JP4972496B2 - Substrate support device assembly method and substrate support device assembly support device - Google Patents

Substrate support device assembly method and substrate support device assembly support device Download PDF

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JP4972496B2
JP4972496B2 JP2007224561A JP2007224561A JP4972496B2 JP 4972496 B2 JP4972496 B2 JP 4972496B2 JP 2007224561 A JP2007224561 A JP 2007224561A JP 2007224561 A JP2007224561 A JP 2007224561A JP 4972496 B2 JP4972496 B2 JP 4972496B2
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support
supported
half mirror
plane
substrate
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JP2009059810A (en
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毅 近藤
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Description

本発明は、基板支持装置組立方法および基板支持装置組立支援装置に関するものであり、特に、組立の容易性,正確性あるいは信頼性の向上に関するものである。   The present invention relates to a substrate support device assembling method and a substrate support device assembly support device, and more particularly to improvement of ease of assembly, accuracy, or reliability.

プリント基板には、電子回路の構成部品である電子回路部品の装着や接着剤等高粘性流体の塗布等、種々の作業が施される。これらの作業が行われる際、プリント基板が裏面側へ撓むことを防止するために、プリント基板を裏面側から支持部材に支持させることが行われている。その際、プリント基板の裏面側に配線パターンが形成されている場合や、その配線パターンに既に電子回路部品が装着されている場合のように、プリント基板が裏面の配線パターンが形成されていない限られた部分においてのみ支持することが望ましい場合、あるいは電子回路部品が装着されていない限られた部分においてのみ支持することが可能である場合がある。そのような場合には、支持部材は基板支持装置の支持台に、プリント基板を支持することができない、あるいは支持しないことが望ましい部分を避けてプリント基板を支持するように配置される。   Various operations such as mounting of electronic circuit components, which are components of the electronic circuit, and application of a highly viscous fluid such as an adhesive are performed on the printed circuit board. When these operations are performed, in order to prevent the printed circuit board from being bent to the back surface side, the printed circuit board is supported on the support member from the back surface side. At that time, as long as the wiring pattern is formed on the back side of the printed circuit board or the electronic circuit component is already mounted on the wiring pattern, the wiring pattern on the back side of the printed circuit board is not formed. In some cases, it is desirable to support only in a certain part, or it is possible to support only in a limited part where no electronic circuit component is mounted. In such a case, the support member is arranged on the support base of the substrate support device so as to support the printed circuit board while avoiding a portion where the printed circuit board cannot be supported or desirably not supported.

そのために、下記の特許文献1には、作業者による支持部材の支持台への配置を支持部材配置作業支援装置により支援することが提案されている。この支援装置は、プリント基板の裏面に電子回路部品が装着された状態を、プリント基板の表面側から透視したものに相当する画像を支持台の支持部材支持面に投影するものとされている。その投影像を見れば、プリント基板の裏面のいずれに電子回路部品が装着されているかがわかり、作業者は支持部材を支持部材支持面上の電子回路部品と干渉しない位置に配置することができる。
特開2004−221165公報
For this purpose, Patent Document 1 below proposes that a support member placement work support device supports the placement of a support member on a support base by an operator. This support apparatus is designed to project an image corresponding to a state in which an electronic circuit component is mounted on the back surface of a printed circuit board as seen through from the front surface side of the printed circuit board on a support member support surface of a support base. From the projected image, it can be seen on which side of the printed circuit board the electronic circuit component is mounted, and the operator can place the support member at a position that does not interfere with the electronic circuit component on the support member support surface. .
JP 2004-221165 A

しかしながら、支持部材の先端のプリント基板を支持する基板支持面は、支持部材の支持部材支持面上に載置される底面より小さく、かつ、平面視において底面の内側に位置するように設けられるのが普通であり、特許文献1に記載の支持部材配置作業支援装置による支援では、支持部材を、基板支持面が電子回路部品との干渉を避けつつプリント基板を支持する位置に正確に配置することが困難あるいは不可能な場合がある。例えば、プリント基板の裏面の電子回路部品の実装密度が高い箇所を支持部材により支持する場合、被支持可能領域が狭く、支持部材を支持部材支持面の被支持可能領域に対応する部分に置いたとき、支持部材の底面が被支持可能領域からはみ出して電子回路部品の画像が隠れて見えなくなり、基板支持面が確実に被支持可能領域内に配置されているか否かがわからないことがあるのである。支持部材の底面はプリント基板を支持しないため、被支持可能領域の像より大きくても支障はないのに対し、基板支持面は被支持可能領域より小さく、かつ、被支持可能領域内に位置させられて電子回路部品との干渉を避けつつ、被支持面を支持することが必要である。
本発明は、以上の事情を背景として為されたものであり、支持部材の支持台への配置を容易に、正確に、あるいは高い信頼性を以て行うことができる基板支持装置組立方法および基板支持装置組立支援装置を提供することを課題とする。
However, the substrate support surface for supporting the printed circuit board at the tip of the support member is provided so as to be smaller than the bottom surface placed on the support member support surface of the support member and located inside the bottom surface in plan view. In the support by the support member placement work support device described in Patent Document 1, the support member is accurately placed at a position where the board support surface supports the printed circuit board while avoiding interference with the electronic circuit components. May be difficult or impossible. For example, when supporting a place where the mounting density of the electronic circuit components on the back surface of the printed circuit board is high by the support member, the supportable area is narrow, and the support member is placed in a part corresponding to the supportable area of the support member support surface. In some cases, the bottom surface of the support member protrudes from the supportable region, and the image of the electronic circuit component is hidden and cannot be seen, so it is not possible to know whether the substrate support surface is reliably disposed in the supportable region. . Since the bottom surface of the support member does not support the printed circuit board, there is no problem even if it is larger than the image of the supported area, whereas the substrate support surface is smaller than the supported area and is located within the supported area. Therefore, it is necessary to support the supported surface while avoiding interference with the electronic circuit component.
The present invention has been made in the background of the above circumstances, and a substrate support device assembling method and a substrate support device capable of easily, accurately or highly reliably arranging a support member on a support base. It is an object to provide an assembly support device.

上記の課題は、支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置を組み立てる基板支持装置組立方法を、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す配置表示面を有する部品配置表示体と、前記支持台とを、(a)前記配置表示面と、(b)前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに0度以上180度以下の角度を成す姿勢で配置するとともに、それら配置表示面と支持平面との間にハーフミラーを配置し、そのハーフミラー上の1点を透過する光の光路である第1光路と前記ハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の前記共通光路部上にその共通光路部に沿って線状の光を投射する投光器を配置し、その投光器から投射される線状の光が前記ハーフミラーを透過して、前記配置表示面の前記支持部材により支持されるべき箇所の中心である被支持点と前記支持平面上の前記基板支持面の中心との一方に入射するとともに、前記ハーフミラーにより反射されて前記部品配置表示体の前記被支持点と前記支持平面上の前記基板支持面の中心との他方に入射する状態で、前記支持部材を前記支持台に配置固定する方法とすることにより解決される。
部品配置表示体は、プリント基板の被支持面の少なくとも電子回路部品の配置を表すものであればよく、被支持面に既に電子回路部品が装着されているプリント基板自体がその代表的なものであるが、その他に、例えば、プリント基板の被支持面を表す画像を使用することができる。この画像は、被支持面を表すハードコピー、例えば、プリント基板に装着される電子回路部品および電子回路部品同士を接続する導線を含む回路の設計図や、実際に電子回路部品が装着されたプリント基板の被支持面を撮像装置によって撮像することにより得られる画像データを印刷したものにより得られ、あるいはそれら回路図あるいは画像データを液晶等の表示画面によって表示することにより得られる。
支持部材は、支持台に着脱可能に固定されるものでもよく、着脱不能に固定されるものでもよい。前者の場合、支持部材は、例えば、マグネットを備え、磁力によって支持台に固定されるものとされ、あるいはねじにより支持台に固定されるものとされ、あるいは負圧によって支持台に吸着され、固定されるものとされる。また、支持部材は、その先端の基板支持面によってプリント基板を支持するとともに、吸着カップ等の吸着部を備え、負圧によりプリント基板を吸着して保持するものでもよく、あるいは吸着部を備えず、基板支持面によってプリント基板を支持するのみのものでもよい。
An object of the present invention is to provide a substrate support device assembly method in which a support member is arranged and fixed on a support base, and a substrate support device that supports one of the supported surfaces of the printed circuit board by the substrate support surface at the tip of the support member is assembled. and a component arrangement display having an arrangement display surface representing at least the arrangement of the electronic circuit components of the supported surface of the printed circuit board, and said support base, and (a) the arrangement display surface, (b) said support table wherein if the supporting member is disposed and fixed the substrate supporting surface of the support member is arranged in a posture angle of the support plane and following one another 0 degrees to 180 degrees is a plane located thereon in conjunction, they arranged A half mirror is arranged between the display surface and the support plane, and a first optical path which is an optical path of light passing through one point on the half mirror and an optical path of light reflected at the one point on the half mirror. A certain first There in the optical path, the projector for projecting two of said common optical path portion on along the common optical path of the linear light optical path to form a common optical path portion is parallel to extending and overlapping portions with each other in some arrangement, and linear light projected from the projector is transmitted through the half mirror, the on the support surface and the support point which is the center of the portion to be supported by the support member of the arrangement display surface While being incident on one of the center of the substrate support surface and being reflected by the half mirror and incident on the other of the supported point of the component arrangement display body and the center of the substrate support surface on the support plane It is solved by a method for arranging fixing the support member to the support base.
The component arrangement display body only needs to represent the arrangement of at least the electronic circuit components on the supported surface of the printed circuit board, and the printed circuit board itself in which the electronic circuit components are already mounted on the supported surface is representative. In addition, for example, an image representing a supported surface of a printed circuit board can be used. This image is a hard copy representing the supported surface, for example, a blueprint of a circuit including an electronic circuit component mounted on a printed circuit board and a conductive wire connecting the electronic circuit components, or a print in which the electronic circuit component is actually mounted It can be obtained by printing image data obtained by imaging the supported surface of the substrate with an imaging device, or can be obtained by displaying the circuit diagram or the image data on a display screen such as liquid crystal.
The support member may be detachably fixed to the support base, or may be fixed detachably. In the former case, for example, the support member includes a magnet and is fixed to the support base by magnetic force, or is fixed to the support base by screws, or is attracted to the support base by negative pressure and fixed. It is supposed to be done. In addition, the support member may support the printed circuit board by the substrate support surface at the tip thereof, and may include an adsorption part such as an adsorption cup, and may adsorb and hold the printed board by negative pressure, or may not include the adsorption part. The printed circuit board may be supported only by the board support surface.

上記課題はまた、支持台のバックアップピン支持面上にバックアップピンが直角に立設された状態で配置固定され、そのバックアップピンの先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置を組み立てる方法を、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す配置表示面を有する部品配置表示体と、前記支持台とを、(a)前記配置表示面と、(b)前記支持台に前記バックアップピンが配置固定されればそのバックアップピンの前記基板支持面がその上に位置する平面であって前記バックアップピン支持面から上方に離れた支持平面とが互いに交差する状態で配置するとともに、それら配置表示面と支持平面との成す角を2等分するとともに配置表示面と支持平面との交線を含む平面上にハーフミラーを配置し、そのハーフミラー上の1点を透過する光の光路である第1光路と前記ハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記バックアップピンにより支持されるべき箇所の中心である被支持点を通過するとともに、前記2つの光路の他方の上に前記バックアップピンの前記基板支持面の中心が位置する状態で、そのバックアップピンを前記バックアップピン支持面に配置固定する方法とすることにより解決される。
上記課題はさらに、支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置を、(I)ハーフミラーと、(II)線状の光を投光する投光器と、(III)それらハーフミラーおよび投光器と、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と、前記支持台とを保持する保持装置とを含むものとするとともに、その保持装置が、(a)前記部品配置表示体の配置表示面と、(b)前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに0度以上180度以下の角度を成すとともに、それら配置表示面と支持平面との間にハーフミラーが位置し、そのハーフミラー上の1点を透過する光の光路である第1光路とそのハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記支持部材により支持されるべき箇所の中心である被支持点を通過するとき、前記2つの光路の他方の上に前記支持部材の前記基板支持面の中心が位置することとなる相対位置に、前記ハーフミラー,前記部品配置表示体および前記支持台を保持するとともに、前記投光器を、前記共通光路部に位置してその共通光路部に平行に前記線状の光を投射可能に保持するものとすることにより解決される。
上記課題はさらにまた、支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置を、(i)ハーフミラーと、(ii)そのハーフミラーと、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と、前記支持台とを保持する保持装置とを含むものとするとともに、その保持装置が、(a)前記部品配置表示体の配置表示面と、(b)前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに0度以上180度以下の角度を成すとともに、それら配置表示面と支持平面との間にハーフミラーが位置し、そのハーフミラー上の1点を透過する光の光路である第1光路とそのハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記支持部材により支持されるべき箇所の中心である被支持点を通過するとき、前記2つの光路の他方の上に前記支持部材の前記基板支持面の中心が位置することとなる相対位置に、前記ハーフミラー,前記部品配置表示体および前記支持台を保持するものであり、かつ、当該基板支持装置組立支援装置を、前記被支持点の像とその被支持点を支持すべき支持部材の基板支持面の像とを認識可能な方向を一定方向に限定する認識方向限定装置を含むものとすることにより解決される。
上記課題はさらに、支持台のバックアップピン支持面上にバックアップピンが直角に立設された状態で配置固定され、そのバックアップピンの先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置を、(i)ハーフミラーと、(ii)そのハーフミラーと、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と、前記支持台とを保持する保持装置とを含むものとするとともに、その保持装置が、(a)前記部品配置表示体の配置表示面と、(b)前記支持台に前記バックアップピンが配置固定されればそのバックアップピンの前記基板支持面がその上に位置する平面であって前記バックアップピン支持面から上方に離れた支持平面とが互いに交差し、それら配置表示面と支持平面との成す角を2等分するとともに配置表示面と支持平面との交線を含む平面上に前記ハーフミラーが位置し、そのハーフミラー上の1点を透過する光の光路である第1光路とそのハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記バックアップピンにより支持されるべき箇所の中心である被支持点を通過するとき、前記2つの光路の他方の上に前記バックアップピンの前記基板支持面の中心が位置することとなる相対位置に、前記ハーフミラー,前記部品配置表示体および前記支持台を保持するものとすることにより解決される。
The above problem is also that the backup pin is arranged and fixed on the backup pin support surface of the support stand in a state of being set up at a right angle, and the substrate support surface at the tip of the backup pin supports one of the both sides of the printed circuit board. A method for assembling a substrate support device for supporting a surface, a component arrangement display body having an arrangement display surface representing an arrangement of at least an electronic circuit component on a supported surface of the printed circuit board, and the support base, (a) the arrangement A display plane; and (b) if the backup pin is arranged and fixed on the support base, the substrate support surface of the backup pin is a plane located thereon and is a support plane separated upward from the backup pin support surface. Are arranged in a state of intersecting each other, the angle formed by the arrangement display surface and the support plane is divided into two equal parts, and the plane including the intersection line of the arrangement display surface and the support plane is included. A half mirror is arranged on the first mirror, and a first optical path that is an optical path of light passing through one point on the half mirror and a second optical path that is an optical path of light reflected at the one point on the half mirror. In addition, one of the two optical paths forming a common optical path part that extends in parallel and overlaps with each other in part passes through a supported point that is the center of the portion to be supported by the backup pin on the arrangement display surface. In addition, the problem is solved by adopting a method of arranging and fixing the backup pin on the backup pin support surface in a state where the center of the substrate support surface of the backup pin is positioned on the other of the two optical paths.
The above-described problem is further provided with an apparatus for supporting an assembly operation of a substrate support device in which a support member is arranged and fixed on a support base, and a substrate support surface at the tip of the support member supports one of the supported surfaces of the printed circuit board. (I) a half mirror, (II) a projector that projects linear light, (III) the half mirror and the projector, and a component that represents an arrangement of at least electronic circuit components on the supported surface of the printed circuit board. an arrangement display body, as well as to include a holding device for holding the said support base, the holding device, the arrangement display surface of (a) the component arrangement display body, said support member to said support base (b) if it is arranged and fixed with its said substrate support surface of the support member forms an angle of support surface and below each other 0 degrees to 180 degrees is a plane located thereon, between them arranged display surface and the support plane Half mirror is located A first optical path that is an optical path of light passing through one point on the half mirror and a second optical path that is an optical path of light reflected at the one point on the half mirror, and are partially parallel to each other to form a common optical path portion is extended and overlaps part to one of the two optical paths, they pass through a supported point which is the center of the portion to be supported by the support member of the arrangement display surface, said two optical paths of the so that the center of the substrate supporting surface is positioned relative position of the other of said support member on said half mirror, holds the support base the component arrangement display body and, the projector, the common optical path This is solved by holding the linear light so that it can be projected parallel to the common optical path portion .
The above-described problem further supports the assembly work of the substrate support device in which the support member is arranged and fixed on the support base, and the substrate support surface at the tip of the support member supports one of the supported surfaces of the printed circuit board. An apparatus, (i) a half mirror, (ii) the half mirror, a component arrangement display body representing an arrangement of at least an electronic circuit component on a supported surface of the printed circuit board, and a holding device that holds the support base The holding device includes (a) an arrangement display surface of the component arrangement display body, and (b) if the support member is arranged and fixed on the support base, the substrate support surface of the support member is The support plane, which is the upper plane, forms an angle of 0 ° to 180 ° with each other, and a half mirror is positioned between the arrangement display surface and the support plane, and one point on the half mirror is transmitted. Light of light A first optical path that is a path and a second optical path that is an optical path of light reflected at the one point on the half mirror, and a common optical path portion that is a portion that extends in parallel and overlaps with each other is formed When one of the two optical paths passes through a supported point that is the center of the location to be supported by the support member of the arrangement display surface, the substrate support surface of the support member is placed on the other of the two optical paths. The half mirror, the component arrangement display body, and the support base are held at a relative position where the center of the substrate is positioned, and the board support device assembly support device is connected to the image of the supported point. This can be solved by including a recognition direction limiting device that limits the direction in which the image of the substrate support surface of the support member to support the supported point can be recognized to a certain direction.
The above-mentioned problem is further arranged and fixed in a state where the backup pin is erected at a right angle on the backup pin support surface of the support base, and is supported by one of the both sides of the printed circuit board by the substrate support surface at the tip of the backup pin. An apparatus that supports the assembly work of the board support apparatus that supports the surface is (i) a half mirror, (ii) the half mirror, and a component arrangement display that represents the arrangement of at least the electronic circuit components on the supported surface of the printed circuit board. And a holding device for holding the support base, and the holding device includes (a) an arrangement display surface of the component arrangement display body, and (b) the backup pin is arranged and fixed on the support base. If this is the case, the substrate support surface of the backup pin is a plane located thereon, and the support plane that is spaced upward from the backup pin support surface intersects with each other, and these arrangements The angle between the display surface and the support plane is equally divided into two, and the half mirror is positioned on a plane including the intersection line between the arranged display surface and the support plane, and the optical path of light passing through one point on the half mirror And a second optical path that is an optical path of light reflected at the one point on the half mirror, and a common optical path portion that is a portion that extends in parallel and overlaps with each other is formed 2 When one of the two optical paths passes through a supported point that is the center of the location to be supported by the backup pin of the arrangement display surface, the substrate support surface of the backup pin is placed on the other of the two optical paths. This is solved by holding the half mirror, the component arrangement display body, and the support base at a relative position where the center is located.

ハーフミラーは、そのハーフミラーの面に入射する光を入射角と同じ角度の反射角の方向に反射する一方、別の一部が真っ直ぐに透過すること(ハーフミラーの厚さは無視し得るものとする)を許容する。上記基板支持装置組立方法および基板支持装置組立支援装置においては、第1光路と第2光路とが互いに平行に延びかつ互いに重なり合う共通光路部を含むようにされる。第1光路は、ハーフミラーを透過する光の光路であって、被支持点と支持平面上に位置する支持部材の基板支持面とのいずれか一方を通る光路であり、第2光路は、ハーフミラーにより反射される光の光路であって、被支持点と基板支持面との他方を通る光路である。
そして、共通光路部を形成する第1,第2光路の一方が、配置表示面の支持部材により支持されるべき箇所の中心である被支持点を通過するとともに、2つの光路の他方の上に支持部材の基板支持面の中心が位置する状態で、その支持部材を前記支持台に配置固定する基板支持装置組立方法と基板支持装置組立支援装置とは、ハーフミラーにより反射された光とハーフミラーを透過した光とが共通光路部に入射する第1の態様と、それとは逆向きに、共通光路部から投射された線状の光の一部がハーフミラーにより反射される一方、別の一部がハーフミラーを透過する第2の態様とを包含している。第1の態様においては、ハーフミラーにより反射された光によって形成される被支持点周辺と基板支持面との一方の像も、ハーフミラーを透過した光によって形成される被支持点周辺と基板支持面との他方の像も共に拡大も縮小もされず(第1光路および第2光路が被支持点や基板支持面を法線方向に通る場合)、あるいは共に同じ率で縮小され(第1光路と第2光路とが被支持点や基板支持面を同じ角度で傾斜した方向に通る場合)、被支持点周辺や基板支持面を同じ方向から見たままの像となる。したがって、第1光路と第2光路との共通光路部上に位置させた認識装置や人の目によって、被支持点と重なって基板支持面が認識される位置に支持部材を配置して固定すれば、目的とする基板支持装置が得られる。第2の態様においては、共通光路部上にその共通光路に沿って線状の光を投射する投光器を配置すれば、その線状の光はハーフミラーにより2つに分けられ、一方は被支持点に入光し、他方は基板支持面に入光する。したがって、投光器を、その投光器から投射された光の一部が被支持点に入光する位置に位置決めすれば、その投光器から投射された光の他の一部が支持部材の基板支持面に入光する位置に支持部材を配置固定すればよいことになる。実際には、支持台の支持部材支持面上に載置した支持部材を支持部材支持面に沿って移動させ、投光器からの光が基板支持面の中心に当たる状態となった位置で支持部材を支持台に固定するのである。
投光器を含む上記基板支持装置組立方法および基板支持装置組立支援装置によれば、投光器による指示に基づいて支持部材を支持台の適切な位置に正確に配置することができる。
配置表示面と支持平面との成す角を2等分するとともに、配置表示面と支持平面との交線を含む平面上にハーフミラーを配置する上記基板支持装置組立方法および基板支持装置組立支援装置によれば、バックアップピンを、その基板支持面がプリント基板の被支持点を適切に支持する位置に配置固定することができる。
認識方向限定装置を含む基板支持装置組立支援装置によれば、例えば、ハーフミラーが配置表示面と支持平面との成す角を2等分するとともに、配置表示面と支持平面との交線を含む平面上に配置されることは不可欠ではなくなる。
The half mirror reflects light incident on the surface of the half mirror in the direction of the reflection angle that is the same angle as the incident angle, while another part is transmitted straight (thickness of the half mirror is negligible) Is allowed). In the substrate support apparatus assembly method and the substrate support apparatus assembly support apparatus, the first optical path and the second optical path include a common optical path portion that extends in parallel with each other and overlaps each other. The first optical path is an optical path of light that passes through the half mirror, and is an optical path that passes through one of the supported point and the substrate support surface of the support member positioned on the support plane, and the second optical path is a half path. An optical path of light reflected by the mirror, which passes through the other of the supported point and the substrate support surface.
Then, one of the first and second optical paths forming the common optical path section passes through a supported point that is the center of the location to be supported by the support member on the arrangement display surface, and on the other of the two optical paths. The substrate support device assembly method and the substrate support device assembly support device for arranging and fixing the support member on the support base in a state where the center of the substrate support surface of the support member is positioned, the light reflected by the half mirror and the half mirror In contrast to the first mode in which the light transmitted through the common light path is incident on the common optical path part, a part of the linear light projected from the common optical path part is reflected by the half mirror, whereas And a second mode in which the part is transmitted through the half mirror. In the first aspect, one image of the periphery of the supported point formed by the light reflected by the half mirror and the substrate support surface is also the periphery of the supported point formed by the light transmitted through the half mirror and the substrate support. Neither the other image of the surface nor the enlargement or reduction is performed (when the first optical path and the second optical path pass through the supported point or the substrate support surface in the normal direction), or both are reduced at the same rate (first optical path). And the second optical path pass through the supported point and the substrate support surface in a direction inclined at the same angle), the image of the periphery of the supported point and the substrate support surface is viewed from the same direction. Therefore, the recognition member placed on the common optical path portion of the first optical path and the second optical path, or the human eye, arranges and fixes the support member at a position where the substrate support surface is recognized by overlapping the supported point. In this case, a target substrate support device can be obtained. In the second aspect, if a projector that projects linear light along the common optical path is disposed on the common optical path, the linear light is divided into two by a half mirror, one of which is supported. The light enters the point, and the other enters the substrate support surface. Therefore, if the projector is positioned at a position where a part of the light projected from the projector enters the supported point, the other part of the light projected from the projector enters the substrate support surface of the support member. It is only necessary to arrange and fix the support member at the position where light is emitted. Actually, the support member placed on the support member support surface of the support base is moved along the support member support surface, and the support member is supported at a position where the light from the projector hits the center of the substrate support surface. It is fixed to the base.
According to the substrate support device assembly method and the substrate support device assembly support device including the projector, the support member can be accurately arranged at an appropriate position on the support base based on an instruction from the projector.
The above-mentioned substrate support device assembly method and substrate support device assembly support device in which the angle formed by the arrangement display surface and the support plane is equally divided and the half mirror is arranged on a plane including the intersection line of the arrangement display surface and the support plane Accordingly, the backup pin can be disposed and fixed at a position where the substrate support surface appropriately supports the supported point of the printed circuit board.
According to the substrate support apparatus assembly support apparatus including the recognition direction limiting apparatus, for example, the half mirror bisects the angle formed by the arrangement display surface and the support plane, and includes an intersection line between the arrangement display surface and the support plane. It is not essential to be placed on a plane.

