JPS6015982A - Bonding method for piezoelectric element - Google Patents

Bonding method for piezoelectric element

Info

Publication number
JPS6015982A
JPS6015982A JP58124004A JP12400483A JPS6015982A JP S6015982 A JPS6015982 A JP S6015982A JP 58124004 A JP58124004 A JP 58124004A JP 12400483 A JP12400483 A JP 12400483A JP S6015982 A JPS6015982 A JP S6015982A
Authority
JP
Japan
Prior art keywords
adhesive
piezoelectric element
bonding jig
top plate
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58124004A
Other languages
Japanese (ja)
Inventor
Kenichi Yoshida
憲一 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58124004A priority Critical patent/JPS6015982A/en
Publication of JPS6015982A publication Critical patent/JPS6015982A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Abstract

PURPOSE:To obtain the high-stability method in which an adhesive does not enchroach into the top of the piezoelectric element and there is no displacement of the piezoelectric element by a method wherein an adhesive is spread over the substrate on which the piezoelectric element is overlapped, further on which a protective film is placed followed by pressing and heating to cure it, after which the protective film is removed. CONSTITUTION:An adhesive 2 is spread over the grooves of the IJP head and the piezoelectric element 3 is overlapped on the adhesive 2. The IJP head is set on the bonding jig base table 5 present on a hot plate for heating. The adhesive plane of the protective film 4 is tightly bonded on the piezoelectric element 3 overlapped on the top of the IJP head set on the bonding jig base table 5. A handle 7 of the bonding jig top plate 6 is lifted and the shaft 9 fixed to the bonding jig base table 5 is inserted into a bearing 8 of the bonding jig top plate 6. Then the bonding jig top plate 6 is lowered by using a guide for setting 10 as a guide. By pressing with the bonding jig top plate 6 and heating with the hot plate, the adhesive 2 is completely cured, after which the bonding jig top plate 6 is detached.

Description

【発明の詳細な説明】 本発明は、インクジェットプレートヘッドにおける、ヘ
ッド上部に圧電素子を接着する、圧電素子の接着方法に
関するものである。インフジエラ)ブv−)ヘッド(以
下IJPヘッドと略す)への圧電素子の接着法において
、従来は、熱によって硬化する接着剤をIJPヘッド上
に塗布し、この接着剤の上に圧電子を置き、ホットプレ
ート上にある接着治具にセットし、゛加圧・加熱し、完
全硬化させ、硬化後、接着治具より取ね出し、IJPヘ
ッドにフレキシブルプリント板を貼り、圧電素子と、フ
レキシブルプリント板のコネクタ部を、半田付けしてい
た。しかし、圧電素子の、半田付けする上面部に接着剤
が付着していると、半田付けが困難なため、これについ
てはカッターナイフなどの刃先で、1個づつ除去しなけ
ればならなかった。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a piezoelectric element bonding method for bonding a piezoelectric element to the upper part of an inkjet plate head. Conventionally, in the method of bonding a piezoelectric element to an IJP head (hereinafter abbreviated as IJP head), an adhesive that hardens by heat is applied onto the IJP head, and the piezoelectric element is placed on top of this adhesive. , set it on an adhesive jig on a hot plate, pressurize and heat it to completely cure it, take it out from the adhesive jig after curing, attach a flexible printed board to the IJP head, and attach the piezoelectric element and flexible print. The connector part of the board was soldered. However, if adhesive adheres to the top surface of the piezoelectric element to be soldered, it is difficult to solder, and this has to be removed one by one with the edge of a cutter knife or the like.

また、圧電素子上部にはみ出した接着剤を吸収するため
、圧電素子と接着治具の上板の間に、吸い取ユ祇・キム
ワイプ・トレーシングベーパ・ベンコツトなどの吸収材
を挿入し、加圧・加熱し接着したが、吸い取り紙及びキ
ムワイプの場合は接着した圧電素子の周囲に、紙の繊維
が付着しハ?トレーシングベーパの場合は、接着剤を、
十分吸収できず、圧電素子上部に接着剤が残留する。ま
り、ペンコツH−j:、)レーシングヘーハの場合ト同
じく、十分に吸収できず、かつ圧電、素子上面に付着し
、除去でき々かった。以上のように、紙類を挿入し、接
着すると、紙の繊維が、付着する。
In addition, in order to absorb the adhesive that protrudes from the top of the piezoelectric element, an absorbent material such as suction yugi, Kimwipe, tracing vapor, or benkotsuto is inserted between the piezoelectric element and the top plate of the adhesive jig, and then pressurized and heated. However, in the case of blotter paper and Kimwipe, the paper fibers adhere to the area around the piezoelectric element that has been adhered. For tracing vapor, use adhesive,
Adhesive cannot be absorbed sufficiently and adhesive remains on the top of the piezoelectric element. As in the case of Racing Heha, it could not be absorbed sufficiently and adhered to the top surface of the piezoelectric element, making it difficult to remove. As described above, when paper is inserted and adhered, the paper fibers adhere.

