JP5007395B2 - 立体光源体 - Google Patents
立体光源体 Download PDFInfo
- Publication number
- JP5007395B2 JP5007395B2 JP2006173598A JP2006173598A JP5007395B2 JP 5007395 B2 JP5007395 B2 JP 5007395B2 JP 2006173598 A JP2006173598 A JP 2006173598A JP 2006173598 A JP2006173598 A JP 2006173598A JP 5007395 B2 JP5007395 B2 JP 5007395B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light source
- led element
- led
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
B・・・・・・・・・回路基板
P・・・・・・・・・照明装置
1・・・・・・・・・LED素子
1a・・・・・・・・集光レンズ
2・・・・・・・・・ベース
2a1・・・・・・・反射面
4・・・・・・・・・レンズ(光学ユニット)
21・・・・・・・・構成面
21a〜21e・・・LED支持面
21f・・・・・・・底面
22・・・・・・・・電力供給回路
h・・・・・・・・・光軸(光の反照射側)
Claims (8)
- 異なる方向に光を照射して使用可能な光源体であって、
PN接合半導体であり実際に発光する部材であるLED素子と、立体形状を成し且つ前記LED素子を複数支持するベースとを具備し、
前記立体形状を構成する構成面のうち、互いに異なる方向を向き且つ光の照射側で法線同士は交差しない関係にある複数の構成面を、前記LED素子を支持するためのLED支持面として設定しており、前記LED支持面として設定される前記構成面に、他の部材に取り付けられる面である底面の対向面が含まれており、
前記各LED素子の光軸同士が、光の反照射側の略一点で交わるものであり、
前記ベースが、垂直断面形状が略正方形の切頭四角錐体を成す中実ブロック状であって、前記底面以外の面を前記LED支持面としており、前記ベースの底面が放熱部材に接触して設けられることを特徴とする光源体。 - 前記LED素子が、前記LED支持面ごとに1つずつ設けられている請求項1記載の光源体。
- 前記LED素子に電力を供給するための電力供給回路を、前記ベースに一体的に形成していることを特徴とする請求項1又は2記載の光源体。
- 前記LED素子に電力を供給するための電力供給回路を、前記ベースに取付可能な回路基板に形成していることを特徴とする請求項1乃至3いずれか記載の光源体。
- 前記LED素子が、エピタキシャル面である上面側から両電極をとり且つ天地をひっくり返した状態で実装するフリップチップ型であることを特徴とする請求項1乃至4いずれか記載の光源体。
- 前記ベースに、LED素子がその光軸と異なる方向に照射する光を、前記光軸方向と略一致させる向きに反射させる反射面を設けていることを特徴とする請求項1乃至5いずれか記載の光源体。
- 前記LED素子ごとに、該LED素子がその光軸と異なる方向に照射する光を、前記光軸方向と略一致させる向きに導かせる集光レンズを設けていることを特徴とする請求項1乃至6いずれか記載の光源体。
- 請求項1乃至7いずれか記載の光源体を少なくとも用いて成る照明装置であって、
前記LED素子の照射側に、その照射光を収束又は発散させるためのレンズを備えて成ることを特徴とする照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006173598A JP5007395B2 (ja) | 2006-06-23 | 2006-06-23 | 立体光源体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006173598A JP5007395B2 (ja) | 2006-06-23 | 2006-06-23 | 立体光源体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008004415A JP2008004415A (ja) | 2008-01-10 |
JP5007395B2 true JP5007395B2 (ja) | 2012-08-22 |
Family
ID=39008628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006173598A Expired - Fee Related JP5007395B2 (ja) | 2006-06-23 | 2006-06-23 | 立体光源体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5007395B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018062299A (ja) * | 2016-10-14 | 2018-04-19 | 矢崎総業株式会社 | 照明装置および車室内照明装置 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8002435B2 (en) * | 2008-06-13 | 2011-08-23 | Philips Electronics Ltd Philips Electronique Ltee | Orientable lens for an LED fixture |
WO2010043100A1 (en) * | 2008-10-16 | 2010-04-22 | Yung Pun Cheng | Wide-angle led lighting lamp with high heat-dissipation efficiency and uniform illumination |
JP2010147446A (ja) | 2008-12-22 | 2010-07-01 | Panasonic Electric Works Co Ltd | 発光装置 |
JP5394730B2 (ja) * | 2008-12-26 | 2014-01-22 | 東京エレクトロン株式会社 | アニール装置およびアニール方法 |
JP2011049001A (ja) * | 2009-08-26 | 2011-03-10 | Hibino Kk | 照明装置 |
JP5330944B2 (ja) * | 2009-09-18 | 2013-10-30 | パナソニック株式会社 | 発光装置 |
KR101039881B1 (ko) * | 2009-12-21 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 그를 이용한 라이트 유닛 |
WO2012002029A1 (ja) * | 2010-07-01 | 2012-01-05 | シャープ株式会社 | 照明装置、表示装置、テレビ受信装置およびled光源 |
JP2012142453A (ja) * | 2010-12-29 | 2012-07-26 | Citizen Electronics Co Ltd | 半導体発光装置 |
JP5675423B2 (ja) * | 2011-02-24 | 2015-02-25 | シチズンホールディングス株式会社 | 照明装置 |
CN102734645B (zh) * | 2011-04-01 | 2016-11-23 | 上海广茂达光艺科技股份有限公司 | Led投影灯具 |
JP2013069837A (ja) * | 2011-09-22 | 2013-04-18 | Citizen Electronics Co Ltd | 発光モジュール |
TW201416771A (zh) * | 2012-10-19 | 2014-05-01 | Unity Opto Technology Co Ltd | 背光模組 |
CN104180337B (zh) * | 2013-05-21 | 2018-09-14 | 海洋王(东莞)照明科技有限公司 | Led泛光灯 |
KR20160072168A (ko) | 2013-11-13 | 2016-06-22 | 정해운 | 발광 장치 |
JP2015149198A (ja) * | 2014-02-06 | 2015-08-20 | Ipf株式会社 | Ledバルブ |
JP6418042B2 (ja) * | 2015-04-08 | 2018-11-07 | 日亜化学工業株式会社 | 発光装置及び光源装置 |
JP6804241B2 (ja) * | 2016-09-06 | 2020-12-23 | 国立大学法人埼玉大学 | 水処理装置及び紫外線照射装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62135306U (ja) * | 1986-02-19 | 1987-08-26 | ||
JP3830121B2 (ja) * | 1999-06-10 | 2006-10-04 | 株式会社 ニューコム | 物体検出用光学ユニット及びそれを用いた位置座標入力装置 |
JP4276758B2 (ja) * | 1999-12-09 | 2009-06-10 | 仗祐 中田 | 球状半導体素子を用いた発電装置および球状半導体素子を用いた発光装置 |
JP2002184209A (ja) * | 2000-12-19 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 照明装置 |
US7048412B2 (en) * | 2002-06-10 | 2006-05-23 | Lumileds Lighting U.S., Llc | Axial LED source |
JP2005276466A (ja) * | 2004-03-23 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 電球形led光源 |
JP4757477B2 (ja) * | 2004-11-04 | 2011-08-24 | 株式会社 日立ディスプレイズ | 光源ユニット、それを用いた照明装置及びそれを用いた表示装置 |
-
2006
- 2006-06-23 JP JP2006173598A patent/JP5007395B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018062299A (ja) * | 2016-10-14 | 2018-04-19 | 矢崎総業株式会社 | 照明装置および車室内照明装置 |
Also Published As
Publication number | Publication date |
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JP2008004415A (ja) | 2008-01-10 |
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