JP4973854B2 - Pressure bonding apparatus and method for manufacturing piezoelectric element unit using the same - Google Patents

Pressure bonding apparatus and method for manufacturing piezoelectric element unit using the same Download PDF

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JP4973854B2
JP4973854B2 JP2007086084A JP2007086084A JP4973854B2 JP 4973854 B2 JP4973854 B2 JP 4973854B2 JP 2007086084 A JP2007086084 A JP 2007086084A JP 2007086084 A JP2007086084 A JP 2007086084A JP 4973854 B2 JP4973854 B2 JP 4973854B2
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piezoelectric element
element forming
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fixed substrate
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潤也 等々力
祐介 島田
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Seiko Epson Corp
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本発明は、複数の圧電素子が一体的に形成される圧電素子形成部材を有する圧電素子ユニットの製造に用いられる加圧接合装置、すなわち、圧電素子形成部材と固定基板とを位置決めした状態で接合する加圧接合装置及びそれを用いた圧電素子ユニットの製造方法に関する。   The present invention relates to a pressure bonding apparatus used for manufacturing a piezoelectric element unit having a piezoelectric element forming member in which a plurality of piezoelectric elements are integrally formed, that is, in a state where the piezoelectric element forming member and a fixed substrate are positioned. The present invention relates to a pressure bonding apparatus and a method of manufacturing a piezoelectric element unit using the same.

圧電素子の変位を利用した装置としては、例えば、インク等の液滴をノズル開口から吐出させる液体噴射ヘッドが挙げられる。具体的には、ノズル開口と連通する圧力発生室の一部を振動板で構成し、この振動板を圧電素子により変形させて圧力発生室に供給された液体に圧力を付与することでノズル開口から液滴として吐出させている。そして、このような液体噴射ヘッド等に利用される圧電素子としては、例えば、個別電極と共通電極とが圧電材料を挟んで交互に積層形成されたものがある。具体的には、例えば、電極と圧電材料とを交互に積層した圧電振動板(圧電素子形成部材)の非振動領域を固定基板に接合すると共に、圧電振動板の振動領域を櫛歯状に切り分けることによって複数の圧電振動子(圧電素子)を有する圧電振動子ユニット(圧電素子ユニット)として構成されたものがある(例えば、特許文献1参照)。そして、このような圧電素子ユニットは、各圧電素子の先端面を振動板に当接させた状態で固定されて使用される。   As an apparatus using the displacement of a piezoelectric element, for example, a liquid ejecting head that ejects droplets of ink or the like from nozzle openings can be cited. Specifically, a part of the pressure generating chamber communicating with the nozzle opening is configured by a diaphragm, and the nozzle is opened by deforming the diaphragm by a piezoelectric element to apply pressure to the liquid supplied to the pressure generating chamber. Are discharged as droplets. As a piezoelectric element used for such a liquid ejecting head, for example, there is an element in which individual electrodes and common electrodes are alternately stacked with a piezoelectric material interposed therebetween. Specifically, for example, a non-vibration region of a piezoelectric vibration plate (piezoelectric element forming member) in which electrodes and piezoelectric materials are alternately laminated is bonded to a fixed substrate, and the vibration region of the piezoelectric vibration plate is cut into comb teeth. Accordingly, there is one configured as a piezoelectric vibrator unit (piezoelectric element unit) having a plurality of piezoelectric vibrators (piezoelectric elements) (see, for example, Patent Document 1). Such a piezoelectric element unit is used while being fixed in a state where the tip surface of each piezoelectric element is in contact with the diaphragm.

特開平11−129474号公報(第3〜4頁、第1〜2図)Japanese Patent Laid-Open No. 11-129474 (pages 3-4, FIGS. 1-2)

このような圧電素子ユニットは、一般的に、加圧接合装置によって圧電素子形成部材と固定基板とを相対的に位置決めした状態で接合することによって形成される。具体的には、例えば、図10に示すように、圧電素子ユニット100を構成する固定基板114を加圧接合装置上に所定の保持治具143によって保持する。また、略コ字形状を有する係合部材144に圧電素子形成部材113を係合させる。すなわち、圧電素子形成部材113の先端部側の端面及び両側端面に係合部材144を当接させる。一方、圧電素子形成部材113の基端部側の端面を押圧部材147で係合部材144側に向かって押圧する。これにより、圧電素子形成部材113が所定位置に位置決めされた状態で保持される。そして、このように固定基板114及び圧電素子形成部材113が保持された状態で、圧電素子形成部材113を固定基板114側に押圧し、固定基板114と圧電素子形成部材113との間の接着剤を硬化させることで両者を接合している。   Such a piezoelectric element unit is generally formed by bonding a piezoelectric element forming member and a fixed substrate in a relatively positioned state by a pressure bonding apparatus. Specifically, for example, as shown in FIG. 10, the fixed substrate 114 constituting the piezoelectric element unit 100 is held on a pressure bonding apparatus by a predetermined holding jig 143. Further, the piezoelectric element forming member 113 is engaged with the engaging member 144 having a substantially U shape. That is, the engagement member 144 is brought into contact with the end surface and both end surfaces of the piezoelectric element forming member 113 on the front end side. On the other hand, the end surface of the piezoelectric element forming member 113 on the proximal end side is pressed by the pressing member 147 toward the engaging member 144 side. As a result, the piezoelectric element forming member 113 is held in a state of being positioned at a predetermined position. Then, with the fixed substrate 114 and the piezoelectric element forming member 113 held in this manner, the piezoelectric element forming member 113 is pressed toward the fixed substrate 114, and an adhesive between the fixed substrate 114 and the piezoelectric element forming member 113 is used. Both are joined by curing.

このように従来の加圧接合装置では、圧電素子形成部材の先端部側を係合部材に係合させている。このため、圧電素子形成部材を係合部材に係合させる際、或いは係合部材から圧電素子形成部材を取り外す際に、圧電素子形成部材に割れや欠けが生じてしまう虞がある。特に、圧電素子形成部材の先端面側の両角部において割れや欠けが生じやすい。   Thus, in the conventional pressure bonding apparatus, the tip end side of the piezoelectric element forming member is engaged with the engaging member. For this reason, when the piezoelectric element forming member is engaged with the engaging member, or when the piezoelectric element forming member is detached from the engaging member, the piezoelectric element forming member may be cracked or chipped. In particular, cracks and chips are likely to occur at both corners on the tip surface side of the piezoelectric element forming member.

本発明はこのような事情に鑑みてなされたものであり、圧電素子形成部材の割れや欠けを防止することができる加圧接合装置及びそれを用いた圧電素子ユニットの製造方法を提供することを目的とする。   The present invention has been made in view of such circumstances, and provides a pressure bonding apparatus capable of preventing cracking and chipping of a piezoelectric element forming member and a method of manufacturing a piezoelectric element unit using the same. Objective.

