JP2008244170A - Divided substrate and manufacturing method thereof, and infrared detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a main substrate from being deformed by applying press force appropriate for canceling stress generated in the main substrate from a formation section to the main substrate. <P>SOLUTION: A method of manufacturing a divided substrate includes a lamination process and a press process. In the lamination process, at least a resin substrate 67 is laminated on one surface of the main substrate 66, and a circuit board 62, where a resin layer 65 and a circuit component 63 are packaged at the side of the resin layer 65, is laminated on the other surface of the main substrate 66, thus forming a multilayer board 60. In the press process, presswork is performed by bringing a press die 4 having a formation section 4a comprising a projection in a shape corresponding to a three-dimensional shape section 6a in the divided substrate 6 into contact with a surface at the side of the resin substrate 67 in the multilayer board 60, thus forming the three-dimensional shape section 6a comprising a recess at the formation section 4a and burying the circuit component 63 into a prescribed region at least partially overlapping with the three-dimensional shape section 6a in the thickness direction of the main substrate 66 in the resin layer 65. A press die 4 is used that has the formation section 4a with the same height dimension h1 as a thickness dimension t1 in the resin substrate 67. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an individual substrate manufacturing method, an individual substrate, and an infrared detector.

  Conventionally, as a single substrate 6 on which mounting components such as semiconductor elements are mounted, a main substrate in which a resin substrate 67 (for example, an epoxy resin substrate) is laminated on one surface (upper surface in FIG. 4) as shown in FIG. 66, in which a three-dimensionally shaped portion 6a formed of a concave portion is formed on one surface of the resin substrate 67 opposite to the main substrate 66. In the example of FIG. 4, electronic components 64 ′ are mounted on both surfaces of the main substrate 66, and a metal layer 68 (for example, constituting a circuit pattern 68 a) is formed on the one surface of the resin substrate 67.

  As a method for manufacturing this kind of individual substrate 6, a resin substrate 67 is laminated on one surface of a main substrate 66, and a metal sheet 69 made of, for example, copper foil and serving as a basis for a metal layer 68 is formed on one surface of the resin substrate 67. By laminating, a laminating step of forming a laminated substrate 60 in which the main substrate 66, the resin substrate 67, and the metal sheet 69 are laminated so as to have the positional relationship shown in FIG. 5A, and shown in FIG. 5B. Thus, there has been proposed a manufacturing method including a press process for forming the three-dimensionally shaped portion 6a while thermocompression-molding the laminated substrate 60 (the main substrate 66, the resin substrate 67, and the metal sheet 69). Here, the press die 4 used in the pressing step has a molding portion 4a formed of a convex portion having a shape corresponding to the three-dimensional shape portion 6a of the individual substrate 6 at a contact portion with the laminated substrate 60. The three-dimensionally shaped portion 6a is formed on the laminated substrate 60 in the pressing process by the portion 4a. Here, since the height dimension h0 of the molding part 4a of the press mold 4 is set according to the depth dimension of the three-dimensionally shaped part 6a formed on the resin substrate 67, the thickness dimension t0 of the resin substrate 67 is usually set. Is also set to be small (low) (h0 <t0). In this manufacturing method, the thermocompression molding of the laminated substrate 60 and the molding of the three-dimensionally shaped portion 6a can be simultaneously performed in the pressing process, and the thermocompression molding of the laminated substrate 60 and the molding of the three-dimensionally shaped portion 6a are performed in separate processes. The number of man-hours can be reduced as compared with the case of performing (see, for example, Patent Document 1). In the invention described in Patent Document 1, the circuit pattern 68a is formed by performing an etching process on the metal layer 68 (metal sheet 69) after the pressing step.

  Incidentally, in recent years, a resin layer 65 is laminated on the other surface of the main substrate 66 opposite to the resin substrate 67 as the individual substrate 6, and the three-dimensionally shaped portion in the thickness direction of the main substrate 66 among the resin layers 65. There has been proposed an individual substrate 6 in which a circuit component 63 (see FIG. 6) is embedded in a predetermined region at least partially overlapping 6a. In this kind of individual substrate 6, at least a part of the three-dimensionally shaped portion 6 a and the circuit component 63 overlaps in the thickness direction of the main substrate 66, so that downsizing in a plane orthogonal to the thickness direction of the main substrate 66 is achieved. be able to.