発明の態様Aspects of the Invention

以下に、本願において特許請求が可能と認識されている発明(以下、「請求可能発明」という場合がある。請求可能発明は、特許請求の範囲に記載された発明である本願発明の下位概念発明や、本願発明の上位概念あるいは別概念の発明を含むことある。)の態様をいくつか例示し、それらについて説明する。各態様は請求項と同様に、項に区分し、各項に番号を付し、必要に応じて他の項の番号を引用する形式で記載する。これは、あくまでも請求可能発明の理解を容易にするためであり、請求可能発明を構成する構成要素の組み合わせを、以下の各項に記載されたものに限定する趣旨ではない。つまり、請求可能発明は、各項に付随する記載,実施例の記載,従来技術等を参酌して解釈されるべきであり、その解釈に従う限りにおいて、各項の態様にさらに他の構成要素を付加した態様も、また、各項の態様から構成要素を削除した態様も、請求可能発明の一態様となり得るのである。
The following invention which is considered claimable (hereinafter referred to as "claimable invention". Claimable invention, the lower is the invention der Ru present applied invention claimed Some aspects of the concept invention, the superordinate concept of the invention of the present application, or an invention of another concept) may be exemplified and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, the prior art, and the like. The added aspect and the aspect in which the constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

(1)支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置を組み立てる方法であって、
前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す配置表示面を有する部品配置表示体と、前記支持台とを、前記配置表示面と、前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに0度以上180度以下の角度を成す姿勢で配置するとともに、それら配置表示面と支持平面との間にハーフミラーを配置し、そのハーフミラー上の1点を透過する光の光路である第1光路と前記ハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記支持部材により支持されるべき箇所の中心である被支持点を通過するとともに、前記2つの光路の他方の上に前記支持部材の前記基板支持面の中心が位置する状態で、その支持部材を前記支持台に配置固定する基板支持装置組立方法。
本項の方法の実施時に、部品配置表示体と支持台との相対位置が、基板支持装置が実際に使用される際におけるプリント基板と基板支持装置との相対位置に対応する相対位置に位置決めされていることが望ましい。また、支持台に配置固定される支持部材が1つの場合には、上記相対位置に位置決めされていなければ本項の方法実施の実益が得られない。しかし、支持台に複数の支持部材が配置固定されて基板支持装置とされる場合は、それら複数の支持部材の相対位置が、プリント基板の複数の被支持点の相対位置と対応していれば、基板支持装置のプリント基板に対する相対位置を実際の使用時に適宜調節しても、実益がある場合がある。したがって、本項の方法の実施時に、部品配置表示体と支持台との相対位置が、基板支持装置が実際に使用される際におけるプリント基板と基板支持装置との相対位置に対応する相対位置に位置決めされていることは、望ましいことであるが、不可欠ではない。支持台に配置される支持部材の数が多いほどその傾向が強くなり、通常、支持部材が3つ以上の場合に、上記相対位置に位置決めされなくても実益が得られる。
(2)前記部品配置表示体と前記支持台とを、前記配置表示面と前記支持平面とが互いに交差する状態で配置するとともに、それら配置表示面と支持平面との成す角を2等分するとともに配置表示面と支持平面との交線を含む平面(狭義の2等分平面と称する)またはその平面に平行な平面(広義の2等分平面と称する)上に前記ハーフミラーを配置する(1)項に記載の基板支持装置組立方法。
ハーフミラーが、狭義の2等分平面上に配置されている場合には、第1光路と第2光路との一方が配置表示面と支持平面との一方と交差する点と、第1光路と第2光路との他方が配置表示面と支持平面との他方と交差する点との、配置表示面と支持平面との交線からの距離が互いに等しくなる。この事情は、配置表示面と支持平面との成す角が鋭角,直角,鈍角のいずれであっても変わらない。また、第1,第2光路のハーフミラーと成す角度のいかんを問わず変わらない。したがって、第1光路と第2光路との一方が配置表示面上の被支持点を通る場合に、第1光路と第2光路との他方が、支持台の支持部材支持面上に載置された支持部材の基板支持面の中心を通る状態で支持部材を支持台に固定すれば、その支持部材は、それの基板支持面がプリント基板の被支持点を適切に支持する位置に配置固定されたこととなる。
ただし、ハーフミラーが狭義の2等分平面上に配置されることは不可欠ではない。例えば、狭義の2等分平面上にハーフミラー配置した状態から、支持平面を支持平面と直角な方向に平行移動させた状態を考えれば、ハーフミラーが狭義の2等分平面に平行な平面(広義の2等分平面上に配置された場合の一例となるが、この場合には、後に実施例の項で詳述するように、第1,第2光路の共通光路部の方向を変えない限り、本項の方法を適用して配置された複数の支持部材の、支持平面上における複数の基板支持面の位置が同方向に同量ずれるのみで、それら複数の基板支持面の相対位置は変化しないため、適正な基板支持装置が得られるのである。
(3)前記配置表示面と前記支持平面とが互いに直交し、前記ハーフミラーがそれら配置表示面と支持平面との両方に対して45度の角度で傾斜させられた(2)項に記載の基板支持装置組立方法。
この場合には、ハーフミラーを、ハーフミラーに対して45度傾斜した方向から見れば、第1,第2光路の一方が、被支持点を配置表示面に直角な方向に通過することとなる。そして、配置表示面の被支持点周辺と支持部材の基板支持面とをそれらに直角な方向から見た状態で被支持点と基板支持面の中心との一致を判断することができる。第1,第2光路の一方が被支持点を通過する方向が配置表示面の法線方向から小角度傾いていても、傾いていない場合と殆ど違いはない(傾き角が15度以下の場合は本項の方法に含まれると考えるものとする。8度以下であることが望ましい)が、傾き角が大きくなれば、高さのある電子回路部品の陰になって被支持点が見えなくなったり、支持部材の基板支持面の、それを傾いた方向から見ることによる変形が大きくなったりし、その分、被支持点と基板支持面との一致性を正確に判断することが困難になる。本項の方法によれば、その困難を良好に回避できる。
(4)前記部品配置表示体と前記支持台とを、前記配置表示面と前記支持平面とが互いに平行に延びかつ互いに対向する状態で配置し、それら配置表示面および支持平面と45度の角度を成す傾斜姿勢で前記ハーフミラーを配置し、前記2つの光路の前記一方が前記被支持点を前記配置表示面に直角な方向に通過する状態で、前記支持部材を前記支持台に固定する(1)項に記載の基板支持装置組立方法。
本項は、配置表示面と支持平面との成す角が0である特殊な場合と考えることができる。
(5)前記部品配置表示体の前記被支持点から反射される光と、前記支持平面の前記支持部材の基板支持面から反射される光とが、一方はハーフミラーを透過し、他方は前記ハーフミラーにより反射されて、前記共通光路部へ到達し、その共通光路部上の認識点において認識される前記被支持点の像と前記基板支持面の像とが一致する状態で、前記支持部材を前記支持台に固定する(1)項ないし(4)項のいずれかに記載の基板支持装置組立方法。
(1)項に記載の組立方法における共通光路部を含む第1光路および第2光路の各光が、被支持点および基板支持面からハーフミラーへ入射し、反射および透過によりハーフミラーから出射される向きの光であり、かつ、出射後に共通光路部を有する態様が本項に記載の態様である。その共通光路部上の認識点において見て、支持部材の先端の基板支持面の像と、被支持点の像とが丁度重なって見える位置に、支持部材を配置固定することにより、支持部材を適切な支持部材配置点(支持台の支持部材支持面の、支持部材が配置されるべき部分の中心点)に正確に配置することができる。
なお、ハーフミラーを通して見える像も、ハーフミラーに映って見える像も広さを有しており、それら像が互いに重なり合う点は無限に存在するが、ハーフミラーが狭義の2等分平面上に配置されている場合には、それらの点すべてが支持部材の配置固定に適した点である。しかし、ハーフミラーが広義の2等分平面上に配置されている場合には、視線の方向を一定方向に固定して、被支持点の像と基板支持面の像とが丁度重なり合う点のみが、支持部材の配置固定に適した点となる。換言すれば、複数の認識点から互いに平行な方向に見た場合に、被支持点と基板支持面とが丁度重なり合う複数の位置が支持部材の配置固定に適した位置なのである。
認識点における認識は人の眼によって行っても、撮像装置等の認識装置により行ってもよい。また、「被支持点の像と基板支持面の像とが一致する状態」とは、両者が同心的に重なり合って認識される状態は勿論、認識は別個にされるが、同一の位置にあることが認識可能である状態をも含む。認識が人の眼によって行われる場合は、両者の像の位置が一致しているか否かが、人の脳によって判定されることとなり、両者の像が同時に視認され得ることが便利な場合が多い。しかし、不可欠ではない。例えば、十字線や円等、視野の中心や視野の外縁を表す形象との相対位置により両者の像の相対位置が間接的に認識され得る場合には、異なる時期に両者の像が認識されても差し支えないのである。認識装置により行われる場合は、画像処理上、両者の像が異なる時期に認識されることが望ましい場合が多い。しかし、不可欠ではない。認識装置により認識された像が表示装置により表示されたものを人が見て一致性を判断する場合がその一例である。
なお、被支持点自体は面積を有さず、見えないので、厳密には「被支持点の像」ではなく「被支持点を中心とする一定領域の像」と称すべきものであるが、説明の簡略化のために「被支持点の像」なる表現を使用する。
(6)前記共通光路部上にその共通光路部に沿って線状の光を投射する投光器を配置し、その投光器から投射される線状の光が前記ハーフミラーを透過して前記部品配置表示体の前記被支持点と前記支持平面上の前記基板支持面との一方に入射するとともに、前記ハーフミラーにより反射されて前記部品配置表示体の前記被支持点と前記支持平面上の前記基板支持面との他方に入射する状態で前記支持部材を前記支持台に固定する(1)項ないし(4)項のいずれかに記載の基板支持装置組立方法。
(1)項に記載の組立方法における共通光路部を含む第1光路および第2光路の各光が、ハーフミラーにより反射され、あるいはハーフミラーを透過して被支持点および基板支持面に入射する向きの光であり、ハーフミラーへの入射前に共通光路部を有する態様が本項に記載の態様である。投光器により、共通光路部に線状の光が投射されれば、その光はハーフミラーによる反射と透過とにより2つに分けられて、互いに対応する被支持点と基板支持面とに入射し、支持部材配置点が光によって指示されることとなる。したがって、支持部材を、その先端の基板支持面の中心に線状の光が入射する状態で支持部材を支持台に固定すれば、被支持点に対応する支持部材配置点に支持部材を正確に配置することができる。
なお、投光器の線状の光の投射方向は一定であることが望ましいが、ハーフミラーが狭義の2等分平面上に配置されている場合には、投光器を任意の方向に光を投射するものとすることができる。例えば、投光器の位置は一定とし、投射方向を任意に変え得るようにしてもよいのである。
(11)支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置であって、
ハーフミラーと、
そのハーフミラーと、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と、前記支持台とを保持する保持装置と
を含み、その保持装置が、
前記部品配置表示体の配置表示面と、前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに0度以上180度以下の角度を成すとともに、それら配置表示面と支持平面との間にハーフミラーが位置し、そのハーフミラー上の1点を透過する光の光路である第1光路とそのハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記支持部材により支持されるべき箇所の中心である被支持点を通過するとき、前記2つの光路の他方の上に前記支持部材の前記基板支持面の中心が位置することとなる相対位置に、前記ハーフミラー,前記部品配置表示体および前記支持台を保持するものである基板支持装置組立支援装置。
(12)前記保持装置が、前記ハーフミラー,前記部品配置表示体および前記支持台を、前記配置表示面と前記支持平面とが互いに交差し、それら配置表示面と支持平面との成す角を2等分するとともに配置表示面と支持平面との交線を含む平面またはその平面に平行な平面上に前記ハーフミラーが位置する状態に保持する(11)項に記載の基板支持装置組立支援装置。
前記(2)項に関連して行った説明が本項にも当てはまる。
(13)前記保持装置が、前記ハーフミラー,前記部品配置表示体および前記支持台を、前記配置表示面と前記支持平面とが互いに直交し、前記ハーフミラーがそれら配置表示面と支持平面との両方に対して45度の角度で傾斜した状態に保持する(12)項に記載の基板支持装置組立支援装置。
前記(3)項に関連して行った説明が本項にも当てはまる。
(14)前記保持装置が、前記ハーフミラー,前記部品配置表示体および前記支持台を、前記配置表示面と前記支持平面とが互いに平行に延びかつ互いに対向するとともに、前記ハーフミラーがそれら配置表示面および支持平面と45度の角度を成す傾斜姿勢となり、かつ、前記2つの光路の前記一方が前記被支持点を前記配置表示面に直角な方向に通過する状態に保持する(11)項に記載の基板支持装置組立支援装置。
(15)前記共通光路部に設けられ、その共通光路部に平行な線状の光を投射する投光器を含む(11)項ないし(14)項のいずれかに記載の基板支持装置組立支援装置。
本項に記載の支援装置によれば、(6)項に記載の組立方法を実施し得る。
保持装置は、部品配置表示体と支持台とを、被支持点周辺(配置表示面)と基板支持面(支持平面)とが互いに交差する相対位置関係に保持するものでもよく、互いに平行な姿勢で対向する相対位置関係に保持するものでもよい。前者の場合、保持装置は、例えば、部品配置表示体と支持台とを、被支持点周辺と基板支持面とが互いに直交する相対位置関係に保持するものとされる。後者の場合、(24)項に記載の支援装置と同様に導光装置が設けられ、投光器により投射された光の一部がハーフミラーを透過し、別の一部が反射された後、それら透過光と反射光との少なくとも一方が導光装置により導かれて被支持点周辺と基板支持面との少なくとも一方に入射させられるようにされる。
なお、本項の基板支持装置組立支援装置においては、ハーフミラーが狭義の2等分平面上に配置されることは不可欠ではない。
(16)前記投光器を前記共通光路部と交差する方向に移動させる投光器移動装置と、前記投光器の前記線状の光の投射方向を変更する方向変更装置との少なくとも一方を含む(15)項に記載の基板支持装置組立支援装置。
投光器は線状の光を投射するが、投光器移動装置によって移動させることにより、部品配置表示体の配置表示面(プリント基板の被支持面)の複数箇所に光を入射させ、支持部材配置点を複数、指示させることができる。部品配置表示体および支持台を移動装置により移動させてもよいが、投光器を移動させる方が移動に要するスペースが小さくて済む等、簡単である。投光器移動装置は、手動で投光器を移動させるものでも、作業者による操作装置の操作に応じて動力駆動装置により投光器を移動させるものでもよい。いずれにしても、投光器を所定の姿勢に保ちつつそれの移動を案内する案内装置が設けられることが望ましい。
方向変更装置を設けても部品配置表示体の配置表示面(プリント基板の被支持面)の複数箇所に光を入射させ、支持部材配置点を複数、指示させることができる。しかしこの場合には、ハーフミラーが配置表示面と支持平面との狭義の2等分平面に配置されることが必要である。
(17)前記投光器が、前記線状の光としてレーザビームを投射するレーザポインタを含む(15)項または(16)項に記載の基板支持装置組立支援装置。
レーザポインタによれば、線状の光を得ることが容易である。
(18)前記被支持点の像とその被支持点を支持すべき支持部材の基板支持面の像とを認識可能な方向を一定方向に限定する認識方向限定装置を含む(11)項ないし(14)項のいずれかに記載の基板支持装置組立支援装置。
認識方向限定装置を設ければ、認識方向が一定方向に限定されるため、ハーフミラーが狭義の2等分平面上に配置されることは不可欠ではなくなる。あるいは、第1,第2光路を、部品配置表示体の配置表示面の法線に平行なものに限定することができ、被支持点周辺および基板支持面をそれらに直角な方向から見つつ支持部材を配置固定することができ、被支持点と基板支持面との一致判断を容易に正確に行うことができる。
(19)前記認識方向限定装置が、特定の方向から入射する光は透過させるが、他の方向から入射する光は遮断する遮断フィルタを含む(18)項に記載の基板支持装置組立支援装置。
遮断フィルタによれば、一定の認識方向においてのみ、被支持点および基板支持面の像を認識することができる。平板に形成された比較的小さい貫通穴を通して対象物を見る場合には、見ることができるのは対象物の一部分のみであり、他の部分は見ることができないのであるが、これと似た現象が生じるのである。しかも、遮断フィルタにおいては、目の位置を遮断フィルタの面に平行な方向に移動させると、その移動に伴って貫通穴も移動するのに等しい現象が生じるため、目を移動させることにより、認識可能な領域を被支持面全体にわたって移動させることができる。遮断フィルタが大きくても、部品配置表示体の配置表示面は部分的にしか認識されないのであり、その認識可能な領域を移動させるために遮断フィルタを移動させる必要がない。したがって、遮断フィルタを使用すれば、簡易な基板支持装置組立支援装置を得ることができる。
(20)前記遮断フィルタを、前記被支持点から前記部品配置表示体の配置表示面に対する法線の方向に反射される光が前記一定の方向から当該遮断フィルタに入射する姿勢で保持する遮断フィルタ保持装置と
を含む(19)項に記載の基板支持装置組立支援装置。
本項の基板支持装置組立支援装置においては、前記支持部材配置点に配置された前記支持部材の前記基板支持面からその基板支持面に対する法線の方向に反射される光も前記一定の方向から遮断フィルタに入射することとなる。
遮断フィルタ保持装置は、遮断フィルタを、部品配置表示体と支持台とハーフミラーと共に保持するものであってもよく、遮断フィルタに専用の保持装置でもよい。前者の場合には、部品配置表示体と支持台とハーフミラーとを保持する保持装置が、遮断フィルタ保持装置を兼ねることになる。
(21)前記認識方向限定装置が、
認識点に入射する光を設定角度以内の光に制限する入射光制限筒と、
その入射光制限筒をその入射光制限筒の軸線と交差する方向に移動させる制限筒移動装置と
を含む(18)項に記載の基板支持装置組立支援装置。
入射光制限筒の断面積は、部品配置表示体の配置表示面より小さく、認識点に入射する光は、配置表示面の被支持点を含む小さい領域から配置表示面に対して一定の方向に反射される光に制限され、入射光制限筒に入射した光による像を認識することにより、被支持点の像および基板支持面の像を同一の認識方向において認識することとなり、ハーフミラーが狭義の2等分平面上に設けられていなくても、被支持点と基板支持面との一致を誤りなく判定することができる。あるいは、第1,第2光路を、部品配置表示体の配置表示面の法線に平行なものに限定することができる。
入射光制限筒を移動させることにより、入射光制限筒に入射する光が変わり、部品配置表示体の配置表示面を一部ずつ、順次認識することができる。
(22)前記入射光制限筒内に、その入射光制限筒内に入射した光を前記認識点に集光させる1つ以上のレンズを含むレンズ系が設けられた(21)項に記載の基板支持装置組立支援装置。
入射光制限筒が鏡筒として機能することとなる。例えば、レンズ系により、部品配置表示体の配置表示面における被支持点周辺および基板支持面の像が拡大され、プリント基板の支持部材により支持可能な領域が非常に小さい場合でも、支持部材を適切な位置に配置することが容易になる。
(23)支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置であって、
前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と前記支持台とを、前記部品配置表示体の配置表示面と、前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに直交する相対位置関係に保持する保持装置と、
前記配置表示面および前記支持平面の両方に対して45度で傾斜したハーフミラーと、
そのハーフミラーを経た光を認識可能な方向を、前記配置表示面と前記支持平面との一方に平行で他方に直角な方向に限定する認識方向限定装置と、
その認識方向限定装置および前記ハーフミラーを、そのハーフミラーに平行な平面内の任意の位置へ移動させる移動装置と
を含み、かつ、前記保持装置が、前記部品配置表示体と前記支持台とを、前記被支持点から前記配置表示面に対する法線の方向に反射された光と、前記被支持点を支持すべき支持部材の基板支持面から前記支持平面に対する法線の方向に反射された光とが前記ハーフミラーの同一点に入射する相対位置に保持するものである基板支持装置組立支援装置。
ハーフミラーが部品配置表示体の配置表示面と支持平面との両方に対して45度で傾斜させられることにより、被支持点周辺の像および基板支持面の像が縮小されることなく形成され、認識方向限定装置による認識方向の限定により、被支持点周辺と基板支持面とがそれらに直角な方向から見た状態で認識される。したがって、支持部材を、それの基板支持面の像が被支持点の像と丁度重なり合う位置に配置することにより、被支持点と対応する支持部材配置点に正確に配置することができる。そして、ハーフミラーが移動装置によって移動させられることにより、配置表示面(被支持面)を一部ずつ順次認識し、結局、配置表示面(被支持面)の支持部材による支持が必要な箇所の全部にそれぞれ対応する支持部材配置点に支持部材を配置することができる。
(24)支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置であって、
前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と前記支持台とを、前記部品配置表示体の配置表示面と、前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに平行な姿勢で対向する相対位置関係に保持する保持装置と、
前記配置表示面および前記支持平面の両方に対して45度で傾斜したハーフミラーと、
前記被支持点から前記配置表示面に対する法線の方向に反射される光と、前記被支持点を支持すべき支持部材の基板支持面から前記支持平面に対する法線の方向に反射される光とを、前記ハーフミラーの同一点へ導く導光装置と、
前記ハーフミラーからの光のうち認識可能な光を、前記被支持点から前記配置表示面に対する法線の方向に反射される光と前記基板支持面から前記支持平面に対する法線の方向に反射される光とに限定する認識可能光限定装置と、
その認識可能光限定装置および前記ハーフミラーを、前記配置表示面に平行な平面内の任意の位置へ移動させる移動装置と
を含む基板支持装置組立支援装置。
配置表示面と支持平面とは互いに平行な姿勢で対向させられるが、ハーフミラーの傾斜角度が45度とされ、導光装置および認識可能光限定装置が設けられることにより、配置表示面と支持平面とが互いに直交する状態とされる場合と同様に、被支持点とその被支持点を支持すべき支持部材の基板支持面とが位置ずれなく認識され、支持部材を支持台上の適正な位置に正確に配置することができる。そして、認識可能光限定装置を移動装置によって移動させることにより、配置表示面の一部分ずつを順次認識し、結局、全体を認識することができ、支持部材による支持が必要な全部の被支持点にそれぞれ対応する位置に支持部材を配置することができる。
なお、上記(23)項の基板支持装置組立支援装置において、認識方向限定装置を、共通光路部に設けられてその共通光路部に平行な線状の光を投射する投光器に置換しても、また、(24)項の基板支持装置組立支援装置において、認識可能光限定装置を投光器に置換しても、本発明の効果が得られる。
(1) A method of assembling a substrate support device in which a support member is arranged and fixed on a support base, and supports a supported surface that is one of both surfaces of a printed circuit board by a substrate support surface at the tip of the support member,
The component arrangement display body having an arrangement display surface representing the arrangement of at least electronic circuit components on the supported surface of the printed circuit board, the support table, and the support member is arranged and fixed on the arrangement display surface and the support table. Then, the substrate support surface of the support member is disposed in a posture that forms an angle of 0 degrees or more and 180 degrees or less with respect to the support plane that is a plane on which the substrate support surface is located, and between the arrangement display surface and the support plane. A first optical path that is an optical path of light passing through one point on the half mirror and a second optical path that is an optical path of light reflected at the one point on the half mirror. One of the two optical paths forming a common optical path portion that extends in parallel and overlaps with each other in part passes through a supported point that is the center of the portion to be supported by the support member on the arrangement display surface. While, the in the state where the center of the substrate supporting surface is positioned in the supporting member, the substrate supporting device assembly method of placing fixing the support member to the support base on the other of the two optical paths.
When performing the method of this section, the relative position between the component arrangement display body and the support base is positioned at a relative position corresponding to the relative position between the printed circuit board and the substrate support device when the substrate support device is actually used. It is desirable that Further, in the case where there is one support member arranged and fixed on the support base, the actual implementation of the method of this section cannot be obtained unless the support member is positioned at the relative position. However, when a plurality of support members are arranged and fixed on the support base to form a substrate support device, the relative positions of the plurality of support members correspond to the relative positions of the plurality of supported points of the printed circuit board. Even if the relative position of the substrate supporting device with respect to the printed circuit board is appropriately adjusted during actual use, there may be a case where there is a profit. Therefore, when the method of this section is performed, the relative position between the component arrangement display body and the support base is set to a relative position corresponding to the relative position between the printed circuit board and the substrate support device when the substrate support device is actually used. Being positioned is desirable but not essential. As the number of support members arranged on the support base increases, the tendency becomes stronger. Normally, when there are three or more support members, the actual benefits can be obtained even if they are not positioned at the relative positions.
(2) The component arrangement display body and the support base are arranged in a state where the arrangement display surface and the support plane intersect each other, and an angle formed by the arrangement display surface and the support plane is divided into two equal parts. In addition, the half mirror is arranged on a plane (referred to as a bisection plane in a narrow sense) including an intersection line between the arrangement display surface and a support plane or a plane parallel to the plane (referred to as a bisection plane in a broad sense) ( A method for assembling a substrate support apparatus according to item 1).
When the half mirror is arranged on a narrowly divided bisection plane, a point where one of the first optical path and the second optical path intersects one of the arrangement display surface and the support plane, and the first optical path, The distance from the intersection of the arrangement display surface and the support plane to the point where the other of the second optical path intersects the other of the arrangement display surface and the support plane is equal to each other. This situation does not change whether the angle formed by the arrangement display surface and the support plane is an acute angle, a right angle, or an obtuse angle. Moreover, it does not change regardless of the angle formed with the half mirrors of the first and second optical paths. Therefore, when one of the first optical path and the second optical path passes through the supported point on the arrangement display surface, the other of the first optical path and the second optical path is placed on the support member support surface of the support base. If the support member is fixed to the support base in a state passing through the center of the substrate support surface of the support member, the support member is arranged and fixed at a position where the substrate support surface appropriately supports the supported point of the printed circuit board. It will be.
However, it is not indispensable that the half mirror is arranged on a narrowly divided bisection plane. For example, considering a state in which a half mirror is arranged on a bisector plane in a narrow sense and a state in which the support plane is translated in a direction perpendicular to the support plane, the half mirror is a plane parallel to the bisector plane in a narrow sense ( This is an example of the case where they are arranged on a broadly divided bisection plane. In this case, the direction of the common optical path portion of the first and second optical paths is not changed, as will be described later in detail in the section of the embodiment. As long as the positions of the plurality of substrate support surfaces on the support plane of the plurality of support members arranged by applying the method of this section are shifted by the same amount in the same direction, the relative positions of the plurality of substrate support surfaces are Since it does not change, an appropriate substrate support apparatus can be obtained.
(3) The arrangement display surface and the support plane are orthogonal to each other, and the half mirror is inclined at an angle of 45 degrees with respect to both the arrangement display surface and the support plane. Substrate support device assembly method.
In this case, when the half mirror is viewed from a direction inclined by 45 degrees with respect to the half mirror, one of the first and second optical paths passes through the supported point in a direction perpendicular to the arrangement display surface. . The coincidence between the supported point and the center of the substrate support surface can be determined in a state where the periphery of the supported point on the arrangement display surface and the substrate support surface of the support member are viewed from a direction perpendicular to them. Even if the direction in which one of the first and second optical paths passes through the supported point is inclined at a small angle from the normal direction of the arrangement display surface, there is almost no difference from the case where it is not inclined (when the inclination angle is 15 degrees or less). Is considered to be included in the method of this section (preferably 8 degrees or less), but if the tilt angle increases, the supported point becomes invisible behind the tall electronic circuit components. Or deformation of the substrate support surface of the support member when viewed from an inclined direction increases, and accordingly, it is difficult to accurately determine the coincidence between the supported point and the substrate support surface. . According to the method of this section, the difficulty can be favorably avoided.
(4) The component arrangement display body and the support base are arranged in a state where the arrangement display surface and the support plane extend in parallel with each other and face each other, and an angle of 45 degrees with the arrangement display surface and the support plane. The half mirror is disposed in an inclined posture that forms the following, and the support member is fixed to the support base in a state where the one of the two optical paths passes through the supported point in a direction perpendicular to the arrangement display surface ( A method for assembling a substrate support apparatus according to item 1).
This term can be considered as a special case where the angle formed by the arrangement display surface and the support plane is zero.
(5) One of the light reflected from the supported point of the component arrangement display body and the light reflected from the substrate support surface of the support member on the support plane is transmitted through a half mirror, and the other is The support member is reflected by a half mirror and reaches the common optical path portion, and the image of the supported point recognized at the recognition point on the common optical path portion matches the image of the substrate support surface. The substrate support apparatus assembling method according to any one of items (1) to (4), wherein the substrate is fixed to the support base.
Each light of the first optical path and the second optical path including the common optical path in the assembling method described in the item (1) enters the half mirror from the supported point and the substrate support surface, and is emitted from the half mirror by reflection and transmission. A mode described in this section is a mode in which the light has a common light path portion after emission. The support member is placed and fixed at a position where the image of the substrate support surface at the tip of the support member and the image of the supported point are seen to overlap each other at the recognition point on the common optical path portion. It can arrange | position correctly at an appropriate support member arrangement | positioning point (The center point of the part where the support member should be arrange | positioned of the support member support surface of a support stand).
The image that can be seen through the half mirror and the image that appears on the half mirror have a wide area, and there are an infinite number of points where they overlap each other, but the half mirror is placed on a narrowly divided bisection plane. In such a case, all of these points are suitable for fixing the support member. However, when the half mirror is arranged on a broadly divided bisection plane, the direction of the line of sight is fixed in a certain direction, and the image of the supported point and the image of the substrate supporting surface only overlap. This is a point suitable for the arrangement and fixing of the support member. In other words, when viewed in a direction parallel to each other from a plurality of recognition points, a plurality of positions where the supported point and the substrate support surface just overlap are suitable positions for fixing and fixing the support member.
Recognition at the recognition point may be performed by a human eye or by a recognition device such as an imaging device. In addition, “the state in which the image of the supported point and the image of the substrate support surface match” means that the two are concentrically overlapped and recognized as well as being recognized separately but at the same position. This includes a state in which this can be recognized. When recognition is performed by the human eye, it is often convenient that both images can be viewed at the same time because it is determined by the human brain whether the positions of the images match. . But not essential. For example, if the relative position of both images can be indirectly recognized by the relative position with the shape representing the center of the field of view or the outer edge of the field of view, such as a crosshair or circle, the images of both are recognized at different times. There is no problem. When it is performed by a recognition device, it is often desirable that both images are recognized at different times in terms of image processing. But not essential. An example of this is when a person sees the image recognized by the recognition device displayed on the display device and judges the coincidence.
In addition, since the supported point itself does not have an area and is not visible, strictly speaking, it should be referred to as “an image of a certain area centered on the supported point” instead of “an image of the supported point”. For simplicity of explanation, the expression “image of supported point” is used.
(6) A projector that projects linear light along the common optical path is disposed on the common optical path, and the linear light projected from the projector passes through the half mirror and displays the component arrangement display. Incident on one of the supported point of the body and the substrate support surface on the support plane and reflected by the half mirror to support the substrate on the component placement display body and the substrate on the support plane The substrate support apparatus assembling method according to any one of (1) to (4), wherein the support member is fixed to the support base in a state of being incident on the other side of the surface.
Each light of the first optical path and the second optical path including the common optical path portion in the assembling method described in the item (1) is reflected by the half mirror, or is transmitted through the half mirror and enters the supported point and the substrate support surface. The mode described in this section is a mode in which the light is directed and has a common optical path portion before entering the half mirror. When linear light is projected onto the common optical path by the projector, the light is divided into two parts by reflection and transmission by the half mirror, and is incident on the corresponding supported point and the substrate support surface, The support member placement point is indicated by light. Therefore, if the support member is fixed to the support base in a state where linear light is incident on the center of the substrate support surface at the tip, the support member is accurately positioned at the support member arrangement point corresponding to the supported point. Can be arranged.
In addition, it is desirable that the projection direction of the linear light of the projector is constant, but when the half mirror is arranged on a narrowly divided bisection plane, the projector projects light in an arbitrary direction. It can be. For example, the position of the projector may be constant, and the projection direction may be arbitrarily changed.
(11) A device that supports the assembly work of a substrate support device in which a support member is arranged and fixed on a support base, and the substrate support surface at the tip of the support member supports one of the supported surfaces of the printed circuit board. And
Half mirror,
Including the half mirror, a component arrangement display body that represents the arrangement of at least electronic circuit components on the supported surface of the printed circuit board, and a holding device that holds the support base.
The arrangement display surface of the component arrangement display body and the support plane, which is a plane on which the substrate support surface of the support member is positioned if the support member is arranged and fixed on the support base, are not less than 180 degrees from each other. A half mirror located between the arrangement display surface and the support plane, and a first optical path which is an optical path of light passing through one point on the half mirror and the half mirror on the half mirror One of two optical paths that form a common optical path portion that is a portion that extends in parallel with each other and overlaps with each other is a second optical path that is an optical path of light reflected at one point. When passing through a supported point, which is the center of the portion to be supported by the support member, the relative position where the center of the substrate support surface of the support member is located on the other of the two optical paths, Her Mirror, the substrate supporting device assembly support device is to hold the support table the component arrangement display body and.
(12) In the holding device, the half mirror, the component arrangement display body, and the support base are configured such that the arrangement display surface and the support plane intersect each other, and an angle formed by the arrangement display surface and the support plane is 2 The substrate support device assembly support device according to (11), wherein the half mirror is held in a state of being equally divided and including a plane including an intersection line between the arrangement display surface and the support plane or a plane parallel to the plane.
The explanation given in relation to the item (2) also applies to this item.
(13) The holding device includes the half mirror, the component arrangement display body, and the support base, wherein the arrangement display surface and the support plane are orthogonal to each other, and the half mirror includes the arrangement display surface and the support plane. The substrate support apparatus assembly support apparatus according to item (12), which is held in an inclined state at an angle of 45 degrees with respect to both.
The explanation given in relation to the item (3) also applies to this item.
(14) The holding device includes the half mirror, the component arrangement display body, and the support base, the arrangement display surface and the support plane extending in parallel with each other and facing each other, and the half mirror displaying the arrangement thereof. In the item (11), the inclined posture forms an angle of 45 degrees with the surface and the support plane, and the one of the two optical paths passes through the supported point in a direction perpendicular to the arrangement display surface. The board | substrate support apparatus assembly assistance apparatus of description.
(15) The substrate support apparatus assembly support apparatus according to any one of (11) to (14), including a projector provided in the common optical path section and projecting linear light parallel to the common optical path section.
According to the support device described in this section, the assembly method described in section (6) can be implemented.
The holding device may hold the component arrangement display body and the support base in a relative positional relationship in which the periphery of the supported point (arrangement display surface) and the substrate support surface (support plane) intersect each other, and are parallel to each other. May be held in a relative positional relationship facing each other. In the former case, for example, the holding device holds the component arrangement display body and the support base in a relative positional relationship in which the periphery of the supported point and the substrate support surface are orthogonal to each other. In the latter case, a light guide device is provided in the same manner as the support device described in (24), and after a part of the light projected by the projector is transmitted through the half mirror and another part is reflected, At least one of the transmitted light and the reflected light is guided by the light guide device so as to be incident on at least one of the periphery of the supported point and the substrate support surface.
In the substrate support device assembly support device of this section, it is not indispensable that the half mirror is arranged on a narrowly divided bisection plane.
(16) Item (15) includes at least one of a projector moving device that moves the projector in a direction that intersects the common optical path section, and a direction changing device that changes a projection direction of the linear light of the projector. The board | substrate support apparatus assembly assistance apparatus of description.
The projector projects linear light, but is moved by the projector moving device so that the light is incident on a plurality of locations on the component display surface of the component arrangement display body (supported surface of the printed circuit board), and the support member arrangement point is set. Multiple instructions can be given. Although the component arrangement display body and the support base may be moved by the moving device, it is simpler to move the projector, for example, a smaller space is required for the movement. The projector moving device may be a device that manually moves the projector, or a device that moves the projector by a power driving device according to the operation of the operating device by an operator. In any case, it is desirable to provide a guide device that guides the movement of the projector while maintaining the projector in a predetermined posture.
Even if the direction changing device is provided, light can be incident on a plurality of locations on the placement display surface (supported surface of the printed circuit board) of the component placement display body, and a plurality of support member placement points can be indicated. However, in this case, it is necessary that the half mirror is arranged in a narrowly divided bisection plane between the arrangement display surface and the support plane.
(17) The substrate support apparatus assembly support apparatus according to (15) or (16), wherein the projector includes a laser pointer that projects a laser beam as the linear light.
According to the laser pointer, it is easy to obtain linear light.
(18) A recognition direction limiting device that limits a direction in which the image of the supported point and the image of the substrate support surface of the support member that supports the supported point to a certain direction can be recognized. 14. The substrate support apparatus assembly support device according to any one of items 14).
If the recognition direction limiting device is provided, the recognition direction is limited to a certain direction, so that it is not indispensable that the half mirror is arranged on a narrowly divided bisection plane. Alternatively, the first and second optical paths can be limited to those parallel to the normal of the arrangement display surface of the component arrangement display body, and the periphery of the supported point and the substrate support surface are supported while viewed from the direction perpendicular to them. The members can be arranged and fixed, and the coincidence determination between the supported point and the substrate support surface can be performed easily and accurately.
(19) The substrate support device assembly support device according to (18), wherein the recognition direction limiting device includes a cutoff filter that transmits light incident from a specific direction but blocks light incident from another direction.
According to the cutoff filter, the image of the supported point and the substrate support surface can be recognized only in a certain recognition direction. When viewing an object through a relatively small through-hole formed in a flat plate, only a part of the object can be seen and the other part cannot be seen, but a similar phenomenon. Will occur. Moreover, in the cutoff filter, if the eye position is moved in a direction parallel to the plane of the cutoff filter, a phenomenon that is equivalent to the movement of the through hole with the movement occurs. Possible areas can be moved across the supported surface. Even if the cutoff filter is large, the arrangement display surface of the component arrangement display body is only partially recognized, and it is not necessary to move the cutoff filter to move the recognizable area. Therefore, if a blocking filter is used, a simple substrate support device assembly support device can be obtained.
(20) A cutoff filter that holds the cutoff filter in a posture in which light reflected from the supported point in a direction normal to the arrangement display surface of the component arrangement display body is incident on the cutoff filter from the certain direction. The substrate support device assembly support device according to item (19), including a holding device.
In the substrate support device assembly support device according to this aspect, the light reflected from the substrate support surface of the support member arranged at the support member arrangement point in the direction of the normal to the substrate support surface is also from the certain direction. The light enters the cutoff filter.
The cutoff filter holding device may hold the cutoff filter together with the component arrangement display body, the support base, and the half mirror, or may be a holding device dedicated to the cutoff filter. In the former case, the holding device that holds the component arrangement display body, the support base, and the half mirror also serves as the cutoff filter holding device.
(21) The recognition direction limiting device is
An incident light limiting cylinder that limits light incident on the recognition point to light within a set angle;
The substrate support device assembly support device according to item (18), including: a limiting cylinder moving device that moves the incident light limiting cylinder in a direction intersecting the axis of the incident light limiting cylinder.
The cross-sectional area of the incident light limiting cylinder is smaller than the arrangement display surface of the component arrangement display body, and the light incident on the recognition point is in a certain direction with respect to the arrangement display surface from a small area including the supported point of the arrangement display surface. By recognizing the image of the light that is limited to the reflected light and incident on the incident light restricting cylinder, the image of the supported point and the image of the substrate support surface are recognized in the same recognition direction, and the half mirror is narrowly defined. Even if it is not provided on the bisection plane, the coincidence between the supported point and the substrate support surface can be determined without error. Alternatively, the first and second optical paths can be limited to those parallel to the normal line of the arrangement display surface of the component arrangement display body.
By moving the incident light restricting cylinder, the light incident on the incident light restricting cylinder changes, and the arrangement display surfaces of the component arrangement display bodies can be sequentially recognized one by one.
(22) The substrate according to item (21), wherein a lens system including one or more lenses for condensing the light incident in the incident light limiting cylinder on the recognition point is provided in the incident light limiting cylinder. Support device assembly support device.
The incident light limiting cylinder functions as a lens barrel. For example, the lens system enlarges the area around the supported point on the arrangement display surface of the component arrangement display body and the image of the board support surface, and even when the area that can be supported by the support member of the printed circuit board is very small, It becomes easy to arrange in a proper position.
(23) A device that supports the assembly work of a substrate support device in which a support member is arranged and fixed on a support base, and the substrate support surface at the tip of the support member supports one of the supported surfaces of the printed circuit board. And
The component arrangement display body representing the arrangement of at least the electronic circuit components on the supported surface of the printed circuit board and the support base are arranged, and the support member is arranged and fixed to the arrangement display surface of the component arrangement display body and the support base. For example, a holding device that holds the substrate support surface of the support member in a relative positional relationship orthogonal to a support plane that is a plane positioned thereon,
A half mirror inclined at 45 degrees with respect to both the arrangement display surface and the support plane;
A recognition direction limiting device that limits a direction in which light passing through the half mirror can be recognized to a direction parallel to one of the arrangement display surface and the support plane and perpendicular to the other;
The recognition direction limiting device and the moving device that moves the half mirror to an arbitrary position in a plane parallel to the half mirror, and the holding device includes the component arrangement display body and the support base. The light reflected from the supported point in the direction of the normal to the arrangement display surface and the light reflected from the substrate support surface of the support member that should support the supported point in the direction of the normal to the support plane And a substrate support device assembly support device which holds the half mirror at a relative position where it is incident on the same point.
The half mirror is inclined at 45 degrees with respect to both the arrangement display surface and the support plane of the component arrangement display body, so that the image around the supported point and the image of the substrate support surface are formed without being reduced, Due to the limitation of the recognition direction by the recognition direction limiting device, the periphery of the supported point and the substrate support surface are recognized in a state viewed from a direction perpendicular to them. Therefore, the support member can be accurately arranged at the support member arrangement point corresponding to the supported point by arranging the support member at a position where the image of the substrate support surface just overlaps the image of the supported point. Then, the half mirror is moved by the moving device, so that the arrangement display surface (supported surface) is sequentially recognized one by one, and eventually, the place where the arrangement display surface (supported surface) needs to be supported by the support member is detected. Support members can be arranged at support member arrangement points corresponding to all of them.
(24) A device that supports the assembly work of a substrate support device in which a support member is arranged and fixed on a support base, and the substrate support surface at the tip of the support member supports one of the supported surfaces of the printed circuit board. And
The component arrangement display body representing the arrangement of at least the electronic circuit components on the supported surface of the printed circuit board and the support base are arranged, and the support member is arranged and fixed to the arrangement display surface of the component arrangement display body and the support base. For example, a holding device that holds the substrate support surface of the support member in a relative positional relationship in which the support plane is a plane on which the substrate support surface is opposed in parallel with each other;
A half mirror inclined at 45 degrees with respect to both the arrangement display surface and the support plane;
Light reflected from the supported point in the direction of the normal to the arrangement display surface, and light reflected from the substrate support surface of the support member that should support the supported point in the direction of the normal to the support plane A light guide device that guides the same to the same point of the half mirror;
Recognizable light out of the light from the half mirror is reflected in the normal direction from the supported point to the arrangement display surface and from the substrate support surface in the normal direction to the support plane. A recognizable light limiting device that limits the light to
A substrate support device assembly support device, comprising: a recognizable light limiting device; and a moving device that moves the half mirror to an arbitrary position in a plane parallel to the arrangement display surface.
The arrangement display surface and the support plane are opposed to each other in a parallel posture, but the arrangement angle of the half mirror is 45 degrees, and the arrangement display surface and the support plane are provided by providing the light guide device and the recognizable light limiting device. And the substrate support surface of the support member that should support the supported point are recognized without misalignment, and the support member is positioned at an appropriate position on the support base. Can be arranged accurately. Then, by moving the recognizable light limiting device by the moving device, each part of the arrangement display surface is sequentially recognized, and eventually the whole can be recognized, and all supported points that need to be supported by the support member are detected. Support members can be arranged at corresponding positions.
In the substrate support device assembly support device of the above (23), even if the recognition direction limiting device is replaced with a projector that is provided in the common optical path portion and projects linear light parallel to the common optical path portion, Further, in the substrate support apparatus assembly support apparatus according to the item (24), the effect of the present invention can be obtained even if the recognizable light limiting apparatus is replaced with a projector.

