JP4921645B2 - ウエハレベルｃｓｐ - Google Patents

ウエハレベルｃｓｐ Download PDF

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Publication number
JP4921645B2
JP4921645B2 JP2001057277A JP2001057277A JP4921645B2 JP 4921645 B2 JP4921645 B2 JP 4921645B2 JP 2001057277 A JP2001057277 A JP 2001057277A JP 2001057277 A JP2001057277 A JP 2001057277A JP 4921645 B2 JP4921645 B2 JP 4921645B2
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JP
Japan
Prior art keywords
semiconductor substrate
electrode pad
metal wiring
disposed
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001057277A
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English (en)
Japanese (ja)
Other versions
JP2002261192A (ja
JP2002261192A5 (enExample
Inventor
紀幸 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP2001057277A priority Critical patent/JP4921645B2/ja
Publication of JP2002261192A publication Critical patent/JP2002261192A/ja
Publication of JP2002261192A5 publication Critical patent/JP2002261192A5/ja
Application granted granted Critical
Publication of JP4921645B2 publication Critical patent/JP4921645B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2001057277A 2001-03-01 2001-03-01 ウエハレベルｃｓｐ Expired - Fee Related JP4921645B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001057277A JP4921645B2 (ja) 2001-03-01 2001-03-01 ウエハレベルｃｓｐ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001057277A JP4921645B2 (ja) 2001-03-01 2001-03-01 ウエハレベルｃｓｐ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011062223A Division JP5200130B2 (ja) 2011-03-22 2011-03-22 ウエハレベルｃｓｐの製造方法

Publications (3)

Publication Number Publication Date
JP2002261192A JP2002261192A (ja) 2002-09-13
JP2002261192A5 JP2002261192A5 (enExample) 2008-01-24
JP4921645B2 true JP4921645B2 (ja) 2012-04-25

Family

ID=18917179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001057277A Expired - Fee Related JP4921645B2 (ja) 2001-03-01 2001-03-01 ウエハレベルｃｓｐ

Country Status (1)

Country Link
JP (1) JP4921645B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4072505B2 (ja) 2003-02-28 2008-04-09 エルピーダメモリ株式会社 積層型半導体パッケージ
US7863188B2 (en) 2005-07-29 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5127178B2 (ja) * 2005-07-29 2013-01-23 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2008034704A (ja) * 2006-07-31 2008-02-14 New Japan Radio Co Ltd 半導体装置の製造方法
JP4946693B2 (ja) * 2007-07-24 2012-06-06 ソニー株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135270A (ja) * 1996-10-31 1998-05-22 Casio Comput Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2002261192A (ja) 2002-09-13

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