また、保護フィルムを、圧電素子−上面に擦りつけて密
着させ、加圧・加熱し接着すると、圧電素子上部への接
着剤の回り込みはなく、良好な而が生じるという欠点が
あった。
Furthermore, when the protective film is rubbed onto the top surface of the piezoelectric element and bonded by applying pressure and heat, there is a drawback that the adhesive does not run around to the top of the piezoelectric element, resulting in a poor quality.

本発明は、これらの欠点を除去し、圧電素子上部に接着
剤が回り込まず、かつ圧電素子の位置づれも発生しない
、安定性の高い接着方法を掃供するものである。
The present invention eliminates these drawbacks and provides a highly stable bonding method in which the adhesive does not wrap around the top of the piezoelectric element and the position of the piezoelectric element does not shift.

以下、図面によって詳細に説明する。A detailed explanation will be given below with reference to the drawings.

第1(・利によ、本発明の一実施例を示す断面図であり
、第2図け、本発明の一実施例を示す斜視図である。
The first figure is a sectional view showing one embodiment of the present invention, and the second figure is a perspective view showing one embodiment of the present invention.

第1 iJに」?いて、lはIJPヘッドであり、 接
着剤2をこの上面溝部に塗布する。3は圧電素子であり
、接着剤2の上に重ねる。4は保護フィルムであり、厚
さが薄く、耐熱性があり、長面に僅か粘着性を有するも
ので、圧電素子上面に粘着面を密着させ、加圧接着時に
接着剤の回り込みを防ぐ。接着剤を固化するだめの加圧
・加熱方法として、次のような治具を用いた。5は接着
治具ベース板であり、上面に5′のスポンジゴム及び5
゛のテフロンシートが貼り付けられている。6は、接着
治具上板であり、下面にスポンジゴム6゛及びテフロン
シート6°゛を貼り、圧゛亀素子を接着する時の加圧用
の重りになる。7は、取手であり、接着治具上板の移動
時のつまみである。8は、スライドベアリングであり、
接着治具−ヒ板がスムーズな上下移動をするためのもの
である。9は軸であり、接着治具上板を支持する。
1st iJ”? 1 is an IJP head, and adhesive 2 is applied to the groove on the upper surface. 3 is a piezoelectric element, which is placed on top of the adhesive 2. 4 is a protective film, which is thin, heat resistant, and slightly adhesive on its long side; the adhesive surface is brought into close contact with the top surface of the piezoelectric element to prevent the adhesive from going around during pressure bonding. The following jig was used to pressurize and heat the adhesive to solidify it. 5 is an adhesive jig base plate, with 5' sponge rubber and 5
A Teflon sheet is attached. Reference numeral 6 designates the upper plate of the adhesive jig, and a sponge rubber 6'' and a Teflon sheet 6'' are pasted on the lower surface, and this serves as a weight for applying pressure when adhering the pressure mechanism element. Reference numeral 7 denotes a handle, which is a knob for moving the upper plate of the adhesive jig. 8 is a slide bearing;
Adhesive jig - This is to allow the plate to move up and down smoothly. Reference numeral 9 denotes a shaft that supports the upper plate of the adhesive jig.

第2図において、10は、セット用ガイドであり、接着
治具上板の位置決めと、スムーズな上下運動金させる案
内をする。
In FIG. 2, reference numeral 10 denotes a setting guide, which guides the positioning of the upper plate of the adhesive jig and its smooth vertical movement.

以上のような構造からなる、iJPヘッドの圧電素子の
接着を行なうには、先ず■JPヘッド1の各溝部に接着
剤2を塗布し、ヘラで均一に伸ばし、次に、接着剤2の
上に圧電素子3を取ね、加熱用のホットプレート(図示
せず)上にある接着治具ペース台5の上にIJPヘッド
lをセラ)−1−る。保護フィルム4の粘着面を吸着治
具ベース台6の上のIJPヘッド1の上部Cf(曵ね、
ICE’4累子3の止子3Gメで1させる。
To bond the piezoelectric elements of the iJP head with the above structure, first apply adhesive 2 to each groove of the JP head 1, spread it evenly with a spatula, and then apply adhesive 2 on top of the adhesive 2. Then, take the piezoelectric element 3 and place the IJP head l on the adhesive jig pace table 5 on the heating hot plate (not shown). The adhesive surface of the protective film 4 is attached to the upper part Cf of the IJP head 1 on the suction jig base 6.
ICE'4 Yuko 3's Toko 3G Me to make it 1.