以下、請求可能発明のいくつかの実施例を、図を参照しつつ詳しく説明する。なお、請求可能発明は、下記実施例の他、上記〔発明の態様〕の項に記載された態様を始めとして、当業者の知識に基づいて種々の変更を施した態様で実施することができる。   Several embodiments of the claimable invention will now be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

図1に、請求可能発明の一実施例としての基板支持装置組立支援装置(以後、支援装置と略称する)8が図示されている。この支援装置8により組立が支援される基板支持装置10は、図2に示すように、支持台12と、支持台12の支持部材支持面(以下、支持面と略称する)14上に立設され、固定された支持部材としてのバックアップピン16とを含む。本支持台12は、支持面14の大きさを複数種類、例えば、3種類に変更可能なものとされ、図1に示すように、支持台12を構成するために3枚の支持台形成板18,20,22が用意されている。支持台形成板18には、支持台12を支援装置8に位置決めするための被位置決め部たる位置決め穴24が一対、支持台形成板18の長手方向に距離を隔てて設けられるとともに、支持台形成板18の幅方向において位置決め穴24が設けられた部分とは反対側の部分に突部26が設けられている。また、支持台形成板20には、幅方向の一方の側に、突部26と嵌め合わされる凹部28が設けられ、他方の側に別の突部30が設けられ、支持台形成板22には、突部30と嵌め合わされる凹部32が設けられている。これら支持台形成板18,20,22は互いに嵌め合わされた状態では、長手方向および幅方向に離間不能とされ、各々の表面である支持面形成面34,36,38が一平面状の支持面14を構成する。突部26,30および凹部28,32が係合部ないし位置合わせ部を構成している。また、支持台形成板18,20,22はいずれも、少なくとも、支持面形成面34,36,38が鋼等、強磁性材料製とされており、強磁性材料製の支持面14が得られる。   FIG. 1 shows a substrate support device assembly support device (hereinafter abbreviated as a support device) 8 as an embodiment of the claimable invention. As shown in FIG. 2, the substrate support device 10 whose assembly is supported by the support device 8 is erected on a support base 12 and a support member support surface (hereinafter abbreviated as a support surface) 14 of the support base 12. And a backup pin 16 as a fixed support member. The support table 12 can change the size of the support surface 14 into a plurality of types, for example, three types. As shown in FIG. 18, 20, and 22 are prepared. The support base forming plate 18 is provided with a pair of positioning holes 24 as positioning portions for positioning the support base 12 on the support device 8 at a distance in the longitudinal direction of the support base forming plate 18. A protrusion 26 is provided at a portion on the opposite side to the portion where the positioning hole 24 is provided in the width direction of the plate 18. Further, the support base forming plate 20 is provided with a concave portion 28 fitted to the protrusion 26 on one side in the width direction, and another protrusion 30 is provided on the other side. Is provided with a recess 32 to be fitted with the protrusion 30. When these support base forming plates 18, 20, and 22 are fitted to each other, they cannot be separated in the longitudinal direction and the width direction, and the support surface forming surfaces 34, 36, and 38, which are the respective surfaces, are one-plane support surfaces. 14 is configured. The protrusions 26 and 30 and the recesses 28 and 32 constitute an engaging portion or an alignment portion. In addition, in each of the support base forming plates 18, 20, and 22, at least the support surface forming surfaces 34, 36, and 38 are made of a ferromagnetic material such as steel, and the support surface 14 made of a ferromagnetic material is obtained. .

バックアップピン16は、図1に示すように、横断面形状が円形を成し、ストレートな円柱状の取付部40と、取付部40の軸方向の一端部に設けられ、先端ほど直径が直線的に減少するテーパ状の支持部42とを備え、支持部42の先端が円形の基板支持面44を構成している。取付部40の支持部42とは反対側の端部にはマグネット46が埋設されており、バックアップピン16は支持台12に磁力によって着脱可能に固定される。   As shown in FIG. 1, the backup pin 16 has a circular cross-sectional shape, and is provided at a straight columnar mounting portion 40 and one end portion in the axial direction of the mounting portion 40, and the diameter is linear toward the tip. And a tapered support portion 42 that decreases in number, and the tip of the support portion 42 forms a circular substrate support surface 44. A magnet 46 is embedded in the end of the mounting portion 40 opposite to the support portion 42, and the backup pin 16 is detachably fixed to the support base 12 by a magnetic force.

支援装置8は、図1に示すように、ハーフミラー60と、保持装置62と、遮断フィルタ64とを含む。保持装置62は、第1保持部材66と第2保持部材68とを含む。第1保持部材66は、板状を成し、支持台12を保持する支持台保持部70と、板状を成し、支持台保持部70に対して直角に設けられ、ハーフミラー60を保持するミラー保持部72とを含む。支持台保持部70は、支持台形成板18,20,22の全部により構成され、大きさが最大の状態における支持台12より大きく、そのミラー保持部72側の部分には、一対の位置決めピン74が、支持台保持部70とミラー保持部72との交線に平行な方向に距離を隔てて立設され、支持台12を位置決めする支持台位置決め部を構成している。   As illustrated in FIG. 1, the support device 8 includes a half mirror 60, a holding device 62, and a cutoff filter 64. The holding device 62 includes a first holding member 66 and a second holding member 68. The first holding member 66 has a plate shape and a support base holding portion 70 that holds the support base 12. The first holding member 66 has a plate shape and is provided at a right angle to the support base holding portion 70 to hold the half mirror 60. And a mirror holding part 72. The support base holding part 70 is composed of all of the support base forming plates 18, 20, 22, and is larger than the support base 12 in the maximum size state, and a pair of positioning pins is provided on the mirror holding part 72 side. 74, stands up at a distance in a direction parallel to the line of intersection of the support holder 70 and the mirror holder 72, and constitutes a support holder positioning part that positions the support 12.

ミラー保持部72は板状を成し、支持台保持部70からの延び出し端部に少なくとも1つ、例えば、2個のミラー取付部76が設けられている。これらミラー取付部76はミラー支持部でもあり、それぞれブロック状を成し、支持台保持部70とミラー保持部72との交線に平行な方向に距離を隔てた2個所に設けられ、それぞれ溝78が、ミラー取付部76を、上記交線に平行な方向に貫通し、ミラー取付部76のミラー保持部72からの突出端に開口させられるとともに、深さ方向が支持台保持部70に対して45度傾斜して形成されている。   The mirror holding portion 72 has a plate shape, and at least one, for example, two mirror mounting portions 76 are provided at the end extending from the support base holding portion 70. These mirror mounting portions 76 are also mirror support portions, each having a block shape, provided at two positions spaced apart in a direction parallel to the line of intersection of the support base holding portion 70 and the mirror holding portion 72, respectively. 78 passes through the mirror mounting portion 76 in a direction parallel to the intersecting line and is opened at the protruding end of the mirror mounting portion 76 from the mirror holding portion 72, and the depth direction is relative to the support base holding portion 70. And inclined by 45 degrees.

第2保持部材68は、図1に示すように、板状を成し、ミラー保持部72の支持台保持部70からの突出端部に軸84により、支持台保持部70とミラー保持部72との交線に平行な軸線まわりに回動可能に取り付けられている。第2保持部材68には、プリント基板86を載置する基板載置面88と、プリント基板86を取り付ける基板取付面90とが互いに直角に設けられている。基板載置面88は、第2保持部材68の回動軸線に近い側の部分である基端部側に、第2保持部材68の厚さ方向および回動軸線に平行に設けられ、基板取付面90は基板載置面88に対して直角に設けられ、基板載置面88から回動軸線から離れる方向へ延び出させられている。   As shown in FIG. 1, the second holding member 68 has a plate shape, and the support holding unit 70 and the mirror holding unit 72 are connected to the projecting end portion of the mirror holding unit 72 from the support holding unit 70 by a shaft 84. It is attached so as to be rotatable around an axis parallel to the line of intersection. The second holding member 68 is provided with a substrate mounting surface 88 for mounting the printed circuit board 86 and a substrate mounting surface 90 for mounting the printed circuit board 86 at right angles to each other. The substrate mounting surface 88 is provided on the base end side, which is a portion of the second holding member 68 close to the rotation axis, in parallel with the thickness direction of the second holding member 68 and the rotation axis. The surface 90 is provided at a right angle to the substrate placement surface 88 and extends from the substrate placement surface 88 in a direction away from the rotation axis.

第2保持部材68の基端部にはまた、基板載置面88に開口し、回動軸線に平行に延びる溝94が形成されるとともに、1対の位置決め部材96がそれぞれ、溝94の長手方向に移動可能に嵌合されている。溝94は、横断面形状が逆T字形を成し、1対の位置決め部材96はそれぞれ、逆T字形を成し、溝94に摺動可能に嵌合される脚部98と、脚部98から基板取付面90側へ延び出させられた位置決め部100とを備え、作業者により手動で移動させられ、前記1対の位置決めピン74の中間点に対して対称に接近,離間させられ、作業者により力が加えられない状態では、移動させられた位置において停止した状態を保つように構成されている。   A groove 94 that opens to the substrate mounting surface 88 and extends parallel to the rotation axis is formed at the base end portion of the second holding member 68, and a pair of positioning members 96 are respectively formed in the longitudinal direction of the groove 94. It is fitted so that it can move in the direction. The groove 94 has an inverted T-shaped cross section, and each of the pair of positioning members 96 has an inverted T-shape, and a leg 98 slidably fitted in the groove 94 and a leg 98. Positioning part 100 extended from the base plate mounting surface 90 side to the board mounting surface 90 side, moved manually by an operator, and symmetrically approached and separated from the midpoint of the pair of positioning pins 74, In a state in which no force is applied by the person, it is configured to maintain a stopped state at the moved position.

基板取付面90は、寸法が最大のプリント基板より大きく、第2保持部材68は、少なくとも基板取付面90が強磁性材料製とされ、図1に示すように、基板押さえ部材110が磁力によって着脱可能に固定されるようにされている。基板押さえ部材110は、柱状の取付部112と、取付部112の軸方向の一端部から直角に延び出させられた板状の押さえ部114とを備え、取付部112にマグネット116(図3参照)が埋設されている。基板取付面90にはまた、その第2保持部材68の回動軸線からの延び出し端部に、少なくとも1つ、例えば、2個のフィルタ取付部120が設けられている。これらフィルタ取付部120はフィルタ保持部ないしフィルタ支持部でもあり、ブロック状を成し、それぞれ溝122が、フィルタ取付部120を、第2保持部材68の回動軸線に平行な方向に貫通し、第2保持部材68からの突出端に開口させられるとともに、深さ方向が基板取付面90に直角に形成されている。   The board mounting surface 90 is larger than the largest printed circuit board, and at least the board mounting surface 90 of the second holding member 68 is made of a ferromagnetic material. As shown in FIG. It is supposed to be fixed as possible. The board pressing member 110 includes a columnar mounting portion 112 and a plate-shaped pressing portion 114 extending perpendicularly from one axial end portion of the mounting portion 112, and a magnet 116 (see FIG. 3). ) Is buried. The substrate mounting surface 90 is also provided with at least one, for example, two filter mounting portions 120 at an end portion extending from the rotation axis of the second holding member 68. These filter attachment parts 120 are also filter holding parts or filter support parts, and form a block shape. Each groove 122 penetrates the filter attachment part 120 in a direction parallel to the rotation axis of the second holding member 68, An opening is made at the projecting end from the second holding member 68, and the depth direction is formed at right angles to the substrate mounting surface 90.

