JP4946476B2 - Organic EL device and manufacturing method thereof - Google Patents

Description

  The present invention relates to an organic EL device and a method for manufacturing the same.

  2. Description of the Related Art In recent years, attention has been paid to an organic EL device including an organic electroluminescence (hereinafter referred to as organic EL) element that emits light without requiring a backlight or the like as a type of electro-optical device typified by a liquid crystal device. The organic EL element is configured to include an organic functional film, that is, an organic light emitting layer between a pair of opposed electrodes, and an organic EL device that performs full-color display includes red (R), green (G), An organic EL element (light emitting element) having an emission wavelength band corresponding to each color of blue (B) is provided.

As an effective method for forming such an organic EL device, there is a method using a droplet discharge method such as an inkjet method. This method is a method in which a partition is provided on a first electrode formed on a substrate to partition a pixel region, and a liquid material for forming an organic functional film is filled in each pixel region. An organic functional film is formed by drying.
Further, after the organic functional film is formed, the second electrode is collectively formed on the partition wall and the organic functional film by a vapor phase method such as a vapor deposition method.

  According to the method using the droplet discharge method, there is an advantage that a plurality of organic functional films having different emission wavelength bands can be simultaneously formed on the same substrate. However, in this method, when the liquid material is dried, its volume is greatly reduced. Therefore, it is necessary to fill the pixel area with a larger amount of liquid material than the thickness of the organic functional film. In some cases, a desired light emitting layer may not be obtained by mixing with the liquid material in the adjacent pixel region.

As a method for solving such inconvenience, Patent Document 1 discloses a method of performing liquid-repellent processing on the upper surface of the partition wall by plasma treatment, and Patent Document 2 discloses a method on an electrode made of a lyophilic inorganic material. The method of forming a partition by the method of patent document 1 is disclosed.
JP 2002-372921 A JP 2002-334882 A

  As described above, according to the methods of Patent Document 1 and Patent Document 2, it is expected that the liquid material can be prevented from overflowing from the partitioned pixel region. However, for example, in order to improve the durability (lifetime) of the organic EL device, if the organic functional film is formed thick, the second electrode formed on the organic functional film is formed on the partition wall. There is a risk of disconnection from the electrode (wiring).

  In other words, when the organic functional film is to be thickened, it is necessary to fill the pixel region with a larger amount of liquid material, and the liquid material overflows from the pixel region. In order to prevent this, when the partition is made high, a large step is formed between the partition and the organic functional film. When the second electrode is formed by a general vapor phase method such as a vapor deposition method in a state where there is such a large step, the coverage is deteriorated, so that the formed second electrode is formed on the partition wall and the organic layer. There is a risk of discontinuity with the functional film. If there is an organic functional film to which power is not supplied due to such disconnection, uneven color and discoloration will occur.

  In addition, a method of increasing the volume of the pixel region and improving the coverage by making the partition surface surrounding the pixel region a tapered surface is also conceivable. For this purpose, the side surface of the partition wall is gently tapered (inclined). Therefore, the liquid material easily flows out, and the liquid material cannot sufficiently be prevented from overflowing from the pixel region.

  The present invention has been made in view of the above-described situation, and even when the partition walls are raised, inconvenience due to disconnection of the second electrode on the organic functional film is prevented, and the second electrode functions normally. An object of the present invention is to provide an organic EL device and a method for manufacturing the same.

The organic EL device of the present invention has a substrate, a first electrode formed on the substrate, and an opening formed on the first electrode and partitioning the first electrode for each pixel region. A partition wall, an organic functional film formed in the opening, and a second electrode formed on the organic functional film,
The partition wall is provided with a groove-shaped notch that communicates with the opening at least at a part of the circumference surrounding the opening.
The second electrode is formed so as to cover the entire surface of the partition, in the notch, and on the organic functional film, and at least continuously between the notch and the organic functional film. It is provided.

In such an organic EL device, even when the partition is made high, the step between the organic functional film and the notch can be reduced. Therefore, a general vapor phase method such as a vapor deposition method can be used as a method of continuously forming the second electrode between the organic functional film and the inside of the notch, and the production efficiency is remarkably increased. be able to.
Further, since the partition wall can be made high, for example, when the organic functional film is formed by a method using a droplet discharge method or the like, a larger amount of the organic functional film material is filled in the pixel region. And the organic functional film can be thickened. Therefore, the durability (life) of the organic functional film can be improved, and the organic EL device provided with the organic functional film has a long life.

