JP4989138B2 - Infrared detector - Google Patents

Description

  The present invention relates to an infrared detector used for human body detection and the like.

In general, a so-called pyroelectric element is often used as an infrared detecting element for detecting a human body by the amount of change in infrared rays. Infrared detectors using such pyroelectric elements are used for load control such as lighting in addition to detection of security entry. As this infrared detector, for example, as shown in FIG. 14, the infrared rays generated by the movement of the human body are condensed on the light receiving portion of the pyroelectric element X by the lens 100, and the pyroelectric element X generated according to the change in infrared rays after converting the signal due to the polarization in the current-voltage conversion circuits 101 into a voltage signal, a band-pass selectively amplify the predetermined frequency band amplifier 102, advance window comparator array capacitor 103 or we have set the threshold " H "," L "level has a type that outputs a detection signal of, is the detection signal output this window comparator array capacitor 103 or we are used to load the control.

By the way, in the conventional infrared detector, as shown in FIG. 15A, both ends of the pyroelectric element X are bridged between the convex support portions 105 and 105 made of electronic circuit elements provided on the circuit board 104. The pyroelectric element X is floated from the circuit board 104 and a space Y for thermal insulation is provided between the light receiving surface of the pyroelectric element X and the back circuit board 104. The pyroelectric element X receives infrared rays. In some cases, the sensitivity of the pyroelectric element X is increased by preventing infrared energy from escaping. The pyroelectric element X of charges for very small, must be very large amplification, with its influence, the slightest noise on the output of the pyroelectric element X, the subsequent bandpass amplifier 102 As a result, noise is also amplified, making it difficult to distinguish between the original signal and noise. Therefore, as shown in FIG. 15A, a package structure in which the pyroelectric element X and the circuit board 104 are sealed in a container made of a metal cap (CAN) 106 and a stem 107 to provide a shield is provided. Noise is cut off (for example, Patent Document 1). Naozu 15 (a) in 108 output terminal, 109 is an infrared passing window of cap 106, optical filter 110 bandpass type for passing only infrared predetermined frequency range is mounted in the infrared ray passage window 109 ing.

By the way, since the infrared detector having the package structure disclosed in Patent Document 1 has only an impedance conversion circuit inside, it has a configuration as shown in FIG. In addition to the infrared detector in which the pyroelectric element X is housed in a container composed of a cap 106 and a stem 107 shown in b), an external electronic circuit element 113 such as a lens 112, a capacitor, a resistor, and an IC chip is mounted. above optical filter 110 and window comparator array data 103, and further the timer, it is general that the output amplifier is used is added.

On the other hand, as shown in FIGS. 16A to 16C, a three-dimensional circuit block (MID substrate) 200 made of a resin molded product has a pyroelectric element X, a bandpass amplifier, and an electronic circuit constituting a window comparator. There has been provided an infrared detector that is miniaturized by mounting the element 201 and enclosing and sealing it in a container composed of a cap 106 and a stem 107 (for example, Patent Document 2). The three-dimensional circuit block 200 used for the infrared detector is a vertically long block that has a vertical surface and a vertical surface, and has an electronic circuit element 201 mounted on the vertical surface. In FIG. 2, a recess 202 for forming a space for thermal insulation of the pyroelectric element X is integrally formed, and the pyroelectric element X is bridged between both ends of the recess 202.
JP-A-5-332829 (FIG. 1, paragraph numbers 0015 to 1006) Japanese Patent No. 3211074 (FIGS. 6 to 13 and paragraph numbers 0018 to 0021)

In the case of the infrared detector disclosed in the above-mentioned Patent Document 1, the light receiving surface of the pyroelectric element X is arranged on the circuit board 104 so that the infrared energy does not escape when the pyroelectric element X receives the infrared light. Although the support part 105 which floats more is provided, since this support part 105 is a separate component from the circuit board 104, a separate component mounting process is required, which causes a cost increase. Further, when the support part 105 is provided as a separate part, there is a problem that the height of the support part 105 changes due to an attachment error, and the thermal insulation effect of the pyroelectric element X varies. In the case of the infrared detector of Patent Document 1, requires an external circuit such as in FIG. 14, the circuit scale because it is configured to implement the order of electron circuitry element 1 13 to a large printed circuit board 111 is very large There is a problem that it is not possible to respond to the recent demands for miniaturization and thinning, and it becomes easy to be affected by electromagnetic noise when circuit parts are externally attached. It was a factor. In order to prevent this, there is a problem that it is necessary to attach a large shield plate to the external circuit portion.

  On the other hand, the one using the three-dimensional circuit block 200 like the infrared detector disclosed in Patent Document 2 can solve the problems of the infrared detector disclosed in Patent Document 1 to some extent.

  That is, since the recess 202 for directly floating the pyroelectric element X is formed in the three-dimensional circuit block 200, the number of parts can be reduced and the cost can be reduced, and the electronic circuit element 201 is stored in a container made of a metal cap and stem. By using the CAN package, it is possible to reduce the size, and it is also possible to reduce the size of the circuit unit by making the bandpass amplifier and the window comparator into an IC. In addition, since the distance between the pyroelectric element X and the input part of the bandpass amplifier can be shortened, external noise is less likely to enter than a method of amplifying with an external component using a printed circuit board, and the configuration is strong against noise. Further, by housing and shielding the pyroelectric element X and the entire circuit unit in a container made of a metal cap and stem, there is an advantage that a configuration extremely resistant to external noise can be realized.