上記課題を解決する本発明は、個別電極と共通電極とが圧電材料層を挟んで交互に複数積層されてなりその先端部側が複数のスリットによって櫛歯状に切り分けられ圧電素子の列と、該圧電素子の列の両外側に設けられた位置決め部とを備える圧電素子形成部材と、該圧電素子形成部材の基端部側が接合される固定基板と、を具備する圧電素子ユニットを形成する際に用いられ、前記圧電素子形成部材と前記固定基板とを位置決めした状態で加圧接合する加圧接合装置であって、基台上の所定位置に前記固定基板を位置決めした状態で保持する保持治具と、前記保持治具に保持された前記固定基板の端面に対向して移動可能に配されて前記圧電素子形成部材の前記先端部側の端面に当接される当接部材と、前記当接部材に沿って移動可能に当該当接部材の両端部に配されて前記圧電素子形成部材の両側端面にそれぞれ当接される一対のチャック部材とを有し、前記基台上の規定位置に前記圧電素子形成部材を位置決めして保持する位置決め治具と、前記圧電素子形成部材を前記固定基板側に押圧する加圧手段と、を具備し、前記当接部材が、前記圧電素子形成部材の前記位置決め部が形成される部分にそれぞれ当接する突出部を有することを特徴とする加圧接合装置にある。
かかる本発明の加圧接合装置では、位置決め治具を構成する当接部材とチャック部材とがそれぞれ独立しているため、これら当接部材及びチャック部材が圧電素子形成部材に接触することによる圧電素子形成部材の割れや欠けの発生を防止することができる。
The present invention that solves the above-described problem is a row of piezoelectric elements in which a plurality of individual electrodes and a common electrode are alternately stacked with a piezoelectric material layer interposed therebetween, and the tip end side is cut into a comb-like shape by a plurality of slits , When forming a piezoelectric element unit comprising: a piezoelectric element forming member provided with positioning portions provided on both outer sides of the row of piezoelectric elements; and a fixed substrate to which the base end side of the piezoelectric element forming member is bonded A pressure bonding apparatus that pressurizes and bonds the piezoelectric element forming member and the fixed substrate in a positioned state, and holds the fixed substrate in a predetermined position on a base. A contact member that is movably disposed so as to face the end surface of the fixed substrate held by the holding jig and is in contact with the end surface of the piezoelectric element forming member, Can move along contact parts A pair of chuck members disposed at both ends of the contact member and in contact with both end surfaces of the piezoelectric element forming member, and positioning the piezoelectric element forming member at a predetermined position on the base A positioning jig for holding, and a pressurizing unit that presses the piezoelectric element forming member toward the fixed substrate, and the contact member is formed at a portion where the positioning portion of the piezoelectric element forming member is formed. respectively in pressure bonding apparatus characterized by have a protrusion that abuts.
In the pressure bonding apparatus according to the present invention, since the contact member and the chuck member constituting the positioning jig are independent from each other, the piezoelectric element is formed by the contact member and the chuck member coming into contact with the piezoelectric element forming member. Generation | occurrence | production of the crack of a formation member and a chip | tip can be prevented.

ここで、前記チャック部材の前記圧電素子形成部材側の面が、当該圧電素子形成部材側が凸となる曲面で形成されていることが好ましい。これにより、圧電素子形成部材とチャック部材との接触面積が小さく抑えられるため、圧電素子形成部材にチャック部材が接触することによる割れや欠けの発生をさらに確実に防止することができる。   Here, it is preferable that the surface on the piezoelectric element forming member side of the chuck member is formed as a curved surface with the piezoelectric element forming member side being convex. Thereby, since the contact area between the piezoelectric element forming member and the chuck member can be kept small, it is possible to more reliably prevent the occurrence of cracks and chipping due to the chuck member coming into contact with the piezoelectric element forming member.

また、前記位置決め治具が、前記圧電素子形成部材の基端部側の端面に当接して当該圧電素子形成部材を前記当接部材側に押圧する押圧部材をさらに有することが好ましい。これにより、圧電素子形成部材を規定位置にさらに正確に位置決めして良好に保持することができると共に、圧電素子形成部材の変形も防止することができる。   Moreover, it is preferable that the positioning jig further includes a pressing member that comes into contact with the end surface on the proximal end side of the piezoelectric element forming member and presses the piezoelectric element forming member toward the contacting member. As a result, the piezoelectric element forming member can be positioned more accurately at the specified position and held well, and deformation of the piezoelectric element forming member can also be prevented.

さらに本発明は、このような加圧接合装置を用いた圧電素子ユニットの製造方法であって、前記保持治具によって所定位置に位置決めした状態で前記固定基板を前記基台上に保持し、前記当接部材及び一方の前記チャック部材を前記規定位置に合わせて移動して固定し、前記圧電素子形成部材を、その先端側の端面の前記位置決め部が形成される部分に前記当接部材の前記突出部が当接し且つその側端面が前記一方のチャック部材に当接するように前記固定基板上に接着剤を介して配置し、他方の前記チャック部材を前記圧電素子形成部材の側端面に当接させて前記圧電素子形成部材を規定位置に位置決めし、当該圧電素子形成部材を前記規定位置に位置決めした状態で、前記加圧手段によって前記圧電素子形成部材を前記固定基板側に押圧して前記接着剤によって前記圧電素子形成部材と前記固定基板とを接合することを特徴とする圧電素子ユニットの製造方法にある。
かかる本発明の製造方法では、当接部材及びチャック部材が圧電素子形成部材に接触することによる圧電素子形成部材の割れや欠けの発生を確実に防止することができる。
Furthermore, the present invention is a method of manufacturing a piezoelectric element unit using such a pressure bonding apparatus, wherein the fixed substrate is held on the base in a state of being positioned at a predetermined position by the holding jig, The abutting member and one of the chuck members are moved and fixed in accordance with the specified position, and the piezoelectric element forming member is fixed to the portion of the abutting member at the portion where the positioning portion of the end surface on the tip side is formed. An adhesive is disposed on the fixed substrate so that the protruding portion abuts and the side end surface abuts on the one chuck member, and the other chuck member abuts on the side end surface of the piezoelectric element forming member. The piezoelectric element forming member is positioned at a specified position, and the piezoelectric element forming member is pressed toward the fixed substrate by the pressing means in a state where the piezoelectric element forming member is positioned at the specified position. In the manufacturing method of the piezoelectric element unit, characterized by bonding the fixed substrate and the piezoelectric element forming member by said adhesive Te.
In the manufacturing method of the present invention, it is possible to reliably prevent the piezoelectric element forming member from being cracked or chipped due to the contact member and the chuck member coming into contact with the piezoelectric element forming member.

ここで、前記圧電素子形成部材と前記固定基板とを接合後、前記当接部材及び前記チャック部材のそれぞれを前記圧電素子形成部材の外側に向かって移動させてから前記圧電素子形成部材と前記固定基板との接合体を前記基台上から取り外すことが好ましい。これにより、接合体を基台上から取り外す際にも、圧電素子形成部材が当接部材及びチャック部材に接触して割れや欠けが発生するのを防止することができる。   Here, after joining the piezoelectric element forming member and the fixed substrate, the contact member and the chuck member are moved toward the outside of the piezoelectric element forming member, and then the piezoelectric element forming member and the fixed member are fixed. It is preferable to remove the joined body with the substrate from the base. Thereby, also when removing a joined body from on a base, it can prevent that a piezoelectric element formation member contacts a contact member and a chuck member, and a crack and a chip | tip generate | occur | produce.