第2保持部材68は、その回動軸線まわりの回動により、図1に示すように、基板取付面90が第1保持部材66の支持台保持部70に対して直角となる使用位置と、図3に二点鎖線で示すように、支持台保持部70側へたたまれる非使用位置とに移動させられる。図示は省略するが、位置保持機構ないし姿勢保持機構が設けられ、第2保持部材68が使用位置に位置し、基板取付面90が支持台保持部70に対して直角な姿勢に保たれるようにされている。位置保持機構は、例えば、軸84内に設けられたボールプランジャと、第2保持部材68の軸84に回動可能に嵌合された部分に設けられたノッチとを含んで構成される。   As shown in FIG. 1, the second holding member 68 is rotated about its rotation axis, and as shown in FIG. 1, the substrate mounting surface 90 is at a right angle with respect to the support holder 70 of the first holding member 66, As shown by a two-dot chain line in FIG. 3, it is moved to a non-use position where it is folded to the support base holding part 70 side. Although illustration is omitted, a position holding mechanism or posture holding mechanism is provided so that the second holding member 68 is located at the use position, and the substrate mounting surface 90 is held in a posture perpendicular to the support base holding portion 70. Has been. The position holding mechanism includes, for example, a ball plunger provided in the shaft 84 and a notch provided in a portion rotatably fitted to the shaft 84 of the second holding member 68.

前記ハーフミラー60と遮断フィルタ64とは、図1に示すように、軸128によって互いに回動可能に連結されており、図3に二点鎖線で示すように、たたんで合わせることができる。ハーフミラー60は、表裏どちらの面からの入射光についても、その一部を反射し、残りの透過を許容するミラーであり、透過率および反射率が種々に異なる複数種類のものがある。本実施例では、ハーフミラー60は、透過率が30%、反射率が70%のものとされている。   As shown in FIG. 1, the half mirror 60 and the blocking filter 64 are pivotally connected to each other by a shaft 128, and can be folded together as shown by a two-dot chain line in FIG. The half mirror 60 is a mirror that reflects a part of the incident light from both the front and back surfaces and allows the remaining light to be transmitted, and there are a plurality of types having different transmittance and reflectance. In the present embodiment, the half mirror 60 has a transmittance of 30% and a reflectance of 70%.

遮断フィルタ64は認識方向限定装置たる視認方向限定装置を構成し、例えば、特開2004−109615公報に記載のルーバフィルムと同様に構成され、図4に概念的に示すように、2つのルーバ層130,132を備えている。これらルーバ層130,132はそれぞれ、内部に多数の微細なルーバ134が形成されたフィルムであり、ルーバ134は互いに等間隔を隔てて平行に、かつ、フィルムの表面に対して直角に形成され、隣接するルーバの間の部分が光透過部136を構成している。2つのルーバ層130,132は、各ルーバ134が、例えば、互いに直角に交差する状態で接着され、ルーバ積層体138を構成している。そのため、ルーバ積層体138は、図5に示すように、2つのルーバ層130,132の各ルーバ134により碁盤目状に仕切られ、多数のセル状の光透過領域140が得られる。このルーバ積層体138が、例えば、保護フィルムにより保護されるとともに、枠状の保持体により保持され、あるいは無色透明な基板に貼り付けられて遮断フィルタ64が得られる。   The blocking filter 64 constitutes a visual recognition direction limiting device that is a recognition direction limiting device, and is configured, for example, in the same manner as the louver film described in JP-A-2004-109615, and has two louver layers as conceptually shown in FIG. 130 and 132 are provided. Each of these louver layers 130 and 132 is a film having a large number of fine louvers 134 formed therein, and the louvers 134 are formed in parallel at equal intervals and perpendicular to the surface of the film. A portion between adjacent louvers constitutes a light transmission portion 136. The two louver layers 130 and 132 are bonded so that the louvers 134 cross each other at a right angle, for example, and constitute a louver laminate 138. Therefore, as shown in FIG. 5, the louver laminate 138 is partitioned in a grid pattern by the louvers 134 of the two louver layers 130 and 132, and a large number of cellular light transmission regions 140 are obtained. The louver laminated body 138 is protected by, for example, a protective film, held by a frame-shaped holding body, or attached to a colorless and transparent substrate to obtain the cutoff filter 64.

遮断フィルタ64に入射する光のうち、遮断フィルタ64の光入射面に対する法線に対して傾斜した方向から入射した光はルーバ134により透過を阻止され、セル状光透過領域140を透過する光は殆ど広がらずに遮断フィルタ64の表面から射出される。遮断フィルタ64に対して法線方向に入射する光の透過は許容され、法線方向に対して傾斜した方向から入射する光は遮断されるのであり、作業者は、遮断フィルタ64のうち、視線が遮断フィルタ64と直角となり、透過光と平行となる部分についてのみ、その透過光により形成される像を見ることができる。特に、遮断フィルタ64は、各ルーバ134が直角に交差する状態で設けられた2つのルーバ層130,132を備えるため、作業者の視認範囲が遮断フィルタ64の左右方向と上下方向との両方において制限された狭い範囲となっている。   Of light incident on the blocking filter 64, light incident from a direction inclined with respect to the normal to the light incident surface of the blocking filter 64 is blocked from being transmitted by the louver 134, and light transmitted through the cellular light transmission region 140 is transmitted. It is ejected from the surface of the blocking filter 64 with little spread. Transmission of light incident in the normal direction with respect to the blocking filter 64 is allowed, and light incident from a direction inclined with respect to the normal direction is blocked. Is perpendicular to the cut-off filter 64, and an image formed by the transmitted light can be seen only in a portion parallel to the transmitted light. In particular, since the cutoff filter 64 includes two louver layers 130 and 132 provided in a state where each louver 134 intersects at a right angle, the visibility range of the operator is both in the horizontal direction and the vertical direction of the cutoff filter 64. It is a limited and narrow area.

基板支持装置10の組立を説明する。
プリント基板86は、その両面の一方であり、作業が施される面である作業面とは反対側の面をバックアップピン16の基板支持面44により支持される。バックアップピン16は、支持台12の支持面14のうち、プリント基板86の支持に適した位置に取り付けられる。例えば、プリント基板86に施される作業が電子回路部品の装着であり、その両面に電子回路部品が装着される場合、一方の面への電子回路部品の装着後、他方の面に電子回路部品が装着される際、基板支持装置10は、プリント基板86の既に電子回路部品が装着された面を被支持面として支持することとなり、バックアップピン16を支持面14の、電子回路部品との干渉を避けてプリント基板86を支持することができる位置に配置することが必要である。バックアップピン16は、被支持面の配線パターンが設けられた部分も支持するが、場合によっては、配線パターンとの干渉を避けて支持するように配置される。
The assembly of the substrate support apparatus 10 will be described.
The printed circuit board 86 is supported by the substrate support surface 44 of the backup pin 16 on one side of the printed circuit board 86, and the surface opposite to the work surface on which the work is performed. The backup pin 16 is attached to a position suitable for supporting the printed circuit board 86 on the support surface 14 of the support base 12. For example, when the work to be performed on the printed circuit board 86 is mounting of electronic circuit components, and electronic circuit components are mounted on both surfaces thereof, the electronic circuit components are mounted on the other surface after mounting the electronic circuit components on one surface. When the circuit board is mounted, the board supporting device 10 supports the surface of the printed circuit board 86 on which the electronic circuit components are already mounted as a supported surface, and the backup pin 16 interferes with the electronic circuit parts of the supporting surface 14. Therefore, it is necessary to arrange the printed circuit board 86 at a position where the printed circuit board 86 can be supported. The backup pin 16 also supports the portion of the supported surface where the wiring pattern is provided. However, in some cases, the backup pin 16 is disposed so as to avoid interference with the wiring pattern.

このバックアップピン16の配置が支援装置8により支援される。支援には、例えば、実際に電子回路部品150が装着されて製品とされるプリント基板86であり、両面のうち、先に電子回路部品150が装着される面に、電子回路部品150が装着されたプリント基板86が部品配置表示体として用いられる。そのため、図1および図2に示すように、プリント基板86,支持台12,ハーフミラー60および遮断フィルタ64が保持装置62にセットされる。保持装置62は、第2保持部材68が使用位置に位置させられ、基板取付面90が第1保持部材66の支持台保持部70に対して直角とされる。そして、支持台形成板18が支持台保持部70上に載置されるとともに、位置決め穴24が位置決めピン74に嵌合される。プリント基板86の大きさに応じて、必要であれば、支持台形成板18に支持台形成板20が嵌合され、さらに支持台形成板20に支持台形成板22が嵌合される。また、プリント基板86は、図1に示すように、第2保持部材68の基板載置面88上に、まだ電子回路部品150が装着されていない部品装着面を基板取付面90側とし、電子回路部品150が装着されている面であって、バックアップピン16により支持される被支持面152が表側となるように載せられ、配置表示面として機能するようにされ、基板取付面90に真っ直ぐに添わされるとともに、1対の位置決め部材96により両側から挟まれ、支持台12に対して位置決めされる。また、プリント基板86の縁部が基板押さえ部材110の押さえ部114により押さえられ、基板取付面90との間に挟まれて固定される。それにより、図2に示すように、プリント基板86の被支持面152と支持台12の支持面14とは互いに直角となり、被支持面152と、支持面14上に直角に立設されるバックアップピン16の基板支持面44がその上に位置する平面である支持平面154とが互いに直交する状態となる。基板載置面88および一対の位置決め部材96は基板位置決め部を構成し、前記支持台位置決め部と共に相対位置位置決め部を構成している。   The arrangement of the backup pin 16 is supported by the support device 8. For the support, for example, the printed circuit board 86 is actually a product on which the electronic circuit component 150 is actually mounted, and the electronic circuit component 150 is mounted on the surface on which the electronic circuit component 150 is first mounted. The printed circuit board 86 is used as a component arrangement display body. Therefore, as shown in FIGS. 1 and 2, the printed circuit board 86, the support base 12, the half mirror 60, and the cutoff filter 64 are set in the holding device 62. In the holding device 62, the second holding member 68 is positioned at the use position, and the board mounting surface 90 is set to be perpendicular to the support base holding portion 70 of the first holding member 66. Then, the support base forming plate 18 is placed on the support base holding part 70, and the positioning holes 24 are fitted to the positioning pins 74. Depending on the size of the printed circuit board 86, if necessary, the support base forming plate 20 is fitted to the support base forming plate 18, and the support base forming plate 22 is further fitted to the support base forming plate 20. Further, as shown in FIG. 1, the printed circuit board 86 has a component mounting surface on which the electronic circuit component 150 is not yet mounted on the substrate mounting surface 88 of the second holding member 68 as the substrate mounting surface 90 side. The surface on which the circuit component 150 is mounted, and the supported surface 152 supported by the backup pin 16 is placed on the front side so as to function as an arrangement display surface, and straight on the board mounting surface 90 In addition, it is sandwiched from both sides by a pair of positioning members 96 and positioned with respect to the support base 12. Further, the edge portion of the printed circuit board 86 is pressed by the pressing portion 114 of the substrate pressing member 110 and is sandwiched and fixed between the substrate mounting surface 90. As a result, as shown in FIG. 2, the supported surface 152 of the printed circuit board 86 and the support surface 14 of the support base 12 are perpendicular to each other, and the backup surface 152 and the backup surface erected at a right angle on the support surface 14. The support plane 154 that is the plane on which the substrate support surface 44 of the pin 16 is positioned is orthogonal to each other. The substrate mounting surface 88 and the pair of positioning members 96 constitute a substrate positioning portion, and constitute a relative position positioning portion together with the support base positioning portion.

プリント基板86のセット後、図2に示すように、ハーフミラー60の自由端部(遮断フィルタ64が取り付けられていない側の端部)が、第1保持部材66の1対のミラー取付部76の各溝78に嵌合され、遮断フィルタ64の自由端部(ハーフミラー60が連結されていない側の端部)が、第2保持部材68の1対のフィルタ取付部120の各溝122に嵌合され、ハーフミラー60および遮断フィルタ64が保持装置62により保持される。保持装置62は遮断フィルタ保持装置を兼ねている。ミラー取付部76の溝78は支持台保持部70に対して45度傾斜して設けられ、基板取付面90は支持台保持部70に対して直角であり、ハーフミラー60は、基板取付面90に取り付けられたプリント基板86の被支持面152と、支持台保持部70に保持された支持台12に取り付けられるバックアップピン16による支持平面154との間において、それら被支持面152および支持平面154に対して45度を成す角度で傾斜した状態となる。ハーフミラー60はまた、被支持面152と支持平面154とにより規定される狭義の2等分平面上に配置される。支持平面154の支持台保持部70に対して直角な方向における位置は、支持台12の厚さおよびバックアップピン16の高さによって決まるが、この支持平面154の位置およびプリント基板86被支持面152の位置に応じてミラー取付部76が設けられ、ハーフミラー60が、被支持面152と支持平面154との成す角である直角を2等分するとともに、被支持面152と支持平面154との交線を含む平面である狭義の2等分平面上に配置されるようにされる。さらに、フィルタ取付部120の溝122は基板取付面90に直角に設けられており、遮断フィルタ64はハーフミラー60に対して45度を成す角度で傾斜させられ、プリント基板86の被支持面152に直角、支持台12の支持面14に平行となり、また、ハーフミラー60に対してプリント基板86と同じ側に位置させられる。
なお、本実施例においては、フィルタ取付部120の溝122が遮断フィルタ64を水平な姿勢に維持するに十分な深さとされ、ミラー取付部76の溝78は浅くされて、ハーフミラー60の自由端を位置決めして支持する機能を果たすようにされている。しかし、溝122を浅くし、溝78を深くすることも可能である。いずれにしても、2つの溝78,122の一方が深くてハーフミラー60と遮断フィルタ64との一方を確実に保持するとともに、その一方の延出し方向を決め、他方の溝はハーフミラー60と遮断フィルタ64との他方の自由端の位置を決める機能を果たすようにすることが望ましい。溝が深い側の取付部に、ハーフミラー60または遮断フィルタ64の溝からの抜け出しを防止するセットスクリュウ等固定部材を設けることも可能である。
After the printed board 86 is set, as shown in FIG. 2, the free end of the half mirror 60 (the end on the side where the blocking filter 64 is not attached) is a pair of mirror attaching portions 76 of the first holding member 66. The free end portion (the end portion on the side where the half mirror 60 is not connected) of the cutoff filter 64 is fitted into each groove 78 of the pair of filter mounting portions 120 of the second holding member 68. The half mirror 60 and the cutoff filter 64 are held by the holding device 62. The holding device 62 also serves as a cutoff filter holding device. The groove 78 of the mirror mounting portion 76 is provided with an inclination of 45 degrees with respect to the support base holding portion 70, the substrate mounting surface 90 is perpendicular to the support base holding portion 70, and the half mirror 60 has the substrate mounting surface 90. The supported surface 152 and the support plane 154 between the supported surface 152 of the printed circuit board 86 attached to the support board 15 and the support plane 154 by the backup pin 16 attached to the support board 12 held by the support board holding unit 70. It is in a state of being inclined at an angle of 45 degrees with respect to the angle. The half mirror 60 is also disposed on a bisected plane in a narrow sense defined by the supported surface 152 and the support plane 154. The position of the support plane 154 in the direction perpendicular to the support base holding part 70 is determined by the thickness of the support base 12 and the height of the backup pin 16, and the position of the support plane 154 and the printed circuit board 86 supported surface 152. , And the half mirror 60 bisects the right angle that is the angle between the supported surface 152 and the support plane 154, and between the supported surface 152 and the support plane 154. It is arranged on a bisected plane in a narrow sense, which is a plane including intersecting lines. Further, the groove 122 of the filter mounting portion 120 is provided at a right angle to the substrate mounting surface 90, and the cutoff filter 64 is inclined at an angle of 45 degrees with respect to the half mirror 60, and the supported surface 152 of the printed circuit board 86. Is perpendicular to the support surface 14 of the support 12 and is positioned on the same side as the printed circuit board 86 with respect to the half mirror 60.
In this embodiment, the groove 122 of the filter mounting portion 120 is deep enough to maintain the cutoff filter 64 in a horizontal posture, and the groove 78 of the mirror mounting portion 76 is shallow, so that the half mirror 60 is free. The end is positioned and supported. However, it is possible to make the groove 122 shallower and the groove 78 deeper. In any case, one of the two grooves 78 and 122 is deep and securely holds one of the half mirror 60 and the blocking filter 64 and determines the extending direction of one of the two grooves 78 and 122. It is desirable to fulfill the function of determining the position of the other free end of the cutoff filter 64. It is also possible to provide a fixing member such as a set screw that prevents the half mirror 60 or the cutoff filter 64 from coming out of the groove at the attachment portion on the deep groove side.

さらに、本保持装置62においてプリント基板86と支持台12との相対位置が、基板支持装置10が対基板作業システムの一種である電子回路部品装着システムにおいて実際に使用される際におけるプリント基板86と基板支持装置10との相対位置に対応する相対位置に位置決めされる。前述のように、支持台12は位置決めピン74に嵌合されることにより、支持面14に平行な一平面内において1対の位置決めピン74の並び方向およびその並び方向と直角な方向に位置決めされ、プリント基板86は基板載置面88に載置されるとともに、1対の位置決め部材96によって挟まれることにより、被支持面152に平行な一平面内において基板載置面88に直角な方向および1対の位置決め部材96の移動方向に位置決めされる。基板載置面88は、基板位置決め部材の基板位置決め面でもある。このように本実施例においては、支持台12は位置決め穴24を位置決め基準として位置決めされ、プリント基板86は基板載置面88に載置される被載置面および位置決め部材96により挟まれる側面を位置決め基準として位置決めされるが、これら位置決め基準は、電子回路部品装着システムにおいて基板支持装置10およびプリント基板86を位置決めするための位置決め基準である。電子回路部品装着システムにおいて基板支持装置10およびプリント基板86はそれぞれ、位置決め装置により、基板搬送装置による搬送方向と、部品装着面および被支持面に平行な一平面内において搬送方向と直交する方向とに位置決めされ、被支持面152と支持面14とが互いに平行に延び、かつ対向するとともに、被支持点(被支持面152のバックアップピン16により支持されるべき箇所の中心点)と、その被支持点を支持するバックアップピン16の基板支持面44とが互いに対向させられる。そのため、支援装置8の保持装置62において1対の位置決めピン74,基板載置面88および1対の位置決め部材96は、支持台12とプリント基板86とを、電子回路部品装着システムにおける位置決めと同様に、被支持点と、被支持点を支持するバックアップピン16の基板支持面44の中心点とが対応する状態、すなわち被支持点を通る光と、バックアップピン16がピン配置点(支持面14のバックアップピン16が配置されるべき部分の中心点)に配置された状態において、そのバックアップピン16の基板支持面44の中心を通る光とがハーフミラー60の同一点に入射し、前者の光であってハーフミラー60により反射される反射光の光路と、後者の光であってハーフミラー60を透過した透過光の光路とが互いに平行に延びかつ互いに重なり合って共通光路部を形成し、同一の認識点に到達する相対位置関係に位置決めするように設けられる。   Further, the relative position between the printed circuit board 86 and the support base 12 in the holding device 62 is such that the printed circuit board 86 is actually used in an electronic circuit component mounting system in which the substrate support apparatus 10 is a kind of a substrate work system. It is positioned at a relative position corresponding to the relative position with respect to the substrate support apparatus 10. As described above, the support 12 is positioned in the direction in which the pair of positioning pins 74 are aligned and in a direction perpendicular to the alignment direction in one plane parallel to the support surface 14 by being fitted to the positioning pins 74. The printed circuit board 86 is placed on the board placement surface 88 and sandwiched between the pair of positioning members 96, so that a direction perpendicular to the board placement surface 88 in a plane parallel to the supported surface 152 is obtained. The pair of positioning members 96 are positioned in the moving direction. The substrate placement surface 88 is also a substrate positioning surface of the substrate positioning member. As described above, in the present embodiment, the support base 12 is positioned with the positioning hole 24 as a positioning reference, and the printed circuit board 86 has a mounting surface mounted on the substrate mounting surface 88 and a side surface sandwiched between the positioning members 96. Although these are positioned as positioning references, these positioning references are positioning references for positioning the substrate support device 10 and the printed circuit board 86 in the electronic circuit component mounting system. In the electronic circuit component mounting system, the substrate support device 10 and the printed circuit board 86 are respectively positioned by the positioning device and in the transport direction by the substrate transport device and in the direction orthogonal to the transport direction in a plane parallel to the component mounting surface and the supported surface. The supported surface 152 and the support surface 14 extend in parallel with each other and face each other, and the supported point (the center point of the portion to be supported by the backup pin 16 of the supported surface 152) and the supported surface The substrate support surface 44 of the backup pin 16 that supports the support point is opposed to each other. Therefore, in the holding device 62 of the support device 8, the pair of positioning pins 74, the substrate mounting surface 88, and the pair of positioning members 96 are the same as the positioning in the electronic circuit component mounting system for the support base 12 and the printed circuit board 86. The state where the supported point corresponds to the center point of the substrate support surface 44 of the backup pin 16 that supports the supported point, that is, the light passing through the supported point, and the backup pin 16 is the pin arrangement point (support surface 14). In the state where the backup pin 16 is arranged at the center point), the light passing through the center of the substrate support surface 44 of the backup pin 16 is incident on the same point of the half mirror 60, and the former light. The optical path of the reflected light reflected by the half mirror 60 and the optical path of the transmitted light that is the latter light and transmitted through the half mirror 60 extend parallel to each other. And a common optical path portion is formed on top of each other, is provided so as to position the relative positional relationship to reach the same recognition point.

作業者は、遮断フィルタ64を覗いて基板支持面44および被支持面152の各像を見ながら、バックアップピン16を支持台12に置く。遮断フィルタ64は、支持台保持部70の自由端側に居て遮断フィルタ64を上から覗き込んでいる作業者の視認範囲を顔の上下方向および左右方向において制限するように構成されているため、図6に示すように、作業者には、遮断フィルタ64のうち、視線が遮断フィルタ64に対して直角となり、遮断フィルタ64に直角に入光する光に対して平行となる部分についてのみ、基板支持面44および被支持点の各像を見ることができ、視線が遮断フィルタ64に対して斜めになる部分は暗く、像は見えない。したがって、作業者は、被支持面152から、それに対する法線方向に反射され、ハーフミラー60により、ハーフミラー60の面に対して45度の方向に反射されて遮断フィルタ64に直角に入光させられる光による像と、基板支持面44から、それに対する法線方向に反射され、ハーフミラー60を透過して遮断フィルタ64に直角に入光する光による像とを見て、被支持点周辺および基板支持面44をそれぞれ、それらに直角な方向から見るに等しいこととなる。この視認は、被支持面152と支持平面154との交線に直角な平面に平行な方向における視認でもあり、ハーフミラー60の傾斜方向に平行で、ハーフミラー60と直交する平面内における視認でもある。また、ハーフミラー60は被支持面152および支持平面154に対してそれぞれ、45度を成す角度で傾斜させられており、作業者は被支持面152の像も、支持台12に載置されたバックアップピン16の基板支持面44の像も実寸大で見ることができる。   The operator puts the backup pin 16 on the support base 12 while looking through the blocking filter 64 and viewing the images of the substrate support surface 44 and the supported surface 152. Since the cutoff filter 64 is located on the free end side of the support base holding part 70 and is configured to limit the visible range of the operator looking into the cutoff filter 64 from above in the vertical and horizontal directions of the face. As shown in FIG. 6, the operator only needs a part of the blocking filter 64 where the line of sight is perpendicular to the blocking filter 64 and parallel to the light incident at right angles to the blocking filter 64. Each image of the substrate support surface 44 and the supported point can be seen, and the portion where the line of sight is oblique with respect to the cutoff filter 64 is dark, and the image is not visible. Therefore, the operator is reflected from the supported surface 152 in the normal direction to the supported surface 152, reflected by the half mirror 60 in the direction of 45 degrees with respect to the surface of the half mirror 60, and incident on the blocking filter 64 at a right angle. The periphery of the supported point is observed by looking at the image of the incident light and the image of the light reflected from the substrate support surface 44 in the normal direction with respect to the substrate and passing through the half mirror 60 and entering the blocking filter 64 at a right angle. And the substrate support surface 44 is equivalent to viewing from a direction perpendicular to them. This visual recognition is also visual recognition in a direction parallel to a plane perpendicular to the line of intersection of the supported surface 152 and the support plane 154, or visual recognition in a plane parallel to the inclination direction of the half mirror 60 and perpendicular to the half mirror 60. is there. In addition, the half mirror 60 is inclined at an angle of 45 degrees with respect to the supported surface 152 and the supporting plane 154, and the operator also placed the image of the supported surface 152 on the support table 12. The image of the substrate support surface 44 of the backup pin 16 can also be seen in actual size.

作業者は、被支持点と、その被支持点に対応するピン配置点に配置されたバックアップピン16の基板支持面44の中心点とをそれぞれ通り、遮断フィルタ64に直角に入光する2つの光により形成される共通光路部上の認識点において被支持面152および基板支持面44の各像を見るのであり、作業者は目を移動させて遮断フィルタ64を覗き、被支持面152の像を見て、被支持点を含む被支持可能領域を探し、あれば、支持面14の、被支持可能領域の中に基板支持面44の像が見え、被支持点の像と、基板支持面44の像とがちょうど重なり、同心的に重なって見える位置にバックアップピン16を置くことにより、バックアップピン16をピン配置点に正確に配置することができる。共通光路部を形成する2つの光の一方が被支持点を通り、他方が基板支持面44の中心を通る状態でバックアップピン16が支持台12に固定されるのである。ハーフミラー60が狭義の2等分平面上に配置されており、共通光路部を形成する2つの光のうち、ハーフミラー60により反射される光の光路が被支持面152と交差する点と、ハーフミラー60を透過する光の光路が基板支持面44と交差する点との、被支持面152と基板支持面44との交線からの距離は互いに等しく、基板支持面44の像が被支持点の像と重なって見える位置にバックアップピン16を配置すれば、基板支持面44が、上記交線からの距離が、被支持点の交線からの距離と等しい位置に位置させられ、バックアップピン16が被支持点を適切に支持する位置に配置される。支持台12に配置固定される複数のバックアップピン16のいずれについても同様であり、それらバックアップピン16は、複数の被支持点の相対位置と同じ相対位置関係を有する状態で支持面14上に配置され、プリント基板86を適切に支持する基板支持装置10が得られる。なお、遮断フィルタ64の透視窓は比較的大きい被支持可能領域をも視認可能な大きさとされるため、被支持点をできる限り透視窓の中央に位置させた状態で、その被支持点と同心的な位置にバックアップピン16を置くことが望ましい。   The operator passes through the supported point and the center point of the substrate support surface 44 of the backup pin 16 arranged at the pin arrangement point corresponding to the supported point, and enters the cutoff filter 64 at a right angle. The images of the supported surface 152 and the substrate support surface 44 are viewed at a recognition point on the common optical path formed by light, and the operator moves his eyes and looks into the blocking filter 64 to image the supported surface 152. If a supported area including a supported point is found, an image of the substrate support surface 44 can be seen in the supported area of the support surface 14, and the image of the supported point and the substrate support surface can be seen. By placing the backup pin 16 at a position where the 44 images just overlap and appear to concentrically overlap, the backup pin 16 can be accurately placed at the pin placement point. The backup pin 16 is fixed to the support base 12 with one of the two lights forming the common optical path section passing through the supported point and the other passing through the center of the substrate support surface 44. The half mirror 60 is arranged on a narrowly divided bisection plane, and the light path reflected by the half mirror 60 of the two lights forming the common optical path section intersects the supported surface 152; The distance from the intersection of the supported surface 152 and the substrate support surface 44 to the point where the optical path of the light passing through the half mirror 60 intersects the substrate support surface 44 is equal to each other, and the image of the substrate support surface 44 is supported. If the backup pin 16 is arranged at a position where the dot image appears to overlap, the substrate support surface 44 is positioned at a position where the distance from the intersection line is equal to the distance from the intersection line of the supported point. 16 is arranged at a position that appropriately supports the supported point. The same applies to any of the plurality of backup pins 16 arranged and fixed on the support base 12, and these backup pins 16 are arranged on the support surface 14 in a state having the same relative positional relationship as the relative positions of the plurality of supported points. As a result, the substrate supporting apparatus 10 that appropriately supports the printed circuit board 86 is obtained. Since the see-through window of the blocking filter 64 is sized so that a relatively large supported area can be visually recognized, it is concentric with the supported point in a state where the supported point is located in the center of the see-through window as much as possible. It is desirable to place the backup pin 16 at a proper position.

