JP4881161B2 - 基板上の固体層の形成 - Google Patents
基板上の固体層の形成 Download PDFInfo
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- JP4881161B2 JP4881161B2 JP2006542017A JP2006542017A JP4881161B2 JP 4881161 B2 JP4881161 B2 JP 4881161B2 JP 2006542017 A JP2006542017 A JP 2006542017A JP 2006542017 A JP2006542017 A JP 2006542017A JP 4881161 B2 JP4881161 B2 JP 4881161B2
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- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000011254 layer-forming composition Substances 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RZFODFPMOHAYIR-UHFFFAOYSA-N oxepan-2-one;prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1CCCCCO1 RZFODFPMOHAYIR-UHFFFAOYSA-N 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229940068918 polyethylene glycol 400 Drugs 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000031070 response to heat Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000010099 solid forming Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
まず、プラスチック基板の表面に銅が良く付着するよう、プラスチック基板表面を顕微鏡的に腐食させるために基板を68+−2℃のクロム酸/濃硫酸槽で腐食させる。
単官能基:
イソボルニルアクリレート(Isobornylacrylate (IBOA))、例えば、SR506D
オクチル デシル アクリレート(Octyl decyl acrylate (ODA))、例えば、 SR484
カプロラクトン アクリレート(Caprolactone acrylate)、例えば、SR495
ラウリル アクリレート(Lauryl acrylate)、例えば、SR335
二官能基:
トリプロピレン グリコール ジアクリレート(Tripropylene glycol diacrylate (TPGDA))、例えば、Actilane 424
1,6−ヘキサンジオール ジアクリレート(1,6-hexanediol diacrylate (HDDA))、例えば、Actilane 425
ジプロピレングリコール ジアクリレート(Dipropylene glycol diacrylate (DPGDA))、例えば、SR508
プロプオキシレート(2)ネオペンチル グリコール ジアクリレート(Propoxylated (2) neopentyl glycol diacrylate (PONPGDA))、例えば、SR9003
トリシクロデカン ジメタノールジアクリレート(Tricyclodecanedimethanol diacrylate (TCDDMDA))、例えば、SR833S
ポリエチレン グリコール400ジアクリレート(Polyethylene glycol 400 diacrylate (PEG400DA))、例えば、SR344
三官能基:
トリメチロール プロパン トリアクリレート(Trifunctional propane triacrylate (TMPTA))、例えば、Actilane 431
エトキシレート(3)トリメチロール プロパン トリアクリレート(Ethoxylated (3) trimethylol propane triacrylate)、例えば、SR454
エトキシレート(6)トリメチロール プロパン トリアクリレート(Ethoxylated (6) trimethylol propane triacrylate)、例えば、SR499
四官能基:
アクチレン505(テトラファンクショナル ポリエステル アクリレート オリゴマー)(Actilane 505 (a tetrafunctional polyester acrylate oligomer))
エトキシレート ペンタエリチリトール テトラアクリレート(Ethoxylated pentaerythritol tetraacrylate (PPTTA))、例えば、Actilane 440
ジメチロールプロパン テトラアクリレート(Ditrimethylolpropane tetraacrylate (di TMPTA))、例えば、Actilane 441
6官能基:
ジペンタエリチリトール ヘキサアクリレート(Dipentaerythritol hexaacrylate (DPHA))、例えば、Actilane 450
Actilane の範囲についてはAkzo Nobel, The Netherlandsより入手可能である。Actilane は商標である。
(ポリアクリル酸(polyacrylic acid), ポリ酢酸ビニル(polyvinyl acetate), ポリエチレン イミン(polyethylene imine), ポリエチレン オキシド(polyethylene oxide), ポリエチレン グリコール(polyethylene glycol), ゼラチン(gelatin)、またはそれのコポリマー(copolymers)を含む。第二流体が第一固体層に接触すると可溶組成は溶解する。例えば、ポリビニルピロリドン(polyvinylpyrrolidone)は、第一固体層上に伝導金属領域を形成するために用いることができる金属イオン及び還元剤の水溶液に接触して溶解する(下記を参照願いたい)。結果物の固体層中のポリビニルピロリドン(polyvinyl pyrrolidone)は重量の約5%が適当である。