以下に本発明を実施形態に基づいて詳細に説明する。
図1は、本実施形態に係る加圧接合装置を用いて製造した圧電素子ユニットの概略斜視図であり、図2は、図1のA−A′断面図である。図1及び図2に示すように、圧電素子ユニット10は、複数の圧電素子11がその幅方向に並設された列12を有する圧電素子形成部材13と、圧電素子形成部材13の先端部側が自由端となるようにその基端部側が接着剤20によって接着される固定基板14とを有する。
Hereinafter, the present invention will be described in detail based on embodiments.
FIG. 1 is a schematic perspective view of a piezoelectric element unit manufactured using a pressure bonding apparatus according to the present embodiment, and FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. As shown in FIGS. 1 and 2, the piezoelectric element unit 10 includes a piezoelectric element forming member 13 having a row 12 in which a plurality of piezoelectric elements 11 are arranged in parallel in the width direction, and a distal end side of the piezoelectric element forming member 13. It has the fixed board | substrate 14 to which the base end part side adhere | attaches with the adhesive agent 20 so that it may become a free end.

圧電素子形成部材13は、圧電材料層15と、共通電極又は個別電極となる電極層16、17とを交互に積層することにより形成され、例えば、ワイヤソー等によって複数のスリットである切り込み部18を形成することにより櫛歯状に切り分けられて圧電素子11の列12が形成されている。また、圧電素子11の列12の両外側には、各圧電素子11よりも広い幅を有する位置決め部19が設けられている。この位置決め部19は、圧電素子ユニット10を液体噴射ヘッドに組み込む際に、圧電素子ユニット10を高精度に位置決めするために設けられていて、圧電素子11と同様の圧電材料層15と電極層16、17を有するが外部電極と接続しないため駆動することのないダミー素子である。一方、固定基板14は、例えば、ステンレス鋼(SUS)等からなる板状部材からなり、圧電素子形成部材13の振動領域である先端部側が自由端となるように、圧電素子形成部材13の非振動領域である基端部側が接着剤20によって接着されている。   The piezoelectric element forming member 13 is formed by alternately laminating piezoelectric material layers 15 and electrode layers 16 and 17 serving as common electrodes or individual electrodes. For example, a plurality of slits 18 are formed by a wire saw or the like. By forming, it is cut into a comb-like shape to form a row 12 of piezoelectric elements 11. Further, on both outer sides of the rows 12 of the piezoelectric elements 11, positioning portions 19 having a wider width than the piezoelectric elements 11 are provided. The positioning unit 19 is provided to position the piezoelectric element unit 10 with high accuracy when the piezoelectric element unit 10 is incorporated into the liquid jet head. The piezoelectric material layer 15 and the electrode layer 16 are the same as those of the piezoelectric element 11. , 17 but is a dummy element that is not driven because it is not connected to an external electrode. On the other hand, the fixed substrate 14 is made of, for example, a plate-like member made of stainless steel (SUS) or the like, and the non-piezoelectric element forming member 13 is non-movable so that the distal end side which is the vibration region of the piezoelectric element forming member 13 becomes a free end. The base end side that is the vibration region is bonded by the adhesive 20.

そして、このような圧電素子ユニット10は、例えば、液体噴射ヘッドに搭載される。以下に、その一例としてインクジェット式記録ヘッドについて説明する。なお、図3は、インクジェット式記録ヘッドの概略を示す断面図である。図3に示すように、流路形成基板30には圧力発生室31が形成されており、この圧力発生室31はその幅方向で複数並設されている。また、各圧力発生室31の長手方向一端部側には、各圧力発生室31にインクを供給するためのリザーバ32がインク供給口33を介して連通されている。また、流路形成基板30の圧力発生室31の開口面側は振動板34で封止され、他方面側にはノズル開口35が穿設されたノズルプレート36が接合されている。振動板34上には、図示しないインクカートリッジやメインタンクからのインク供給を受けるサブタンクなどのインク貯留部に接続されるインク供給路37を有するヘッドケース38が固定されており、且つこのヘッドケース38には、上述した圧電素子ユニット10が高精度に位置決めされて固定されている。すなわち、圧電素子ユニット10は、各圧電素子11の先端面が振動板34上の各圧力発生室31に対応する領域に設けられた各アイランド部39に当接した状態で固定されている。   Such a piezoelectric element unit 10 is mounted on, for example, a liquid jet head. An ink jet recording head will be described below as an example. FIG. 3 is a cross-sectional view schematically showing the ink jet recording head. As shown in FIG. 3, a pressure generating chamber 31 is formed in the flow path forming substrate 30, and a plurality of the pressure generating chambers 31 are arranged in the width direction. In addition, a reservoir 32 for supplying ink to each pressure generating chamber 31 is communicated with each pressure generating chamber 31 via an ink supply port 33 on one end side in the longitudinal direction. Further, the opening surface side of the pressure generating chamber 31 of the flow path forming substrate 30 is sealed with a vibration plate 34, and a nozzle plate 36 having a nozzle opening 35 formed therein is joined to the other surface side. A head case 38 having an ink supply path 37 connected to an ink storage portion such as an ink cartridge (not shown) or a sub tank that receives ink supplied from the main tank is fixed on the vibration plate 34. The piezoelectric element unit 10 described above is positioned and fixed with high accuracy. That is, the piezoelectric element unit 10 is fixed in a state in which the tip surface of each piezoelectric element 11 is in contact with each island portion 39 provided in a region corresponding to each pressure generating chamber 31 on the vibration plate 34.

このように構成されたインクジェット式記録ヘッドでは、インク貯留部に連通されるインク供給路を介してリザーバ32にインクが供給され、インク供給口33を介して各圧力発生室31に分配される。実際には、圧電素子11に電圧を印加することにより圧電素子11を収縮させる。これにより、振動板34が圧電素子11と共に引き上げられて圧力発生室31の容積が広げられ、圧力発生室31内にインクが引き込まれる。そして、ノズル開口35に至るまで内部をインクで満たした後、駆動回路からの記録信号に従い、圧電素子11に印加していた電圧を解除すると、圧電素子11が伸張されて元の状態に戻る。これにより、振動板34も変位して元の状態に戻るため圧力発生室31が収縮され、内部圧力が高まりノズル開口35からインク滴が吐出される。   In the ink jet recording head configured as described above, the ink is supplied to the reservoir 32 via the ink supply path communicating with the ink reservoir, and is distributed to each pressure generating chamber 31 via the ink supply port 33. Actually, the piezoelectric element 11 is contracted by applying a voltage to the piezoelectric element 11. As a result, the diaphragm 34 is pulled up together with the piezoelectric element 11 to expand the volume of the pressure generating chamber 31, and ink is drawn into the pressure generating chamber 31. Then, after filling the inside with ink until the nozzle opening 35 is reached, the voltage applied to the piezoelectric element 11 is released according to the recording signal from the drive circuit, and the piezoelectric element 11 is expanded to return to the original state. As a result, the vibration plate 34 is also displaced to return to the original state, so that the pressure generating chamber 31 is contracted, the internal pressure is increased, and ink droplets are ejected from the nozzle openings 35.