  In manufacturing the individual substrate 6 in which the circuit component 63 is embedded in the predetermined region of the resin layer 65, in addition to the main substrate 66, the resin substrate 67, and the metal sheet 69 described above, The resin layer 65 is laminated on the front surface side, and the circuit board 62 on which the circuit component 63 is mounted is mounted on the surface of the resin layer 65 opposite to the main board 66 as shown in FIG. Are laminated toward the resin layer 65 side, and the circuit component 63 is embedded in the resin layer 65 in the pressing step as shown in FIG. In this manufacturing method, the laminated substrate 60 (the main substrate 66, the resin substrate 67, the metal sheet 69, the resin layer 65, and the circuit substrate 62) is subjected to thermocompression bonding, the formation of the three-dimensional shape portion 6a, and further to the resin layer 65 in the pressing step. The circuit component 63 can be embedded at the same time.

In addition, as an example of the individual substrate 6 manufactured by the above-described manufacturing method, a mounting region in which mounting components are mounted on one surface of the three-dimensional shape portion 6a is provided, and at least a part of the three-dimensional shape portion 6a is in the mounting region. In the formed structure, a gap is formed between the mounting component and the resin substrate 67 by the three-dimensionally shaped portion 6a, so that thermal insulation between the mounting component and the resin substrate 67 can be achieved. Therefore, when this single substrate 6 is used for, for example, an infrared detector that detects infrared rays, a pyroelectric element that converts a change in the amount of received infrared light into a voltage signal and outputs it as a mounting component mounted in the mounting region. It is conceivable to improve the sensitivity of the pyroelectric element by forming a three-dimensionally shaped portion 6a formed of a concave portion for thermal insulation at a position corresponding to the detecting portion of the pyroelectric element in the mounting area.
JP 2007-59844 A (paragraph 0012-0020, FIG. 1-2)

  By the way, in the manufacturing method of the individual substrate 6 in which the circuit component 63 is embedded in the resin layer 65, the main substrate 66 is interposed through the resin layer 65 when the circuit component 63 is embedded in the resin layer 65 in the pressing process. Since the stress is generated in the main board 66 by being pressed by the circuit component 63, in order to prevent the deformation of the main board 66, the pressing force for canceling the stress is applied to the main board 66 from the side opposite to the resin layer 65. It is necessary to apply.

  However, since the height dimension h0 of the molding part 4a of the press die 4 is set smaller than the thickness dimension t0 of the resin substrate 67 (h0 <t0) as described above, FIG. ), The resin substrate 67 is interposed between the molded portion 4a and the main substrate 66, and the resin substrate 67 serves as a cushioning material, so that the stress generated on the main substrate 66 from the molded portion 4a to the main substrate 66. It is not possible to apply an appropriate pressing force that cancels. That is, the pressing force applied to the main substrate 66 from the molding portion 4a is relieved by the resin substrate 67, so that an appropriate pressing force cannot be applied to the main substrate 66 from the side opposite to the resin layer 65. 6 (b) and 6 (c), the main substrate 66 may be deformed (in FIGS. 6 (b) and 6 (c), the main substrate 66 before deformation is indicated by a two-dot chain line). If the main board 66 is deformed, there is a possibility that a malfunction such as damage to the main board 66 or the circuit component 63 may occur.

  The present invention has been made in view of the above-described reasons, and an individual substrate manufacturing method capable of preventing deformation of a main substrate, an individual substrate, an infrared detector capable of increasing sensitivity and improving reliability. The purpose is to provide.