  However, in the infrared detector disclosed in Patent Document 2, an electronic component or an IC is mounted on a circuit portion in which the three-dimensional circuit block 200 stands vertically and forms a front surface and a back surface. Therefore, it is inevitable that the package becomes vertically long.

  For this reason, the thickness of a device to which the infrared detector disclosed in Patent Document 2 is restricted is limited, making it difficult to reduce the thickness, and the demand for further miniaturization and reduction in thickness cannot be met. In addition, when the three-dimensional circuit block 200 is downsized to reduce the overall size, the following two problems occur.

  First, there is a problem of lack of mounting space. That is, in the above-described three-dimensional circuit block 200, a portion where the front surface and the back surface are formed upright by the subordinate can be taken as a circuit space. However, if the three-dimensional circuit block 200 is simply reduced in size, The space for mounting circuit components cannot be secured, and downsizing cannot be realized.

  The second problem is due to the fact that the distance between the output of the pyroelectric element X and the amplified subsequent stage output is close. In other words, since the change in the charge of the pyroelectric element X is very weak, the subsequent circuit amplifies the femtoampere level current change to several hundred millivolt level, while supplying power to the power supply unit for power supply. In addition to the generated voltage, extraneous (disturbance) noise such as superimposed noise from a commercial power supply and radiation noise from a mobile phone also rides. It is necessary to sufficiently separate the pyroelectric element X from the final stage output so that a slight signal of these external noises does not affect the pyroelectric element X. However, when the distance is about 1 mm, there arises a problem that a phenomenon such as an oscillation phenomenon or a deterioration in frequency characteristics occurs due to capacitive coupling between the pyroelectric element X and the final output stage.

  The present invention has been made in view of the above points, and the object of the present invention is to easily form a space for thermal insulation of the infrared detection element, and to reduce the number of processes and the manufacturing process. It is an object of the present invention to provide a thin, small and low-cost infrared detector that can be easily inspected.

In order to achieve the above-described object, in the invention of claim 1, an infrared ray that houses a circuit block in which a heat ray detection element and an electronic circuit element are mounted in a package container composed of a stem and a cap deposited on the stem. In the detector
The circuit block is formed integrally with a concavo-convex shape portion on an upper surface, and the convex portions of the concavo-convex shape portion are portions that support and electrically join both ends of the heat ray detection element, and the concave portion is defined as the position of the heat ray detection element. Forming a first resin layer as a thermal insulation space portion provided below the heat ray detection portion, a circuit wiring pattern, and embedding a circuit board on which the electronic circuit element is mounted together with the electronic circuit element; A second resin layer provided below the first resin layer, and a shield layer provided between the first resin layer and the second resin layer and having a specific potential or a ground potential are integrally provided,
Any one of the terminal pins for power supply, ground, and detection signal output projecting from the stem into the cap penetrates from the lower surface of the circuit block to the upper surface, and projects the upper end portion. Is bonded to the circuit portion on the upper surface of the circuit block.

  According to the first aspect of the present invention, the space for forming the heat insulating layer of the circuit block and the infrared detection element can be easily formed integrally with the first resin layer, and the electronic circuit component is made of the second resin. By embedding in the layer by integral molding, it becomes possible to secure a space (mounting area) for mounting electronic circuit elements that has been an obstacle to downsizing in the standing direction, and can be significantly thinned and downsized. In addition, as a circuit board on which electronic circuit elements are mounted, a printed circuit board that can form a fine fine pitch circuit by a general circuit board forming method or a board that uses a thin copper foil can be used. The circuit block including the circuit board can be made into a multilayer board structure that can be easily manufactured by pressing. In addition, the connection of the terminal pin to the circuit part of the circuit block is mounted on the heat ray detection element. Since it is performed on the upper surface of the same circuit block, mounting and bonding of the heat ray detection element to the circuit block and bonding of the terminal pin to the circuit part can be performed in the same process, and the number of processes can be reduced, and the bonding state is inspected Since it is possible to perform the inspection visually, the inspection in the manufacturing process becomes easy, and there is an effect that it can be manufactured at a low cost, and the influence of external noise can be reduced by the shield layer.

  According to a second aspect of the present invention, in the first aspect of the present invention, a potential is defined between the power supply terminal pin, the detection signal output terminal pin, or both, and the heat ray detection element. Alternatively, a shield portion having a ground potential is interposed.

  According to the second aspect of the present invention, capacitive coupling between the heat ray detection element and the detection signal output terminal pin or the power supply terminal pin or both can be prevented by the shielding effect by the shield part, and as a result, the sensitivity deterioration can be prevented. And noise resistance can be improved.

  According to a third aspect of the present invention, in the second aspect of the present invention, the position where the shield portion is interposed is inward of the circuit block.

  According to the invention of claim 3, capacitive coupling inside the circuit block can be prevented.

  According to a fourth aspect of the present invention, in the second aspect of the present invention, a junction portion on the upper surface of the circuit block of one or both of the power supply terminal pin and the detection signal output terminal pin, and the heat ray detection element, A shield portion having a specific potential or a ground potential is provided so as to be interposed in a space between the two.

  According to the invention of claim 4, capacitive coupling outside the circuit block can be prevented.

