JP4899759B2 - Lead frame member for solid electrolytic capacitors - Google Patents

Description

  The present invention relates to a lead frame member having a pocket structure for use in a solid electrolytic capacitor, a solid electrolytic capacitor using the lead frame member, and a manufacturing method thereof.

  In recent years, with the digitization of electrical equipment and the speeding up of personal computers, small and large-capacitance capacitors and capacitors with low impedance in the high frequency region are required. Recently, a solid electrolytic capacitor using a conductive polymer having electronic conductivity as a solid electrolyte has been proposed.

A general solid electrolytic capacitor element has a structure as shown in FIG. 1, and a dielectric oxide film (2) is provided on a valve action metal surface (1) such as etched aluminum, tantalum or titanium. A solid electrolyte layer (4) and a conductor layer (5) made of an organic material layer such as a conductive polymer or an inorganic material layer such as a metal oxide are provided on top, and insulation for separating the cathode and the anode as necessary. A layer (3) is provided to form a capacitor element.
Usually, a plurality of these capacitor elements are laminated, and the anode terminal (the end surface portion not provided with the solid electrolyte) from which the valve metal is exposed is joined to the anode lead frame portion (6), while the conductive layer portion (cathode) 2) is joined to the cathode lead frame portion (7) with a conductive adhesive, and the whole is sealed with an insulating resin (8) such as an epoxy resin, so that the multilayer solid electrolytic capacitor (11) shown in FIG. create.

  However, generally, the capacitor element has a larger cathode part thickness than the anode part, and therefore, when a plurality of elements are stacked, swelling on the cathode part side increases. As shown in FIG. 2, a spacer (9) is interposed to eliminate this difference in thickness. However, since the difference in thickness between the cathode and anode portions varies from element to element, Even if it is provided, it is difficult to arrange the elements completely in parallel. There are also irregularities on the surface of the conductive layer of the element.

  For this reason, in a manufacturing process in which a certain amount of conductive adhesive is applied, the conductive adhesive may be excessive or insufficient. If the amount of the conductive adhesive is too small, the current collecting property is deteriorated and the ESR (equivalent series resistance) is increased. If there is too much conductive adhesive, extra adhesive may overflow and spread between the elements. In the manufacturing method using a lead frame, the distance between the capacitor areas is relatively narrow in order to increase the manufacturing efficiency, so if the excess adhesive escapes, it may reach the adjacent lead frame or capacitor area. , Causing a short circuit and reducing the current collecting characteristics. Even when the short circuit is not reached, the conductive adhesive is exposed at the time of sealing, which causes a defective appearance of the solid electrolytic capacitor.

  In order to solve the above-mentioned problem, Japanese Patent Publication No. 2003-45753 (Patent Document 1) discloses a “tilt-like bending process with a step for arranging an anode part and a cathode part of a capacitor element on a lead frame. In addition, Japanese Patent No. 3543489 (Patent Document 2) of the same applicant describes that “a lead frame portion that contacts the exterior resin and a lead frame portion positioned outside the exterior resin”. And forming a stepped bent portion in a portion located inside the exterior resin in the portion where the hole or notch is formed ''. .

  In the former, a pocket-shaped recess is formed by a lead frame, and capacitor elements are stacked inside. However, since the “step” and the “tilt-shaped bent portion” are formed separately, The corners are not sealed. On the other hand, in any of the above-mentioned patent documents, the Chiritori-shaped bending portion is provided over the entire anode portion and cathode portion of the capacitor element, and these bending portions are provided only in a part of the anode portion and the cathode portion. The configuration is not described.

Japanese Patent Publication No. 2003-45753 Japanese Patent No. 3543489

  SUMMARY OF THE INVENTION An object of the present invention is to eliminate a misalignment caused by unevenness of an element and increase a yield, and to eliminate a decrease in ESR value caused by a protruding or spreading of a conductive adhesive when a capacitor element is laminated. .