接着治具上板6の、取手7を持ち上げ、渡鳥治具ベース
台5に固定されている曲19苓:、接着治具土板6のベ
アリング10に挿入し7、七ノド用ガイド10を案内に
・吸着治ν、上板6を引き下ろし7、IJPヘッドlと
L電素−了3の接着、及び、圧′直素子3の上面と保護
フィルム4を密着させるだめ、接着治具−に板6によっ
て加圧し、ホットプレートで、加熱することにより接着
剤2を見金硬化させる。
Lift up the handle 7 of the adhesive jig top plate 6, insert it into the bearing 10 of the adhesive jig clay plate 6 fixed to the Watari jig base 5, and guide the guide 10 for seven throats. - Pull down the upper plate 6 using the suction jig 7. In order to bond the IJP head 1 and the L element 3, and to bring the top surface of the pressure direct element 3 and the protective film 4 into close contact, place the plate on the adhesive jig. 6 and heated with a hot plate to harden the adhesive 2.

完全硬化後、接着治具上&6を烙り外し2、保護フィル
ム4を取り3?いてもIJPヘッドJ」二部に接着され
7に圧電索子3の1−而には、P着剤2の回り込みも々
く、良好な而が得られる。
After completely curing, remove the top &6 of the adhesive jig 2, remove the protective film 4 3? Even if the IJP head J is bonded to the second part of the piezoelectric cable 7 and the first part of the piezoelectric cable 3, the P adhesive 2 can easily wrap around the piezoelectric cord 3, and a good effect can be obtained.

以1のように、本発明によルば圧電素子上m1に接着剤
がないため、ず〈゛にフレキシブルプリント板への半B
]付けが、町11にとなり、艮好な接着が短時間で行な
える。
As described in 1 above, according to the present invention, since there is no adhesive on m1 on the piezoelectric element, it is not necessary to attach the half B to the flexible printed board.
] Attachment becomes 11 times, and beautiful adhesion can be done in a short time.

尚、本発明によれば、他の素子を接着する場合にも、使
用することがoJ能であり極めて便利である。
Furthermore, according to the present invention, it is possible to use the present invention even when bonding other elements, since it is an OJ function and is extremely convenient.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本う′る明の実施例でhる圧゛ム累子の接着
方法をi況明するブζめに示ず萌ai1図であり、第2
図は、第】図に対応するぶ)尻重でめる。 図において、】はIJPヘッド、2は接着ハリ、3は圧
電素子、4は保訣フィルム、5は接着治具ベース台、5
’ハスポンジコム、5”i、xテンロンシート、6は1
妾着治其上板、61はスポンジコム、6゛′はテフロン
シート、7は重子、8目ベアリング、9は軸、10はセ
ット用ガイドである。
Fig. 1 is a first drawing showing the method of adhering the pressure plate according to the embodiment of the present invention;
The figure corresponds to Figure 1). In the figure, ] is the IJP head, 2 is the adhesive tension, 3 is the piezoelectric element, 4 is the adhesive film, 5 is the adhesive jig base, 5
'haspongecom, 5"i, x tenron seat, 6 is 1
61 is a sponge comb, 6' is a Teflon sheet, 7 is a weight, 8 is a bearing, 9 is a shaft, and 10 is a setting guide.

Claims (1)

【特許請求の範囲】[Claims] 基板上に、熱によって硬化する接着剤を塗布し、前記接
着剤上に、圧電素子を重ね合わせ、さらに、前記圧電素
子上に保護フィルムを置き、加圧・加熱によって完全硬
化させた後、保護フィルムを除去することにより、圧電
素子上部に接着剤が、付着しないようにしたことを特徴
とする圧電素子の接着方法。
An adhesive that hardens by heat is applied onto the substrate, a piezoelectric element is placed on top of the adhesive, a protective film is placed on the piezoelectric element, and the protective film is completely cured by applying pressure and heat. A method for bonding a piezoelectric element, characterized in that adhesive is prevented from adhering to the top of the piezoelectric element by removing the film.
JP58124004A 1983-07-07 1983-07-07 Bonding method for piezoelectric element Pending JPS6015982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58124004A JPS6015982A (en) 1983-07-07 1983-07-07 Bonding method for piezoelectric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58124004A JPS6015982A (en) 1983-07-07 1983-07-07 Bonding method for piezoelectric element

Publications (1)

Publication Number Publication Date
JPS6015982A true JPS6015982A (en) 1985-01-26

Family

ID=14874650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58124004A Pending JPS6015982A (en) 1983-07-07 1983-07-07 Bonding method for piezoelectric element

Country Status (1)

Country Link
JP (1) JPS6015982A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008238753A (en) * 2007-03-28 2008-10-09 Seiko Epson Corp Pressure bonding device and manufacturing method for piezoelectric element unit using them

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008238753A (en) * 2007-03-28 2008-10-09 Seiko Epson Corp Pressure bonding device and manufacturing method for piezoelectric element unit using them

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