そして、このようにインクジェット式記録ヘッド等の液体噴射ヘッドでは、圧電素子11の極めて微小な変形(伸縮)を利用してノズル開口35からインク滴を吐出させているため、液体噴射ヘッド等に用いられる圧電素子ユニット10は、極めて高精度に形成する必要がある。例えば、固定基板14と圧電素子形成部材13とを高精度に接合する必要がある。   In such a liquid ejecting head such as an ink jet recording head, ink droplets are ejected from the nozzle openings 35 by utilizing extremely minute deformation (extension / contraction) of the piezoelectric element 11. It is necessary to form the piezoelectric element unit 10 to be formed with extremely high accuracy. For example, it is necessary to join the fixed substrate 14 and the piezoelectric element forming member 13 with high accuracy.

以下、固定基板14と圧電素子形成部材13とを接合に用いる本発明の加圧接合装置について説明する。図4は、加圧接合装置の概略斜視図であり、図5は、加圧接合装置の正面方向の一部断面図であり、図6は、図5のB−B′断面図である。   Hereinafter, the pressure bonding apparatus of the present invention using the fixed substrate 14 and the piezoelectric element forming member 13 for bonding will be described. 4 is a schematic perspective view of the pressure bonding apparatus, FIG. 5 is a partial cross-sectional view of the pressure bonding apparatus in the front direction, and FIG. 6 is a cross-sectional view taken along line BB ′ of FIG.

図示するように、加圧接合装置40は、装置本体41上に設けられる基台42を有し、基台42上には固定基板14を保持する保持治具43が着脱自在に設けられている。本実施形態に係る加圧接合装置40では、保持治具43に複数、例えば、2つの固定基板14が保持され、複数の圧電素子ユニット10を同時に形成することができるようになっている。   As shown in the figure, the pressure bonding apparatus 40 has a base 42 provided on the apparatus main body 41, and a holding jig 43 for holding the fixed substrate 14 is detachably provided on the base 42. . In the pressure bonding apparatus 40 according to the present embodiment, a plurality of, for example, two fixed substrates 14 are held by the holding jig 43, and a plurality of piezoelectric element units 10 can be formed simultaneously.

また、装置本体41上には、圧電素子形成部材13を所定位置に位置決めする位置決め治具44が設けられている。この位置決め治具44は、保持治具43に保持された固定基板14の端面に対向して配されて圧電素子形成部材13の先端部側の端面に当接される当接部材45と、この当接部材45の両端部に当接部材45に沿ってスライド可能に配されて圧電素子形成部材13の両側端面にそれぞれ当接される一対のチャック部材46(第1のチャック部材46A及び第2のチャック部材46B)とを有する。また、位置決め治具44は、本実施形態では、圧電素子形成部材13の基端部側に配されて圧電素子形成部材13を当接部材45側に押圧する押圧部材47をさらに有する。   A positioning jig 44 for positioning the piezoelectric element forming member 13 at a predetermined position is provided on the apparatus main body 41. The positioning jig 44 is disposed so as to face the end surface of the fixed substrate 14 held by the holding jig 43, and comes into contact with the end surface on the tip end side of the piezoelectric element forming member 13. A pair of chuck members 46 (the first chuck member 46A and the second chuck member 46A) are slidably disposed along the contact member 45 at both ends of the contact member 45 and are in contact with both end surfaces of the piezoelectric element forming member 13, respectively. Chuck member 46B). Further, in the present embodiment, the positioning jig 44 further includes a pressing member 47 that is disposed on the proximal end side of the piezoelectric element forming member 13 and presses the piezoelectric element forming member 13 toward the contact member 45.

当接部材45は、圧電素子形成部材13(固定基板14)側に突出して圧電素子形成部材13の先端面に当接する突出部48が設けられている。この突出部48は、圧電素子形成部材13の両端部近傍に対応する部分、すなわち、圧電素子形成部材13の位置決め部19が形成される部分に対応して設けられている。これにより、圧電素子形成部材13の圧電素子11が形成される領域に、当接部材45が当接することがなく、圧電素子11の先端部の欠けや割れ等の発生が防止される。一対のチャック部材46は、当接部材45の両端部に対応する位置に、この当接部材45に沿ってスライド可能に設けられている。また、各チャック部材46の圧電素子形成部材13と当接する側の面は、本実施形態では、圧電素子形成部材13側が凸となる曲面で構成されている。すなわち、各チャック部材46の圧電素子形成部材13との接触面積が小さくなるようにして、圧電素子形成部材13の割れ等の発生を抑制している。   The abutting member 45 is provided with a protruding portion 48 that protrudes toward the piezoelectric element forming member 13 (fixed substrate 14) and comes into contact with the front end surface of the piezoelectric element forming member 13. The protrusion 48 is provided corresponding to a portion corresponding to the vicinity of both ends of the piezoelectric element forming member 13, that is, a portion where the positioning portion 19 of the piezoelectric element forming member 13 is formed. Thereby, the contact member 45 does not come into contact with the region where the piezoelectric element 11 of the piezoelectric element forming member 13 is formed, and the occurrence of chipping or cracking of the tip portion of the piezoelectric element 11 is prevented. The pair of chuck members 46 are slidably provided along the contact member 45 at positions corresponding to both end portions of the contact member 45. In addition, in the present embodiment, the surface of each chuck member 46 that contacts the piezoelectric element forming member 13 is a curved surface that is convex on the piezoelectric element forming member 13 side. In other words, the contact area of each chuck member 46 with the piezoelectric element forming member 13 is reduced to prevent the piezoelectric element forming member 13 from cracking.

押圧部材47は、圧電素子形成部材13の基端部側の端面に対向して設けられて圧電素子形成部材13の端面に当接する当接部49を有し、この当接部49は、本実施形態では、圧電素子形成部材13の基端部側の端面と同一又はそれ以上の面積で形成されている。すなわち、押圧部材47の当接部49は、圧電素子形成部材13の基端部側の端面のほぼ全面に接触する大きさを有する。これにより、圧電素子形成部材13と固定基板14を接合する際に、圧電素子形成部材13がこの押圧部材47(当接部49)によって確実に支持され圧電素子形成部材13の変形が防止される。   The pressing member 47 has a contact portion 49 that is provided to face the end surface on the base end portion side of the piezoelectric element forming member 13 and contacts the end surface of the piezoelectric element forming member 13. In the embodiment, the piezoelectric element forming member 13 is formed with an area equal to or larger than the end face of the base end portion side. That is, the abutting portion 49 of the pressing member 47 has a size that makes contact with substantially the entire end surface of the piezoelectric element forming member 13 on the proximal end side. Accordingly, when the piezoelectric element forming member 13 and the fixed substrate 14 are joined, the piezoelectric element forming member 13 is reliably supported by the pressing member 47 (contact portion 49), and deformation of the piezoelectric element forming member 13 is prevented. .