  As a result of intensive studies in view of the above problems, the present inventors have devised the shape of a current collecting lead frame used in manufacturing a multilayer solid capacitor and adopting a pocket type lead frame, The present inventors have found that it is possible to provide a low ESR solid electrolytic capacitor with high stacking efficiency by suppressing the stacking deviation caused by the unevenness and the protrusion and spreading of the bonding conductor during stacking. In particular, (1) the lead frame lead-out part is provided with a bent structure, and the wall part (which contacts or faces the element end face when the capacitor element is mounted) and the side wall cooperate to form a corner at the corner of the capacitor element mounting surface. Forming the wall structure of the mold, or (2) finding that excellent results can be obtained by providing the side walls on both sides of the capacitor element mounting surface with the height of the side walls changed depending on the position, and completed the present invention It came to do.

That is, the present invention relates to the following lead frame members.
(1) For use in a capacitor element having an anode at one end and a cathode at the other end, the anode of the capacitor element, the anode corresponding to the cathode, and the cathode are opposed to each other with a gap therebetween. A lead frame member provided, wherein the anode part and / or the cathode part has a side wall on a capacitor element mounting surface, and a height of the side wall varies depending on a part. .
(2) The lead frame member according to 1 above, wherein a lead frame lead-out portion continuous with the anode portion and / or the cathode portion has a structure located above the capacitor element mounting surface.
(3) The lead frame member according to the above (2), wherein the side wall wraps around the end face of the anode part and / or the cathode part to form a square wall structure at the corner of the capacitor element mounting surface.
(4) The lead frame member according to any one of (1) to (3), wherein the side wall is partially provided on a capacitor element mounting surface.
(5) The lead frame member as described in 4 above, wherein the side wall is provided only on 50% to 90% of the capacitor element mounting surface.
(6) The lead frame member according to any one of (1) to (5), wherein the side wall has the highest lead frame lead-out portion and the lowest side on the gap side.
(7) The lead frame member according to any one of (1) to (5), wherein the side wall has the lowest lead frame lead-out portion and the highest height on the gap side.
(8) A chip-type solid electrolytic capacitor in which a capacitor element is mounted on the lead frame member according to any one of 1 to 7 and the whole is sealed.
(9) A multilayer solid electrolytic capacitor in which a plurality of capacitor elements are mounted on the lead frame member according to any one of 1 to 7 and the whole is sealed.
(10) A plurality of cathodes of capacitor elements are laminated on the cathode portion of the lead frame member according to any one of 1 to 7 above using a conductive adhesive, and the whole is sealed after welding the anode. A method for producing a laminated solid electrolytic capacitor.

  The solid electrolytic capacitor using the pocket type lead frame member of the present invention eliminates the stacking deviation due to the unevenness of the element, and the protrusion and spread of the conductive adhesive when the capacitor element with less unevenness is stacked. Stacking efficiency and low ESR can be realized.

  The present invention, by making the shape of the lead frame for current collection used when manufacturing the multilayer solid capacitor into a pocket type, suppresses the misalignment due to the unevenness of the element and the protrusion and spread of the bonding conductor, The present invention provides a solid electrolytic capacitor with high lamination efficiency and low ESR.

(Basic structure)
The lead frame of the present invention is for use in a flat rectangular capacitor element having an anode at one end and a cathode at the other end. In this lead frame member, an anode part and a cathode part corresponding to the anode and cathode of the capacitor element are provided facing each other with a gap therebetween, and at least the side surfaces of the anode part and / or the cathode part are the capacitor elements of the lead frame. It is formed in a wall shape with respect to the mounting surface (the surface on which the capacitor elements are stacked), and the height of the side wall varies depending on the position.

  The angle formed by the capacitor element mounting surface and the inner surface of the side wall is preferably 70 to 100 degrees, more preferably substantially 90 degrees. If the angle is less than 70 degrees, the side walls interfere when the element is inserted into the mounting surface, making stacking difficult. If the angle is larger than 100 degrees, the positional deviation of the elements at the time of stacking occurs, and the space is wasted.