In addition, it is preferable that the notches of the partition walls communicate with each other extending from a plurality of openings, and it is more preferable that the arranged pixel regions are arranged in communication for each row or column. preferable.
With such a configuration, the wiring between the second electrode formed in the notch and the pixel driving circuit can be simplified.
Further, for example, if the second electrode is discontinuous between the partition wall and the organic functional film by increasing the partition wall, the power supply to the organic functional film is as follows: This is done only via the second electrode (lead-in wiring) in the notch. Therefore, independent wiring is provided for each row or column of the arranged pixel region, and the pixels can be driven independently for each row or column. Accordingly, it is possible to adjust and improve unevenness of light emission and the like by pixel drive control.

Moreover, it is preferable that the inner surface of the notch of the partition wall has liquid repellency.
With such a configuration, for example, when the organic functional film is formed by a technique using a droplet discharge method, the liquid material of the organic functional film flows out from the pixel region into the cutout portion, and enters the cutout portion. We can prevent wetting and spreading. Therefore, a predetermined amount of the liquid material of the organic functional film can be arranged in the opening, and thereby the organic functional film can be made to have a predetermined thickness.

Further, the side surface surrounding the opening of the partition wall has a configuration in which at least a part thereof is an inclined surface that reduces the opening diameter from the first electrode side toward the second electrode side. You can also
With such a configuration, when the second electrodes are collectively formed on the partition wall and the organic functional film by, for example, a vapor phase method, the inclined surface (reverse tapered surface) causes the first electrode to be formed. The coverage of the second electrode is impaired. Therefore, the formed second electrode is discontinuous between the partition and the organic functional film, and when the pixels are driven independently for each row or column as described above, the row or column Each wiring can be more reliably made independent.

The manufacturing method of the organic EL device of the present invention is as follows:
Forming a first electrode on a substrate;
On the first electrode, there is an opening that divides the first electrode for each pixel region, and at least a part of the circumference surrounding the opening has a groove-shaped notch that communicates with the opening. Forming a partition;
Forming an organic functional film in the opening of the partition wall by a liquid phase method;
And a step of forming a second electrode by a vapor phase method so as to cover the entire surface of the partition, the inside of the notch, and the organic functional film.

According to such a method, an organic EL device having a small step between the organic functional film and the cutout can be manufactured even when the partition wall is made high. Therefore, a general method such as a vapor deposition method can be used as a method for continuously forming the second electrode between the organic functional film and the inside of the notch, which can significantly increase the production efficiency. it can.
Further, since the partition walls can be made high, for example, when the organic functional film is formed by a liquid phase method such as a droplet discharge method, the pixel region is filled with a larger amount of the material of the organic functional film. And the organic functional film can be thickened. Therefore, durability (life) of the organic functional film can be improved, and a long-life organic EL device including the organic functional film can be manufactured.

The step of forming the partition includes
Forming a first partition on the first electrode in a state where the first electrode is exposed in the pixel region;
Preferably, the method includes a step of forming a second partition on the first partition in a state where the notch is provided.
According to such a method, the said partition in which the said notch part was formed can be manufactured simply.

Moreover, it is preferable to have the process of providing liquid repellency to the said partition between the process of forming the said partition, and the process of forming the said organic functional film.
According to such a method, liquid repellency can be reliably imparted to the inside and upper surface of the partition and the notch. Therefore, for example, when the organic functional film is formed by a technique using a droplet discharge method, the liquid material of the organic functional film is prevented from flowing out from the pixel region to the notch and spreading into the notch. Is done. Therefore, a predetermined amount of the liquid material of the organic functional film can be disposed in the opening, and thus an organic EL device including an organic functional film having a predetermined thickness can be manufactured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the technical scope of the present invention is not limited to the following embodiments. In the drawings used for the following description, the scale of each member is appropriately changed in order to make each member a recognizable size.

  FIG. 1 is an explanatory view showing a wiring structure of an embodiment of the organic EL device of the present invention. As shown in FIG. 1, the organic EL device 1 of the present embodiment includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction intersecting the scanning lines 101, and a plurality extending in parallel with the signal lines 102. The power source line 103 is wired, and the pixel region A is formed in the vicinity of each intersection of the scanning line 101 and the signal line 102.