  The invention of claim 1 has a main substrate in which a resin substrate is laminated on one surface and a resin layer is laminated on the other surface, and a three-dimensionally shaped portion including a recess is formed on one surface of the resin substrate opposite to the main substrate. A method of manufacturing an individual substrate in which circuit components are embedded in a predetermined region of the resin layer that overlaps at least partly with the three-dimensionally shaped portion in the thickness direction of the main substrate, the resin layer being opposite to the main substrate Laminate that forms a multilayer substrate by laminating at least a resin substrate and a resin layer on the main substrate so that circuit components mounted on either the circuit substrate or the main substrate laminated on the surface are in contact with the resin layer A molding part is formed by bringing a press mold having a molding part composed of a convex part having a shape corresponding to the process and a three-dimensional part of the individual substrate into contact with the surface of the laminated substrate on the resin substrate side. With the three-dimensional shape part And a pressing step of burying the circuit component in the predetermined region of the resin layer, as a press mold, characterized by using those having a molding portion having the same height as the thickness of the resin substrate.

  According to the present invention, as the press mold, one having a molding part having the same height as the thickness dimension of the resin substrate is used. Therefore, in the state where the press process is performed, the molding part of the press mold and the main substrate There is no intervening resin substrate, and the pressing force applied from the molding part to the main substrate is not relaxed by the resin substrate. Here, since the circuit component is embedded in a predetermined region of the resin layer at least partially overlapping the three-dimensionally shaped portion in the thickness direction of the main substrate, the pressing force from the molding portion corresponds to the predetermined region of the main substrate. Will be applied to the part. Therefore, when a circuit component is embedded in a predetermined region of the resin layer in the pressing process, stress is applied to a portion of the main substrate corresponding to the predetermined region by pressing the main substrate against the circuit component through the resin layer. Even if it occurs, an appropriate pressing force that cancels the stress generated in the main substrate can be applied to the main substrate from the molding portion, and deformation of the main substrate can be prevented.

  The invention according to claim 2 is an individual substrate manufactured by the method for manufacturing an individual substrate according to claim 1, and includes a mounting region in which a mounting component is mounted on one surface of the three-dimensionally shaped portion side, The three-dimensionally shaped portion is formed of a concave portion that forms a thermal insulation gap between the mounted component and the resin substrate by being at least partially formed in the mounting region.

  According to the present invention, since the deformation of the main substrate can be prevented even if the three-dimensionally shaped portion is formed at a position overlapping the predetermined region in the thickness direction of the main substrate, it overlaps with the predetermined region in the thickness direction of the main substrate. Without avoiding the position, the three-dimensionally shaped portion can be formed at an optimum position for thermal insulation between the mounting component and the resin substrate.

  A third aspect of the invention includes the individual substrate according to the second aspect of the invention and a pyroelectric element mounted on the mounting area as the mounting component, and the three-dimensional shape portion detects the pyroelectric element in the mounting area. It is formed in the position corresponding to a part.

  According to this invention, since the thermal insulation between the detection part of the pyroelectric element and the resin substrate can be taken, the sensitivity of the pyroelectric element is increased. In addition, since deformation of the main board is prevented, problems such as damage to the main board and circuit components due to deformation of the main board can be avoided, and reliability can be improved.

  The invention according to claim 1 has an effect that the deformation of the main substrate can be prevented by using a press die having a molding portion having the same height as the thickness of the resin substrate.

  The invention of claim 3 has the effect of improving the sensitivity and reliability of the pyroelectric element.

  In the following embodiments, a method for manufacturing an individual substrate used for an infrared detector that detects infrared light is illustrated. However, the method for manufacturing an individual substrate according to the present invention is not limited to an individual substrate used for an infrared detector. A main substrate having a resin substrate laminated on the surface and a resin layer laminated on the other surface, and a three-dimensionally shaped portion formed of a concave portion is formed on one surface of the resin substrate opposite to the main substrate. It can be used as a manufacturing method of various individual substrates having a configuration in which circuit components are embedded in a predetermined region at least partially overlapping the three-dimensionally shaped portion in the thickness direction.

  Hereinafter, the configuration of the infrared detector exemplified in this embodiment will be described with reference to FIGS.