  The relationship between the capacitor element mounting surface of the lead frame and the lead portion may be either a planar type or a non-planar type. Here, the flat type means that the lead part of the lead frame is flush with the capacitor element mounting surface, and the non-planar type means that the lead frame lead part is above the cathode or anode side end face of the capacitor element. In other words, this means that a bent structure is provided in the lead frame lead-out portion, thereby forming a wall portion that contacts or faces the end face when the capacitor element is mounted. In the former case, a U-shaped groove is formed by the side wall of the capacitor element mounting surface. In the latter case, a recess is formed by the side wall and the step. In the present invention, these grooves and recesses that can accommodate capacitor elements are collectively referred to as a pocket structure.

  By adopting such a pocket structure for the lead frame, the position of the element at the time of stacking is accurately determined, so that the variation in capacitance is reduced and the ESR value is lowered. In addition, by creating a wall that surrounds the element, even if the conductive adhesive used to fix the laminated element escapes during the lamination process, the excess adhesive will stop at the wall and be on the outside of the lead frame It does not ooze out and spread. In addition, since the lead frame plays the role of a wall, there is an effect that the capacitor element is less damaged when the sealing resin is filled, and the leakage current is remarkably reduced.

Various shapes are conceivable as the pocket structure. The present invention is characterized in that the height of the side wall of the lead frame is made different depending on the position. Specifically, as shown in FIG. 3, a shape in which a cutout portion is obliquely formed on the side wall is preferable.
In the example of FIG. 3, (a) to (c) are examples in which the height of the side wall on the anode portion side is changed.
(a) is an example in which a flat lead frame is used, the notch is slanted, and the height of the anode end portion (leading portion side) is lowered.
(b) is an example in which a flat lead frame is used, the notch is slanted, and the height of the anode end (leader side) is increased.
(c) is an example in which a non-planar lead frame is used, the notch is slanted, and the height of the anode end (leader side) is increased.
Note that (d) is an example in which a bent structure is provided at the anode end portion (leading portion side) and the height of the side wall of the anode portion is constant.

(e)-(g) is the example which changed the height of the side wall by the side of a cathode part.
(e) is an example in which a non-planar lead frame is used, the notch is slanted, and the height of the cathode end (leading portion side) is increased.
(f) is an example in which a non-planar lead frame is used, the notch is slanted, and the height of the cathode end portion (leading portion side) is increased. The side wall portion is not a raised capacitor element mounting surface.
(g) is an example in which a non-planar lead frame is used, the notch is slanted, and the height of the cathode end portion (leading portion side) is increased. The side wall portion is obtained by raising the capacitor element mounting surface.
In addition, (h) is an example in which a bent structure is provided at the cathode end portion (leading portion side) and the height of the side wall of the cathode portion is constant.

The lead frame of the present invention is formed by combining the cathode part and the anode part having the shape as described above.
A combination of an anode part and a cathode part (anode part: (a) to (c) and cathode part: (e) to (g) in FIG. 3) having a lead-out part with a notch provided obliquely. The anode part or the cathode part having a lead-out part having a shape in which the notch part is provided obliquely (in FIG. 3, the anode part: (a) to (c) and the cathode part: (e) to (g) )) And an anode or cathode having a lead-out portion having a shape in which notches are not provided obliquely (in FIG. 3, anode portion: (d) and cathode portion (h)) may be combined.
The examples given here are merely examples, and various other patterns are conceivable.

