JP4973854B2 - Pressure bonding apparatus and method for manufacturing piezoelectric element unit using the same - Google Patents

Description

  The present invention relates to a pressure bonding apparatus used for manufacturing a piezoelectric element unit having a piezoelectric element forming member in which a plurality of piezoelectric elements are integrally formed, that is, in a state where the piezoelectric element forming member and a fixed substrate are positioned. The present invention relates to a pressure bonding apparatus and a method of manufacturing a piezoelectric element unit using the same.

  As an apparatus using the displacement of a piezoelectric element, for example, a liquid ejecting head that ejects droplets of ink or the like from nozzle openings can be cited. Specifically, a part of the pressure generating chamber communicating with the nozzle opening is configured by a diaphragm, and the nozzle is opened by deforming the diaphragm by a piezoelectric element to apply pressure to the liquid supplied to the pressure generating chamber. Are discharged as droplets. As a piezoelectric element used for such a liquid ejecting head, for example, there is an element in which individual electrodes and common electrodes are alternately stacked with a piezoelectric material interposed therebetween. Specifically, for example, a non-vibration region of a piezoelectric vibration plate (piezoelectric element forming member) in which electrodes and piezoelectric materials are alternately laminated is bonded to a fixed substrate, and the vibration region of the piezoelectric vibration plate is cut into comb teeth. Accordingly, there is one configured as a piezoelectric vibrator unit (piezoelectric element unit) having a plurality of piezoelectric vibrators (piezoelectric elements) (see, for example, Patent Document 1). Such a piezoelectric element unit is used while being fixed in a state where the tip surface of each piezoelectric element is in contact with the diaphragm.

Japanese Patent Laid-Open No. 11-129474 (pages 3-4, FIGS. 1-2)

  Such a piezoelectric element unit is generally formed by bonding a piezoelectric element forming member and a fixed substrate in a relatively positioned state by a pressure bonding apparatus. Specifically, for example, as shown in FIG. 10, the fixed substrate 114 constituting the piezoelectric element unit 100 is held on a pressure bonding apparatus by a predetermined holding jig 143. Further, the piezoelectric element forming member 113 is engaged with the engaging member 144 having a substantially U shape. That is, the engagement member 144 is brought into contact with the end surface and both end surfaces of the piezoelectric element forming member 113 on the front end side. On the other hand, the end surface of the piezoelectric element forming member 113 on the proximal end side is pressed by the pressing member 147 toward the engaging member 144 side. As a result, the piezoelectric element forming member 113 is held in a state of being positioned at a predetermined position. Then, with the fixed substrate 114 and the piezoelectric element forming member 113 held in this manner, the piezoelectric element forming member 113 is pressed toward the fixed substrate 114, and an adhesive between the fixed substrate 114 and the piezoelectric element forming member 113 is used. Both are joined by curing.

  Thus, in the conventional pressure bonding apparatus, the tip end side of the piezoelectric element forming member is engaged with the engaging member. For this reason, when the piezoelectric element forming member is engaged with the engaging member, or when the piezoelectric element forming member is detached from the engaging member, the piezoelectric element forming member may be cracked or chipped. In particular, cracks and chips are likely to occur at both corners on the tip surface side of the piezoelectric element forming member.

  The present invention has been made in view of such circumstances, and provides a pressure bonding apparatus capable of preventing cracking and chipping of a piezoelectric element forming member and a method of manufacturing a piezoelectric element unit using the same. Objective.

The present invention that solves the above-described problem is a row of piezoelectric elements in which a plurality of individual electrodes and a common electrode are alternately stacked with a piezoelectric material layer interposed therebetween, and the tip end side is cut into a comb-like shape by a plurality of slits , When forming a piezoelectric element unit comprising: a piezoelectric element forming member provided with positioning portions provided on both outer sides of the row of piezoelectric elements; and a fixed substrate to which the base end side of the piezoelectric element forming member is bonded A pressure bonding apparatus that pressurizes and bonds the piezoelectric element forming member and the fixed substrate in a positioned state, and holds the fixed substrate in a predetermined position on a base. A contact member that is movably disposed so as to face the end surface of the fixed substrate held by the holding jig and is in contact with the end surface of the piezoelectric element forming member, Can move along contact parts A pair of chuck members disposed at both ends of the contact member and in contact with both end surfaces of the piezoelectric element forming member, and positioning the piezoelectric element forming member at a predetermined position on the base A positioning jig for holding, and a pressurizing unit that presses the piezoelectric element forming member toward the fixed substrate, and the contact member is formed at a portion where the positioning portion of the piezoelectric element forming member is formed. respectively in pressure bonding apparatus characterized by have a protrusion that abuts.
In the pressure bonding apparatus according to the present invention, since the contact member and the chuck member constituting the positioning jig are independent from each other, the piezoelectric element is formed by the contact member and the chuck member coming into contact with the piezoelectric element forming member. Generation | occurrence | production of the crack of a formation member and a chip | tip can be prevented.