  The infrared detector according to the present embodiment includes a circuit block 10 on which a pyroelectric element 1 that outputs a change in the amount of received infrared light as a voltage signal is mounted on an individual substrate 6, and a package 2 that houses the circuit block 10. Yes. The circuit block 10 is formed with a signal processing circuit that processes at least the output of the pyroelectric element 1.

  The package 2 has a stem 21 made of a metal and formed in a disc shape, and a cap 22 made of a metal and formed in a bottomed cylindrical shape with an open rear surface. The rear surface of the cap 22 is a stem. 21 is assembled into a closed shape. The circuit block 10 is mounted on the stem 21 via a spacer 7 made of an insulating material, and the cap 22 is fixed to the stem 21 so as to form a space for housing the circuit block 10 between the stem 21. Here, a plurality (three in this case) of terminal pins 25 that are electrically connected to the circuit block 10 are inserted into the stem 21 so that electrical connection to the circuit block 10 can be made from the external space of the package 2. It is as. The spacer 7, the circuit block 10, and the stem 21 are fixed by an adhesive.

  A rectangular (here, square) window portion 2 a is formed on the front wall of the cap 22 located in front of the pyroelectric element 1, and infrared rays are collected on the light receiving surface (front surface) of the pyroelectric element 1. An infrared lens 3 that emits light is disposed inside the cap 22 so as to cover the window portion 2a. The stem 21 has a plurality of terminal holes 21b through which the terminal pins 25 are inserted in the thickness direction, and the sealing portion 24 in a state where the terminal pins 25 are inserted into the terminal holes 21b. Is sealed. In the present embodiment, the cap 22 and the stem 21 are made of steel plates, and the flange portion 22c that extends outward from the rear end edge of the cap 22 with respect to the flange portion 21c formed on the peripheral portion of the stem 21. Is sealed by welding.

  By the way, the individual board 6 of the circuit block 10 is made of glass epoxy or the like, and a circuit board 62 on which an IC or chip-shaped electronic component 64 that is a component of a signal processing circuit or the like is mounted; In addition, a main substrate 66 that forms a circuit such as a signal processing circuit, a resin layer 65 laminated between the circuit substrate 62 and the main substrate 66, and one surface of the main substrate 66 opposite to the resin layer 65 are laminated. A resin substrate 67 and a metal layer 68 laminated on one surface of the resin substrate 67 opposite to the main substrate 66 are configured. The circuit board 62, the resin layer 65, the resin substrate 67, and the metal layer 68 are described later. The individual substrate 6 is formed so as to be integrally laminated on the main substrate 66 by using the manufacturing method of the individual substrate 6. Here, the circuit board 62 and the main board 66 are molded with the resin layer 65 sandwiched in a state where the above-described IC as the circuit component 63 is mounted, so that the resin is obtained with the circuit component 63 embedded in the resin layer 65. A multilayer circuit board composed of a so-called component-embedded substrate is formed together with the layer 65. That is, the individual substrate 6 of this embodiment is configured by laminating the resin substrate 67 and the metal layer 68 on the multilayer circuit board.

  In the circuit board 62, the circuit component 63 is flip-chip mounted on the upper surface side in FIG. 3, and a plurality of chip-shaped electronic components 64 are mounted on the lower surface side by solder reflow. In addition, the infrared detector of this embodiment is used for the use which detects the motion of a person by detecting the infrared rays radiated | emitted from a human body, and the circuit component 63 (IC) is the predetermined frequency of the pyroelectric element 1. An amplifier circuit (bandpass amplifier) that amplifies the output of a band (for example, about 0.1 to 10 Hz), a window comparator at the subsequent stage of the amplifier circuit, and the like are integrated.

