JP4865852B2 - 押出装置における端部の自動較正 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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Description
本発明は、加法過程モデリング技術を用いた3次元物体の製造に関する。より具体的には、本発明は、3次元モデリングマシンにおける押出端部を較正する方法に関する。
本発明は、プラットフォーム上に載置された基板上に堆積装置からのモデリング材料を堆積させるコントローラによって指示されたように3次元物体を構築する3次元モデリングマシンにおいて、較正ルーチンを実行する方法である。この方法は、規定の位置で3次元構造を表す材料構築プロファイルの生成を備えている。そして、材料構築プロファイルの相対的位置が決定される。予想構築プロファイルは、特定されたのち、材料構築プロファイルの決定された相対位置と比較され、相対位置との間の差が特定される。その差からオフセットが決定される。その後、モデリングシステムは、オフセットに基づいて堆積装置を配置する。
図1は、本発明を利用可能な、当該技術分野で周知となっている種類の3次元モデリングシステム10の全体図を示している。より具体的には、図1に示す3次元モデリングシステム10は、押出による積層モデリングシステムである。プロセッサ12に常駐するコンピュータ支援設計(CAD)プログラムは、作り出される部品14の形状を記述するファイルを生成する。生成されたファイルは、スライシングプログラム(プロセッサ12に常駐しているように示されているが、プロセッサ12に代えて、別個のプロセッサに常駐させてもよい)のアルゴリズムによって、モデル材料押出端部38から押出可能な形状に対応するモデリング材料体積要素16に細分化される。追加的な支持材料体積要素18が必要に応じて追加され、部品14のモデル47の構築中に、機械的支持部45を部品14のモデル47に提供する。
(1)図12のステップ208にて記録された全ての位置を加算し、この例の場合は10箇所である、記録位置の総数で除算することにより、目標着地点の平均位置(目標平均)を算出する。
(2)その後、記録位置の各々と平均値とを比較する。算出された平均値に対して最大誤差を有する記録位置が、その平均値について許容範囲外である場合には、その位置を破棄して、平均値を再計算する。
(3)記録位置を破棄した場合、残った位置について比較ステップを繰り返す。
(4)以下の2つの状況のいずれかが発生するまで比較ステップと破棄ステップを繰り返す:
残った位置の最大誤差が許容範囲内である状況;または
平均化される位置の数が許容レベル未満、この場合は7箇所未満になった状況。
Claims (15)
- 基板と、第1の押出端部及び第2の押出端部を含む押出ヘッドとを有する3次元モデリングマシンにおける較正ルーチンの実行方法であって、
該方法は、
複数軸のセンサアセンブリにおけるプランジャを、該複数軸のセンサアセンブリにおける複数の電気的接点に対して動作可能に付勢することと、
前記基板上に前記第1の押出端部で第1の材料構築プロファイルを生成することと、
前記第2の押出端部が前記第1の押出端部よりも低くなるように、前記第1の押出端部と前記第2の押出端部とのうちの少なくとも一方を切り換えることと、
前記基板上に前記第2の押出端部で第2の材料構築プロファイルを生成することと、
前記複数軸のセンサアセンブリにおけるハウジングに対して前記プランジャが移動し、該プランジャの各移動によって、前記プランジャが前記複数の電気的接点のうちの少なくとも1つから離れるように、前記第1の材料構築プロファイル及び前記第2の材料構築プロファイルの上面を前記プランジャと接触させることと、
前記プランジャが前記少なくとも1つの電気的接点から離れたことに基づいて基準位置に対する前記第1の材料構築プロファイル及び前記第2の材料構築プロファイルの上面の相対的位置を決定することと、
前記第1の材料構築プロファイルの上面の前記相対的位置と、前記第2の材料構築プロファイルの上面の前記相対的位置との差に基づいて、鉛直方向の押出端部間のオフセットを決定することと
を備えることを特徴とする方法。 - 請求項1に記載の方法であって、
さらに、
前記第1の材料構築プロファイルの前記上面の予想位置を規定する予想構築プロファイルを特定することと、
前記第1の材料構築プロファイルの前記上面の前記相対的位置を、鉛直方向の押出端部と基板との間のオフセットと比較することと、
前記鉛直方向の押出端部と基板との間のオフセットに基づいて前記基板を配置することと
を備えることを特徴とする方法。 - 請求項1に記載の方法であって、
前記ハウジングに対する前記プランジャの移動は、前記ハウジングに対して前記プランジャが傾く移動を含んでいる
ことを特徴とする方法。 - 請求項1に記載の方法であって、
さらに、
前記押出ヘッドがその後、前記第1の押出端部と前記第2の押出端部とを切り換えたときに、前記鉛直方向の押出端部間のオフセットを相殺するために、前記基板の位置を調整することを備える
ことを特徴とする方法。 - 請求項1に記載の方法であって、
前記ハウジングに対する前記プランジャの移動は、前記付勢の反対方向における前記プランジャの移動を含む
ことを特徴とする方法。 - 請求項5に記載の方法であって、
さらに、
前記複数軸のセンサアセンブリの前記ハウジングを前記押出ヘッドに固定することを備える
ことを特徴とする方法。 - 請求項1に記載の方法であって、
さらに、
前記ハウジングに対して前記プランジャを傾けて、該プランジャが傾くことで前記複数の電気的接点のうちの少なくとも1つから前記プランジャが離れるように、前記第1の材料構築プロファイルの側面を前記プランジャに接触させることと、