By adopting such a pocket structure, even when the thickness of the cathode portion of the element to be laminated is uneven or when each element loses flatness and has unevenness, it can be laminated without being misaligned. It becomes possible, and the sealing defect resulting from the defect of a lamination | stacking form can be reduced.
In the present invention, in particular, (1) a square wall structure is formed at the corner of the capacitor element mounting surface by cooperating the bent structure in the non-planar structure and the side wall (the above (f), (g) (H) and (i)), (2) The side wall is provided only on a part of the capacitor element mounting surface, and the height of one end of either the cathode part or the anode part is made higher than the other (the above ( It is preferable to take at least one of the constitutions a) to (c) and (e) to (g)). The height of the end of the side wall may be set higher than the bent structure of the lead frame (the above (a) to (c), (e)), even if the height is the same as the bent structure of the lead frame. Good (above (d), (f) to (i)). The angle of inclination of the notch is not particularly limited, but is usually 20 degrees or more and less than 90 degrees, preferably 30 degrees or more and less than 80 degrees. If the angle is small, it is difficult to handle a small-sized capacitor, and if it is too large, the effect of the present invention is not sufficiently exhibited.

  Among these, for (2), even in the conventional structure, since the anode part and the cathode part of the lead frame are separated, there is a side wall at a position corresponding to the insulating part between the anode and the cathode of the capacitor element. Not provided. However, in the present invention, there is a great point that a portion (notch) in which a side wall is not provided also exists at a position in contact with the negative (positive) electrode portion of the capacitor element on the negative (positive) electrode side lead frame. It is a feature.

This is because the yield after sealing is improved by several percent when the lead frame on the cathode side is not in contact with the element. Although the exact reason for this is not clear, the load on the capacitor element during lamination is light because the smoothness of the mating surface during lamination and the strength of that part are more stable when not in contact with the lead frame. It is thought that it became.
However, when the notch is too large, the conductive adhesive may leak and spread from there, so the width should be such that the conductive adhesive does not leak. The specific ratio depends on the properties of the conductive adhesive, but it is preferable that the side walls be 50% or more and 90% or less on both sides of the capacitor element mounting surface.

  The material of the lead frame is not particularly limited as long as it is generally used, and particularly preferably a copper alloy having a high electric conductivity (for example, Cu—Ni, Cu—Sn, Cu—Fe). , Cu—Ni—Sn, Cu—Co—P, Cu—Zn—Mg, Cu—Sn—Ni—P alloys, etc.) can be used.

  The outer surface of the lead frame is usually plated with a low-melting-point metal (for example, tin), but the inner part covered with the sealing resin can be adversely affected by the dissolution of tin. In consideration of the above, it is preferable to perform plating using a high conductivity material such as silver having a high melting point of 300 ° C. or higher.

(Other configurations of solid electrolytic capacitor elements)
Other configurations of the solid electrolytic capacitor element are not particularly limited as long as they can be used in the field.

[Anode substrate]
For example, the conductor portion of the capacitor element is generally made of a metal having a dielectric on the surface. The metal that can be used in the present invention is mainly a metal having a valve action, and is a simple metal such as aluminum, tantalum, niobium, titanium, zirconium, magnesium, silicon, or an alloy thereof. Further, the porous form may be any form as long as it is a form of a porous molded body such as an etched product of a rolled foil or a fine powder sintered body. Although the thickness of a conductor changes with purposes of use, for example, a foil having a thickness of about 40 to 300 μm is used. Although the size and shape of the metal foil vary depending on the application, a rectangular element having a width of about 1 to 50 mm and a length of about 1 to 50 mm is preferable as a flat element unit, more preferably about 2 to 15 mm in width and about 2 in length. ~ 25 mm.

  Further, in the pocket-shaped lead frame of the present invention, there is no difference in electrical characteristics depending on the shape of these metals, and the shape of the foil as described above may be used, or a sintered body may be used. I do not care.

  As the conductor, a porous sintered body of these metals, a plate (including a ribbon, a foil, etc.) surface-treated by etching or the like can be used, and preferably a flat plate or a foil. Furthermore, a known method can be used as a method of forming a dielectric oxide film on the surface of the porous metal body. For example, when an aluminum foil is used, an oxide film can be formed by anodizing in an aqueous solution containing boric acid, phosphoric acid, adipic acid, or a sodium salt or an ammonium salt thereof. Moreover, when using the sintered compact of a tantalum powder, for example, it can anodize in phosphoric acid aqueous solution and can form an oxide film in a sintered compact.