バックアップピン16は棒状を成し、基板支持面44はテーパ状の支持部42の先端面であり、基板支持面44より大径の取付部40より小さく、ハーフミラー60には基板支持面44と取付部40とが重なって映るが、取付部40は基板支持面44より下方であって、ハーフミラー60から遠いため、基板支持面44に作業者の視点が合ってクリアに見え、被支持可能領域内に位置するか否かを判断することができる。なお、基板支持面44と支持部42のテーパ面との光学的特性を互いに異ならせれば、例えば反射率を、一方を70%以上とし、他方を30%以下とするというように、互いに異ならせれば、基板支持面44の認識が一層容易になる。
また、本実施例においてハーフミラー60の入射光の反射率が70%、透過率が30%とされているが、遮断フィルタ64がハーフミラー60に対してプリント基板86側に位置するように設けられ、プリント基板86の被支持面152からの反射光がハーフミラー60により反射されて遮断フィルタ64に入射させられるため、被支持面152の像形成光量が多く、被支持面152の状態が明確に見え、被支持面152に小さい電子回路部品150が密度高く装着されている場合にも被支持可能領域が正確にわかり、バックアップピン16を電子回路部品150との干渉を生じることなく、ピン配置点に配置することができる。被支持面152には、配線パターンが設けられており、原則として配線パターンとの干渉も避けるようにバックアップピン16を配置するが、配線パターンは薄く、バックアップピン16により支持されても支障は殆どなく、必要であれば、配線パターンの部分もバックアップピン16に支持させることができる。
The backup pin 16 has a rod shape, the substrate support surface 44 is the tip surface of the tapered support portion 42, and is smaller than the mounting portion 40 having a larger diameter than the substrate support surface 44. Although the mounting portion 40 appears to overlap, the mounting portion 40 is below the substrate support surface 44 and far from the half mirror 60, so that the operator's point of view matches the substrate support surface 44 and can be supported. It can be determined whether or not it is located within the region. If the optical characteristics of the substrate support surface 44 and the tapered surface of the support portion 42 are made different from each other, for example, the reflectance can be made different from each other such that one is 70% or more and the other is 30% or less. In this case, the substrate support surface 44 can be more easily recognized.
Further, in the present embodiment, the reflectance of the incident light of the half mirror 60 is 70% and the transmittance is 30%, but the cutoff filter 64 is provided so as to be positioned on the printed circuit board 86 side with respect to the half mirror 60. Since the reflected light from the supported surface 152 of the printed circuit board 86 is reflected by the half mirror 60 and is incident on the cutoff filter 64, the amount of image formation on the supported surface 152 is large, and the state of the supported surface 152 is clear. Even when small electronic circuit components 150 are mounted on the supported surface 152 with high density, the supported region can be accurately identified, and the pin arrangement of the backup pin 16 without causing interference with the electronic circuit component 150 can be achieved. Can be placed at a point. The supported surface 152 is provided with a wiring pattern. In principle, the backup pin 16 is disposed so as to avoid interference with the wiring pattern. However, the wiring pattern is thin, and even if supported by the backup pin 16, there is almost no trouble. Instead, if necessary, the wiring pattern portion can be supported by the backup pin 16.

支援装置8は、非使用時には、図3に二点鎖線で示すように、ハーフミラー60と遮断フィルタ64とが合わされて第1保持部材66の支持台保持部70上に載せられ、第2保持部材68が回動させられ、支持台保持部70側へたたまれて自由端部が遮断フィルタ64上に載せられ、まとめられた状態で片付けられる。   When the support device 8 is not in use, as shown by a two-dot chain line in FIG. 3, the half mirror 60 and the cutoff filter 64 are combined and placed on the support holding portion 70 of the first holding member 66, so that the second holding The member 68 is rotated, folded to the support base holding part 70 side, the free end part is placed on the cutoff filter 64, and is put away in a grouped state.

図7に示す支援装置200のように、遮断フィルタ202を、プリント基板86の被支持面152からの反射光がハーフミラー204を透過して遮断フィルタ202に直角に入射し、バックアップピン16の基板支持面44からの反射光がハーフミラー204により45度の方向に反射されて遮断フィルタ202に直角に入射するように設けてもよい。支援装置200のその他の構成は、前記支援装置8と同じであり、同じ作用を成す構成要素には同一の符号を付して対応関係を示し、説明を省略する。   As in the support device 200 shown in FIG. 7, the reflected light from the supported surface 152 of the printed circuit board 86 passes through the half mirror 204 and enters the blocking filter 202 at a right angle. The reflected light from the support surface 44 may be reflected by the half mirror 204 in the direction of 45 degrees and incident on the blocking filter 202 at a right angle. The rest of the configuration of the support device 200 is the same as that of the support device 8, and the same reference numerals are given to the constituent elements that perform the same actions, and the description thereof is omitted.

遮断フィルタ202とハーフミラー204とは、軸206により回動可能に連結され、支持台保持部70には、溝208を有するフィルタ取付部210が1対(図7には1つのみ図示されている)、設けられ、遮断フィルタ202の自由端部が嵌合され、保持される。溝208は、その深さ方向が支持台保持部70に対して直角に設けられ、遮断フィルタ202は支持台保持部70に対して直角に保持され、支持台保持部70に保持された支持台12の支持面14およびバックアップピン16の基板支持面44が位置する支持平面154に対して直角となり、第2保持部材68に保持された基板86の被支持面152に対して平行となる。   The blocking filter 202 and the half mirror 204 are rotatably connected by a shaft 206, and a pair of filter mounting portions 210 each having a groove 208 are shown in the support base holding portion 70 (only one is shown in FIG. 7). The free end of the cutoff filter 202 is fitted and held. The depth of the groove 208 is provided at a right angle to the support base holding part 70, and the cutoff filter 202 is held at a right angle to the support base holding part 70, and the support base held by the support base holding part 70. The support surface 14 of 12 and the substrate support surface 44 of the backup pin 16 are perpendicular to the support plane 154 where the support surface 14 is located, and parallel to the supported surface 152 of the substrate 86 held by the second holding member 68.

本ハーフミラー204の入射光の透過率は、例えば、40%とされ、反射率は60%とされ、被支持面152の像形成光の量が多くされ、できるだけ明瞭に見えるようにされる。例えば、被支持面152に装着された電子回路部品が小さく、その像が見難いのであれば、例えば、作業者は拡大レンズ212を持って遮断フィルタ202を覗き込み、小さい電子回路部品の像を拡大して見て、被支持点を正確に探す。本実施例の支援装置200においても、前記支援装置8と同様に、作業者は遮断フィルタ202を覗き、ハーフミラー204に映った像を見つつ、支持面14の、被支持面152の被支持可能領域の像の中に基板支持面44の像が見え、被支持点の像と基板支持面44の像とが同心的に重なって見える位置にバックアップピン16を置く。   The transmittance of incident light of the half mirror 204 is, for example, 40%, the reflectance is 60%, and the amount of image forming light on the supported surface 152 is increased so that it can be seen as clearly as possible. For example, if the electronic circuit component mounted on the supported surface 152 is small and the image is difficult to see, for example, the operator looks into the blocking filter 202 with the magnifying lens 212 and displays an image of the small electronic circuit component. Zoom in and look for supported points accurately. Also in the support device 200 of the present embodiment, as in the support device 8, the operator looks through the blocking filter 202 and sees the image reflected on the half mirror 204, while supporting the supported surface 152 of the support surface 14. The backup pin 16 is placed at a position where the image of the substrate support surface 44 can be seen in the image of the possible area, and the image of the supported point and the image of the substrate support surface 44 appear concentrically.

支持台の支持面の支持部材を配置する位置を、投光器による光の投射により示すようにしてもよい。その実施例を図8および図9に基づいて説明する。
本実施例の支援装置250は、図8に概略的に示すように、ハーフミラー252と、保持装置254と、投光器としてのレーザポインタ256と、投光器移動装置としてのレーザポインタ移動装置258とを含む。保持装置254は、支持台保持部260と基板・ミラー保持部262とを備えている。これら保持部260,262は互いに直角に設けられ、支持台保持部260には支持台12を位置決めする位置決めピン264が1対設けられ、基板・ミラー保持部262には、それぞれ溝266を備えた1対のミラー取付部268が設けられるとともに、前記第2保持部68と同様に,基板載置面270,基板取付面272,溝274,1対の位置決め部材276,複数の基板押さえ部材278が設けられている。溝266は、その深さ方向が保持部260,262の各々に対して45度傾斜して設けられている。本実施例においても、保持部260,262およびミラー取付部268は、ハーフミラー252が被支持面152と支持平面154との狭義の2等分平面上に配置されるように設けられている。
You may make it show the position which arrange | positions the support member of the support surface of a support stand by the projection of the light by a projector. The embodiment will be described with reference to FIGS.
As schematically shown in FIG. 8, the support device 250 according to the present embodiment includes a half mirror 252, a holding device 254, a laser pointer 256 as a projector, and a laser pointer moving device 258 as a projector moving device. . The holding device 254 includes a support base holding unit 260 and a substrate / mirror holding unit 262. These holding portions 260 and 262 are provided at right angles to each other, a pair of positioning pins 264 for positioning the support base 12 are provided on the support stand holding portion 260, and the substrate / mirror holding portion 262 includes a groove 266. A pair of mirror mounting portions 268 are provided, and, similar to the second holding portion 68, a substrate mounting surface 270, a substrate mounting surface 272, a groove 274, a pair of positioning members 276, and a plurality of substrate pressing members 278 are provided. Is provided. The depth direction of the groove 266 is provided to be inclined by 45 degrees with respect to each of the holding portions 260 and 262. Also in the present embodiment, the holding portions 260 and 262 and the mirror mounting portion 268 are provided so that the half mirror 252 is disposed on a narrowly divided bisection plane between the supported surface 152 and the support plane 154.

レーザポインタ移動装置258は、図8に示すように、作業者が手動でレーザポインタ256を移動させ、基板・ミラー保持部262に保持されたプリント基板86の被支持面152に平行な一平面内において任意の位置へ移動させるように構成されている。そのため、支持台保持部260の基板・ミラー保持部262から離れた箇所に設けられたフレーム284に、可動部材としてのスライド286が、保持部260,262に平行な方向に移動可能に設けられるとともに、そのスライド286に1対の案内部材としてのガイドレール288が設けられ、それらガイドレール288の案内により、別の可動部材としてのスライド290が支持台保持部260に直角な方向に移動させられる。このスライド290にレーザポインタ256が基板・ミラー保持部262に直角な姿勢で搭載されており、スライド286,290の移動により、レーザポインタ256は、被支持面152に平行な平面内の任意の位置へ移動させられ、被支持面152の任意の位置に線状の光としてのレーザビームを投射する。フレーム284がスライド286の移動を案内する案内部材としても機能し、一対のガイドレール288と共に案内装置を構成し、レーザポインタ256の移動を、基板・ミラー保持部262に直角な姿勢を保ちつつ案内する。   As shown in FIG. 8, the laser pointer moving device 258 moves the laser pointer 256 manually by an operator, and is within one plane parallel to the supported surface 152 of the printed circuit board 86 held by the board / mirror holding unit 262. It is comprised so that it may move to arbitrary positions. Therefore, a slide 286 as a movable member is provided on a frame 284 provided at a position away from the substrate / mirror holding part 262 of the support base holding part 260 so as to be movable in a direction parallel to the holding parts 260 and 262. A guide rail 288 as a pair of guide members is provided on the slide 286, and the slide 290 as another movable member is moved in a direction perpendicular to the support base holding portion 260 by the guide rails 288. The laser pointer 256 is mounted on the slide 290 in a posture perpendicular to the substrate / mirror holding unit 262. By the movement of the slides 286 and 290, the laser pointer 256 is moved to an arbitrary position in a plane parallel to the supported surface 152. And a laser beam as linear light is projected onto an arbitrary position of the supported surface 152. The frame 284 also functions as a guide member for guiding the movement of the slide 286, and constitutes a guide device together with a pair of guide rails 288, and guides the movement of the laser pointer 256 while maintaining a posture perpendicular to the substrate / mirror holding portion 262. To do.

基板支持装置10の組立時には、図9に示すように、支持台12が位置決めピン264により位置決めされて支持台保持部260により保持される。また、プリント基板86が基板載置面270上に載置されるとともに、基板取付面272に添わされ、1対の位置決め部材276により挟まれて位置決めされるとともに、基板押さえ部材278により押さえられ、被支持面152が支持面14および支持平面154に対して直角に保持される。プリント基板86および支持台12は、電子回路部品装着システムにおける位置決めのための位置決め基準を利用して、前記実施例と同様に位置決めされる。さらに、ハーフミラー252がミラー取付部268の溝266に嵌合され、被支持面152と支持平面154との両方に対して45度の角度で傾斜した状態に保持される。   At the time of assembling the substrate support apparatus 10, as shown in FIG. 9, the support base 12 is positioned by the positioning pins 264 and held by the support base holding part 260. The printed circuit board 86 is placed on the board placement surface 270, is attached to the board mounting surface 272, is sandwiched and positioned by a pair of positioning members 276, and is pressed by the board pressing member 278. The supported surface 152 is held at right angles to the support surface 14 and the support plane 154. The printed circuit board 86 and the support base 12 are positioned in the same manner as in the above embodiment by using a positioning reference for positioning in the electronic circuit component mounting system. Further, the half mirror 252 is fitted in the groove 266 of the mirror mounting portion 268 and is held in an inclined state at an angle of 45 degrees with respect to both the supported surface 152 and the support plane 154.

したがって、レーザポインタ256は、ハーフミラー252に対して45度傾斜した方向からレーザビームを投射することとなり、レーザポインタ256から投射された光の一部はハーフミラー252を透過して被支持面152に直角に入射し、別の一部はハーフミラー252により反射されて支持面14に直角に入射し、支持面14に立設されたバックアップピン16の基板支持面44に直角に入射する。本実施例では、被支持面152と支持平面154とそれぞれ直角に交差し、ハーフミラーに対して45度傾斜した方向に延びる2つの光路が重なり合う共通光路部にレーザポインタ256が設けられ、その共通光路部に沿ってレーザビームを投射する。   Therefore, the laser pointer 256 projects a laser beam from a direction inclined by 45 degrees with respect to the half mirror 252, and part of the light projected from the laser pointer 256 passes through the half mirror 252 and is supported on the supported surface 152. , And another part is reflected by the half mirror 252 and enters the support surface 14 at a right angle, and enters the substrate support surface 44 of the backup pin 16 erected on the support surface 14 at a right angle. In this embodiment, a laser pointer 256 is provided in a common optical path portion where two optical paths that intersect the supported surface 152 and the support plane 154 at right angles and extend in a direction inclined by 45 degrees with respect to the half mirror are overlapped. A laser beam is projected along the optical path.

作業者はハーフミラー252を通して被支持面152を見て被支持点を探し、その被支持点と正対する位置へレーザポインタ256を移動させ、被支持面152に向かってレーザビームを投射する。この投射されたレーザビームはハーフミラー252を透過して被支持点に、被支持面152に対する法線の方向に入射する一方、ハーフミラー252により、ハーフミラー252に対して45度の方向に反射されて支持面14に法線の方向に入射し、作業者はバックアップピン16を、基板支持面44の中心にレーザビームが入射する状態で支持面14に載置すれば、被支持点に対応するピン配置点にバックアップピン16を正確に載置することができる。作業者は、バックアップピン16を支持面14上に載置するとともに、支持面14に沿って移動させ、レーザビームが基板支持面44の中心に当たる状態となった位置で止め、バックアップピン16は磁力によって支持台12に固定される。ハーフミラー252は狭義の2等分平面上に配置されており、光により指示された位置に基板支持面44が位置するようにバックアップピン16を置けば、基板支持面44が、被支持面152と支持平面154との交線からの距離が、被支持点の交線からの距離と等しい位置に位置する状態でバックアップピン16が配置されることとなる。作業者はレーザポインタ256を移動させて順次、被支持点にレーザビームを投射し、レーザビームにより指示されたピン配置点にバックアップピン16を配置する。それにより、複数のバックアップピン16を、それらが支持する複数の被支持点の相対位置と同じ相対位置関係を有する状態で支持台12上に固定することができ、プリント基板86を、被支持点において支持することができる基板支持装置10が得られる。   An operator looks at the supported surface 152 through the half mirror 252 to find a supported point, moves the laser pointer 256 to a position facing the supported point, and projects a laser beam toward the supported surface 152. The projected laser beam passes through the half mirror 252 and is incident on the supported point in a direction normal to the supported surface 152, and is reflected by the half mirror 252 in a direction of 45 degrees with respect to the half mirror 252. If the operator places the backup pin 16 on the support surface 14 in a state where the laser beam is incident on the center of the substrate support surface 44, the support surface 14 corresponds to the supported point. Therefore, the backup pin 16 can be accurately placed at the pin placement point. The operator places the backup pin 16 on the support surface 14, moves the backup pin 16 along the support surface 14, stops the laser beam at a position where the laser beam hits the center of the substrate support surface 44, and the backup pin 16 has a magnetic force. To be fixed to the support 12. The half mirror 252 is arranged on a bisected plane in a narrow sense. When the backup pin 16 is placed so that the substrate support surface 44 is positioned at a position designated by light, the substrate support surface 44 becomes the supported surface 152. The backup pin 16 is disposed in a state where the distance from the intersection line between the support plane 154 and the support plane 154 is located at a position equal to the distance from the intersection line of the supported point. The operator moves the laser pointer 256 to sequentially project the laser beam onto the supported point, and places the backup pin 16 at the pin placement point designated by the laser beam. As a result, the plurality of backup pins 16 can be fixed on the support base 12 in a state having the same relative positional relationship as the relative positions of the plurality of supported points that they support, and the printed circuit board 86 is fixed to the supported points. The substrate supporting apparatus 10 that can be supported in the above is obtained.

認識方向限定装置は、入射光制限筒および制限筒移動装置を含む装置としてもよい。その実施例を図10ないし図12に基づいて説明する。
本実施例の支援装置330は、図10および図11に示すように、ハーフミラー332と、保持装置334と、認識方向限定装置336と、移動装置337とを含む。保持装置334は、互いに直角に設けられた支持台保持部340および基板保持部342を含む。支持台保持部340には、前記支持台保持部260と同様に一対の位置決めピン264が設けられ、基板保持部342には、前記基板・ミラー保持部262と同様に、基板載置面270等が設けられており、プリント基板86と支持台12とは、被支持面152と、支持台保持部260に保持された支持台12にバックアップピン16が配置固定されれば、そのバックアップピン16の基板支持面44がその上に位置する支持平面154(図12参照)とが互いに直交する相対位置に保持される。
The recognition direction limiting device may be a device including an incident light limiting cylinder and a limiting cylinder moving device. The embodiment will be described with reference to FIGS.
As illustrated in FIGS. 10 and 11, the support device 330 according to the present embodiment includes a half mirror 332, a holding device 334, a recognition direction limiting device 336, and a moving device 337. The holding device 334 includes a support base holding part 340 and a substrate holding part 342 provided at right angles to each other. A pair of positioning pins 264 are provided in the support base holding part 340 in the same manner as the support base holding part 260, and the substrate holding surface 270 and the like are provided in the substrate holding part 342 in the same manner as in the substrate / mirror holding part 262. If the backup pin 16 is disposed and fixed on the supported surface 152 and the support table 12 held by the support table holding part 260, the printed circuit board 86 and the support table 12 are connected to each other. The substrate support surface 44 is held at a relative position perpendicular to the support plane 154 (see FIG. 12) on which the substrate support surface 44 is positioned.

認識方向限定装置336は入射光制限筒338を含み、移動装置337により移動させられる。移動装置337は、図10に示すように、支持台保持部340に立設されたフレーム346に、保持部340,342に平行な方向に移動可能に設けられた可動部材としてのスライド348と、スライド348上に設けられた1対の案内部材としてのガイドレール350により案内され、保持部340,342にそれぞれ保持されたプリント基板86の被支持面152および支持台12に立設されたバックアップピン16の支持平面154に対して45度傾斜した方向に移動させられるスライド352とを含み、スライド352上に入射光制限筒338が搭載されている。   The recognition direction limiting device 336 includes an incident light limiting cylinder 338 and is moved by the moving device 337. As shown in FIG. 10, the moving device 337 includes a slide 348 as a movable member provided on a frame 346 erected on the support holding unit 340 so as to be movable in a direction parallel to the holding units 340 and 342. Backup pins guided by guide rails 350 as a pair of guide members provided on the slide 348 and supported on the supported surface 152 of the printed circuit board 86 held by the holding portions 340 and 342 and on the support base 12, respectively. And a slide 352 that is moved in a direction inclined by 45 degrees with respect to the 16 support planes 154, and an incident light limiting cylinder 338 is mounted on the slide 352.

入射光制限筒338は、横断面形状が円形を成し、その中心線が基板保持部342に直角、支持台保持部340に平行となり、水平な姿勢でスライド
352に搭載されている。この入射光制限筒338内には、図11に示すように、その基板保持部342側の端部にハーフミラー332が設けられ、他端部に拡大レンズ356が設けられてレンズ系を構成し、入射光制限筒338内に入射した光を認識点に集光させる。ハーフミラー332は、入射光制限筒338の中心線に対して45度の角度、傾斜して設けられ、被支持面152および支持平面154の両方に対して45度傾斜させられている。したがって、入射光制限筒338は、移動装置337により、被支持面152および支持平面154に平行な方向およびそれらに対して45度傾斜した方向であって、入射光制限筒338の中心線と交差する方向に移動させられ、ハーフミラー332と共に、ハーフミラー332に平行な平面内の任意の位置へ移動させられる。本支援装置330において移動装置337は、ハーフミラー332が、被支持面152と支持平面154との狭義の2等分平面上を移動するように設けられる。
The incident light limiting cylinder 338 has a circular cross-sectional shape, and its center line is perpendicular to the substrate holding part 342 and parallel to the support base holding part 340, and is mounted on the slide 352 in a horizontal posture. In this incident light limiting cylinder 338, as shown in FIG. 11, a half mirror 332 is provided at the end on the substrate holding part 342 side, and a magnifying lens 356 is provided at the other end to constitute a lens system. Then, the light incident in the incident light limiting cylinder 338 is condensed on the recognition point. The half mirror 332 is provided at an angle of 45 degrees with respect to the center line of the incident light limiting cylinder 338 and is inclined at 45 degrees with respect to both the supported surface 152 and the support plane 154. Therefore, the incident light restricting cylinder 338 is crossed by the moving device 337 in a direction parallel to the supported surface 152 and the support plane 154 and inclined by 45 degrees with respect to them, and intersects the center line of the incident light restricting cylinder 338. And moved to an arbitrary position in a plane parallel to the half mirror 332 together with the half mirror 332. In the support device 330, the moving device 337 is provided such that the half mirror 332 moves on a bisected plane in a narrow sense between the supported surface 152 and the support plane 154.

入射光制限筒338にはまた、図11に示すように、その周壁の支持台保持部340側の部分であって、ハーフミラー332に対応する部分を貫通して開口358が設けられており、支持面14のうち、開口358に対応する部分からの反射光は開口358を通ってハーフミラー332に入射し、反射される。プリント基板86と支持台12とは保持装置334により直角に保持され、被支持点から被支持面152に対する法線の方向に反射された光と、その被支持点に対応するピン配置点に立設されたバックアップピン16の基板支持面44から支持平面154に対する法線の方向に反射された光とは、被支持面152および支持平面154に対して45度傾斜して設けられたハーフミラー332の同一点に入射し、ハーフミラー332からの出射後、重なり合って入射光制限筒338の中心線に平行な共通光路部を形成し、同一の認識点に到達する。   As shown in FIG. 11, the incident light restricting cylinder 338 is also provided with an opening 358 that passes through a portion of the peripheral wall on the support base holding portion 340 side that corresponds to the half mirror 332. Reflected light from a portion of the support surface 14 corresponding to the opening 358 enters the half mirror 332 through the opening 358 and is reflected. The printed circuit board 86 and the support base 12 are held at a right angle by a holding device 334, and stand at the pin arrangement point corresponding to the light reflected from the supported point in the direction of the normal to the supported surface 152. The half mirror 332 provided at 45 degrees with respect to the supported surface 152 and the support plane 154 is inclined from the light reflected in the direction normal to the support plane 154 from the substrate support surface 44 of the backup pin 16 provided. After being emitted from the half mirror 332, they overlap to form a common optical path portion parallel to the center line of the incident light restricting cylinder 338 and reach the same recognition point.

作業者は、支持台12にバックアップピン16を配置するとき、図12に示すように、入射光制限筒338を覗いて支持面14および被支持面152を見るため、それらから認識点に入射する光の角度が入射光制限筒338により制限され、作業者の視認範囲は、支持面14および被支持面152のうち、反射光が入射光制限筒338に入射し、拡大レンズ356に到達する範囲に制限される。入射光制限筒338の内径は、作業者の視認範囲が、被支持面152の像により、電子回路部品が装着されていない空き部分が被支持可能領域であることを視認することができる大きさであって、できるだけ小さく、かつ、被支持面152からの法線方向の反射光による被支持可能領域の像およびその周辺の僅かな像と、基板支持面44からの法線方向の反射光による像およびその周辺の僅かな像とに制限される大きさとされ、入射光制限筒338により制限される認識点への入射光の角度は、作業者の視認範囲が上記のように制限される大きさに設定される。したがって、作業者は、入射光制限筒338を覗いて基板支持面44および被支持面152の各像を見ようとすれば、その視線が入射光制限筒338の中心線とほぼ平行となり、ハーフミラー232を経た光の認識可能な方向が、被支持面152に直角で支持平面154に平行な方向に限定され、被支持点周辺と基板支持面44とを、それらに直角な方向から見るに等しいこととなる。認識方向限定装置336は視認方向限定装置である。そして、被支持可能領域の像の中に基板支持面44の像が位置し、被支持点の像とちょうど重なり合って見える位置にバックアップピン16を置けば、被支持点と対応するピン配置点に正確に配置することができる。また、基板支持面44および被支持面152の像は拡大レンズ356により拡大され、小さい電子回路部品でも大きく見ることができ、被支持可能領域を正確に探し、バックアップピン16を電子回路部品との干渉を生じることなく配置することができる。   When the operator places the backup pin 16 on the support base 12, as shown in FIG. 12, the operator sees the support surface 14 and the supported surface 152 through the incident light limiting cylinder 338, and enters the recognition point from them. The angle of light is limited by the incident light limiting cylinder 338, and the worker's visual recognition range is a range in which the reflected light enters the incident light limiting cylinder 338 and reaches the magnifying lens 356 among the support surface 14 and the supported surface 152. Limited to The inner diameter of the incident light restricting cylinder 338 is such that the worker's visual recognition range can visually recognize from the image of the supported surface 152 that an empty portion where no electronic circuit component is mounted is a supported region. It is as small as possible, and the image of the supported area by the reflected light in the normal direction from the supported surface 152 and a slight image of the periphery thereof, and the reflected light in the normal direction from the substrate supporting surface 44 The angle of the incident light to the recognition point restricted by the incident light restricting cylinder 338 is such a size that the worker's visible range is restricted as described above. Is set. Therefore, when the operator looks into the incident light limiting cylinder 338 and looks at the images of the substrate support surface 44 and the supported surface 152, the line of sight becomes substantially parallel to the center line of the incident light limiting cylinder 338, and the half mirror The recognizable direction of the light having passed through H.232 is limited to a direction perpendicular to the supported surface 152 and parallel to the supporting plane 154, and is equivalent to viewing the periphery of the supported point and the substrate supporting surface 44 from a direction perpendicular to them. It will be. The recognition direction limiting device 336 is a visual recognition direction limiting device. Then, if the image of the substrate support surface 44 is located in the image of the supported area and the backup pin 16 is placed at a position where it appears to overlap the image of the supported point, the pin placement point corresponding to the supported point is set. Can be placed accurately. Further, the images of the substrate support surface 44 and the supported surface 152 are magnified by the magnifying lens 356, so that even a small electronic circuit component can be viewed in a large size. It can be arranged without causing interference.