ALF116 及びALF117により表示するUV硬化性触媒構成物は下記表1に示す構成により準備された。使用されたモノマー、オリゴマー及び開始剤(initiator)は、関連するUV硬化性インクジェット分野において、優れた硬化特性及びプラスリック基板に対する付着力を持つものとして知られている。これらの構成物は、その液中で酢酸パラジウム触媒が溶解する運搬液として作用するある溶媒(ジアセトン アルコール及びメトキシプロパノール、(diacetone alcohl and methoxy propanol)を含む。溶媒は、Xaar, UKのXJ500/180プリントヘッドを用いてインクジェット印刷によりMelinex(Melinexは商標)ポリエステル基板にこれら組成物を適用した後に蒸発をさせた。インクは、その後UVの適用により硬化を始め、モノマー及びオリゴマ−成分が重合化して硬化した。
さらに下記表2に纏めたようにALF120, ALF121, 及びALF124で表示される3つの組成物を準備した。これらは全て表1のAF117の変形である。
ALF121は、インクジェット印刷によるインクの堆積に良い特性を与えるためにさらに修飾された。そのような2つのインクを、下記表3にALF125, 及びALF126bとして表示する。
ALF126bは、さらにUV硬化性触媒インクが最適効果を生ずるように修飾され、ALF126fとして知られているものを作り出した。これはMelinex (Melinexは商標である)ポリエステル基板上に伝導性銅層を堆積するのに用いられた。ALF126fの組成は次の通りである。
ALF126fインクは、12μmドローダウンバー(drawdown bar)を用いてMelinex 339 (Dupon Teijin Films) ポリエステル基板に塗布された。その後液状フィルムは、25ミクロンアルミフォイルにパターン化された開口を通してUV光に曝された。UV光源はH-電球を用いたFusion システムF500を用い、合計0.70J/cm2のUV線量を投与した。フィルムの露光された部分は硬化し、凝固した。露光しなかった部分は液状のままであり、エタノールを用いて容易に洗い流された。さらにUVランプの下で4回走行させた(pass)結果完全に硬化した。
構造は直接レーザー書き込みプロセスを用いて直接書き込まれた。12ミクロンから24ミクロンの間のALF126fインクの液状フィルムが、ドローダウン(drawdown)法を用いてMelinex 339 (MelinexはDupon Teijin Filmsの商標である) ポリエステル基板上に準備された。液状フィルムは直ちにOrbotech DP100 SL 直接レーザー書き込みシステム(Direct laser write system)に入れられた (Orbotech は商標である)。このシステムは355nmで作動する4 W Paladin (Paladin は商標である) ダイオード励起固体レーザー(diode pumped solid state laser) (Coherent Ltd) を用いる。
Claims (27)
- その上に第二層を形成する化学反応を活性化することのできる第一固体層を、基板の表面に形成する方法であって、前記方法は:
第一液をインクジェット印刷により基板表面に適用すること、
前記第一液は、前記第二層を形成する化学反応のための硬化性組成物及び活性化剤を含み、
前記硬化性組成物は重合し及び/又は交差結合して硬化し、それにより固体層を形成するアクリレート(acrylate)またはメタアクリレート(methacrylate)モノマー及び/又はオリゴマーの混合物を含み、組成物は、少なくとも3つの交差結合可能な官能基を持つある割合のアクリレート(acrylate)またはメタアクリレート(methacrylate)モノマー及び/又はオリゴマーを含み、前記硬化性組成物はさらに、刺激に反応して硬化反応を開始する遊離基を生成する開始剤を含み、及び前記硬化性組成物を前記刺激に露出して基板表面への材料の付着力を増大させる硬化性組成物を硬化することにより、第一固体層を形成し、それにより第二流体と接触させた後に前記第二層を形成する化学反応を活性化することができ、前記第一固体層は、第二流体において少なくとも部分的に不溶解である第一化学官能基を含み、及び第一固体層は、第二流体において少なくとも部分的に溶解し、混和し、または膨張し、またはそうでなければ第二流体により浸透される第二化学官能基を含む、
ことを含む。 - さらに、前記第一固体層と、活性化剤により活性化され、前記第二層を形成する化学反応のための一又は二以上の試薬を含む前記第二流体を、接触させることを含む請求項1に記載の方法。
- 前記第二層が伝導性金属層を含む請求項2に記載の方法。
- 前記第二層形成化学反応は伝導性金属領域を形成する金属イオンと還元剤との間の反応であり、前記活性化剤が一又は二以上の触媒金属イオン、還元剤またはpH変更試薬を含む請求項3に記載の方法。
- 第一液の全モノマー及び/またはオリゴマ−の重量の75%を超えない割合が3つの交差結合可能な官能基を持つ、請求項1乃至4の何れか1項に記載の方法。
- 第一液の全モノマー及び/またはオリゴマ−重量の35%を超えない割合が4つの交差結合可能な官能基を持つ、請求項1乃至5の何れか1項に記載の方法。
- 第一液の全モノマー及び/またはオリゴマ−重量の10%を超えない割合が5つの交差結合可能な官能基を持つ、請求項1乃至6の何れか1項に記載の方法。
- 前記第一液の特徴により、前記第一固体層が第二流体に浸透する請求項1乃至7の何れか一項に記載の方法。
- 前記第一化学官能基の前記第二化学官能基に対する重量比率が約5:1より大きく、好ましくは約10:1より大きく、より好ましくは約15:1より大きい請求項1乃至8の何れか一項に記載の方法。
- 前記第一液中での硬化性組成物の活性化剤に対する重量割合が約15:1より大きく、好ましくは約25:1より大きい請求項1乃至9の何れか一項に記載の方法。
- 前記第一固体層がパターンに従って基板表面に形成される請求項1乃至10の何れか一項に記載の方法。
- 前記硬化性液が基板表面に広範囲に適用され、パターンに従い選択的に硬化される請求項11に記載の方法。
- 前記第二流体がインクジェット印刷により第一固体層に堆積される請求項1乃至12の何れか一項に記載の方法。
- 前記刺激が電磁照射である、請求項1乃至13の何れか1項に記載の方法。
- 前記電磁照射が紫外線照射である、請求項14に記載の方法。
- 前記活性化剤が金属または金属を含む材料を含む請求項1乃至15の何れか一項に記載の方法。