また、保持治具43が固定される基台42の両端部には、一対のスライド軸50が立設されており、この一対のスライド軸50には、圧電素子形成部材13を固定基板14側に押圧するための加圧部材(加圧手段)51が軸方向でスライド可能に固定されている。この加圧部材51は、例えば、スライド軸50に上下方向に移動可能に固定されるスライド部材52と、スライド部材52に設けられるスリット状のガイド孔53に挿通されて先端部が基台42側に突出した状態でこのスライド部材52に係合保持されるコマ部材54と、スライド部材52に固定されてコマ部材54の先端面を圧電素子形成部材13に当接させた状態でコマ部材54を圧電素子形成部材13側に押圧する付勢部材55とを具備する。   A pair of slide shafts 50 are erected on both ends of the base 42 to which the holding jig 43 is fixed. The piezoelectric element forming member 13 is attached to the pair of slide shafts 50 on the fixed substrate 14 side. A pressurizing member (pressurizing means) 51 for pressing is fixed to be slidable in the axial direction. The pressure member 51 is inserted into, for example, a slide member 52 that is fixed to the slide shaft 50 so as to be movable in the vertical direction, and a slit-shaped guide hole 53 provided in the slide member 52, and the distal end portion is on the base 42 side. The top member 54 is engaged with and held by the slide member 52 in a state of projecting to the top, and the top member 54 is fixed to the slide member 52 and the tip surface of the top member 54 is in contact with the piezoelectric element forming member 13. And an urging member 55 that presses the piezoelectric element forming member 13 side.

ここで、本実施形態に係るスライド部材52は、スライド軸50に上下方向に移動可能に固定される支持板56と、この支持板56の下面側に固定されてコマ部材54が挿通されるガイド孔53が設けられたガイド板57と、支持板56の上面側に設けられて支持板56と共に付勢部材55を固定する固定板58とで構成されている。   Here, the slide member 52 according to this embodiment includes a support plate 56 that is fixed to the slide shaft 50 so as to be movable in the vertical direction, and a guide that is fixed to the lower surface side of the support plate 56 and through which the top member 54 is inserted. The guide plate 57 is provided with a hole 53, and the fixing plate 58 is provided on the upper surface side of the support plate 56 and fixes the urging member 55 together with the support plate 56.

コマ部材54は、各保持治具43に保持された各固定基板14に対応して設けられており、例えば、本実施形態では、2つのコマ部材54が設けられている。すなわち、ガイド板57には、各固定基板14に対応して2つのガイド孔53が設けられており、各コマ部材54は、各ガイド孔53に挿通されてガイド板57に係合保持されている。具体的には、各コマ部材54は、基端部(上端部)側にフランジ部59を有し、ガイド孔53に挿通されるとその先端部がガイド板57の下側(基台側)に突出した状態で、フランジ部59がガイド板57の表面に係止されるようになっている。コマ部材54の保持治具43側の先端面には、弾性材料からなる弾性層60が設けられている。   The piece member 54 is provided corresponding to each fixed substrate 14 held by each holding jig 43. For example, in this embodiment, two piece members 54 are provided. That is, the guide plate 57 is provided with two guide holes 53 corresponding to the respective fixed substrates 14, and each piece member 54 is inserted into each guide hole 53 and is engaged and held by the guide plate 57. Yes. Specifically, each piece member 54 has a flange portion 59 on the base end (upper end) side, and when the top member 54 is inserted into the guide hole 53, the tip end is below the base plate 57 (base side). The flange portion 59 is locked to the surface of the guide plate 57 in a state where the flange portion 59 projects. An elastic layer 60 made of an elastic material is provided on the front end surface of the top member 54 on the holding jig 43 side.

付勢部材55は、各コマ部材54に対応してそれぞれ独立して設けられている。また、付勢部材55は、各コマ部材54に対してそれぞれ複数設けられていることが好ましく、例えば、本実施形態では、各コマ部材54に対してそれぞれ2つの付勢部材55が所定間隔で設けられている。付勢部材55のコマ部材54と接触する先端部は、コマ部材54と点接触する形状となっていることが好ましい。例えば、本実施形態に係る付勢部材55は、筒状体61内に挿入された球状体62が、例えば、コイルばね等からなる弾性部材63によって付勢され筒状体61の先端部の開口から若干突出した状態で保持されてなる。   The urging member 55 is provided independently for each piece member 54. In addition, it is preferable that a plurality of urging members 55 are provided for each piece member 54. For example, in this embodiment, two urging members 55 are provided at a predetermined interval for each piece member 54. Is provided. It is preferable that the tip of the urging member 55 that contacts the piece member 54 has a shape that makes point contact with the piece member 54. For example, the urging member 55 according to the present embodiment is configured such that the spherical body 62 inserted into the cylindrical body 61 is urged by an elastic member 63 made of, for example, a coil spring or the like, and the opening at the tip of the cylindrical body 61 is opened. It is held in a state of slightly protruding from.

また、この付勢部材55とコマ部材54との間にも、例えば、コイルばね等からなる弾性部材64が介装されている。コマ部材54が圧電素子形成部材13に当接されていない状態では、コマ部材54と付勢部材55との間には所定の間隔が確保されており、コマ部材54はこの弾性部材64のみで付勢されている。   An elastic member 64 made of, for example, a coil spring is interposed between the biasing member 55 and the top member 54. In a state where the piece member 54 is not in contact with the piezoelectric element forming member 13, a predetermined interval is secured between the piece member 54 and the biasing member 55, and the piece member 54 is composed only of the elastic member 64. It is energized.

以下、このような加圧接合装置40を用いた圧電素子ユニット10の製造手順について図7及び図8を参照して詳細に説明する。なお、図7は、圧電素子ユニットの製造工程を示す平面図であり、図8は、圧電素子ユニットの製造工程を示す断面図である。   Hereinafter, the manufacturing procedure of the piezoelectric element unit 10 using such a pressure bonding apparatus 40 will be described in detail with reference to FIGS. FIG. 7 is a plan view showing the manufacturing process of the piezoelectric element unit, and FIG. 8 is a cross-sectional view showing the manufacturing process of the piezoelectric element unit.

図7(a)に示すように、まず、固定基板14が所定位置に固定された保持治具43を基台42上に位置決め固定する。なお、上述したように本実施形態では、保持治具43には2つの固定基板14が保持されている。この保持治具43の位置決め方法は、特に限定されず、例えば、基台42上に基準となる基準ピン(図示なし)を設けておき、保持治具43をこの基準ピンに当接させることによって位置決めする。このとき、圧電素子形成部材13を位置決め保持するための位置決め治具44である当接部材45、チャック部材46及び押圧部材47は、各固定基板14に対応して基台42の外側に配置されている。   As shown in FIG. 7A, first, the holding jig 43 with the fixed substrate 14 fixed at a predetermined position is positioned and fixed on the base 42. As described above, in the present embodiment, the two fixing substrates 14 are held by the holding jig 43. The positioning method of the holding jig 43 is not particularly limited. For example, a reference pin (not shown) serving as a reference is provided on the base 42 and the holding jig 43 is brought into contact with the reference pin. Position. At this time, the abutting member 45, the chuck member 46 and the pressing member 47, which are positioning jigs 44 for positioning and holding the piezoelectric element forming member 13, are arranged outside the base 42 corresponding to the respective fixed substrates 14. ing.

次に、図7(b)に示すように、当接部材45と、一方のチャック部材、例えば、第1のチャック部材46Aとを移動させ、圧電素子形成部材13が固定される位置、すなわち図中点線で示す規定位置に合わせて固定する。勿論、第1のチャック部材46Aの替わりに第2のチャック部材46Bを移動させてもよい。   Next, as shown in FIG. 7B, the contact member 45 and one of the chuck members, for example, the first chuck member 46A are moved, that is, the position where the piezoelectric element forming member 13 is fixed, that is, FIG. Fix according to the specified position indicated by the middle dotted line. Of course, the second chuck member 46B may be moved instead of the first chuck member 46A.