作業者は、スライド348,352を移動させて入射光制限筒338と共にハーフミラー332を移動させ、入射光制限筒338を覗いて被支持面152を一部ずつ見ては被支持可能領域を探し、被支持可能領域があれば、バックアップピン16を、基板支持面44の像が被支持可能領域の像の中に見え、基板支持面44の像と被支持点の像とが同心的に重なって見えるように支持面14上に載置する。入射光制限筒338は、スライド352の移動により、図12に二点鎖線で示すように、被支持面152および支持平面154に対して45度傾斜した方向に移動させられ、スライド348,352の移動により、ハーフミラー332は、被支持面152全体を同時に見ることができる1枚のハーフミラーと同様に機能し、バックアップピン16を、全部の被支持点にそれぞれ対応するピン配置点に配置することができる。移動装置337は、認識方向限定装置336およびハーフミラー332を、そのハーフミラー332に平行な平面内の任意の位置へ移動させる装置であり、制限筒移動装置でもあり、入射光制限筒338と共に認識方向限定装置を構成する。   The operator moves the slides 348 and 352 to move the half mirror 332 together with the incident light restricting cylinder 338, and looks through the incident light restricting cylinder 338 to see part of the supported surface 152 to find a supported area. If there is a supportable region, the backup pin 16 can be seen in the image of the substrate support surface 44 in the image of the supportable region, and the image of the substrate support surface 44 and the image of the support point overlap concentrically. It is placed on the support surface 14 so that it can be seen. The incident light restricting cylinder 338 is moved in a direction inclined by 45 degrees with respect to the supported surface 152 and the support plane 154 as shown by a two-dot chain line in FIG. By moving, the half mirror 332 functions in the same manner as one half mirror that can simultaneously see the entire supported surface 152, and the backup pins 16 are arranged at pin arrangement points corresponding to all the supported points, respectively. be able to. The moving device 337 is a device that moves the recognition direction limiting device 336 and the half mirror 332 to an arbitrary position in a plane parallel to the half mirror 332, and is also a limiting cylinder moving device and is recognized together with the incident light limiting cylinder 338. Configure the direction limiting device.

保持装置を、ハーフミラー,プリント基板および支持台を、被支持面と支持平面とが互いに平行に延びかつ互いに対向するとともに、ハーフミラーがそれら被支持面および支持平面と45度の角度を成す傾斜姿勢となり、かつ、第1,第2光路の一方が被支持点を被支持面に直角な方向に通過する状態で保持するものとしてもよい。その実施例を図13に基づいて説明する。
本実施例の支援装置400は、ハーフミラー402,保持装置404,導光装置406,認識可能光限定装置408および移動装置(図示省略)を含む。保持装置404は、支持台保持部410と、支持台保持部410と平行に設けられた基板保持部412とを含む。支持台保持部410は、前記支持台保持部70と同様に構成されて水平に設けられ、支持台12を位置決めする1対の位置決めピン411を備えている。基板保持部412は、例えば、前記保持装置62の第2保持部材68を支持台保持部410と平行であって水平に、かつ下向きに支持台保持部410と対向する状態で設けた構成を備え、前記基板取付面90に相当し、水平で下向きの基板取付面413、前記基板載置面88に相当し、基板取付面413に直角な基板位置決め面414、前記位置決め部材96に相当し、基板位置決め面414に平行な方向に対称に移動可能に設けられた1対の位置決め部材416および前記基板押さえ部材110と同様に構成された複数の基板押さえ部材418を含み、被支持面152と支持平面154とは互いに平行となる。また、これら位置決めピン411等は、電子回路部品装着システムにおける位置決めに使用される位置決め基準を利用し、プリント基板86と支持台12とを、被支持面152および支持面14に平行な方向において、部品装着時と同様の相対位置関係に位置決めして保持するように設けられる。
The holding device has a half mirror, a printed circuit board, and a support base. The supported surface and the support plane extend parallel to each other and face each other, and the half mirror forms an angle of 45 degrees with the supported surface and the support plane. It is good also as what hold | maintains in the state which becomes an attitude | position and one side of a 1st, 2nd optical path passes a supported point in the direction orthogonal to a supported surface. The embodiment will be described with reference to FIG.
The support device 400 of this embodiment includes a half mirror 402, a holding device 404, a light guide device 406, a recognizable light limiting device 408, and a moving device (not shown). The holding device 404 includes a support table holding unit 410 and a substrate holding unit 412 provided in parallel with the support table holding unit 410. The support base holding part 410 is configured in the same manner as the support base holding part 70 and is provided horizontally, and includes a pair of positioning pins 411 for positioning the support base 12. The substrate holding unit 412 includes, for example, a configuration in which the second holding member 68 of the holding device 62 is provided in a state of being parallel to the support base holding unit 410, horizontally, and facing the support base holding unit 410 downward. Corresponding to the substrate mounting surface 90, corresponding to the horizontal and downward substrate mounting surface 413, the substrate mounting surface 88, the substrate positioning surface 414 perpendicular to the substrate mounting surface 413, the positioning member 96, and the substrate A pair of positioning members 416 provided symmetrically in a direction parallel to the positioning surface 414 and a plurality of substrate pressing members 418 configured in the same manner as the substrate pressing member 110 are included. 154 are parallel to each other. Further, these positioning pins 411 and the like utilize the positioning reference used for positioning in the electronic circuit component mounting system, and the printed circuit board 86 and the support base 12 are arranged in a direction parallel to the supported surface 152 and the support surface 14. It is provided so as to be positioned and held in the same relative positional relationship as at the time of component mounting.

前記導光装置406は、図13に概略的に示すように、装置本体420と、複数、例えば、3枚の全反射ミラー422,424,426とを備えている。全反射ミラー422,424はそれぞれ、装置本体420に、各反射面が支持台保持部410,基板保持部412に対向し、支持台保持部410および基板保持部412、すなわち支持平面154および被支持面152に対して45度傾斜させられるとともに、互いに直角に設けられ、全反射ミラー426は、その反射面が全反射ミラー422と対向させられるとともに、全反射ミラー422と平行に設けられている。ハーフミラー402は、装置本体420に、支持台保持部410および基板保持部412、すなわち支持平面154および被支持面152に対して45度傾斜させられ、全反射ミラー424,426に対向する状態で設けられている。これらミラー402,422,424,426はそれぞれ、例えば、矩形の板状を成す。   As schematically shown in FIG. 13, the light guide device 406 includes a device main body 420 and a plurality of, for example, three total reflection mirrors 422, 424, and 426. The total reflection mirrors 422 and 424 are respectively opposed to the apparatus main body 420, and the reflecting surfaces thereof are opposed to the support base holding part 410 and the substrate holding part 412. The total reflection mirror 426 is inclined at 45 degrees with respect to the surface 152 and at right angles to each other. The reflection surface of the total reflection mirror 426 is opposed to the total reflection mirror 422 and parallel to the total reflection mirror 422. The half mirror 402 is inclined 45 degrees with respect to the support body holding part 410 and the substrate holding part 412, that is, the support plane 154 and the supported surface 152, in the apparatus main body 420 and faces the total reflection mirrors 424 and 426. Is provided. Each of these mirrors 402, 422, 424, and 426 has a rectangular plate shape, for example.

さらに、装置本体420には、認識可能光制限筒たる入射光制限筒430が一体的に設けられ、認識可能光限定装置たる視認可能光限定装置を構成している。入射光制限筒430は、装置本体420のハーフミラー402が設けられた部分から支持台保持部410および基板保持部412に平行に、本実施例では水平に延び出させられ、その延び出し端部に拡大レンズ432が設けられ、レンズ系を構成している。入射光制限筒430の内径は、前記入射光制限筒338と同様に設定され、ミラー402,422,424,426は、入射光制限筒430の内径に応じた大きさとされている。また、移動装置は、図示は省略するが、基板保持部412に平行な一平面内において互いに直交する2方向のうちの一方に平行な方向(例えば、紙面に直角な方向)に移動させられるスライドと、そのスライド上において他方に平行な方向(紙面に平行で左右方向)に移動させられるスライドとを備え、作業者により操作され、入射光制限筒430,ハーフミラー402および導光装置406を、支持台保持部410と基板保持部412との間のスペースであって、支持台12に配置されたバックアップピン16と干渉しない領域において、支持面14および被支持面152に平行な平面内の任意の位置へ移動させる装置とされている。なお、導光装置406,支持台保持部410および基板保持部412は、被支持面152からの法線方向の反射光がハーフミラー402に入射するまでの光路の長さと、基板支持面44からの法線方向の反射光がハーフミラー402に入射するまでの光路の長さとがほぼ等しくなるように設けられている。   Further, the apparatus main body 420 is integrally provided with an incident light limiting cylinder 430 that is a recognizable light limiting cylinder, and constitutes a visible light limiting apparatus that is a recognizable light limiting apparatus. The incident light restricting cylinder 430 extends horizontally from the portion of the apparatus main body 420 where the half mirror 402 is provided in parallel with the support base holding part 410 and the substrate holding part 412 in this embodiment, and its extended end part. Are provided with a magnifying lens 432 to constitute a lens system. The inner diameter of the incident light limiting cylinder 430 is set in the same manner as the incident light limiting cylinder 338, and the mirrors 402, 422, 424 and 426 are sized according to the inner diameter of the incident light limiting cylinder 430. Although not shown, the moving device is a slide that is moved in a direction parallel to one of two directions orthogonal to each other (for example, a direction perpendicular to the paper surface) within a plane parallel to the substrate holding portion 412. And a slide that is moved in the direction parallel to the other on the slide (in the horizontal direction parallel to the paper surface), and is operated by an operator, and the incident light limiting cylinder 430, the half mirror 402, and the light guide device 406 are Any space in a plane parallel to the support surface 14 and the supported surface 152 in a space between the support table holding unit 410 and the substrate holding unit 412 and not interfering with the backup pin 16 disposed on the support table 12. It is set as the device which moves to the position. Note that the light guide device 406, the support holding unit 410, and the substrate holding unit 412 are configured from the length of the optical path until the reflected light in the normal direction from the supported surface 152 enters the half mirror 402, and from the substrate support surface 44. The length of the optical path until the reflected light in the normal direction is incident on the half mirror 402 is substantially equal.

さらにまた、照明装置440,442が設けられている。これら照明装置440,442はそれぞれ、例えば、リング状を成し、一方の照明装置440は、導光装置406の装置本体420の全反射ミラー422に対向する部分に、その中心線が支持台保持部410と直角に設けられ、支持面14のうち、全反射ミラー422に対向する部分に、真上から光を照射するようにされている。また、他方の照明装置442は、装置本体420の全反射ミラー424に対向する部分に、その中心線が基板保持部412と直角に設けられ、被支持面152のうち、全反射ミラー424に対向する部分に真下から光を照射するようにされている。これら照明装置440,442はそれぞれ、光を照射する照射状態と照射しない非照射状態とに、例えば、手動で切り換えられるように構成されている。   Furthermore, lighting devices 440 and 442 are provided. Each of these illumination devices 440 and 442 has, for example, a ring shape, and one illumination device 440 has a support line at the center line of the light guide device 406 facing the total reflection mirror 422 of the device main body 420. It is provided at a right angle to the portion 410, and the portion of the support surface 14 that faces the total reflection mirror 422 is irradiated with light from directly above. The other illumination device 442 has a center line at a right angle to the substrate holding portion 412 at a portion facing the total reflection mirror 424 of the apparatus main body 420, and faces the total reflection mirror 424 in the supported surface 152. The light is radiated from directly under the part. Each of these illumination devices 440 and 442 is configured to be manually switched, for example, between an irradiation state in which light is irradiated and a non-irradiation state in which light is not irradiated.

支持台12にバックアップピン16を載置する際には、支持台12,プリント基板86がそれぞれ、支持台保持部410,基板保持部412により水平に保持され、支持面14と被支持面152とは互いに平行であり、被支持面152と支持平面154とは互いに平行となり、被支持点のちょうど真下に、その被支持点を支持するバックアップピン16を配置するピン配置点が位置する。作業者は、入射光制限筒430からハーフミラー402を覗いて基板支持面44および被支持面152の各像を見る。この際、例えば、照明装置440,442は共に光の照射状態とされ、作業者は、基板支持面44および被支持面152を同時に重ねて見るが、入射光制限筒430により、前記入射光制限筒338と同様に、作業者が視認可能な光の方向が制限されて支持面14および被支持面152の視認範囲が制限され、作業者は、ほぼ、被支持点から被支持面152に対する法線方向に反射される光および基板支持面44から支持平面154に対する法線方向に反射される光のみを見ることとなる。被支持点から法線方向に反射される光は、全反射ミラー424により水平方向に反射されてハーフミラー402に入射してハーフミラー402を透過し、ピン配置点に配置されたバックアップピン16の基板支持面44の中心から法線方向に反射される光は、全反射ミラー422により水平方向に反射されるとともに、全反射ミラー426により上方へ反射され、ハーフミラー402の、上記被支持点からの入射光と同一点に入射し、ハーフミラー402によりハーフミラー402に対して45度の方向に反射され、ハーフミラー402を透過した光と重なって共通光路部を構成し、認識点に到達し、作業者は被支持点周辺および基板支持面44をそれらに直角な方向から見るに等しいこととなり、作業者は、被支持点とそれに対応するピン配置点に配置されたバックアップピン16の基板支持面44の中心との一致を正確に判断することができる。   When the backup pin 16 is placed on the support base 12, the support base 12 and the printed board 86 are held horizontally by the support base holding part 410 and the board holding part 412, respectively. Are parallel to each other, the supported surface 152 and the support plane 154 are parallel to each other, and a pin placement point for placing the backup pin 16 that supports the supported point is located just below the supported point. The operator looks through the half mirror 402 from the incident light limiting cylinder 430 and sees the images on the substrate support surface 44 and the supported surface 152. At this time, for example, the illumination devices 440 and 442 are both in the light irradiation state, and the operator looks at the substrate support surface 44 and the supported surface 152 at the same time, but the incident light restriction cylinder 430 restricts the incident light. Similar to the cylinder 338, the direction of light visible to the operator is limited, and the viewing range of the support surface 14 and the supported surface 152 is limited. Only light reflected in the line direction and light reflected in the normal direction from the substrate support surface 44 to the support plane 154 will be seen. The light reflected in the normal direction from the supported point is reflected in the horizontal direction by the total reflection mirror 424, enters the half mirror 402, passes through the half mirror 402, and is transmitted from the backup pin 16 arranged at the pin arrangement point. The light reflected in the normal direction from the center of the substrate support surface 44 is reflected in the horizontal direction by the total reflection mirror 422 and reflected upward by the total reflection mirror 426, and from the above supported point of the half mirror 402. Is incident on the same point as the incident light, and is reflected by the half mirror 402 in the direction of 45 degrees with respect to the half mirror 402 and overlaps with the light transmitted through the half mirror 402 to form a common optical path portion, and reaches the recognition point. The operator is equivalent to seeing the periphery of the supported point and the substrate support surface 44 from a direction perpendicular to them, and the operator can select the supported point and the corresponding pin. The coincidence of the center of the substrate supporting surface 44 of the backup pins 16 disposed 置点 can be accurately determined.

そのため、作業者は、支持台14上に載置したバックアップピン16を支持面14に沿って移動させ、支持面14の、被支持面152の被支持可能領域の像の中に基板支持面44の像が見え、基板支持面44の像が被支持点の像と同心的に重なって見える位置にバックアップピン16を置けば、被支持点に対応するピン配置点にバックアップピン16を正確に置くことができる。照明装置440,442は、基板支持面44および被支持面152にそれぞれ、それらに直角な方向から光を照射するため、バックアップピン16や電子回路部品の影が形成されず、作業者は、影に妨げられることなく、被支持点を探し、バックアップピン16をピン配置点に正確に置くことができる。作業者は、移動装置を操作し、ハーフミラー402を覗いては被支持可能領域を探し、バックアップピン16を配置する。また、拡大レンズ432により、被支持面152および基板支持面44の像が拡大されるため、小さい電子回路部品が高密度で実装されている箇所についても、電子回路部品との干渉を生じることなく、バックアップピン16をピン配置点に正確に配置することができる。さらに、被支持面152からの法線方向の反射光がハーフミラー402に入射するまでの光路の長さと、基板支持面44からの法線方向の反射光がハーフミラー402に入射するまでの光路の長さとがほぼ等しくされているため、作業者が被支持点および基板支持面44をいずれも焦点が合った状態で見ることができる。   Therefore, the operator moves the backup pin 16 placed on the support base 14 along the support surface 14, and the substrate support surface 44 in the image of the supported area of the support surface 152 of the support surface 14. If the backup pin 16 is placed at a position where the image of the substrate support surface 44 appears concentrically with the image of the supported point, the backup pin 16 is accurately placed at the pin placement point corresponding to the supported point. be able to. Since the illumination devices 440 and 442 irradiate the substrate support surface 44 and the supported surface 152 with light from a direction perpendicular to them, the shadow of the backup pin 16 and the electronic circuit component is not formed. Without being obstructed, the supported point can be searched and the backup pin 16 can be accurately placed at the pin placement point. The operator operates the moving device, looks into the half mirror 402, searches for a supported area, and arranges the backup pin 16. In addition, since the images of the supported surface 152 and the substrate support surface 44 are magnified by the magnifying lens 432, interference with the electronic circuit components does not occur even in places where small electronic circuit components are mounted at high density. The backup pin 16 can be accurately arranged at the pin arrangement point. Further, the length of the optical path until the reflected light in the normal direction from the supported surface 152 enters the half mirror 402 and the optical path until the reflected light in the normal direction from the substrate support surface 44 enters the half mirror 402. Therefore, the operator can see both the supported point and the substrate support surface 44 in a focused state.

照明装置440,442により支持面14と被支持面152とを選択的に照明するようにしてもよい。例えば、まず、照明装置442を照明状態とし、照明装置440を非照明状態として被支持面152のみに光を照射し、ハーフミラー402および導光装置406を移動させ、被支持点を探す。被支持点が見つかったならば、照明装置442を非照明状態とし、照明装置440を照明状態とし、支持面14のみを見て、その視認範囲内に基板支持面44が位置するようにバックアップピン16を置く。   The support surface 14 and the supported surface 152 may be selectively illuminated by the illumination devices 440 and 442. For example, first, the illumination device 442 is set in an illumination state, the illumination device 440 is set in a non-illumination state, light is irradiated only on the supported surface 152, the half mirror 402 and the light guide device 406 are moved, and a supported point is searched. If the supported point is found, the illuminating device 442 is set to the non-illuminated state, the illuminating device 440 is set to the illuminating state, and only the support surface 14 is viewed. 16 is put.

保持装置により、プリント基板と支持台とが、被支持面と支持平面とが互いに平行な姿勢で対向する相対位置関係に保持される場合、被支持面および支持平面に平行な方向において、被支持点と支持部材配置点との位置が一致し、被支持面および支持平面に直角な方向において対向する状態となる位置に保持されることは不可欠ではなく、保持装置は、プリント基板と支持台とを、被支持面および支持平面に平行な方向において、被支持点と支持部材配置点とがずれた状態となる位置に保持する装置としてもよい。その実施例を図14に基づいて説明する。   When the holding device holds the printed circuit board and the support base in a relative positional relationship in which the supported surface and the support plane face each other in a parallel posture, the supported surface is supported in a direction parallel to the supported surface and the support plane. It is not essential that the positions of the point and the support member arrangement point coincide with each other and be held in a position facing each other in a direction perpendicular to the supported surface and the support plane. It is good also as an apparatus which hold | maintains in a position where a to-be-supported point and a supporting member arrangement | positioning point have shifted | deviated in the direction parallel to a to-be-supported surface and a support plane. The embodiment will be described with reference to FIG.

本実施例の支援装置470の保持装置472は、前記保持装置404と同様に、互いに平行に設けられた支持台保持部474および基板保持部476を備え、位置決めピン478により支持台12を位置決めし、基板取付面480,基板位置決め面482,基板位置決め部材484,基板押さえ部材486によってプリント基板86を位置決めし、保持する。位置決めピン478は、支持台12をプリント基板86に対して、支持平面154および被支持面152に平行な一方向において位置をずらして位置決めするように設けられるが、基板支持装置10およびプリント基板86が、電子回路部品装着システムにおいて位置決めされるための位置決め基準を利用して位置決めされることは、前記各実施例と同じである。   Similar to the holding device 404, the holding device 472 of the support device 470 of the present embodiment includes a support stand holding portion 474 and a substrate holding portion 476 provided in parallel with each other, and positions the support stand 12 with positioning pins 478. The printed circuit board 86 is positioned and held by the board mounting surface 480, the board positioning surface 482, the board positioning member 484, and the board pressing member 486. The positioning pins 478 are provided so as to position the support base 12 with respect to the printed circuit board 86 while shifting the positions in one direction parallel to the support plane 154 and the supported surface 152. However, the positioning is performed by using a positioning reference for positioning in the electronic circuit component mounting system as in the above embodiments.

また、導光装置500は、装置本体502,ハーフミラー504および全反射ミラー506を含む。全反射ミラー506は被支持面152に対向し、被支持面152に対して45度傾斜して設けられ、ハーフミラー504は全反射ミラー504に対して、被支持面152に直角な面に対して対称に、かつ、被支持面152および支持平面154に対して45度傾斜して設けられている。なお、導光装置500,支持台保持部474および基板保持部476は、被支持面152からの法線方向の反射光がハーフミラー504に入射するまでの光路の長さと、基板支持面44からの法線方向の反射光がハーフミラー504に入射するまでの光路の長さとがほぼ等しくなるように設けられている。さらに、装置本体502には、ハーフミラー504と全反射ミラー506とにそれぞれ対向して照明装置508,510が設けられるとともに、認識可能光限定装置511の入射光制限筒512およびレンズ系を構成する拡大レンズ514が設けられている。   The light guide device 500 includes a device main body 502, a half mirror 504, and a total reflection mirror 506. The total reflection mirror 506 faces the supported surface 152 and is inclined by 45 degrees with respect to the supported surface 152, and the half mirror 504 is relative to the surface perpendicular to the supported surface 152 with respect to the total reflection mirror 504. And inclined by 45 degrees with respect to the supported surface 152 and the support plane 154. The light guide device 500, the support base holding unit 474, and the substrate holding unit 476 are configured so that the normal path reflected light from the supported surface 152 enters the half mirror 504 and the length of the optical path from the substrate support surface 44. The length of the optical path until the reflected light in the normal direction enters the half mirror 504 is substantially equal. Further, the apparatus main body 502 is provided with illumination devices 508 and 510 facing the half mirror 504 and the total reflection mirror 506, respectively, and constitutes an incident light limiting cylinder 512 and a lens system of the recognizable light limiting device 511. A magnifying lens 514 is provided.

したがって、被支持面152から反射される光は全反射ミラー506により反射され、ハーフミラー504を透過し、基板支持面44から反射される光はハーフミラー504により反射されるが、作業者により視認される光は、入射光制限筒512により制限され、作業者は被支持面152および基板支持面44をそれぞれ、それらに直角な方向から見るに等しいこととなる。保持装置472の支持台12を位置決めする位置決めピン478は、支持台12をプリント基板86に対して、ピン配置点の位置が被支持点に対して、ハーフミラー504による反射光および透過光(共通光路部)と平行な方向においてずらされるとともに、被支持点から被支持面152に対して法線方向に反射され、全反射ミラー506により45度の方向に反射された光と、ピン配置点に配置されたバックアップピン16の基板支持面44から支持平面154に対する法線方向に反射された光とがハーフミラー504の同一点に入射する位置に位置決めするように設けられており、被支持点の像と基板支持面44の像とを重ねて見ることができる。   Therefore, the light reflected from the supported surface 152 is reflected by the total reflection mirror 506, passes through the half mirror 504, and the light reflected from the substrate support surface 44 is reflected by the half mirror 504. The incident light is limited by the incident light limiting cylinder 512, and the operator is equivalent to viewing the supported surface 152 and the substrate supporting surface 44 from a direction perpendicular to them. Positioning pins 478 for positioning the support base 12 of the holding device 472 are reflected and transmitted by the half mirror 504 (common to the support base 12 with respect to the printed circuit board 86 and the position of the pin placement point with respect to the supported point). And the light reflected from the supported point in the normal direction to the supported surface 152 and reflected by the total reflection mirror 506 in the direction of 45 degrees, and the pin arrangement point. The light reflected from the substrate support surface 44 of the arranged backup pin 16 in the normal direction to the support plane 154 is positioned so as to be incident on the same point of the half mirror 504. The image and the image of the substrate support surface 44 can be seen superimposed.

本支援装置470においても導光装置500は、図示を省略する移動装置により、被支持面152および支持面14に平行な方向に移動させられる。作業者は、入射光制限筒512を覗くとともに、導光装置500を移動させて被支持点を探す。作業者は入射光制限筒512を覗いて基板支持面44および被支持点の各像を見ることにより、それら像を位置ずれなく、重ねて見ることができ、被支持点の像に基板支持面44の像が重なるようにバックアップピン16を配置する。被支持面152からの法線方向の反射光がハーフミラー504に入射するまでの光路の長さと、基板支持面44からの法線方向の反射光がハーフミラー504に入射するまでの光路の長さとがほぼ等しくなるように設けられているため、被支持点の像および基板支持面44の像をいずれも焦点が合った状態で見ることができる。   Also in the support device 470, the light guide device 500 is moved in a direction parallel to the supported surface 152 and the support surface 14 by a moving device (not shown). The operator looks into the incident light limiting cylinder 512 and moves the light guide device 500 to search for a supported point. The operator can see the images of the substrate support surface 44 and the supported point by looking through the incident light restricting cylinder 512, so that the images can be seen without being displaced, and the image of the supported point is displayed on the substrate support surface. The backup pins 16 are arranged so that the 44 images overlap. The length of the optical path until the reflected light in the normal direction from the supported surface 152 enters the half mirror 504 and the length of the optical path until the reflected light in the normal direction from the substrate support surface 44 enters the half mirror 504 Therefore, both the image of the supported point and the image of the substrate support surface 44 can be seen in a focused state.