Connected to the signal line 102 is a data side driving circuit 104 including a shift register, a level shifter, a video line, and an analog switch. A scanning side driving circuit 105 including a shift register and a level shifter is connected to the scanning line 101. In each of the pixel regions A, a switching thin film transistor 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel signal supplied from the signal line 102 via the switching thin film transistor 112 are provided. Is electrically connected to the power supply line 103 via the driving thin film transistor 113, the driving thin film transistor 113 to which the pixel signal held by the holding capacity cap is supplied to the gate electrode, and the driving thin film transistor 113. Are provided with a first electrode (pixel electrode) 111 into which a driving current flows from the power supply line 103 and an organic functional film 110 sandwiched between the pixel electrode 111 and the second electrode (counter electrode) 12. ing.
Note that an organic EL element is configured by including the first electrode (pixel electrode) 111, the second electrode (counter electrode) 12, and the organic functional film 110. One electrode (pixel electrode) 111 functions as an anode, and the second electrode (counter electrode) 12 functions as a cathode.

  According to such a configuration, when the scanning line 101 is driven and the switching thin film transistor 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor cap, and according to the state of the holding capacitor cap. The on / off state of the driving thin film transistor 113 is determined. Then, a current flows from the power supply line 103 to the pixel electrode 111 through the channel of the driving thin film transistor 113, and further a current flows to the counter electrode 12 through the organic functional film 110. Then, the organic functional film 110 emits light according to the amount of current flowing through it.

  FIG. 2 is a schematic plan view of the organic EL device shown in FIG. The organic EL device 1 of the present embodiment includes a substrate 2, a display region P in which pixel regions A are arranged, a flexible substrate 5, and a drive IC 6 (drive circuit). One end of the counter electrode 12 is connected to a cathode wiring (not shown) formed on the substrate 2, and one end 12 a of the wiring is connected to a wiring 5 a on the flexible substrate 5 as shown in FIG. 2. It is connected to the. The wiring 5 a is connected to a driving IC 6 (driving circuit) provided on the flexible substrate 5.

  FIG. 3 is a schematic view of the main part of the display area P as viewed from the upper surface side of the substrate 2. As will be described in detail later, a circuit element portion (not shown) is formed on the substrate 2, and the pixel electrode 111 is provided on the circuit element portion. A partition wall 4 is formed by partitioning the pixel electrode 111, and the opening 4 a of the partition wall 4 is a pixel region A. The partition wall 4 is provided with a groove-shaped notch 42 that communicates with the opening 4a. The cutout portion 42 includes a branch line portion 421 extending from the opening 4a and a main line portion 422 that bundles the branch line portions 421 for each row corresponding to a scanning line in the pixel region array. An organic functional film (not shown) is formed on the pixel electrode 111 in the opening 4a. A counter electrode (shown in the figure) is formed on the organic functional film, on the partition wall 4, and in the notch 42. (Not shown) is formed.

  4 is a cross-sectional view taken along line XX in FIG. In the present embodiment, the bottom emission type organic EL device 1 will be described as an example. In the bottom emission type organic EL device 1, the substrate 2 and the circuit element unit 14 are made of a transparent material, and light emitted from the organic functional film 110 toward the substrate 2 passes through the circuit element unit 14 and the substrate 2. The light emitted from the organic functional film 110 to the side opposite to the substrate 2 is also reflected by the counter electrode 12 and transmitted through the circuit element unit 14 and the substrate 2. Then, the light is emitted to the outside (observer side) of the substrate 2.

  As shown in FIG. 4, the organic EL element 3 formed on the substrate 2 includes a pixel electrode 111, an organic functional film 110 including a hole injection layer 60 and a light emitting layer 70, and a counter electrode 12. Yes. In the thickness direction of the substrate 2, a circuit element portion 14 is formed between the EL element portion 10 including the organic EL element 3 and the substrate 2. In the circuit element portion 14, the above-described scanning line, signal line, storage capacitor, switching thin film transistor, driving thin film transistor 123, and the like are formed.

In the circuit element portion 14, a base protective layer 281 mainly composed of SiO ₂ is formed on the substrate 2 as a base, and a silicon layer 241 is formed thereon. A gate insulating layer 282 mainly composed of SiO ₂ and / or SiN is formed on the surface of the silicon layer 241.
In the silicon layer 241, a region overlapping with the gate electrode 242 with the gate insulating layer 282 interposed therebetween is a channel region 241a. The gate electrode 242 is a part of a scanning line (not shown). On the other hand, a first interlayer insulating layer 283 mainly composed of SiO ₂ is formed on the surface of the gate insulating layer 282 that covers the silicon layer 241 and on which the gate electrode 242 is formed.

  Further, in the silicon layer 241, a low concentration source region 241b and a high concentration source region 241S are provided on the source side of the channel region 241a, while a low concentration drain region 241c and a high concentration drain are provided on the drain side of the channel region 241a. The region 241D is provided to form a so-called LDD (Light Doped Drain) structure. Among these, the high-concentration source region 241S is connected to the source electrode 243 through a contact hole 243a that opens over the gate insulating layer 282 and the first interlayer insulating layer 283. The source electrode 243 is configured as a part of a power supply line (not shown). On the other hand, the high-concentration drain region 241D is connected to the drain electrode 244 made of the same layer as the source electrode 243 through a contact hole 244a that opens through the gate insulating layer 282 and the first interlayer insulating layer 283.

  A planarization film 284 is formed on the first interlayer insulating layer 283 where the source electrode 243 and the drain electrode 244 are formed. The planarizing film 284 is formed of a heat-resistant insulating resin such as acrylic or polyimide, and is formed to eliminate surface irregularities due to the driving TFT 123, the source electrode 243, the drain electrode 244, and the like. Are known.

  A pixel electrode 111 is formed on the surface of the planarization film 284, and the pixel electrode 111 is connected to the drain electrode 244 through a contact hole 111a provided in the planarization film 284. . That is, the pixel electrode 111 is connected to the high concentration drain region 241D of the silicon layer 241 through the drain electrode 244. In this embodiment, which is a bottom emission type, the pixel electrode 111 is formed of a transparent conductive material, and specifically, ITO is suitably used.

  On the surface of the planarization film 284 on which the pixel electrode 111 is formed, the pixel electrode 111 and an inorganic partition wall 40 that covers the peripheral edge of the pixel electrode 111 are formed. Further, an organic partition wall 41 is formed on the inorganic partition wall 40. Is formed. In addition, on the pixel electrode 111, the hole injection layer 60 and the light emission are emitted inside the opening 40 a formed in the inorganic partition wall 40 and the opening 4 a formed in the organic partition wall 41, that is, in the pixel region A. The layer 70 is laminated in this order from the pixel electrode 111 side, whereby the organic functional film 110 is formed.

  In the organic functional film 110, the hole injection layer 60 has a function of injecting holes into the light emitting layer 70 and also has a function of transporting holes inside the hole injection layer 60. By providing such a hole injection layer 60 between the pixel electrode 111 and the light emitting layer 70, element characteristics such as light emission efficiency and lifetime of the light emitting layer 70 can be improved. In the light emitting layer 70, the holes injected from the hole injection layer 60 and the electrons injected from the counter electrode 12 are recombined to emit light.

  The hole injection layer 60 is a liquid containing 3,4-polyethylenedioxythiophene-polystyrene sulfonic acid (PEDOT-PSS) as a forming material, that is, 3,4-polyethylene in polystyrene sulfonic acid as a dispersion medium. A liquid in which dioxythiophene is dispersed and further dispersed or dissolved in water is preferably used.

As a material for forming the light emitting layer 70, a known light emitting material capable of emitting fluorescence or phosphorescence is used. Specific examples of the material for forming the light emitting layer 70 include (poly) fluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), and polyvinylcarbazole (PVK). ), Polythiophene derivatives, and polysilanes such as polymethylphenylsilane (PMPS) are preferably used. In addition, these polymer materials include polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, and quinacridone. It can also be used by doping a low molecular weight material such as.
In addition, as a material for forming such a light emitting layer 70, in particular, in the case of full color display, a material that emits light corresponding to each of the red, green, and blue wavelength ranges is used, and each of the materials is set in advance. Is formed and arranged.

The counter electrode 12 is formed so as to cover the light emitting layer 70. For example, Ca is formed to a thickness of about 5 nm, and Al is formed thereon to a thickness of about 300 nm. Since the electrode has such a laminated structure, particularly Al functions as a reflective layer. If a transparent material is used for the counter electrode 12 as well, the emitted light can be emitted from the counter electrode 12 side. As the transparent material, ITO, Pt, Ir, Ni, or Pd can be used. The film thickness is preferably about 75 nm in order to ensure transparency, and more preferably thinner than this film thickness.
Further, a sealing substrate (not shown) is stuck on the counter electrode 12 via an adhesive layer 51.