  Here, it is preferable that the surface on the piezoelectric element forming member side of the chuck member is formed as a curved surface with the piezoelectric element forming member side being convex. Thereby, since the contact area between the piezoelectric element forming member and the chuck member can be kept small, it is possible to more reliably prevent the occurrence of cracks and chipping due to the chuck member coming into contact with the piezoelectric element forming member.

  Moreover, it is preferable that the positioning jig further includes a pressing member that comes into contact with the end surface on the proximal end side of the piezoelectric element forming member and presses the piezoelectric element forming member toward the contacting member. As a result, the piezoelectric element forming member can be positioned more accurately at the specified position and held well, and deformation of the piezoelectric element forming member can also be prevented.

Furthermore, the present invention is a method of manufacturing a piezoelectric element unit using such a pressure bonding apparatus, wherein the fixed substrate is held on the base in a state of being positioned at a predetermined position by the holding jig, The abutting member and one of the chuck members are moved and fixed in accordance with the specified position, and the piezoelectric element forming member is fixed to the portion of the abutting member at the portion where the positioning portion of the end surface on the tip side is formed. An adhesive is disposed on the fixed substrate so that the protruding portion abuts and the side end surface abuts on the one chuck member, and the other chuck member abuts on the side end surface of the piezoelectric element forming member. The piezoelectric element forming member is positioned at a specified position, and the piezoelectric element forming member is pressed toward the fixed substrate by the pressing means in a state where the piezoelectric element forming member is positioned at the specified position. In the manufacturing method of the piezoelectric element unit, characterized by bonding the fixed substrate and the piezoelectric element forming member by said adhesive Te.
In the manufacturing method of the present invention, it is possible to reliably prevent the piezoelectric element forming member from being cracked or chipped due to the contact member and the chuck member coming into contact with the piezoelectric element forming member.

  Here, after joining the piezoelectric element forming member and the fixed substrate, the contact member and the chuck member are moved toward the outside of the piezoelectric element forming member, and then the piezoelectric element forming member and the fixed member are fixed. It is preferable to remove the joined body with the substrate from the base. Thereby, also when removing a joined body from on a base, it can prevent that a piezoelectric element formation member contacts a contact member and a chuck member, and a crack and a chip | tip generate | occur | produce.

Hereinafter, the present invention will be described in detail based on embodiments.
FIG. 1 is a schematic perspective view of a piezoelectric element unit manufactured using a pressure bonding apparatus according to the present embodiment, and FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. As shown in FIGS. 1 and 2, the piezoelectric element unit 10 includes a piezoelectric element forming member 13 having a row 12 in which a plurality of piezoelectric elements 11 are arranged in parallel in the width direction, and a distal end side of the piezoelectric element forming member 13. It has the fixed board | substrate 14 to which the base end part side adhere | attaches with the adhesive agent 20 so that it may become a free end.

  The piezoelectric element forming member 13 is formed by alternately laminating piezoelectric material layers 15 and electrode layers 16 and 17 serving as common electrodes or individual electrodes. For example, a plurality of slits 18 are formed by a wire saw or the like. By forming, it is cut into a comb-like shape to form a row 12 of piezoelectric elements 11. Further, on both outer sides of the rows 12 of the piezoelectric elements 11, positioning portions 19 having a wider width than the piezoelectric elements 11 are provided. The positioning unit 19 is provided to position the piezoelectric element unit 10 with high accuracy when the piezoelectric element unit 10 is incorporated into the liquid jet head. The piezoelectric material layer 15 and the electrode layer 16 are the same as those of the piezoelectric element 11. , 17 but is a dummy element that is not driven because it is not connected to an external electrode. On the other hand, the fixed substrate 14 is made of, for example, a plate-like member made of stainless steel (SUS) or the like, and the non-piezoelectric element forming member 13 is non-movable so that the distal end side which is the vibration region of the piezoelectric element forming member 13 becomes a free end. The base end side that is the vibration region is bonded by the adhesive 20.