[Insulation layer]
The insulating layer may be formed by applying an insulating resin and a masking material, or may be formed by attaching an insulating tape. As a masking material, a general heat resistant resin, preferably a heat resistant resin which can be dissolved or swelled in a solvent or a precursor thereof, a composition comprising inorganic fine powder and a cellulose resin, etc. can be used, but the material is not limited. Specific examples include polyphenylsulfone (PPS), polyethersulfone (PES), cyanate ester resin, fluororesin (tetrafluoroethylene, tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer, etc.), low molecular weight polyimides and their Examples thereof include derivatives and precursors thereof, and low molecular weight polyimides, polyethersulfones, fluororesins and their precursors are particularly preferable.
The width of the insulator is 1.0 mm or less, preferably 0.8 mm or less.

[Solid electrolyte layer]
The solid electrolyte layer may be formed of any one of a conductive polymer, a conductive organic material, a conductive inorganic oxide, and the like. In addition, a plurality of materials may be sequentially formed, or a composite material may be formed. Preferably, a known conductive polymer, for example, a conductive polymer containing at least one divalent group of pyrrole, thiophene, or aniline structure or a substituted derivative thereof as a repeating unit can be used. For example, a method in which a 3,4-ethylenedioxythiophene monomer and an oxidizing agent are preferably applied in the form of a solution, separately or together, and applied to an oxide film layer of a metal foil (JP-A-2-15611). And the like described in Japanese Patent Laid-Open No. 10-32145).

  In general, a dopant is used for the conductive polymer, and any dopant compound can be used as the dopant. For example, organic sulfonic acid, inorganic sulfonic acid, organic carboxylic acid and salts thereof can be used. In general, an aryl sulfonate dopant is used. For example, salts such as benzenesulfonic acid, toluenesulfonic acid, naphthalenesulfonic acid, anthracenesulfonic acid, anthraquinonesulfonic acid, or substituted derivatives thereof can be used. Further, as a compound that can bring out particularly excellent capacitor performance, a compound having one or more sulfonic acid groups and a quinone structure in the molecule, a heterocyclic sulfonic acid, and a salt thereof may be used.

[Conductor layer]
The conductor layer is generally formed by applying a carbon paste as a base and applying a silver paste thereon. However, the conductor layer may be formed only by applying a silver paste, or the conductor layer may be formed by a method other than coating. May be.

  The same effect can be obtained when the capacitor element is a single plate capacitor element or a multilayer capacitor element. As shown in FIG. 2, the multilayer capacitor element is formed by laminating a plurality of capacitor elements (four in the illustrated example), and the cathode portions of the capacitor elements are joined together by a conductive adhesive such as silver paste. Formed.

[Conductive adhesive]
The conductive adhesive is a material in which a resin paste having a role of fixing and a conductive metal are mixed, and has a property of conducting electricity and a property of fixing materials together.
As the conductive adhesive used in the present invention, those generally used for solid electrolytic capacitors can be used, and a paste having silver as the main component or a curable resin is preferable.

As a method of connecting the pocket type lead frame and the capacitor element, the anode side is connected by resistance welding the anode part of the lead frame after covering the anode side of the capacitor element with an adhesive conductor. After the resistance welding, the welded portion may be completely covered with a conductive adhesive. Thereby, the leakage current decreases and the ESR value increases.
The cathode may be formed by applying an existing conductive adhesive to the element and sequentially laminating it.

  The lead frame having the pocket structure of the present invention is preferably formed sequentially by several steps of the mold, and then moved from the outer processed portion to the inner processed portion in order to make the pocket structure. It may be formed automatically.

The present invention relates to a lead frame having a pocket structure as described above, and a solid electrolytic capacitor using the lead frame.
The solid electrolytic capacitor element thus obtained is usually made into a capacitor product for various applications by connecting lead terminals and applying an exterior such as a resin mold, a resin case, a metal outer case, or a resin dipping.

