JP4918075B2 - 放熱ピン部材の製造方法及び放熱ピン部材を含むパッケージ基板の製造方法 - Google Patents
放熱ピン部材の製造方法及び放熱ピン部材を含むパッケージ基板の製造方法 Download PDFInfo
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Description
101 支持体
102 樹脂層
103 スタンプ
104 放熱ピン製造用溝
105 モールド
106 焼成型ペースト
107 放熱部
Claims (9)
- 放熱ピン部と前記放熱ピン部を支持する支持部とを備え、半導体チップの放熱用に用いられる、放熱ピン部材の製造方法であって、
(A)支持体の一面に放熱ピン部材製造用溝が形成された樹脂層を有するモールドを製造する段階;
(B)前記放熱ピン部材製造用溝を含む前記モールドの一面に、カーボン成分及びバインダーを含む焼成型ペーストを印刷する段階;
(C)前記支持体を除去して放熱部を形成する段階;及び
(D)前記放熱部に焼成工程を行って前記樹脂層及び前記バインダーを除去する段階;
を含み、
前記焼成型ペーストは、カーボンナノチューブ又はカーボンナノファイバーと、金属微粒子と、バインダーとを含む、放熱ピン部材の製造方法。 - 前記(A)段階は、
(A1)支持体の一面に樹脂層を積層する段階;
(A2)放熱ピン部材製造用溝に対応するパターンを有するスタンプで前記樹脂層をインプリンティングする段階;及び
(A3)前記スタンプを除去する段階;
を含む、請求項1に記載の放熱ピン部材の製造方法。 - 前記(B)段階の後、
(B1)前記印刷された焼成型ペーストを乾燥させる段階をさらに含む、請求項1又は2に記載の放熱ピン部材の製造方法。 - 前記(D)段階の後、
(E)反応性イオンエッチング(RIE)工程によって、前記焼成工程で除去されなかった前記樹脂層及び前記バインダーを除去する段階をさらに含む、請求項1から3のいずれか1項に記載の放熱ピン部材の製造方法。 - 放熱ピン部と前記放熱ピン部を支持する支持部とを備える放熱ピン部材を含むパッケージ基板の製造方法であって、
(A)支持体の一面に放熱ピン部材製造用溝が形成された樹脂層を有するモールドを製造する段階;
(B)前記放熱ピン部材製造用溝を含む前記モールドの一面に、カーボン成分及びバインダーを含む焼成型ペーストを印刷する段階;
(C)前記支持体を除去して放熱部を形成する段階;
(D)前記放熱部に焼成工程を行って前記樹脂層及び前記バインダーを除去し、放熱ピン部材を製造する段階;及び
(E)前記放熱ピン部材を、プリント基板に実装された半導体チップ上に付着する段階;
を含み、
前記焼成型ペーストは、カーボンナノチューブ又はカーボンナノファイバーと、金属微粒子と、バインダーとを含む、放熱ピン部材を含むパッケージ基板の製造方法。 - 前記(A)段階は、
(A1)支持体の一面に樹脂層を積層する段階;
(A2)放熱ピン部材製造用溝に対応するパターンを有するスタンプで前記樹脂層をインプリンティングする段階;及び
(A3)前記スタンプを除去する段階;
を含む、請求項5に記載の放熱ピン部材を含むパッケージ基板の製造方法。 - 前記(B)段階の後、
(B1)前記印刷された焼成型ペーストを乾燥させる段階をさらに含む、請求項5又は6に記載の放熱ピン部材を含むパッケージ基板の製造方法。 - 前記(D)段階の後、
(D1)反応性イオンエッチング(RIE)工程によって、前記焼成工程で除去されなかった前記樹脂層及び前記バインダーを除去する段階をさらに含む、請求項5から7のいずれか1項に記載の放熱ピン部材を含むパッケージ基板の製造方法。 - 前記放熱ピン部材は、前記半導体チップを含む、前記半導体チップが実装された前記プリント基板の表面を外部から密封するために、カバー構造を有する、請求項5から8のいずれか1項に記載の放熱ピン部材を含むパッケージ基板の製造方法。
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JPH09162338A (ja) * | 1995-12-07 | 1997-06-20 | Janome Sewing Mach Co Ltd | Lsi用ヒートシンク及びその製造法 |
JP2002110874A (ja) * | 2000-09-29 | 2002-04-12 | Edl:Kk | ヒートシンクとその製造方法 |
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JP2004207690A (ja) * | 2002-12-13 | 2004-07-22 | Usui Kokusai Sangyo Kaisha Ltd | 樹脂材製ヒートシンク |
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CN101232794B (zh) * | 2007-01-24 | 2011-11-30 | 富准精密工业(深圳)有限公司 | 均热板及散热装置 |
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2008
- 2008-05-30 KR KR1020080051003A patent/KR101022954B1/ko not_active IP Right Cessation
- 2008-07-22 US US12/219,442 patent/US20090294956A1/en not_active Abandoned
- 2008-08-20 JP JP2008211566A patent/JP4918075B2/ja not_active Expired - Fee Related
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2011
- 2011-09-01 US US13/137,669 patent/US8377748B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US8377748B2 (en) | 2013-02-19 |
KR20090124662A (ko) | 2009-12-03 |
JP2009290185A (ja) | 2009-12-10 |
US20110308069A1 (en) | 2011-12-22 |
KR101022954B1 (ko) | 2011-03-16 |
US20090294956A1 (en) | 2009-12-03 |
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