  Such a piezoelectric element unit 10 is mounted on, for example, a liquid jet head. An ink jet recording head will be described below as an example. FIG. 3 is a cross-sectional view schematically showing the ink jet recording head. As shown in FIG. 3, a pressure generating chamber 31 is formed in the flow path forming substrate 30, and a plurality of the pressure generating chambers 31 are arranged in the width direction. In addition, a reservoir 32 for supplying ink to each pressure generating chamber 31 is communicated with each pressure generating chamber 31 via an ink supply port 33 on one end side in the longitudinal direction. Further, the opening surface side of the pressure generating chamber 31 of the flow path forming substrate 30 is sealed with a vibration plate 34, and a nozzle plate 36 having a nozzle opening 35 formed therein is joined to the other surface side. A head case 38 having an ink supply path 37 connected to an ink storage portion such as an ink cartridge (not shown) or a sub tank that receives ink supplied from the main tank is fixed on the vibration plate 34. The piezoelectric element unit 10 described above is positioned and fixed with high accuracy. That is, the piezoelectric element unit 10 is fixed in a state in which the tip surface of each piezoelectric element 11 is in contact with each island portion 39 provided in a region corresponding to each pressure generating chamber 31 on the vibration plate 34.

  In the ink jet recording head configured as described above, the ink is supplied to the reservoir 32 via the ink supply path communicating with the ink reservoir, and is distributed to each pressure generating chamber 31 via the ink supply port 33. Actually, the piezoelectric element 11 is contracted by applying a voltage to the piezoelectric element 11. As a result, the diaphragm 34 is pulled up together with the piezoelectric element 11 to expand the volume of the pressure generating chamber 31, and ink is drawn into the pressure generating chamber 31. Then, after filling the inside with ink until the nozzle opening 35 is reached, the voltage applied to the piezoelectric element 11 is released according to the recording signal from the drive circuit, and the piezoelectric element 11 is expanded to return to the original state. As a result, the vibration plate 34 is also displaced to return to the original state, so that the pressure generating chamber 31 is contracted, the internal pressure is increased, and ink droplets are ejected from the nozzle openings 35.

  In such a liquid ejecting head such as an ink jet recording head, ink droplets are ejected from the nozzle openings 35 by utilizing extremely minute deformation (extension / contraction) of the piezoelectric element 11. It is necessary to form the piezoelectric element unit 10 to be formed with extremely high accuracy. For example, it is necessary to join the fixed substrate 14 and the piezoelectric element forming member 13 with high accuracy.

  Hereinafter, the pressure bonding apparatus of the present invention using the fixed substrate 14 and the piezoelectric element forming member 13 for bonding will be described. 4 is a schematic perspective view of the pressure bonding apparatus, FIG. 5 is a partial cross-sectional view of the pressure bonding apparatus in the front direction, and FIG. 6 is a cross-sectional view taken along line BB ′ of FIG.

  As shown in the figure, the pressure bonding apparatus 40 has a base 42 provided on the apparatus main body 41, and a holding jig 43 for holding the fixed substrate 14 is detachably provided on the base 42. . In the pressure bonding apparatus 40 according to the present embodiment, a plurality of, for example, two fixed substrates 14 are held by the holding jig 43, and a plurality of piezoelectric element units 10 can be formed simultaneously.

  A positioning jig 44 for positioning the piezoelectric element forming member 13 at a predetermined position is provided on the apparatus main body 41. The positioning jig 44 is disposed so as to face the end surface of the fixed substrate 14 held by the holding jig 43, and comes into contact with the end surface on the tip end side of the piezoelectric element forming member 13. A pair of chuck members 46 (the first chuck member 46A and the second chuck member 46A) are slidably disposed along the contact member 45 at both ends of the contact member 45 and are in contact with both end surfaces of the piezoelectric element forming member 13, respectively. Chuck member 46B). Further, in the present embodiment, the positioning jig 44 further includes a pressing member 47 that is disposed on the proximal end side of the piezoelectric element forming member 13 and presses the piezoelectric element forming member 13 toward the contact member 45.