  The present invention will be described in more detail below with typical examples. Note that these are illustrative examples, and the present invention is not limited to these.

Example 1:
[Formation of oxide film]
An aluminum conversion foil (thickness: 100 μm) was cut into a minor axis direction of 3 mm × a major axis direction of 10 mm, and a polyimide solution having a width of 0.8 mm was applied to both sides in a circumferential manner so as to divide the major axis direction into 5 mm portions and dried. A first masking was created. A 10 mass% ammonium adipate aqueous solution was applied to a 3 × 5 mm portion of the chemical conversion foil, and a dielectric oxide film was formed by applying a voltage of 4 V to form a cut portion.

[Formation of solid electrolyte layer]
Next, a polyimide solution having a width of 0.8 mm was applied to both sides so as to divide the major axis direction into 4 mm portions, and dried to create a second masking.
A 3 × 4 mm portion of this aluminum foil was impregnated with isopropyl alcohol (IPA) solution in which 3,4-ethylenedioxythiophene (2.0 mol / L) was dissolved for 5 seconds, and then dried at room temperature for 5 minutes, It was immersed for 5 seconds in a 1.5 mol / L ammonium persulfate aqueous solution adjusted so that sodium 2-anthraquinonesulfonate was 0.07% by mass. Subsequently, this aluminum foil was allowed to stand in the atmosphere at 40 ° C. for 10 minutes for oxidative polymerization. The dipping step and the polymerization step are repeated 18 times, and finally the poly (3,4-ethylenedioxythiophene) produced is washed in 50 ° C. warm water, and then dried at 100 ° C. for 30 minutes to obtain aluminum. A conductive polymer solid electrolyte layer was formed on the outer surface of the foil.

  About this aluminum foil, the average film thickness and the standard deviation were measured using the film thickness meter (The Peacock company make, digital dial gauge DG-205, accuracy 3 micrometers). The average film thickness measured for 150 elements was 140 μm, and the standard deviation was 12 μm.

  Next, a 3 mm × 4 mm portion on which the solid electrolyte layer is formed is immersed in a 10% by mass ammonium adipate solution, and the contact with the anode lead frame is attached to the valve action metal foil in the portion where the solid electrolyte layer is not formed. Then, a voltage of 3.8 V was applied to perform re-chemical conversion.

[Formation of conductor layer]
Next, as shown in FIG. 4, a carbon paste layer and a silver paste layer were provided as a conductor layer in the portion where the conductive polymer composition layer of the aluminum foil was formed.
Here, the portion of the aluminum foil on which the dielectric coating under the first masking was not formed was cut. The anode part of the cut element was welded with a spacer after forming the conductor layer, and both corners were cut off. These aluminum foils are connected by resistance welding, 4 layers are stacked, and connected to a pocket-type lead frame that is non-planar and has an L-shaped (side + end) wall as shown in FIG. After that, the corner notch was covered with silver paste.
Furthermore, after sealing this laminated | stacked element with an epoxy resin, a rated voltage (2V) was applied at 125 degreeC, and it aged for 2 hours, and manufactured a total of 300 capacitors.

With respect to these 300 capacitors, the capacity and loss factor (expressed in%) at 120 Hz, equivalent series resistance (ESR), and leakage current were measured as initial characteristics. Table 1 shows an average value of these measured values and a defective rate when a leakage current of 0.002 CV or more is regarded as a defective product.
The leakage current is a value measured 1 minute after applying the rated voltage, and the average value of the leakage current is a value calculated excluding defective products.

Comparative Example 1:
In Example 1, 300 capacitors were manufactured in the same manner except that the lead frame during lamination was a conventional type (planar type) without a side wall.
For these 300 capacitors, the capacity and loss factor (expressed in%), equivalent series resistance (ESR), and leakage current at 120 Hz were measured as initial characteristics. Table 1 shows an average value of these measured values and a defective rate when a leakage current of 0.002 CV or more is regarded as a defective product.
The leakage current is a value measured 1 minute after applying the rated voltage, and the average value of the leakage current is a value calculated excluding defective products.