  FIG. 5 is a schematic diagram of a cross section taken along line YY ′ of FIG. 3, and the structure of the partition 4 will be described using this. The partition wall 4 of this embodiment includes an inorganic partition wall 40 formed on the circuit element unit 14 and the pixel electrode 111, a first organic partition wall 411 (first partition wall) formed on the inorganic partition wall 40, The second organic partition 412 (second partition) is formed on the first organic partition 411. The inorganic partition 40 and the first organic partition 411 are formed to have an opening that covers the periphery of the pixel electrode 111 and exposes the center thereof, and the second organic partition 412 On the 1st organic partition 411, it forms except the linear part corresponding to the said notch part 42 (refer FIG. 3). Accordingly, when the linear portion is observed from the upper surface side of the partition wall 4, a groove-shaped notch 42 having the upper surface of the first organic partition wall 411 as the bottom surface and the second organic partition wall 412 as the side surface is formed. . The cutout portion 42 includes a branch line portion 421 extending from the opening portion and a main line portion 422 communicating with other pixel regions.

In the present embodiment, the inorganic partition 40 is made of SiO ₂ and has lyophilicity with respect to the liquid material for forming the organic functional film 110. The organic partition 41 is made of a heat-resistant insulating resin such as acrylic or polyimide, and has liquid repellency with respect to the liquid material.

An organic functional film 110 including a hole injection layer 60 and a light emitting layer 70 is formed in the opening. Further, the counter electrode 12 is collectively formed on the organic functional film 110 and the partition wall 4 by a vapor phase method such as vapor deposition, and is sandwiched between the pixel electrode 111 and the counter electrode 12. The organic functional film 110 constitutes the organic EL element 3.
The counter electrode 12 communicates with the organic functional film 110 by descending directly in the opening 4a of the partition wall 4 from the second organic partition wall 412 as a path for supplying power to the organic functional film 110 (energization path). It has a first path and a second path that passes through the notch 42 formed in the partition wall 4 and reaches the opening 4 a and communicates with the organic functional film 110.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device 1 will be described with reference to FIGS. 6 to 9 are cross-sectional views of the organic EL device 1 corresponding to the YY ′ position in FIG. 3 in the manufacturing process.

  In order to manufacture the organic EL device 1 of the present invention, first, the circuit element portion 14 is formed on the substrate 2 by a known technique. And the transparent conductive film used as the pixel electrode 111 is formed with ITO so that the whole surface of the board | substrate 2 may be covered. Next, by patterning this conductive film, as shown in FIG. 6A, a pixel electrode 111 is formed at a predetermined pixel formation position.

Next, an inorganic insulating material such as SiO ₂ is formed on the pixel electrode 111 and the circuit element portion 14 by a CVD method or the like to form a partition layer (not shown). Subsequently, a known photolithography technique, The partition layer is patterned using an etching technique. Thereby, as shown in FIG. 6B, the opening 40a is formed for each pixel region of each organic EL element 3 to be formed, and at the same time, the inorganic partition 40 is formed. The inorganic partition 40 is formed to have a thickness of about 0.1 μm to 0.5 μm, for example.

  Next, as shown in FIG. 6C, the first organic partition 411 is made of resin at a predetermined position of the inorganic partition 40, specifically, a position surrounding the pixel region, using a resin in the same manner as the inorganic partition 40 described above. It is formed to a thickness of about 0.5 μm to 2.0 μm.

  Next, as shown in FIG. 6D, the second organic partition 412 is formed on the first organic partition 411. At the time of formation, the resist mask is not provided in a portion corresponding to the notch portion 42, thereby forming the second organic partition wall 412 and simultaneously forming the branch line portion 421 and the trunk line portion 422 of the notch portion 41. When the second organic partition wall 412 is formed of the same material as the first organic partition wall 411, the second organic partition wall 412 is connected to the first organic partition wall 411 by controlling the etching time. When forming with a different material, the notch part 42 can be made into the desired depth using the difference in an etching rate. The second organic partition 412 is formed to have a thickness of about 2 μm to 10 μm, for example.