According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the position where the shield portion is interposed is a space extending from the inside of the circuit block to between the joining portion and the heat ray detecting element. And

  According to the invention of claim 5, capacitive coupling can be prevented from the inside to the outside of the circuit block.

According to a sixth aspect of the present invention, in the fourth or fifth aspect of the present invention, the shield portion is perpendicular to the shield layer at a position between the joining portion and a detection output portion of the heat ray detection element. The shield member protrudes in the direction and upward from the support surface of the heat ray detection element, and the potential of the shield member is the specific potential or the ground potential.

According to the invention of claim 6, in addition to the operational effects of the invention of claim 4 or claim 5, the arrangement of the shield member and the mounting of the heat ray detection element can be performed in the same process, so that the number of man-hours can be reduced. Further cost reduction is possible.

  According to a seventh aspect of the present invention, in the sixth aspect of the present invention, the shield member has a lower portion inserted into a vertical hole extending from the upper surface of the first resin layer to the shield layer, and protrudes from the vertical hole. The upper end of the part to be performed is arranged above the upper surface of the heat ray detecting element.

  According to the invention of claim 7, since it is possible to prevent capacitive coupling with the detection signal output terminal pin or the power supply terminal pin or both above the surface on which the heat ray detection element is mounted, the shield member is used. The shield effect can be further improved, and the shield member can be supported by the vertical hole and connected to the potential of the shield layer.

In the invention of claim 8, in the invention of claim 4 or claim 5 , the shield part is in the first resin layer located between the joint part and the detection output part of the heat ray detection element. A shield member is incorporated so as to be perpendicular to the shield layer, and the potential of the shield member is the specific potential or the ground potential.

According to the invention of claim 8, in addition to the function and effect of the invention of claim 4 or claim 5, by incorporating the shield member in the first resin layer, the shield member is simultaneously formed with the heat press at the time of resin layer formation. The resin layer can be built in, so that the number of steps can be reduced, and the state of the shield member can be mechanically stabilized by incorporating the shield member in the first resin layer.
Inward capacitive coupling can be prevented.

  According to a ninth aspect of the invention, in the eighth aspect of the invention, the portion of the first resin layer containing the shield member is bulged upward, and the upper end portion of the shield member is extended into the bulged portion. The tip position of the upper end portion is set to be higher than the upper surface of the heat ray detection element.

According to the invention of claim 9, since capacitive coupling with the detection signal output terminal pin or the power supply terminal pin or both above the surface on which the heat ray detection element is mounted can be prevented, shielding effect by the shield portion of the invention can further improving, can protect the upper end portion of the shield member in swelling site.

In the invention of claim 10, characterized in that in the invention of claim 4 or claim 5, wherein the shield portion, the the bonding site of the first resin layer to a position between the detection output portion of the heat ray sensing elements It is formed by the shield wall which consists of a standing wall surface.

According to the invention of claim 10, in addition to the function and effect of the invention of claim 4 or claim 5, it becomes possible to form a shield wall in the first resin layer when molding the test circuit block. Reduction and further cost reduction.

  According to the present invention, the space for forming the heat insulating layer of the circuit block and the infrared detecting element can be easily formed integrally with the first resin layer, and the electronic circuit component element is integrally formed with the second resin layer. By burying it, it becomes possible to secure a space (mounting area) for mounting the electronic circuit element that has been an obstacle to downsizing in the standing direction, and can be significantly reduced in thickness and size, and the electronic circuit element As a circuit board for mounting, a printed circuit board capable of forming a fine fine pitch circuit by a general circuit board forming method or a board using a thin copper foil can be used, and the resin layer and the circuit board are included. The circuit block can be made into a multilayer substrate structure that can be easily manufactured by pressing, and in addition, the terminal block is bonded to the circuit part of the circuit block in the same circuit block as the mounting surface of the heat ray detection element. Since it is performed on the top surface of the rack, mounting and bonding of the heat ray detection element to the circuit block and bonding of the terminal pin to the circuit part can be performed in the same process, the number of processes can be reduced, and inspection of the bonding state can be visually observed. Therefore, the inspection in the manufacturing process becomes easy, and it can be manufactured at a low cost. Further, the shield layer can reduce the influence of external noise.

Embodiments of the present invention will be described below.
(Embodiment 1)
As shown in FIGS. 1A to 1C, the infrared detector A of the present embodiment is disposed in a can package container including a disk-shaped metal stem 1 and a metal cap 2, for example. The circuit block 3 on which a heat ray detecting element such as the pyroelectric element X is mounted is accommodated. In addition to the pyroelectric element X, a heat ray detecting element such as a thermopile or a bolometer may be used.

  The stem 1 protrudes from the peripheral part one step above the peripheral part to form a mounting part 1a for mounting the circuit block 3 via a spacer 6 made of an insulating material, and the cap 2 has an opening at the bottom and is located at the center of the ceiling part. Has a rectangular infrared passage window 4 fitted with a bandpass optical filter 5 for allowing only infrared rays in a specific frequency range to enter the cap 2. Here, when the use of the infrared detector A is human body detection, the optical filter 5 is used that passes light having a wavelength of about 4 μm or more and is coated so as to cut infrared rays lower than that.

  The stem 1 is a circuit block 3 built in the cap 2 by attaching the cap 2 by mounting and fixing the flange portion 2a protruding from the lower end periphery of the cap 2 on the annular step portion 1b around the mounting portion 1a. Is sealed and electromagnetic shielding is performed.