Comparative Example 2:
In Example 1 , 300 capacitors were manufactured by the same method except that the lead frame at the time of lamination was a conventional type (step type) without a side wall.
For these 300 capacitors, the capacity and loss factor (expressed in%), equivalent series resistance (ESR), and leakage current at 120 Hz were measured as initial characteristics. Table 1 shows an average value of these measured values and a defective rate when a leakage current of 0.002 CV or more is regarded as a defective product.
The leakage current is a value measured 1 minute after applying the rated voltage, and the average value of the leakage current is a value calculated excluding defective products.

  The solid electrolytic capacitor using the pocket type lead frame member of the present invention eliminates the stacking deviation due to the unevenness of the element, and the protrusion and spread of the conductive adhesive when the capacitor element with less unevenness is stacked. Stacking efficiency and low ESR can be realized.

Sectional drawing which shows the typical structure of the capacitor | condenser element for solid electrolytic capacitors. Sectional drawing which shows the typical structure of the solid electrolytic capacitor obtained by laminating | stacking a capacitor | condenser element on a lead frame. The figure which shows the example of the pocket-shaped lead frame of this invention. The top view of the pocket-shaped lead frame of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Valve metal 2 Dielectric oxide film 3 Insulating layer 4 Solid electrolyte layer 5 Conductor layer 6 Anode lead frame part 7 Cathode lead frame part 8 Insulating resin 9 Spacer 9b Resistance welding 10 Conductive adhesive 10a Anode side conductive adhesion Agent 10b Cathode Side Conductive Adhesive 11 Solid Electrolytic Capacitor

Claims (6)

A multilayer solid electrolytic capacitor in which a plurality of capacitor elements are mounted on a lead frame member and the whole is sealed. The plurality of capacitor elements have their cathodes laminated with a conductive adhesive. The lead frame member is used for a capacitor element having an anode at one end and a cathode at the other end, and the anode of the capacitor element, the anode corresponding to the cathode, and the cathode are separated by a gap. The anode part and / or the cathode part have a side wall on the capacitor element mounting surface, and at least one side wall of the anode part and the cathode part is mounted on the capacitor element. provided only 90% or less than 50% of the surface on both sides, the height of the at least one sidewall of the anode part and cathode part depends sites, the anode part and / or Solid electrolytic multilayer capacitor lead portions of the lead frame is a lead frame member having a structure located at the top of the capacitor element mounting surface continuous with the electrode portion. Solid electrolytic multilayer capacitor according to claim 1 anode part and cathode part of the lead frame member and has a side wall on either side capacitor element mounting surface. 3. The multilayer solid electrolytic capacitor according to claim 2, wherein the side wall of the lead frame member wraps around the end face of the anode part and / or the cathode part to form a square wall structure at the corner of the capacitor element mounting surface. Lead side wall of the frame member is highest in the lead portion of the lead frame, the multilayer solid electrolytic capacitor according to any one of claims 1 to 3 had the lowest at the gap side. Lead side wall of the frame member is lowest at the lead portion of the lead frame, the multilayer solid electrolytic capacitor according to any one of the highest yet claims 1-3 in the gap side. For use in a capacitor element having an anode at one end and a cathode at the other end, the anode of the capacitor element, the anode corresponding to the cathode, and the cathode are provided facing each other with a gap therebetween. The anode part and / or the cathode part have a side wall on the capacitor element mounting surface, and at least one side wall of the anode part and the cathode part is 50% or more on both sides of the capacitor element mounting surface. %, The height of the side wall of at least one of the anode part and the cathode part varies depending on the part, and the lead frame lead-out part continuous to the anode part and / or the cathode part is provided on the capacitor element mounting surface. using a lead frame member having a structure located above, a plurality of laminated using a conductive adhesive to the cathode of the capacitor element on the cathode portion of the lead frame member Method for producing a solid electrolytic multilayer capacitor comprising sealing the whole After welding the anode.

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