JP4863811B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP4863811B2 JP4863811B2 JP2006211112A JP2006211112A JP4863811B2 JP 4863811 B2 JP4863811 B2 JP 4863811B2 JP 2006211112 A JP2006211112 A JP 2006211112A JP 2006211112 A JP2006211112 A JP 2006211112A JP 4863811 B2 JP4863811 B2 JP 4863811B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- storage body
- heat storage
- electronic component
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005338 heat storage Methods 0.000 claims description 90
- 238000002844 melting Methods 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000007787 solid Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000012188 paraffin wax Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011232 storage material Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009172 bursting Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000032368 Device malfunction Diseases 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
2 容器
2a 天井部
2b 側部
2c 底部
2d 注入口
2f 通気孔
3 蓄熱体
4 電子部品
8、9 フィルタ
Claims (4)
- 電子部品と、蓄熱体と、蓄熱体を収納した熱伝導性を有する容器とを備えた電子機器において、
前記容器内に融解後の蓄熱体を所定量収納した状態での、前記蓄熱体の上面より高い前記容器の位置に、前記容器内へ蓄熱体を注入する注入口と、前記容器内の空気の排出口となる通気孔とが設けられ、前記蓄熱体の上面より低い前記容器の表面の位置に、電子部品が取り付けられていることを特徴とする電子機器。 - 請求項1に記載の電子機器において、
前記注入口の径は、前記通気孔の径より大きくなっていることを特徴とする電子機器。 - 請求項1に記載の電子機器において、
前記容器は、直方体形に形成され、
前記容器の矩形の天井部の一方の角部に、前記注入口が設けられ、前記天井部の他方の角部に、前記通気孔が設けられていることを特徴とする電子機器。 - 請求項1に記載の電子機器において、
前記容器に前記注入口および前記通気孔を塞ぐように、気体を通して液体を通さないフィルタが取り付けられていることを特徴とする電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006211112A JP4863811B2 (ja) | 2006-08-02 | 2006-08-02 | 電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006211112A JP4863811B2 (ja) | 2006-08-02 | 2006-08-02 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008041764A JP2008041764A (ja) | 2008-02-21 |
JP4863811B2 true JP4863811B2 (ja) | 2012-01-25 |
Family
ID=39176479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006211112A Expired - Fee Related JP4863811B2 (ja) | 2006-08-02 | 2006-08-02 | 電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4863811B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6361315B2 (ja) * | 2014-06-25 | 2018-07-25 | 三菱電機株式会社 | 冷却板 |
JP6365370B2 (ja) * | 2015-03-25 | 2018-08-01 | 三菱電機株式会社 | 冷却板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06101294B2 (ja) * | 1986-02-10 | 1994-12-12 | 松下電工株式会社 | 引外しコイルの固定装置 |
JPH04101450A (ja) * | 1990-08-20 | 1992-04-02 | Meidensha Corp | 冷却装置 |
JP2004247423A (ja) * | 2003-02-12 | 2004-09-02 | Koyo Seiko Co Ltd | 冷却装置 |
-
2006
- 2006-08-02 JP JP2006211112A patent/JP4863811B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008041764A (ja) | 2008-02-21 |
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