  The abutting member 45 is provided with a protruding portion 48 that protrudes toward the piezoelectric element forming member 13 (fixed substrate 14) and comes into contact with the front end surface of the piezoelectric element forming member 13. The protrusion 48 is provided corresponding to a portion corresponding to the vicinity of both ends of the piezoelectric element forming member 13, that is, a portion where the positioning portion 19 of the piezoelectric element forming member 13 is formed. Thereby, the contact member 45 does not come into contact with the region where the piezoelectric element 11 of the piezoelectric element forming member 13 is formed, and the occurrence of chipping or cracking of the tip portion of the piezoelectric element 11 is prevented. The pair of chuck members 46 are slidably provided along the contact member 45 at positions corresponding to both end portions of the contact member 45. In addition, in the present embodiment, the surface of each chuck member 46 that contacts the piezoelectric element forming member 13 is a curved surface that is convex on the piezoelectric element forming member 13 side. In other words, the contact area of each chuck member 46 with the piezoelectric element forming member 13 is reduced to prevent the piezoelectric element forming member 13 from cracking.

  The pressing member 47 has a contact portion 49 that is provided to face the end surface on the base end portion side of the piezoelectric element forming member 13 and contacts the end surface of the piezoelectric element forming member 13. In the embodiment, the piezoelectric element forming member 13 is formed with an area equal to or larger than the end face of the base end portion side. That is, the abutting portion 49 of the pressing member 47 has a size that makes contact with substantially the entire end surface of the piezoelectric element forming member 13 on the proximal end side. Accordingly, when the piezoelectric element forming member 13 and the fixed substrate 14 are joined, the piezoelectric element forming member 13 is reliably supported by the pressing member 47 (contact portion 49), and deformation of the piezoelectric element forming member 13 is prevented. .

  A pair of slide shafts 50 are erected on both ends of the base 42 to which the holding jig 43 is fixed. The piezoelectric element forming member 13 is attached to the pair of slide shafts 50 on the fixed substrate 14 side. A pressurizing member (pressurizing means) 51 for pressing is fixed to be slidable in the axial direction. The pressure member 51 is inserted into, for example, a slide member 52 that is fixed to the slide shaft 50 so as to be movable in the vertical direction, and a slit-shaped guide hole 53 provided in the slide member 52, and the distal end portion is on the base 42 side. The top member 54 is engaged with and held by the slide member 52 in a state of projecting to the top, and the top member 54 is fixed to the slide member 52 and the tip surface of the top member 54 is in contact with the piezoelectric element forming member 13. And an urging member 55 that presses the piezoelectric element forming member 13 side.

  Here, the slide member 52 according to this embodiment includes a support plate 56 that is fixed to the slide shaft 50 so as to be movable in the vertical direction, and a guide that is fixed to the lower surface side of the support plate 56 and through which the top member 54 is inserted. The guide plate 57 is provided with a hole 53, and the fixing plate 58 is provided on the upper surface side of the support plate 56 and fixes the urging member 55 together with the support plate 56.

  The piece member 54 is provided corresponding to each fixed substrate 14 held by each holding jig 43. For example, in this embodiment, two piece members 54 are provided. That is, the guide plate 57 is provided with two guide holes 53 corresponding to the respective fixed substrates 14, and each piece member 54 is inserted into each guide hole 53 and is engaged and held by the guide plate 57. Yes. Specifically, each piece member 54 has a flange portion 59 on the base end (upper end) side, and when the top member 54 is inserted into the guide hole 53, the tip end is below the base plate 57 (base side). The flange portion 59 is locked to the surface of the guide plate 57 in a state where the flange portion 59 projects. An elastic layer 60 made of an elastic material is provided on the front end surface of the top member 54 on the holding jig 43 side.

  The urging member 55 is provided independently for each piece member 54. In addition, it is preferable that a plurality of urging members 55 are provided for each piece member 54. For example, in this embodiment, two urging members 55 are provided at a predetermined interval for each piece member 54. Is provided. It is preferable that the tip of the urging member 55 that contacts the piece member 54 has a shape that makes point contact with the piece member 54. For example, the urging member 55 according to the present embodiment is configured such that the spherical body 62 inserted into the cylindrical body 61 is urged by an elastic member 63 made of, for example, a coil spring or the like, and the opening at the tip of the cylindrical body 61 is opened. It is held in a state of slightly protruding from.