次に、図7(c)に示すように、固定された当接部材45及び第1のチャック部材46Aに合わせて固定基板14上に圧電素子形成部材13を載置する。つまり、圧電素子形成部材13を、その先端面が当接部材45に当接し且つその側端面が第1のチャック部材46Aに当接するように固定基板14上に載置する。なおこのとき、固定基板14又は圧電素子形成部材13の何れか一方に接着剤を塗布しておき、固定基板14上に接着剤を介して圧電素子形成部材13を載置する。   Next, as shown in FIG. 7C, the piezoelectric element forming member 13 is placed on the fixed substrate 14 in accordance with the fixed contact member 45 and the first chuck member 46A. That is, the piezoelectric element forming member 13 is placed on the fixed substrate 14 so that the tip end surface thereof is in contact with the contact member 45 and the side end surface thereof is in contact with the first chuck member 46A. At this time, an adhesive is applied to either the fixed substrate 14 or the piezoelectric element forming member 13, and the piezoelectric element forming member 13 is placed on the fixed substrate 14 via the adhesive.

ここで、圧電素子形成部材13は、当接部材45及び第1のチャック部材46Aと実際に当接していてもよいが、これら圧電素子形成部材13と当接部材45及び第1のチャック部材46Aとの間には若干の隙間が存在していてもよい。   Here, the piezoelectric element forming member 13 may actually be in contact with the contact member 45 and the first chuck member 46A. However, the piezoelectric element forming member 13 and the contact member 45 and the first chuck member 46A may be in contact with each other. There may be a slight gap between the two.

次いで、図8(a)に示すように、第2のチャック部材46Bを移動させて上記規定位置に合わせて固定する。このとき、圧電素子形成部材13の位置が、上記規定位置よりも第2のチャック部材46B側であると、第2のチャック部材46Bが圧電素子形成部材13の側端面に当接し、第2のチャック部材46Bと共に圧電素子形成部材13が移動することになる。これにより、圧電素子形成部材13は、当接部材45に沿った方向(図中左右方向)で規定位置に正確に位置決めされる。   Next, as shown in FIG. 8A, the second chuck member 46B is moved and fixed according to the specified position. At this time, if the position of the piezoelectric element forming member 13 is closer to the second chuck member 46B than the specified position, the second chuck member 46B comes into contact with the side end surface of the piezoelectric element forming member 13, and the second The piezoelectric element forming member 13 moves together with the chuck member 46B. As a result, the piezoelectric element forming member 13 is accurately positioned at the specified position in the direction along the contact member 45 (the left-right direction in the figure).

次いで、本実施形態では、図8(b)に示すように、押圧部材47を圧電素子形成部材13側に移動させて規定位置に合わせて固定する。このとき、圧電素子形成部材13の位置が、上記規定位置よりも押圧部材47側であると、押圧部材47の当接部49が圧電素子形成部材13の基端部側の端面に当接して、押圧部材47と共に圧電素子形成部材13が移動することになる。これにより圧電素子形成部材13は、当接部材45とは直交する方向(図中上下方向)で規定位置に正確に位置決めされる。つまり、圧電素子形成部材13は、当接部材45の突出部48、各チャック部材46及び押圧部材47の当接部49と、それぞれ当接して、規定位置に正確に位置決めされる。   Next, in this embodiment, as shown in FIG. 8B, the pressing member 47 is moved to the piezoelectric element forming member 13 side and fixed in accordance with a specified position. At this time, if the position of the piezoelectric element forming member 13 is closer to the pressing member 47 than the prescribed position, the contact portion 49 of the pressing member 47 contacts the end surface of the piezoelectric element forming member 13 on the proximal end side. The piezoelectric element forming member 13 moves together with the pressing member 47. As a result, the piezoelectric element forming member 13 is accurately positioned at a specified position in a direction (vertical direction in the drawing) orthogonal to the contact member 45. That is, the piezoelectric element forming member 13 is in contact with the protruding portion 48 of the contact member 45, the contact portion 49 of each chuck member 46, and the pressing member 47, and is accurately positioned at the specified position.

本発明の加圧接合装置40では、このような手順で圧電素子形成部材13が規定位置に位置決めされるため、圧電素子形成部材13に当接部材45及びチャック部材46が接触することによる圧電素子形成部材13の割れや欠けの発生を防止することができる。特に、圧電素子形成部材13の当接部材45側の両角部の割れや欠けの発生を効果的に防止することができる。さらに、圧電素子形成部材13の先端部側の端面に、当接部材45の突出部48のみが当接するため、圧電素子11が形成される領域に欠けや割れ等が発生するのを防止することができる。   In the pressure bonding apparatus 40 of the present invention, since the piezoelectric element forming member 13 is positioned at the specified position in such a procedure, the piezoelectric element formed by the contact member 45 and the chuck member 46 contacting the piezoelectric element forming member 13. Generation | occurrence | production of the crack and notch | chip of the formation member 13 can be prevented. In particular, it is possible to effectively prevent the occurrence of cracking or chipping at both corners of the piezoelectric element forming member 13 on the contact member 45 side. Furthermore, since only the projecting portion 48 of the contact member 45 contacts the end surface of the piezoelectric element forming member 13 on the front end side, it is possible to prevent the region where the piezoelectric element 11 is formed from being chipped or cracked. Can do.

さらに、本実施形態では、上述したように押圧部材47によって圧電素子形成部材13を所定の圧力で押圧することで、この押圧部材47と当接部材45の突出部48との間に圧電素子形成部材13を挟み込んで保持している。このため、圧電素子11の先端に当接部材45が当接することがない。したがって、圧電素子11の先端部を傷つけることなく圧電素子形成部材13を保持することができる。   Further, in the present embodiment, as described above, the piezoelectric element is formed between the pressing member 47 and the protruding portion 48 of the contact member 45 by pressing the piezoelectric element forming member 13 with a predetermined pressure by the pressing member 47. The member 13 is sandwiched and held. For this reason, the contact member 45 does not contact the tip of the piezoelectric element 11. Therefore, the piezoelectric element forming member 13 can be held without damaging the tip of the piezoelectric element 11.

次に、図9に示すように、例えば、駆動モータを用いた駆動装置、油圧ポンプあるいは電磁ポンプ等で構成される加圧手段(図示なし)によって加圧部材51(スライド部材52)を所定位置まで下降させ、コマ部材54によって各圧電素子形成部材13を固定基板14側に所定圧力で加圧する。具体的には、コマ部材54が付勢部材55の先端部の球状体62に当接するまでスライド部材52を下降させて固定すると、コマ部材54が付勢部材55及び弾性部材64によって圧電素子形成部材13側に付勢され、その結果、圧電素子形成部材13はコマ部材54によって固定基板14側に所定圧力で加圧される。そして、このように圧電素子形成部材13を固定基板14側に加圧したまま、例えば、150℃〜200℃程度の温度下で接着剤20(図2参照)を加熱硬化させる。   Next, as shown in FIG. 9, the pressurizing member 51 (sliding member 52) is moved to a predetermined position by pressurizing means (not shown) constituted by, for example, a drive device using a drive motor, a hydraulic pump or an electromagnetic pump. The piezoelectric element forming member 13 is pressed to the fixed substrate 14 side with a predetermined pressure by the top member 54. Specifically, when the slide member 52 is lowered and fixed until the top member 54 comes into contact with the spherical body 62 at the tip of the urging member 55, the piezo member 54 is formed by the urging member 55 and the elastic member 64 to form a piezoelectric element. As a result, the piezoelectric element forming member 13 is pressed to the fixed substrate 14 side by a predetermined pressure by the piece member 54. Then, the adhesive 20 (see FIG. 2) is heat-cured at a temperature of about 150 ° C. to 200 ° C., for example, while the piezoelectric element forming member 13 is pressed toward the fixed substrate 14 in this way.