  The pyroelectric element 1 is mounted on the mounting area 67 a on the one surface where the metal layer 68 is laminated on the resin substrate 67 of the individual substrate 6, and the pyroelectric element 1 is focused on the mounting area 67 a of the individual substrate 6. In a portion corresponding to the detection portion of the electric element 1, a three-dimensional shape portion 6 a is formed that includes a concave portion that forms a gap for thermal insulation between the detection portion of the pyroelectric element 1 and the resin substrate 67. . By providing the three-dimensionally shaped portion 6a, thermal insulation between the detecting portion of the pyroelectric element 1 and the resin substrate 67 can be taken, and the sensitivity of the pyroelectric element 1 is increased. Here, the three-dimensionally shaped portion 6 a (concave portion) is formed in an oval shape in plan view, and both sides of the three-dimensionally shaped portion 6 a on the one surface of the individual substrate 6 in the short diameter direction are both end portions of the pyroelectric element 1. It functions as a support part that supports Pads 68b for connecting electrodes (not shown) formed at both ends of the pyroelectric element 1 are formed on the support portion. Here, the circuit component 63 described above is embedded in a predetermined region of the resin layer 65 that at least partially overlaps the three-dimensionally shaped portion 6 a in the thickness direction of the main substrate 66.

  In the circuit block 10, through holes 62 b, 65 b, 66 b, 67 b through which the terminal pins 25 are inserted are provided through the circuit board 62, the resin layer 65, the main board 66, and the resin board 67 in the thickness direction. The pyroelectric element 1 and the signal processing circuit are electrically connected through the terminal pin 25. In this embodiment, the circuit board 62, the resin layer 65, the main board 66, and the resin board 67 are stacked, and through holes 62b and 65b are formed by a single drilling process that forms a through hole penetrating in the thickness direction. , 66b, 67b are formed so that the manufacturing process can be simplified and electrical connection within the circuit block 10 can be facilitated as compared with the case where the through holes 62b, 65b, 66b, 67b are individually formed. Yes.

  The metal layer 68 formed on the one surface of the resin substrate 67 constitutes the above-described pad 68b and the pattern portion 68c electrically connected to the pad 68b. Hereinafter, the pads 68b and the pattern portions 68c formed from the metal layer 68 on the one surface of the resin substrate 67 are referred to as circuit patterns 68a.

  Of the above-described three terminal pins 25, one is a power supply terminal pin 25 (25a), the other one is a signal output terminal pin 25 (25b), and the other one is a ground terminal pin 25. (25c). Here, the sealing portions 24 and 24 (24a and 24b) for sealing the terminal pins 25a and 25b are formed of insulating sealing glass, and the sealing portion 24 for sealing the terminal pins 25c. (24c) is formed of a metal material. In short, the terminal pins 25a and 25b are electrically insulated from the metal stem 21, whereas the ground terminal pin 25c is set to the same potential as the stem 21.

  When assembling the infrared detector having the above-described configuration, after mounting the circuit block 10 on the stem 21 via the spacer 7, the flange portion 22c of the cap 22 and the flange portion 21c of the stem 21 to which the infrared lens 3 is fixed. The circuit block 10 may be housed in the sealed metal package 2 by welding. The package 2 is a so-called CAN package, which can enhance the shielding effect against external noise and improve the weather resistance by improving the airtightness. Further, the mounting components mounted on the individual substrate 6 are not limited to the pyroelectric element 1 described above. For example, thermistor type infrared detection element, thermopile type infrared detection element, resistance bolometer type infrared detection element, etc. As long as the change in the amount of received infrared light can be converted into a change in the electrical signal, it is sufficient.

  Next, a method for manufacturing the individual substrate 6 used in the above-described infrared detector will be described with reference to FIG.

  First, circuit components 63 are mounted on the circuit board 62 and necessary circuit patterns are formed on the circuit board 62 and the main board 66. In this state, the circuit board 62, the resin layer 65, and the main board 66 are laminated, and the resin board 67 is further laminated on the surface of the main board 66, and a metal sheet 69 (for example, thickness) serving as the basis of the metal layer 68 described above. Is laminated on the surface of the resin substrate 67, so that the circuit substrate 62, the resin layer 65, the main substrate 66, the resin substrate 67, and the metal sheet have the positional relationship shown in FIG. A laminated substrate 60 laminated with 69 is formed (hereinafter referred to as a lamination process). At this time, the circuit board 62 is laminated with the mounting surface on which the circuit component 63 is mounted facing the resin layer 65 side. Further, in the present embodiment, the resin layer 65 and the resin substrate 67 are formed by stacking B-stage resin sheets that have a relatively high elongation rate and tensile strength and are tough at room temperature and are not easily torn. The resin sheet is, for example, an organic green sheet such as an epoxy resin sheet having a thickness of about 10 to 1000 μm and a thermosetting resin such as an epoxy resin highly filled with an inorganic filler such as silica (for example, about 60 to 95 wt%). Can be used. In short, a plurality of resin sheets (for example, 13 sheets) are stacked between the circuit board 62 and the main board 66 to form a resin layer 65, and a plurality of (for example, three) resin sheets are stacked on the main board 66. The resin substrate 67 is formed by stacking. In the present embodiment, a rectangular plate-shaped laminated substrate 60 is formed.

  Then, as shown in FIG. 1B, in a state where the press die 4 is arranged on the laminated substrate 60 formed in the lamination step, the resin sheet is softened and pressure is applied to the press die 4 in a vacuum atmosphere. Thus, the thermocompression molding of the laminated substrate 60 is performed, and the resin sheet is further cured to a C stage state at a predetermined temperature (hereinafter referred to as a pressing step). As shown in FIG. 1A, the press die 4 used in the pressing step is in a contact portion with the surface on the metal sheet 69 side of the multilayer substrate 60, and the three-dimensional shape portion 6a (here, It has a molding part 4a formed of a convex part corresponding to the concave part for thermal insulation (here, the plan view is an ellipse), and this molding part 4a allows the three-dimensional part 6a to be formed on the laminated substrate 60 in the pressing process. Mold. In other words, in the pressing process, the press mold 4 is placed on the laminated substrate 60 so that the surface on which the molding part 4a is formed (hereinafter referred to as the molding surface 4b) is abutted against the surface of the laminated substrate 60 on the metal sheet 69 side. The three-dimensionally shaped portion 6a is molded on the laminated substrate 60 by the molded portion 4a by being placed and pressed in this state. Further, in the pressing process, thermocompression molding (that is, integration of the circuit board 62, the resin layer 65, the main board 66, the resin board 67, and the metal layer 68) of the laminated board 60 is performed. The circuit component 63 mounted on the resin layer 65 is embedded in the resin layer 65. As a result, as shown in FIG. 1C, the thermocompression molding of the laminated substrate 60 and the molding of the three-dimensionally shaped portion 6a and the embedding of the circuit component 63 in the resin layer 65 can be simultaneously performed in the pressing process. Man-hours can be relatively reduced. Here, the circuit board 62, the main board 66, and the press die 4 are embedded so that the circuit component 63 is embedded in a predetermined region of the resin layer 65 that at least partially overlaps the three-dimensional shape portion 6 a in the thickness direction of the main board 66. Are pressed in a state of being aligned with each other in a plane orthogonal to the thickness direction of the main substrate 66. The conditions for the thermocompression molding described above can be set as appropriate. For example, the pressure may be 0.2 to 5 MPa, the temperature may be 100 to 150 ° C., and the time may be 60 to 600 seconds. Furthermore, in order to cure to the C stage state, the temperature is set to 150 to 200 ° C. and the time is set to 10 to 180 minutes.

  By the way, in this embodiment, the press die 4 provided with the molding part 4a which has the same height dimension h1 as the thickness dimension t1 of the resin substrate 67 is employ | adopted as the press die 4 used at a press process (h1 = t1). In other words, in the present embodiment, a B-stage resin sheet is used as the resin substrate 67, so that a plurality of (for example, three) resin sheets stacked on the main substrate 66 as the resin substrate 67 are stacked. A press die 4 having a molding part 4a having the same height dimension h1 as the total thickness dimension t1 is used. Thereby, as shown in FIG. 1B, the resin substrate 67 does not intervene between the molded portion 4a and the main substrate 66 in a state where the pressing is performed. In the present embodiment, since the metal sheet 69 is laminated on the resin substrate 67, the molded portion 4a does not directly contact the main substrate 66, but the metal sheet interposed between the molded portion 4a and the main substrate 66. 69 does not serve as a buffer material like the resin substrate 67, and the pressing force from the molding portion 4a is applied to the main substrate 66 without being relaxed by the metal sheet 69.