  An elastic member 64 made of, for example, a coil spring is interposed between the biasing member 55 and the top member 54. In a state where the piece member 54 is not in contact with the piezoelectric element forming member 13, a predetermined interval is secured between the piece member 54 and the biasing member 55, and the piece member 54 is composed only of the elastic member 64. It is energized.

  Hereinafter, the manufacturing procedure of the piezoelectric element unit 10 using such a pressure bonding apparatus 40 will be described in detail with reference to FIGS. FIG. 7 is a plan view showing the manufacturing process of the piezoelectric element unit, and FIG. 8 is a cross-sectional view showing the manufacturing process of the piezoelectric element unit.

  As shown in FIG. 7A, first, the holding jig 43 with the fixed substrate 14 fixed at a predetermined position is positioned and fixed on the base 42. As described above, in the present embodiment, the two fixing substrates 14 are held by the holding jig 43. The positioning method of the holding jig 43 is not particularly limited. For example, a reference pin (not shown) serving as a reference is provided on the base 42 and the holding jig 43 is brought into contact with the reference pin. Position. At this time, the abutting member 45, the chuck member 46 and the pressing member 47, which are positioning jigs 44 for positioning and holding the piezoelectric element forming member 13, are arranged outside the base 42 corresponding to the respective fixed substrates 14. ing.

  Next, as shown in FIG. 7B, the contact member 45 and one of the chuck members, for example, the first chuck member 46A are moved, that is, the position where the piezoelectric element forming member 13 is fixed, that is, FIG. Fix according to the specified position indicated by the middle dotted line. Of course, the second chuck member 46B may be moved instead of the first chuck member 46A.

  Next, as shown in FIG. 7C, the piezoelectric element forming member 13 is placed on the fixed substrate 14 in accordance with the fixed contact member 45 and the first chuck member 46A. That is, the piezoelectric element forming member 13 is placed on the fixed substrate 14 so that the tip end surface thereof is in contact with the contact member 45 and the side end surface thereof is in contact with the first chuck member 46A. At this time, an adhesive is applied to either the fixed substrate 14 or the piezoelectric element forming member 13, and the piezoelectric element forming member 13 is placed on the fixed substrate 14 via the adhesive.

  Here, the piezoelectric element forming member 13 may actually be in contact with the contact member 45 and the first chuck member 46A. However, the piezoelectric element forming member 13 and the contact member 45 and the first chuck member 46A may be in contact with each other. There may be a slight gap between the two.

  Next, as shown in FIG. 8A, the second chuck member 46B is moved and fixed according to the specified position. At this time, if the position of the piezoelectric element forming member 13 is closer to the second chuck member 46B than the specified position, the second chuck member 46B comes into contact with the side end surface of the piezoelectric element forming member 13, and the second The piezoelectric element forming member 13 moves together with the chuck member 46B. As a result, the piezoelectric element forming member 13 is accurately positioned at the specified position in the direction along the contact member 45 (the left-right direction in the figure).

  Next, in this embodiment, as shown in FIG. 8B, the pressing member 47 is moved to the piezoelectric element forming member 13 side and fixed in accordance with a specified position. At this time, if the position of the piezoelectric element forming member 13 is closer to the pressing member 47 than the prescribed position, the contact portion 49 of the pressing member 47 contacts the end surface of the piezoelectric element forming member 13 on the proximal end side. The piezoelectric element forming member 13 moves together with the pressing member 47. As a result, the piezoelectric element forming member 13 is accurately positioned at a specified position in a direction (vertical direction in the drawing) orthogonal to the contact member 45. That is, the piezoelectric element forming member 13 is in contact with the protruding portion 48 of the contact member 45, the contact portion 49 of each chuck member 46, and the pressing member 47, and is accurately positioned at the specified position.

  In the pressure bonding apparatus 40 of the present invention, since the piezoelectric element forming member 13 is positioned at the specified position in such a procedure, the piezoelectric element formed by the contact member 45 and the chuck member 46 contacting the piezoelectric element forming member 13. Generation | occurrence | production of the crack and notch | chip of the formation member 13 can be prevented. In particular, it is possible to effectively prevent the occurrence of cracking or chipping at both corners of the piezoelectric element forming member 13 on the contact member 45 side. Furthermore, since only the projecting portion 48 of the contact member 45 contacts the end surface of the piezoelectric element forming member 13 on the front end side, it is possible to prevent the region where the piezoelectric element 11 is formed from being chipped or cracked. Can do.

