JP5005316B2 - 受光モジュール - Google Patents
受光モジュール Download PDFInfo
- Publication number
- JP5005316B2 JP5005316B2 JP2006290786A JP2006290786A JP5005316B2 JP 5005316 B2 JP5005316 B2 JP 5005316B2 JP 2006290786 A JP2006290786 A JP 2006290786A JP 2006290786 A JP2006290786 A JP 2006290786A JP 5005316 B2 JP5005316 B2 JP 5005316B2
- Authority
- JP
- Japan
- Prior art keywords
- resin package
- light receiving
- shield cover
- insertion direction
- receiving module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 claims description 54
- 239000011347 resin Substances 0.000 claims description 54
- 238000003825 pressing Methods 0.000 claims description 43
- 238000003780 insertion Methods 0.000 claims description 24
- 230000037431 insertion Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004049 embossing Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Details Of Aerials (AREA)
Description
x 挿入方向
1 基板
2 受光素子
3 ICチップ
4 樹脂パッケージ
4a レンズ
5 シールドカバー
5a 開口
11 メイン端子
50 天板
51 背板
52,53 押圧板
52a,53a 端部
52b 傾斜辺
52e,53eエンボス
54 側板
54e エンボス
55 グランド端子
Claims (3)
- 基板と、
上記基板に搭載された受光素子と、
上記受光素子を覆う樹脂パッケージと、
一方向に開いた開口を有しており、この開口から上記樹脂パッケージが挿入されているシールドカバーと、
を備えた受光モジュールであって、
上記シールドカバーは、互いに異なる方向であり、かついずれもが上記樹脂パッケージの挿入方向に対して直角である方向に向けて上記樹脂パッケージを押圧する2つの押圧板を有しており、
上記2つの押圧板は、上記挿入方向視において互いに隣接し、かつ上記挿入方向における位置が互いに異なる端部を有していることを特徴とする、受光モジュール。 - 上記2つの押圧板の上記端部は、上記樹脂パッケージが挿入されていない状態において、上記挿入方向視において互いに重なっている、請求項1に記載の受光モジュール。
- 上記シールドカバーのうち上記2つの押圧板の少なくとも一方の上記端部に繋がる辺は、上記挿入方向に対して傾斜している、請求項1または2に記載の受光モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006290786A JP5005316B2 (ja) | 2006-10-26 | 2006-10-26 | 受光モジュール |
US11/973,031 US7608816B2 (en) | 2006-10-26 | 2007-10-05 | Light receiving module incorporating shield cover |
CNB2007101674853A CN100541796C (zh) | 2006-10-26 | 2007-10-25 | 光接收模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006290786A JP5005316B2 (ja) | 2006-10-26 | 2006-10-26 | 受光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008108933A JP2008108933A (ja) | 2008-05-08 |
JP5005316B2 true JP5005316B2 (ja) | 2012-08-22 |
Family
ID=39328989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006290786A Expired - Fee Related JP5005316B2 (ja) | 2006-10-26 | 2006-10-26 | 受光モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US7608816B2 (ja) |
JP (1) | JP5005316B2 (ja) |
CN (1) | CN100541796C (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150198484A1 (en) * | 2012-07-06 | 2015-07-16 | Pricer Ab | Electronic shelf label with an optical arrangement |
CN106501903B (zh) * | 2015-09-08 | 2019-07-02 | 许多 | 光电转换器及其制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4902046B2 (ja) * | 2000-12-15 | 2012-03-21 | ローム株式会社 | 赤外線データ通信モジュールおよびその製造方法 |
JP4285966B2 (ja) * | 2002-09-27 | 2009-06-24 | 三洋電機株式会社 | カメラモジュール |
JP2004335881A (ja) | 2003-05-09 | 2004-11-25 | Sharp Corp | 赤外線データ通信モジュールの製造方法 |
JP4238126B2 (ja) * | 2003-12-25 | 2009-03-11 | ローム株式会社 | 半導体モジュール |
JP4619816B2 (ja) * | 2005-02-21 | 2011-01-26 | ローム株式会社 | 光通信モジュールおよびその製造方法 |
JP4794874B2 (ja) * | 2005-03-07 | 2011-10-19 | ローム株式会社 | 光通信モジュール |
-
2006
- 2006-10-26 JP JP2006290786A patent/JP5005316B2/ja not_active Expired - Fee Related
-
2007
- 2007-10-05 US US11/973,031 patent/US7608816B2/en active Active
- 2007-10-25 CN CNB2007101674853A patent/CN100541796C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7608816B2 (en) | 2009-10-27 |
CN101170108A (zh) | 2008-04-30 |
US20080099670A1 (en) | 2008-05-01 |
JP2008108933A (ja) | 2008-05-08 |
CN100541796C (zh) | 2009-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10021283B2 (en) | Light shielding members for solid state image capturing apparatus, camera module and electronic device | |
US20030124773A1 (en) | Optical module, circuit board and electronic device | |
US20060202296A1 (en) | Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties | |
TW201417326A (zh) | 光耦合器 | |
WO2006075381A1 (ja) | カメラモジュールおよび半導体装置 | |
JP2006261380A (ja) | 光通信モジュール | |
JP4823729B2 (ja) | 光通信モジュール | |
JP5005316B2 (ja) | 受光モジュール | |
JP4238126B2 (ja) | 半導体モジュール | |
JP2008277488A (ja) | 受発光モジュール | |
JP2007194381A (ja) | 受光モジュール | |
US6118165A (en) | Photodiode and optical transmitter-receiver | |
JP2009016369A (ja) | 受光モジュール | |
CN207557972U (zh) | 光学指纹识别模组及电子装置 | |
JP2006261302A (ja) | 光通信モジュール | |
JPH02137275A (ja) | ホトカプラ | |
JP4998689B2 (ja) | 光学機器モジュール | |
JP4708014B2 (ja) | 光半導体装置 | |
JP2007087990A (ja) | 受光モジュール | |
JP2007081073A (ja) | 受光モジュール | |
JP4036850B2 (ja) | 受光モジュール | |
JP2007087991A (ja) | 受光モジュール | |
US20080230679A1 (en) | Integrated photoreceptor circuit and optoelectronic component inlcuding the same | |
CN117059642A (zh) | 影像传感模块 | |
JP4675653B2 (ja) | 半導体モジュールの製造方法および半導体モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090907 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110928 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120522 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120523 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150601 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5005316 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |