JP4953873B2 - Composite bonding material and bonded body - Google Patents
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- JP4953873B2 JP4953873B2 JP2007080284A JP2007080284A JP4953873B2 JP 4953873 B2 JP4953873 B2 JP 4953873B2 JP 2007080284 A JP2007080284 A JP 2007080284A JP 2007080284 A JP2007080284 A JP 2007080284A JP 4953873 B2 JP4953873 B2 JP 4953873B2
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本発明は、少なくとも２種類の異種部材同士を接合するためのコンポジット接合材に関する。 The present invention relates to a composite bonding material for bonding at least two kinds of different members.
従来より、ヒーターや静電チャック等の半導体製造装置用サセプタの端子接合部分等、使用温度が最大で１００〜２００℃程度、且つ、導電性が必要な接合部分の接合材として、インジウム，インジウム合金，スズ合金等の接合材や、アルミニウムや銀等の金属ロウとアルミナ等のセラミックス粉末の混合体からなる接合材が用いられている。
しかしながら、インジウム，インジウム合金，スズ合金等の接合材は軟質金属により形成されているために、この接合材により部材を接合した場合には、接合部分の強度が不足する。一方、上記混合体からなる接合材では、セラミックス粉末が導電性を有さないために、導電性が必要な接合部分に適用した場合には、接合部分が抵抗発熱する可能性がある。なお、このような抵抗発熱を回避するために接合面積を大きくする方法が考えられるが、接合面積を大きくした場合には、接合部分の残留応力が増大し、破壊の可能性が高くなる。 However, since a joining material such as indium, an indium alloy, and a tin alloy is formed of a soft metal, when the members are joined with this joining material, the strength of the joined portion is insufficient. On the other hand, in the bonding material made of the above mixture, since the ceramic powder does not have conductivity, the bonding portion may generate resistance heat when applied to a bonding portion that requires conductivity. In order to avoid such resistance heat generation, a method of increasing the bonding area is conceivable. However, when the bonding area is increased, the residual stress at the bonding portion increases and the possibility of destruction increases.
また上記混合体からなる接合材を用いて部材を接合する場合には、図３（ａ）に示すようにセラミックス粉末１１と金属ロウ１３を接合領域に積層配置しなければならないので、金属ロウ１３を収納する収納孔１２を接合部材（図３（ａ）の例では端子７）に形成しなければならない等、接合可能な部材の形状や材質に制約が生じる。またこの場合、金属ロウ１３とセラミックス粉末１１の濡れ性を向上するためにメッキやスパッタ等の表面処理を施す必要がある。さらにこの場合、接合後は金属ロウ１３とセラミックス粉末１１が反応することにより図３（ｂ）に示すように高融点の化合物１４が形成されるために、一度複合化した金属ロウ１３を再溶融して再利用することはできない。 Further, when the members are bonded using the bonding material made of the above mixture, the ceramic powder 11 and the metal brazing 13 must be laminated and disposed in the bonding region as shown in FIG. For example, the shape and the material of the member that can be joined are restricted, such as the housing hole 12 for housing the material having to be formed in the joining member (terminal 7 in the example of FIG. In this case, in order to improve the wettability of the metal braze 13 and the ceramic powder 11, it is necessary to perform a surface treatment such as plating or sputtering. Further, in this case, after joining, the metal braze 13 and the ceramic powder 11 react to form a compound 14 having a high melting point as shown in FIG. And cannot be reused.
本発明は、上述の課題を解決するためになされたものであり、その目的は、接合可能な部材の形状や材質に制約がなく、また濡れ性を向上させるための表面処理の必要がなく、さらには再利用が可能な、高強度、且つ、抵抗発熱しないコンポジット接合材を提供することにある。 The present invention has been made in order to solve the above-mentioned problems, and the purpose thereof is that there is no restriction on the shape and material of a member that can be joined, and there is no need for a surface treatment to improve wettability, It is another object of the present invention to provide a composite bonding material that can be reused and has high strength and does not generate resistance heat.
本発明に係るコンポジット接合材は、少なくとも２種類の異種部材同士を接合するための接合材であって、インジウム，インジウム合金，及びスズ合金のうちのいずれかの金属材料からなる金属ロウと、当該金属ロウ内に均一に分散されたＩＴＯ（Indium Tin Oxide：インジウム・スズ酸化物）粉末とを含むことを特徴とする。 The composite bonding material according to the present invention is a bonding material for bonding at least two kinds of dissimilar members to each other, and includes a metal brazing made of any one of indium, an indium alloy, and a tin alloy, It contains ITO (Indium Tin Oxide: Indium Tin Oxide) powder uniformly dispersed in metal brazing.
本発明に係るコンポジット接合材によれば、金属ロウ内にＩＴＯ粉末が均一に分散されているので、接合材の強度を向上させることができる。 According to the composite bonding material according to the present invention, since the ITO powder is uniformly dispersed in the metal brazing, the strength of the bonding material can be improved.
本発明に係るコンポジット接合材によれば、ＩＴＯ粉末が導電性を有し、且つ、インジウムとスズの濡れ性が良好であるために、抵抗発熱を抑えることができる。 According to the composite bonding material according to the present invention, since the ITO powder has conductivity and the wettability of indium and tin is good, resistance heat generation can be suppressed.
本発明に係るコンポジット接合材によれば、接合時に金属ロウとＩＴＯ粉末を積層配置する必要がないので、接合可能な部材の形状や材質に制約がない。 According to the composite bonding material according to the present invention, there is no restriction on the shape and material of the members that can be bonded since it is not necessary to laminate and arrange the metal brazing and the ITO powder at the time of bonding.
本発明に係るコンポジット接合材によれば、金属ロウとＩＴＯ粉末の濡れ性が良好であるので、濡れ性を向上させるための表面処理を施す必要がない。 According to the composite bonding material according to the present invention, since the wettability of the metal braze and the ITO powder is good, it is not necessary to perform a surface treatment for improving the wettability.
本発明に係るコンポジット接合材によれば、接合後に高融点の化合物が形成されないので、再溶融して金属ロウを再利用することができる。 According to the composite bonding material of the present invention, since a high melting point compound is not formed after bonding, the metal brazing can be reused by remelting.
本願発明の発明者は、鋭意研究を重ねてきた結果、図１に示すように、Ｉｎ，Ｉｎ合金，及びＳｎ合金のうちのいずれかの金属材料からなるメタル相（金属ロウ）２内にＩＴＯ（In2O3-SnO2）粉末３を均一に分散させることにより、高強度、且つ、抵抗発熱しない接合材１を形成できることを知見した。なお、Ｉｎ合金としては、Ｉｎ−Ｓｎ，Ｉｎ−Ａｕ，Ｉｎ−Ｃｕ等を例示することができる。また、Ｓｎ合金としては、Ｓｎ−ＰｎやＳｎ−Ｚｎ等を例示することができる。 As a result of intensive studies, the inventors of the present invention, as shown in FIG. 1, have ITO in the metal phase (metal brazing) 2 made of any one of In, In alloy, and Sn alloy. It has been found that by bonding (In 2 O 3 —SnO 2 ) powder 3 uniformly, it is possible to form a bonding material 1 having high strength and no resistance heat generation. As the In alloy, In—Sn, In—Au, In—Cu, and the like can be exemplified. Examples of the Sn alloy include Sn-Pn and Sn-Zn.