Next, as shown in FIG. 7 (e), the surface on which the pixel electrode 111, the inorganic partition 40, the first organic partition 411, and the second organic partition 412 are formed is subjected to surface treatment with plasma Pz. Contaminants such as organic substances adhering to the surface are removed to improve wettability, and lyophilicity is imparted to the liquid material described later. Specifically, the substrate 2 is heated to a predetermined temperature, for example, about 70 to 80 ° C., and then plasma processing (O ₂ plasma processing) using oxygen as a reaction gas under atmospheric pressure is performed. Next, the wettability of the inner surface of the opening of the first organic partition wall 411, the upper surface and inner surface of the opening of the second organic partition wall 412 and the inner surface of the notch portion 42 of the partition wall 4 is lowered by performing a liquid repellent treatment. Specifically, plasma treatment (CF ₄ plasma treatment) using tetrafluoromethane as a reaction gas under atmospheric pressure is performed, and then the substrate 2 heated for the plasma treatment is cooled to room temperature. Each surface is made liquid repellent and its wettability is lowered.
In this CF ₄ plasma treatment, the exposed surface of the pixel electrode 111 and the inorganic partition wall 40 are also somewhat affected. However, ITO that is a material of the pixel electrode 111 and SiO ₂ that is a constituent material of the inorganic partition wall 40 are Since the affinity for fluorine is poor, the wettability of the surface improved by oxygen plasma treatment is maintained.

  Next, a hole injection layer 60 is formed inside the opening 4 a of the partition wall 4. In the step of forming the hole injection layer 60, a droplet discharge method is particularly suitable. In this embodiment, as shown in FIG. 7 (f), an example using an inkjet method which is a droplet discharge method is shown. . A droplet 91a of a dispersion (liquid material) of PEDOT-PSS, which is a material for forming the hole injection layer 60, is disposed on the exposed surface of the pixel electrode 111 from the droplet discharge nozzle 90, and then the disposed liquid. By drying the material 91 by heat treatment, the hole injection layer 60 is formed as shown in FIG.

  Next, as shown in FIG. 8H, a light emitting layer 70 is formed on the hole injection layer 60 using an inkjet method. From the droplet discharge nozzle 90, the droplet 92a of the material for forming the light emitting layer 70 is discharged onto the hole injection layer 60, and then the liquid material 92 of the light emitting layer 70 disposed at 100 ° C. in a nitrogen atmosphere. Drying is performed by performing a heat treatment for about one hour, and a light emitting layer 70 is formed in the opening 4a formed in the partition wall 4, that is, in the pixel region A, as shown in FIG. As a solvent used in the material for forming the light emitting layer 70, for example, xylene is used.

  Here, when the organic functional film 110 composed of the hole injection layer 60 and the light emitting layer 70 is formed in this way, the liquid material of the hole injection layer 60 and the light emitting layer 70 is formed in the opening 4 a formed in the partition wall 4. Since the cutout portion 42 has liquid repellency when the liquid material is filled, the liquid material is prevented from flowing out from the opening 4a. Therefore, the hole injection layer 60 and the light emitting layer 70 are not formed in the cutout portion 42, and even if formed, the thickness is extremely thin.

  Next, as shown in FIG. 9J, the counter electrode 12 is formed by covering the organic functional film 110 and the organic partition 221 and laminating, for example, calcium with a thickness of about 5 nm and aluminum with a thickness of about 300 nm. In forming the counter electrode 12, for example, lithium fluoride may be formed on the light emitting layer 70 side as an electron injection layer in order to cause the organic EL element 3 to emit light efficiently. Further, in the formation of the counter electrode 12, unlike the formation of the hole injection layer 60 and the light emitting layer 70, by performing the deposition method, the sputtering method, or the like, the substrate is not selectively formed only in the pixel region, but the substrate 2, the counter electrode 12 is formed on almost the entire surface. Thereafter, an adhesive layer (not shown) is formed on the counter electrode 12, and a sealing substrate (not shown) is further adhered by this adhesive layer to perform sealing. Thereby, the organic EL device 1 of the present embodiment is obtained.

  The organic EL device 1 obtained by the manufacturing method as described above has two energization paths for supplying power to the organic functional film 110. Among them, the second path passing through the notch portion 42 according to the present invention has a low first organic partition wall 411, so that the level difference between the upper surface of the organic functional film 110 and the bottom surface of the notch portion 42 is reduced. ing. Therefore, even when the counter electrode 12 is formed collectively on the partition wall 4 and the organic functional film 110 using a vapor phase method such as an evaporation method or a sputtering method, the stepped portion has a good coverage, The second path is discontinuous at the stepped portion, and disconnection is prevented.