  Further, in the present embodiment, as described above, the piezoelectric element is formed between the pressing member 47 and the protruding portion 48 of the contact member 45 by pressing the piezoelectric element forming member 13 with a predetermined pressure by the pressing member 47. The member 13 is sandwiched and held. For this reason, the contact member 45 does not contact the tip of the piezoelectric element 11. Therefore, the piezoelectric element forming member 13 can be held without damaging the tip of the piezoelectric element 11.

  Next, as shown in FIG. 9, the pressurizing member 51 (sliding member 52) is moved to a predetermined position by pressurizing means (not shown) constituted by, for example, a drive device using a drive motor, a hydraulic pump or an electromagnetic pump. The piezoelectric element forming member 13 is pressed to the fixed substrate 14 side with a predetermined pressure by the top member 54. Specifically, when the slide member 52 is lowered and fixed until the top member 54 comes into contact with the spherical body 62 at the tip of the urging member 55, the piezo member 54 is formed by the urging member 55 and the elastic member 64 to form a piezoelectric element. As a result, the piezoelectric element forming member 13 is pressed to the fixed substrate 14 side by a predetermined pressure by the piece member 54. Then, the adhesive 20 (see FIG. 2) is heat-cured at a temperature of about 150 ° C. to 200 ° C., for example, while the piezoelectric element forming member 13 is pressed toward the fixed substrate 14 in this way.

  Thus, when the adhesive 20 is heat-cured, the piezoelectric element forming member 13 may be deformed by the heat. However, in this embodiment, since the piezoelectric element forming member 13 is held in a state where the contact portion 49 of the pressing member 47 is in contact with substantially the entire end surface on the base end side, piezoelectric element formation by heat is performed. The deformation of the member 13 can be suppressed.

  Thereafter, although not shown, the joined body of the piezoelectric element forming member 13 and the fixed substrate 14 is removed from the pressure joining device 40. At this time, each of the contact member 45, each chuck member 46, and the pressing member 47 is moved toward the outside of the piezoelectric element forming member 13. That is, it is preferable to remove the contact member 45, the chuck member 46, and the pressing member 47 from the piezoelectric element forming member 13 and then remove the joined body of the piezoelectric element forming member 13 and the fixed substrate 14 from the base 42. Thereby, when removing the joined body from the base 42, it is possible to prevent the piezoelectric element forming member 13 from coming into contact with the contact member 45 and the chuck member 46 and causing cracks or chips.

  In addition, the joined body of the removed piezoelectric element forming member 13 and the fixed substrate 14 is, for example, a piezoelectric element as shown in FIG. Unit 10 is manufactured.

  As described above, according to the present invention, the piezoelectric element forming member 13 can be positioned with high accuracy and bonded to the fixed substrate 14, and the piezoelectric element forming member 13 is prevented from being deformed or chipped. can do. Therefore, a high-quality piezoelectric element unit 10 can be formed, and when the piezoelectric element unit 10 is incorporated into an ink jet recording head, the tip of each piezoelectric element 11 is reliably brought into contact with the island portion 39 of the diaphragm 34. (See FIG. 3). Therefore, for example, it is possible to realize an ink jet recording head that prevents the occurrence of printing defects such as missing dots.

  As mentioned above, although one embodiment of the present invention was described, of course, the present invention is not limited to such an embodiment. For example, in the above-described embodiment, the pressing member 47 that presses the piezoelectric element forming member 13 is provided, and the pressing member 47 and the abutting member 45 sandwich the piezoelectric element forming member 13. Alternatively, the piezoelectric element forming member 13 may be held between the chuck members 46A and 46B. In this case, the pressing member 47 may not be provided. For example, when the piezoelectric element forming member 13 is placed on the fixed substrate 14, if the piezoelectric element forming member 13 can be reliably brought into contact with the contact member 45 and one chuck member 46, the pressing member 47 is provided. Even if not, the piezoelectric element forming member 13 can be held in a state of being accurately positioned at the specified position. Further, for example, in the above-described embodiment, the example in which the contact surface that contacts the piezoelectric element forming member 13 of each chuck member 46 is configured as a curved surface has been described. Of course, the contact surfaces of these chuck members 46 are You may be comprised by the plane.

