with a mark.

In the second embodiment, the case where the direction identification mark 37 is formed only at the position facing one noise filter 3a has been described as an example. However, the direction identification mark 37 is formed across a plurality of noise filters. In this case, the present invention can be applied.
For example, as shown in FIG. 10, a direction identification mark 37 is provided across the noise filters 3a and 3b of the first element and the second element, and the direction identification mark 37 is provided to the noise filter 3b of the second element. In the case where the occupied area is large, the noise filters 3a to 3d are adjacent to each other as described in the first embodiment and the influence on the filter characteristics caused by the magnetic flux shielding of the direction identification mark 37. In consideration of both of the influence on the filter characteristics due to the magnetic coupling between the noise filters, the size of the opposing area of the capacitance forming electrodes 24 and 25 with respect to the shield electrode 23 of each of the noise filters 3a to 3d is determined as the second element. Noise filter 3b> noise filter 3c for the third element> noise filter 3a for the first element> noise filter 3d for the fourth element By adjusting as described above, it is possible to obtain a high-performance noise filter array capable of suppressing noise variation among the noise filters 3a to 3d and efficiently removing noise by the noise filters 3a to 3d. Can do.

  FIG. 11 shows the measurement of IL characteristics when the size of the facing area of the capacitance forming electrodes 24 and 25 with respect to the shield electrode 23 of each of the noise filters 3a to 3d is adjusted in the configuration shown in FIG. It is a figure which shows a result.

  As shown in FIG. 11, by adjusting the size of the facing area of the capacitance forming electrodes 24 and 25 for each of the noise filters 3a to 3d, variation in filter characteristics due to the direction identification mark 37 is suppressed, and good filter characteristics are obtained. It can be seen that is obtained.

  FIG. 12 is a cross-sectional view showing the structure of the noise filter array according to the third embodiment of the present invention. In FIG. 12, the portions denoted by the same reference numerals as those in FIGS. 1 to 3 indicate the same or corresponding portions as the noise filter array of the first embodiment.

  The noise filter array of the third embodiment basically has the same equivalent circuit as the equivalent circuit shown in FIG. However, in the noise filter array of the third embodiment, the input side capacitor 12b and the output side capacitor 14b are insulated from a part of each of the coil conductors 16 and 18 forming the input side coil 11 and the output side coil 13. The capacitance forming electrodes 24 and 25 are arranged to face each other through the body 4.

  That is, the input side capacitor 12b is configured by disposing the capacitance forming electrode 24 through the insulator 4 with respect to a part of the output side of the coil conductor 16 forming the input side coil 11, and the capacitance forming electrode 24. One end is drawn out to the outer side of the insulator 4 and is electrically connected to the external electrode 6. Thereby, the floating capacitor 12a (see FIG. 3) inevitably generated when the input coil 11 is formed and the input capacitor 12b formed by the capacitance forming electrode 24 are connected in parallel to the input coil 11. The preceding LC parallel resonance circuit 8 (see FIG. 3) is configured.

  Similarly, an output side capacitor 14b is configured by disposing a capacitance forming electrode 25 via an insulator 4 with respect to a part of the output side of the coil conductor 18 forming the output side coil 13, and the capacitance forming electrode is formed. One end of 25 is drawn out to the outer side of the insulator 4 and is electrically connected to the external electrode 7. As a result, the floating capacitor 14a (see FIG. 3) inevitably generated when the output coil 13 is formed and the output capacitor 14b formed by the capacitance forming electrode 25 are connected in parallel to the output coil 13. The rear LC parallel resonance circuit 9 (see FIG. 3) is configured.

  In the noise filter array of the third embodiment, similarly to the first embodiment, magnetic coupling between the coils 11 and 13 is prevented between the upper input coil 11 and the lower output coil 13. A shield electrode 23 is provided, and is electrically connected to a via hole 20 that connects the upper input side coil 11 and the lower output side coil 13 in series.

  In the noise filter array of the third embodiment, the number of turns of the input side coil 11 and the output side coil 13 is adjusted in advance to change the inductance, or the capacitance forming electrode 24 with respect to each of the coil conductors 16 and 18. , 25 and the like, and by adjusting the capacitance of the input side capacitor 12b and the output side capacitor 14b, the LC parallel resonance circuits 8 and 9 are adjusted to the resonance frequency at which noise is desired to be removed. The resonance point is adjusted.