この接合材１を調製する場合は、始めに、メタル相２を構成する金属材料を溶融し、溶融した金属材料内に所定量（金属材料に対し１０〜９０ｖｏｌ％、好ましくは３０〜７０ｖｏｌ％）、且つ、所定粒径（平均粒径０．１〜１００μｍ，好ましくは平均粒径０．１〜２０μｍ）のＩＴＯ粉末３を添加，攪拌する。そして攪拌完了後、金属材料を冷却し、所定形状に加工する。そしてこの接合材１を用いて、例えば内部に埋設されたメッシュ電極４の一部が露出するように窒化アルミニウム（ＡｌＮ）焼結体５表面に形成された接合穴６において、ＡｌＮ焼結体５（メッシュ電極３）とメッシュ電極３に電圧を印加するための端子７とを接合する場合には、始めに、接合穴６の底部に接合材１を配置した後、接合材１上に端子７と重りをセットする。そしてメタル相２の融点まで接合部分を加熱し、メタル相２の溶融を確認してから所定時間保持した後、冷却する。 When preparing the bonding material 1, first, the metal material constituting the metal phase 2 is melted, and a predetermined amount (10 to 90 vol%, preferably 30 to 70 vol% with respect to the metal material) in the molten metal material. In addition, ITO powder 3 having a predetermined particle size (average particle size of 0.1 to 100 μm, preferably average particle size of 0.1 to 20 μm) is added and stirred. Then, after completion of stirring, the metal material is cooled and processed into a predetermined shape. Then, using this bonding material 1, for example, in a bonding hole 6 formed on the surface of an aluminum nitride (AlN) sintered body 5 so that a part of the mesh electrode 4 embedded inside is exposed, the AlN sintered body 5 When the (mesh electrode 3) and the terminal 7 for applying a voltage to the mesh electrode 3 are joined, first, the joining material 1 is disposed at the bottom of the joining hole 6, and then the terminal 7 is placed on the joining material 1. And set the weight. Then, the joining portion is heated to the melting point of the metal phase 2, and after the melting of the metal phase 2 is confirmed and held for a predetermined time, it is cooled.
このように、接合材１を用いて異種部材を接合する場合、接合時に構成材料を積層配置する必要がないので、接合可能な部材の形状や材質に制約がない。またメタル相２とＩＴＯ粉末３の濡れ性は良好であるので、濡れ性を向上させるための表面処理を施す必要がない。さらには接合後に高融点の化合物が形成されることがないので、再溶融してメタル相２を構成する金属材料を再利用することができる。 As described above, when different types of members are joined using the joining material 1, there is no need to stack and arrange the constituent materials at the time of joining, so there are no restrictions on the shapes and materials of the members that can be joined. Moreover, since the wettability of the metal phase 2 and the ITO powder 3 is good, it is not necessary to perform a surface treatment for improving the wettability. Furthermore, since a high melting point compound is not formed after joining, the metal material constituting the metal phase 2 by remelting can be reused.
〔実施例〕
以下、実施例に基づき本発明をさらに詳しく説明する。
〔Example〕
Hereinafter, the present invention will be described in more detail based on examples.
上述の調製方法により以下の表１に示す組成を有する実施例１〜４３及び比較例１〜９の接合材を調製し、調製された各接合材を用いて上述の接合方法によりＡｌＮ焼結体５に端子７を接合した。そして各接合体についてＡｌＮ焼結体５を固定した状態で端子７を０．５ｍｍ／ｍｉｎの速度で引っ張ることにより接合部分の強度を測定した。またＡｌＮ焼結体５の側壁部分において露出しているメッシュ電極４にＡｇペーストを塗布し、端子７とＡｇペースト間の抵抗を測定した。測定結果は表１に合わせて示す。
表１から明らかなように、実施例１〜４３の接合材を用いた接合領域の電気抵抗はいずれも、金属ロウにセラミックス粉末を混入させた比較例９の接合材を用いた接合領域の電気抵抗よりも大幅に小さい。このことから、Ｉｎ，Ｉｎ合金，及びＳｎ合金のうちのいずれかの金属材料からなるメタル相２内にＩＴＯ粉末３を均一に分散させることにより、接合領域の電気抵抗を小さくし、抵抗発熱を抑制できることが知見された。 As is apparent from Table 1, the electrical resistance of the joining region using the joining materials of Examples 1 to 43 is the electrical resistance of the joining region using the joining material of Comparative Example 9 in which ceramic powder is mixed in metal brazing. Significantly less than resistance. Therefore, by uniformly dispersing the ITO powder 3 in the metal phase 2 made of any metal material of In, In alloy, and Sn alloy, the electrical resistance of the junction region is reduced, and resistance heating is generated. It was found that it can be suppressed.