  As shown in FIG. 2, the circuit block 3 includes a circuit board 7 made of glass epoxy or the like, a second resin layer body 8 laminated on the circuit board 7, and a laminate on the resin layer body 8. The first and second resin layer bodies are composed of a multi-layered substrate unit comprising a shield layer body 9 made of a metal plate and a first resin layer body 10 laminated on the shield layer body 9. 10 and 8 are integrated with the circuit board 7 and the shield layer body 9 by using a method described later. Three terminal pin insertion holes 15 are formed at regular intervals from the lower surface to the upper surface, and pyroelectric A through-hole 14 is formed for electrical connection between the detection output portion of the element X and the circuit portion on the circuit board 7 and for connecting the shield layer of the shield layer body 9 to a predetermined potential portion. It is set up.

Here, the uppermost resin layer body 10 has a concave portion 11 formed of an oblong hole formed in the central portion and a peripheral upper surface (convex portion) of the concave portion 11 to make the upper surface portion of the circuit block 3 an uneven shape portion. The concave portion 11 constitutes a space portion for thermal insulation by floating the heat ray detection portion of the pyroelectric element X in the air, and the detection output portions on both sides of the pyroelectric element X are formed on both upper surface portions of the concave portion 11. land 12a for joining the detection output portion of supporting and pyroelectric element X a certain electrode, the provided 12a, also run de of terminal pins bonded to the periphery of the opening of the terminal pins transmural interpolating hole 15 (not shown) It is provided.

  The above-described space portion enables a highly sensitive measurement by securing an air layer for thermal insulation between the heat ray detection portion (light receiving surface) of the pyroelectric element X and the shield layer body 9. Is.

  Each land 12a is provided at one end of each wiring pattern 13 formed corresponding to the upper surface of the resin layer body 10, and each wiring pattern 13 penetrates the upper and lower surfaces of the resin layer body 10 to the inner surface. It is electrically connected to a through hole 14 that has been plated with through holes.

  The shield layer body 9 is a shield layer formed of a metal foil (for example, a copper foil) for preventing an oscillation phenomenon caused by capacitive coupling between the output of the pyroelectric element X and a subsequent amplification unit (current amplification circuit or bandpass amplifier). 9a is formed on the upper surface (or lower surface or both surfaces) of the glass epoxy substrate, and has a ground potential or some specific potential to serve as a shield.

  The circuit board 7 which is the lowermost layer has a signal processing IC 16 constituting a bandpass amplifier and a window comparator mounted on the lower surface, and a surface on which the chip-like electronic component 17 is mounted on the upper surface. By connecting the electronic circuit elements, a wiring pattern for forming a circuit unit necessary as an infrared detector is formed.

  The chip-shaped electronic component 17 is connected and mounted on the wiring pattern by reflow soldering 18, and the IC 16 is mounted on the wiring pattern by flip chip.

  The resin layer body 8 disposed and formed between the upper part of the circuit board 7 and the shield layer body 9 incorporates (embeds) the chip-like electronic component 17 mounted on the upper surface side of the circuit board 7 together with the circuit board 7. Thus, the entire circuit block 3 having a multilayer substrate unit structure is reduced in thickness.

  By forming the circuit block 3 having the multilayer substrate unit structure as described above, the pyroelectric element X outputs the through hole 14 of the resin layer 10, the through hole 14 of the shield layer body 9, and the resin layer body 8. Through the through-hole 14 and the wiring pattern of the circuit board 7, and the shield layer 9 a of the shield layer body 9 is connected to a circuit portion including the IC 16 and the electronic component 17 on the circuit board 7. It is connected to a part (for example, a part having a ground potential or a specific potential).

  Next, a process for forming the circuit block 3 having the multilayer substrate unit structure described above will be briefly described with reference to FIG.

First, as shown in FIG. 3A, a circuit board 7 in which a chip-like electronic component 17 is fixedly mounted on the upper surface with solder 18 in advance and a shield layer body 9 are prepared, and between the circuit board 7 and the shield layer body 9. In addition, a B-stage epoxy resin material is highly filled with an inorganic filler such as silica (SiO ₂ ) (for example, 85 wt%), has a high elongation and tensile strength, is tough at room temperature, and is not easily torn. A plurality of (for example, three) resin materials 20 are stacked on the circuit board 7, the shield layer body 9 is stacked on the resin material 20, and two of the above-described resin materials 20 are further stacked on the shield layer body 9. In a stacked state, it is put into a press mold, and in this put state, it is heated (for example, 100 ° C.) while being evacuated to thermally melt the resin material, and is pressurized (for example, 3 Mpa) for a certain time. By this heating press, the molten resin flows into the unevenness of the chip-like electronic component 17 on the circuit board 7 and the gap below it. Then, the temperature is raised at a predetermined temperature (for example, 175 ° C.) to be completely cured. By this curing, the resin layer body 8 including the chip-like electronic component 17 is formed integrally with the circuit board 7 on the circuit board 7, and the resin layer body 8 and the uppermost layer are cured above the resin layer body 8. The shield layer body 9 is sandwiched between the formed resin layer body 10 and integrated as shown in FIG. Moreover, the above-mentioned recessed part 11 is simultaneously formed in the resin layer body 10 with a metal mold | die. After the shield layer body 9, the resin layer body 8, and the circuit board 7 are integrated in this way, a through hole 14 and a terminal pin insertion hole 15 that penetrate each layer are formed by a router.

