JP4442154B2 - Multilayer array parts - Google Patents

Description

  The present invention relates to a multilayer array component, and more particularly to a multilayer array component used by being incorporated in an electronic apparatus.

  Conventionally, a multilayer inductor array in which a direction recognition mark made of a metal material is provided on an upper surface of a multilayer body is known (see Patent Document 1). The direction recognition mark is used to specify the direction of the multilayer inductor array having directionality, thereby avoiding mounting errors and manufacturing errors.

As shown in FIG. 6, the multilayer inductor array 51 includes four coils L <b> 1 to L <b> 4 in a multilayer body 52. The coils L1 to L4 are disposed so as to electrically connect the external electrodes 53a and 53b, the external electrodes 54a and 54b, the external electrodes 55a and 55b, and the external electrodes 56a and 56b. Has been. Further, a direction recognition mark 57 is formed at a position other than the central portion of the upper surface of the stacked body 52.
JP 2002-270432 A

  However, the conventional multilayer inductor array 51 is arranged with the direction recognition marks 57 offset in the longitudinal direction. Therefore, for example, there is a problem that the electrical characteristics of the coil L1 connected between the external electrodes 53a and 53b and the electrical characteristics of the coil L4 connected between the external electrodes 56a and 56b are different. This is because the magnetic flux generated by the coil L1 is blocked by the direction recognition mark 57 made of a metal material.

  In particular, when a nonmagnetic material is used for the base material of the laminate, each of the coils L1 to L4 functions as an air-core coil. Therefore, the amount of magnetic flux reaching the direction recognition mark 57 is increased, and the variation in electrical characteristics between the coils L1 to L4 is further increased.

  Accordingly, an object of the present invention is to provide a multilayer array component that can suppress variation in electrical characteristics between coils caused by a direction recognition mark made of a metal material.

In order to achieve the above object, a multilayer array component according to the present invention is a multilayer array component including a multilayer body in which a coil conductor and an insulating layer are stacked to incorporate a plurality of coils, and the stacking direction of the multilayer body in a direction perpendicular to the plurality of coils are arranged, in plan view, the direction identification mark made of a metal material provided on the upper surface of the laminate, are equally overlap so as to extend over the plurality of coils, the direction The recognition mark is not connected to any of the external electrodes provided on the side surface of the laminate .

Alternatively, the laminated array component according to the present invention is
(A) A laminated body constituted by stacking a coil portion in which a coil conductor and an insulating layer are stacked to incorporate a plurality of coils, and a capacitor portion in which a capacitor conductor and an insulating layer are stacked to incorporate a plurality of capacitors is provided. A stacked array component,
(B) A coil part is disposed on the upper part of the laminate, and a capacitor part is disposed on the lower part of the laminate.
(C) A plurality of coils and a plurality of capacitors are arranged in parallel in a direction orthogonal to the stacking direction of the laminate,
(D) In a plan view, the direction recognition marks made of a metal material provided on the upper surface of the laminate are uniformly overlapped so as to straddle a plurality of coils ,
(E) the direction recognition mark is not connected to any of the external electrodes provided on the side surface of the laminate ,
It is characterized by. The direction recognition mark has a rectangular shape, for example, and the ratio of the length in the long side direction to the length in the short side direction is set to 5: 1 or more.

  With the above configuration, since the direction recognition marks made of metal are overlapped so as to straddle a plurality of coils, variation in distribution of magnetic flux generated in each coil is suppressed, and variation in electrical characteristics between coils is reduced. . In particular, since the direction recognition mark overlaps each of the plurality of coils equally, the distribution of magnetic flux generated in each coil becomes equal, and variation in electrical characteristics between the coils is further reduced. Furthermore, in the stacking direction of the laminate, when the distance between each of the plurality of coils and the direction recognition mark is 100 μm or less, the effect of reducing variation in the electrical characteristics between the coils appears remarkably.

  Each of the plurality of coils is a spiral coil in which the direction of the coil axis is parallel to the stacking direction of the laminate, and in plan view, ½ or less of the inner area of each of the plurality of coils is a direction recognition mark. They are overlapping. With the above configuration, the amount of magnetic flux blocked by the direction recognition mark is suppressed, and a low-loss multilayer array component can be obtained.