以上の実施例は、いずれも、被支持面152および基板支持面44を、最も望ましい方向である法線方向から見、あるいはレーザビームが法線方向に入射させるようにされているが、これは不可欠なことではない。例えば、ハーフミラーが被支持面と支持平面との狭義の2等分平面上に配置される場合、被支持点の像とその被支持点を支持すべき支持部材の基板支持面の像とを認識可能な方向を法線方向に限定することは勿論、一定方向に限定することも不可欠ではないのである。被支持点と、その被支持点を支持すべき支持部材配置点に配置された支持部材の基板支持面の中心とからそれぞれ反射される光の方向は無数にあり、被支持点を通る光および基板支持面の中心をそれぞれ通る光であって、ハーフミラーにより反射され、ハーフミラーを透過する2つの光が重なり合う共通光路部の方向も無数にあるが、それら共通光路部のうちのいずれにおいて被支持点の像および基板支持面の像を認識しても、ハーフミラーが狭義の2等分平面上に配置されていれば、共通光路部を形成する2つの光路が通る被支持点と基板支持面の中心との、被支持面と支持平面との交線からの距離が互いに等しくなり、被支持点の像と基板支持面の像とが重なる位置に支持部材を配置すれば、支持部材を支持部材配置点に配置することができるのである。   In each of the above embodiments, the supported surface 152 and the substrate support surface 44 are viewed from the normal direction which is the most desirable direction, or the laser beam is incident in the normal direction. It is not essential. For example, when the half mirror is arranged on a bisected plane in a narrow sense of the supported surface and the support plane, an image of the supported point and an image of the substrate support surface of the support member that should support the supported point are obtained. In addition to limiting the recognizable direction to the normal direction, it is not essential to limit the direction to a certain direction. There are innumerable directions of light reflected from the supported point and the center of the substrate support surface of the support member arranged at the support member arrangement point that should support the supported point, and light passing through the supported point and There are innumerable directions of common optical path portions where two lights that pass through the center of the substrate support surface and are reflected by the half mirror and transmitted through the half mirror overlap, but in any of these common optical path portions Even if the image of the support point and the image of the substrate support surface are recognized, if the half mirror is arranged on a narrowly divided bisection plane, the supported point and the substrate support through which the two optical paths forming the common optical path section pass If the support member is disposed at a position where the distance from the intersection line of the supported surface and the support plane with the center of the surface becomes equal to each other and the image of the supported point and the image of the substrate support surface overlap, Can be placed at the support member placement point It is kill the.

図15に実線で示すように、被支持面と支持平面とが直角に設けられ、ハーフミラーが狭義の2等分平面上に配置される場合、図中、○印で示す被支持点を例に取れば、細線で示すように、ハーフミラーに対して45度傾斜した方向から見ても、破線で示すように、ハーフミラーに対して45度より小さい角度傾斜した方向から見ても、その像が被支持点の像と重なる基板支持面の中心は○印で示す位置になり、視認方向が異なっていても同じであり、ハーフミラーをどの方向から見ても支持部材を被支持点を支持すべき位置に配置することができる。また、作業者が目の位置を固定した状態で視線の方向を変えることによっても支持部材を被支持点に対応する支持部材配置点に配置することができる。○印で示す被支持点の像を、破線で示す方向において見る場合の目の位置において、△印で示す被支持点の像を見ても、像が被支持点の像と重なって見える基板支持面の中心の、被支持面と支持平面との交線からの距離は、被支持点と交線との距離に等しく、被支持点を支持すべき位置に支持部材を置くことができるのである。   As shown by the solid line in FIG. 15, when the supported surface and the support plane are provided at right angles and the half mirror is arranged on a narrowly divided bisection plane, the supported point indicated by a circle in the figure is an example. If seen from a direction inclined 45 degrees with respect to the half mirror as shown by a thin line, or even if seen from a direction inclined at an angle smaller than 45 degrees with respect to the half mirror as shown by a broken line, The center of the substrate support surface where the image overlaps the image of the supported point is the position indicated by a circle, and it is the same even if the viewing direction is different. It can arrange | position in the position which should be supported. Further, the support member can be arranged at the support member arrangement point corresponding to the supported point by changing the direction of the line of sight while the operator fixes the position of the eyes. A substrate in which an image of a supported point indicated by a circle is seen to overlap the image of the supported point even when the image of the supported point indicated by a triangle is viewed at the position of an eye when the image of the supported point indicated by a circle is viewed in the direction indicated by a broken line The distance from the intersection line between the supported surface and the support plane at the center of the support surface is equal to the distance between the supported point and the intersection line, and the support member can be placed at a position where the supported point should be supported. is there.

以上は、ハーフミラーの傾斜方向に平行で、ハーフミラーと直交する平面(被支持面と支持平面との交線と直交する平面)内において、認識点や視線の方向を変える場合について説明したが、視線の方向を上記ハーフミラーと直交する平面に対して傾斜した方向に変えても差し支えない。例えば、図16に示すように、視点Aからハーフミラー上の点Bを経て○印で示す被支持点を見ている状態で、支持平面上の○印で示す点に基板支持面の中心が位置するように、支持部材を配置すれば、その支持部材の基板支持面は○印で示す被支持点においてプリント基板を支持することになることは前述の通りであるが、この視点Aを視点Cに変え、点Bを経て認識される□印で示す被支持点と一致する位置に基板支持面の中心が位置する状態で、支持部材を配置してもよいのである。視点Cは、視点Aを、点Bを通りハーフミラーと直交する旋回中心線550のまわりに旋回させた点であり、図16におけるJ矢視図である図17に示すように、視点A,Cは共通の円周552上に位置する。そして、視点Cから点Bを見た場合、□印で示す被支持点と□印で示す基板支持面の中心とが一致する状態で見える。   The above describes the case where the direction of the recognition point or line of sight is changed in a plane that is parallel to the inclination direction of the half mirror and orthogonal to the half mirror (a plane orthogonal to the line of intersection between the supported surface and the support plane). The direction of the line of sight may be changed to a direction inclined with respect to the plane perpendicular to the half mirror. For example, as shown in FIG. 16, the center of the substrate support surface is located at the point indicated by a circle on the support plane in a state where the supported point indicated by the circle is viewed from the viewpoint A via the point B on the half mirror. As described above, if the support member is arranged so as to be positioned, the substrate support surface of the support member will support the printed circuit board at the supported point indicated by the circles. Instead of C, the support member may be arranged in a state where the center of the substrate support surface is located at a position that coincides with the supported point indicated by the □ mark recognized through the point B. The viewpoint C is a point obtained by turning the viewpoint A around the turning center line 550 passing through the point B and orthogonal to the half mirror. As shown in FIG. C is located on a common circumference 552. When the point B is viewed from the viewpoint C, it appears that the supported point indicated by the □ mark and the center of the substrate support surface indicated by the □ mark coincide with each other.

ハーフミラーを透過して見える点が直線CBと支持平面との交点であることは明らかであるが、その点と、ハーフミラーで反射されて視点Cにおいて見える被支持面上の点との間にいかなる関係があるかは、例えば、次のように理解することができる。図17において、視点Aが視点Cの位置へ移動した場合、点Bを透過して見える基板支持面により支持されるべき被支持点は、反射の法則により、円周552上において視点Cと点対称の関係にある点Dと点Bとを通る直線上に位置するはずである。反射の法則によれば、旋回中心線550を含む一平面内において、視点Cと点Bとを通る直線と、点Dと点Bとを通る直線とがそれぞれ旋回中心線550に対して成す角度が同じになるからである。また、ハーフミラーに対して上記円周552と対称な円周554を想定した場合、□印で示す位置の基板支持面からの光は、図16におけるK矢視図である図18に示すように、円周554上において、円周552上における点Dと同じ位置に位置する点Eと点Bとを結ぶ直線に沿って進むはずである。このことは、旋回中心線550に沿って、円周552から円周554に向かう向き(矢印J,Kの向き)に見た場合の、直線CBEと円周552,554との相対位置を想像すれば理解できる。そして、円周552と被支持面との相対位置関係と、円周554と支持平面との相対位置関係が同じであるから、直線BDと被支持面との交点と、直線BEと支持平面との交点とは、ハーフミラーに対して面対称の関係にあることになる。すなわち、それぞれ□印で示す被支持点と基板支持面とはハーフミラーに対して面対称の関係にあり、被支持点と基板支持面の中心とが一致する位置(□印で示す位置)に基板支持面が位置するように支持部材を配置すれば、その支持部材は□印で示す被支持点を支持するのに適した位置に配置されたことになる。
以上のことから、視線の方向が、ハーフミラーの傾斜方向に平行でハーフミラーと直交する平面に対して傾斜した状態で、基板支持面の中心が被支持点と一致する状態で支持部材を配置しても、その支持部材が適切な位置に配置されたことになることが明らかである。
It is clear that the point seen through the half mirror is the intersection of the straight line CB and the support plane, but between that point and the point on the supported surface that is reflected by the half mirror and seen at the viewpoint C. For example, the relationship can be understood as follows. In FIG. 17, when the viewpoint A moves to the position of the viewpoint C, the supported point to be supported by the substrate supporting surface that can be seen through the point B is the point C and the point C on the circumference 552 according to the law of reflection. It should be located on a straight line passing through point D and point B which are in a symmetrical relationship. According to the law of reflection, the angle formed by the straight line passing through the viewpoint C and the point B and the straight line passing through the point D and the point B with respect to the turning center line 550 in one plane including the turning center line 550. Because they are the same. Further, assuming a circumference 554 that is symmetrical to the circumference 552 with respect to the half mirror, the light from the substrate support surface at the position indicated by □ is as shown in FIG. In addition, on the circumference 554, it should proceed along a straight line connecting the point E and the point B located at the same position as the point D on the circumference 552. This is to imagine the relative position between the straight line CBE and the circumferences 552 and 554 when viewed in the direction from the circumference 552 to the circumference 554 (directions of arrows J and K) along the turning center line 550. You can understand. Since the relative positional relationship between the circumference 552 and the supported surface and the relative positional relationship between the circumference 554 and the supporting plane are the same, the intersection of the straight line BD and the supported surface, the straight line BE and the supporting plane The point of intersection is in a plane-symmetric relationship with the half mirror. That is, the supported point indicated by □ and the substrate support surface are symmetrical with respect to the half mirror, and the supported point and the center of the substrate support surface coincide with each other (position indicated by □). If the support member is disposed so that the substrate support surface is located, the support member is disposed at a position suitable for supporting the supported point indicated by the □ mark.
As described above, the support member is arranged with the center of the substrate support surface coinciding with the supported point in a state where the direction of the line of sight is inclined with respect to a plane parallel to the inclination direction of the half mirror and perpendicular to the half mirror. Even so, it is clear that the support member has been placed in the proper position.

それに対し、図15に二点鎖線で示すように、狭義の2等分平面を規定する支持平面を、その支持平面に対して直角な方向に移動させれば、ハーフミラーは、広義の2等分平面上に配置されることとなる。この場合、被支持点を、ハーフミラーが狭義の2等分平面上に配置される場合と同じ方向から見れば、△印で示す被支持点のように、像が被支持点の像と重なる基板支持面の中心点は、支持平面上において、ハーフミラーが狭義の2等分平面上に配置された場合の位置からずれる。しかし、被支持点の像を見る方向が一定であり、例えば、△印で示す被支持点を見る方向と平行な方向から、□印で示す被支持点の像を見れば、像がその被支持点の像と重なって見える基板支持面の中心点の支持平面上におけるずれの量および方向は、△印で示す被支持点に対する基板支持面の中心点と同じになる。○印で示す被支持点のように、△印および□印でそれぞれ示す被支持点の像の視認方向とは異なる方向から被支持点の像を見れば、基板支持面の中心点のずれ量が異なるのに対し、視認方向が一定であれば、いずれの被支持点を支持する支持部材の基板支持面についてもずれの量および方向が同じになり、複数の被支持点の相対位置関係と等しい相対位置関係を有する位置に複数の支持部材を配置することができ、それら被支持点を支持することができる基板支持装置が得られる。   On the other hand, as shown by a two-dot chain line in FIG. 15, if the support plane that defines the bisectoral plane in the narrow sense is moved in a direction perpendicular to the support plane, the half mirror becomes the second magnitude in the broad sense. It will be arranged on the division plane. In this case, when the supported point is viewed from the same direction as when the half mirror is arranged on a narrowly divided bisection plane, the image overlaps the image of the supported point as indicated by the Δ mark. The center point of the substrate support surface is deviated from the position when the half mirror is arranged on the narrowly divided bisection plane on the support plane. However, the direction in which the image of the supported point is viewed is constant. For example, if the image of the supported point indicated by □ is viewed from a direction parallel to the direction of viewing the supported point indicated by △, the image The amount and direction of the shift of the center point of the substrate support surface that appears to overlap the image of the support point on the support plane is the same as the center point of the substrate support surface with respect to the supported point indicated by Δ. If the image of the supported point is seen from a direction different from the viewing direction of the image of the supported point indicated by △ and □, such as the supported point indicated by ○, the amount of deviation of the center point of the substrate support surface However, if the viewing direction is constant, the amount and direction of displacement are the same for the substrate support surface of the support member that supports any supported point, and the relative positional relationship between the plurality of supported points A plurality of supporting members can be arranged at positions having the same relative positional relationship, and a substrate supporting apparatus capable of supporting these supported points is obtained.

この認識方向の一定化は、前記各実施例において説明した遮断フィルタ,入射光制限筒等により構成される認識方向限定装置,認識可能光限定装置により行うことができる。例えば、図1〜図6に示す実施例において、ハーフミラー60を広義の2等分平面上に配置しても、遮断フィルタ64による視認方向の限定により、複数の被支持点の像を平行な方向から見ることができ、複数の被支持点の相対位置関係と同じ関係を有する位置にバックアップピン16を配置することができる。この遮断フィルタ64により、被支持点および基板支持面44の認識方向が、それらに直角な方向に限定されるため、基板支持面44と、支持面14のバックアップピン16が載置される部分とが認識方向において同じ光路上に位置することとなり、ハーフミラー60が狭義の2等分平面上に位置する場合と同様に、バックアップピン16を、被支持面152と支持平面154との交線からの距離が、被支持点の交線からの距離と等しい位置に配置することができ、保持装置によるプリント基板86および支持台12の保持を単純にすることができる。
また、投光器からの光の投射によって支持部材配置点を指示する場合も同様に、ハーフミラーが広義の2等分平面上に位置するのであれば、投光方向を一定とすることにより、複数の被支持点をそれぞれ支持する支持部材の配置点を指示することができる。例えば、図8および図9に示す実施例において、レーザポインタ256のレーザビームの投光方向は一定であり、ハーフミラー252を広義の2等分平面上に位置させることができる。
The recognition direction can be made constant by the recognition direction limiting device and the recognizable light limiting device configured by the blocking filter, the incident light limiting cylinder, and the like described in the above embodiments. For example, in the embodiment shown in FIGS. 1 to 6, even if the half mirror 60 is arranged on a broadly divided bisection plane, the images of a plurality of supported points are parallel due to the limitation of the viewing direction by the blocking filter 64. The backup pin 16 can be arranged at a position that can be seen from the direction and has the same relationship as the relative positional relationship between the plurality of supported points. Because the blocking filter 64 limits the recognition direction of the supported point and the substrate support surface 44 to a direction perpendicular to them, the substrate support surface 44 and the portion on which the backup pin 16 of the support surface 14 is placed Are positioned on the same optical path in the recognition direction, and the backup pin 16 is separated from the line of intersection between the supported surface 152 and the support plane 154 in the same manner as when the half mirror 60 is positioned on the narrowly divided bisection plane. Can be arranged at a position equal to the distance from the line of intersection of the supported points, and the holding of the printed circuit board 86 and the support base 12 by the holding device can be simplified.
Similarly, when the support member placement point is indicated by projecting light from the projector, similarly, if the half mirror is positioned on a broadly divided bisection plane, a plurality of projection directions can be obtained by making the projection direction constant. It is possible to indicate the arrangement points of the supporting members that respectively support the supported points. For example, in the embodiment shown in FIGS. 8 and 9, the laser beam projection direction of the laser pointer 256 is constant, and the half mirror 252 can be positioned on a broadly divided bisection plane.

図19に示すように、被支持面と支持平面との成す角が鋭角の場合も同様であり、ハーフミラーが被支持面と支持平面との狭義の2等分平面上に配置される場合には、被支持点の像を認識する方向がいずれの方向であっても、像が被支持点の像と重なる基板支持面の中心の、被支持面と支持平面との交線からの距離が、被支持点のその交線からの距離に等しく、被支持点を支持すべき位置に支持部材を配置することができる。また、ハーフミラーが広義の2等分平面上に配置される場合には、複数の被支持点の各像の認識方向が異なっていれば、像が被支持点の像と重なって見える基板支持面の中心のずれ量がそれぞれ異なり、複数の被支持点間の相対位置関係と同じ相対位置関係を有する位置に支持部材を配置することができないが、認識方向を一定とすれば、ずれ量が等しくなり、支持部材を被支持点を支持することができる位置に配置することができる。   As shown in FIG. 19, the same applies to the case where the angle formed by the supported surface and the support plane is an acute angle, and when the half mirror is arranged on a bisected plane in a narrow sense between the supported surface and the support plane. The distance from the intersection of the supported surface and the support plane at the center of the substrate support surface where the image overlaps the image of the supported point is the same regardless of the direction in which the image of the supported point is recognized. The support member can be disposed at a position equal to the distance of the supported point from the intersection line and to support the supported point. Further, when the half mirror is arranged on a broadly divided bisection plane, if the recognition direction of each image of a plurality of supported points is different, the substrate support appears to overlap the image of the supported point. The amount of deviation at the center of the surface is different, and the support member cannot be placed at a position having the same relative positional relationship as the relative positional relationship between the plurality of supported points. And the support member can be disposed at a position where the supported point can be supported.

図20に示すように、被支持面と支持平面との成す角が鈍角の場合も同様であり、ハーフミラーが被支持面と支持平面との狭義の2等分平面上に配置される場合には、複数の被支持点の各像をそれぞれ異なる方向から見ても、被支持面と支持平面との交線からの距離が被支持点と等しい位置に基板支持面の中心が位置する位置に支持部材を配置することができる。図示は省略するが、ハーフミラーが広義の2等分平面上に配置される場合、認識方向を一定とすることにより、複数の支持部材を被支持点に対応する配置点に配置することができる。   As shown in FIG. 20, the same applies to the case where the angle formed by the supported surface and the support plane is an obtuse angle, and when the half mirror is arranged on a narrowly divided bisection plane between the supported surface and the support plane. Is a position where the center of the substrate support surface is located at a position where the distance from the line of intersection between the supported surface and the support plane is equal to the supported point even when each image of the plurality of supported points is viewed from different directions. A support member can be disposed. Although illustration is omitted, when the half mirror is arranged on a broadly divided bisection plane, a plurality of supporting members can be arranged at arrangement points corresponding to the supported points by making the recognition direction constant. .

なお、上記各実施例において、ハーフミラーを透過する透過光により形成される像およびハーフミラーの反射による反射光により形成される像は、作業者が直接見ることにより、認識されるようにされていたが、認識装置として、例えば、撮像装置を使用し、撮像によって認識されるようにしてもよい。撮像装置として、例えば、面撮像装置の一種であるCCDカメラが用いられる。例えば、図1ないし図6に示す支援装置8において撮像装置に像を認識させる場合、撮像装置を、その撮像面が支持台保持部70に平行となり、撮像軸線が直角となるよう配置し、移動装置により、撮像装置を支持面14に平行な一平面内において任意の位置へ移動させ、ハーフミラー60を経て形成された像を順次撮像させる。撮像装置の撮像により得られた像を表示装置に表示させ、作業者は、その表示を見つつ被支持点と重なって基板支持面44が表示される位置にバックアップピン16を置く。撮像装置によれば、作業者の視認範囲が撮像範囲に限定される。撮像装置自体が認識点限定装置、認識方向限定装置、認識可能光限定装置として機能するのであり、例えば、図13および図14に示すように、被支持面152と支持平面154とが平行に設けられる場合、撮像装置を、撮像軸線が被支持面152および支持平面154と平行になるように設けることにより、認識方向が限定され、被支持点周辺および基板支持面をそれらに直角な方向から見ることができる。また、被支持点から、被支持面に対する法線の方向に反射された光がハーフミラーに入射するまでの光路と、基板支持面から支持平面に対する法線の方向に反射された光がハーフミラーに入射するまでの光路とが同じ長さにされることにより、撮像装置は、被支持点周辺および基板支持面のいずれについても焦点が合った状態で撮像することができ、それらの一致を正確に判断することができる。   In each of the above embodiments, the image formed by the transmitted light that passes through the half mirror and the image formed by the reflected light by the reflection of the half mirror are recognized by the operator looking directly. However, for example, an imaging device may be used as the recognition device, and the recognition device may be recognized by imaging. As the imaging device, for example, a CCD camera which is a kind of surface imaging device is used. For example, when the image capturing apparatus recognizes an image in the support apparatus 8 shown in FIGS. 1 to 6, the image capturing apparatus is arranged so that the image capturing surface thereof is parallel to the support base holding unit 70 and the image capturing axis is perpendicular to the image capturing apparatus. The image pickup device is moved to an arbitrary position in a plane parallel to the support surface 14 by the apparatus, and images formed through the half mirror 60 are sequentially picked up. An image obtained by imaging by the imaging device is displayed on the display device, and the operator puts the backup pin 16 at a position where the substrate support surface 44 is displayed while overlapping the supported point while viewing the display. According to the imaging device, the worker's visible range is limited to the imaging range. The imaging device itself functions as a recognition point limiting device, a recognition direction limiting device, and a recognizable light limiting device. For example, as shown in FIGS. 13 and 14, a supported surface 152 and a support plane 154 are provided in parallel. In such a case, by providing the imaging device so that the imaging axis is parallel to the supported surface 152 and the supporting plane 154, the recognition direction is limited, and the periphery of the supported point and the substrate supporting surface are viewed from a direction perpendicular to them. be able to. Further, the light path from the supported point until the light reflected in the direction of the normal to the supported surface enters the half mirror, and the light reflected from the substrate support surface in the direction of the normal to the support plane is the half mirror. By making the optical path to enter the same length, the imaging device can take an image with both the periphery of the supported point and the substrate support surface in focus, and the coincidence can be accurately determined. Can be judged.

像と共に、視野の中心を表すマークが認識されるようにしてもよい。例えば、像を撮像装置によって認識する場合、表示装置の表示画面の中心に、撮像中心を表すマーク、例えば、十字線が撮像により得られた像と共に表示されるようにし、撮像装置に、被支持点が撮像中心と一致する状態で被支持面を撮像させる。そして、基板支持面の中心が十字線の交点に位置するようにバックアップピンを支持面上に置く。撮像中心を表すマークが表示される場合は、被支持面と支持平面とを交替で照明し、一方の像のみが撮像され、表示されるようにしてもよい。   A mark representing the center of the field of view may be recognized together with the image. For example, when an image is recognized by the imaging device, a mark representing the imaging center, for example, a crosshair is displayed together with the image obtained by imaging at the center of the display screen of the display device, and the imaging device supports The supported surface is imaged with the point coincident with the imaging center. Then, the backup pin is placed on the support surface so that the center of the substrate support surface is located at the intersection of the cross lines. When a mark representing the imaging center is displayed, the supported surface and the support plane may be alternately illuminated so that only one image is captured and displayed.

作業者が直に目によって像を認識する場合でも、視野中心マークを設けることは有効である。例えば、図10〜図12に示す実施例において、ハーフミラー332の中心に十字線を設け、あるいは図13,図14に示す各実施例においてハーフミラー402,504の中心に十字線を設け、十字線と被支持点とが一致する位置へハーフミラー332,402,504を移動させ、支持面14の、基板支持面44の中心が十字線と一致する位置にバックアップピン16を置く。この場合、被支持点が十字線により教示されるため、視認範囲は比較的広く設定することができ、被支持可能領域を探し易い。また、図13,図14に示す各支援装置400,470におけるように、支持面14と被支持面152とをそれぞれ照明装置440,442によって照明し、照明を選択的に行う場合に特に有効である。十字線により被支持点の位置が記憶され、ピン配置点が正確に教示されるため、バックアップピン16の配置時に被支持点が認識されなくてもバックアップピンを正確に配置することができるからである。被支持面152のみおよび支持面14のみに光が照射されることにより、他方の面の像に邪魔されることなく、被支持点を探し、バックアップピン16を配置することができる。   Even when an operator recognizes an image directly with eyes, it is effective to provide a visual field center mark. For example, in the embodiment shown in FIGS. 10 to 12, a crosshair is provided at the center of the half mirror 332, or in each embodiment shown in FIGS. 13 and 14, a crosshair is provided at the center of the half mirrors 402 and 504. The half mirrors 332, 402, and 504 are moved to a position where the line and the supported point coincide with each other, and the backup pin 16 is placed on the support surface 14 at a position where the center of the substrate support surface 44 coincides with the cross line. In this case, since the supported point is taught by a crosshair, the viewing range can be set relatively wide, and it is easy to find the supported region. Further, as in each of the support devices 400 and 470 shown in FIGS. 13 and 14, the support surface 14 and the supported surface 152 are illuminated by the illumination devices 440 and 442, respectively, and are particularly effective when the illumination is selectively performed. is there. Since the position of the supported point is stored by the cross line and the pin placement point is accurately taught, the backup pin can be accurately placed even if the supported point is not recognized when the backup pin 16 is placed. is there. By irradiating only the supported surface 152 and only the supporting surface 14 with light, the backup pin 16 can be arranged by searching for the supported point without being disturbed by the image of the other surface.

被支持点の像と支持部材の基板支持面の像とを認識可能な位置、認識可能な方向、認識可能な光の限定に筒を用いる場合、筒を長いものとすれば、位置を固定して設けられた保持装置に対峙する作業者と筒の先端、すなわち筒の作業者が覗き込む側とは反対側の端との距離が長くなっても、覗き込み側端と作業者との距離が遠くなり過ぎず、覗き込みが容易である。この場合、例えば、複数の筒部材を互いに摺動可能に嵌合して、筒を伸縮可能なものとすれば、筒が作業者に近づく側へ移動させられるときには筒を収縮させ、作業者から離れる側へ移動させられるときには筒を伸長させることにより、作業者は、筒の中心線に平行な方向において常にほぼ同じ位置において筒を覗き込むことができる。筒を保持する保持部材を伸縮可能な部材としてもよい。   If the cylinder is used to limit the position, recognizable direction, and recognizable light for recognizing the image of the supported point and the image of the substrate support surface of the support member, the position can be fixed if the cylinder is long. Even if the distance between the worker facing the holding device provided and the tip of the tube, that is, the end opposite to the side on which the worker looks into the tube is long, the distance between the looking side end and the worker Is not too far away and easy to look into. In this case, for example, if a plurality of cylinder members are slidably fitted to each other and the cylinder can be expanded and contracted, the cylinder is contracted when the cylinder is moved closer to the operator, By extending the cylinder when moved to the away side, the operator can always look into the cylinder at substantially the same position in the direction parallel to the center line of the cylinder. The holding member that holds the cylinder may be a member that can be expanded and contracted.

また、筒を用いる場合、ハーフミラーは筒と共に設けるのに限らず、筒を用いない場合と同様に、被支持面全体および支持面全体をそれぞれ、同時に見ることができる1枚の大きいハーフミラーとしてもよい。   In addition, when using a cylinder, the half mirror is not limited to be provided together with the cylinder, and as with a case where no cylinder is used, the entire supported surface and the entire supporting surface can be viewed simultaneously as a single large half mirror. Also good.