  Next, the land 12a and the wiring pattern 13 are formed on the upper surface of the resin layer body 10 by general electroless plating, and the through hole plating for interlayer connection is formed on the inner surface of the through hole 14 and the terminal pin insertion hole 15 described above. After the plating, etching is performed by a general patterning method, so that the wiring pattern on the lower surface of the lowermost circuit board 7, the land 12 a of the resin layer body 10, and the land around the opening of the terminal pin insertion hole 15 are formed. If the wiring pattern 13 is formed, the substrate unit of the circuit block 3 before mounting the IC 16 and the pyroelectric element X is completed as shown in FIG.

The thermosetting resin may be a phenol resin, a cyanate resin or the like, and the inorganic filler may be one kind of aluminum oxide (Al ₂ O ₃ ), magnesium oxide (MgO), boron nitride (BN), etc. in addition to silica. Two or more types may be mixed.

  After mounting the IC 16 on the lower surface of the circuit block 3 completed as described above, the circuit block 3 is mounted on the mounting portion 1a of the stem 1 via the spacer 6, and between the circuit block 3 and the spacer 6, or between the spacers. 6 and the mounting portion 1a are fixed with an adhesive. The central hole 6a of the spacer 6 constitutes a storage space for the IC 16.

  Here, the stem 1 used in the present embodiment is made of a metal that holds the power supply terminal pin 19a, the detection signal output terminal pin 19b, the ground terminal pin 19c, and the terminal pins 19a, 19b, and 19c. (SPC, Kovar, etc.) and the base portion through which the terminal pins 19a and 19b are penetrated are sealed with the glass material 22 and the terminal pins 19a and 19b are supported by the glass material 22. It is electrically insulated from the base part. Moreover, the hole of the base part which penetrates the ground terminal pin 19 is sealed with a metal material, and the potential of the stem 1 and the potential of the terminal pin 19c are made the same potential by joining the ground terminal pin 19c with the metal material. .

  Thus, the terminal pins 19a to 19c are notched holes 6b opened in the side periphery of the spacer 6 when the circuit block 3 is mounted on the mounting portion 1a of the stem 1 through the spacer 6 as described above. Then, the upper end protrudes from the upper surface side of the circuit block 3 through the terminal pin insertion holes 15 formed corresponding to the circuit blocks 3 respectively.

  Now, after the process of mounting and fixing the circuit block 3 on the stem 1 as described above is completed, in the next process, the pyroelectric element X is bridged between the lands 12a, 12a on both sides of the recess 11 of the resin layer body 10, In this state, the electrodes of the pyroelectric element X are electrically joined to the lands 12a, 12a by a conductive material (not shown) of a conductive pace (silver paste or the like), and each terminal pin 19a protruding from the upper surface of the resin layer body 10 is used. The upper end portions of ˜19c are joined to the land on the periphery of the opening of the terminal pin penetration hole 15 by a conductive material 21 such as a conductive paste (silver paste).

As a result, the electrode serving as the detection output portion of the pyroelectric element X is connected to the circuit portion of the circuit board 7 via the wiring pattern 13 and the through-hole plating of the through-holes 14 penetrating each layer 10, 9, 8. Each of the terminal pins 19a to 19c is connected to the wiring pattern of the circuit board 7 through the through hole plating of the through hole 15, and the operation power supply from the outside through the power supply terminal pin 19a and the ground terminal pin 19c. supplied with, it is possible to output a detection signal to the outside in the detection signal output terminal pins 19b and ground terminal pin 19c.

  After the step of mounting the pyroelectric element X on the circuit block 3 and joining the terminal pins 19a to 19c to the circuit block 3 in this way, after visually inspecting the joined state, the cap 2 A desired infrared detector A having a hermetic structure by sealing the inside of the container made up of the cap 2 and the stem 1 by welding the flange portion 2a on the annular step portion 1b of the stem 1 is shown in FIG. It will be completed as shown in FIG.

The circuit configuration of the infrared detector A basically has the same circuit configuration as that of the conventional example of FIG. 14, and the level in either the positive or negative direction with respect to the ground level as shown in FIG. having a current amplifying circuit 100 for amplifying the detection output of the pyroelectric element X, a bandpass Suanpu 1 01 for removing noise components, comparing the level with a threshold of detection output outputted from the bandpass Suanpu 1 01 And a window comparator 102 that outputs a detection signal S. In FIG. 4, the corresponding power supply input terminal, detection signal output terminal, and ground connection terminal are denoted by the corresponding terminal pin symbols.