  In the multilayer array component according to the present invention, since the direction recognition marks made of a metal material overlap so as to straddle a plurality of coils, the distribution of magnetic flux generated in each coil becomes equal. As a result, it is possible to suppress variations in electrical characteristics between the coils due to the direction recognition mark made of a metal material.

  Embodiments of the multilayer array component according to the present invention will be described below with reference to the accompanying drawings.

  1 is an exploded perspective view of the multilayer LC composite array component 1, FIG. 2 is an external perspective view thereof, and FIG. 3 is an electrical equivalent circuit diagram. The LC composite array component 1 includes a laminated body 35 in which rectangular ceramic sheets 2 to 12 made of a ceramic dielectric material such as barium titanate or a ceramic magnetic material such as ferrite are laminated and integrally fired. In addition, the first to fourth LC parts LC1 to LC4 are arranged at appropriate intervals.

  As shown in FIG. 1, the first LC component LC1 includes a spiral coil L1 configured by electrically connecting coil conductors 21a, 21b, 21c, and 21d in series via via holes 25, a capacitor conductor 26, The ground conductors 30 and 31 are composed of a capacitor C1 configured to face each other with the ceramic sheets 9 and 10 therebetween.

  In the second LC component LC2, a spiral coil L2 formed by electrically connecting coil conductors 22a, 22b, 22c, and 22d in series via via holes 25, a capacitor conductor 27, and ground conductors 30, 31 are opposed to each other. And the capacitor C2.

  In the third LC component LC3, a spiral coil L3 formed by electrically connecting coil conductors 23a, 23b, 23c, and 23d in series via via holes 25, a capacitor conductor 28, and ground conductors 30 and 31 are opposed to each other. And the capacitor C3 configured as described above.

  In the fourth LC component LC4, a spiral coil L4 configured by electrically connecting coil conductors 24a, 24b, 24c, and 24d in series via via holes 25, a capacitor conductor 29, and ground conductors 30, 31 are opposed to each other. And a capacitor C4 configured as described above.

  The adjacent LC components LC1 to LC4 are arranged in parallel in a direction orthogonal to the stacking direction of the ceramic sheets 2 to 12. In other words, the spiral coils L1 to L4 and the capacitors C1 to C4 are arranged in parallel in a direction orthogonal to the stacking direction of the ceramic sheets 2 to 12, respectively.

  The coil conductors 21 a to 24 a are formed on the upper surface of the ceramic sheet 4 with a predetermined interval. Similarly, coil conductors 21b to 24b, 21c to 24c, and 21d to 24d are formed on the upper surfaces of the ceramic sheets 5, 6, and 7 with a predetermined interval, respectively. The lead portions of the coil conductors 21 a to 24 a are exposed on the front side of the ceramic sheet 4, and the lead portions of the coil conductors 21 d to 24 d are exposed on the back side of the ceramic sheet 7.

  The direction recognition mark 32 is formed at a position other than the central portion of the upper surface of the ceramic sheet 2 (a position approaching the long side on the back side in this embodiment). The rectangular direction recognition mark 32 extends in the long side direction of the ceramic sheet 2. In the plan view, the ratio of the long side length to the short side length of the direction recognition mark 32 is 5 so that the direction recognition mark 32 preferably overlaps evenly so as to straddle the spiral coils L1 to L4. : 1 or higher.

  On the other hand, each of the capacitor electrodes 26 to 29 is formed on the upper surface of the ceramic sheet 10 so as to extend from the front side of the sheet toward the back side. The lead portions of the capacitor electrodes 26 to 29 are exposed on the front side of the ceramic sheet 10.

  The large-area ground conductors 30 and 31 are formed on the upper surfaces of the ceramic sheets 9 and 11, respectively. The lead portions of the ground conductors 30 and 31 are exposed on the left and right sides of the sheets 9 and 11.

  In this example, a dielectric material having a thickness of 25 μm was used as the ceramic sheets 2 to 8 in the coil portion, and a dielectric sheet having a thickness of 12.5 μm was used as the ceramic sheets 9 to 12 in the capacitor portion. The direction recognition mark 32, the coil conductors 21a to 24d, the capacitor conductors 26 to 29, and the ground conductors 30 and 31 are made of Ag, Pd, Cu, Au, alloys thereof, or the like, and are formed by a method such as screen printing. The via hole 25 is formed by making a hole in the via hole using a laser beam or the like and filling the hole with a conductive paste such as Ag, Pd, Cu, Au, or an alloy thereof.