  In the circuit forming process after the pressing process, through holes 62b, 65b, 66b, 67b and via holes are formed in the laminated substrate 60 integrated in the pressing process, and the through holes 62b, 65b, 66b, 67b are formed. In addition, a conductive path is formed in the via hole, and the metal layer 68 is patterned to form the circuit pattern 68a described above from the metal layer 68. Specifically, a portion of the metal layer 68 that becomes the circuit pattern 68a is covered with a resist (not shown), and the metal layer 68 is subjected to an etching process, whereby an unnecessary portion of the metal layer 68 other than the circuit pattern 68a ( The metal layer 68 of the three-dimensional shape portion 6a is removed by etching. Thereafter, if the resist is removed, a circuit pattern 68 a is formed on one surface of the resin substrate 67.

  Furthermore, in this embodiment, in order to improve productivity, a method of simultaneously forming a plurality of individual substrates 6 in a single pressing process (so-called multi-cavity) is adopted. Specifically, a laminate mold 60 having a size that allows a plurality of individual substrates 6 to be taken is used, and a press die 4 in which a plurality of molding parts 4a having the same shape are arranged on the molding surface 4b is used. Use. Here, as an example, a press die 4 is used in which a plurality of molding portions 4a are formed in a lattice point shape so that the molding portions 4a are aligned at equal intervals on the molding surface 4b. In the pressing process, the circuit board 62, the main board 66, and the press mold 4 are aligned with each other by inserting pins (not shown) into through holes (not shown) formed at the four corners. Is done. Then, the individual substrate 6 is cut out from the laminated substrate 60 in the cutting step after the circuit forming step.

  According to the manufacturing method of the individual substrate 6 described above, since the press die 4 having the molding part 4a having the same height dimension h1 as the thickness dimension t1 of the resin substrate 67 is used, the state in which the pressing process is performed Thus, the resin substrate 67 is not interposed between the molding part 4a of the press mold 4 and the main substrate 66, and the pressing force applied to the main substrate 66 from the molding part 4a is relaxed by the resin substrate 67. There is no. Here, since the circuit component 63 is embedded in a predetermined region of the resin layer 65 that at least partially overlaps the three-dimensionally shaped portion 6 a in the thickness direction of the main substrate 66, the pressing force from the molding portion 4 a is out of the main substrate 66. It is applied to a portion corresponding to the predetermined area. Therefore, when the circuit component 63 is embedded in a predetermined region of the resin layer 65 in the pressing step, the main substrate 66 is pressed against the circuit component 63 through the resin layer 65, whereby the predetermined region of the main substrate 66 is placed in the predetermined region. Even if a stress is generated in the corresponding portion, an appropriate pressing force for canceling the stress can be applied from the molding portion 4a to the main substrate 66, and deformation of the main substrate 66 can be prevented.

  In the above-described embodiment, the laminated substrate 60 is formed by laminating the circuit board 62, the resin layer 65, the main substrate 66, the resin substrate 67, and the metal sheet 69 (metal layer 68). However, the present invention is not limited to 60, and the individual substrate 6 can be applied by applying the manufacturing method of the present invention to the laminated substrate 60 in which the resin substrate 67 is laminated on at least one surface of the main substrate 66 and the resin layer 65 is laminated on the other surface. Can be manufactured. For example, even when there is no metal sheet 69, the molding part 4 a directly contacts the main substrate 66 by using the press die 4 having the molding part 4 a having the same height dimension h 1 as the thickness dimension t 1 of the resin substrate 67. The proper pressing force can be applied to the main substrate 66 from the molding portion 4a. In this embodiment, the circuit component 63 mounted on the circuit board 62 is mounted on the circuit board 62 by stacking the resin layer 65 and the circuit board 62 on the main board 66 in the stacking process so that the circuit component 63 contacts the resin layer 65. However, the circuit component 63 is mounted on the other surface (resin layer 65 side) of the main board 66, and the circuit component 63 is embedded in the predetermined region of the resin layer 65. The circuit component 63 (mounted on the main board 66) may be embedded in the resin layer 65. In this case, the circuit board 62 may be omitted.

  Furthermore, in the above-described embodiment, the example in which the circuit component 63 is mounted on the upper surface side of the circuit board 62 in FIG. 3 and the plurality of chip-like electronic components 64 is mounted on the lower surface side is shown. A circuit component 63 is flip-chip mounted on the lower surface side of 62 (or, although not shown, the circuit component 63 may be die-bonded and then connected by wire bonding and resin-sealed). The chip-shaped electronic component 64 may be mounted by solder reflow. In this case, a plurality of chip-like electronic components 64 are provided in a predetermined region of the resin layer 65 that at least partially overlaps the three-dimensional shape portion 6a in the thickness direction of the main substrate 66, instead of the circuit component 63 made of the IC of the above embodiment. Is embedded as a circuit component. Therefore, when the chip-shaped electronic component 64 is embedded in a predetermined region of the resin layer 65 in the pressing process, the main substrate 66 is pressed against the chip-shaped electronic component 64 through the resin layer 65, so that Although a stress is generated in a portion corresponding to the predetermined region, an appropriate pressing force for canceling the stress can be applied from the molding portion 4a to the main substrate 66, so that the deformation of the main substrate 66 can be prevented. it can.

It is process sectional drawing of the principal part which shows the manufacturing method of the separate board | substrate of embodiment of this invention. The infrared detector same as the above is shown, (a) is a schematic plan view, and (b) is a schematic sectional view. It is a schematic exploded perspective view which shows an infrared detector same as the above. It is a schematic sectional drawing which shows the separate board | substrate of a prior art example. It is process sectional drawing of the principal part which shows the manufacturing method of the separate board | substrate same as the above. It is process sectional drawing of the principal part which shows the manufacturing method of the separate substrate of another prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pyroelectric element 4 Press die 4a Molding part 6 Piece board 6a Three-dimensional shape part 60 Laminated board 62 Circuit board 63 Circuit component 65 Resin layer 66 Main board 67 Resin board 67a Mounting area h1 Height dimension of molding part t1 Resin board Thickness dimension

Claims (3)

  It has a main substrate with a resin substrate laminated on one surface and a resin layer laminated on the other surface, and a three-dimensionally shaped part consisting of recesses is formed on one surface of the resin substrate opposite to the main substrate. A circuit board manufacturing method in which circuit components are embedded in a predetermined region at least partially overlapping with a three-dimensionally shaped portion in the thickness direction of the board, the circuit board being laminated on the surface of the resin layer opposite to the main board A laminating step of laminating at least a resin substrate and a resin layer on the main substrate so that a circuit component mounted on one of the main substrate and the main substrate contacts the resin layer; Forming the three-dimensional shape portion at the molding portion by pressing a press mold having a molding portion having a shape corresponding to the three-dimensional shape portion against the surface of the laminated substrate on the resin substrate side. Together with the predetermined resin layer And a pressing step of burying the circuit component to pass, as a press mold method of manufacturing a single-piece substrates characterized by using those having a molding portion having the same height as the thickness of the resin substrate.   An individual substrate manufactured by the method for manufacturing an individual substrate according to claim 1, further comprising a mounting region on which a mounting component is mounted on one surface of the three-dimensional shape portion side, wherein the three-dimensional shape portion includes at least one An individual substrate comprising: a recess formed in a mounting region to form a thermal insulation gap between the mounting component and the resin substrate. A solid substrate according to claim 2 and a pyroelectric element mounted on the mounting area as the mounting component, wherein the three-dimensionally shaped portion is formed at a position corresponding to the detection part of the pyroelectric element in the mounting area. Infrared detector characterized by being made.

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