  In addition, since the disconnection of the second path is prevented in this way, even if a disconnection occurs in the first path, power is supplied to the organic functional film 110 via the second path. Therefore, the organic EL element 3 functions reliably. Therefore, a vapor phase method such as a vapor deposition method can be favorably used as a method for forming the counter electrode 12 on the partition 4 and the organic functional film 110 at once.

In addition, since the organic EL element 3 can be surely functioned even if the first path is disconnected, the organic function and the second organic partition wall 412 are formed when the counter electrode 12 is formed. The step between the film 110 and the film 110 may be increased. Therefore, the structure which forms the 2nd organic partition 412 high is possible.
In this case, when the organic functional film 110 is formed by a method using a droplet discharge method such as an ink jet method, the liquid material for forming the organic functional film 110 exceeds the second organic partition wall 412. Overflow to the neighboring pixel area A is prevented.

Therefore, the liquid material can be filled more in the opening 4a of the partition wall 4, and the light emitting film 70 and the like can be thickened. In general, a functional film made of an organic material deteriorates when energized. Therefore, if the film thickness is thin, the functional film has a short life. However, the light emitting layer 70 according to the present invention is formed to be sufficiently thick, and thus has a long life. It will be a thing. Therefore, the organic EL element 3 including the light emitting layer 70 and the like also has a long life.

  Further, since the liquid material of the organic functional film 110 is prevented from flowing out from the pixel region A into the notch 42 and spreading into the notch 42, the liquid material is placed in the opening 4a. The organic functional film 110 can be formed in a predetermined thickness.

  Further, the step of forming the partition 4 includes the step of forming the first organic partition 411 (first partition) with the pixel electrode 111 exposed, and the step of forming the partition on the first organic partition 411. A step of forming the second organic partition 412 (second partition) in a state having the notch 42, so that the partition 4 having the notch 42 is easily formed. be able to.

  In addition, since there is a step of imparting liquid repellency to the partition 4 between the step of forming the partition 4 and the step of forming the organic functional film 110, the inner surface and the upper surface of the partition 4 are provided. And liquid repellency can be reliably provided to the notch part 42 inner surface. Accordingly, when the organic functional film 110 is formed by a method using a droplet discharge method, the liquid material of the organic functional film 110 flows out from the pixel region A to the cutout portion 42 and spreads in the cutout portion 42. It is prevented. Therefore, a predetermined amount of the liquid material of the organic functional film 110 can be arranged in the opening 4a, and thereby the organic functional film 110 having a predetermined thickness can be formed.

As described above, the organic EL device 1 of the present invention functions reliably and has a long-life organic EL element, so that the device is highly reliable and has a long life.
In addition, according to the manufacturing method of the present invention, the partition walls 4 having the notches 42 can be easily formed, the counter electrodes 12 can be collectively formed, and a plurality of organic functional films 110 having different emission wavelength bands on the same substrate. Therefore, the productivity of the organic EL device 1 can be significantly increased.

(Other structural examples of organic EL devices)
In the embodiment, the example in which the first path that descends the opening 4a from the partition 4 and reaches the organic functional film 110 as the energization path for supplying power to the organic functional film 110 is shown. The first path may be disconnected. Specifically, the second organic partition wall 412 is formed higher, or at least a part of the side surface surrounding the opening 4a of the partition wall 4 is opened from the pixel electrode 111 side toward the counter electrode 12 side. By forming on the inclined surface (reverse taper surface) that reduces the diameter, the coverage property may be impaired on the side surface surrounding the opening 4a of the partition wall 4 when the counter electrode 12 is formed by the vapor phase method. it can.
In such a configuration, since power is supplied to the organic EL elements 3 only through the second path, the rows (scanning lines) and columns of the arranged organic EL elements 3 as in the present embodiment. If the configuration has the notch portion 41 communicating with each other, the wiring can be made independent for each row (scanning line) or each column. Therefore, the pixels can be driven independently for each row or column, and unevenness of light emission can be adjusted and improved by driving control of the pixels.

  In the present embodiment, the organic EL device 1 having a bottom emission structure is taken as an example, but a top emission structure in which light is extracted from the counter electrode 12 side may be used. Further, the structure of the partition 4 may not be a laminate of the inorganic partition 40 and the organic partition 41, and the organic partition 41 may be a single layer or three or more layers. Moreover, when it is set as the organic wall 41 which consists of multiple layers, you may change the material of each layer.