  From the above configuration, the ceramic sheets 2 to 12 are stacked and pressure-bonded to form a ceramic laminate 35 having a rectangular parallelepiped shape as shown in FIG. A coil portion is disposed at the upper portion of the laminated body 35, and a capacitor portion is disposed at the lower portion. A direction recognition mark 32 made of a metal material is disposed on the upper surface of the laminate 35.

  Next, input / output external electrodes 36a, 37a, 38a, 39a and input / output external electrodes 36b, 37b, 38b, 39b are formed on the front and back side surfaces of the ceramic laminate 35, respectively. Ground external electrodes G are formed on the left and right end faces of the ceramic laminate 35.

  Each LC component LC1 to LC4 includes an input / output external electrode 36a and 36b, an input / output external electrode 37a and 37b, an input / output external electrode 38a and 38b, and an input / output external electrode 39a and 39b. Is electrically connected.

  Next, the ceramic laminate 35 is fired to obtain a sintered ceramic laminate. Further, nickel plating and Sn plating are performed on the surfaces of the external electrodes 36a to 39b and G to form a plating layer.

  In the laminated LC composite array component 1 having the above configuration, the directions of the coil axes of the helical coils L1 to L4 of the LC components LC1 to LC4 are parallel to the stacking direction of the ceramic sheets 2 to 12. Accordingly, the magnetic fluxes generated by the spiral coils L1 to L4 are directed upward from the upper end surfaces of the spiral coils L1 to L4.

  On the other hand, the direction recognition mark 32 and the helical coils L1 to L4 formed on the upper surface of the LC composite array component 1 are evenly overlapped with each of the helical coils L1 to L4 in plan view as shown in FIG. It has a portion S1 and a portion S2 that does not overlap. Since the direction recognition marks 32 made of a metal material are uniformly overlapped with the spiral coils L1 to L4, the magnetic fluxes directed upward from the upper end surfaces of the spiral coils L1 to L4 are equally blocked by the direction recognition marks 32, respectively. It is done. Thereby, the distribution of the magnetic flux generated in each of the spiral coils L1 to L4 becomes equal, and variation in electrical characteristics between the spiral coils L1 to L4 can be reduced.

  FIG. 5 is a graph showing the results of measuring the insertion loss characteristics of the LC components LC1 to LC4 of the LC composite array component 1 (see the solid line 40). Since all the LC components LC1 to LC4 exhibit substantially the same insertion loss characteristics, the solid line 40 is described as a single line. For comparison, only the direction recognition mark is shifted in the longitudinal direction of the laminated body 35 as shown in FIG. 6, and the internal structure of the laminated body 35 is similar to that of the LC composite array component 1 with respect to the insertion loss characteristic. Was measured. A dotted line 41a displays the insertion loss characteristic of the LC component LC1 on the side where the direction recognition mark is arranged, and a dotted line 41b displays the insertion loss characteristics of the remaining LC components LC2 to LC4. From the graph, it can be seen that the attenuation amount of the LC component LC1 on the side where the direction recognition mark is arranged is smaller than the remaining LC components LC2 to LC4.

  By the way, it is preferable that the direction recognition mark 32 overlaps with 1/2 or less of the inner area S of each of the spiral coils L1 to L4 in a plan view. This is because when the overlap between the direction recognition mark 32 and each of the spiral coils L1 to L4 exceeds 1/2 of the inner area S, the ratio of the direction recognition mark 32 blocking the magnetic flux generated by the spiral coils L1 to L4 is increased. This is because the eddy current loss easily occurs in the direction recognition mark 32 due to the rapid increase. The inner area S of the spiral coils L1 to L4 means the area of the inner cross section of the spiral coil, and is a portion (S1 + S2) indicated by hatching in FIG.