It is a schematic perspective view which shows an example of a piezoelectric element unit. It is sectional drawing which shows an example of a piezoelectric element unit. FIG. 3 is a cross-sectional view illustrating an outline of a liquid jet head on which a piezoelectric element unit is mounted. 1 is a schematic perspective view of a pressure bonding apparatus according to an embodiment. 1 is a partial cross-sectional view of a pressure bonding apparatus according to an embodiment. It is sectional drawing of the pressure bonding apparatus which concerns on one Embodiment. It is a top view which shows the manufacturing process of the piezoelectric element unit which concerns on one Embodiment. It is a top view which shows the manufacturing process of the piezoelectric element unit which concerns on one Embodiment. It is sectional drawing which shows the manufacturing process of the piezoelectric element unit which concerns on one Embodiment. It is the schematic which shows an example of the pressure bonding apparatus which concerns on a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Piezoelectric element unit, 11 Piezoelectric element, 13 Piezoelectric element formation member, 14 Fixed substrate, 20 Adhesive, 40 Pressure bonding apparatus, 41 Apparatus main body, 42 Base, 43 Holding jig, 44 Positioning jig, 45 Contact Member, 46 chuck member, 47 pressing member, 48 projecting portion, 49 contact portion

Claims (5)

A plurality of individual electrodes and a common electrode are alternately stacked with a piezoelectric material layer interposed therebetween, and the tip end side is cut into a comb-like shape by a plurality of slits , on both outer sides of the piezoelectric element rows A piezoelectric element forming member comprising: a piezoelectric element forming member provided with a positioning portion provided ; and a fixed substrate to which a base end side of the piezoelectric element forming member is bonded; And a pressure bonding apparatus for pressure bonding in a state where the fixed substrate is positioned,
A holding jig for holding the fixed substrate in a state of being positioned at a predetermined position on the base;
A contact member that is arranged to be movable so as to face the end surface of the fixed substrate held by the holding jig and is in contact with the end surface of the piezoelectric element forming member; A pair of chuck members which are arranged at both ends of the contact member so as to be movable along the two ends of the piezoelectric element forming member, and which are in contact with both end surfaces of the piezoelectric element forming member. A positioning jig for positioning and holding the forming member;
Pressurizing means for pressing the piezoelectric element forming member toward the fixed substrate;
Equipped with,
It said abutment member, the piezoelectric element forming member and the positioning unit pressure bonding apparatus characterized by have a respective protrusion abuts a portion is formed of.   2. The pressure bonding apparatus according to claim 1, wherein a surface of the chuck member on the piezoelectric element forming member side is formed as a curved surface having a convex surface on the piezoelectric element forming member side. The positioning jig, the claim 1, characterized by further comprising a pressing member for pressing the piezoelectric element forming member proximal end of the end surface in contact with the piezoelectric element forming member wherein the contact member side or 2. The pressure bonding apparatus according to 2. A method for manufacturing a piezoelectric element unit using the pressure bonding apparatus according to any one of claims 1 to 3 ,
Holding the fixed substrate on the base in a state positioned at a predetermined position by the holding jig;
The contact member and one of the chuck members are moved and fixed in accordance with the specified position,
The piezoelectric element forming member is fixed so that the protruding portion of the abutting member abuts on a portion where the positioning portion of the end surface on the tip end side abuts and the side end surface abuts on the one chuck member. Place it on the substrate with an adhesive,
The other chuck member is brought into contact with a side end surface of the piezoelectric element forming member to position the piezoelectric element forming member at a specified position,
With the piezoelectric element forming member positioned at the specified position, the pressure element presses the piezoelectric element forming member toward the fixed substrate and joins the piezoelectric element forming member and the fixed substrate with the adhesive. A method for manufacturing a piezoelectric element unit, comprising: After joining the piezoelectric element forming member and the fixed substrate, the contact member and the chuck member are moved toward the outside of the piezoelectric element forming member, and then the piezoelectric element forming member and the fixed substrate are moved. The method of manufacturing a piezoelectric element unit according to claim 4 , wherein the joined body is removed from the base.