また、実施例３，８，１３，１８，２３の接合材を用いた接合領域の接合強度はいずれも比較例１，２の接合材を用いた接合領域の接合強度よりも大きい。さらに実施例３３，３６の接合材を用いた接合領域の接合強度はいずれも比較例５，６の接合材を用いた接合領域の接合強度よりも大きい。このことから、ＩＴＯ粉末の含有量が同じである場合には、ＩＴＯ粉末の平均粒径は０．１〜１００μｍの範囲内にあることが望ましいことが知見された。 In addition, the bonding strength of the bonding regions using the bonding materials of Examples 3, 8, 13, 18, and 23 is higher than the bonding strength of the bonding regions using the bonding materials of Comparative Examples 1 and 2. Further, the bonding strength of the bonding regions using the bonding materials of Examples 33 and 36 is higher than the bonding strength of the bonding regions using the bonding materials of Comparative Examples 5 and 6. From this, it was found that when the content of the ITO powder is the same, it is desirable that the average particle diameter of the ITO powder is in the range of 0.1 to 100 μm.
また、実施例１１〜１５の接合材を用いた接合領域の接合強度はいずれも比較例３，４の接合材を用いた接合領域の接合強度よりも大きい。さらに実施例３２〜３４の接合材を用いた接合領域の接合強度はいずれも比較例７，８の接合材を用いた接合領域の接合強度よりも大きい。このことから、ＩＴＯ粉末の平均粒径が同じである場合には、ＩＴＯ粉末の含有量は１０〜９０ｖｏｌ％の範囲内にあることが望ましいことが知見された。 Further, the bonding strength of the bonding regions using the bonding materials of Examples 11 to 15 is higher than the bonding strength of the bonding regions using the bonding materials of Comparative Examples 3 and 4. Further, the bonding strength of the bonding regions using the bonding materials of Examples 32-34 is higher than the bonding strength of the bonding regions using the bonding materials of Comparative Examples 7 and 8. From this, it was found that when the average particle diameter of the ITO powder is the same, the content of the ITO powder is preferably in the range of 10 to 90 vol%.
以上、本発明者によってなされた発明を適用した実施の形態について説明したが、この実施の形態による本発明の開示の一部をなす論述及び図面により本発明は限定されることはない。すなわち、上記実施の形態に基づいて当業者等によりなされる他の実施の形態、実施例及び運用技術等は全て本発明の範疇に含まれることは勿論であることを付け加えておく。 As mentioned above, although the embodiment to which the invention made by the present inventor is applied has been described, the present invention is not limited by the description and the drawings that form part of the disclosure of the present invention according to this embodiment. That is, it should be added that other embodiments, examples, operation techniques, and the like made by those skilled in the art based on the above embodiments are all included in the scope of the present invention.
１：接合材
２：メタル相
３：ＩＴＯ粉末
４：メッシュ電極
５：窒化アルミニウム（ＡｌＮ）焼結体
６：接合穴
７：端子
１１：セラミックス粉末
１２：収納孔
１３：金属ロウ
1: Bonding material 2: Metal phase 3: ITO powder 4: Mesh electrode 5: Aluminum nitride (AlN) sintered body 6: Bonding hole 7: Terminal 11: Ceramic powder 12: Storage hole 13: Metal brazing
Claims (2)
前記ＩＴＯ粉末は前記金属ロウに対し１０ｖｏｌ％以上９０ｖｏｌ％以下の割合で混入され、
前記ＩＴＯ粉末の平均粒径が０．１μｍ以上１００μｍ以下の範囲内にあることを特徴とするコンポジット接合材。 A joining material for joining at least two kinds of dissimilar members, a metal brazing made of a metal material of any one of indium, an indium alloy, and a tin alloy, and uniformly dispersed in the metal brazing and the ITO powder seen including,
The ITO powder is mixed in a proportion of 10 vol% to 90 vol% with respect to the metal wax,
An average particle diameter of the ITO powder is in a range of 0.1 μm to 100 μm .
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