In the infrared detector A of the present embodiment configured as described above, the circuit block 3 and each of the terminal pins 19a to 19c are joined on the upper surface of the circuit block 3, so that the pyroelectric element X is connected to the circuit block 3. Mounting and bonding and bonding of terminal pins to circuit blocks can be performed in the same process, and the number of processes can be reduced, and inspection of the bonding state can be performed by visual inspection, so inspection in the manufacturing process is easy Yes.
(Embodiment 2)
In addition to the configuration of the first embodiment, the infrared detector A according to the present embodiment detects between the protruding portion of the power supply terminal pin 19a and the pyroelectric element X as shown in FIGS. 5 (a) and 5 (b). Between the protruding portion of the signal output terminal pin 19b and the pyroelectric element X, a shield member 23 made of a metal plate material such as iron or copper is disposed, and the protruding portion of the terminal pins 19a and 19b and the pyroelectric element X are arranged. To prevent capacitive coupling between the two. The shield member 23 is connected to, for example, a ground potential (or a specific potential). For this connection and fixing, the shield member 23 is fixed at an arrangement position using, for example, a conductive paste (silver pace) or solder. The Note when connecting to a ground potential, previously formed wiring patterns between the joint portion to the installation position for example, the ground terminal pin 19c and the disposed position of. Further, in order to enhance the shielding effect, the shield member 23 is erected in the direction perpendicular to the shield layer 9a, and the height of the conductive material 21 that joins the terminal pins 19a and 19b and the height of the upper surface of the pyroelectric element X are determined. with even higher, terminal pins 19a, the joint portion 19b Ru Setea certain range so as not to face the pyroelectric element X.

  Since other configurations are the same as those of the first embodiment, illustration and description of an exploded perspective view and a circuit configuration diagram are omitted.

  Thus, the infrared detector A of the present embodiment can prevent capacitive coupling between the detection output portion of the pyroelectric element X and the power supply terminal pins 19a and 19b by the shielding effect by the shield member 23, and as a result. Sensitivity deterioration can be prevented and noise resistance can be improved. Further, by arranging the shield member 23 and the mounting surface of the pyroelectric element X in the same manner, they can be arranged and mounted in the same process.

In the present embodiment, the shield member 23 is disposed corresponding to both the terminal pins 19a and 19b. However, the shield member 23 may be disposed corresponding to one of the terminal pins 19a and 19b. Further, as the shield member 23, a conductive pace or solder raised on the upper surface of the resin layer body 10 may be used.
(Embodiment 3)
The shield member 23 used in the second embodiment is formed of a metal plate disposed on the upper surface of the resin layer body 10 or a raised conductive pace or solder. In this embodiment, the shield member 23 is disposed at a portion where the shield member 23 is disposed. Correspondingly, as shown in FIG. 6A, a vertical hole portion 24 penetrating from the upper surface to the lower surface of the resin layer body 10 is provided, and the shield member 23 made of a metal plate material is provided in the vertical hole portion 24 as shown in FIG. And the shield member 23 is electrically connected to the shield layer 9a and fixed, and the shield member 23 to be used is inserted and fixed in the vertical hole portion 24 in the state of the resin layer body 10 as shown in FIG. The metal plate material formed so that the height of the part protruding from the upper surface is higher than the height of the conductive material 21 that joins the terminal pins 19a and 19b and the height of the pyroelectric element X is used. FIG. 7A is an exploded perspective view of the present embodiment, FIG. 7B is a perspective view showing a state before the shield member 23 is inserted, and FIG. 7C is a perspective view showing the inserted state. In addition, since it is the same as Embodiment 1 except the arrangement | positioning structure of the shield member 23, the same code | symbol is attached | subjected to the same component and description is abbreviate | omitted.

  Thus, the infrared detector A of the present embodiment prevents capacitive coupling between the detection output portion of the pyroelectric element X, the power supply terminal pin 19a, and the detection signal output terminal pin 19 by the shielding effect of the shield member 23. be able to.

  In the present embodiment, the shield member 23 is disposed corresponding to both the terminal pins 19a and 19b. However, the shield member 23 may be disposed corresponding to one of the terminal pins 19a and 19b. Further, as the shield member 23, a conductive pace or solder that is raised in bulk may be used.

(Embodiment 4)
In the third embodiment, the shield member 23 is inserted and fixed in the vertical hole portion 24 provided in the resin layer body 10, but in this embodiment, in the process of forming the circuit block 3 by a heating press, FIG. As shown in FIG. 2, the shield member 23 is disposed at a predetermined position on the upper surface of the shield layer body 9, and the same heat press as that in the first embodiment is performed in a state where the shield member 23 is joined in advance by soldering or conductive paste (silver paste). Thus, the shield member 23 is built in the resin layer 8. And the upper end part of the shield member 23 protrudes from the upper surface of the circuit block 3 obtained by the process of the heating press as shown in FIG. As a result, as shown in FIG. 9A, the height of the portion protruding from the upper surface of the resin layer body 10 becomes higher than the height of the conductive material 21 that joins the terminal pins 19a and 19b and the height of the pyroelectric element X. Thus, capacitive coupling of the power supply terminal pin 19a, the detection signal output terminal pin 19 and the pyroelectric element X can be prevented. FIG. 9B shows an exploded perspective view of the present embodiment. In addition, since it is the same as Embodiment 3 except the arrangement | positioning structure of the shield member 23, the same code | symbol is attached | subjected to the same component and description is abbreviate | omitted.

  Thus, the infrared detector A of the present embodiment can prevent the capacitive coupling of the power supply terminal pin 19a, the detection signal output terminal pin 19b, and the pyroelectric element X by the shielding effect of the shield member 23. As a result, it is possible to prevent deterioration of sensitivity and improve noise resistance, and by incorporating the shield member 23 in the resin layer body 10, the resin layer of the shield member 23 can be incorporated at the same time as the heating press at the time of resin layer formation. The number can be reduced, and the state of the shield member 23 can be mechanically stabilized by incorporating the shield member 23 in the resin layer body 8.