さらに、図1〜図6および図7に示す各実施例において、遮断フィルタ64,202を省略してもよい。   Further, in each of the embodiments shown in FIGS. 1 to 6 and FIG. 7, the cutoff filters 64 and 202 may be omitted.

また、図1〜図6および図7に示す各実施例に示すように、保持装置62を、非使用状態においては、使用状態におけるよりコンパクトな状態にたたむことができるようにすれば、収納等に便利であり、例えば、図1に示す保持装置62において更に、第2保持部材68および第1保持部材66の支持台保持部70とミラー保持部72とがたたまれて合わされるようにしてもよい。図8〜図9,図10〜図12,図13および図14に示す各実施例においても保持装置が、非使用状態においては使用状態におけるよりコンパクトな状態にたたまれるように構成されてもよく、図1〜図6および図7に示す各実施例において保持装置が使用状態のままとされ、支持台保持部と基板取付面とが固定的に直角に設けられるようにしてもよい。   In addition, as shown in each embodiment shown in FIGS. 1 to 6 and FIG. 7, if the holding device 62 can be folded into a more compact state in the use state in the non-use state, the storage device etc. For example, in the holding device 62 shown in FIG. 1, the support holding unit 70 and the mirror holding unit 72 of the second holding member 68 and the first holding member 66 are further folded and combined. Also good. 8 to 9, FIG. 10 to FIG. 12, FIG. 13 and FIG. 14, the holding device may be configured to be folded into a more compact state in the use state when not in use. In addition, in each embodiment shown in FIGS. 1 to 6 and FIG. 7, the holding device may be left in use, and the support base holding portion and the substrate mounting surface may be fixedly provided at a right angle.

さらに、図13および図14に示す各支援装置400,470におけるように、プリント基板が水平で下向きの状態に保持されるとき、基板保持部に負圧を供給し、基板取付面に形成された負圧供給孔から空気を吸引し、回路基板が基板取付面に負圧により吸着されて保持されるようにしてもよい。   Further, as in each of the support devices 400 and 470 shown in FIGS. 13 and 14, when the printed circuit board is held in a horizontal and downward state, negative pressure is supplied to the board holding portion and formed on the board mounting surface. Air may be sucked from the negative pressure supply hole so that the circuit board is attracted and held by the negative pressure on the board mounting surface.

また、本発明に係る組立方法および支援装置により、プリント基板の両面の一方であって、電子回路部品が装着されていない面を被支持面として支持部材により支持する装置を組み立て、その組立を支援することができる。プリント基板の電子回路部品が装着されていない面には、例えば、配線パターンが形成され、電子回路部品の装着が予定されているが、まだ電子回路部品が装着されていない面、あるいは両面のうちの一方の面のみに電子回路部品が装着されるプリント基板の電子回路部品が装着されない側の面がある。プリント基板の配線パターンが形成された面を支持部材により支持するにあたり、配線パターンを避けて支持することが望ましい場合、あるいは配線パターンを避けて支持することが必要な場合、その配線パターンの形成状態を表す表示面を有する配線パターン表示体を、部品配置表示体に替えて、部品配置表示体と同様に、基板支持装置の組立,組立の支援に使用する。プリント基板の電子回路部品が装着されず、配線パターンが形成されていない面でも、例えば、凸部と凹部との少なくとも一方があって、それを避けてプリント基板を支持することが必要な場合、プリント基板の被支持面の凹凸を表す表示面を有する凹凸表示体を、部品配置表示体に替えて、部品配置表示体と同様に、基板支持装置の組立,組立の支援に使用する。配線パターン表示体および凹凸表示体はそれぞれ、プリント基板の被支持面の状態を表す被支持面状態表示体であり、被支持面状態表示体として、例えば、プリント基板自体あるいはプリント基板の被支持面を表す画像を使用することができる。部品配置表示体も被支持面状態表示体の一種である。   In addition, the assembly method and support device according to the present invention assembles a device that supports one of the both sides of the printed circuit board on which the electronic circuit component is not mounted as a supported surface by a support member, and supports the assembly. can do. For example, a wiring pattern is formed on the surface of the printed circuit board on which the electronic circuit component is not mounted, and the mounting of the electronic circuit component is planned. There is a surface on the side of the printed circuit board on which the electronic circuit component is not mounted on only one surface of the printed circuit board. When it is desirable to support the circuit board on which the wiring pattern is formed, avoiding the wiring pattern, or when it is necessary to support it without the wiring pattern, the state of the wiring pattern formation A wiring pattern display body having a display surface representing the circuit board is used in place of the component arrangement display body for the assembly of the substrate support device and the assembly support in the same manner as the component arrangement display body. Even if the electronic circuit component of the printed circuit board is not mounted and the wiring pattern is not formed, for example, when there is at least one of a convex part and a concave part and it is necessary to support the printed circuit board avoiding it, An uneven display body having a display surface representing the unevenness of the supported surface of the printed circuit board is used to support the assembly and assembly of the board support device in the same manner as the component arrangement display body, instead of the component arrangement display body. Each of the wiring pattern display body and the concavo-convex display body is a supported surface state display body that represents the state of the supported surface of the printed circuit board. As the supported surface state display body, for example, the printed circuit board itself or the supported surface of the printed circuit board An image representing can be used. The component arrangement display body is also a kind of supported surface state display body.

請求可能発明の一実施例である基板支持装置組立支援装置,プリント基板および基板支持装置を示す分解斜視図である。It is a disassembled perspective view which shows the board | substrate support apparatus assembly assistance apparatus which is one Example of claimable invention, a printed circuit board, and a board | substrate support apparatus. 図1に示す基板支持装置組立支援装置を示す側面図である。It is a side view which shows the board | substrate support apparatus assembly assistance apparatus shown in FIG. 図1に示す基板支持装置組立支援装置を示す斜視図である。It is a perspective view which shows the board | substrate support apparatus assembly assistance apparatus shown in FIG. 図1に示す基板支持装置組立支援装置の遮断フィルタを概略的に示す側面図である。It is a side view which shows roughly the interruption | blocking filter of the board | substrate support apparatus assembly assistance apparatus shown in FIG. 図4に示す遮断フィルタを概略的に示す平面図である。FIG. 5 is a plan view schematically showing the cutoff filter shown in FIG. 4. 図4に示す遮断フィルタを通してハーフミラーを見た状態を示す平面図である。It is a top view which shows the state which looked at the half mirror through the cutoff filter shown in FIG. 別の実施例である基板支持装置組立支援装置を示す側面図である。It is a side view which shows the board | substrate support apparatus assembly assistance apparatus which is another Example. 更に別の実施例である基板支持装置組立支援装置を示す斜視図である。It is a perspective view which shows the board | substrate support apparatus assembly assistance apparatus which is another Example. 図8に示す基板支持装置組立支援装置を示す側面図である。It is a side view which shows the board | substrate support apparatus assembly assistance apparatus shown in FIG. 更に別の実施例である基板支持装置組立支援装置を示す斜視図である。It is a perspective view which shows the board | substrate support apparatus assembly assistance apparatus which is another Example. 図10に示す基板支持装置組立支援装置の入射光制限筒を示す側面断面図である。It is side surface sectional drawing which shows the incident light restriction | limiting cylinder of the board | substrate support apparatus assembly assistance apparatus shown in FIG. 図10に示す基板支持装置組立支援装置を示す側面図である。It is a side view which shows the board | substrate support apparatus assembly assistance apparatus shown in FIG. 更に別の実施例である基板支持装置組立支援装置を概略的に示す側面図(一部断面)である。It is a side view (partial cross section) which shows schematically the board | substrate support apparatus assembly assistance apparatus which is another Example. 更に別の実施例である基板支持装置組立支援装置を概略的に示す側面図(一部断面)である。It is a side view (partial cross section) which shows schematically the board | substrate support apparatus assembly assistance apparatus which is another Example. 互いに直交する状態で設けられた被支持面と支持平面との狭義の2等分平面上にハーフミラーを配置した場合における被支持点および基板支持面の各像の認識方向および広義の2等分平面上にハーフミラーを配置した場合における被支持点および基板支持面の各像の認識方向を概念的に説明する図である。The recognition direction of each image of the supported point and the substrate support surface and the bisection in a broad sense when a half mirror is arranged on the bisection plane in a narrow sense of the supported surface and the support plane provided in a state orthogonal to each other It is a figure which illustrates notionally the recognition direction of each image of a to-be-supported point and a board | substrate support surface at the time of arrange | positioning a half mirror on a plane. 被支持点および基板支持面の各像を、被支持面と支持平面との交線に直角な平面に対して傾斜した方向から認識する場合を、その直角な平面に対して直角な方向から概念的に説明する図である。When recognizing each image of the supported point and the substrate support surface from a direction inclined with respect to a plane perpendicular to the line of intersection between the supported surface and the support plane, it is a concept from a direction perpendicular to the perpendicular plane. FIG. 図16におけるJ矢視図である。It is a J arrow line view in FIG. 図16におけるK矢視図である。It is a K arrow line view in FIG. 鋭角を成す状態で設けられた被支持面と支持平面との狭義の2等分平面上にハーフミラーを配置した場合における被支持点および基板支持面の各像の認識方向および広義の2等分平面上にハーフミラーを配置した場合における被支持点および基板支持面の各像の認識方向を概念的に説明する図である。The recognition direction of each image on the supported point and the substrate supporting surface and the bisecting in a broad sense when a half mirror is arranged on a narrowly bisecting plane between the supported surface and the supporting plane provided in an acute angle state. It is a figure which illustrates notionally the recognition direction of each image of a to-be-supported point and a board | substrate support surface at the time of arrange | positioning a half mirror on a plane. 鈍角を成す状態で設けられた被支持面と支持平面との狭義の2等分平面上にハーフミラーを配置した場合における被支持点および基板支持面の各像の認識方向を概念的に説明する図である。The recognition direction of each image of a supported point and a substrate support surface when a half mirror is arranged on a bisector plane in a narrow sense between a supported surface and a support plane provided in an obtuse angle will be conceptually described. FIG.

符号の説明Explanation of symbols

8:基板支持装置組立支援装置 10:基板支持装置 12:支持台 14:支持部材支持面 16:バックアップピン 44:基板支持面 60:ハーフミラー 62:保持装置 64:遮断フィルタ 86:プリント基板 150:電子回路部品 152:被支持面 200:基板支持装置組立支援装置 202:遮断フィルタ 204:ハーフミラー 212:拡大レンズ 250:基板支持装置組立支援装置 252:ハーフミラー 254:保持装置 256:レーザポインタ 258:レーザポインタ移動装置 330:基板支持装置組立支援装置 332:ハーフミラー 334:保持装置 336:認識方向限定装置 337:移動装置 338:入射光制限筒 356:拡大レンズ 400:基板支持装置組立支援装置 402:ハーフミラー 404:保持装置 406:導光装置 408:認識可能光限定装置 430:入射光制限筒 432:拡大レンズ 470:基板支持装置組立支援装置 472:保持装置 500:導光装置 511:認識可能光限定装置 512:入射光制限筒 514:拡大レンズ   8: Substrate support device assembly support device 10: Substrate support device 12: Support base 14: Support member support surface 16: Backup pin 44: Substrate support surface 60: Half mirror 62: Holding device 64: Cutoff filter 86: Printed circuit board 150: Electronic circuit component 152: Supported surface 200: Substrate support device assembly support device 202: Cutoff filter 204: Half mirror 212: Magnifying lens 250: Substrate support device assembly support device 252: Half mirror 254: Holding device 256: Laser pointer 258: Laser pointer moving device 330: Substrate support device assembly support device 332: Half mirror 334: Holding device 336: Recognition direction limiting device 337: Moving device 338: Incident light limiting cylinder 356: Magnifying lens 400: Substrate support Device assembly support device 402: Half mirror 404: Holding device 406: Light guide device 408: Recognizable light limiting device 430: Incident light limiting cylinder 432: Magnifying lens 470: Substrate support device assembly support device 472: Holding device 500: Light guide Device 511: Recognizable light limiting device 512: Incident light limiting tube 514: Magnifying lens

Claims (11)

支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置を組み立てる方法であって、
前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す配置表示面を有する部品配置表示体と、前記支持台とを、(a)前記配置表示面と、(b)前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに0度以上180度以下の角度を成す姿勢で配置するとともに、それら配置表示面と支持平面との間にハーフミラーを配置し、そのハーフミラー上の1点を透過する光の光路である第1光路と前記ハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の前記共通光路部上にその共通光路部に沿って線状の光を投射する投光器を配置し、その投光器から投射される線状の光が前記ハーフミラーを透過して、前記配置表示面の前記支持部材により支持されるべき箇所の中心である被支持点と前記支持平面上の前記基板支持面の中心との一方に入射するとともに、前記ハーフミラーにより反射されて前記部品配置表示体の前記被支持点と前記支持平面上の前記基板支持面の中心との他方に入射する状態で、前記支持部材を前記支持台に配置固定することを特徴とする基板支持装置組立方法。
A method of assembling a substrate support device in which a support member is arranged and fixed on a support base, and supports a supported surface that is one of both surfaces of a printed circuit board by a substrate support surface at the tip of the support member,
A component arrangement display body having an arrangement display surface representing an arrangement of at least electronic circuit components on a supported surface of the printed circuit board, and the support base, (a) the arrangement display surface, and (b) the support base If the support member is arranged and fixed, the substrate support surface of the support member is arranged in a posture that forms an angle of 0 degrees or more and 180 degrees or less with respect to the support plane on which the substrate support surface is located, and the arrangement display surface A half mirror is disposed between the first mirror and the support plane, and a first optical path which is an optical path of light passing through one point on the half mirror and an optical path of light reflected at the one point on the half mirror. Projector for projecting linear light along the common optical path part onto the common optical path part of two optical paths that form a common optical path part that is a part that extends in parallel and overlaps with each other. Place that And linear light projected from the optical unit is transmitted through the half mirror, the substrate supporting surface on the support surface and the support point which is the center of the portion to be supported by the support member of the arrangement display surface In the state of being incident on the other of the supported point of the component arrangement display body and the center of the substrate support surface on the support plane after being reflected by the half mirror. A substrate supporting apparatus assembling method, wherein a member is arranged and fixed on the supporting base.
支持台のバックアップピン支持面上にバックアップピンが直角に立設された状態で配置固定され、そのバックアップピンの先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置を組み立てる方法であって、A substrate that is placed and fixed in a state in which the backup pin is erected at right angles on the backup pin support surface of the support base, and that supports the supported surface that is one of both sides of the printed circuit board by the substrate support surface at the tip of the backup pin. A method of assembling a support device,
前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す配置表示面を有する部品配置表示体と、前記支持台とを、(a)前記配置表示面と、(b)前記支持台に前記バックアップピンが配置固定されればそのバックアップピンの前記基板支持面がその上に位置する平面であって前記バックアップピン支持面から上方に離れた支持平面とが互いに交差する状態で配置するとともに、それら配置表示面と支持平面との成す角を2等分するとともに配置表示面と支持平面との交線を含む平面上にハーフミラーを配置し、そのハーフミラー上の1点を透過する光の光路である第1光路と前記ハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記バックアップピンにより支持されるべき箇所の中心である被支持点を通過するとともに、前記2つの光路の他方の上に前記バックアップピンの前記基板支持面の中心が位置する状態で、そのバックアップピンを前記バックアップピン支持面に配置固定する基板支持装置組立方法。A component arrangement display body having an arrangement display surface representing an arrangement of at least electronic circuit components on a supported surface of the printed circuit board, and the support base, (a) the arrangement display surface, and (b) the support base If the backup pins are arranged and fixed, the backup pins are arranged in a state where the substrate support surface of the backup pins is a plane located thereon and the support planes spaced upward from the backup pin support surface intersect each other, and The angle between the arrangement display surface and the support plane is divided into two equal parts, a half mirror is arranged on a plane including the intersection line of the arrangement display surface and the support plane, and the optical path of light passing through one point on the half mirror A first optical path that is a second optical path that is an optical path of light reflected at the one point on the half mirror, and a common optical path that is a part that extends in parallel and overlaps with each other. One of the two optical paths formed passes through a supported point that is the center of the place to be supported by the backup pin on the arrangement display surface, and the substrate of the backup pin is on the other of the two optical paths. A substrate support device assembling method for arranging and fixing the backup pin on the backup pin support surface in a state where the center of the support surface is located.
前記バックアップピンが、横断面形状が円形を成し、前記支持台に固定されるストレートな円柱状の取付部と、取付部の軸方向の一端部に設けられ、先端ほど直径が直線的に減少するテーパ状の支持部とを備え、支持部の先端が円形の基板支持面を構成するものであり、そのバックアップピンを前記支持台に複数配置固定する請求項2に記載の基板支持装置組立方法。The backup pin has a circular cross-sectional shape and is provided at a straight cylindrical mounting portion fixed to the support base and one end portion in the axial direction of the mounting portion, and the diameter decreases linearly toward the tip. 3. A substrate support apparatus assembling method according to claim 2, wherein a plurality of back-up pins are arranged and fixed to the support base. . 支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置であって、
ハーフミラーと、
線状の光を投光する投光器と、
それらハーフミラーおよび投光器と、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と、前記支持台とを保持する保持装置と
を含み、その保持装置が、
(a)前記部品配置表示体の配置表示面と、(b)前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに0度以上180度以下の角度を成すとともに、それら配置表示面と支持平面との間にハーフミラーが位置し、そのハーフミラー上の1点を透過する光の光路である第1光路とそのハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記支持部材により支持されるべき箇所の中心である被支持点を通過するとき、前記2つの光路の他方の上に前記支持部材の前記基板支持面の中心が位置することとなる相対位置に、前記ハーフミラー,前記部品配置表示体および前記支持台を保持するとともに、前記投光器を、前記共通光路部に位置してその共通光路部に平行に前記線状の光を投射可能に保持するものである基板支持装置組立支援装置。
A support member is arranged and fixed on a support base, and the substrate support surface at the tip of the support member supports an assembly operation of a substrate support device that supports a supported surface that is one of both surfaces of a printed circuit board,
Half mirror,
A projector that projects linear light;
These half mirrors and projectors, a component arrangement display body that represents the arrangement of at least electronic circuit components on the supported surface of the printed circuit board, and a holding device that holds the support base, the holding device,
(a) an arrangement display surface of the component arrangement display body; and (b) a support plane which is a plane on which the substrate support surface of the support member is positioned if the support member is arranged and fixed to the support base. Are formed at an angle of 0 degrees to 180 degrees with each other, a half mirror is positioned between the arrangement display surface and the support plane, and a first optical path which is an optical path of light passing through one point on the half mirror; One of the two optical paths forming a common optical path portion, which is a second optical path that is an optical path of light reflected at the one point on the half mirror, and that partially extends and overlaps each other, The center of the substrate support surface of the support member is positioned on the other of the two optical paths when passing through a supported point which is the center of the portion to be supported by the support member of the arrangement display surface; In the relative position The half mirror, the component arrangement display body, and the support base are held , and the projector is positioned so as to be able to project the linear light in parallel with the common optical path portion. Substrate support device assembly support device.
前記保持装置が、前記ハーフミラー,前記部品配置表示体および前記支持台を、前記配置表示面と前記支持平面とが互いに交差し、それら配置表示面と支持平面との成す角を2等分するとともに配置表示面と支持平面との交線を含む平面またはその平面に平行な平面
上に前記ハーフミラーが位置する状態に保持する請求項4に記載の基板支持装置組立支援装置。
The holding device divides the half mirror, the component arrangement display body, and the support base into two equal angles between the arrangement display surface and the support plane, with the arrangement display surface and the support plane intersecting each other. 5. The substrate support apparatus assembly support apparatus according to claim 4 , wherein the half mirror is held in a state where the half mirror is positioned on a plane including an intersection line between the arrangement display surface and the support plane or a plane parallel to the plane.
支持台に支持部材が配置固定され、その支持部材の先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置であって、
ハーフミラーと、
そのハーフミラーと、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と、前記支持台とを保持する保持装置と
を含み、その保持装置が、
(a)前記部品配置表示体の配置表示面と、(b)前記支持台に前記支持部材が配置固定されればその支持部材の前記基板支持面がその上に位置する平面である支持平面とが互いに0度以上180度以下の角度を成すとともに、それら配置表示面と支持平面との間にハーフミラーが位置し、そのハーフミラー上の1点を透過する光の光路である第1光路とそのハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記支持部材により支持されるべき箇所の中心である被支持点を通過するとき、前記2つの光路の他方の上に前記支持部材の前記基板支持面の中心が位置することとなる相対位置に、前記ハーフミラー,前記部品配置表示体および前記支持台を保持するものであり、
かつ、当該基板支持装置組立支援装置が、前記被支持点の像とその被支持点を支持すべき支持部材の基板支持面の像とを認識可能な方向を一定方向に限定する認識方向限定装置を含む基板支持装置組立支援装置。
A support member is arranged and fixed on a support base, and the substrate support surface at the tip of the support member supports an assembly operation of a substrate support device that supports a supported surface that is one of both surfaces of a printed circuit board,
Half mirror,
Including the half mirror, a component arrangement display body that represents the arrangement of at least electronic circuit components on the supported surface of the printed circuit board, and a holding device that holds the support base.
(a) an arrangement display surface of the component arrangement display body; and (b) a support plane which is a plane on which the substrate support surface of the support member is positioned if the support member is arranged and fixed to the support base. Are formed at an angle of 0 degrees to 180 degrees with each other, a half mirror is positioned between the arrangement display surface and the support plane, and a first optical path which is an optical path of light passing through one point on the half mirror; One of the two optical paths forming a common optical path portion, which is a second optical path that is an optical path of light reflected at the one point on the half mirror, and that partially extends and overlaps each other, The center of the substrate support surface of the support member is positioned on the other of the two optical paths when passing through a supported point which is the center of the portion to be supported by the support member of the arrangement display surface; In the relative position Holding a half mirror, the component arrangement display body and the support base ;
A recognition direction limiting device that limits the direction in which the substrate support device assembly support device can recognize the image of the supported point and the image of the substrate support surface of the support member that should support the supported point to a certain direction. A substrate support apparatus assembly support apparatus including:
前記保持装置が、前記ハーフミラー,前記部品配置表示体および前記支持台を、前記配置表示面と前記支持平面とが互いに交差し、それら配置表示面と支持平面との成す角を2等分するとともに配置表示面と支持平面との交線を含む平面またはその平面に平行な平面
上に前記ハーフミラーが位置する状態に保持する請求項6に記載の基板支持装置組立支援装置。
The holding device divides the half mirror, the component arrangement display body, and the support base into two equal angles between the arrangement display surface and the support plane, with the arrangement display surface and the support plane intersecting each other. The substrate support apparatus assembly support apparatus according to claim 6 , wherein the half mirror is held in a state where the half mirror is positioned on a plane including an intersection line between the arrangement display surface and the support plane or a plane parallel to the plane.
前記保持装置が、前記ハーフミラー,前記部品配置表示体および前記支持台を、前記配置表示面と前記支持平面とが互いに平行に延びかつ互いに対向するとともに、前記ハーフミラーがそれら配置表示面および支持平面と45度の角度を成す傾斜姿勢となり、かつ、前記2つの光路の前記一方が前記被支持点を前記配置表示面に直角な方向に通過する状態に保持する請求項6に記載の基板支持装置組立支援装置。 The holding device includes the half mirror, the component arrangement display body, and the support base. The arrangement display surface and the support plane extend in parallel with each other and face each other, and the half mirror includes the arrangement display surface and support. The substrate support according to claim 6 , wherein the substrate support is in an inclined posture that forms an angle of 45 degrees with a plane, and the one of the two optical paths holds the supported point in a state perpendicular to the arrangement display surface. Device assembly support device. 前記認識方向限定装置が、特定の方向から入射する光は透過させるが、他の方向から入射する光は遮断する遮断フィルタを含む請求項6ないし8のいずれかに記載の基板支持装置組立支援装置。 9. The substrate support device assembly support device according to claim 6, wherein the recognition direction limiting device includes a blocking filter that transmits light incident from a specific direction but blocks light incident from another direction. . 前記認識方向限定装置が、
認識点に入射する光を設定角度以内の光に制限する入射光制限筒と、
その入射光制限筒をその入射光制限筒の軸線と交差する方向に移動させる制限筒移動装置と
を含む請求項6ないし8のいずれかに記載の基板支持装置組立支援装置。
The recognition direction limiting device is
An incident light limiting cylinder that limits light incident on the recognition point to light within a set angle;
The substrate support apparatus assembly support apparatus according to claim 6 , further comprising: a restriction cylinder moving device that moves the incident light restriction cylinder in a direction intersecting the axis of the incident light restriction cylinder.
支持台のバックアップピン支持面上にバックアップピンが直角に立設された状態で配置固定され、そのバックアップピンの先端の基板支持面により、プリント基板の両面の一方である被支持面を支持する基板支持装置の組立作業を支援する装置であって、A substrate that is placed and fixed in a state in which the backup pin is erected at right angles on the backup pin support surface of the support base, and that supports the supported surface that is one of both sides of the printed circuit board by the substrate support surface at the tip of the backup pin. A device that supports the assembly work of the support device,
ハーフミラーと、Half mirror,
そのハーフミラーと、前記プリント基板の被支持面の少なくとも電子回路部品の配置を表す部品配置表示体と、前記支持台とを保持する保持装置とThe half mirror, a component arrangement display body that represents the arrangement of at least electronic circuit components on the supported surface of the printed circuit board, and a holding device that holds the support base
を含み、その保持装置が、And the holding device is
(a)前記部品配置表示体の配置表示面と、(b)前記支持台に前記バックアップピンが配置固定されればそのバックアップピンの前記基板支持面がその上に位置する平面であって前記バックアップピン支持面から上方に離れた支持平面とが互いに交差し、それら配置表示面と支持平面との成す角を2等分するとともに配置表示面と支持平面との交線を含む平面上に前記ハーフミラーが位置し、そのハーフミラー上の1点を透過する光の光路である第1光路とそのハーフミラー上の前記1点において反射される光の光路である第2光路とであって、一部において互いに平行に延びかつ重なり合う部分である共通光路部を形成する2つの光路の一方が、前記配置表示面の前記バックアップピンにより支持されるべき箇所の中心である被支持点を通過するとき、前記2つの光路の他方の上に前記バックアップピンの前記基板支持面の中心が位置することとなる相対位置に、前記ハーフミラー,前記部品配置表示体および前記支持台を保持するものである基板支持装置組立支援装置。(a) an arrangement display surface of the component arrangement display body, and (b) if the backup pin is arranged and fixed on the support base, the substrate support surface of the backup pin is a plane located thereon, and the backup The support planes spaced upward from the pin support surface intersect with each other, the angle formed by the arrangement display surface and the support plane is divided into two equal parts, and the half on the plane including the intersection line of the arrangement display surface and the support plane A first optical path that is an optical path of light that passes through one point on the half mirror and a second optical path that is an optical path of light reflected at the one point on the half mirror; One of the two optical paths forming a common optical path portion that extends in parallel and overlaps with each other in the portion passes through a supported point that is the center of the location to be supported by the backup pin on the arrangement display surface. The half mirror, the component arrangement display body, and the support base are held at a relative position where the center of the substrate support surface of the backup pin is positioned on the other of the two optical paths. Substrate support device assembly support device.
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