JP4956672B2 - 半導体製造装置の温度調節システム - Google Patents

半導体製造装置の温度調節システム Download PDF

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Publication number
JP4956672B2
JP4956672B2 JP2010529836A JP2010529836A JP4956672B2 JP 4956672 B2 JP4956672 B2 JP 4956672B2 JP 2010529836 A JP2010529836 A JP 2010529836A JP 2010529836 A JP2010529836 A JP 2010529836A JP 4956672 B2 JP4956672 B2 JP 4956672B2
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Japan
Prior art keywords
heat
storage tank
transfer fluid
heat transfer
heat storage
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Active
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JP2010529836A
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English (en)
Japanese (ja)
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JP2011501429A (ja
Inventor
チョー、ボン−ヒョン
ウン、チャン−ウー
チョイ、ヒュン−ソク
リー、サン−ゴン
リー、クワン−ミョン
リー、イン−ジュ
チョイ、ヨン−ホー
アン、ソン−クク
パク、チョウル−オー
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Temperature (AREA)
  • Drying Of Semiconductors (AREA)
JP2010529836A 2007-10-18 2007-11-09 半導体製造装置の温度調節システム Active JP4956672B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020070105057A KR100925236B1 (ko) 2007-10-18 2007-10-18 반도체 제조 장비의 온도 조절 시스템
KR10-2007-0105057 2007-10-18
PCT/KR2007/005642 WO2009051288A1 (en) 2007-10-18 2007-11-09 Temperature control system for semiconductor manufacturing equipment

Publications (2)

Publication Number Publication Date
JP2011501429A JP2011501429A (ja) 2011-01-06
JP4956672B2 true JP4956672B2 (ja) 2012-06-20

Family

ID=40567535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010529836A Active JP4956672B2 (ja) 2007-10-18 2007-11-09 半導体製造装置の温度調節システム

Country Status (4)

Country Link
US (1) US20100206519A1 (ko)
JP (1) JP4956672B2 (ko)
KR (1) KR100925236B1 (ko)
WO (1) WO2009051288A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11656016B2 (en) 2019-11-20 2023-05-23 Ebara Refrigeration Equipment & Systems Co., Ltd. Cooling system that comprises multiple cooling apparatus and reduces power consumption
US11703284B2 (en) 2019-11-08 2023-07-18 Ckd Corporation Temperature control system and integrated temperature control system
US11788777B2 (en) 2019-11-08 2023-10-17 Ckd Corporation Temperature control system and integrated temperature control system
US11796247B2 (en) 2019-11-20 2023-10-24 Ckd Corporation Temperature control system

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5914037B2 (ja) * 2012-02-23 2016-05-11 東京エレクトロン株式会社 冷却システム、冷却システムを備える基板処理装置及び冷却方法
KR20130107818A (ko) * 2012-03-23 2013-10-02 삼성전자주식회사 레이저 간섭계 및 이 레이저 간섭계를 이용한 변위 측정 시스템
KR101352056B1 (ko) * 2013-06-25 2014-01-15 (주)테키스트 온도조절장치
KR101345410B1 (ko) * 2013-06-25 2014-01-10 (주)테키스트 온도조절장치
JP5938506B1 (ja) * 2015-09-17 2016-06-22 株式会社日立国際電気 基板処理システム、半導体装置の製造方法、プログラム及び記録媒体
CN106931706A (zh) * 2017-04-18 2017-07-07 海南佩尔优科技有限公司 一种冷库供冷系统及其控制方法
CN106958977A (zh) * 2017-04-18 2017-07-18 海南佩尔优科技有限公司 一种冷库供冷设备及其控制方法
KR101940287B1 (ko) * 2018-02-08 2019-01-18 (주)테키스트 반도체 제조용 온도 조절 장치
JP6852040B2 (ja) * 2018-11-16 2021-03-31 大陽日酸株式会社 半導体製造装置部品の洗浄装置、半導体製造装置部品の洗浄方法、及び半導体製造装置部品の洗浄システム
JP7314462B2 (ja) * 2019-04-02 2023-07-26 Smc株式会社 温調装置
CN111809244A (zh) * 2019-04-10 2020-10-23 西安奕斯伟硅片技术有限公司 用于硅系材料蚀刻处理的除热装置及除热装置的工作方法
CN113811833B (zh) * 2019-04-23 2022-10-04 Ckd株式会社 热交换系统
KR102403661B1 (ko) * 2020-02-19 2022-05-31 (주)피티씨 반도체 공정용 칠러 장치
KR102345640B1 (ko) * 2020-02-21 2021-12-31 (주)피티씨 반도체 공정용 칠러 장치
JP7473401B2 (ja) * 2020-06-03 2024-04-23 株式会社ディスコ 加工水供給システム
CN112539444B (zh) * 2020-12-11 2022-04-15 西安交通大学 一种家用余热再利用与储能系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801998B2 (ja) * 1992-10-12 1998-09-21 富士通株式会社 電子機器の冷却装置
JPH10116867A (ja) * 1996-10-11 1998-05-06 Orion Mach Co Ltd 半導体ウェーハの試験方法及び試験装置用温度調節器
US6493507B2 (en) * 1997-01-30 2002-12-10 Ival O. Salyer Water heating unit with integral thermal energy storage
JP4391713B2 (ja) * 1999-07-02 2009-12-24 東京エレクトロン株式会社 半導体製造設備
JP3921913B2 (ja) * 2000-03-13 2007-05-30 株式会社日立製作所 ウエハ処理装置およびウエハ製造方法
TW505770B (en) * 2000-05-02 2002-10-11 Nishiyama Corp Temperature controller
KR20020066358A (ko) * 2001-02-08 2002-08-16 오리올 인코포레이션 반도체 제조 장치에 사용되는 다채널 온도 조절 장치
KR100427654B1 (ko) * 2001-05-10 2004-04-27 유니셈 주식회사 반도체 제조 설비용 냉각장치 및 냉각방법
JP4035008B2 (ja) * 2002-07-08 2008-01-16 株式会社日立ハイテクノロジーズ 真空処理装置
KR100706662B1 (ko) * 2004-10-15 2007-04-11 주식회사 글로벌스탠다드테크놀로지 다중 라인들의 순환수 온도를 제어하는 온도 조절 장치 및 그의 제어 방법
KR100719225B1 (ko) 2005-12-21 2007-05-17 주식회사 글로벌스탠다드테크놀로지 반도체 제조 공정용 온도조절 시스템
US8025097B2 (en) * 2006-05-18 2011-09-27 Centipede Systems, Inc. Method and apparatus for setting and controlling temperature

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11703284B2 (en) 2019-11-08 2023-07-18 Ckd Corporation Temperature control system and integrated temperature control system
US11788777B2 (en) 2019-11-08 2023-10-17 Ckd Corporation Temperature control system and integrated temperature control system
US11656016B2 (en) 2019-11-20 2023-05-23 Ebara Refrigeration Equipment & Systems Co., Ltd. Cooling system that comprises multiple cooling apparatus and reduces power consumption
US11796247B2 (en) 2019-11-20 2023-10-24 Ckd Corporation Temperature control system

Also Published As

Publication number Publication date
KR20090039420A (ko) 2009-04-22
WO2009051288A1 (en) 2009-04-23
US20100206519A1 (en) 2010-08-19
KR100925236B1 (ko) 2009-11-05
JP2011501429A (ja) 2011-01-06

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