Furthermore, since the four noise filters 3a to 3d are also arranged in an array in the third embodiment, the filter characteristics caused by the magnetic coupling between the adjacent noise filters are the same as in the first embodiment. In consideration of the influence on the noise, the noise filters 3b and 3c in which other noise filters are adjacent on both sides are compared with the noise filters 3a and 3d in which the other noise filters are adjacent on only one side. Adjusting the capacitance so as to increase the capacitance, for example, adjusting the opposing areas of the capacitance forming electrodes 24 and 25 of the noise filters 3b and 3c of the second and third elements as in the first embodiment. It is the same as in the case of the first embodiment that it is necessary to perform the above.
Further, when the direction identification mark is formed, as in the case of the second embodiment, the capacitance (facing area or facing) of the capacitance forming electrodes 24 and 25 with respect to the shield electrode 23 so as to compensate for the inductance reduction due to the direction identification mark. By adjusting the (distance), the influence on the filter characteristics due to the magnetic flux shielding of the direction identification mark 37 can be eliminated.
Since other configurations and operational effects are the same as those in the first embodiment, detailed description thereof is omitted here to avoid duplication.

  In the first to third embodiments, the noise filters 3a to 3d are provided with the LC parallel resonance circuits 8 and 9 in two stages before and after the signal wiring 2. However, the present invention is not limited to this. It is also possible to adopt a configuration in which LC parallel resonant circuits are connected in cascade to the wiring 2 in three or more stages. In that case, by setting the inductance and capacitance appropriately so as to achieve an appropriate resonance frequency for each LC parallel resonance circuit, it is possible to obtain a wider band noise removal characteristic.

  In the first to third embodiments, the noise filter array in which the four noise filters 3a to 3d are combined and integrated corresponding to the four signal wirings 2 formed on the circuit board 1 has been described. However, the noise filter array of the present invention is not limited to this, and can be widely applied when there are three or more noise filters.

  The present invention is not limited to the first to third embodiments in other respects, and various applications and modifications can be made within the scope of the invention.

According to the present invention, it is possible to easily and surely set the resonance frequency in a plurality of frequency bands, and it is possible to efficiently remove noise for each of the plurality of frequency bands. It is possible to provide a noise filter array capable of reliably preventing magnetic coupling and obtaining high attenuation at each resonance frequency.
Therefore, the noise filter array of the present invention can be suitably used for applications such as noise removal for mobile phones, and further widely used for other applications such as noise removal for other high-frequency circuits. Is possible.

It is a top view which shows the state which mounted the noise filter array concerning Example 1 of this invention on the circuit board. It is sectional drawing which follows the AA line of FIG. It is an equivalent circuit schematic of the noise filter array concerning Example 1 of this invention. In the noise filter array according to the first exemplary embodiment of the present invention, the first noise filter and two elements when the opposing area and opposing distance of each capacitance forming electrode with respect to the shield electrode are set to the same value between the noise filters It is a figure which compares and shows the result of having investigated the IL characteristic with the noise filter of eyes. It is a figure which shows typically the magnitude | size of the capacitance formation electrode with respect to the shield electrode for every noise filter of the noise filter array concerning Example 1 of this invention. It is a disassembled perspective view which shows the manufacturing method of the noise filter array concerning Example 1 of this invention. It is a figure which shows typically the correspondence of the magnitude | size of the capacitance formation electrode and shield electrode for every noise filter of the noise filter array concerning the modification of Example 1 of this invention. The figure which shows typically the magnitude | size of the capacitance formation electrode with respect to the shield electrode of each noise filter in the noise filter array of Example 2 of this invention in case a direction identification mark is formed in the opposing position of the noise filter of the 1st element. It is. Regarding the noise filter array according to the second embodiment of the present invention, of the four noise filters having the configuration shown in FIG. 8, the first noise filter having a direction identification mark and the fourth element having no direction identification mark. It is a figure which shows the result of having investigated the IL characteristic of this noise filter. The noise filter array according to Example 2 of the present invention schematically shows the size of the capacitance forming electrode with respect to the shield electrode of each noise filter when the direction identification mark is formed across the noise filters of the first element and the second element. FIG. The noise filter array according to Example 2 of the present invention shows the result of measuring the IL characteristics when the size of the facing area of the capacitance forming electrode with respect to the shield electrode is adjusted in each noise filter having the configuration shown in FIG. FIG. It is sectional drawing which shows the structure of the noise filter array concerning Example 3 of this invention.