In the present embodiment, the shield member 23 is disposed corresponding to both the terminal pins 19a and 19b. However, the shield member 23 may be disposed corresponding to one of the terminal pins 19a and 19b. Further, as the shield member 23, a conductive pace or solder that is raised in bulk may be used.
(Embodiment 5)
While the upper end portion of the embodiment 4, the shielding member 23 is protruded from the upper surface of the resin layer 10, the present embodiment FIG. 10 (a), the part of the resin layer 10 as shown in (b) above It is characterized in that it is hot-pressed so as to bulge and the upper end portion of the shield member 23 is built in the bulged portion 10a. In addition, since it is the same as that of Embodiment 4 except the built-in structure of the upper end part of the shield member 23, the same code | symbol is attached | subjected to the same component and description is abbreviate | omitted.

  Thus, in the infrared detector A of the present embodiment, as in the fourth embodiment, the capacitive coupling between the power supply terminal pin 19a and the detection signal output terminal pin 19b and the detection output portion of the pyroelectric element X is shielded 23. Can be prevented by the shielding effect, and as a result, it is possible to prevent deterioration of sensitivity and improve noise resistance, and by incorporating the shield member 23 in the resin layer body 10, the shield member is simultaneously formed with the heating press at the time of resin layer formation. Thus, the number of processes can be reduced, and the entire shield member 23 can be built into the resin layer body 10 to mechanically stabilize the state of the shield member 23.

In the present embodiment, the shield member 23 is disposed corresponding to both the terminal pins 19a and 19b. However, the shield member 23 may be disposed corresponding to one of the terminal pins 19a and 19b. Further, as the shield member 23, a conductive pace or solder that is raised in bulk may be used.
(Embodiment 6)
In the above-described first to fifth embodiments, the shield member 23 is protruded upward from the upper surface of the resin layer body 10 to allow the joining of the terminal pins 19a and 19b and the mounting of the pyroelectric element X in the same process and from the outside. Although the visual inspection can be performed, in the present embodiment, for example, when the circuit block 3 is formed by a heating press in order to perform bonding of the power supply terminal pin 19a on the upper surface of the shield layer body 9, By forming the rising position of the side wall portion of the resin layer 10 corresponding to the bonding portion between the position of the bonding portion and the pyroelectric element X as shown in FIGS. The power supply terminal pins 19a to 19c can be joined and the pyroelectric element X can be mounted in the same process. Further, a shield layer 25a is formed on the surface of the side peripheral wall portion by plating or the like to make the side peripheral wall portion a shield wall 25, and the shield wall 25 is used to connect the joint portion of the power supply terminal pin 19a to the pyroelectric element X. Capacitive coupling with the detection output site is prevented.

  Since the configuration other than the above is basically the same as that of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

Thus, in the present embodiment, capacitive coupling between the power supply terminal pin 19a and the pyroelectric element X can be prevented by the shielding effect by the shield wall 25, and as a result, sensitivity deterioration can be prevented and noise resistance can be improved. In addition, when the circuit block 3 is formed by the heating press, it is possible to simultaneously form the rising wall surface as the shield wall 25 on the resin layer 10, thereby reducing the number of processes.

12A and 12B, when the terminal pins 19a to 19c are joined at the upper surface portion of the shield layer body 9, these joints are formed when the circuit block 3 is formed. A counterbore-shaped hole 26 is formed so as to be able to be performed from the upper surface side, the terminal pins 19a to 19c are exposed on the upper surface side of the circuit block 3 of the pyroelectric element X, and a shield layer is formed on the inner peripheral surface of the hole portion 26. By forming the inner peripheral surface 25a as the shield wall 25, capacitive coupling between the joint portion and the detection output portion of the pyroelectric element X may be prevented.
(Embodiment 7)
In the first to sixth embodiments, the IC 16 is flip-mounted on the circuit board 7, but in the present embodiment, the IC 16 is mounted by wire bonding 31.

  In the case of the present embodiment, as shown in FIG. 13A, the IC 16 is mounted on the lower surface of the circuit board 7, and the electronic component 17 is embedded in the resin layer body 8 to form the circuit block 3. When mounting the circuit block 3 on the stem 1, as shown in FIG. 13B, the spacer 6 is placed on the surface side where the IC 16 is mounted, and the IC 16 is accommodated in the central hole 6a of the spacer 6, The spacer 6 is bonded and fixed to the circuit board 7, and after this bonding and fixing, as shown in FIG. 13C, the center hole 6a is filled with a resin 30 and sealed, and then the circuit block is connected via the bonded and fixed spacer 6. 3 is mounted on the mounting portion 1a of the stem 1, and the spacer 6 is bonded and fixed to the mounting portion 1a.

  Since other configurations may be any of the configurations of the first to sixth embodiments, illustration and description are omitted here, and the same reference numerals are given to the same components. Further, even when the IC 16 is embedded in the resin layer body 8, it may be adopted in the configuration of the first embodiment as long as the wire is not broken during the heat press.