このように接着剤20を加熱硬化させる際には、その熱によって圧電素子形成部材13が変形する虞がある。しかしながら、本実施形態では、圧電素子形成部材13が、その基端部側の端面の略全面に押圧部材47の当接部49が当接した状態で保持されているため、熱による圧電素子形成部材13の変形を抑えることができる。   Thus, when the adhesive 20 is heat-cured, the piezoelectric element forming member 13 may be deformed by the heat. However, in this embodiment, since the piezoelectric element forming member 13 is held in a state where the contact portion 49 of the pressing member 47 is in contact with substantially the entire end surface on the base end side, piezoelectric element formation by heat is performed. The deformation of the member 13 can be suppressed.

その後、図示しないが圧電素子形成部材13と固定基板14との接合体を加圧接合装置40から取り外す。このとき、当接部材45、各チャック部材46及び押圧部材47のそれぞれを、圧電素子形成部材13の外側に向かって移動させる。すなわち、これら当接部材45、チャック部材46及び押圧部材47を圧電素子形成部材13から引き離してから、圧電素子形成部材13と固定基板14との接合体を基台42上から取り外すことが好ましい。これにより、上記接合体を基台42上から取り外す際に、圧電素子形成部材13が当接部材45及びチャック部材46に接触して割れや欠けが発生するのを防止することができる。   Thereafter, although not shown, the joined body of the piezoelectric element forming member 13 and the fixed substrate 14 is removed from the pressure joining device 40. At this time, each of the contact member 45, each chuck member 46, and the pressing member 47 is moved toward the outside of the piezoelectric element forming member 13. That is, it is preferable to remove the contact member 45, the chuck member 46, and the pressing member 47 from the piezoelectric element forming member 13 and then remove the joined body of the piezoelectric element forming member 13 and the fixed substrate 14 from the base 42. Thereby, when removing the joined body from the base 42, it is possible to prevent the piezoelectric element forming member 13 from coming into contact with the contact member 45 and the chuck member 46 and causing cracks or chips.

なお、取り外された圧電素子形成部材13と固定基板14との接合体は、例えば、ワイヤソー等によって圧電素子形成部材13の先端部側が櫛歯状に切り分けられて、図1に示すような圧電素子ユニット10が製造される。   In addition, the joined body of the removed piezoelectric element forming member 13 and the fixed substrate 14 is, for example, a piezoelectric element as shown in FIG. Unit 10 is manufactured.

以上説明したように、本発明によれば、圧電素子形成部材13を高精度に位置決めして固定基板14に接合することができると共に、圧電素子形成部材13の変形や、欠け等の発生を防止することができる。したがって、高品質な圧電素子ユニット10を形成することができ、この圧電素子ユニット10をインクジェット式記録ヘッドに組み込む際、各圧電素子11の先端部を振動板34のアイランド部39に確実に当接させることができる(図3参照)。よって、例えば、ドット抜け等の印刷不良の発生を防止したインクジェット式記録ヘッドを実現することができる。   As described above, according to the present invention, the piezoelectric element forming member 13 can be positioned with high accuracy and bonded to the fixed substrate 14, and the piezoelectric element forming member 13 is prevented from being deformed or chipped. can do. Therefore, a high-quality piezoelectric element unit 10 can be formed, and when the piezoelectric element unit 10 is incorporated into an ink jet recording head, the tip of each piezoelectric element 11 is reliably brought into contact with the island portion 39 of the diaphragm 34. (See FIG. 3). Therefore, for example, it is possible to realize an ink jet recording head that prevents the occurrence of printing defects such as missing dots.

以上、本発明の一実施形態について説明したが、勿論、本発明はこのような実施形態に限定されるものでない。例えば、上述の実施形態では、圧電素子形成部材13を押圧する押圧部材47を設け、この押圧部材47と当接部材45とで、圧電素子形成部材13を挟持するようにしたが、例えば、一対のチャック部材46A,46Bで圧電素子形成部材13を挟持するようにしてもよい。この場合、押圧部材47は設けられていなくてもよい。例えば、圧電素子形成部材13を固定基板14上に載置する際、圧電素子形成部材13を当接部材45及び一方のチャック部材46に確実に当接させることができれば、押圧部材47が設けられていなくても、圧電素子形成部材13を規定位置に正確に位置決めした状態で保持することができる。また、例えば、上述の実施形態では、各チャック部材46の圧電素子形成部材13と当接する当接面が曲面で構成されている例を説明したが、勿論、これらチャック部材46の当接面は平面で構成されていてもよい。   As mentioned above, although one embodiment of the present invention was described, of course, the present invention is not limited to such an embodiment. For example, in the above-described embodiment, the pressing member 47 that presses the piezoelectric element forming member 13 is provided, and the pressing member 47 and the abutting member 45 sandwich the piezoelectric element forming member 13. Alternatively, the piezoelectric element forming member 13 may be held between the chuck members 46A and 46B. In this case, the pressing member 47 may not be provided. For example, when the piezoelectric element forming member 13 is placed on the fixed substrate 14, if the piezoelectric element forming member 13 can be reliably brought into contact with the contact member 45 and one chuck member 46, the pressing member 47 is provided. Even if not, the piezoelectric element forming member 13 can be held in a state of being accurately positioned at the specified position. Further, for example, in the above-described embodiment, the example in which the contact surface that contacts the piezoelectric element forming member 13 of each chuck member 46 is configured as a curved surface has been described. Of course, the contact surfaces of these chuck members 46 are You may be comprised by the plane.

圧電素子ユニットの一例を示す概略斜視図である。It is a schematic perspective view which shows an example of a piezoelectric element unit. 圧電素子ユニットの一例を示す断面図である。It is sectional drawing which shows an example of a piezoelectric element unit. 圧電素子ユニットが搭載された液体噴射ヘッドの概略を示す断面図である。FIG. 3 is a cross-sectional view illustrating an outline of a liquid jet head on which a piezoelectric element unit is mounted. 一実施形態に係る加圧接合装置の概略斜視図である。1 is a schematic perspective view of a pressure bonding apparatus according to an embodiment. 一実施形態に係る加圧接合装置の一部断面図である。1 is a partial cross-sectional view of a pressure bonding apparatus according to an embodiment. 一実施形態に係る加圧接合装置の断面図である。It is sectional drawing of the pressure bonding apparatus which concerns on one Embodiment. 一実施形態に係る圧電素子ユニットの製造工程を示す平面図である。It is a top view which shows the manufacturing process of the piezoelectric element unit which concerns on one Embodiment. 一実施形態に係る圧電素子ユニットの製造工程を示す平面図である。It is a top view which shows the manufacturing process of the piezoelectric element unit which concerns on one Embodiment. 一実施形態に係る圧電素子ユニットの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the piezoelectric element unit which concerns on one Embodiment. 従来技術に係る加圧接合装置の一例を示す概略図である。It is the schematic which shows an example of the pressure bonding apparatus which concerns on a prior art.