- 前記硬化性組成物の前記活性化剤の金属部分に対する重量比率が約15:1より大きく、好ましくは約25:1より大きい請求項16に記載の方法。
- 前記活性化剤が触媒を含む請求項16又は17に記載の方法。
- 請求項1乃至18の何れか一項に記載の方法を含む電気品の製造方法。
- 請求項1乃至19の何れか一項に記載の方法であって、電池を生産するために用いる方法。
- 回路の2つの部品間を電気的に接続するために用いる請求項1乃至19の何れか一項に記載の方法。
- 装飾的特徴を作り出すために用いる請求項1乃至19の何れか一項に記載の方法。
- 請求項1乃至22の何れか一項に記載の方法により製作された物。
- 基板表面に第一固体層を形成するインクジェット印刷可能な液であって、該液は第二層形成化学反応を活性化するのに適した活性化剤、及び硬化することにより基板表面への材料の付着力を増大させ、基板に付着した第一固体層を形成し、及び該第二層形成化学反応を活性化することのできる硬化性組成物を含み、前記硬化性組成物は重合し及び/又は交差結合して硬化し、それにより固体層を形成するアクリレート(acrylate)またはメタアクリレート(methacrylate)モノマー及び/又はオリゴマーの混合物を含み、組成物は、少なくとも3つの交差結合可能な官能基を持つある割合のアクリレート(acrylate)またはメタアクリレート(methacrylate)モノマー及び/又はオリゴマーを含み、前記硬化性組成物はさらに、刺激に反応して硬化反応を開始する遊離基を生成する開始剤を含み、前記第一固体層は、第二流体において少なくとも部分的に不溶解である第一化学官能基を含み、及び第一固体層は、第二流体において少なくとも部分的に溶解し、混和し、または膨張し、またはそうでなければ第二流体により浸透される第二化学官能基を含む、
前記液。 - 液の全モノマー及び/またはオリゴマ−重量の75%を超えない割合が3つの交差結合可能な官能基を持つ、請求項24に記載の液。
- 液の全モノマー及び/またはオリゴマ−重量の35%を超えない割合が4つの交差結合可能な官能基を持つ、請求項24又は25に記載の液。
- 液の全モノマー及び/またはオリゴマ−重量の10%を超えない割合が5つの交差結合可能な官能基を持つ、請求項24乃至26の何れか1項に記載の液。
Applications Claiming Priority (9)
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GB0328221A GB0328221D0 (en) | 2003-12-05 | 2003-12-05 | Formation of solid layers on substrates |
GB0328221.7 | 2003-12-05 | ||
US52794803P | 2003-12-08 | 2003-12-08 | |
US60/527,948 | 2003-12-08 | ||
GB0401825A GB0401825D0 (en) | 2003-12-05 | 2004-01-28 | Formation of solid layers on substrates |
GB0401825.5 | 2004-01-28 | ||
PCT/GB2004/004589 WO2005045095A2 (en) | 2003-10-29 | 2004-10-29 | The formation of layers on substrates |
GBPCT/GB2004/004589 | 2004-10-29 | ||
PCT/GB2004/005088 WO2005056875A2 (en) | 2003-12-05 | 2004-12-03 | Formation of solid layers on substrates |
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WO2011130335A2 (en) * | 2010-04-12 | 2011-10-20 | Tufts University | Silk electronic components |
WO2013062630A2 (en) * | 2011-10-25 | 2013-05-02 | Unipixel Displays, Inc. | Flexible scratch resistance film for display devices |
GB2514738A (en) * | 2012-05-04 | 2014-12-03 | Unipixel Displays Inc | High resolution conductive patterns having low variance through optimization of catalyst concentration |
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GB0401825D0 (en) * | 2003-12-05 | 2004-03-03 | Conductive Inkjet Tech Ltd | Formation of solid layers on substrates |
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JPH0617255A (ja) * | 1992-03-25 | 1994-01-25 | Bayer Ag | 無電解メツキされた金属フイルムの付着力の改善法 |
JPH0931660A (ja) * | 1995-07-18 | 1997-02-04 | Matsushita Electric Ind Co Ltd | 基板金属化法 |
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WO2003091477A1 (en) * | 2002-04-23 | 2003-11-06 | Agency For Science, Technology And Research | Method for electroless deposition of a metal layer on selected portions of a substrate |
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GB0401825D0 (en) | 2004-03-03 |
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