(A) is an exploded perspective view of Embodiment 1, (b) is a perspective view of the state of removing the cap of Embodiment 1, and (c) is an overall perspective view of Embodiment 1. FIG. FIG. 3 is a cross-sectional view of a circuit block partially omitted in the first embodiment. FIG. 6 is an explanatory diagram of a manufacturing process of the circuit block according to the first embodiment. 1 is a circuit configuration diagram of Embodiment 1. FIG. (A) is the perspective view of the state which removed the cap of Embodiment 2, (b) is sectional drawing of the circuit block which a part of Embodiment 2 was abbreviate | omitted. (A) is sectional drawing of the circuit block abbreviate | omitted before insertion of the shield member of Embodiment 3, (b) is sectional drawing of the circuit block abbreviate | omitted after insertion of the shield member of Embodiment 3. is there. (A) is an exploded perspective view of the third embodiment, (b) is an exploded perspective view of a state in which the cap of the third embodiment is removed and the shield member is removed, and (c) is an exploded perspective view of the shield member of the third embodiment. It is a perspective view after insertion. It is explanatory drawing of the manufacturing process of Embodiment 4. (A) is sectional drawing of the circuit block which a part of Embodiment 4 abbreviate | omitted, (b) is a disassembled perspective view of Embodiment 4. FIG. (A) is sectional drawing of the circuit block which a part of Embodiment 5 abbreviate | omitted, (b) is a perspective view of the state which removed the cap of Embodiment 4. FIG. (A) is a perspective view of the state of removing the cap of Embodiment 6, (b) is a top view of the state of removing the cap of Embodiment 6, (c) is a cross-sectional view of the circuit block of Embodiment 6. (A) is a perspective view of a state in which another example cap of Embodiment 6 is removed, and (b) is a top view of a state in which another example cap of Embodiment 6 is removed. (A) is a perspective view of the circuit board used for Embodiment 7, (b)-(d) is the mounting process explanatory drawing to the stem of the circuit block used for Embodiment 7. FIG. It is a circuit block diagram of an infrared detector. (A) is sectional drawing of a prior art example, (b) is an exploded perspective view at the time of actual use of a prior art example. (A) is an exploded perspective view of a three-dimensional circuit block of another conventional example, (b) is a perspective view with a cap of another conventional example removed, and (c) is a perspective view of another conventional example.

Explanation of symbols

1 Stem 2 Cap 3 Circuit Block 4 Infrared Passing Window 5 Optical Filter
6 Spacer 7 Circuit board 8 Resin layer body 9 Shield layer body 9a Shield layer 10 Resin layer body 11 Recess 16 IC
19a Power supply terminal pin 19b Detection signal output terminal pin 19c Ground terminal pin 21 Conductive material A Infrared detector X Pyroelectric element

Claims (10)

In an infrared detector that houses a circuit block in which a heat ray detection element and an electronic circuit element are mounted inside a packaging container consisting of a stem and a cap attached to the stem,
The circuit block is formed integrally with a concavo-convex shape portion on an upper surface, and the convex portions of the concavo-convex shape portion are portions that support and electrically join both ends of the heat ray detection element, and the concave portion is defined as the position of the heat ray detection element. Forming a first resin layer as a thermal insulation space portion provided below the heat ray detection portion, a circuit wiring pattern, and embedding a circuit board on which the electronic circuit element is mounted together with the electronic circuit element; A second resin layer provided below the first resin layer, and a shield layer provided between the first resin layer and the second resin layer and having a specific potential or a ground potential are integrally provided,
Any one of the terminal pins for power supply, ground, and detection signal output projecting from the stem into the cap penetrates from the lower surface of the circuit block to the upper surface, and projects the upper end portion. Is bonded to a circuit part on the upper surface of the circuit block. A shield part having a potential of the specific potential or the ground potential is interposed between one or both of the power supply terminal pin and the detection signal output terminal pin and the heat ray detection element. The infrared detector according to claim 1. The infrared detector according to claim 2, wherein the position where the shield portion is interposed is an inner side of the circuit block. The potential is specified in such a manner that either one or both of the power supply terminal pin and the detection signal output terminal pin is interposed in a space between the junction portion on the upper surface of the circuit block and the heat ray detection element. The infrared detector according to claim 2, wherein a shield portion having a potential or a ground potential is provided. The position is interposed a shield portion, the infrared detector according to claim 4 Symbol mounting, characterized in that a space ranging between the junction from the inside of the circuit block and the heat ray detection element. The shield portion protrudes in a direction perpendicular to the shield layer and upward from the support surface of the heat ray detection element at a position between the joint portion and the detection output portion of the heat ray detection element. consists shield member, an infrared detector according to claim 4 or claim 5 Symbol mounting, characterized in that the potential of the shield member is set to the specific potential or the ground potential. The shield member has a lower portion inserted into a vertical hole extending from the upper surface of the first resin layer to the shield layer, and an upper end of a portion protruding from the vertical hole is above the upper surface of the heat ray detecting element. The infrared detector according to claim 6, wherein the infrared detector is disposed. The shield part incorporates a shield member so as to be perpendicular to the shield layer in the first resin layer located between the joint part and the detection output part of the heat ray detection element, infrared detector according to claim 4 or claim 5 Symbol mounting, characterized in that the potential of the shield member is set to the specific potential or the ground potential. A portion of the first resin layer containing the shield member bulges upward, and an upper end portion of the shield member extends into the bulge portion so that the tip position of the upper end portion is the heat ray detecting element. 9. The infrared detector according to claim 8, wherein the infrared detector is at least an upper surface of the infrared detector. The shield portion claims, characterized said and bonding portion, that is formed by the shield wall consisting of a rising wall of said first resin layer at a position between the detection output portion of the heat ray sensing elements 4 or infrared detector according to claim 5 Symbol mounting.

Images