符号の説明Explanation of symbols

10 圧電素子ユニット、 11 圧電素子、 13 圧電素子形成部材、 14 固定基板、 20 接着剤、 40 加圧接合装置、 41 装置本体、 42 基台、 43 保持治具、 44 位置決め治具、 45 当接部材、 46 チャック部材、 47 押圧部材、 48 突出部、 49 当接部   DESCRIPTION OF SYMBOLS 10 Piezoelectric element unit, 11 Piezoelectric element, 13 Piezoelectric element formation member, 14 Fixed substrate, 20 Adhesive, 40 Pressure bonding apparatus, 41 Apparatus main body, 42 Base, 43 Holding jig, 44 Positioning jig, 45 Contact Member, 46 chuck member, 47 pressing member, 48 projecting portion, 49 contact portion

Claims (5)

個別電極と共通電極とが圧電材料層を挟んで交互に複数積層されてなりその先端部側が複数のスリットによって櫛歯状に切り分けられ圧電素子の列と、該圧電素子の列の両外側に設けられた位置決め部とを備える圧電素子形成部材と、該圧電素子形成部材の基端部側が接合される固定基板と、を具備する圧電素子ユニットを形成する際に用いられ、前記圧電素子形成部材と前記固定基板とを位置決めした状態で加圧接合する加圧接合装置であって、
基台上の所定位置に前記固定基板を位置決めした状態で保持する保持治具と、
前記保持治具に保持された前記固定基板の端面に対向して移動可能に配されて前記圧電素子形成部材の前記先端部側の端面に当接される当接部材と、前記当接部材に沿って移動可能に当該当接部材の両端部に配されて前記圧電素子形成部材の両側端面にそれぞれ当接される一対のチャック部材とを有し、前記基台上の規定位置に前記圧電素子形成部材を位置決めして保持する位置決め治具と、
前記圧電素子形成部材を前記固定基板側に押圧する加圧手段と、
を具備し、
前記当接部材が、前記圧電素子形成部材の前記位置決め部が形成される部分にそれぞれ当接する突出部を有することを特徴とする加圧接合装置。
A plurality of individual electrodes and a common electrode are alternately stacked with a piezoelectric material layer interposed therebetween, and the tip end side is cut into a comb-like shape by a plurality of slits , on both outer sides of the piezoelectric element rows A piezoelectric element forming member comprising: a piezoelectric element forming member provided with a positioning portion provided ; and a fixed substrate to which a base end side of the piezoelectric element forming member is bonded; And a pressure bonding apparatus for pressure bonding in a state where the fixed substrate is positioned,
A holding jig for holding the fixed substrate in a state of being positioned at a predetermined position on the base;
A contact member that is arranged to be movable so as to face the end surface of the fixed substrate held by the holding jig and is in contact with the end surface of the piezoelectric element forming member; A pair of chuck members which are arranged at both ends of the contact member so as to be movable along the two ends of the piezoelectric element forming member, and which are in contact with both end surfaces of the piezoelectric element forming member. A positioning jig for positioning and holding the forming member;
Pressurizing means for pressing the piezoelectric element forming member toward the fixed substrate;
Equipped with,
It said abutment member, the piezoelectric element forming member and the positioning unit pressure bonding apparatus characterized by have a respective protrusion abuts a portion is formed of.
前記チャック部材の前記圧電素子形成部材側の面が、当該圧電素子形成部材側が凸となる曲面で形成されていることを特徴とする請求項1に記載の加圧接合装置。   2. The pressure bonding apparatus according to claim 1, wherein a surface of the chuck member on the piezoelectric element forming member side is formed as a curved surface having a convex surface on the piezoelectric element forming member side. 前記位置決め治具が、前記圧電素子形成部材の基端部側の端面に当接して当該圧電素子形成部材を前記当接部材側に押圧する押圧部材をさらに有することを特徴とする請求項1又は2に記載の加圧接合装置。 The positioning jig, the claim 1, characterized by further comprising a pressing member for pressing the piezoelectric element forming member proximal end of the end surface in contact with the piezoelectric element forming member wherein the contact member side or 2. The pressure bonding apparatus according to 2. 請求項1〜3の何れか一項に記載の加圧接合装置を用いた圧電素子ユニットの製造方法であって、
前記保持治具によって所定位置に位置決めした状態で前記固定基板を前記基台上に保持し、
前記当接部材及び一方の前記チャック部材を前記規定位置に合わせて移動して固定し、
前記圧電素子形成部材を、その先端側の端面の前記位置決め部が形成される部分に前記当接部材の前記突出部が当接し且つその側端面が前記一方のチャック部材に当接するように前記固定基板上に接着剤を介して配置し、
他方の前記チャック部材を前記圧電素子形成部材の側端面に当接させて前記圧電素子形成部材を規定位置に位置決めし、
当該圧電素子形成部材を前記規定位置に位置決めした状態で、前記加圧手段によって前記圧電素子形成部材を前記固定基板側に押圧して前記接着剤によって前記圧電素子形成部材と前記固定基板とを接合することを特徴とする圧電素子ユニットの製造方法。
A method for manufacturing a piezoelectric element unit using the pressure bonding apparatus according to any one of claims 1 to 3 ,
Holding the fixed substrate on the base in a state positioned at a predetermined position by the holding jig;
The contact member and one of the chuck members are moved and fixed in accordance with the specified position,
The piezoelectric element forming member is fixed so that the protruding portion of the abutting member abuts on a portion where the positioning portion of the end surface on the tip end side abuts and the side end surface abuts on the one chuck member. Place it on the substrate with an adhesive,
The other chuck member is brought into contact with a side end surface of the piezoelectric element forming member to position the piezoelectric element forming member at a specified position,
With the piezoelectric element forming member positioned at the specified position, the pressure element presses the piezoelectric element forming member toward the fixed substrate and joins the piezoelectric element forming member and the fixed substrate with the adhesive. A method for manufacturing a piezoelectric element unit, comprising:
前記圧電素子形成部材と前記固定基板とを接合後、前記当接部材及び前記チャック部材のそれぞれを前記圧電素子形成部材の外側に向かって移動させてから前記圧電素子形成部材と前記固定基板との接合体を前記基台上から取り外すことを特徴とする請求項に記載の圧電素子ユニットの製造方法。 After joining the piezoelectric element forming member and the fixed substrate, the contact member and the chuck member are moved toward the outside of the piezoelectric element forming member, and then the piezoelectric element forming member and the fixed substrate are moved. The method of manufacturing a piezoelectric element unit according to claim 4 , wherein the joined body is removed from the base.
JP2007086084A 2007-03-28 2007-03-28 Pressure bonding apparatus and method for manufacturing piezoelectric element unit using the same Expired - Fee Related JP4973854B2 (en)

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