JP4943157B2 - 挿入力がゼロであるような高周波コネクタ - Google Patents
挿入力がゼロであるような高周波コネクタ Download PDFInfo
- Publication number
- JP4943157B2 JP4943157B2 JP2006538508A JP2006538508A JP4943157B2 JP 4943157 B2 JP4943157 B2 JP 4943157B2 JP 2006538508 A JP2006538508 A JP 2006538508A JP 2006538508 A JP2006538508 A JP 2006538508A JP 4943157 B2 JP4943157 B2 JP 4943157B2
- Authority
- JP
- Japan
- Prior art keywords
- signal
- conductor
- shielded
- connector
- compressible interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003780 insertion Methods 0.000 title description 2
- 230000037431 insertion Effects 0.000 title description 2
- 239000004020 conductor Substances 0.000 claims description 292
- 238000000034 method Methods 0.000 claims description 19
- 235000012431 wafers Nutrition 0.000 claims description 18
- 239000011810 insulating material Substances 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 229910001111 Fine metal Inorganic materials 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 235000018936 Vitellaria paradoxa Nutrition 0.000 claims 1
- 238000004891 communication Methods 0.000 description 23
- 239000000758 substrate Substances 0.000 description 11
- 238000005476 soldering Methods 0.000 description 10
- 229920000106 Liquid crystal polymer Polymers 0.000 description 7
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
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- 229910000679 solder Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000013013 elastic material Substances 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
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- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 238000005498 polishing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
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- 239000011888 foil Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/735—Printed circuits including an angle between each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/702,192 US7074047B2 (en) | 2003-11-05 | 2003-11-05 | Zero insertion force high frequency connector |
| US10/702,192 | 2003-11-05 | ||
| PCT/US2004/036936 WO2005046005A1 (en) | 2003-11-05 | 2004-11-05 | Zero insertion force high frequency connector |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007511051A JP2007511051A (ja) | 2007-04-26 |
| JP2007511051A5 JP2007511051A5 (enExample) | 2007-12-27 |
| JP4943157B2 true JP4943157B2 (ja) | 2012-05-30 |
Family
ID=34551610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006538508A Expired - Fee Related JP4943157B2 (ja) | 2003-11-05 | 2004-11-05 | 挿入力がゼロであるような高周波コネクタ |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7074047B2 (enExample) |
| EP (1) | EP1687870B1 (enExample) |
| JP (1) | JP4943157B2 (enExample) |
| CN (1) | CN1902786B (enExample) |
| CA (1) | CA2544851C (enExample) |
| WO (1) | WO2005046005A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7503768B2 (en) | 2003-11-05 | 2009-03-17 | Tensolite Company | High frequency connector assembly |
| US7404718B2 (en) | 2003-11-05 | 2008-07-29 | Tensolite Company | High frequency connector assembly |
| US7074047B2 (en) * | 2003-11-05 | 2006-07-11 | Tensolite Company | Zero insertion force high frequency connector |
| US7291842B2 (en) * | 2005-06-14 | 2007-11-06 | Varian Medical Systems Technologies, Inc. | Photoconductor imagers with sandwich structure |
| DE102005033915A1 (de) * | 2005-07-20 | 2007-02-01 | Tyco Electronics Amp Gmbh | Koaxialer Verbinder |
| US7666008B2 (en) * | 2006-09-22 | 2010-02-23 | Onanon, Inc. | Conductive elastomeric and mechanical pin and contact system |
| US7699617B2 (en) * | 2007-10-08 | 2010-04-20 | Winchester Electronics Corporation | Modular interconnect apparatus |
| US9692188B2 (en) * | 2013-11-01 | 2017-06-27 | Quell Corporation | Flexible electrical connector insert with conductive and non-conductive elastomers |
| US9468103B2 (en) * | 2014-10-08 | 2016-10-11 | Raytheon Company | Interconnect transition apparatus |
| US9660333B2 (en) | 2014-12-22 | 2017-05-23 | Raytheon Company | Radiator, solderless interconnect thereof and grounding element thereof |
| GB2539964A (en) * | 2015-07-03 | 2017-01-04 | Sevcon Ltd | Electronics assembly |
| US9780458B2 (en) | 2015-10-13 | 2017-10-03 | Raytheon Company | Methods and apparatus for antenna having dual polarized radiating elements with enhanced heat dissipation |
| US10429321B2 (en) | 2016-08-29 | 2019-10-01 | Kla-Tencor Corporation | Apparatus for high-speed imaging sensor data transfer |
| WO2018081087A1 (en) * | 2016-10-25 | 2018-05-03 | Quell Corporation | Hybrid flexible electrical connector insert |
| US10361485B2 (en) | 2017-08-04 | 2019-07-23 | Raytheon Company | Tripole current loop radiating element with integrated circularly polarized feed |
| US12407123B1 (en) | 2020-11-23 | 2025-09-02 | Quell Corporation | Electrically dissipative flexible unitary connector insert |
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| JPS6014474B2 (ja) * | 1979-01-25 | 1985-04-13 | アルプス電気株式会社 | 電気的接続部材の製造方法 |
| JPS5745169U (enExample) * | 1980-08-28 | 1982-03-12 | ||
| US4556265A (en) * | 1981-06-29 | 1985-12-03 | Rca Corporation | RF Coaxial-strip line connector |
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| US7107034B2 (en) | 2003-06-27 | 2006-09-12 | The Boeing Company | High frequency and low noise interconnect system |
| JP4590406B2 (ja) * | 2003-07-17 | 2010-12-01 | ウィンチェスター・エレクトロニクス・コーポレイション | 高速電気コネクタ |
| US7074047B2 (en) | 2003-11-05 | 2006-07-11 | Tensolite Company | Zero insertion force high frequency connector |
| US6822162B1 (en) | 2003-11-07 | 2004-11-23 | Agilent Technologies, Inc. | Microcircuit housing with sloped gasket |
| US6767248B1 (en) | 2003-11-13 | 2004-07-27 | Chen-Hung Hung | Connector for coaxial cable |
-
2003
- 2003-11-05 US US10/702,192 patent/US7074047B2/en not_active Expired - Lifetime
-
2004
- 2004-11-05 JP JP2006538508A patent/JP4943157B2/ja not_active Expired - Fee Related
- 2004-11-05 CA CA2544851A patent/CA2544851C/en not_active Expired - Fee Related
- 2004-11-05 EP EP04810401.2A patent/EP1687870B1/en not_active Expired - Lifetime
- 2004-11-05 WO PCT/US2004/036936 patent/WO2005046005A1/en not_active Ceased
- 2004-11-05 CN CN2004800392322A patent/CN1902786B/zh not_active Expired - Fee Related
-
2006
- 2006-05-03 US US11/381,435 patent/US7249953B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1902786A (zh) | 2007-01-24 |
| EP1687870B1 (en) | 2016-11-02 |
| JP2007511051A (ja) | 2007-04-26 |
| US20060194477A1 (en) | 2006-08-31 |
| US7074047B2 (en) | 2006-07-11 |
| CN1902786B (zh) | 2012-01-04 |
| CA2544851C (en) | 2012-08-14 |
| CA2544851A1 (en) | 2005-05-19 |
| US7249953B2 (en) | 2007-07-31 |
| WO2005046005A1 (en) | 2005-05-19 |
| EP1687870A1 (en) | 2006-08-09 |
| US20050095896A1 (en) | 2005-05-05 |
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