  Moreover, the variation reduction effect of the electrical characteristics between the spiral coils L1 to L4 is such that the distance between the upper end surface of the spiral coils L1 to L4 and the direction recognition mark 32 is 100 μm or less in the sheet stacking direction of the laminate 35. It is particularly effective in some cases. This is because, in the case of the conventional laminated LC composite array component provided with the direction recognition mark 57 (see FIG. 6), when the distance between the spiral coils L1 to L4 and the direction recognition mark 57 becomes 100 μm or less, the direction recognition mark This is because the amount 57 interrupts the magnetic flux generated by the spiral coil L1 increases rapidly. That is, the magnetic flux distribution of the spiral coil L1 on the side where the direction recognition mark 57 is arranged is very different from the magnetic flux distribution of the remaining spiral coils L2 to L3.

  In addition, this invention is not limited to the said Example, It can change variously within the range of the summary.

  For example, the laminated array component may be a π-type LC filter array component, a T-type LC filter array component, or an LCR composite array component having a resistor R. Also, it may be a multilayer inductor array component.

  In addition, although the above embodiment has been described as an example of individual products, it goes without saying that in the case of mass production, it may be manufactured in a state of a mother laminated block including a plurality of laminated array components.

  Moreover, when manufacturing a laminated array component, it is not necessarily limited to the construction method of integrally firing after stacking ceramic sheets provided with conductors and via holes. A ceramic sheet fired in advance may be used. Moreover, you may manufacture a laminated array component with the construction method demonstrated below. That is, a paste-like insulating material is applied by printing or the like to form an insulating layer, and then a paste-like conductive material is applied on the insulating layer to form conductors and via holes. Further, a paste-like insulating material is applied from above to form an insulating layer. By sequentially applying in this manner, an LC composite array component having a laminated structure is obtained.

1 is an exploded perspective view showing an embodiment of a multilayer array component according to the present invention. The perspective view which shows the external appearance of the laminated array component shown in FIG. FIG. 3 is an electrical equivalent circuit diagram of the multilayer array component shown in FIG. 2. The top view which shows the positional relationship of a mark and a coil. The graph which shows the insertion loss characteristic of the multilayer array component shown in FIG. The perspective view which shows the conventional multilayer inductor array.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Laminated LC composite array component 2-12 ... Ceramic sheet 21a-21d, 22a-22d, 23a-23d, 24a-24d ... Coil conductor 26, 27, 28, 29 ... Capacitor conductor 30, 31 ... Ground conductor 32 ... Direction recognition mark 35 ... Laminated body C1-C4 ... Capacitor L1-L4 ... Spiral coil LC1-LC4 ... LC component S ... Inner area of coil S1 ... Overlapping part

Claims (6)

A laminated array component comprising a laminated body in which a coil conductor and an insulating layer are laminated to incorporate a plurality of coils,
In the direction orthogonal to the stacking direction of the laminate, the plurality of coils are juxtaposed,
In plan view, direction recognition marks made of a metal material provided on the upper surface of the laminate are uniformly overlapped across the plurality of coils ,
The direction recognition mark is not connected to any of the external electrodes provided on the side surface of the laminate ,
A laminated array component characterized by A multilayer array comprising a laminate formed by stacking a coil section in which a coil conductor and an insulating layer are stacked to incorporate a plurality of coils, and a capacitor section in which a capacitor conductor and an insulating layer are stacked to incorporate a plurality of capacitors. Parts,
While disposing the coil part on the upper part of the laminate, disposing the capacitor part on the lower part of the laminate,
In the direction orthogonal to the stacking direction of the stacked body, the plurality of coils and the plurality of capacitors are arranged in parallel,
In plan view, direction recognition marks made of a metal material provided on the upper surface of the laminate are uniformly overlapped across the plurality of coils ,
The direction recognition mark is not connected to any of the external electrodes provided on the side surface of the laminate ,
A laminated array component characterized by   3. The multilayer array component according to claim 1, wherein the direction recognition mark overlaps each of the plurality of coils equally. 4.   4. The multilayer array component according to claim 1, wherein a distance between each of the plurality of coils and the direction recognition mark is 100 μm or less in a stacking direction of the stacked body. .   The lamination according to any one of claims 1 to 4, wherein the direction recognition mark has a rectangular shape, and the ratio of the length of the long side to the length of the short side is 5: 1 or more. Mold array parts.   Each of the plurality of coils is a spiral coil whose coil axis direction is parallel to the stacking direction of the laminate, and in plan view, ½ or less of the inner area of each of the plurality of coils is the direction recognition. The multilayer array component according to any one of claims 1 to 5, wherein the stacked array component overlaps with a mark.

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