(Electronics)
Next, a specific example of an electronic apparatus provided with the organic EL device 1 of the present embodiment will be described.
FIG. 10A is a perspective view showing an example of a mobile phone. In FIG. 10A, reference numeral 1000 indicates a mobile phone body, and reference numeral 1001 indicates a display unit including the organic EL device 1.
FIG. 10B is a perspective view illustrating an example of a wristwatch type electronic device. In FIG. 10B, reference numeral 1100 indicates a watch body, and reference numeral 1101 indicates a display unit including the organic EL device 1.
FIG. 10C is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. 10C, reference numeral 1200 denotes an information processing apparatus, reference numeral 1202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing apparatus body, and reference numeral 1206 denotes a display unit including the organic EL device 1.
FIG. 10D is a perspective view showing an example of a thin large-screen television. In FIG. 10D, the thin large-screen television 1300 includes a thin large-screen television main body (housing) 1302, an audio output unit 1304 such as a speaker, and a display unit 1306 including the organic EL device 1.

  Since the electronic devices 1000, 1100, 1200, and 1300 shown in FIGS. 10A to 10D include the organic EL device 1, the display units 1001, 1101, 1206, and 1306 of the organic EL device 1 are included. By preventing color unevenness and extending the life, these electronic devices 1000, 1100, 1200, and 1300 have good display characteristics and longer life.

Explanatory drawing which shows the wiring structure of one Embodiment of the organic electroluminescent apparatus of this invention Plane schematic diagram of organic EL device Schematic view of the main part of the display area in plan view XX sectional view of FIG. YY 'arrow sectional view of FIG. The figure explaining the manufacturing method of an organic electroluminescent apparatus The figure explaining the manufacturing method of an organic electroluminescent apparatus The figure explaining the manufacturing method of an organic electroluminescent apparatus The figure explaining the manufacturing method of an organic electroluminescent apparatus Specific examples of electronic devices provided with the organic EL device of the present invention

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Organic EL apparatus, 2 ... Board | substrate, 4 ... Partition, 411 ... 1st organic partition (1st partition), 412 ... 2nd organic partition (2nd partition), 42 ... Notch part, 421 ... Branch line , 422 ... trunk part 12 ... counter electrode (second electrode), 60 ... hole injection layer, 70 ... light emitting layer, 110 ... organic functional film, 111 ... pixel electrode (first electrode)

Claims (6)

A substrate, a first electrode formed on the substrate, a partition wall formed on the first electrode and having an opening for partitioning the first electrode for each pixel region; and in the opening An organic functional film formed, and a second electrode formed on the organic functional film,
The partition wall is provided with a groove-shaped notch that communicates with the opening at least at a part of the circumference surrounding the opening.
Notch of said partition wall, which extends from the plurality of openings corresponding to the array is the pixel regions are in communication with each row or column,
The second electrode is formed so as to cover the entire surface of the partition, in the notch, and on the organic functional film, and at least continuously between the notch and the organic functional film. An organic EL device, wherein the organic EL device is provided so as to be driven independently for each row or column .   The organic EL device according to claim 1, wherein an inner surface of the notch of the partition wall has liquid repellency. At least a part of the side surface surrounding the opening of the partition wall is an inclined surface that reduces the diameter of the opening from the first electrode side toward the second electrode side. The organic EL device according to claim 1 or 2 . Forming a first electrode on a substrate;
On the first electrode, there is an opening that divides the first electrode for each pixel region, and at least a part of the circumference surrounding the opening has a groove-shaped notch that communicates with the opening. Forming a partition;
Forming an organic functional film in the opening of the partition wall by a liquid phase method;
Possess as on the partition wall, and the cut portion, and forming a second electrode by a vapor phase process over the entire surface of the organic functional film, and
Notch of said partition wall, which extends from the plurality of openings corresponding to the array is the pixel regions are in communication with each row or column,
The second electrode is formed so as to cover the entire surface of the partition, in the notch, and on the organic functional film, and at least continuously between the notch and the organic functional film. A method of manufacturing an organic EL device, wherein the organic EL device is provided so as to be driven independently for each row or column . The step of forming the partition includes
Forming a first partition on the first electrode in a state where the first electrode is exposed in the pixel region;
The method of manufacturing an organic EL device according to claim 4 , further comprising: forming a second partition wall in a state where the notch is provided on the first partition wall. A step of forming the partition wall, between the step of forming the organic functional layer, the organic EL according to claim 4 or claim 5, further comprising a step of imparting liquid repellency to the partition wall Device manufacturing method.

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