前記プランジャが傾くことで前記少なくとも1つの電気的接点から前記プランジャが離れることに基づいて、別の基準位置に対する前記第1の材料構築プロファイルの前記側面の相対的位置を決定することと
を備えることを特徴とする方法。 - 請求項1に記載の方法であって、
前記複数の電気的接点は、前記プランジャの周囲に円周方向に配置されている
ことを特徴とする方法。 - 基板と、第1の押出端部及び第2の押出端部を含む押出ヘッドとを有する3次元モデリングマシンにおける較正ルーチンの実行方法であって、
該方法は、
前記第2の押出端部が上昇位置にある間、前記第1の押出端部で第1の材料構築プロファイルを構築することと、
前記基板に対する前記第1の材料構築プロファイルの上面の高さを決定するために、該第1の材料構築プロファイルの前記上面を、センサアセンブリのプランジャと接触させることと、
前記第2の押出端部が前記第1の押出端部よりも低くなるように、前記第1の押出端部と前記第2の押出端部とのうちの少なくとも一方を切り換えることと、
前記第2の押出端部が下降位置にある間、該第2の押出端部で第2の材料構築プロファイルを構築することと、
前記基板に対する前記第2の材料構築プロファイルの上面の高さを決定するために、該第2の材料構築プロファイルの前記上面を、前記センサアセンブリの前記プランジャと接触させることと、
前記第1の材料構築プロファイルの前記上面の高さと、予想された高さとの差に基づいて、鉛直方向の押出端部と基板との間のオフセットを決定することと、
前記第1の材料構築プロファイルの前記上面の高さと、前記第2の材料構築プロファイルの前記上面の高さとの間の差に基づいて、鉛直方向の押出端部間のオフセットを決定することと
を備えることを特徴とする方法。 - 請求項9に記載の方法であって、
前記センサアセンブリは、複数軸のセンサアセンブリを含み、
前記方法は、さらに、
前記複数軸のセンサアセンブリにおける複数の電気的接点に対して移動可能に前記プランジャを付勢することを備える
ことを特徴とする方法。 - 請求項10に記載の方法であって、
前記ハウジングに対する前記プランジャの移動は、前記ハウジングに対して前記プランジャが傾く移動を含む
ことを特徴とする方法。 - 請求項9に記載の方法であって、
さらに、
基準位置に対する前記第1の材料構築プロファイルの側面の相対的位置を決定するために、前記第1の材料構築プロファイルの前記側面を、前記センサアセンブリの前記プランジャと接触させること
を備えることを特徴とする方法。 - 請求項12に記載の方法であって、
さらに、
別の基準位置に対する前記第2の材料構築プロファイルの側面の相対的位置を決定するために、前記第2の材料構築プロファイルの前記側面を、前記センサアセンブリの前記プランジャと接触させること
を備えることを特徴とする方法。 - 請求項9に記載の方法であって、
さらに、
鉛直方向の押出端部と基板との間のオフセットに基づいて、前記基板を配置すること
を備えることを特徴とする方法。 - 請求項9に記載の方法であって、
さらに、
前記押出ヘッドがその後、前記第1の押出端部と前記第2の押出端部とを切り換えるときに、鉛直方向の押出端部間のオフセットを相殺するように、前記基板の位置を調整すること
を備えることを特徴とする方法。
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US11/397,012 | 2006-04-03 | ||
US11/397,012 US7680555B2 (en) | 2006-04-03 | 2006-04-03 | Auto tip calibration in an extrusion apparatus |
PCT/US2007/006437 WO2007130220A2 (en) | 2006-04-03 | 2007-03-15 | Auto tip calibration in an extrusion apparatus |
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EP (1) | EP2004896B1 (ja) |
JP (1) | JP4865852B2 (ja) |
CN (1) | CN101460290A (ja) |
WO (1) | WO2007130220A2 (ja) |
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JP2004151104A (ja) * | 2002-10-31 | 2004-05-27 | Hewlett-Packard Development Co Lp | 立体形状作成ツールにおいて多数のノズル部材を位置合わせするための方法 |
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EP2004896B1 (en) | 2015-08-19 |
EP2004896A4 (en) | 2013-02-20 |
JP2009532243A (ja) | 2009-09-10 |
EP2004896A2 (en) | 2008-12-24 |
WO2007130220A3 (en) | 2008-11-20 |
US20070228592A1 (en) | 2007-10-04 |
CN101460290A (zh) | 2009-06-17 |
WO2007130220A2 (en) | 2007-11-15 |
US7680555B2 (en) | 2010-03-16 |
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