DESCRIPTION OF SYMBOLS 1 Circuit board 2 Signal wiring 2a, 2b Electrode pattern 3a-3d Noise filter 4 Insulator 6,7 External electrode 8 LC parallel resonance circuit of the preceding stage 9 LC parallel resonance circuit of the latter stage 11 Input side coil 12a Floating capacitor 12b Input side capacitor 13 Output side coil 14a Floating capacitor 14b Output side capacitor 16, 18 Coil conductor 17, 19, 20 Via hole 23 Shield electrode 24, 25 Capacitance forming electrode 31, 32 Insulating sheet 33, 34, 35 Insulation sheet for forming capacitor Sheet 37 Direction identification mark

Claims (3)

On a circuit board on which a plurality of signal filters are formed, comprising at least three noise filters for noise removal, wherein each noise filter is integrated in an adjacent state by an insulator and arranged in an array. A noise filter array implemented and used,
On the outside of the insulator, a pair of left and right external electrodes connected to each signal wiring formed on the circuit board is formed,
A plurality of coils are arranged in series inside the insulator, and both ends of the series-connected coils are electrically connected individually to the pair of left and right external electrodes, respectively. In addition, a capacitor is connected in parallel to at least one of the plurality of coils, and the remaining coil has a resonance point due to the influence of a floating capacitor that is inevitably generated by forming the coil. A plurality of different stages of LC parallel resonant circuits are connected in cascade to form each noise filter.
Each of the coils is configured by connecting a plurality of laminated coil conductors via the insulator through via holes,
The capacitor has a shield electrode between the front and rear coils connected in series and electrically connected to both the coils, and one end of each of the external electrodes of the pair of left and right external electrodes. The other end side of the electrically connected capacitance forming electrode is configured to be opposed to each other via the insulator, and
To suppress the variation in characteristics of the noise filter adjacent to each other, among the noise filter, in the noise filter other noise filter on both sides is adjacent, the electric magnetic field distribution of each other adjacent noise filter to each other In order to eliminate the shift of the resonance frequency to the high frequency side due to mutual interference, the capacitance is adjusted so that the capacitance of the capacitor is larger than that of the noise filter in which another noise filter is adjacent to only one side. A noise filter array characterized by On a circuit board on which a plurality of signal filters are formed, comprising at least three noise filters for noise removal, wherein each noise filter is integrated in an adjacent state by an insulator and arranged in an array. A noise filter array implemented and used,
A pair of left and right external electrodes individually connected to each signal wiring formed on the circuit board is formed outside the insulator, and a position outside the insulator where the external electrode is not formed While a direction identification mark is formed on the
A plurality of coils are arranged in series inside the insulator, and both ends of the series-connected coils are electrically connected individually to the pair of left and right external electrodes, respectively. In addition, a capacitor is connected in parallel to at least one of the plurality of coils, and the remaining coil has a resonance point due to the influence of a floating capacitor that is inevitably generated by forming the coil. A plurality of different stages of LC parallel resonant circuits are connected in cascade to form each noise filter.
Each of the coils is configured by connecting a plurality of laminated coil conductors via the insulator through via holes,
The capacitor has a shield electrode between the front and rear coils connected in series and electrically connected to both the coils, and one end of each of the external electrodes of the pair of left and right external electrodes. The other end side of the electrically connected capacitance forming electrode is configured to be opposed to each other via the insulator, and
In order to suppress variation in characteristics of the noise filters adjacent to each other, among the noise filters, the magnetic flux generated by the direction identification mark is used for the noise filter located at a position facing the direction identification mark via the insulator. A noise filter array, wherein the capacitance of the capacitor is adjusted so as to compensate for a decrease in inductance caused by shielding.   In the noise filter array according to claim 1 or 2, in place of the capacitor configured by arranging the shield electrode and the capacitance forming electrode so as to face each other via the insulator, the coil conductor; A noise filter array, wherein a capacitor is formed by disposing a capacitance forming electrode, one end of which is electrically connected to the pair of left and right external electrodes, facing each other through the insulator.

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